ZA200804813B - Thick film semiconducting inks - Google Patents

Thick film semiconducting inks

Info

Publication number
ZA200804813B
ZA200804813B ZA2008/04813A ZA200804813A ZA200804813B ZA 200804813 B ZA200804813 B ZA 200804813B ZA 2008/04813 A ZA2008/04813 A ZA 2008/04813A ZA 200804813 A ZA200804813 A ZA 200804813A ZA 200804813 B ZA200804813 B ZA 200804813B
Authority
ZA
South Africa
Prior art keywords
thick film
semiconducting inks
film semiconducting
inks
thick
Prior art date
Application number
ZA2008/04813A
Other languages
English (en)
Inventor
Ekundare Ayodele Odo
Rudolf Scriba Manfred
thomas britton David
Original Assignee
Univ Cape Town
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Cape Town filed Critical Univ Cape Town
Publication of ZA200804813B publication Critical patent/ZA200804813B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/08—Printing inks based on natural resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D191/00—Coating compositions based on oils, fats or waxes; Coating compositions based on derivatives thereof
    • C09D191/005—Drying oils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D191/00—Coating compositions based on oils, fats or waxes; Coating compositions based on derivatives thereof
    • C09D191/02—Vulcanised oils, e.g. factice
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Thin Film Transistor (AREA)
  • Conductive Materials (AREA)
ZA2008/04813A 2005-12-22 2008-06-03 Thick film semiconducting inks ZA200804813B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ZA200510436 2005-12-22
PCT/IB2006/003666 WO2007072162A1 (en) 2005-12-22 2006-12-18 Thick film semiconducting inks

Publications (1)

Publication Number Publication Date
ZA200804813B true ZA200804813B (en) 2016-07-27

Family

ID=37907452

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA2008/04813A ZA200804813B (en) 2005-12-22 2008-06-03 Thick film semiconducting inks

Country Status (8)

