JP3647289B2 - Manufacturing method of glass envelope - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a glass envelope in which a plurality of glass members are sealed with a sealing material in a thin image display device or the like applied to a color television or a computer terminal, and the inside is configured in a reduced pressure state.ofIt relates to a manufacturing method.
[0002]
[Prior art]
  Conventionally, when manufacturing a glass envelope having a space inside, a frit glass as a sealing material is applied or placed between glass members and put in a sealing means such as an electric furnace, or Put on a hot plate heater (may be sandwiched between hot plate heaters from above and below), heat the entire glass envelope to the sealing temperature, and seal the sealed part between the glass members with molten frit glass .
[0003]
  In particular, when this glass envelope is used as a vacuum container of an image display device, conventionally, an electron-emitting device is used in the glass envelope. The electron-emitting devices are roughly classified into two types: a thermionic emission device and a cold cathode electron-emitting device. Cold cathode electron-emitting devices include field emission type (hereinafter referred to as “FE type”), metal / insulating layer / metal type (hereinafter referred to as “MIM type”), surface conduction electron-emitting device, and the like. is there. Examples of the FE type include W.W. P. Dyke & W. W. Dolan, "Field emission", Advance in Electron Physics, 8, 89 (1956) or C.I. A. Spindt, “PHYSICAL Properties of Thin-Film Field Emission Catalysts with Mollybdenium Cones”, J. Am. Appl. Phys. 47, 5248 (1976), etc. are known.
[0004]
  Examples of MIM types include C.I. A. Mead, “Operation of Tunnel-Emission Devices”, J. Am. Appl.Phys. , 32, 646 (1961) are known.
[0005]
  Examples of the surface conduction electron-emitting device type include M.I. I. Elinson, Radio Eng. Electron Phys. , 10, 1290, (1965). This surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current is passed through a small-area thin film formed on a substrate in parallel to the film surface. As this surface conduction electron-emitting device, SnO as described by Erinson et al.₂Thin film, Au thin film [G. Dittmer: “Thin Solid Films”, 9, 317 (1972)], In₂O_Three/ SnO₂By thin film [M. Hartwell and C.H. G. Fonstad: "IEEE Trans. ED Conf." 519 (1975)], and carbon thin film [Hisa Araki et al .: Vacuum, Vol. 26, No. 1, p. 22 (1983)] have been reported.
[0006]
  Development of flat panel image display devices that emit phosphors with an electron beam generated from these cold cathode electron-emitting devices has been underway. The surface conduction electron-emitting device emits electrons by passing a current through a conductive thin film partially having a high resistance portion. For example, Japanese Patent Application Laid-Open No. HEI 7-7 already filed by the present applicant. No. 235255 is disclosed in the publication.
[0007]
  In an image display device using electrons, a face envelope, a rear plate, and an outer frame are sealed with a sealant, and the inside is decompressed to form a glass envelope. An electron source that generates electrons, a driving circuit for the electron source, an image forming member having a phosphor that emits light by collision of electrons, an acceleration electrode for accelerating electrons toward the image forming member, and a high-voltage power source thereof Etc. need to be configured.
[0008]
[Problems to be solved by the invention]
  However, the conventional method for manufacturing a glass envelope has the following problems.
[0009]
  As described above, when manufacturing a glass envelope, a frit glass as a sealing material is applied or placed between glass members and placed in a sealing means such as an electric furnace, or a hot plate heater. (It may be sandwiched by a hot plate heater from above and below), and the entire glass envelope, including the part other than the sealing part, is heated to the sealing temperature. The method of sealing through glass is taken. For this reason, there has been a problem of using energy such as excess electric power for heating other than the sealing portion. In addition, there is a problem that it takes time to raise the entire glass envelope to the sealing temperature and to cool it to room temperature.
[0010]
  The present invention has been made on the basis of the above circumstances, and glass that realizes sealing between glass members with a smaller amount of energy without heating the entire glass envelope to the sealing temperature as in the prior art. EnvelopeofAn object is to provide a manufacturing method.
