JP2000143262A - Heating element, frit sintered compact and production of glass enclosure using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a process for producing an enclosure which is sealable more rapidly than a sealing method for heating the entire part of the conventional glass enclosures at a sealing temperature, is improved in yield and is easily generally used and a frit sintered compact which is a sealing member. SOLUTION: A frit sintered compact 5 is the frit sintered compact formed by adding a binder and a solvent to frit to prepare a frit paste, coating the surface of a heating element with this frit paste and firing the frit paste. Glass members 1 and 2 are held to face each other across the frit sintered compact 5 and load is applied thereto. The glass members 1 and 2 are then heated at temperature lower than the sealing temperature and the heating element is energized, by which the frit is melted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a frit fired body and a method for sealing a glass member, and more particularly, to a method for frit firing using a frit fired body having a heating element that generates heat by energization and a frit that covers the heating element. The present invention relates to a method for manufacturing a vacuum vessel by sealing members.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a glass envelope for maintaining the inside of a vacuum, a frit serving as a sealing material is applied or a sheet frit is placed between glass members to seal an electric furnace or the like. A sealing method in which the entire glass envelope is heated to the sealing temperature by filing the glass member in a furnace or placed on a hot plate heater (sometimes sandwiched between the hot plate heaters from above and below) by fritting. Has been taken.

[0003] As another sealing means, in order to improve the throughput, the whole object to be sealed is heated to 300 ° C, only the sealed part is locally heated by a diode laser, and is fused with a frit arranged in the sealed part. ("Photon
ics Spectra ", January, 1996, p18).

A flat image forming apparatus using an electron source requires an ultra-high vacuum to stably operate a cold cathode electron-emitting device or the like for a long period of time, so that a substrate having a plurality of electron-emitting devices is required. And a getter that seals a substrate having a phosphor at a position opposed thereto with a frit across a frame, adsorbs a released gas, and maintains a vacuum.

Heretofore, two types of electron-emitting devices using a thermionic electron-emitting device and a cold-cathode electron-emitting device have been known. The cold cathode electron emitting device includes a field emission type (hereinafter, referred to as “FE type”), a metal / insulating layer / metal type (hereinafter, referred to as “MIM type”), a surface conduction type electron emitting device, and the like. An example of the FE type is WP Dyke & W.
W. Dolan, “Field emission”, Advance in Electoro
n Physics, 8, 89 (1956) or CA Spindt,
“PHYSICAL Properties of thin-film field emission
cathodes with molybdenium cones ”, J. Appl. Phy
s., 47, 5248 (1976) and the like.

As an example of the MIM type, CA Mead, “Ope
ration of Tunnel-Emission Devices ”, J. Apply. Ph
ys., 32, 646 (1961) and the like.

As an example of the surface conduction electron-emitting device type,
MI Elinson, Recio Eng. Electron Phys., 10, 129
0, (1965) and the like.

The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current flows in a small-area thin film formed on a substrate in parallel with the film surface. Examples of the surface conduction electron-emitting device include a device using an SnO ₂ thin film by Elinson et al. And a device using an Au thin film [G. Dittmer: “Thin Solid Films”, 9, 317 (197)
2)], using an In ₂ O ₃ / SnO ₂ thin film [M. Hartwe
ll and CG Fonstad: “IEEE Trans. ED Con
f. "519 (1975)], and those based on carbon thin films [Hisashi Araki et al .: Vacuum, Vol. 26, No. 1, p. 22 (1983)] and the like have been reported.

A flat panel image display device which emits a fluorescent material by an electron beam generated from these cold cathode electron-emitting devices has been developed. A surface conduction electron-emitting device emits electrons by passing a current through a conductive thin film having a high resistance part in one part. An example of such a device is disclosed in Japanese Patent Application Laid-Open No. 7-235255. It is shown.

[0010]

However, the conventional method for manufacturing a glass envelope has the following disadvantages.

First, as described above, when manufacturing a glass envelope, a frit serving as a sealing material is applied or placed between glass members and placed in a sealing furnace such as an electric furnace. , Or put on the hot plate heater (sometimes sandwiched between the hot plate heater from above and below)
Since a sealing method is used in which the entire glass envelope is heated to the sealing temperature and the glass member at the sealing portion is fused with a frit, there is a problem that it takes time to raise and lower the temperature.