Country Link
US (1) US9206324B2 (cg-RX-API-DMAC7.html)
EP (1) EP1971651B1 (cg-RX-API-DMAC7.html)
JP (1) JP5106414B2 (cg-RX-API-DMAC7.html)
KR (1) KR101407252B1 (cg-RX-API-DMAC7.html)
CN (1) CN101346441B (cg-RX-API-DMAC7.html)
ES (1) ES2609413T3 (cg-RX-API-DMAC7.html)
WO (1) WO2007072162A1 (cg-RX-API-DMAC7.html)
ZA (1) ZA200804813B (cg-RX-API-DMAC7.html)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7226966B2 (en) 2001-08-03 2007-06-05 Nanogram Corporation Structures incorporating polymer-inorganic particle blends
US20090075083A1 (en) 1997-07-21 2009-03-19 Nanogram Corporation Nanoparticle production and corresponding structures
US6599631B2 (en) 2001-01-26 2003-07-29 Nanogram Corporation Polymer-inorganic particle composites
US8568684B2 (en) 2000-10-17 2013-10-29 Nanogram Corporation Methods for synthesizing submicron doped silicon particles
CN103333526A (zh) 2007-01-03 2013-10-02 内诺格雷姆公司 基于硅/锗的纳米颗粒油墨、掺杂型颗粒、用于半导体应用的印刷和方法
JP5560640B2 (ja) * 2008-09-30 2014-07-30 大日本印刷株式会社 半導体基板の製造方法及びその方法により得られた半導体基板
US8895962B2 (en) * 2010-06-29 2014-11-25 Nanogram Corporation Silicon/germanium nanoparticle inks, laser pyrolysis reactors for the synthesis of nanoparticles and associated methods
CN103210703B (zh) 2010-09-13 2016-08-10 Pst传感器(私人)有限公司 装配和封装分立电子元件
CN103210290B (zh) 2010-09-13 2015-12-09 Pst传感器(私人)有限公司 印刷温度传感器
CN103262252B (zh) * 2010-11-23 2016-03-02 德拉鲁国际公司 二极管，其用途，及其制备方法
US20140179049A1 (en) * 2012-12-20 2014-06-26 Nanogram Corporation Silicon/germanium-based nanoparticle pastes with ultra low metal contamination
US9475695B2 (en) 2013-05-24 2016-10-25 Nanogram Corporation Printable inks with silicon/germanium based nanoparticles with high viscosity alcohol solvents
US20150108632A1 (en) * 2013-10-23 2015-04-23 Nano And Advanced Materials Institute Limited Thin film with negative temperature coefficient behavior and method of making thereof
JP6651165B2 (ja) * 2014-09-17 2020-02-19 旭化成株式会社 薄膜トランジスタ及びその製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2014760A (en) * 1934-10-18 1935-09-17 Dewsbury Wilfred Graham Paint, lithographic varnish, printing ink, and the like and process of making same
US3015632A (en) * 1956-12-31 1962-01-02 Tribune Company Electrically conductive printing ink and method of producing same
US3105632A (en) * 1960-03-14 1963-10-01 Dresser Ind High pressure centrifugal compressor
US3992212A (en) 1972-08-18 1976-11-16 Universal Oil Products Company Electrical resistor inks
US3947278A (en) * 1973-12-19 1976-03-30 Universal Oil Products Company Duplex resistor inks
US3989644A (en) 1974-09-27 1976-11-02 General Electric Company Radiation curable inks
DE2934528A1 (de) * 1979-08-27 1981-04-02 Henkel KGaA, 4000 Düsseldorf Hilfsmittel fuer pigmentpasten
JPS62262025A (ja) 1986-05-07 1987-11-14 Canon Inc 液晶用セル
JPH064799B2 (ja) * 1987-03-31 1994-01-19 谷口インキ製造株式会社 印刷インキ
JPH0713212B2 (ja) * 1987-10-16 1995-02-15 東レ株式会社 導電性インキ組成物
JPH01153776A (ja) * 1987-12-10 1989-06-15 Fuji Kagakushi Kogyo Co Ltd 印字用液状インク
JPH08194790A (ja) 1995-01-18 1996-07-30 Apo Syst Kk ２次元コードカードシステム
JP2963657B2 (ja) * 1996-07-05 1999-10-18 株式会社信州セラミックス 被着処理剤
EP1104791A1 (en) * 1999-11-25 2001-06-06 Sicpa Holding S.A. Printing ink, use of micro-wires as antennas in security documents, method for producing a security document and methods for authentication of security documents
JP4722269B2 (ja) * 2000-08-29 2011-07-13 Ａｚエレクトロニックマテリアルズ株式会社 低誘電率多孔質シリカ質膜、半導体装置およびコーティング組成物、ならびに低誘電率多孔質シリカ質膜の製造方法
JP2003036520A (ja) 2001-07-25 2003-02-07 Fuji Photo Film Co Ltd 磁気記録媒体
ATE476470T1 (de) * 2002-06-28 2010-08-15 Merck Patent Gmbh Härtung und trocknung von lacksystemen und druckfarben
JP2004244525A (ja) * 2003-02-14 2004-09-02 Kyocera Chemical Corp 導電性塗料
US7306823B2 (en) * 2004-09-18 2007-12-11 Nanosolar, Inc. Coated nanoparticles and quantum dots for solution-based fabrication of photovoltaic cells

Also Published As

Publication number Publication date
ES2609413T3 (es) 2017-04-20
US9206324B2 (en) 2015-12-08
EP1971651A1 (en) 2008-09-24
CN101346441A (zh) 2009-01-14
WO2007072162A1 (en) 2007-06-28
KR101407252B1 (ko) 2014-06-16
JP2009520866A (ja) 2009-05-28
EP1971651B1 (en) 2016-10-05
KR20080100170A (ko) 2008-11-14
JP5106414B2 (ja) 2012-12-26
CN101346441B (zh) 2012-04-18
US20090004832A1 (en) 2009-01-01

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