AU2001283717A1 - Method and device for plasma treatment of moving metal substrates - Google Patents

Method and device for plasma treatment of moving metal substrates

Info

Publication number
AU2001283717A1
AU2001283717A1 AU2001283717A AU8371701A AU2001283717A1 AU 2001283717 A1 AU2001283717 A1 AU 2001283717A1 AU 2001283717 A AU2001283717 A AU 2001283717A AU 8371701 A AU8371701 A AU 8371701A AU 2001283717 A1 AU2001283717 A1 AU 2001283717A1
Authority
AU
Australia
Prior art keywords
plasma treatment
metal substrates
moving metal
moving
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001283717A
Inventor
Pierre Vanden Brande
Alain Weymeersch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
COLD PLASMA APPLICATIONS
Original Assignee
COLD PLASMA APPLIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8171886&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2001283717(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by COLD PLASMA APPLIC filed Critical COLD PLASMA APPLIC
Publication of AU2001283717A1 publication Critical patent/AU2001283717A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34—Methods of heating
    • C21D1/38—Heating by cathodic discharges
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/52—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
    • C21D9/54—Furnaces for treating strips or wire
    • C21D9/56—Continuous furnaces for strip or wire
    • C21D9/561—Continuous furnaces for strip or wire with a controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Drying Of Semiconductors (AREA)
AU2001283717A 2000-08-04 2001-08-06 Method and device for plasma treatment of moving metal substrates Abandoned AU2001283717A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00202764 2000-08-04
EP00202764A EP1178134A1 (en) 2000-08-04 2000-08-04 Process and apparatus for the continuous plasma treatment of metallic substrates
PCT/BE2001/000130 WO2002012591A1 (en) 2000-08-04 2001-08-06 Method and device for plasma treatment of moving metal substrates

Publications (1)

Publication Number Publication Date
AU2001283717A1 true AU2001283717A1 (en) 2002-02-18

Family

ID=8171886

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001283717A Abandoned AU2001283717A1 (en) 2000-08-04 2001-08-06 Method and device for plasma treatment of moving metal substrates

Country Status (8)

Country Link
US (1) US6933460B2 (en)
EP (2) EP1178134A1 (en)
JP (1) JP2004506096A (en)
AU (1) AU2001283717A1 (en)
BR (1) BR0113141A (en)
CA (1) CA2423138A1 (en)
WO (1) WO2002012591A1 (en)
ZA (1) ZA200301533B (en)

