ZA876229B - An arrangement and a process for the positioning and synchronization of a writing laser beam - Google Patents
An arrangement and a process for the positioning and synchronization of a writing laser beamInfo
- Publication number
- ZA876229B ZA876229B ZA876229A ZA876229A ZA876229B ZA 876229 B ZA876229 B ZA 876229B ZA 876229 A ZA876229 A ZA 876229A ZA 876229 A ZA876229 A ZA 876229A ZA 876229 B ZA876229 B ZA 876229B
- Authority
- ZA
- South Africa
- Prior art keywords
- laser beam
- semiconductor chip
- synchronization
- mark
- writing laser
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 abstract 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/42—Bombardment with radiation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/01—Details
- G06K7/015—Aligning or centering of the sensing device with respect to the record carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Artificial Intelligence (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Laser Beam Printer (AREA)
- Laser Beam Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH3781/86A CH670592A5 (xx) | 1986-09-22 | 1986-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA876229B true ZA876229B (en) | 1988-03-01 |
Family
ID=4263345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA876229A ZA876229B (en) | 1986-09-22 | 1987-08-21 | An arrangement and a process for the positioning and synchronization of a writing laser beam |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US4809014A (xx) |
| EP (1) | EP0262088B1 (xx) |
| JP (1) | JPS6394622A (xx) |
| KR (1) | KR880004559A (xx) |
| AT (1) | ATE64238T1 (xx) |
| CA (1) | CA1278392C (xx) |
| CH (1) | CH670592A5 (xx) |
| DE (1) | DE3770559D1 (xx) |
| IL (1) | IL83969A (xx) |
| ZA (1) | ZA876229B (xx) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4927226A (en) * | 1989-03-27 | 1990-05-22 | General Electric Company | Multiplexer for high power CW lasers |
| JP2004200221A (ja) * | 2002-12-16 | 2004-07-15 | Toray Eng Co Ltd | レーザマーキング方法及び装置 |
| US20050087520A1 (en) * | 2003-10-28 | 2005-04-28 | Lixiao Wang | Method and apparatus for selective ablation of coatings from medical devices |
| US7315038B2 (en) * | 2005-08-26 | 2008-01-01 | Electro Scientific Industries, Inc. | Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target |
| US7297972B2 (en) * | 2005-08-26 | 2007-11-20 | Electro Scientific Industries, Inc. | Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target |
| CA2788591A1 (en) * | 2010-02-04 | 2011-08-11 | Echelon Laser Systems, Lp | Laser etching system and method |
| CN110945517A (zh) * | 2017-07-27 | 2020-03-31 | 罗伯特·博世有限公司 | 用于实现探测功能的设备以及用于运行这种设备的方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4134066A (en) * | 1977-03-24 | 1979-01-09 | International Business Machines Corporation | Wafer indexing system using a grid pattern and coding and orientation marks in each grid cell |
| DE3123031A1 (de) * | 1981-06-10 | 1983-01-05 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur kennzeichnung von halbleiterchips und kennzeichenbarer halbleiterchip |
| US4695698A (en) * | 1984-07-10 | 1987-09-22 | Larassay Holding Ag | Method of, and apparatus for, generating a predetermined pattern using laser radiation |
| DE3427611A1 (de) * | 1984-07-26 | 1988-06-09 | Bille Josef | Laserstrahl-lithograph |
-
1986
- 1986-09-22 CH CH3781/86A patent/CH670592A5/de not_active IP Right Cessation
-
1987
- 1987-08-21 ZA ZA876229A patent/ZA876229B/xx unknown
- 1987-09-01 EP EP87810500A patent/EP0262088B1/de not_active Expired - Lifetime
- 1987-09-01 AT AT87810500T patent/ATE64238T1/de not_active IP Right Cessation
- 1987-09-01 DE DE8787810500T patent/DE3770559D1/de not_active Expired - Fee Related
- 1987-09-10 KR KR870010044A patent/KR880004559A/ko not_active Application Discontinuation
- 1987-09-21 IL IL83969A patent/IL83969A/xx not_active IP Right Cessation
- 1987-09-21 CA CA000547447A patent/CA1278392C/en not_active Expired - Lifetime
- 1987-09-22 US US07/108,444 patent/US4809014A/en not_active Expired - Fee Related
- 1987-09-22 JP JP62236373A patent/JPS6394622A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US4809014A (en) | 1989-02-28 |
| IL83969A0 (en) | 1988-02-29 |
| KR880004559A (ko) | 1988-06-04 |
| DE3770559D1 (de) | 1991-07-11 |
| JPS6394622A (ja) | 1988-04-25 |
| IL83969A (en) | 1991-06-30 |
| CA1278392C (en) | 1990-12-27 |
| EP0262088B1 (de) | 1991-06-05 |
| CH670592A5 (xx) | 1989-06-30 |
| EP0262088A1 (de) | 1988-03-30 |
| ATE64238T1 (de) | 1991-06-15 |
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