To solve this problem, a method has been proposed in which the sealing time is shortened by locally heating using a laser to lower the heating temperature of the entire glass envelope. Is usually illuminated in the form of a spot,
It is not possible to uniformly heat all parts where the frit is arranged at the same time, and it is difficult to apply load evenly because there are parts where the frit has melted and parts where it has not melted,
Vacuum airtightness in uneven parts such as wiring becomes uncertain,
There was a problem that the yield was low. In addition, it is necessary to scan the portion where the frit is arranged in order, which takes time. In addition, when the heat capacity distribution of the sealed object is large, it is necessary to control the scanning speed, power, and the like accordingly. Therefore, there has been a problem that a new control circuit and a new program are required for generalization.

Therefore, the present invention can seal in a shorter time than the conventional sealing method in which the entire glass envelope is heated at the sealing temperature, and the yield can be reduced with respect to local heating sealing using a laser. It is an object of the present invention to provide a method for manufacturing an envelope that can be easily and widely used and can be sealed in a shorter time, and a frit fired body that is a sealing member.

[0014]

A frit fired body according to the present invention for solving the above-mentioned problems is a frit fired body having a heating element that generates heat when energized, and a frit that covers the heating element. A binder and a solvent are added to the frit to form a frit paste, and the surface of the heating element is covered with the frit paste and fired.

Further, the method for sealing a glass member using a fired frit body according to the present invention is a method for sealing a glass member using a fired frit body having a heating element that generates heat by energization and a frit that covers the heating element. The frit fired body is a fired body obtained by adding a binder and a solvent to the frit to form a frit paste, covering the surface of the heating element with the frit paste, and firing. A load is applied to the glass member such that the glass member faces each other with the body interposed therebetween, the glass member is heated at a temperature lower than a sealing temperature, and electricity is supplied to the heating element to melt the frit.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

First, referring to FIG. 1, as a simple example, a glass face plate, a rear plate disposed opposite to the glass face plate, and a peripheral portion between the face plate and the rear plate. A method for locally heating and sealing a glass envelope made of a glass outer frame surrounding the above will be described. 1 (a) to 1 (c), 1
Is a glass face plate, 2 is a rear plate disposed opposite to the glass face plate 1, 3 is a glass outer frame which is located between the face plate 1 and the rear plate 2 and surrounds the periphery, and 5 is a feature of the present invention. , A frit fired body having a heating element, 6 is a hot plate heater, and 7 is a current source.

As shown in FIG. 1 (a), in this description, an example will be described in which the rear plate 2 is sealed to the glass outer frame 3 and the face plate 1 which have been integrated in advance by normal sealing. FIG. 1B is a diagram of the sealing viewed from the side.

First, as shown in FIG. 1 (a), a frit provided with a heating element which is a feature of the present invention, which will be described in detail later, is arranged in a sealing portion on a face plate and a glass outer frame integrated. I do. In this description, four frit are arranged as shown in the figure, and the rear plate 2 is overlapped. As shown in FIG. 1B, a uniform load is applied to the hot plate 6 so that the frit flows by the weight 8 as shown in FIG.
Is heated so that the temperature distribution inside the glass to be sealed becomes uniform. Then, a current is passed from the current source 7 between the extraction electrodes of the frit fired body having the heating element, whereby the frit portion is heated to a desired sealing temperature to perform sealing.

Here, the frit fired body provided with a heating element is a frit powder obtained by adding a binder such as an acrylic resin and a solvent to a frit powder to form a paste.
It is applied to a heating element with a dispenser or the like and preliminarily baked.

As the material of the heating element, NiCr, Ti,
It is desirable to use a material such as Ni having a coefficient of linear expansion close to that of glass so that thermal stress is reduced with respect to glass, and a material having high resistance so as to easily generate heat at a low current. By using a heating element, sealing can be performed in accordance with the heat capacity distribution of the sealing portion.

Regarding the shape, the extraction electrode is 2
It is necessary to have some places.
As shown in FIG. 2A, a frit is applied around a linear heating element and temporarily baked, and as shown in FIG. 2B, a frit is applied and fired on a surface of a foil-shaped heating element.
When the frit is combined as shown in FIG. 2 (c), it is sufficient that the extraction electrode does not overlap at the boundary of the frit, and the boundary serves as a melted portion of the frit. Although the direction is perpendicular to the heating element, the angle is arbitrary.