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Publication number Priority date Publication date Assignee Title
AT414215B (en) 2003-02-12 2006-10-15 Peter Ziger ANNEX TO PLASMA PROCESSING
CN1716557A (en) * 2004-02-25 2006-01-04 库力索法投资公司 Laser cleaning system for a wire bonding machine
US7737382B2 (en) * 2004-04-01 2010-06-15 Lincoln Global, Inc. Device for processing welding wire
TW200635085A (en) * 2005-01-20 2006-10-01 Barnes Group Inc LED assembly having overmolded lens on treated leadframe and method therefor
US20060219754A1 (en) * 2005-03-31 2006-10-05 Horst Clauberg Bonding wire cleaning unit and method of wire bonding using same
FR2887737B1 (en) * 2005-06-24 2007-09-07 Celes Sa INDUCTION OVEN FOR PROCESSING BANDS, SHEETS, PLATES, IN ELECTRICITY CONDUCTIVE MATERIAL, AND INDUCER FOR SUCH A FURNACE
FR2887738B1 (en) * 2005-06-24 2007-08-24 Celes Sa INDUCTION OVEN FOR PROCESSING BANDS, SHEETS, PLATES, IN ELECTRICITY CONDUCTIVE MATERIAL, AND INDUCER FOR SUCH A FURNACE
JP5870325B2 (en) * 2006-02-14 2016-02-24 大学共同利用機関法人自然科学研究機構 Initial activation method and hydrogenation method of hydrogen storage metal or alloy
AT504466B1 (en) * 2006-10-25 2009-05-15 Eiselt Primoz METHOD AND DEVICE FOR DEGASSING OBJECTS OR MATERIALS USING THE OXIDATIVE RADICALS
EP2053631A1 (en) * 2007-10-22 2009-04-29 Industrial Plasma Services & Technologies - IPST GmbH Method and device for plasma treatment of moving substrates
BE1017852A3 (en) 2007-11-19 2009-09-01 Ind Plasma Services & Technologies Ipst Gmbh METHOD AND INSTALLATION OF GALVANIZATION BY PLASMA EVAPORATION
WO2009126850A1 (en) 2008-04-11 2009-10-15 The Timken Company Inductive heating using permanent magnets for hardening of gear teeth and components alike
US8138677B2 (en) * 2008-05-01 2012-03-20 Mark Edward Morehouse Radial hall effect ion injector with a split solenoid field
EP2251452B1 (en) 2009-05-13 2018-07-18 SiO2 Medical Products, Inc. Pecvd apparatus for vessel coating
US9545360B2 (en) 2009-05-13 2017-01-17 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
MY162497A (en) * 2009-10-16 2017-06-15 Linde Ag Cleaning of copper wire using plasma or activated gas
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US8993942B2 (en) 2010-10-11 2015-03-31 The Timken Company Apparatus for induction hardening
JP2013542613A (en) * 2010-10-27 2013-11-21 アプライド マテリアルズ インコーポレイテッド Method and apparatus for controlling roughness of photoresist line width
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
JP5603433B2 (en) * 2010-12-28 2014-10-08 キヤノンアネルバ株式会社 Carbon film manufacturing method and plasma CVD method
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
EP2776603B1 (en) 2011-11-11 2019-03-06 SiO2 Medical Products, Inc. PASSIVATION, pH PROTECTIVE OR LUBRICITY COATING FOR PHARMACEUTICAL PACKAGE, COATING PROCESS AND APPARATUS
US9664626B2 (en) 2012-11-01 2017-05-30 Sio2 Medical Products, Inc. Coating inspection method
WO2014078666A1 (en) 2012-11-16 2014-05-22 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
KR102211950B1 (en) 2012-11-30 2021-02-04 에스아이오2 메디컬 프로덕츠, 인크. Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like
EP2961858B1 (en) 2013-03-01 2022-09-07 Si02 Medical Products, Inc. Coated syringe.
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
CN105392916B (en) 2013-03-11 2019-03-08 Sio2医药产品公司 Coat packaging materials
EP2971227B1 (en) 2013-03-15 2017-11-15 Si02 Medical Products, Inc. Coating method.
WO2015148471A1 (en) 2014-03-28 2015-10-01 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
CA3204930A1 (en) 2015-08-18 2017-02-23 Sio2 Medical Products, Inc. Pharmaceutical and other packaging with low oxygen transmission rate
US10545534B2 (en) * 2016-12-31 2020-01-28 Lenovo (Singapore) Pte. Ltd. Multiple display device
EP4084040A1 (en) 2021-04-29 2022-11-02 voestalpine Stahl GmbH Method and devices for plasma treatment
CN116364541B (en) * 2023-05-30 2023-08-08 艾瑞森表面技术（苏州）股份有限公司 Plasma etching method and plasma etching system

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US3654108A (en) * 1969-09-23 1972-04-04 Air Reduction Method for glow cleaning
FR2555362B1 (en) * 1983-11-17 1990-04-20 France Etat METHOD AND DEVICE FOR TREATING A SEMICONDUCTOR MATERIAL WITH PLASMA
NL8602760A (en) * 1986-10-31 1988-05-16 Bekaert Sa Nv METHOD AND APPARATUS FOR CLEANING AN ELECTROUS SUBSTRATE SUCH AS A WIRE, A TIRE, A ROPE, ETC, AND ARTICLES CLEANED ACCORDING TO THAT METHOD
US5003225A (en) * 1989-01-04 1991-03-26 Applied Microwave Plasma Concepts, Inc. Method and apparatus for producing intense microwave pulses
EP0396919A3 (en) * 1989-05-08 1991-07-10 Applied Materials, Inc. Plasma reactor and method for semiconductor processing
WO1991009150A1 (en) * 1989-12-15 1991-06-27 Canon Kabushiki Kaisha Method of and device for plasma treatment
DE4211167A1 (en) * 1992-03-31 1993-10-07 Thaelmann Schwermaschbau Veb Method and device for the continuous thermal surface treatment of rod or strand-shaped materials with a metallic surface
US5670415A (en) * 1994-05-24 1997-09-23 Depositech, Inc. Method and apparatus for vacuum deposition of highly ionized media in an electromagnetic controlled environment
US5811022A (en) * 1994-11-15 1998-09-22 Mattson Technology, Inc. Inductive plasma reactor
US5577090A (en) * 1995-01-12 1996-11-19 Moses; Kenneth G. Method and apparatus for product x-radiation
BE1010913A3 (en) * 1997-02-11 1999-03-02 Cockerill Rech & Dev Annealing process substrate metal in parade.

Also Published As

Publication number Publication date
CA2423138A1 (en) 2002-02-14
US6933460B2 (en) 2005-08-23
JP2004506096A (en) 2004-02-26
WO2002012591A1 (en) 2002-02-14
EP1178134A1 (en) 2002-02-06
EP1307607A1 (en) 2003-05-07
ZA200301533B (en) 2004-02-25
US20040026412A1 (en) 2004-02-12
BR0113141A (en) 2003-07-08

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