TW200734419A - Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive - Google Patents
Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesiveInfo
- Publication number
- TW200734419A TW200734419A TW096103324A TW96103324A TW200734419A TW 200734419 A TW200734419 A TW 200734419A TW 096103324 A TW096103324 A TW 096103324A TW 96103324 A TW96103324 A TW 96103324A TW 200734419 A TW200734419 A TW 200734419A
- Authority
- TW
- Taiwan
- Prior art keywords
- spin
- thermal
- chemical
- coating material
- thermoplastic adhesive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D121/00—Coating compositions based on unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D193/00—Coating compositions based on natural resins; Coating compositions based on derivatives thereof
- C09D193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J121/00—Adhesives based on unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/348,143 US8268449B2 (en) | 2006-02-06 | 2006-02-06 | Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200734419A true TW200734419A (en) | 2007-09-16 |
Family
ID=38334906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096103324A TW200734419A (en) | 2006-02-06 | 2007-01-30 | Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
Country Status (8)
Country | Link |
---|---|
US (2) | US8268449B2 (zh) |
EP (1) | EP2007836A4 (zh) |
JP (1) | JP2009529065A (zh) |
KR (1) | KR20080096646A (zh) |
CN (1) | CN101790570A (zh) |
SG (1) | SG169384A1 (zh) |
TW (1) | TW200734419A (zh) |
WO (1) | WO2007092689A2 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080200011A1 (en) * | 2006-10-06 | 2008-08-21 | Pillalamarri Sunil K | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
JP5788173B2 (ja) * | 2007-06-25 | 2015-09-30 | ブルーワー サイエンス アイ エヌシー. | 高温スピンオン仮接合用組成物 |
DE102007059848A1 (de) * | 2007-12-12 | 2009-06-25 | Robert Bosch Gmbh | Elektrische Anordnung und Verfahren zur Herstellung einer elektrischen Anordnung |
EP2238618B1 (en) * | 2008-01-24 | 2015-07-29 | Brewer Science, Inc. | Method for reversibly mounting a device wafer to a carrier substrate |
US8092628B2 (en) | 2008-10-31 | 2012-01-10 | Brewer Science Inc. | Cyclic olefin compositions for temporary wafer bonding |
US8771927B2 (en) * | 2009-04-15 | 2014-07-08 | Brewer Science Inc. | Acid-etch resistant, protective coatings |
US20120073741A1 (en) * | 2009-06-11 | 2012-03-29 | Harima Chemicals, Inc. | Adhesive composition |
US9018308B2 (en) * | 2009-12-01 | 2015-04-28 | Pbi Performance Products, Inc. | Polybenzimidazole/polyacrylate mixtures |
US8852391B2 (en) | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
US9263314B2 (en) | 2010-08-06 | 2016-02-16 | Brewer Science Inc. | Multiple bonding layers for thin-wafer handling |
JP5681502B2 (ja) | 2010-09-30 | 2015-03-11 | 東京応化工業株式会社 | 接着剤組成物 |
US8962723B2 (en) * | 2011-06-15 | 2015-02-24 | Lion Copolymer Geismar, Llc | Durable substrate coating and process for making |
JP5661669B2 (ja) | 2011-09-30 | 2015-01-28 | 東京応化工業株式会社 | 接着剤組成物、接着フィルムおよび基板の処理方法 |
SG11201401838QA (en) | 2011-10-31 | 2014-10-30 | Tokyo Ohka Kogyo Co Ltd | Adhesive composition for bonding water and supporting body for said wafer, adhesive film, and laminate |
US20140357785A1 (en) * | 2011-12-23 | 2014-12-04 | Frans Nooren Afdichtingssystemen B.V. | Composition for coating a substrate and method for coating a substrate |
JP6128837B2 (ja) * | 2012-02-21 | 2017-05-17 | 東京応化工業株式会社 | 接着剤組成物の製造方法、接着剤組成物及び接着フィルム |
JP6063737B2 (ja) * | 2012-03-12 | 2017-01-18 | 東京応化工業株式会社 | 接着剤組成物、接着フィルムおよび基板の処理方法 |
US9127126B2 (en) | 2012-04-30 | 2015-09-08 | Brewer Science Inc. | Development of high-viscosity bonding layer through in-situ polymer chain extension |