Although the frit fired body is shown as a straight one, it can be formed in any shape according to the shape of the sealed object.

Next, the heating of the whole sealed object will be described. If the temperature distribution of the glass member is large at the time of sealing, the glass will crack. Therefore, in order to prevent the glass from cracking, the entire glass envelope is made up of a hot plate as described in this description or an electric furnace (not shown). Heat below sealing temperature. Hereinafter, heating below the sealing temperature will be referred to as assist heating.

It is desirable to remove the frit extraction electrode portion provided with the heating element after cutting, if necessary, by cutting or the like. In this description, for the sake of simplicity, an example is shown in which the face plate is later sealed with the glass outer frame and the rear plate integrated beforehand, but as shown in FIG. It is also possible to simultaneously seal the rear plate and the glass outer frame, and the glass outer frame and the face plate.

The glass envelope is manufactured as described above.

As described above, in the method for manufacturing a glass envelope in which a plurality of glass members are sealed using a sealing material to maintain the inside of the glass envelope in a vacuum, the entire glass envelope is lower than the sealing temperature of the sealing portion. In order to perform sealing using local heating means for heating the sealing portion to the sealing temperature at the same time as the heating means for heating to the sealing temperature from the outside of the envelope, it is possible to reduce the temperature for heating the entire glass. It is possible to manufacture a glass envelope by reducing the time required to raise and lower the temperature as compared to a sealing method in which the entire envelope is heated to the sealing temperature and the glass member of the sealed portion is fused with a frit. it can.

In the electron source substrate constituting the glass envelope, electrodes, wirings, etc. for driving the electron source are formed. In order to maintain the glass container in a vacuum, the electrodes and the wiring are provided. In order to obtain vacuum airtightness in a portion having irregularities such as wiring, it is possible to perform sealing while pressing constantly at the time of melting of the frit, and the yield is improved with respect to local heating sealing by the laser. In addition, it is possible to melt the entire part where the frit is arranged at the same time, and there is no need to heat the sealing seal part by laser scanning to melt the frit in order, especially when developing and applying to large area panels. The time required for the sealing step can be significantly reduced.

Further, when there is a large distribution of heat capacity in each sealed portion of the glass envelope to be sealed, it becomes necessary to control the scanning speed, power, etc. in accordance with the distribution. There has been a problem that general control requires a new control circuit or program. However, in the present invention, it is possible to deal with only a simple means of selecting a frit with a heating element having a desired heat generation amount according to the heat capacity of each sealing portion, and combining these and arranging them in the sealing portion. is there. Thus, the frit of the present invention can be easily generalized.

The method for manufacturing a glass envelope according to the present invention is preferably used for a method for manufacturing an image display device in which a phosphor and an electron accelerating electrode are formed on a face plate and an electron source is formed on a rear plate. Can be This electron source
Surface conduction electron-emitting devices are preferred. Therefore, a method of manufacturing an image display device using a surface conduction electron-emitting device, which is most preferably used in the present invention, will be described below. The essence of the present invention is a manufacturing method relating to a method of sealing a glass envelope. Therefore, it goes without saying that the present invention can be applied not only to the method of manufacturing an image display device using a surface conduction electron-emitting device but also to a method of manufacturing another glass envelope.

Here, a method of manufacturing an image display device using a surface conduction electron-emitting device used in the present invention will be described.
An embodiment will be described with reference to FIGS. In this embodiment, an electron-emitting device and wiring are formed on the rear plate,
A phosphor and a metal back were formed on the face plate.

First, an image display device according to the present invention will be described with reference to FIG. 3, and then a manufacturing method thereof will be described.

FIG. 3 is a perspective view of the image display device used in the present embodiment, and a part of the panel is cut away to show the internal structure. In the drawing, reference numeral 35 denotes a rear plate, 36 denotes a support frame, and 37 denotes a face plate. These form a glass envelope for maintaining the inside of the display panel at a vacuum. In assembling the glass envelope, it is necessary to seal the members so as to maintain sufficient strength and airtightness for joining the members. The inside of the glass envelope is evacuated to a vacuum by an exhaust pipe (not shown). The exhaust pipe is also used as a gas introduction pipe for an activation gas in an activation step generated during a process step.

