ZA200301533B - Method and device for plasma treatment of moving metal substrate. - Google Patents
Method and device for plasma treatment of moving metal substrate. Download PDFInfo
- Publication number
- ZA200301533B ZA200301533B ZA200301533A ZA200301533A ZA200301533B ZA 200301533 B ZA200301533 B ZA 200301533B ZA 200301533 A ZA200301533 A ZA 200301533A ZA 200301533 A ZA200301533 A ZA 200301533A ZA 200301533 B ZA200301533 B ZA 200301533B
- Authority
- ZA
- South Africa
- Prior art keywords
- substrate
- magnetic
- treatment zone
- displacement
- electrode
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 169
- 238000000034 method Methods 0.000 title claims description 48
- 229910052751 metal Inorganic materials 0.000 title claims description 21
- 239000002184 metal Substances 0.000 title claims description 21
- 238000009832 plasma treatment Methods 0.000 title 1
- 230000005291 magnetic effect Effects 0.000 claims description 130
- 230000006698 induction Effects 0.000 claims description 60
- 238000006073 displacement reaction Methods 0.000 claims description 40
- 150000002500 ions Chemical class 0.000 claims description 18
- 238000004140 cleaning Methods 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- 229910052786 argon Inorganic materials 0.000 claims description 7
- 239000003302 ferromagnetic material Substances 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- 150000002430 hydrocarbons Chemical class 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical class [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000001307 helium Substances 0.000 claims 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 229910052756 noble gas Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 210000002381 plasma Anatomy 0.000 description 38
- 230000008569 process Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010849 ion bombardment Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- -1 argon ions Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000008246 gaseous mixture Substances 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000005495 cold plasma Effects 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008774 maternal effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/34—Methods of heating
- C21D1/38—Heating by cathodic discharges
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/52—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
- C21D9/54—Furnaces for treating strips or wire
- C21D9/56—Continuous furnaces for strip or wire
- C21D9/561—Continuous furnaces for strip or wire with a controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Physical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00202764A EP1178134A1 (de) | 2000-08-04 | 2000-08-04 | Pasma-Verfahren und -Vorrichtung zur Durchlaufbehandlung metallischer Gegenstände |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA200301533B true ZA200301533B (en) | 2004-02-25 |
Family
ID=8171886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA200301533A ZA200301533B (en) | 2000-08-04 | 2003-02-25 | Method and device for plasma treatment of moving metal substrate. |
Country Status (8)
Country | Link |
---|---|
US (1) | US6933460B2 (de) |
EP (2) | EP1178134A1 (de) |
JP (1) | JP2004506096A (de) |
AU (1) | AU2001283717A1 (de) |
BR (1) | BR0113141A (de) |
CA (1) | CA2423138A1 (de) |
WO (1) | WO2002012591A1 (de) |
ZA (1) | ZA200301533B (de) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT414215B (de) | 2003-02-12 | 2006-10-15 | Peter Ziger | Anlage zur plasmaprozessierung |
CN1716557A (zh) * | 2004-02-25 | 2006-01-04 | 库力索法投资公司 | 用于引线焊接机的激光清洁系统 |
US7737382B2 (en) * | 2004-04-01 | 2010-06-15 | Lincoln Global, Inc. | Device for processing welding wire |
TW200635085A (en) * | 2005-01-20 | 2006-10-01 | Barnes Group Inc | LED assembly having overmolded lens on treated leadframe and method therefor |
US20060219754A1 (en) * | 2005-03-31 | 2006-10-05 | Horst Clauberg | Bonding wire cleaning unit and method of wire bonding using same |
