Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
  • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
  • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
  • C09J133/04—Homopolymers or copolymers of esters
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J201/00—Adhesives based on unspecified macromolecular compounds
  • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J7/35—Heat-activated
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate

Definitions

• the present invention relates to an adhesive composition, a coverlay, a bonding sheet, and an electronic substrate.
• Patent Document 1 discloses an adhesive composition for bonding automotive components, which contains a polymerizable monomer (A) and a block copolymer (B) having a polymer block (a) containing structural units derived from a styrene compound and structural units derived from a maleimide compound, and an acrylic polymer block (b).
• A polymerizable monomer
• B block copolymer
• the adhesive composition currently has difficulty maintaining excellent adhesion even after 3,000 hours of exposure to a high-temperature environment of 150°C. This is due to the lack of long-term heat resistance of the resins that make up these adhesive compositions.
• Imide-based adhesive compositions are known as adhesive compositions with relatively excellent heat resistance, but there is still room for improvement in the long-term moisture resistance and flexibility of bonded objects made using these imide-based adhesive compositions. As such, it has been difficult for conventional adhesive compositions to achieve both the required properties for various applications and long-term heat resistance.
• Fluoropolymers are also materials with excellent heat and moisture resistance, and fluoropolymer-based adhesive compositions using them exist.
• Patent Document 2 discloses an adhesive for electronic components made from a fluoropolymer having a fluorinated alicyclic structure and at least one coupling group within the molecule. Fluoropolymer-based adhesive compositions require special modification treatment of the fluoropolymer to improve the adhesive properties of the fluoropolymer. On the other hand, fluoropolymer-based adhesive compositions have excellent long-term heat resistance, maintaining sufficient peel strength even after exposure to an environment of 150°C for 3,000 hours.
• an adhesive composition that uses a blend of multiple polymers is an example of an adhesive composition that uses a blend of a fluoropolymer, which has excellent heat resistance, and an acrylic polymer, which is relatively inexpensive and has excellent adhesion.
• an adhesive composition that uses a blend of multiple polymers is an example of an adhesive composition that uses a blend of a fluoropolymer, which has excellent heat resistance, and an acrylic polymer, which is relatively inexpensive and has excellent adhesion.
• blends of fluoropolymer and acrylic polymer were incompatible with each other, and even when forced mixing was performed using methods such as roll kneading, there were cases where the polymers were poorly dispersed or did not exhibit the expected performance.
• adhesive compositions containing a blend of fluoropolymers and acrylic polymers have room for further improvement in terms of coatability and handleability.
• adhesive compositions for electronic circuit boards are often used by forming a uniform film of the cured adhesive composition with a thickness of 15 ⁇ m to 100 ⁇ m on a substrate such as a polyimide film.
• fluoropolymers and acrylic polymers which are incompatible with each other, cause layer separation in solvent-based systems. For this reason, it is difficult to coat solvent-based adhesive compositions containing a blend of these polymers with a uniform thickness on a substrate, making them difficult to use in practical applications.
• the gist and configuration of the present invention are as follows.
• the acrylic polymer contains at least one group selected from the group consisting of a carboxyl group and a hydroxyl group.
• the thermosetting resin comprises an epoxy resin.
• [5] The adhesive composition according to any one of [1] to [4] above, wherein the inorganic filler is at least one material selected from the group consisting of silica, aluminum hydroxide, calcium carbonate, and aluminum oxide.
• a coverlay comprising the adhesive composition according to any one of [1] to [6] above.
• a bonding sheet comprising the adhesive composition according to any one of [1] to [6] above, or a cured product of the adhesive composition.
• An electronic substrate comprising a cured product of the adhesive composition according to any one of [1] to [6] above.
• FIGS. 1A to 1C are diagrams illustrating a manufacturing process of an electronic substrate according to an embodiment.
• the adhesive composition of the present invention contains a modified fluoropolymer, an acrylic polymer, a thermosetting resin, and an inorganic filler.
• the thermosetting resin can improve the compatibility of the mutually incompatible modified fluoropolymer and acrylic polymer in a solvent system.
• an inorganic filler in the adhesive composition, the compatibility of the modified fluoropolymer and acrylic polymer can be further improved, and the dispersibility of the modified fluoropolymer and acrylic polymer can be improved.
• the adhesive composition of the present invention can achieve both long-term heat resistance and various properties required of an adhesive composition due to the synergistic effect of the modified fluoropolymer, acrylic polymer, thermosetting resin, and inorganic filler.
• the adhesive composition of the present invention has excellent long-term heat resistance, and therefore maintains excellent adhesive strength even after exposure to an environment at 150°C for 3,000 hours.
• conventional fluoropolymer-based adhesive compositions require roughening treatment or the like for the adherend (such as the glossy surface of copper foil)
• the adhesive composition of the present invention has excellent adhesion, so roughening treatment or the like is not necessary for the adherend.
