EP1307607A1 - Verfahren und vorrichting zur plasma-behandlung metallischer substrate im durchlauf - Google Patents

Verfahren und vorrichting zur plasma-behandlung metallischer substrate im durchlauf

Info

Publication number
EP1307607A1
EP1307607A1 EP01962488A EP01962488A EP1307607A1 EP 1307607 A1 EP1307607 A1 EP 1307607A1 EP 01962488 A EP01962488 A EP 01962488A EP 01962488 A EP01962488 A EP 01962488A EP 1307607 A1 EP1307607 A1 EP 1307607A1
Authority
EP
European Patent Office
Prior art keywords
substrate
magnetic
treatment zone
electrode
produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01962488A
Other languages
English (en)
French (fr)
Inventor
Pierre Vanden Brande
Alain Weymeersch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cold Plasma Applications Cpa
Original Assignee
Cold Plasma Applications Cpa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8171886&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1307607(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cold Plasma Applications Cpa filed Critical Cold Plasma Applications Cpa
Priority to EP01962488A priority Critical patent/EP1307607A1/de
Publication of EP1307607A1 publication Critical patent/EP1307607A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34Methods of heating
    • C21D1/38Heating by cathodic discharges
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/52Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
    • C21D9/54Furnaces for treating strips or wire
    • C21D9/56Continuous furnaces for strip or wire
    • C21D9/561Continuous furnaces for strip or wire with a controlled atmosphere or vacuum
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • C23C14/022Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3266Magnetic control means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Drying Of Semiconductors (AREA)
EP01962488A 2000-08-04 2001-08-06 Verfahren und vorrichting zur plasma-behandlung metallischer substrate im durchlauf Withdrawn EP1307607A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01962488A EP1307607A1 (de) 2000-08-04 2001-08-06 Verfahren und vorrichting zur plasma-behandlung metallischer substrate im durchlauf

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP00202764 2000-08-04
EP00202764A EP1178134A1 (de) 2000-08-04 2000-08-04 Pasma-Verfahren und -Vorrichtung zur Durchlaufbehandlung metallischer Gegenstände
PCT/BE2001/000130 WO2002012591A1 (fr) 2000-08-04 2001-08-06 Procede et dispositif pour traiter des substrats metalliques au defile par plasma
EP01962488A EP1307607A1 (de) 2000-08-04 2001-08-06 Verfahren und vorrichting zur plasma-behandlung metallischer substrate im durchlauf

Publications (1)

Publication Number Publication Date
EP1307607A1 true EP1307607A1 (de) 2003-05-07

Family

ID=8171886

Family Applications (2)

Application Number Title Priority Date Filing Date
EP00202764A Withdrawn EP1178134A1 (de) 2000-08-04 2000-08-04 Pasma-Verfahren und -Vorrichtung zur Durchlaufbehandlung metallischer Gegenstände
EP01962488A Withdrawn EP1307607A1 (de) 2000-08-04 2001-08-06 Verfahren und vorrichting zur plasma-behandlung metallischer substrate im durchlauf

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP00202764A Withdrawn EP1178134A1 (de) 2000-08-04 2000-08-04 Pasma-Verfahren und -Vorrichtung zur Durchlaufbehandlung metallischer Gegenstände

Country Status (8)

Country Link
US (1) US6933460B2 (de)
EP (2) EP1178134A1 (de)
JP (1) JP2004506096A (de)
AU (1) AU2001283717A1 (de)
BR (1) BR0113141A (de)
CA (1) CA2423138A1 (de)
WO (1) WO2002012591A1 (de)
ZA (1) ZA200301533B (de)