In the figure, N × M surface conduction electron-emitting devices 32 are formed on the rear plate 35. (N,
M is a positive integer of 2 or more and is appropriately set according to the target number of display pixels. In the N × M surface conduction electron-emitting devices, simple matrix wiring is performed by M row-directional wirings 33 (also called lower wirings) and N column-directional wirings 34 (also called upper wirings).

Next, description will be made with reference to FIG. FIG. 4 is a schematic diagram showing the configuration of the surface conduction electron-emitting device.
4A is a plan view, and FIG. 4B is a sectional view. In FIG. 4, 41 is a substrate, 42 and 43 are device electrodes, 44 is a conductive thin film, and 45 is an electron emitting portion.

By forming the conductive thin film 44 through the device electrodes 42 and 43 while evacuating the glass envelope to a vacuum through the exhaust pipe 31, the conductive thin film is locally broken, deformed or deteriorated. When the pressure inside the glass envelope becomes 1 × 10 ⁻³ Pa or less, the electron emission portion 35 is brought into an electrically high-resistance state. Acetone is introduced as an oxidizing gas at about 1 Pa, and an activation step for remarkably improving the emission current is performed by applying a voltage to the device electrodes 42 and 43 of the surface conduction electron-emitting device and causing a current to flow through the device. The activation of the electron emission section 45 is performed.
A phosphor 38 is formed on the lower surface of a face plate 37 which is the same as the example disclosed in Japanese Patent Application Laid-Open No. 7-235255 described in the prior art. Since the present embodiment is a color display device, phosphors of three primary colors of red, green, and blue used in the field of CRT are separately applied to a portion of the fluorescent film 38. A metal back 39 known in the field of CRT is provided on the surface of the fluorescent film 38 on the rear plate side. The purpose of providing the metal back 39 is to improve the light efficiency by mirror-reflecting a part of the light emitted from the fluorescent film 33, to protect the fluorescent film 38 from the collision of negative ions, and to reduce the electron beam acceleration voltage. It may be used as an electrode for application or may serve as a conductive path for the excited electrons of the fluorescent film 38. Metal back 39 is fluorescent film 3
After 8 was formed on the face plate substrate 37, the fluorescent film 38 was smoothed, and Al was formed thereon by vacuum evaporation. Although not used in the present embodiment, for the purpose of applying an acceleration voltage and improving the conductivity of the fluorescent film, a gap between the face plate substrate 37 and the fluorescent film 38 is provided.
For example, a transparent conductive film such as ITO may be provided.

Dx1 to Dxm and Dy1 to Dyn
Hv is an electric connection terminal of an airtight container provided for electrically connecting the display panel to an electric circuit (not shown). Dx1 to Dxm are electrically connected to the row wiring 33 of the multiple electron beam source, Dy1 to Dyn are electrically connected to the column wiring 34 of the multiple electron beam source, and Hv is electrically connected to the metal back 39 of the face plate.

The image display device to which the manufacturing method of the present invention is applied has been described above.

The method for manufacturing the image display device of the present invention will be specifically described.

First, the creation of the rear plate will be described.

First, the lower wiring 23 was formed by screen printing on a rear plate made of blue glass having a silicon oxide film formed on the surface. Next, an interlayer insulating film is formed between the lower wiring 33 and the upper wiring 34. Further, an upper wiring 34 was formed.
Next, device electrodes 42 and 43 connected to the lower wiring 33 and the upper wiring 34 were formed.

Next, after a conductive thin film 34 made of PdO is formed, it is patterned to obtain a desired form.

Next, a frit for fixing the outer frame was formed at a desired position.

Through the above steps, a rear plate was formed on which surface conduction electron-emitting devices having a simple matrix wiring were formed.

Next, the creation of the face plate will be described.

First, a phosphor and a black conductor plate were formed on a blue plate glass substrate, a smoothing treatment was performed on the inner surface of the phosphor film, and then an Al metal back was formed.

Next, a frit for fixing the outer frame was formed at a desired position.

Through the above steps, a phosphor in which the phosphors of the three primary colors are arranged in stripes was formed on the face plate. -Creation of glass envelope by local heating of sealed portion The glass envelope of the image display device was sealed by the above-mentioned "method of local heating and sealing of glass envelope".

Next, the production of an electron-emitting device by a vacuum process will be described.