JP6216575B2 (ja) | 2012-10-25 | 2017-10-18 | 東京応化工業株式会社 | 接着剤組成物及び接着フィルム |
WO2014165406A1 (en) | 2013-04-01 | 2014-10-09 | Brewer Science Inc. | Apparatus and method for thin wafer transfer |
US10103048B2 (en) | 2013-08-28 | 2018-10-16 | Brewer Science, Inc. | Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates |
US9865490B2 (en) | 2014-01-07 | 2018-01-09 | Brewer Science Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
EP3092658A4 (en) | 2014-01-07 | 2017-07-05 | Brewer Science, Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
WO2016014648A2 (en) | 2014-07-22 | 2016-01-28 | Brewer Science Inc. | Polyimides as laser release materials for 3-d ic applications |
KR20210108482A (ko) | 2019-01-22 | 2021-09-02 | 브레우어 사이언스, 인코포레이션 | 3-d ic 응용을 위한 레이저-이형성 결합 재료 |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE388487A (zh) * | 1900-01-01 | |||
GB488557A (en) * | 1937-01-06 | 1938-07-06 | Dunlop Rubber Co | Improvements in or relating to adhesive compositions |
DE710987C (de) * | 1937-04-14 | 1941-09-24 | Herbig Haarhaus Akt Ges Lackfa | Anstrichmittel |
US2279256A (en) * | 1938-10-27 | 1942-04-07 | Dewey And Almy Chem Comp | Adhesive composition |
US3297617A (en) * | 1963-12-23 | 1967-01-10 | Velsicol Chemical Corp | Coating slurry containing aggregate and aqueous emulsion of petroleumderived hydrocarbon resin |
US3987122A (en) * | 1972-04-03 | 1976-10-19 | Exxon Research And Engineering Company | Thermoplastic adhesive compositions |
US3868433A (en) * | 1972-04-03 | 1975-02-25 | Exxon Research Engineering Co | Thermoplastic adhesive compositions |
US3959062A (en) * | 1972-08-10 | 1976-05-25 | E. I. Du Pont De Nemours And Company | Method of joining surfaces using segmented copolyester adhesive |
US3970494A (en) | 1975-04-18 | 1976-07-20 | Western Electric Co., Inc. | Method for adhering one surface to another |
JPS5996112A (ja) * | 1982-11-26 | 1984-06-02 | Toyo Soda Mfg Co Ltd | 高純度イソプレン重合体環化物の製造方法 |
US4793337A (en) * | 1986-11-17 | 1988-12-27 | E. R. Squibb & Sons, Inc. | Adhesive structure and products including same |
JPH07119328B2 (ja) | 1987-12-18 | 1995-12-20 | 三井石油化学工業株式会社 | 環状オレフィン系ランダム共重合体組成物 |
EP0335985B1 (en) * | 1987-10-08 | 1996-02-07 | Mitsui Petrochemical Industries, Ltd. | Random cycloolefin copolymer composition |
JP3221720B2 (ja) | 1992-03-25 | 2001-10-22 | 出光興産株式会社 | 環状オレフィン系共重合体組成物 |
JP3359080B2 (ja) | 1993-03-23 | 2002-12-24 | 東京応化工業株式会社 | 耐酸性保護膜形成用塗布液及びそれを用いた半導体素子の製造方法 |
TW383332B (en) * | 1995-02-14 | 2000-03-01 | Toyo Chemicals Co Ltd | Pressure-sensitive adhesive for attaching semiconductor wafer onto sheet |
US5844309A (en) * | 1995-03-20 | 1998-12-01 | Fujitsu Limited | Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition |
US5645603A (en) * | 1995-07-25 | 1997-07-08 | Peters; William E. | Method of enhancing physical properties of non-elastomeric thermoplastic materials and resulting compositions |
JPH09176398A (ja) | 1995-12-22 | 1997-07-08 | Mitsui Petrochem Ind Ltd | 環状オレフィン系樹脂組成物およびその用途 |
US5888650A (en) * | 1996-06-03 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Temperature-responsive adhesive article |
US6054363A (en) * | 1996-11-15 | 2000-04-25 | Canon Kabushiki Kaisha | Method of manufacturing semiconductor article |
ID21997A (id) * | 1997-01-30 | 1999-08-19 | Mitsui Chemicals Inc | Komposisi perekat lebur-panas |
JP4164136B2 (ja) * | 1997-08-04 | 2008-10-08 | コニシ株式会社 | スチレンブロック共重合体ゴム系接着剤組成物 |
US6110999A (en) * | 1998-03-06 | 2000-08-29 | Denovus Llc | Reusable adhesive composition and method of making the same |
