AT317319B - Verfahren zur Herstellung einer Photokathode - Google Patents
Verfahren zur Herstellung einer PhotokathodeInfo
- Publication number
- AT317319B AT317319B AT961170A AT961170A AT317319B AT 317319 B AT317319 B AT 317319B AT 961170 A AT961170 A AT 961170A AT 961170 A AT961170 A AT 961170A AT 317319 B AT317319 B AT 317319B
- Authority
- AT
- Austria
- Prior art keywords
- photocathode
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/302—Controlling tubes by external information, e.g. programme control
- H01J37/3023—Programme control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/026—Deposition thru hole in mask
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/05—Etch and refill
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/102—Mask alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/06—Unusual non-204 uses of electrolysis
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/949—Energy beam treating radiation resist on semiconductor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86922969A | 1969-10-24 | 1969-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
AT317319B true AT317319B (de) | 1974-08-26 |
Family
ID=25353148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT961170A AT317319B (de) | 1969-10-24 | 1970-10-23 | Verfahren zur Herstellung einer Photokathode |
Country Status (7)
Country | Link |
---|---|
US (1) | US3679497A (de) |
JP (1) | JPS4913429B1 (de) |
AT (1) | AT317319B (de) |
CH (1) | CH543813A (de) |
DE (1) | DE2050763C2 (de) |
FR (1) | FR2065508B1 (de) |
GB (1) | GB1322034A (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1330502A (en) * | 1970-09-21 | 1973-09-19 | Texas Instruments Ltd | Manufacture of masks |
FR2144024A5 (de) * | 1971-06-29 | 1973-02-09 | Thomson Csf | |
FR2146106B1 (de) * | 1971-07-16 | 1977-08-05 | Thomson Csf | |
US3887811A (en) * | 1971-10-08 | 1975-06-03 | Radiant Energy Systems | Electro mechanical alignment apparatus for electron image projection systems |
US3832560A (en) * | 1973-06-13 | 1974-08-27 | Westinghouse Electric Corp | Method and apparatus for electron beam alignment with a member by detecting cathodoluminescence from oxide layers |
US3895234A (en) * | 1973-06-15 | 1975-07-15 | Westinghouse Electric Corp | Method and apparatus for electron beam alignment with a member |
US3875414A (en) * | 1973-08-20 | 1975-04-01 | Secr Defence Brit | Methods suitable for use in or in connection with the production of microelectronic devices |
US3987215A (en) * | 1974-04-22 | 1976-10-19 | International Business Machines Corporation | Resist mask formation process |
US3961102A (en) * | 1974-09-13 | 1976-06-01 | Cornwell Research Foundation, Inc. | Scanning electron microscope fabrication of optical gratings |
US4011351A (en) * | 1975-01-29 | 1977-03-08 | International Business Machines Corporation | Preparation of resist image with methacrylate polymers |
JPS51137116U (de) * | 1975-04-28 | 1976-11-05 | ||
US4117301A (en) * | 1975-07-21 | 1978-09-26 | Rca Corporation | Method of making a submicrometer aperture in a substrate |
GB1520925A (en) * | 1975-10-06 | 1978-08-09 | Mullard Ltd | Semiconductor device manufacture |
IT1068535B (it) * | 1975-11-03 | 1985-03-21 | Ibm | Apparecchio e processo elettrolito grafico |
JPS5311319A (en) * | 1976-07-20 | 1978-02-01 | Mitsubishi Heavy Ind Ltd | Damper device |
GB1557064A (en) * | 1976-09-09 | 1979-12-05 | Mullard Ltd | Masks suitable for use in electron image projectors |
JPS5354319A (en) * | 1976-10-27 | 1978-05-17 | Seitetsu Kagaku Co Ltd | Damper |
GB1578259A (en) * | 1977-05-11 | 1980-11-05 | Philips Electronic Associated | Methods of manufacturing solid-state devices apparatus for use therein and devices manufactured thereby |
US4201580A (en) * | 1978-07-24 | 1980-05-06 | Bell Telephone Laboratories, Incorporated | Lithographic fabrication with treatment of "living polymer" |
JPS5827663B2 (ja) * | 1979-06-04 | 1983-06-10 | 富士通株式会社 | 半導体装置の製造方法 |
JPS5644256U (de) * | 1979-09-12 | 1981-04-21 | ||
JPS5650867U (de) * | 1979-09-27 | 1981-05-06 | ||
US4504558A (en) * | 1980-07-10 | 1985-03-12 | International Business Machines Corporation | Method of compensating the proximity effect in electron beam projection systems |
JPS57183034A (en) * | 1981-05-07 | 1982-11-11 | Toshiba Corp | Electron bean transfer device |
JPS57194531A (en) * | 1981-05-26 | 1982-11-30 | Toshiba Corp | Electron beam transfer device |
US4698236A (en) * | 1984-10-26 | 1987-10-06 | Ion Beam Systems, Inc. | Augmented carbonaceous substrate alteration |
DE3584141D1 (de) * | 1984-11-20 | 1991-10-24 | Fujitsu Ltd | Verfahren zum projizieren eines photoelektrischen bildes. |
GB8514390D0 (en) * | 1985-06-07 | 1985-07-10 | Turner D W | Electron lithography |
JPS62222633A (ja) * | 1986-03-25 | 1987-09-30 | Sharp Corp | 半導体素子の製造方法 |
DE4038183C2 (de) * | 1990-11-30 | 1994-10-20 | Hell Ag Linotype | Verfahren und Vorrichtung zur Ausrichtung eines Elektronenstrahls relativ zu einem Bezugsobjekt |
US5817533A (en) * | 1996-07-29 | 1998-10-06 | Fujitsu Limited | High-yield methods of fabricating large substrate capacitors |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3113896A (en) * | 1961-01-31 | 1963-12-10 | Space Technology Lab Inc | Electron beam masking for etching electrical circuits |
FR1529444A (fr) * | 1966-07-01 | 1968-06-14 | Telefunken Patent | Dispositif d'alignement précis de masques sur des éléments semi-conducteurs |
-
1969
- 1969-10-24 US US869229A patent/US3679497A/en not_active Expired - Lifetime
-
1970
- 1970-10-15 DE DE2050763A patent/DE2050763C2/de not_active Expired
- 1970-10-19 GB GB4954670A patent/GB1322034A/en not_active Expired
- 1970-10-20 JP JP45091730A patent/JPS4913429B1/ja active Pending
- 1970-10-21 CH CH1559370A patent/CH543813A/de not_active IP Right Cessation
- 1970-10-23 AT AT961170A patent/AT317319B/de not_active IP Right Cessation
- 1970-10-23 FR FR7038342A patent/FR2065508B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2065508B1 (de) | 1975-06-06 |
DE2050763A1 (de) | 1971-05-13 |
FR2065508A1 (de) | 1971-07-30 |
US3679497A (en) | 1972-07-25 |
CH543813A (de) | 1973-10-31 |
JPS4913429B1 (de) | 1974-03-30 |
DE2050763C2 (de) | 1983-01-05 |
GB1322034A (en) | 1973-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |