Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/10—Arrangements for heating

Definitions

• the present invention relates to a heat dissipation sheet.
• Such heat dissipation sheets are typically constructed primarily from metal materials such as aluminum, aluminum alloys, or copper, and have a comb-like cross-sectional structure with multiple rectangular fins extending from a rectangular base (see, for example, Patent Document 1).
• the object of the present invention is to provide a heat dissipation sheet that has excellent heat dissipation properties and is compact, particularly in the thickness direction.
• thermo conductivity of the adhesive layer is 0.2 W/m ⁇ K or more and 1 W/m ⁇ K or less.
• a heat dissipation sheet can be made that has excellent heat dissipation properties and is miniaturized, particularly in the thickness direction (thinner thickness).
• it is easy to ensure space for the heat dissipation sheet, improving the overall appearance of the electronic component that includes the semiconductor device equipped with the heat dissipation sheet, and further reducing its weight.
• FIG. 1 is a side view showing a first embodiment of a heat dissipation sheet of the present invention.
• FIG. 2 is a side view for explaining a manufacturing method for manufacturing the heat dissipation sheet shown in FIG.
• FIG. 3 is a side view showing a second embodiment of the heat dissipation sheet of the present invention.
• FIG. 1 is a side view showing a first embodiment of the heat dissipation sheet of the present invention.
• the upper side in Fig. 1 will be referred to as “top” and the lower side as “bottom.”
• the drawings used are enlarged or reduced as appropriate so that the parts being described can be clearly seen.
• the substrate 4 is a release sheet, and the fiber fixing layer 3 and the heat dissipation layer 2 are provided in this order from the substrate 4 side, supporting the fiber fixing layer 3 and the heat dissipation layer 2 (see FIG. 1( a)).
• the fiber fixing layer 3 is peeled off from the substrate 4 (see FIG. 1( b)), and the fiber fixing layer 3 is attached to an object (hereinafter described as a semiconductor device). That is, the surface of the substrate 4 facing the fiber fixing layer 3 has a release agent layer.
• the main material of the substrate 4 may be, for example, a resin material such as polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polypropylene, polyamide, polyimide, polycarbonate, or polyarylate, or a glass material such as soda glass or quartz glass, and one or more of these may be used in combination.
• a resin material such as polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polypropylene, polyamide, polyimide, polycarbonate, or polyarylate
• a glass material such as soda glass or quartz glass
• the average thickness of the substrate 4 is not particularly limited, but is preferably approximately 9 ⁇ m or more and 200 ⁇ m or less, and more preferably approximately 12 ⁇ m or more and 70 ⁇ m or less. This allows the fiber fixing layer 3 to be stably supported before it is peeled off, suppresses excessive deformation, and prevents the fiber fixing layer 3 from unintentionally detaching from the substrate 4.
• the release agent layer provided on the surface of the substrate 4 facing the fiber fixing layer 3 contains a release agent.
• release agents include polyolefins such as polyethylene resin, thermoplastic elastomers such as olefin-based thermoplastic elastomers, fluororesins such as tetrafluoroethylene, and mixtures of these.
• preferred release agents for use in the release agent layer include polyethylene resin and olefin-based thermoplastic elastomer.
• the release agent layer is composed of such a release agent, it does not contain silicone compounds, which can adversely affect relays and the like. Therefore, when the release agent layer is composed of polyethylene resin and olefin-based thermoplastic elastomer, it is possible to prevent the creation of an environment within the adhesive body in which silicone compounds migrate from the release agent layer to the fiber fixing layer (adhesive layer).
• the release agent layer is composed of polyethylene resin and olefin-based thermoplastic elastomer, it is not necessary to use silicone resin at the manufacturing site when producing the adhesive body, and it is possible to prevent silicone compounds from adhering to the surface of the adhesive sheet substrate or release sheet substrate.
• the release agent layer is composed of olefin-based thermoplastic elastomer and polyethylene resin, excellent releasability is achieved, thereby facilitating the peeling process.
• the fiber fixing layer 3 has an overall layered shape and a planar shape similar to that of the substrate 4 when viewed from above.
• the fiber fixing layer 3 has the function of fixing the straight fibers 21 on the upper surface side (one side) of the fiber fixing layer 3 by fixing the base ends of the straight fibers 21 in an embedded state along their thickness direction (vertical direction).