US6440259B1 (en) * | 1999-08-04 | 2002-08-27 | 3M Innovative Properties Company | One-part storage-stable water-based contact adhesive composition with an internal coagulant |
JP2001139755A (ja) | 1999-11-15 | 2001-05-22 | Kanegafuchi Chem Ind Co Ltd | 光学フィルム用樹脂組成物 |
DE19956422A1 (de) * | 1999-11-24 | 2001-06-13 | Hella Kg Hueck & Co | Lösbare Klebstoffe zum Verbinden von Substraten |
CA2378078A1 (en) * | 2000-03-30 | 2001-10-11 | H.B. Fuller Licensing & Financing, Inc. | Adhesive composition comprising a particulate thermoplastic component |
KR100314881B1 (ko) * | 2000-06-24 | 2001-12-22 | 정하승 | 폴리올레핀 타입의 편향 요크용 핫멜트 조성물 |
KR20030042454A (ko) * | 2000-08-22 | 2003-05-28 | 제온 코포레이션 | 필름 적층 방법 |
TW574753B (en) * | 2001-04-13 | 2004-02-01 | Sony Corp | Manufacturing method of thin film apparatus and semiconductor device |
EP1295926A1 (en) | 2001-09-19 | 2003-03-26 | ExxonMobil Chemical Patents Inc. | Components for adhesive compositions and process for manufacture |
DE10213227A1 (de) * | 2002-03-25 | 2003-10-16 | Bayer Ag | Zusammensetzung |
US7186448B2 (en) * | 2002-05-13 | 2007-03-06 | Jsr Corporation | Composition and method for temporarily fixing solid |
AU2003251401A1 (en) * | 2002-06-14 | 2003-12-31 | Dow Global Technologies Inc. | Thermoplastic elastomer bonded directly to metal substrate |
US6828020B2 (en) * | 2002-08-14 | 2004-12-07 | Adco Products, Inc. | Self-adhesive vibration damping tape and composition |
US6869894B2 (en) * | 2002-12-20 | 2005-03-22 | General Chemical Corporation | Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing |
DE10334576B4 (de) | 2003-07-28 | 2007-04-05 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse |
US7084201B2 (en) * | 2003-11-14 | 2006-08-01 | Wall-Guard Corporation Of Ohio | Non-flammable waterproofing composition |
CN1886480A (zh) | 2003-11-27 | 2006-12-27 | 捷时雅株式会社 | 热熔型粘合剂组合物 |
JP2006135272A (ja) | 2003-12-01 | 2006-05-25 | Tokyo Ohka Kogyo Co Ltd | 基板のサポートプレート及びサポートプレートの剥離方法 |
KR100696287B1 (ko) | 2004-01-28 | 2007-03-19 | 미쓰이 가가쿠 가부시키가이샤 | 반도체 웨이퍼의 보호방법 |
JP2004156048A (ja) | 2004-02-09 | 2004-06-03 | Polyplastics Co | 環状オレフィン系樹脂組成物フィルム |
DE102004007060B3 (de) | 2004-02-13 | 2005-07-07 | Thallner, Erich, Dipl.-Ing. | Vorrichtung und Verfahren zum Verbinden von Wafern |
US7541264B2 (en) | 2005-03-01 | 2009-06-02 | Dow Corning Corporation | Temporary wafer bonding method for semiconductor processing |
JP5220616B2 (ja) | 2006-12-05 | 2013-06-26 | 三井化学株式会社 | 環状オレフィン系重合体組成物、およびその用途 |
-
2006
- 2006-02-06 US US11/348,143 patent/US8268449B2/en active Active
-
2007
- 2007-01-26 SG SG201100807-5A patent/SG169384A1/en unknown
- 2007-01-26 CN CN200780004575A patent/CN101790570A/zh active Pending
- 2007-01-26 WO PCT/US2007/061110 patent/WO2007092689A2/en active Application Filing
- 2007-01-26 KR KR1020087017286A patent/KR20080096646A/ko not_active Application Discontinuation
- 2007-01-26 EP EP07710318A patent/EP2007836A4/en not_active Withdrawn
- 2007-01-26 JP JP2008553452A patent/JP2009529065A/ja active Pending
- 2007-01-30 TW TW096103324A patent/TW200734419A/zh unknown
-
2008
- 2008-08-20 US US12/195,224 patent/US7678861B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2007836A2 (en) | 2008-12-31 |
WO2007092689A3 (en) | 2010-03-04 |
US8268449B2 (en) | 2012-09-18 |
EP2007836A4 (en) | 2013-01-23 |
KR20080096646A (ko) | 2008-10-31 |
US20080306207A1 (en) | 2008-12-11 |
CN101790570A (zh) | 2010-07-28 |
SG169384A1 (en) | 2011-03-30 |
US7678861B2 (en) | 2010-03-16 |
WO2007092689A2 (en) | 2007-08-16 |
JP2009529065A (ja) | 2009-08-13 |
US20070185310A1 (en) | 2007-08-09 |
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