ZA801244B - Workpiece surface treatment - Google Patents

Workpiece surface treatment

Info

Publication number
ZA801244B
ZA801244B ZA00801244A ZA801244A ZA801244B ZA 801244 B ZA801244 B ZA 801244B ZA 00801244 A ZA00801244 A ZA 00801244A ZA 801244 A ZA801244 A ZA 801244A ZA 801244 B ZA801244 B ZA 801244B
Authority
ZA
South Africa
Prior art keywords
surface treatment
workpiece surface
workpiece
treatment
Prior art date
Application number
ZA00801244A
Other languages
English (en)
Inventor
R Melcher
L Romankiw
Gutfeld R Von
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21892301&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ZA801244(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ibm filed Critical Ibm
Publication of ZA801244B publication Critical patent/ZA801244B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electrochemistry (AREA)
  • Laser Beam Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Weting (AREA)
  • Electron Beam Exposure (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
ZA00801244A 1979-05-08 1980-03-04 Workpiece surface treatment ZA801244B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/037,074 US4283259A (en) 1979-05-08 1979-05-08 Method for maskless chemical and electrochemical machining

Publications (1)

Publication Number Publication Date
ZA801244B true ZA801244B (en) 1980-12-31

Family

ID=21892301

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA00801244A ZA801244B (en) 1979-05-08 1980-03-04 Workpiece surface treatment

Country Status (8)

Country Link
US (1) US4283259A (es)
EP (1) EP0019064B1 (es)
JP (1) JPS55148771A (es)
BR (1) BR8002526A (es)
CA (1) CA1171381A (es)
DE (1) DE3060691D1 (es)
ES (1) ES8103206A1 (es)
ZA (1) ZA801244B (es)