• This fiber fixing layer 3 is formed by embedding the base ends of the straight fibers 21 into the fiber fixing layer 3 using the electrostatic flocking method described below, thereby fixing the straight fibers 21 to the fiber fixing layer 3. This allows the straight fibers 21 to be reliably fixed by the fiber fixing layer 3.
• the fiber fixing layer 3 may be a photocurable adhesive layer or a thermosetting adhesive layer.
• the photocurable adhesive layer include an ultraviolet-curable adhesive layer that is cured by irradiation with ultraviolet rays and an electron beam-curable adhesive layer that is cured by irradiation with electron beams, and in some cases, the photocurable adhesive layer may contain a photopolymerization initiator, etc.
• the ultraviolet-curable adhesive layer or the electron beam-curable adhesive layer include an adhesive layer that contains a base resin, a radiation-polymerizable compound, a radiation polymerization initiator, etc.
• the base resin contained in the photocurable adhesive layer may be, for example, an acrylic resin, a silicone resin, a polyester resin, a polyvinyl acetate resin, a polyvinyl ether resin, a styrene elastomer resin, a polyisoprene resin, a polyisobutylene resin, or a urethane resin, which are known components contained in adhesive layers.
• the base resin is preferably an acrylic resin, which has excellent heat resistance.
• the acrylic resin is preferably a polymer (homopolymer or copolymer) whose main monomer component is a (meth)acrylic acid alkyl ester.
• the photocurable adhesive layer may contain only one type of base resin, or two or more types. If there are two or more types, the combination and ratio of these can be selected as desired depending on the purpose.
• radiation-polymerizable compounds include low-molecular-weight compounds that have two or more polymerizable carbon-carbon double bonds per molecule that can be three-dimensionally crosslinked by irradiation with energy rays such as ultraviolet rays or electron beams. Specific examples of these compounds include those described in JP-A-2022-141213.
• the radiation polymerization initiator examples include those described in JP-A-2022-141213.
• the photocurable adhesive layer may contain additives such as a tackifier and a crosslinking agent.
• thermosetting adhesive layers include adhesive layers containing a base resin and a thermosetting component.
• the base resin contained in the thermosetting adhesive layer may be, for example, the same as the base resin contained in the photocurable adhesive layer described above.
• thermosetting adhesive layer may contain only one type of base resin, or two or more types. If there are two or more types, the combination and ratio of these can be selected as desired depending on the purpose.
• thermosetting components contained in the thermosetting adhesive layer include, for example, various thermosetting resins such as epoxy resin, phenolic resin, urea resin, urethane resin, and melamine resin.
• thermosetting adhesive layer may contain only one type of thermosetting component, or two or more types. If there are two or more types, the combination and ratio of these components can be selected as desired depending on the purpose.
• the fiber fixing layer 3 (adhesive layer) can particularly enhance durability after curing.
• the fiber fixing layer 3, which is formed from such an adhesive layer, may further contain a particulate thermally conductive material in order to improve the thermal conductivity of the fiber fixing layer 3.
• additives such as plasticizers, tackifiers, thickeners, fillers, antioxidants, preservatives, anti-mold agents, dyes, pigments, etc. may be added to the above-mentioned substrate 4 and fiber fixing layer 3, respectively, as needed.
• the thermal conductivity of this fiber fixing layer 3 is not particularly limited, but is preferably 0.2 W/m ⁇ K or more and 1 W/m ⁇ K or less, and more preferably 0.4 W/m ⁇ K or more and 1 W/m ⁇ K or less. This allows heat generated in the semiconductor device on which the heat dissipation sheet 1 is provided to be conducted (transmitted) to the heat dissipation layer 2 side via the fiber fixing layer 3 with excellent thermal conductivity.
• L1/T1 is preferably 0.3 or greater and 1 or less, and more preferably 0.8 or greater and 1 or less. This allows the straight fibers 21 to be fixed more reliably and stably in an upright position.
• the thickness T1 of the fiber fixing layer 3 is not particularly limited, but is preferably 10 ⁇ m or more and 1000 ⁇ m or less, and more preferably 50 ⁇ m or more and 300 ⁇ m or less. This allows the straight fibers 21 to be fixed more reliably and stably in an upright position.
