ZA839419B - Upstream cathode assembly - Google Patents

Upstream cathode assembly

Info

Publication number
ZA839419B
ZA839419B ZA839419A ZA839419A ZA839419B ZA 839419 B ZA839419 B ZA 839419B ZA 839419 A ZA839419 A ZA 839419A ZA 839419 A ZA839419 A ZA 839419A ZA 839419 B ZA839419 B ZA 839419B
Authority
ZA
South Africa
Prior art keywords
cathode assembly
upstream cathode
upstream
assembly
cathode
Prior art date
Application number
ZA839419A
Other languages
English (en)
Inventor
Nath Prem
Izu Masatsugu
Original Assignee
Energy Conversion Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Energy Conversion Devices Inc filed Critical Energy Conversion Devices Inc
Publication of ZA839419B publication Critical patent/ZA839419B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32018Glow discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Photovoltaic Devices (AREA)
  • Chemical Vapour Deposition (AREA)
ZA839419A 1982-12-22 1983-12-20 Upstream cathode assembly ZA839419B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/452,224 US4513684A (en) 1982-12-22 1982-12-22 Upstream cathode assembly

Publications (1)

Publication Number Publication Date
ZA839419B true ZA839419B (en) 1984-08-29

Family

ID=23795607

Family Applications (2)

Application Number Title Priority Date Filing Date
ZA839420A ZA839420B (en) 1982-12-22 1983-12-20 Upstream cathode assembly
ZA839419A ZA839419B (en) 1982-12-22 1983-12-20 Upstream cathode assembly

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ZA839420A ZA839420B (en) 1982-12-22 1983-12-20 Upstream cathode assembly

Country Status (10)

Country Link
US (1) US4513684A (ja)
EP (1) EP0118644A1 (ja)
JP (1) JPS59155123A (ja)
KR (1) KR920006893B1 (ja)
AU (1) AU564627B2 (ja)
BR (1) BR8307044A (ja)
CA (1) CA1214253A (ja)
ES (1) ES528254A0 (ja)
MX (1) MX154312A (ja)
ZA (2) ZA839420B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4483883A (en) * 1982-12-22 1984-11-20 Energy Conversion Devices, Inc. Upstream cathode assembly
DE3427057A1 (de) * 1984-07-23 1986-01-23 Standard Elektrik Lorenz Ag, 7000 Stuttgart Anlage zum herstellen von halbleiter-schichtstrukturen durch epitaktisches wachstum
JPH0722127B2 (ja) * 1985-02-20 1995-03-08 株式会社日立製作所 反応・処理装置内の清浄化および反応・処理用気相物質の純化方法、および反応・処理装置
US4601260A (en) * 1985-04-01 1986-07-22 Sovonics Solar Systems Vertical semiconductor processor
DE3706482A1 (de) * 1986-02-28 1987-09-03 Politechnika Warszawska Verfahren und vorrichtungen zur herstellung von diffusionsoberflaechenschichten auf metallenen werkstuecken durch glimmentladung
DE3752208T2 (de) * 1986-11-10 1998-12-24 Semiconductor Energy Laboratory Co., Ltd., Atsugi, Kanagawa Durch Mikrowellen gesteigertes CVD-Verfahren und -Gerät
US6677001B1 (en) * 1986-11-10 2004-01-13 Semiconductor Energy Laboratory Co., Ltd. Microwave enhanced CVD method and apparatus
JPH0672306B2 (ja) 1987-04-27 1994-09-14 株式会社半導体エネルギー研究所 プラズマ処理装置およびプラズマ処理方法
US4870030A (en) * 1987-09-24 1989-09-26 Research Triangle Institute, Inc. Remote plasma enhanced CVD method for growing an epitaxial semiconductor layer
KR930011413B1 (ko) * 1990-09-25 1993-12-06 가부시키가이샤 한도오따이 에네루기 겐큐쇼 펄스형 전자파를 사용한 플라즈마 cvd 법
GB2264957B (en) * 1992-03-12 1995-09-20 Bell Communications Res Deflected flow in a chemical vapor deposition cell
DE4324320B4 (de) * 1992-07-24 2006-08-31 Fuji Electric Co., Ltd., Kawasaki Verfahren und Vorrichtung zur Herstellung einer als dünne Schicht ausgebildeten fotovoltaischen Umwandlungsvorrichtung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE7700229L (sv) * 1976-01-22 1977-07-23 Western Electric Co Forfarande for beleggning av substrat genom utfellning fran ett plasma
US4301765A (en) * 1979-01-10 1981-11-24 Siemens Aktiengesellschaft Apparatus for generating layers on a carrier foil
US4282267A (en) * 1979-09-20 1981-08-04 Western Electric Co., Inc. Methods and apparatus for generating plasmas
US4262631A (en) * 1979-10-01 1981-04-21 Kubacki Ronald M Thin film deposition apparatus using an RF glow discharge
JPS5934421B2 (ja) * 1979-11-29 1984-08-22 住友電気工業株式会社 薄膜製造法
CA1159012A (en) * 1980-05-02 1983-12-20 Seitaro Matsuo Plasma deposition apparatus
US4400409A (en) * 1980-05-19 1983-08-23 Energy Conversion Devices, Inc. Method of making p-doped silicon films
JPS56165371A (en) * 1980-05-26 1981-12-18 Shunpei Yamazaki Semiconductor device
JPS5756923A (en) * 1980-09-23 1982-04-05 Mitsubishi Electric Corp Manufacture of thin film
US4379181A (en) * 1981-03-16 1983-04-05 Energy Conversion Devices, Inc. Method for plasma deposition of amorphous materials
JPS5833829A (ja) * 1981-08-24 1983-02-28 Toshiba Corp 薄膜形成装置
US4462333A (en) * 1982-10-27 1984-07-31 Energy Conversion Devices, Inc. Process gas introduction, confinement and evacuation system for glow discharge deposition apparatus

Also Published As

Publication number Publication date
AU2245383A (en) 1984-06-28
MX154312A (es) 1987-06-30
BR8307044A (pt) 1984-07-31
ES8501168A1 (es) 1984-11-01
CA1214253A (en) 1986-11-18
ZA839420B (en) 1984-08-29
AU564627B2 (en) 1987-08-20
JPS59155123A (ja) 1984-09-04
KR840007319A (ko) 1984-12-06
EP0118644A1 (en) 1984-09-19
JPH0576172B2 (ja) 1993-10-22
KR920006893B1 (ko) 1992-08-21
US4513684A (en) 1985-04-30
ES528254A0 (es) 1984-11-01

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