[0011]
[Means for Solving the Problems]
  In order to achieve the above object, the present invention uses a sealing material for a plurality of glass members.So that the sealing part is squareIn the manufacturing method of the sealed glass envelope,
  Heating the entire glass envelope to a temperature lower than the sealing temperature of the sealing material;The sealing portion is arranged by energizing a wiring which is arranged along the sealing material and has a high electric resistance in the vicinity of the corner portion of the sealing portion so that the temperature at the corner portion is higher than that of the other portion. To compensate for the temperature distribution between the corner and other parts of theIt is characterized by that.
[0012]
  Also,In the present invention, a plurality of glass members are used with a sealing material.In the manufacturing method of the glass envelope that is sealed and configured so that the sealed portion is square,
The whole glass envelope is heated to a temperature lower than the sealing temperature of the sealing material, and the sealing material is heated to the sealing temperature, and sealed by irradiation with a lamp from the outside of the glass envelope. Compensate the temperature distribution between the corners of the part and other partsIt is characterized by that.
[0013]
  With such a configuration, the loss of thermal energy when sealing the glass envelope can be suppressed, the time required for temperature rise and fall can be shortened, and the temperature distribution at the sealed portion of the glass envelope can be reduced. Sticking can be reduced and the thermal stress of the glass member at the time of sealing can be reduced. For this reason, there is no thermal strain between the glass members, and a non-defective product is obtained as a glass envelope.
[0014]
  In such a configuration, since the temperature of the image area is kept low compared to the conventional case where the entire envelope is heated at the sealing temperature without means for local heating, it is arranged in the image area. Thermal degradation of the electron-emitting device that is used can be avoided.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, the glass envelope of the present inventionofThe manufacturing method will be specifically described with reference to FIGS. First, in the image forming unit of the image display device, the glass envelope of the present inventionManufacturing methodAs an example of applyingGlass envelopeA simple configuration is shown. That is, the glass envelope here includes a glass face plate, a rear plate arranged to face the glass face plate, and a glass outer frame that surrounds the peripheral portion between the face plate and the rear plate. Consists of
[0016]
・ About local heating sealing method of glass envelope
  When heating the entire glass envelope by hot plate heaters 6 and 7 (first heating means) from above and below using FIG. 1 (this heating is performed at a required temperature lower than the sealing temperature), glass The structural conditions for locally heating the sealed portion of the envelope will be described.
[0017]
  In FIG. 1, reference numeral 2 denotes a rectangular (particularly rectangular) glass face plate, 1 denotes a glass rear plate that is also disposed opposite to the glass face plate 2, and 3 denotes a face plate 2 and a rear plate. 1 is a rectangular (rectangular) glass outer frame that surrounds the peripheral edge thereof, 4 is a frit glass that is a sealing material, and 5 is an electric heater (second heating means) for locally heating the sealing material 4. It is.
[0018]
  As shown in FIG. 1, for example, a local heating heater is formed between the sealing material and the glass member (2, 1), and the sealing portion (sealing material) is locally applied to the sealing temperature using the local heating heater. In order to prevent the glass from cracking, the other part is assisted heated below the sealing temperature, and the sealing material is heated and melted by heat conduction from the glass member.
[0019]
・ About the method of equalizing the temperature of the sealing part
  As described above, when the assist heating by the first heating unit and the local heating by the second heating unit are performed, the temperature distribution varies in the sealed portion. In the case of a normal glass envelope, the corner portion of the glass outer frame has a different temperature because the heat escape is different from that of the straight portion. That is, at the outer corner portion of the glass outer frame, the heat escape is larger than the straight portion, so that the temperature is likely to decrease. On the other hand, at the corner portion inside the glass outer frame, the temperature tends to rise. For this reason, the temperature difference becomes large near the corner portion, the thermal stress distortion becomes the largest, and it becomes easy to crack at the time of local heating sealing and subsequent cooling.