• the present invention since the present invention is configured so that the fiber fixing layer 3 is directly attached to the object from which heat is to be dissipated, it is effective to set the characteristics of the fiber fixing layer 3 as described above.
• the length L1 of the portion of the straight fibers 21 embedded in the fiber fixing layer 3 is not particularly limited, but is preferably 3 ⁇ m or more and 1000 ⁇ m or less, and more preferably 10 ⁇ m or more and 100 ⁇ m or less. This allows the straight fibers 21 to be stably fixed by the fiber fixing layer 3 in an upright state.
• the elastic modulus of the fiber fixing layer 3 at room temperature (25°C) is preferably 0.1 MPa or more and 10 MPa or less, and more preferably 0.2 MPa or more and 9 MPa or less. This allows the fiber fixing layer 3 to fix the straight fibers 21 more stably and for the long term, and also to exhibit excellent adhesion to semiconductor devices.
• the present invention since the present invention is configured so that the fiber fixing layer 3 is directly attached to the object that dissipates heat, it is effective to set the characteristics of the fiber fixing layer 3 as described above.
• the elastic modulus at room temperature can be obtained, for example, in accordance with JIS K7244-4, by preparing a fiber fixing layer 3 with a width of 4 mm and a length of 20 mm, and measuring it at room temperature using a dynamic viscoelasticity measuring device (Hitachi High-Tech Science Corporation, "DMA7100") in tensile mode, at a frequency of 1 Hz, and at a heating rate of 5°C/min.
• a dynamic viscoelasticity measuring device Hitachi High-Tech Science Corporation, "DMA7100”
• the elastic modulus of the fiber fixing layer 3 at high temperatures is preferably 0.01 MPa or more and 5 MPa or less, and more preferably 0.05 MPa or more and 4 MPa or less. This allows the fiber fixing layer 3 to fix the straight fibers 21 more stably and for the long term even at high temperatures, and also provides excellent adhesion to semiconductor devices that tend to generate heat.
• the high-temperature elastic modulus can be obtained, for example, in accordance with JIS K7244-4, by preparing a fiber fixing layer 3 with a width of 4 mm and a length of 20 mm, and measuring it at a high temperature (75°C) using a dynamic viscoelasticity measuring device (Hitachi High-Tech Science Corporation, "DMA7100") in tension mode, at a frequency of 1 Hz, and at a heating rate of 5°C/min.
• a dynamic viscoelasticity measuring device Hitachi High-Tech Science Corporation, "DMA7100
• the elastic modulus of the fiber fixing layer 3 at room temperature (25°C) and the elastic modulus of the fiber fixing layer 3 at high temperature (75°C) are the values after curing. Even if the layer is cured after being attached to the semiconductor device, the values after curing are also used.
• the heat dissipation layer 2 is provided on the substrate 4 via the fiber fixing layer 3, and when the heat dissipation sheet 1 is provided corresponding to the semiconductor device, the heat generated in the semiconductor device is transmitted through the substrate 4 and the fiber fixing layer 3, and then this heat dissipation layer 2 has the function of dissipating the heat to the outside of the semiconductor device and the heat dissipation sheet 1, i.e., to the outside air.
• this heat dissipation layer 2 comprises a plurality of straight fibers 21 that are thermally conductive, i.e., have heat dissipation properties.
• the heat dissipation layer 2 has a planar shape in a planar view, and as shown in Figure 1, the base ends of the straight fibers 21 are embedded and fixed in the thickness direction (vertical direction) of the fiber fixing layer 3, and the tips are erected in the thickness direction with their tips facing upward (opposite the fiber fixing layer 3).
• the heat dissipation layer 2 By configuring the heat dissipation layer 2 in this way, it is possible to reduce the size of the heat dissipation sheet 1, particularly in the thickness direction, while also increasing the contact area between the semiconductor device and the outside of the heat dissipation sheet 1, i.e., the outside air, and the heat dissipation layer 2 (straight fibers 21). This allows the heat generated in the semiconductor device to be dissipated via the heat dissipation sheet 1 with excellent heat dissipation efficiency.