FR2887737B1 (fr) * | 2005-06-24 | 2007-09-07 | Celes Sa | Four a induction pour traiter des bandes, toles, plaques, en materiau conducteur de l'electricite, et inducteur pour un tel four |
FR2887738B1 (fr) * | 2005-06-24 | 2007-08-24 | Celes Sa | Four a induction pour traitement de bandes, toles, plaques, en materiau conducteur de l'electricite, et inducteur pour un tel four |
JP5870325B2 (ja) * | 2006-02-14 | 2016-02-24 | 大学共同利用機関法人自然科学研究機構 | 水素貯蔵金属又は合金の初期活性化方法及び水素化方法 |
AT504466B1 (de) * | 2006-10-25 | 2009-05-15 | Eiselt Primoz | Verfahren und vorrichtung zur entfettung von gegenständen oder materialien mittels oxidativer radikale |
EP2053631A1 (de) * | 2007-10-22 | 2009-04-29 | Industrial Plasma Services & Technologies - IPST GmbH | Verfahren und Vorrichtung zur Plasma-Behandlung Substrate im Durchlauf |
BE1017852A3 (fr) | 2007-11-19 | 2009-09-01 | Ind Plasma Services & Technologies Ipst Gmbh | Procede et installation de galvanisation par evaporation plasma. |
WO2009126850A1 (en) | 2008-04-11 | 2009-10-15 | The Timken Company | Inductive heating using permanent magnets for hardening of gear teeth and components alike |
US8138677B2 (en) * | 2008-05-01 | 2012-03-20 | Mark Edward Morehouse | Radial hall effect ion injector with a split solenoid field |
EP2251452B1 (de) | 2009-05-13 | 2018-07-18 | SiO2 Medical Products, Inc. | Pecvd-anlage zum beschichten von gefässen |
US9545360B2 (en) | 2009-05-13 | 2017-01-17 | Sio2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
US9458536B2 (en) | 2009-07-02 | 2016-10-04 | Sio2 Medical Products, Inc. | PECVD coating methods for capped syringes, cartridges and other articles |
MY162497A (en) * | 2009-10-16 | 2017-06-15 | Linde Ag | Cleaning of copper wire using plasma or activated gas |
US11624115B2 (en) | 2010-05-12 | 2023-04-11 | Sio2 Medical Products, Inc. | Syringe with PECVD lubrication |
US8993942B2 (en) | 2010-10-11 | 2015-03-31 | The Timken Company | Apparatus for induction hardening |
JP2013542613A (ja) * | 2010-10-27 | 2013-11-21 | アプライド マテリアルズ インコーポレイテッド | フォトレジスト線幅の荒れを制御するための方法及び装置 |
US9878101B2 (en) | 2010-11-12 | 2018-01-30 | Sio2 Medical Products, Inc. | Cyclic olefin polymer vessels and vessel coating methods |
JP5603433B2 (ja) * | 2010-12-28 | 2014-10-08 | キヤノンアネルバ株式会社 | カーボン膜の製造方法及びプラズマcvd方法 |
US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
US11116695B2 (en) | 2011-11-11 | 2021-09-14 | Sio2 Medical Products, Inc. | Blood sample collection tube |
EP2776603B1 (de) | 2011-11-11 | 2019-03-06 | SiO2 Medical Products, Inc. | Passivierungs-, ph-schutz- oder schmierbeschichtung für arzneimittelverpackung, beschichtungsverfahren und vorrichtung |
US9664626B2 (en) | 2012-11-01 | 2017-05-30 | Sio2 Medical Products, Inc. | Coating inspection method |
WO2014078666A1 (en) | 2012-11-16 | 2014-05-22 | Sio2 Medical Products, Inc. | Method and apparatus for detecting rapid barrier coating integrity characteristics |
US9764093B2 (en) | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
KR102211950B1 (ko) | 2012-11-30 | 2021-02-04 | 에스아이오2 메디컬 프로덕츠, 인크. | 의료용 주사기 카트리지 등의 pecvd 증착 균일성 제어 |
EP2961858B1 (de) | 2013-03-01 | 2022-09-07 | Si02 Medical Products, Inc. | Beschichtete spritze. |
US9937099B2 (en) | 2013-03-11 | 2018-04-10 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging with low oxygen transmission rate |
CN105392916B (zh) | 2013-03-11 | 2019-03-08 | Sio2医药产品公司 | 涂布包装材料 |
EP2971227B1 (de) | 2013-03-15 | 2017-11-15 | Si02 Medical Products, Inc. | Beschichtungsverfahren. |
WO2015148471A1 (en) | 2014-03-28 | 2015-10-01 | Sio2 Medical Products, Inc. | Antistatic coatings for plastic vessels |
CA3204930A1 (en) | 2015-08-18 | 2017-02-23 | Sio2 Medical Products, Inc. | Pharmaceutical and other packaging with low oxygen transmission rate |
US10545534B2 (en) * | 2016-12-31 | 2020-01-28 | Lenovo (Singapore) Pte. Ltd. | Multiple display device |
EP4084040A1 (de) | 2021-04-29 | 2022-11-02 | voestalpine Stahl GmbH | Verfahren und vorrichtungen zur plasmabehandlung |
CN116364541B (zh) * | 2023-05-30 | 2023-08-08 | 艾瑞森表面技术(苏州)股份有限公司 | 等离子蚀刻方法及等离子蚀刻系统 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3654108A (en) * | 1969-09-23 | 1972-04-04 | Air Reduction | Method for glow cleaning |