[0020]
  thereThe sealA temperature compensation means for the landing part is used. As this embodiment,The means listed in (1) to (5) can be considered, but the embodiments of the present invention are (3) and (5).Means are adopted.
[0021]
  (1) By specifying the shape of the corners of the glass face plate 2 and the glass rear plate 1, heat escape from the outer frame can be reduced. For example, as shown in FIG. 1, the protruding portion from the glass outer frame 3 of the glass face plate 2 and the glass rear plate 1 only needs to be small at the corner. Specific shapes include means such as rounding corners or cutting off corners.
[0022]
  (2) The shape of the corners of the glass outer frame 3 can reduce heat escape from the outer frame. For example, as shown in FIG. 2, the specific shape includes means for rounding the corner or cutting off the corner.
[0023]
  (3) The electrical resistance value at the corner of the local heating heater 5 can be increased, and the heating temperature at the corner can be made higher than that at other portions, for example, the straight portion. That is, as specifically shown in FIG. 3, the width of the heater 5 is reduced at the corners. Although it can be dealt with even if the thickness is reduced, as described above, since the temperature is more likely to decrease at the outer corner portion, it is preferable that the heat is more easily generated on the outer side.
[0024]
  (4) In addition, a heater for temperature compensation can be separately provided at the portion (corner portion).
[0025]
  (5) A heat source (for example, a lamp) is provided outside the glass envelope, and the temperature of the corners of the sealing portion can be compensated by radiant heat.
[0026]
  In this way, for example, by suppressing the variation in the temperature distribution at the sealed portion to within ± 10 ° C., the tensile stress due to heat in the vicinity of the sealed portion can be suppressed to about 10 MPa or less. Of glass components in the attachment process and cooling processWalletCan be prevented. In particular, in the manufacture of the glass envelope according to the present invention, the entire envelope is sealed without local heating means as in the prior art by locally heating the sealed portion and assisting heating the other portion. The glass envelope can be manufactured with less power or the like than when heating at the deposition temperature. Further, since the image area of the glass rear plate is maintained at the heating temperature of the assist (first heating means), the electron-emitting device is not deteriorated by heat. Further, as described above, since the temperature of the sealing portion is uniformly maintained, the generation of thermal stress in the glass member is reduced, and the glass member in the sealing step and the subsequent heating step is reduced.distortionIs reduced.
[0027]
  When an image forming apparatus is used, the glass envelope according to the present invention includes a phosphor and an electron accelerating electrode formed on the face plate 2 and an electron source formed on the rear plate 1. An image forming unit is configured. The electron source is preferably a surface conduction electron-emitting device, but is not limited thereto, and can be applied to a glass envelope for an image forming apparatus using the above-described cold cathode or hot cathode. It is also preferably applied to a glass envelope for a plasma display.
[0028]
  Accordingly, a method for manufacturing an image forming portion (glass envelope) of an image display apparatus using a surface conduction electron-emitting device in which the present invention is preferably used will be described below. Since the present invention relates to sealing of an envelope, the present invention is applied not only to the manufacture of an image forming unit of an image display device using a surface conduction electron-emitting device but also to the manufacture of other glass envelopes. Needless to say, you can.
[0029]
  Here, with respect to the manufacture of an image display device having a surface conduction electron-emitting device in which the present invention is used, the embodiment thereof is shown in FIG., FIG.This will be specifically described with reference to FIG. In the present embodiment, an electron-emitting device and wiring are formed on the rear plate 1, and a phosphor and a metal back are formed on the face plate 2. First, the image display device of the present invention will be described with reference to FIG. 5, and then the manufacturing method will be described.
