ZA763010B - New polymeric substrates for electroless metal deposition - Google Patents

New polymeric substrates for electroless metal deposition

Info

Publication number
ZA763010B
ZA763010B ZA763010A ZA763010A ZA763010B ZA 763010 B ZA763010 B ZA 763010B ZA 763010 A ZA763010 A ZA 763010A ZA 763010 A ZA763010 A ZA 763010A ZA 763010 B ZA763010 B ZA 763010B
Authority
ZA
South Africa
Prior art keywords
metal deposition
polymeric substrates
electroless metal
new polymeric
new
Prior art date
Application number
ZA763010A
Other languages
English (en)
Inventor
E Leech
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of ZA763010B publication Critical patent/ZA763010B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L13/00—Compositions of rubbers containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
ZA763010A 1975-07-25 1976-05-20 New polymeric substrates for electroless metal deposition ZA763010B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59877075A 1975-07-25 1975-07-25

Publications (1)

Publication Number Publication Date
ZA763010B true ZA763010B (en) 1977-04-27

Family

ID=24396845

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA763010A ZA763010B (en) 1975-07-25 1976-05-20 New polymeric substrates for electroless metal deposition

Country Status (13)

Country Link
JP (1) JPS5953295B2 (ja)
AT (1) AT362008B (ja)
AU (1) AU503695B2 (ja)
CA (1) CA1077643A (ja)
CH (1) CH636631A5 (ja)
DE (1) DE2633094C3 (ja)
FR (1) FR2333024A1 (ja)
GB (1) GB1531826A (ja)
IL (1) IL50093A (ja)
IT (1) IT1066020B (ja)
NL (1) NL185935C (ja)
SE (1) SE7608413L (ja)
ZA (1) ZA763010B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809917B1 (de) * 1978-03-08 1979-07-26 Dynamit Nobel Ag Basismaterial zum Herstellen gedruckter Schaltungen nach Additivverfahren und Verfahren zum Herstellen desselben
DE2828288C2 (de) * 1978-06-28 1982-04-15 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zur Herstellung von Basismaterial für gedruckte Schaltungen
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
CA1318416C (en) * 1987-01-14 1993-05-25 Kollmorgen Corporation Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
JPH02117948A (ja) * 1988-08-30 1990-05-02 Japan Synthetic Rubber Co Ltd 変性エポキシ組成物
JP4722954B2 (ja) * 2008-03-17 2011-07-13 イビデン株式会社 プリント配線板用接着剤および、プリント配線板用接着剤層の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1790293B2 (de) * 1966-02-22 1973-12-13 Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) Verfahren zur Herstellung von ge druckten Schaltungen Ausscheidung aus 1665314
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen

Also Published As

Publication number Publication date
DE2633094A1 (de) 1977-01-27
GB1531826A (en) 1978-11-08
IT1066020B (it) 1985-03-04
NL7608242A (nl) 1977-01-27
DE2633094C3 (de) 1987-02-12
IL50093A (en) 1980-01-31
IL50093A0 (en) 1976-09-30
ATA545376A (de) 1980-09-15
SE7608413L (sv) 1977-01-26
CA1077643A (en) 1980-05-13
AT362008B (de) 1981-04-27
CH636631A5 (en) 1983-06-15
FR2333024B1 (ja) 1979-05-25
JPS5953295B2 (ja) 1984-12-24
JPS5215569A (en) 1977-02-05
DE2633094B2 (de) 1979-08-30
NL185935B (nl) 1990-03-16
NL185935C (nl) 1990-08-16
AU503695B2 (en) 1979-09-13
FR2333024A1 (fr) 1977-06-24
AU1525576A (en) 1978-01-05

Similar Documents

Publication Publication Date Title
ZA763606B (en) Process for coating metals
AU499660B2 (en) Treating for polymeric substrates prior to plating
GB1543443A (en) Two layer coating system for metallic substrates
ZA751534B (en) Process for coating metal substrates
AU505928B2 (en) Catalyst for electroless metal deposition
JPS52115785A (en) Process for coating substrate
JPS5289539A (en) Coated ferrous substrate
JPS524439A (en) Phosphating process for metal
JPS522846A (en) Phosphating process for metallic substrate
GB2000050B (en) Coated metal substrates
ZA763010B (en) New polymeric substrates for electroless metal deposition
ZA781667B (en) Process and device for the production of metal-complex compounds suitable for electroless metal deposition
GB1557779A (en) Phosphating process
ZA762314B (en) Electroless plating substrates
JPS5224143A (en) Deposited metal
JPS5217341A (en) Hifukukinzokuzai no seizohoho process for preparing coated metallic member
AU517472B2 (en) Precious metal sensitizing compositions for electroless metal deposition
GB1547873A (en) Process for coating metal surfaces
GB1553081A (en) Metal plating
AU500595B2 (en) Processes for coating metal pipes
JPS5216517A (en) Process for coating metal surface
JPS529645A (en) Process for selectively rusttproofing metallic substrate
JPS5359768A (en) Coating composition for chemical plating
JPS51139870A (en) Substrae for chemical plating
JPS5368631A (en) Znnal complex plating coated steel plate