FR2555362B1 (fr) * | 1983-11-17 | 1990-04-20 | France Etat | Procede et dispositif de traitement d'un materiau semi-conducteur, par plasma |
NL8602760A (nl) * | 1986-10-31 | 1988-05-16 | Bekaert Sa Nv | Werkwijze en inrichting voor het reinigen van een langwerpig substraat, zoals een draad, een band, een koord, enz., alsmede volgens die werkwijze gereinigde voorwerpen. |
US5003225A (en) * | 1989-01-04 | 1991-03-26 | Applied Microwave Plasma Concepts, Inc. | Method and apparatus for producing intense microwave pulses |
EP0396919A3 (de) * | 1989-05-08 | 1991-07-10 | Applied Materials, Inc. | Plasma-Reaktor und Halbleiterbearbeitungsverfahren |
WO1991009150A1 (en) * | 1989-12-15 | 1991-06-27 | Canon Kabushiki Kaisha | Method of and device for plasma treatment |
DE4211167A1 (de) * | 1992-03-31 | 1993-10-07 | Thaelmann Schwermaschbau Veb | Verfahren und Vorrichtung zur kontinuierlichen thermischen Oberflächenbehandlung stab- bzw. strangförmiger Materialien mit metallischer Oberfläche |
US5670415A (en) * | 1994-05-24 | 1997-09-23 | Depositech, Inc. | Method and apparatus for vacuum deposition of highly ionized media in an electromagnetic controlled environment |
US5811022A (en) * | 1994-11-15 | 1998-09-22 | Mattson Technology, Inc. | Inductive plasma reactor |
US5577090A (en) * | 1995-01-12 | 1996-11-19 | Moses; Kenneth G. | Method and apparatus for product x-radiation |
BE1010913A3 (fr) * | 1997-02-11 | 1999-03-02 | Cockerill Rech & Dev | Procede de recuit d'un substrat metallique au defile. |
-
2000
- 2000-08-04 EP EP00202764A patent/EP1178134A1/de not_active Withdrawn
-
2001
- 2001-08-06 BR BR0113141-9A patent/BR0113141A/pt not_active Application Discontinuation
- 2001-08-06 US US10/343,764 patent/US6933460B2/en not_active Expired - Lifetime
- 2001-08-06 EP EP01962488A patent/EP1307607A1/de not_active Withdrawn
- 2001-08-06 WO PCT/BE2001/000130 patent/WO2002012591A1/fr active Application Filing
- 2001-08-06 CA CA002423138A patent/CA2423138A1/fr not_active Abandoned
- 2001-08-06 AU AU2001283717A patent/AU2001283717A1/en not_active Abandoned
- 2001-08-06 JP JP2002517867A patent/JP2004506096A/ja active Pending
-
2003
- 2003-02-25 ZA ZA200301533A patent/ZA200301533B/en unknown
Also Published As
Publication number | Publication date |
---|---|
AU2001283717A1 (en) | 2002-02-18 |
CA2423138A1 (fr) | 2002-02-14 |
US6933460B2 (en) | 2005-08-23 |
JP2004506096A (ja) | 2004-02-26 |
WO2002012591A1 (fr) | 2002-02-14 |
EP1178134A1 (de) | 2002-02-06 |
EP1307607A1 (de) | 2003-05-07 |
US20040026412A1 (en) | 2004-02-12 |
BR0113141A (pt) | 2003-07-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6933460B2 (en) | Method and device for plasma treatment of moving metal substrates | |
US6896773B2 (en) | High deposition rate sputtering | |
US7604716B2 (en) | Methods and apparatus for generating high-density plasma | |
EP1556882B1 (de) | Gepulste Hochleistungsplasmabearbeitungsanlage mit magnetisch erhöhter Wirkung | |
US6806652B1 (en) | High-density plasma source using excited atoms | |
JP2004537825A (ja) | 磁気ミラープラズマ源 | |
KR20110010780A (ko) | 마이크로파를 이용한 회전식 pvd | |
US8835797B2 (en) | Method and device for the plasma treatment of running metal substrates | |
USH2212H1 (en) | Method and apparatus for producing an ion-ion plasma continuous in time | |
Li et al. | Influence of magnetic field on the electrical breakdown characteristics in cylindrical diode | |
AU2014259517B2 (en) | Method and device for the plasma treatment of running metal substrates | |
KR102584240B1 (ko) | 집속 유도 결합 플라즈마용 페라이트 쉴드를 포함하는 플라즈마 발생장치 | |
Abolmasov et al. | Low-energy penning ionization gauge type ion source assisted by RF magnetron discharge | |
KR100469552B1 (ko) | 플라즈마 표면 처리 장치 및 방법 | |
RU2620534C2 (ru) | Способ нанесения покрытий и устройство для его осуществления | |
JPH062132A (ja) | マグネトロン放電処理装置 | |
Barnat et al. | Plasma Sources used for Sputter Deposition | |
WO2004095498A2 (en) | High-density plasma source using excited atoms | |
JPH1167115A (ja) | マイクロ波イオン源 | |
JPH0878188A (ja) | 磁気中性線放電プラズマ表面処理装置 |