[0030]
  FIG. 5 is a perspective view of the image display apparatus according to the present invention, in which a part of the panel is cut away to show the internal structure. In the figure, reference numeral 55 denotes a rear plate, 56 denotes a support frame, and 57 denotes a face plate. The members 55 to 57 here form a glass envelope for maintaining the inside of the display panel in a vacuum. . When assembling the glass envelope, it is necessary to seal it in order to maintain sufficient strength and airtightness for joining the members. At this time, the inside of the glass envelope is evacuated to a vacuum state via an exhaust pipe (not shown). This exhaust pipe introduces an activated gas in the activation process generated during the process process. Also used as a tube.
[0031]
  In the drawing, N × M surface conduction electron-emitting devices 52 are formed on the rear plate 55 (N and M are positive integers of 2 or more, and are appropriately set according to the target number of display pixels. In the N × M surface conduction electron-emitting devices, the number of row direction wirings 53 (also referred to as lower wirings) and N number of column direction wirings 54 (also referred to as upper wirings) are simple. Matrix wiring).
[0032]
  A phosphor 58 is formed on the lower surface of the face plate 57. In this embodiment, since colors are used for image display, phosphors of three primary colors of red, green, and blue used in the field of CRT are separately applied to the fluorescent film 58. In the field of CRT, a known metal back 59 is provided on the surface of the fluorescent film 58 on the rear plate side. The metal back 59 is formed by forming the fluorescent film 58 on the face plate substrate 57, smoothing the fluorescent film 58, and vacuum-depositing Al thereon.
[0033]
  Although not used in this embodiment, a transparent conductive film such as ITO is used between the face plate substrate 57 and the fluorescent film 58 for the purpose of applying an acceleration voltage and improving the conductivity of the fluorescent film. It may be provided.
[0034]
  Reference numerals Dx1 to Dxm, Dy1 to Dyn, and Hv are electrical connection terminals of an airtight container provided to electrically connect the display panel and its electrical circuit (not shown). The terminals Dx1 to Dxm are electrically connected to the row wiring 53 of the multi electron beam source, the terminals Dy1 to Dyn are connected to the column wiring 54 of the multi electron beam source, and the terminal Hv is electrically connected to the metal back 59 of the face plate. Has been.
[0035]
  Next, description will be made with reference to FIG. 6A and 6B are schematic views showing the configuration of the surface conduction electron-emitting device, where FIG. 6A is a plan view and FIG. 6B is a cross-sectional view. In FIG. 6, reference numeral 61 is a substrate, 62 and 63 are element electrodes, 64 is a conductive thin film, and 65 is an electron emission portion.
[0036]
  The electron emitting portion 65 is a portion in which the conductive thin film 64 is locally destroyed, deformed or altered by forming the conductive thin film 64 through the device electrodes 62 and 63 so as to be in an electrically high resistance state. 65, and the atmosphere surrounding the element is, for example, 1 × 10^-3Then, for example, acetone is introduced into the atmosphere as an activation gas made of organic matter at about 1 Pa, a voltage is applied to the above-described device electrodes 62 and 63, and a current flows through the device (activation). Thus, an electron emission portion 65 is formed at the same time as the formation of a film mainly composed of carbon (similar to that disclosed in Japanese Patent Laid-Open No. 7-235255 described in the prior art).
[0037]
  An example of the method for manufacturing the glass envelope of the image display apparatus according to the present invention will be specifically described.
[0038]
・ Rear plate creation
  (1) A lower wiring is formed by screen printing on a blue glass rear plate having a silicon oxide film formed on the surface, and then an interlayer insulating film is formed between the lower wiring and the upper wiring. Furthermore, an upper wiring was formed, and an element electrode connected to the lower wiring and the upper wiring was formed.
  (2) Next, after forming a conductive thin film made of PdO, it was patterned to obtain a desired form.
  (3) A frit glass for fixing the outer frame was formed at a desired position. Through the above steps, a rear plate on which a surface conduction electron-emitting device having a simple matrix wiring, a sealing material for an outer frame, and the like were formed could be produced.