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US7737382B2 (en) * 2004-04-01 2010-06-15 Lincoln Global, Inc. Device for processing welding wire
TW200635085A (en) * 2005-01-20 2006-10-01 Barnes Group Inc LED assembly having overmolded lens on treated leadframe and method therefor
US20060219754A1 (en) * 2005-03-31 2006-10-05 Horst Clauberg Bonding wire cleaning unit and method of wire bonding using same
FR2887737B1 (fr) * 2005-06-24 2007-09-07 Celes Sa Four a induction pour traiter des bandes, toles, plaques, en materiau conducteur de l'electricite, et inducteur pour un tel four
FR2887738B1 (fr) * 2005-06-24 2007-08-24 Celes Sa Four a induction pour traitement de bandes, toles, plaques, en materiau conducteur de l'electricite, et inducteur pour un tel four
JP5870325B2 (ja) * 2006-02-14 2016-02-24 大学共同利用機関法人自然科学研究機構 水素貯蔵金属又は合金の初期活性化方法及び水素化方法
AT504466B1 (de) * 2006-10-25 2009-05-15 Eiselt Primoz Verfahren und vorrichtung zur entfettung von gegenständen oder materialien mittels oxidativer radikale
EP2053631A1 (de) * 2007-10-22 2009-04-29 Industrial Plasma Services & Technologies - IPST GmbH Verfahren und Vorrichtung zur Plasma-Behandlung Substrate im Durchlauf
BE1017852A3 (fr) 2007-11-19 2009-09-01 Ind Plasma Services & Technologies Ipst Gmbh Procede et installation de galvanisation par evaporation plasma.
WO2009126850A1 (en) 2008-04-11 2009-10-15 The Timken Company Inductive heating using permanent magnets for hardening of gear teeth and components alike
US8138677B2 (en) * 2008-05-01 2012-03-20 Mark Edward Morehouse Radial hall effect ion injector with a split solenoid field
MX345403B (es) 2009-05-13 2017-01-30 Sio2 Medical Products Inc Revestimiento por pecvd utilizando un precursor organosilícico.
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
MY162497A (en) * 2009-10-16 2017-06-15 Linde Ag Cleaning of copper wire using plasma or activated gas
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US8993942B2 (en) 2010-10-11 2015-03-31 The Timken Company Apparatus for induction hardening
KR20130141550A (ko) * 2010-10-27 2013-12-26 어플라이드 머티어리얼스, 인코포레이티드 포토레지스트 선폭 거칠기를 조절하기 위한 방법들 및 장치
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
WO2012090420A1 (ja) * 2010-12-28 2012-07-05 キヤノンアネルバ株式会社 カーボン膜の製造方法及びプラズマcvd方法
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
JP6095678B2 (ja) 2011-11-11 2017-03-15 エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド 薬剤パッケージ用の不動態化、pH保護又は滑性皮膜、被覆プロセス及び装置
CA2887352A1 (en) 2012-05-09 2013-11-14 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
EP2914762B1 (de) 2012-11-01 2020-05-13 SiO2 Medical Products, Inc. Verfahren zur inspektion einer beschichtung
EP2920567B1 (de) 2012-11-16 2020-08-19 SiO2 Medical Products, Inc. Verfahren und vorrichtung zur erkennung von schnellen sperrbeschichtungsintegritätseigenschaften
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
CN105705676B (zh) 2012-11-30 2018-09-07 Sio2医药产品公司 控制在医用注射器、药筒等上的pecvd沉积的均匀性
EP2961858B1 (de) 2013-03-01 2022-09-07 Si02 Medical Products, Inc. Beschichtete spritze.
CN110074968B (zh) 2013-03-11 2021-12-21 Sio2医药产品公司 涂布包装材料
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
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CA2995225C (en) 2015-08-18 2023-08-29 Sio2 Medical Products, Inc. Pharmaceutical and other packaging with low oxygen transmission rate
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Also Published As

Publication number Publication date
AU2001283717A1 (en) 2002-02-18
ZA200301533B (en) 2004-02-25
CA2423138A1 (fr) 2002-02-14
BR0113141A (pt) 2003-07-08
JP2004506096A (ja) 2004-02-26
US20040026412A1 (en) 2004-02-12
US6933460B2 (en) 2005-08-23
WO2002012591A1 (fr) 2002-02-14
EP1178134A1 (de) 2002-02-06

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