• the straight fibers 21 are not particularly limited and may include, for example, glass fibers, carbon fibers, polyamide fibers (nylon 6 fibers, nylon 66 fibers, nylon 46 fibers, aramid fibers, etc.), modified polyphenylene ether (modified PPE) fibers, poly-p-phenylenebenzobisoxazole (PBO) fibers, polyvinyl alcohol (PVA) fibers, polyolefin fibers (polyethylene fibers, polypropylene fibers, etc.), plastic fibers such as polyimide fibers, inorganic fibers such as carbon fibers and basalt fibers, natural fibers such as cotton, hemp, and wool, and metal fibers such as stainless steel fibers, and one or more of these may be used in combination.
• polyamide fibers nylon 6 fibers, nylon 66 fibers, nylon 46 fibers, aramid fibers, etc.
• modified PPE modified polyphenylene ether
• PBO poly-p-phenylenebenzobisoxazole
• PVA
• Such straight fibers 21 preferably have a thermal conductivity of 0.2 W/m ⁇ K or more and 900 W/m ⁇ K or less, and more preferably 10 W/m ⁇ K or more and 900 W/m ⁇ K or less. Furthermore, their thermal emissivity is preferably 0.7 or more, and more preferably 0.8 or more.
• the electrical resistivity is 100 k ⁇ m or higher. This ensures that the insulation of the heat dissipation layer 2 is ensured when the heat dissipation sheet 1 is provided for a semiconductor device. Furthermore, the heat dissipation layer 2 made up of straight fibers 21 can be reliably formed using the electrostatic flocking method described below.
• the straight fibers 21 be at least one of carbon fibers, aramid fibers, nylon 6 fibers, stainless steel fibers, and PBO fibers, etc., and if insulation is required, PBO fibers, etc. are preferably used.
• the length of the portion of the straight fibers 21 that protrudes from the fiber fixing layer 3 at the tip end is preferably 70 ⁇ m or more and 7000 ⁇ m or less, and more preferably 150 ⁇ m or more and 5000 ⁇ m or less.
• the thickness of the straight fibers 21 is preferably 0.9 ⁇ m or more and 20 ⁇ m or less, and more preferably 4 ⁇ m or more and 20 ⁇ m or less.
• the aspect ratio (L/T) is preferably 10 or more and 400 or less, and more preferably 20 or more and 100 or less.
• the density of the area where the straight fibers 21 are embedded in the fiber fixing layer 3 is preferably 0.05 cm 2 /cm 2 or more and 0.7 cm 2 /cm 2 or less, and more preferably 0.1 cm 2 /cm 2 or more and 0.5 cm 2 /cm 2 or less.
• the heat dissipation sheet 1 comprises a fiber fixing layer 3 as an adhesive layer with adhesive properties, and a heat dissipation layer 2 provided on one side of the fiber fixing layer 3 and having straight fibers 21 with heat dissipation properties.
• the straight fibers have their base ends embedded in one side of the fiber fixing layer 3 and fixed to the fiber fixing layer 3, and the other side of the fiber fixing layer 3 is used so as to be attached to a semiconductor device, which is an example of an object.
• This configuration allows the heat dissipation sheet 1 to be made even thinner.
• the fiber fixing layer 3 is directly attached to the object from which heat is to be dissipated, heat dissipation properties are also improved.
• the present invention can achieve both a thinner sheet and improved heat dissipation properties.
• the heat dissipation sheet 1 also includes a substrate 4 serving as a release sheet provided on the other side (the bottom side in Figure 1) of the fiber fixing layer 3 serving as an adhesive layer. This allows the substrate 4 to protect the fiber fixing layer 3 before it is attached to a semiconductor device, which is an example of an object, and prevents the adhesive strength of the fiber fixing layer 3 from unintentionally decreasing.
• the elastic modulus of the fiber fixing layer 3 at room temperature (25°C) is 0.2 MPa or more and 9 MPa or less, and that the elastic modulus of the fiber fixing layer 3 at room temperature (75°C) is 0.05 MPa or more and 4 MPa or less, and that the thickness T1 of the fiber fixing layer 3 is 10 ⁇ m or more and 100 ⁇ m or less.
• This synergistic effect allows the straight fibers 21 to be fixed more stably and for a long period of time at both room temperature and high temperatures, and provides excellent adhesion to semiconductor devices that tend to generate heat. Furthermore, durability can be improved.