[0039]
・ About creation of face plate
  (1) A phosphor and a black conductor were formed on a blue glass substrate, and the inner surface of the phosphor film was subjected to a smoothness treatment, and then an Al metal back was formed.
  (2) A frit glass for fixing the outer frame was formed at a desired position. Through the above-described steps, a phosphor in which the three primary color phosphors are arranged in stripes, a sealing material for the outer frame, and the like were formed on the face plate.
[0040]
・ Creation of glass envelope by local heating of sealed part
  A glass envelope was prepared using the above-mentioned “local heating and sealing method for glass envelope”. At this time, the rear plate is held on the hot plate on the adjustment stage of X, Y, and θ, and the rear plate and the face plate are heated to below the sealing temperature while aligning the face plate. Separately, the sealing portion is heated to the sealing temperature by a local heater.
[0041]
  Although the sealing temperature is determined by the material of the frit glass, in this embodiment, the sealing temperature is 410 ° C. and is held for 10 minutes. At this time, the assist heating was set to 300 ° C. In this way, the glass envelope as the image forming unit of the image display device is sealed.
[0042]
・ About making electron-emitting devices
  (1) As described above, in the sealed glass envelope, the exhaust pipe (not shown) of the face plate is connected to a vacuum exhaust device (not shown), and the inside of the glass envelope is evacuated. Exhausted.
  (2) When the pressure in the glass envelope became 0.1 Pa or less, a voltage was applied to the electron-emitting device through the container outer terminals Dox1 to Doxm and Doy1 to Doyn, and a forming process was performed on the conductive thin film.
  (3) Subsequently, the pressure in the glass envelope is 1 × 10^-3When the pressure is lower than Pa, 1 Pa is introduced as an activation gas into the glass envelope through the exhaust pipe, and a voltage is applied to the element through the container outer terminals Dox1 to Doxm and the terminals Doy1 to Doyn, and the electron emitting element The activation treatment was performed.
[0043]
・ About sealing of degassing process in airtight container
  (1) After exhausting the activated gas sufficiently, baking degassing of the glass envelope is performed. The heating temperature was 300 ° C. and the time was 10 hours.
  (2) After completion of the degassing step, a part of the exhaust pipe is heated and melted to perform sealing (chip off). Thus, the image display device was completed.
[0044]
【Example】
  Specific examples are shown below.Reference examplesThe present invention will be described in detail with reference to the following, but the present invention is not limited to these examples, and each element can be replaced or modified within the scope of achieving the object of the present invention. Of course.
[0045]
  [referenceExample 1]
  BookreferenceIn the example, as temperature compensation means, the shape of the corners of the face plate and the rear plate is specified to compensate for the temperature drop at the corners of the sealed portion. This will be described with reference to FIG. That is, in the image forming apparatus of this embodiment, as described above, a face plate, a rear plate, an outer frame, frit glass, and a heater for local heating were prepared. The face plate and the rear plate have rounded corners in advance. The curvature radius is, for example, R = 5 mm. A frit glass having a sealing temperature of 410 ° C. was used.
[0046]
  A frit glass is applied to the adhesive surface of the face plate and the outer surface of the glass frame that are formed with a phosphor and a metal back, and are fired at 410 ° C. for 10 minutes. The face plate and the glass outer frame were bonded to each other.
[0047]
  Next, the glass outer frame integrated with the face plate is fixed to the rear plate. Here, as shown in FIG. 1, reference numeral 2 is a face plate, 1 is a rear plate, and 3 is a glass outer frame. 4 is a frit glass, 6 and 7 are hot plate heaters for auxiliary heating, and 5 is a heater for local heating.
[0048]
  The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and the temperature at which the frit glass 4 is melted at the sealing portion by the heater 5 for local heatingreferenceIn this example, it is heated to 410 ° C.) and this state is maintained for 10 minutes. Thereafter, the panel is slowly cooled down to room temperature. Throughout this process, the temperature in the image area of the rear plate is kept at 305 ° C. or lower.