First, the exhaust pipe (not shown) of the face plate of the glass envelope sealed as described above was connected to a vacuum exhaust device, and the inside of the glass envelope was evacuated to a vacuum.

Next, when the pressure in the glass envelope is 0.1 Pa
When the following conditions are met, the external terminals Dox1 to Doxm and Dox
A voltage was applied to the electron-emitting device through y1 to Doyn, and a forming process was performed on the conductive thin film 34.

Subsequently, when the pressure in the glass envelope was 1 × 10
When the pressure becomes ^-3 Pa or less, acetone as an element activating gas is introduced into the glass envelope through an exhaust pipe at a pressure of 1 Pa, and a voltage is applied to the electron-emitting device through the outer terminals Dox1 to Doxm and Doy1 to Doyn to apply a voltage to the electron emitting device. Was activated.

Next, the degassing step in the glass envelope will be described.

First, after activating gas was sufficiently exhausted, baking degassing was performed at 300 ° C. for 10 hours while exhausting the glass envelope. After this, the exhaust pipe 31
Was heated and melted to perform sealing (chip-off).

Thus, an image display device was completed.

[0056]

(Embodiment 1) Referring to FIGS. 1 (b), 2 (a), 3 and 4, an image forming apparatus using a glass envelope manufactured by the sealing method of the present invention will be described. An example of fabrication will be described.

The frit used was a linear heating element shown in FIG. 2 (a). The material was nickel, and the diameter was 0.3 mm at the portion to be sealed and the resistance was at the extraction electrode portion. Four pieces having a diameter of 1 mm were used so as to be lower.

First, a rear plate and a face plate were prepared.

Then, the glass outer frame and the face plate were sealed in a usual sealing furnace. Then, FIG.
(a) According to FIG. 1 (b), four frit equipped with the above-mentioned heating element were placed in a glass sealing portion, and the heating was performed by a hot plate as the assist heating, and the sealing was performed.

With such a configuration, first, the entire heater was heated to 300 ° C. at 4 ° C./min by the upper and lower heaters and the hot plate. Next, the take-out electrodes were joined to each other so that the heating elements of the four frit were connected in series, and 0.1 A / 1 sec. At a rate of 13.5 A and maintained for 5 minutes, and then 0.1 A / 1 sec. At 0
Down to A.

Subsequently, the upper and lower heaters and the hot plate were cooled at a rate of 1 ° C./min. After the temperature dropped to room temperature, the extraction electrode portion was cut.

The glass envelope produced as described above was free of cracks and the like, and was kept in a vacuum-tight state even at the portion where it was sealed with the wiring, so that there was no problem as a vacuum glass container. After that, an electron-emitting device was manufactured by a vacuum process,
Degassing and sealing were performed to produce an image display device.

In the production of the above-described vacuum container, the sealing time was shortened as compared with the conventional sealing.

Embodiment 2 Using FIGS. 1C, 2B, 3 and 4, an image forming apparatus using a glass envelope manufactured by the sealing method of the present invention is manufactured. An example will be described.

FIG. 5 shows the shape of the support frame used.

A face plate having a thickness greater than that of the rear plate was used. Therefore, the frit is a foil-shaped heating element shown in FIG. 2B at the sealing portion between the support frame and the face plate, and is made of a material NiCr and has a thickness of 50 μm.
m, width of sealing part 0.8mm, width of take-out part only 8m
m, and the sealing portion between the support frame and the rear plate is also made of a foil-like heating element.
r, a thickness of 50 μm, a width of a sealing portion of 1 mm, and a width of only a take-out portion of 8 mm were used.

In the envelope manufactured in this embodiment, the three sides of the sealed portion shown in FIG.
Since the sides have a curved shape, three straight lines and one curved line were used for each sealing portion.

While aligning the rear plate and the face plate, as shown in FIG. 1C, the face plate, the frit, the support frame, the frit, and the rear plate are superimposed in this order, and this is evacuated by a vacuum pump. After heating up to 250 ° C. at a rate of 1 ° C./min in a furnace capable of performing the above, frit extraction electrodes provided with upper and lower heating elements are connected in series, respectively, and a current source supplies 0.1 A / 1 sec.
c. At a rate of 4.5 A and maintained for 5 minutes, and then 0.1 A / 1 sec. And lowered to 0A.

Subsequently, the whole furnace was cooled to room temperature at 1 ° C./min.