• the present invention is configured so that the fiber fixing layer 3 is directly attached to the object that dissipates heat, setting the characteristics of the fiber fixing layer 3 as described above is extremely effective.
• the straight fibers 21 are preferably electrostatically flocked to the fiber fixing layer 3. Electrostatic flocking makes it relatively easy to form the straight fibers 21 having the above-described configuration. Therefore, below, we will explain as an example a method for manufacturing a heat dissipation sheet 1 having a heat dissipation layer 2, in which a heat dissipation layer 2 made of straight fibers 21 is formed using electrostatic flocking.
• FIG. 2 is a side view for explaining a manufacturing method for manufacturing the heat dissipation sheet shown in Fig. 1.
• the upper side in Fig. 2 will be referred to as “upper” and the lower side as “lower”.
• the heat dissipation sheet manufacturing apparatus 100 shown in Figure 2 has an electrode plate 110, a counter electrode plate 120, and a DC voltage generator 130.
• the electrode plate 110 is negatively charged by a DC voltage generator 130, which serves as a voltage application means.
• This electrode plate 110 has a holder 115 on the surface (underside) facing the counter electrode plate 120, and is configured so that the substrate 4 on which the fiber fixing layer 3 is formed can be held (placed) on the holder 115 with the fiber fixing layer 3 facing the counter electrode plate 120.
• the opposing electrode plate 120 is positively charged by a DC voltage generator 130, which serves as a voltage application means, and is positioned opposite the electrode plate 110.
• the counter electrode plate 120 is configured so that the straight fibers 21 for forming the heat dissipation layer 2 can be placed on the surface (upper surface) of the counter electrode plate 120 facing the electrode plate 110 .
• the positive and negative polarities of the electrode plate 110 and the counter electrode plate 120 may be reversed.
• the DC voltage generator 130 is a voltage application means for applying voltage to the electrode plate 110 and the counter electrode plate 120, and is electrically connected via wiring so that the electrode plate 110 side is the negative electrode and the counter electrode plate 120 side is the positive electrode.
• the heat dissipation sheet 1 is manufactured by the heat dissipation sheet manufacturing method using the heat dissipation sheet manufacturing apparatus 100 described above.
• the method for manufacturing a heat dissipation sheet includes a preparation step in which a substrate 4 having an uncured fiber fixing layer 3 is held in a holder 115 and the straight fibers 21 are placed on a counter electrode plate 120; an electrostatic implantation step in which a DC voltage generator 130 is operated to negatively charge the electrode plate 110 and positively charge the counter electrode plate 120, causing the straight fibers 21 to fly from the counter electrode plate 120 to the electrode plate 110, thereby implanting the straight fibers 21 into the fiber fixing layer 3; and a fixation step in which the fiber fixing layer 3 with the implanted straight fibers 21 is solidified or hardened, thereby fixing the straight fibers 21 to the fiber fixing layer 3.
• a substrate 4 having a pre-solidified or pre-cured fiber fixing layer 3 (adhesive layer) is prepared, and then this substrate 4 is held in a holder 115 so that the fiber fixing layer 3 faces the counter electrode plate 120. Additionally, straight fibers 21 are placed on the counter electrode plate 120.
• the pre-solidified or pre-hardened fiber fixing layer 3 and the straight fibers 21 are arranged opposite each other with a space between the electrode plate 110 and the counter electrode plate 120.
• the DC voltage generator 130 is activated to negatively charge the electrode plate 110 and positively charge the counter electrode plate 120, causing the straight fibers 21 to fly from the counter electrode plate 120 to the electrode plate 110, thereby implanting the straight fibers 21 into the fiber fixing layer 3 (implantation process).
• This hair transplantation process is carried out by operating the DC voltage generator 130 to apply a voltage between the electrode plate 110 and the counter electrode plate 120, thereby negatively charging the electrode plate 110 and positively charging the counter electrode plate 120, thereby generating an electrostatic field between the electrode plate 110 and the counter electrode plate 120.
• the straight fibers 21 placed on the counter electrode plate 120 are positively charged due to the counter electrode plate 120 being positively charged. Because the positive charge on the straight fibers 21 causes the electrode plate 110 to be negatively charged, the straight fibers 21 fly in the electrostatic field toward the electrode plate 110.
