JP7831699B1 - 放熱シート - Google Patents

放熱シート

Info

Publication number
JP7831699B1
JP7831699B1 JP2025537275A JP2025537275A JP7831699B1 JP 7831699 B1 JP7831699 B1 JP 7831699B1 JP 2025537275 A JP2025537275 A JP 2025537275A JP 2025537275 A JP2025537275 A JP 2025537275A JP 7831699 B1 JP7831699 B1 JP 7831699B1
Authority
JP
Japan
Prior art keywords
heat dissipation
adhesive layer
layer
fiber fixing
dissipation sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025537275A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025234379A1 (https=
JPWO2025234379A5 (https=
Inventor
猛 八月朔日
光太郎 ▲杉▼原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of JPWO2025234379A1 publication Critical patent/JPWO2025234379A1/ja
Application granted granted Critical
Publication of JP7831699B1 publication Critical patent/JP7831699B1/ja
Publication of JPWO2025234379A5 publication Critical patent/JPWO2025234379A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2025537275A 2024-05-09 2025-04-30 放熱シート Active JP7831699B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2024076836 2024-05-09
JP2024076836 2024-05-09
PCT/JP2025/016354 WO2025234379A1 (ja) 2024-05-09 2025-04-30 放熱シート

Publications (3)

Publication Number Publication Date
JPWO2025234379A1 JPWO2025234379A1 (https=) 2025-11-13
JP7831699B1 true JP7831699B1 (ja) 2026-03-17
JPWO2025234379A5 JPWO2025234379A5 (https=) 2026-04-14

Family

ID=97675274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025537275A Active JP7831699B1 (ja) 2024-05-09 2025-04-30 放熱シート

Country Status (2)

Country Link
JP (1) JP7831699B1 (https=)
WO (1) WO2025234379A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629148U (ja) * 1992-07-23 1994-04-15 株式会社神戸製鋼所 半導体パッケージ用のヒートシンク
JP2006100572A (ja) * 2004-09-29 2006-04-13 Fujitsu Ltd 放熱フィン及びその製造方法
JP2022150725A (ja) * 2021-03-26 2022-10-07 住友ベークライト株式会社 ヒートシンク

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629148U (ja) * 1992-07-23 1994-04-15 株式会社神戸製鋼所 半導体パッケージ用のヒートシンク
JP2006100572A (ja) * 2004-09-29 2006-04-13 Fujitsu Ltd 放熱フィン及びその製造方法
JP2022150725A (ja) * 2021-03-26 2022-10-07 住友ベークライト株式会社 ヒートシンク

Also Published As

Publication number Publication date
JPWO2025234379A1 (https=) 2025-11-13
WO2025234379A1 (ja) 2025-11-13

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