[0049]
  Incidentally, in the case where the sealing portion is heated uniformly using the conventional face plate and rear plate having corners, the heat escape is large at the outer corners of the outer frame, and the temperature is partially reduced. Further, the heat escape becomes smaller at the inner corner of the outer frame, and conversely, the temperature partially increases, and the temperature difference becomes larger near the outer frame corner. Therefore, the thermal stress at this portion increases, and the glass member may break during heating or cooling.
[0050]
  BookreferenceIn the case of the example, the corners of the face plate 2 and the rear plate 1 were rounded to have a predetermined curvature, so that heat escape was reduced. BookreferenceIn the example, the corners of the face plate 2 and the rear plate 1 were rounded to a radius of curvature R = 5 mm. By using the face plate 2 and the rear plate 1 having such a shape to uniformly heat the sealing portion, the range of temperature distribution variation in the sealing portion can be suppressed to ± 10 ° C. or less. The tensile stress due to heat in the vicinity of the sealed portion was reduced to 10 MPa or less. As a result, cracking during heating and cooling was eliminated, and the product yield was improved.
[0051]
  [referenceExample 2]
  BookreferenceIn the example, the temperature distribution at the corner of the sealed portion is compensated by appropriately setting the shape of the corner of the glass outer frame. That is, bookreferenceIn the example embodiment, a face plate, a rear plate, an outer frame, and a frit glass were prepared in the same manner as described above. The corner of the outer frame is rounded in advance. In particular, the bookreferenceIn the example, the radius of curvature is set to R = 3.8 mm, which is the same as the width of the outer frame. A frit glass having a sealing temperature of 410 ° C. was used.
[0052]
  A phosphor and a metal back are formed, frit glass is applied to the adhesive surface of the conductive face plate and the adhesive surface of the glass outer frame, and baked at 410 ° C. for 10 minutes. The plate and the glass outer frame were bonded.
[0053]
  Next, a procedure for fixing the glass outer frame integrated with the face plate to the rear plate will be described. In FIG. 2, reference numeral 2 is a face plate, 1 is a rear plate, 3 is a glass outer frame, 4 is a frit glass, 6 and 7 are hot plate heaters for auxiliary heating, and 5 is a heater for local heating.
[0054]
  The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and the temperature at which the frit glass 4 is melted at the sealing portion by the heater 5 for local heatingreferenceIn the example, it is held at 410 ° C. for 10 minutes. Thereafter, the panel is slowly cooled down to room temperature. Throughout this process, the temperature in the image area of the rear plate is kept at 305 ° C. or lower.
[0055]
  When the sealing portion is uniformly heated using the outer frame having the corners as in the prior art, the heat escape is large at the outer corners of the outer frame, and the temperature partially decreases. On the other hand, the heat escape decreased at the inner corner of the outer frame, and conversely, the temperature partially increased, and the temperature difference increased near the corner of the outer frame. Therefore, the thermal stress in this portion is increased, and the glass member may be broken during heating or cooling.
[0056]
  But bookreferenceIn the case of the example, since the corner portion of the outer frame 3 is rounded to have a predetermined curvature, heat escape is reduced at the outer corner portion of the outer frame, while heat escape is reduced at the inner corner. Increased, the temperature difference became smaller. By using the outer frame of such a shape and heating the sealing portion uniformly, the variation range of the temperature distribution in the sealing portion can be suppressed to ± 10 ° C. or less. As a result, the sealing portion The tensile stress due to heat in the vicinity was reduced to 10 MPa or less. As a result, cracking during heating and cooling was eliminated, and yield was improved.
[0057]
  [Example1]
  In this embodiment, the temperature distribution at the corner of the sealing portion is compensated by adjusting the electric resistance distribution of the heater. That is, in this example, as described above, a face plate, a rear plate, an outer frame, a frit glass, and a heater for local heating were prepared. As for the heater for local heating, the width | variety of the heater was previously made small in the corner | angular part, as shown in FIG. In particular, in the present embodiment, the heater width near the corner is set to about ½ of the heater width at the straight portion. A frit glass having a sealing temperature of 410 ° C. was used.