After the temperature dropped to room temperature, the extraction electrode portion was cut.

The glass envelope produced as described above was free of cracks and the like, and was maintained in a vacuum-tight state even at the portion where it was sealed with the wiring, so that there was no problem as a vacuum glass container. After that, an electron-emitting device is manufactured by a vacuum process,
Degassing and sealing were performed to produce an image display device.

In the production of the above-mentioned vacuum vessel, the sealing time was significantly reduced as compared with the conventional furnace.

[0073]

According to the present invention described above, the entire glass envelope is heated to a temperature lower than the sealing temperature of the sealing portion, and only the sealing portion is heated to the sealing temperature. It is possible to reduce the time required to raise and lower the temperature compared to the sealing method of heating the entire glass envelope to the sealing temperature and fusing the glass member of the sealing part with a frit. To produce a glass envelope.

Further, according to the present invention, in order to maintain a vacuum in a glass container comprising a rear plate on which electrodes and wirings for driving an electron source are formed, a vacuum is applied to the uneven portions such as the electrodes and wirings. It is possible to seal while pressing constantly when the frit is melted in order to take airtightness,
The yield is improved with respect to local heat sealing by laser. In addition, it is possible to melt the entire part where the frit is arranged at the same time, and there is no need to heat the sealing seal part by laser scanning to melt the frit in order, especially when developing and applying to large area panels. The time required for the sealing step can be significantly reduced.

Further, according to the present invention, even if the heat capacity of each sealed portion of the glass envelope to be sealed has a large distribution, a frit with a heating element having a desired calorific value is selected. Then, it can be sealed by combining them.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a sealing method of the present invention.

FIG. 2 is a view showing a typical shape of a frit provided with a heating element.

FIG. 3 is a perspective view of the image display device of the present invention.

FIG. 4 is a basic configuration diagram of a surface conduction electron-emitting device.

FIG. 5 is a perspective view showing the shape of a support frame used in Example 2.

[Description of Signs] 1 Face plate 2 Rear plate 3 Crow outer frame 5 Frit fired body provided with heating element 6 Hot plate heater 7 Current source 8 Weight for load 21 Frit 22 Heating element 23 Extraction electrode 31 Exhaust pipe 32 Surface conduction type Electron emission device 33 Row direction wiring 34 Column direction wiring 35 Rear plate 36 Support frame 37 Face plate 38 Phosphor 39 Metal back 41 Insulating substrate 42, 43 Device electrode 44 Conductive thin film 45 Electron emitting portion

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hidehiko Fujimura 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 3K034 AA02 AA12 AA15 AA37 BB05 BB14 BC02 BC16 BC24 CA02 CA15 CA32 HA01 HA10 JA01 JA02 5C012 AA05 BC03

Claims (8)

[Claims] 1. A heating element characterized in that a heating element that generates heat when energized is covered with a joining member that joins the members. 2. A frit fired body having a heating element that generates heat by energization and a frit that covers the heating element, wherein a binder and a solvent are added to the frit to form a frit paste, and the surface of the heating element is A fired frit body coated with a frit paste and fired. 3. The frit fired body according to claim 2, wherein the heating element is a rod-shaped body. 4. The frit fired body according to claim 2, wherein the heating element is a foil. 5. A glass envelope that seals a plurality of glass members and maintains the inside airtight by using a frit fired body having a heating element that generates heat by energization and a frit that covers the heating element. The frit fired body is a fired body obtained by adding a binder and a solvent to the frit to form a frit paste, and covering the surface of the heating element with the frit paste and firing the frit. Applying a load to the glass member such that the glass member faces each other with a body interposed therebetween, heating the glass member at a temperature lower than a sealing temperature, and energizing the heating element to melt the frit. Manufacturing method of glass envelope. 6. A first glass plate and a second glass plate are opposed to each other via a glass outer frame, and the first glass plate, the second glass plate, and the glass outer frame are integrally sealed. The method for manufacturing a glass envelope according to claim 5, wherein 7. A method for manufacturing a glass envelope of an image display device, wherein a phosphor and an electron accelerating electrode are formed on the first glass plate, and an electron source is formed on the second glass plate. 7. The method for manufacturing a glass envelope according to claim 6, wherein 8. The method according to claim 7, wherein the electron source is a surface conduction electron-emitting device.