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JPS577938A (en) * 1980-06-18 1982-01-16 Fujitsu Ltd Method for forming thin film pattern
US4389291A (en) * 1981-06-19 1983-06-21 Bell Telephone Laboratories, Incorporated Photoelectrochemical processing of InP-type devices
EP0119188B1 (en) * 1982-08-23 1986-09-17 Gravure Research Institute, Inc. Method and apparatus for forming gravure cells in a gravure cylinder
US4415414A (en) * 1982-09-10 1983-11-15 Bell Telephone Laboratories, Incorporated Etching of optical surfaces
DE3477590D1 (en) * 1983-05-30 1989-05-11 Inoue Japax Res Method of and apparatus for machining ceramic materials
US4497692A (en) * 1983-06-13 1985-02-05 International Business Machines Corporation Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method
US4608138A (en) * 1984-02-16 1986-08-26 Mitsubishi Denki Kabushiki Kaisha Electrolytic method and apparatus
JPS617639A (ja) * 1984-06-22 1986-01-14 Toshiba Corp 半導体薄膜の分解装置
DE3608604A1 (de) * 1986-03-14 1987-09-17 Siemens Ag Strukturierbares fotoelektrochemisches abtragen
US4818834A (en) * 1988-03-21 1989-04-04 Raycon Corporation Process for drilling chamfered holes
US4904340A (en) * 1988-10-31 1990-02-27 Microelectronics And Computer Technology Corporation Laser-assisted liquid-phase etching of copper conductors
US5149404A (en) * 1990-12-14 1992-09-22 At&T Bell Laboratories Fine line scribing of conductive material
JPH05293332A (ja) * 1992-04-21 1993-11-09 Showa Shell Sekiyu Kk 揮発性有機化合物含有ガスの除去方法
DE4328628A1 (de) * 1993-08-20 1994-01-20 Ulrich Prof Dr Mohr Verfahren zur Herstellung einer geometrischen strukturierten Oxidschicht auf einem Siliziumkörper
US5509556A (en) * 1994-11-17 1996-04-23 International Business Machines Corporation Process for forming apertures in a metallic sheet
DE19653097A1 (de) * 1996-12-20 1998-07-02 Forschungszentrum Juelich Gmbh Schicht mit porösem Schichtbereich, eine solche Schicht enthaltendes Interferenzfilter sowie Verfahren zu ihrer Herstellung
EP1060299A1 (en) * 1998-03-05 2000-12-20 Obducat AB Method of etching
US7106493B2 (en) * 1999-07-27 2006-09-12 Sanford James E MEMS-based valve device
US6248509B1 (en) 1999-07-27 2001-06-19 James E. Sanford Maskless photoresist exposure system using mems devices
US7329361B2 (en) * 2003-10-29 2008-02-12 International Business Machines Corporation Method and apparatus for fabricating or altering microstructures using local chemical alterations
US8529738B2 (en) * 2005-02-08 2013-09-10 The Trustees Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
US8496799B2 (en) * 2005-02-08 2013-07-30 The Trustees Of Columbia University In The City Of New York Systems and methods for in situ annealing of electro- and electroless platings during deposition
KR20080005947A (ko) * 2005-04-08 2008-01-15 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 도금조 및 에칭조를 모니터링하기 위한 시스템 및 방법
JP4608613B2 (ja) * 2005-04-22 2011-01-12 国立大学法人九州工業大学 レーザー照射微細加工方法
WO2007027907A2 (en) * 2005-09-02 2007-03-08 The Trustees Of Columbia University In The City Of New York A system and method for obtaining anisotropic etching of patterned substrates
JP5030512B2 (ja) * 2005-09-30 2012-09-19 日立ビアメカニクス株式会社 レーザ加工方法
US20070256937A1 (en) * 2006-05-04 2007-11-08 International Business Machines Corporation Apparatus and method for electrochemical processing of thin films on resistive substrates
US20100012506A1 (en) * 2006-07-13 2010-01-21 Jan Phuklin Prichystal Combined electrochemical and laser micromaching process for creating ultri-thin surfaces
CN100388997C (zh) * 2006-09-18 2008-05-21 南京航空航天大学 喷射液束电解-激光复合加工方法及其装置
WO2008070786A1 (en) * 2006-12-06 2008-06-12 The Trustees Of Columbia University In The City Of New York Microfluidic systems and methods for screening plating and etching bath compositions
WO2009124180A2 (en) * 2008-04-02 2009-10-08 The Trustees Of Columbia University In The City Of New York In situ plating and soldering of materials covered with a surface film
US8985050B2 (en) * 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating
US8444848B2 (en) * 2010-02-01 2013-05-21 Tokyo Electron Limited Electrochemical substrate slicing using electromagnetic wave excitation
CN101856753B (zh) * 2010-04-27 2012-08-15 江苏大学 激光空泡空化的光电化学三维加工方法及装置
US9452495B1 (en) * 2011-07-08 2016-09-27 Sixpoint Materials, Inc. Laser slicer of crystal ingots and a method of slicing gallium nitride ingots using a laser slicer
US9039887B2 (en) 2012-05-14 2015-05-26 United Technologies Corporation Component finishing method and assembly
US8764515B2 (en) 2012-05-14 2014-07-01 United Technologies Corporation Component machining method and assembly
CN102785404B (zh) * 2012-08-16 2015-04-08 东华大学 一种防明火绝热的多级复合织物、制备工艺及用途
JP6081218B2 (ja) * 2013-02-20 2017-02-15 新日鉄住金マテリアルズ株式会社 エッチング装置およびエッチング方法
DE102014017886A1 (de) * 2014-12-04 2016-06-09 Auto-Kabel Management Gmbh Verfahren zum Herstellen eines elektrischen Anschlussteils
CN109732199B (zh) * 2019-02-25 2020-11-20 江苏大学 一种半导体材料激光电化学背向协同微加工方法及装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1193335B (de) * 1954-08-25 1965-05-20 Siemens Ag Verfahren zum formgebenden und/oder trennenden Bearbeiten von fotoelektrisch wirksamen Halbleiterkristallen
GB847927A (en) * 1955-10-11 1960-09-14 Philco Corp A method and apparatus for the electrolytic treatment of semiconductive bodies
US3013955A (en) * 1959-04-29 1961-12-19 Fairchild Camera Instr Co Method of transistor manufacture
US3072547A (en) * 1960-07-11 1963-01-08 Ibm Pattern forming method and apparatus
US3265599A (en) * 1963-06-25 1966-08-09 Litton Systems Inc Formation of grain boundary photoorienter by electrolytic etching
US3345275A (en) * 1964-04-28 1967-10-03 Westinghouse Electric Corp Electrolyte and diffusion process
US3345274A (en) * 1964-04-22 1967-10-03 Westinghouse Electric Corp Method of making oxide film patterns
US3529961A (en) * 1966-12-27 1970-09-22 Gen Electric Formation of thin films of gold,nickel or copper by photolytic deposition
US4161436A (en) * 1967-03-06 1979-07-17 Gordon Gould Method of energizing a material
US3935117A (en) * 1970-08-25 1976-01-27 Fuji Photo Film Co., Ltd. Photosensitive etching composition
US3706645A (en) * 1971-09-30 1972-12-19 Us Army Process including photolytic enhancement for anodic dissolution of a gallium arsenide wafer
US3810829A (en) * 1972-06-28 1974-05-14 Nasa Scanning nozzle plating system
LU71852A1 (es) * 1975-02-14 1977-01-05
US4069121A (en) * 1975-06-27 1978-01-17 Thomson-Csf Method for producing microscopic passages in a semiconductor body for electron-multiplication applications
JPS5375472A (en) * 1976-12-17 1978-07-04 Hitachi Ltd Method of producing thin film resistive ic

Also Published As

Publication number Publication date
JPS5641702B2 (es) 1981-09-30
ES491228A0 (es) 1981-02-16
ES8103206A1 (es) 1981-02-16
CA1171381A (en) 1984-07-24
US4283259A (en) 1981-08-11
BR8002526A (pt) 1980-12-30
DE3060691D1 (en) 1982-09-16
EP0019064A1 (de) 1980-11-26
EP0019064B1 (de) 1982-07-28
JPS55148771A (en) 1980-11-19

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