[0058]
  A frit glass 8 is applied to the adhesion surface of the face plate 2 and the adhesion surface of the glass outer frame 3 formed with a phosphor and a metal back, and fired at 410 ° C. for 10 minutes. Above face plate2And the above glass outer frame3Were bonded to each other.
[0059]
  Next, a procedure for fixing the glass outer frame integrated with the face plate to the rear plate is shown. In FIG. 3, reference numeral 2 is a face plate, 1 is a rear plate, 3 is a glass outer frame, 4 is a frit glass, 6 and 7 are hot plate heaters for auxiliary heating, and 5 is a heater for local heating.
[0060]
  The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and further, the heated portion 5 is heated to a temperature at which the frit glass 4 is melted by the local heating heater 5 (410 ° C. in this embodiment). Hold for a minute. Thereafter, the panel is slowly cooled down to room temperature. Throughout this process, the temperature in the image area of the rear plate is kept at 305 ° C. or lower.
[0061]
  Incidentally, when the sealing portion was heated with a conventional heater having a uniform width, the heat escape was large at the outer corner of the outer frame, and the temperature partially decreased. On the other hand, the heat escape is reduced at the inner corner of the outer frame, and conversely, the temperature is partially increased, and the temperature difference is increased near the outer frame angle. During the cooling, the glass member may break.
[0062]
  In the case of the present Example, the temperature fall in a corner part reduced by making resistance of the heater for local heating high in the corner part of a sealing part. By heating the sealing portion using such a heater, the variation range of the temperature distribution in the sealing portion is suppressed to ± 10 ° C. or less. The stress was reduced to 10 MPa or less. As a result, cracking during heating and cooling was eliminated, and yield was improved.
[0063]
  [Example2]
  In this embodiment, as a temperature compensation means, a temperature drop at the corner of the sealed portion is compensated by the radiant heat of the lamp from outside the glass envelope. The present embodiment will be described with reference to FIG. ImplementationExampleThen, as described above, a face plate, a rear plate, an outer frame, a frit glass, and a heater for local heating were prepared. A frit glass having a sealing temperature of 410 ° C. was used.
[0064]
  A frit glass 8 is applied to the adhesive surface of the face plate 2 and the adhesive surface of the glass outer frame 3 formed with a phosphor and a metal back, and fired at a temperature = 410 ° C. for 10 minutes. The face plate2And the above glass outer frame3And glued together.
[0065]
  Next, a procedure for fixing the glass outer frame 3 integrated with the face plate 2 to the rear plate 1 will be described. In FIG. 4, 2 is a face plate, 1 is a rear plate, 3 is a glass outer frame, 4 is a frit glass, 6 and 7 are hot plate heaters for auxiliary heating, 5 is a heater for local heating,9Is an infrared lamp for temperature compensation at the sealing portion angle.
[0066]
  The entire glass envelope is heated to 300 ° C. by hot plate heaters 6 and 7, and further, the temperature at which the frit glass 4 is melted by the heater 5 for local heating is melted to 410 ° C. for 10 minutes in this embodiment. Hold. At this time, an infrared lamp provided outside the glass envelope was irradiated to the corner portion of the sealing portion. Thereafter, the panel is slowly cooled down to room temperature. Throughout this process, the temperature in the image area of the rear plate is kept at 305 ° C. or lower.
[0067]
  When the sealing portion was heated uniformly, the heat escape was large at the outer corners of the outer frame, and the temperature partially decreased. On the other hand, the heat escape is reduced at the inner corner of the outer frame, and conversely, the temperature is partially increased, and the temperature difference is increased near the corner of the outer frame. The glass member sometimes broke during or during cooling.
