ZA813492B - Laminating process - Google Patents

Laminating process

Info

Publication number
ZA813492B
ZA813492B ZA00813492A ZA813492A ZA813492B ZA 813492 B ZA813492 B ZA 813492B ZA 00813492 A ZA00813492 A ZA 00813492A ZA 813492 A ZA813492 A ZA 813492A ZA 813492 B ZA813492 B ZA 813492B
Authority
ZA
South Africa
Prior art keywords
substrate
photosensitive layer
rendering
interface
liquid
Prior art date
Application number
ZA00813492A
Other languages
English (en)
Inventor
Cohen Abraham Bernard
Abraham Bernard Cohen
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22548057&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ZA813492(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Du Pont filed Critical Du Pont
Publication of ZA813492B publication Critical patent/ZA813492B/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/162—Cleaning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
ZA00813492A 1980-05-27 1981-05-25 Laminating process ZA813492B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15363680A 1980-05-27 1980-05-27

Publications (1)

Publication Number Publication Date
ZA813492B true ZA813492B (en) 1983-01-26

Family

ID=22548057

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA00813492A ZA813492B (en) 1980-05-27 1981-05-25 Laminating process

Country Status (11)

Country Link
EP (1) EP0040843B1 (xx)
JP (1) JPS5721890A (xx)
AT (1) ATE7337T1 (xx)
BR (1) BR8103184A (xx)
CA (1) CA1168139A (xx)
DD (1) DD159227A5 (xx)
DE (1) DE3163367D1 (xx)
HU (1) HU181341B (xx)
IE (1) IE51774B1 (xx)
PL (1) PL231343A1 (xx)
ZA (1) ZA813492B (xx)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1263125A (en) * 1984-06-01 1989-11-21 Hans-Guenter E. Kuehnert Apparatus for the automatic feeding of a laminating station
DE3420409A1 (de) * 1984-06-01 1985-12-05 ELTI Apparatebau und Elektronik GmbH, 6106 Erzhausen Laminierstation
DE3510852A1 (de) * 1985-03-26 1986-10-09 ELTI Apparatebau und Elektronik GmbH, 6106 Erzhausen Greifereinrichtung in einer laminiervorrichtung
JPH0721627B2 (ja) * 1985-07-05 1995-03-08 日立化成工業株式会社 光重合性組成物
DE3538117A1 (de) * 1985-10-26 1987-04-30 Hoechst Ag Trennvorrichtung fuer platten
US4744847A (en) * 1986-01-29 1988-05-17 E. I. Du Pont De Nemours And Company Film trimming of laminated photosensitive layer
US4698294A (en) * 1986-09-12 1987-10-06 E. I. Du Pont De Nemours And Company Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer
EP0259853A3 (en) * 1986-09-12 1989-11-08 E.I. Du Pont De Nemours And Company Lamination of photopolymerizable film onto a substrate employing an intermediate photosensitive layer
US4755446A (en) * 1987-01-12 1988-07-05 E. I. Du Pont De Nemours And Company Photosensitive compositions containing microcapsules concentrated in surface layer
DE3736509A1 (de) * 1987-10-28 1989-05-11 Hoechst Ag Vorrichtung zum laminieren und schneiden von fotoresistbahnen
US4971894A (en) * 1989-02-13 1990-11-20 International Business Machines Corporation Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer
DE69316619T2 (de) * 1993-09-24 1998-08-20 Centroplast Sud S R L Maschine zum staubfreien Überziehen von Papier oder Karton mit einem transparenten Film mit Hilfe von lösungsmittelfreien Klebstoffen
TWI262360B (en) 2001-03-29 2006-09-21 Hitachi Chemical Co Ltd Light sensitive film for forming circuit and method for manufacturing printed circuit board
CN101430507A (zh) * 2007-08-27 2009-05-13 E.I.内穆尔杜邦公司 基片上的可光聚合干膜的湿层叠以及与湿层叠有关的组合物
CN102079158B (zh) * 2010-11-11 2013-06-19 东莞红板多层线路板有限公司 线路板贴膜方法
JP5499013B2 (ja) * 2011-11-25 2014-05-21 株式会社フジクラ ラミネート装置
JP6397245B2 (ja) * 2014-07-23 2018-09-26 旭化成株式会社 レジストパターンの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629036A (en) * 1969-02-14 1971-12-21 Shipley Co The method coating of photoresist on circuit boards
JPS5681816A (en) * 1979-11-05 1981-07-04 Xerox Corp Method for minimizing damage of refractive index of optical material
JPS6025769B2 (ja) * 1979-12-06 1985-06-20 セイコーエプソン株式会社 液晶表示装置

Also Published As

Publication number Publication date
DD159227A5 (de) 1983-02-23
IE51774B1 (en) 1987-04-01
EP0040843B1 (en) 1984-05-02
HU181341B (en) 1983-07-28
CA1168139A (en) 1984-05-29
JPS5721890A (en) 1982-02-04
IE811162L (en) 1981-11-27
BR8103184A (pt) 1982-02-09
JPH0143942B2 (xx) 1989-09-25
PL231343A1 (xx) 1982-02-01
EP0040843A1 (en) 1981-12-02
ATE7337T1 (de) 1984-05-15
DE3163367D1 (en) 1984-06-07

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