• the straight fiber 21 is long and flies in the vertical direction within the space (electrostatic field) between the electrode plate 110 and the counter electrode plate 120, with its base end facing the electrode plate 110 and its tip end facing the counter electrode plate 120.
• the holder 115 on the electrode plate 110 side holds the substrate 4 with the pre-solidified or pre-cured fiber fixing layer 3, with the fiber fixing layer 3 facing the counter electrode plate 120. Therefore, as shown in Figure 2(b), the straight fibers 21 flying from the counter electrode plate 120 side are fixed (implanted) to the surface of the fiber fixing layer 3 opposite the substrate 4, with part of their base end piercing (embedding) into the fiber fixing layer 3.
• the straight fibers 21 continue to fly from the opposing electrode plate 120 toward the electrode plate 110 until the planting density of the straight fibers 21 in the fiber fixing layer 3 reaches a preset density, after which the operation of the DC voltage generator 130 is stopped (see Figure 2(c)).
• the fiber fixing layer 3 with the straight fibers 21 implanted therein is solidified or hardened to fix the straight fibers 21 to the fiber fixing layer 3 (fixing process).
• the pre-solidified or pre-hardened fiber fixing layer 3 solidifies or hardens, and the straight fibers 21 are fixed with their base ends embedded in the fiber fixing layer 3 along the thickness direction (vertical direction) of the fiber fixing layer 3.
• a heat dissipation layer 2 is formed in which the straight fibers 21 are arranged upright in the vertical direction with the tip ends of the straight fibers 21 facing downward (opposite the fiber fixing layer 3).
• this fixing step is carried out by heating the fiber fixing layer 3.
• this fixing step is carried out by irradiating the fiber fixing layer 3 with light.
• the straight fibers 21 are fixed by the fiber fixing layer 3 with the base ends of the straight fibers 21 embedded in the fiber fixing layer 3 along the thickness direction (vertical direction) of the fiber fixing layer 3.
• FIG. 3 is a side view showing a second embodiment of the heat dissipation sheet of the present invention.
• the following description of the heat dissipation sheet 1 of the second embodiment will focus on the differences from the heat dissipation sheet 1 of the first embodiment, and will omit a description of similar points.
• the heat dissipation sheet 1 When viewed from above, the heat dissipation sheet 1 has a first region 2A where the straight fibers 21 are present, and a second region 2B where the straight fibers 21 are not present. In the first embodiment, when viewed from above, the entire heat dissipation sheet 1 can be considered to be the first region 2A.
• the density of the straight fibers 21 in the first region 2A is not particularly limited, but is preferably 10,000 fibers/cm 2 or more and 1,000,000 fibers/cm 2 or less.
• the density of the straight fibers 21 in the second region 2B is not particularly limited, but is preferably 0 fibers/cm 2 or more and 10,000 fibers/cm 2 or less.
• the first region 2A and the second region 2B are elongated and extend from the front of the page in Figure 3 toward the depth. Therefore, the second region 2B can be said to be a groove that extends from the front of the page in Figure 3 toward the depth.
• This configuration improves breathability in the second region 2B.
• first regions 2A and second regions 2B are not limited to the configuration shown in the illustration.
• the heat dissipation sheet 1 of this embodiment can be manufactured by placing masks corresponding to the first region 2A and the second region 2B below the fiber fixing layer 3 in Figure 2(b) and operating the DC voltage generator 130.
• regions where the fiber fixing layer 3 is present and regions where it is not present may be formed to correspond to the first region 2A and the second region 2B.
• the fiber fixing layer 3 may be removed along with the straight fibers 21 corresponding to the first region 2A and the second region 2B.
• each component can be replaced with any component that can exert a similar function, or any component can be added.
• An adhesive layer may be provided on the surface of the fiber fixing layer 3 that is to be attached to an object.
• the present invention provides a heat dissipation sheet that has excellent heat dissipation properties and is compact, particularly in the thickness direction. Therefore, the present invention has industrial applicability.

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• 2025
  • 2025-04-30 WO PCT/JP2025/016354 patent/WO2025234379A1/ja active Pending
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