[0068]
  In the case of this example, by irradiating the corner portion of the sealed portion with an infrared lamp, the temperature drop at the corner portion of the sealed portion was reduced, and the thermal stress could be reduced. The variation range of the temperature distribution in the sealed portion was suppressed to ± 10 ° C. or less, and as a result, the tensile stress due to heat near the sealed portion was reduced to 10 MPa or less. As a result, cracking during heating and cooling was eliminated, and yield was improved. This allows for heating and coolingWalletThe yield has been improved.
[0069]
【The invention's effect】
  As explained above, the local heating of the present invention was used.Glass envelopeAccording to the manufacturing method, an effect of reducing power consumption for heating was obtained as compared with the sealing step of heating the entire glass envelope to the sealing temperature. Further, since the temperature for heating the entire envelope can be lowered, the time required for the sealing process can be shortened.
[0070]
  The glass envelope of the present inventionofAccording to the manufacturing method, since the temperature of the sealed part is kept uniform, the thermal stress near the corner of the outer frame where the thermal stress is greatest can be reduced, and the panel can be cracked during sealing and cooling The yield was improved and the yield was improved.
[Brief description of the drawings]
FIG. 1 shows a glass envelope according to the present invention.ofManufacturing methodreference2 is a schematic diagram showing Example 1. FIG.
FIG. 2 is a glass envelope of the present invention.ofManufacturing methodreference6 is a schematic diagram showing Example 2. FIG.
FIG. 3 is a glass envelope of the present invention.ofExamples of manufacturing methods1It is a schematic diagram which shows.
FIG. 4 is a glass envelope of the present invention.Of manufacturing methodExample2It is a schematic diagram which shows.
FIG. 5 is a schematic diagram showing an example of an electron source having a simple matrix arrangement to which the present invention can be applied.
FIG. 6 is a schematic view showing an example of a surface conduction electron-emitting device to which the present invention can be applied.
[Explanation of symbols]
  1 Rear plate
  2 Face plate
  3 outer frame
  4 Frit glass
  5 Local heater (second heating means)
  6 Hot plate (first heating means)
  7 Hot plate (first heating means)
  8 Frit glass
  9 Infrared lamp (third heating means)
  51 Glass substrate
  52 Surface conduction electron-emitting devices
  53 Row direction wiring
  54 Column direction wiring
  55 Rear plate
  56 Glass outer frame
  57 Face plate
  58 phosphor
  59 Metal Back
  61 substrates
  62 Device electrode
  63 Device electrode
  64 Conductive thin film
  65 Electron emitter

Claims (5)

In the method of manufacturing a glass envelope, wherein a plurality of glass members are sealed and configured so that a sealing portion is square using a sealing material,
While heating the whole glass envelope to a temperature lower than the sealing temperature of the sealing material, the sealing material is disposed along the sealing material, and the temperature at the corner near the corner of the sealing portion. Glass heated by compensating for the temperature distribution between the corner portion of the sealed portion and the other portion by energizing the wiring set to have a higher electric resistance so as to be higher than the other portion A method for manufacturing an envelope. In the method of manufacturing a glass envelope, wherein a plurality of glass members are sealed and configured so that a sealing portion is square using a sealing material,
The whole glass envelope is heated to a temperature lower than the sealing temperature of the sealing material, the sealing material is heated to a sealing temperature, and sealing is performed by lamp irradiation from the outside of the glass envelope. A method for manufacturing a glass envelope, comprising compensating for a temperature distribution between a corner portion of a portion and another portion .   3. The method of manufacturing a glass envelope according to claim 1, wherein the variation in temperature distribution of the sealed portion is compensated within a range of ± 10 ° C. 3.   The method for manufacturing a glass envelope according to any one of claims 1 to 3, wherein the sealing material is frit glass. The method for manufacturing a glass envelope according to claim 2, wherein the heating of the sealing material is performed by energizing a wiring arranged along the sealing material.

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