AT15048U1 - Beschichtetes flexibles Bauteil - Google Patents

Beschichtetes flexibles Bauteil Download PDF

Info

Publication number
AT15048U1
AT15048U1 ATGM350/2015U AT3502015U AT15048U1 AT 15048 U1 AT15048 U1 AT 15048U1 AT 3502015 U AT3502015 U AT 3502015U AT 15048 U1 AT15048 U1 AT 15048U1
Authority
AT
Austria
Prior art keywords
flexible
coating
refractory metal
coated
component
Prior art date
Application number
ATGM350/2015U
Other languages
German (de)
English (en)
Inventor
Harald Köstenbauer
Original Assignee
Plansee Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plansee Se filed Critical Plansee Se
Priority to ATGM350/2015U priority Critical patent/AT15048U1/de
Priority to TW105133024A priority patent/TWI701346B/zh
Priority to PCT/AT2016/000094 priority patent/WO2017087998A1/de
Priority to CN201680069437.8A priority patent/CN108292667B/zh
Priority to KR1020187014865A priority patent/KR102578294B1/ko
Priority to JP2018527118A priority patent/JP6908223B2/ja
Publication of AT15048U1 publication Critical patent/AT15048U1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Photovoltaic Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
ATGM350/2015U 2015-11-27 2015-11-27 Beschichtetes flexibles Bauteil AT15048U1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ATGM350/2015U AT15048U1 (de) 2015-11-27 2015-11-27 Beschichtetes flexibles Bauteil
TW105133024A TWI701346B (zh) 2015-11-27 2016-10-13 經塗佈的彈性組分
PCT/AT2016/000094 WO2017087998A1 (de) 2015-11-27 2016-10-24 Beschichtetes flexibles bauteil
CN201680069437.8A CN108292667B (zh) 2015-11-27 2016-10-24 经涂覆的柔性组件
KR1020187014865A KR102578294B1 (ko) 2015-11-27 2016-10-24 코팅된 연성 부품
JP2018527118A JP6908223B2 (ja) 2015-11-27 2016-10-24 被覆された可撓性部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ATGM350/2015U AT15048U1 (de) 2015-11-27 2015-11-27 Beschichtetes flexibles Bauteil

Publications (1)

Publication Number Publication Date
AT15048U1 true AT15048U1 (de) 2016-11-15

Family

ID=57227195

Family Applications (1)

Application Number Title Priority Date Filing Date
ATGM350/2015U AT15048U1 (de) 2015-11-27 2015-11-27 Beschichtetes flexibles Bauteil

Country Status (6)

Country Link
JP (1) JP6908223B2 (enExample)
KR (1) KR102578294B1 (enExample)
CN (1) CN108292667B (enExample)
AT (1) AT15048U1 (enExample)
TW (1) TWI701346B (enExample)
WO (1) WO2017087998A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT15574U3 (de) * 2017-05-11 2018-05-15 Plansee Se Flexibles Bauteil mit Schichtaufbau mit metallischer Lage

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020263628A1 (en) 2019-06-26 2020-12-30 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays
US11550364B2 (en) * 2019-11-01 2023-01-10 Motorola Mobility Llc Flexible display with preformed curvilinear foldable substrate and corresponding electronic devices and methods
CN116855888B (zh) * 2023-07-25 2025-10-14 北京师范大学 一种柔性高熵合金涂层及其制备方法和应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4228405B2 (ja) * 1998-01-22 2009-02-25 東洋紡績株式会社 金属薄膜積層フィルムおよび該フィルムを用いたフレキシブルプリント配線板
JP4197206B2 (ja) * 1998-12-25 2008-12-17 シャープ株式会社 積層金属配線及び薄膜トランジスタ基板、並びにそれらの製造方法
JP2001174613A (ja) * 1999-12-21 2001-06-29 Mitsui Chemicals Inc 反射部材
US20030134151A1 (en) * 2001-09-14 2003-07-17 Fuji Photo Film Co., Ltd. Magnetic recording medium
JP2003099917A (ja) * 2001-09-21 2003-04-04 Fuji Photo Film Co Ltd 磁気記録媒体
EP1813439B1 (en) * 2006-01-27 2013-01-09 European Central Bank Electronic security means for security documents using a thermoelectric power generator
AT11941U1 (de) 2010-02-12 2011-07-15 Plansee Metall Gmbh Berührungssensoranordnung
KR20130082234A (ko) * 2012-01-11 2013-07-19 도레이첨단소재 주식회사 자성체를 포함하는 플렉시블 기판 및 이를 사용한 플렉시블 디스플레이의 제조방법
JP5685558B2 (ja) * 2012-04-19 2015-03-18 株式会社東芝 表示装置
US9121100B2 (en) 2012-12-14 2015-09-01 Intermolecular, Inc. Silver based conductive layer for flexible electronics
TWI594438B (zh) * 2013-06-06 2017-08-01 史達克公司 用於在電子裝置中金屬積覆之銅合金阻障層及覆蓋層及應用彼等於電子裝置之方法
US20150014663A1 (en) * 2013-07-11 2015-01-15 Korea Institute Of Science And Technology Organic light emitting display apparatus and the method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT15574U3 (de) * 2017-05-11 2018-05-15 Plansee Se Flexibles Bauteil mit Schichtaufbau mit metallischer Lage
WO2018204944A1 (de) 2017-05-11 2018-11-15 Plansee Se Flexibles bauteil mit schichtaufbau mit metallischer lage

Also Published As

Publication number Publication date
JP6908223B2 (ja) 2021-07-21
KR102578294B1 (ko) 2023-09-13
CN108292667B (zh) 2022-06-14
CN108292667A (zh) 2018-07-17
KR20180087267A (ko) 2018-08-01
WO2017087998A1 (de) 2017-06-01
JP2018538571A (ja) 2018-12-27
TWI701346B (zh) 2020-08-11
TW201728766A (zh) 2017-08-16

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