• the properties required for an adhesive composition can be controlled by adjusting the weight-average molecular weight, Mooney viscosity, and glass transition temperature of the modified fluoropolymer and acrylic polymer, as well as the content ratio of the modified fluoropolymer and acrylic polymer.
• the properties required for an adhesive composition include coatability, flame retardancy, long-term moisture resistance, liquid storage stability, insulation reliability, peel strength, solvent resistance, solder heat resistance, etc., and the adhesive composition of the present invention or a cured product of the adhesive composition can have some or all of these properties.
• modified fluoropolymers are somewhat expensive, blending the modified fluoropolymer with an inexpensive acrylic polymer can reduce the overall cost of the adhesive composition.
• the modified fluoropolymer is then salted out and washed with water to remove hydrofluoric acid and other impurities.
• the adhesive composition of the present invention is used as an adhesive for electronic substrates such as FPCs (Flexible Printed Circuits)
• this salting out and washing process will affect the final insulation reliability and long-term heat resistance of the electronic substrate.
• the content of the modifying group in the modified fluoropolymer is not particularly limited, but is preferably 0.01 to 15 mol%, more preferably 0.05 to 10 mol%, and even more preferably 0.1 to 5 mol%, based on the total moles of the monomers constituting the modified fluoropolymer.
• the modifying group content is 0.1 mol% or more, the modification effect is sufficient, and in an example, the cured product of the adhesive composition exhibits sufficient crosslink density with the thermosetting resin. As a result, sufficient solder heat resistance and solvent resistance can be achieved.
• the modifying group content is 5 mol% or less, the modified fluoropolymer dissolves effectively in solvents and can be fully used as a varnish.
• the adhesive composition of the present invention contains a modified fluoropolymer and an acrylic polymer, and therefore exhibits excellent adhesion due to the synergistic effect of these polymers. Therefore, when using the adhesive composition of the present invention, prior roughening treatment of the substrate before bonding is not required.
• the adhesive composition is not particularly limited as long as it contains at least one monomer selected from the group consisting of acrylic acid monomers and methacrylic acid monomers as at least a portion of its constituent monomers, and one or more acrylic polymers can be used. At least a portion of the acrylic polymer preferably has reactive sites with a thermosetting resin, such as at least one group selected from the group consisting of carboxyl groups and hydroxyl groups, and is capable of crosslinking with the thermosetting resin.
• a thermosetting resin such as at least one group selected from the group consisting of carboxyl groups and hydroxyl groups
• the acrylic polymer contains reactive sites such as carboxyl groups and hydroxyl groups, it undergoes a crosslinking reaction with the thermosetting resin in the adhesive composition, thereby increasing the crosslink density with the thermosetting resin in the cured product of the adhesive composition and improving properties such as peel strength and solder heat resistance.
• acrylic polymers can also contain acrylic acid ester monomers and methacrylic acid ester monomers.
• acrylic polymer is a copolymer consisting of a monomer that does not contain a carboxyl group, such as ethyl acrylate (EA), butyl acrylate (BA), or methyl methacrylate (MMA), and a monomer that does contain a carboxyl group, such as methacrylic acid (MAA) or monobutyl fumarate (MBF).
• the proportion of monomers containing a carboxyl group or a hydroxyl group among the monomers that make up the acrylic polymer is preferably 0.01 to 5.0 wt%, and more preferably 0.1 to 3.0 wt%.
• the content of carboxyl groups and hydroxyl groups in the acrylic polymer containing carboxyl groups and hydroxyl groups is preferably 0.01 to 5.0 mol%, more preferably 0.05 to 4.0 mol%, and even more preferably 0.1 to 3.0 mol%, relative to the total number of moles of the monomers constituting the acrylic polymer.
• acrylic polymers can be used, such as PA522HF (trade name) (manufactured by Unimatec).
• the weight-average molecular weight of the acrylic polymer is not particularly limited, but is preferably 150,000 to 1,500,000, and more preferably 300,000 to 1,300,000.
• the acrylic polymer may further contain monomers other than acrylic acid monomers, methacrylic acid monomers, acrylic acid ester monomers, and methacrylic acid ester monomers, such as ethylene.
• acrylic polymers include ethylene-acrylic copolymers, and commercially available products such as Vamac Ultra IP (trade name) (manufactured by Celanese) can be used.
• the content of the acrylic polymer in the adhesive composition is preferably 5 to 50% by weight, more preferably 10 to 40% by weight, and even more preferably 15 to 30% by weight, based on 100% by weight of the total amount of components other than the solvent (modified fluoropolymer, acrylic polymer, thermosetting resin, inorganic filler, and optionally the curing agent and curing accelerator for the thermosetting resin, and additives other than the solvent).
• modified fluoropolymer, acrylic polymer, thermosetting resin, inorganic filler, and optionally the curing agent and curing accelerator for the thermosetting resin, and additives other than the solvent modified fluoropolymer, acrylic polymer, thermosetting resin, inorganic filler, and optionally the curing agent and curing accelerator for the thermosetting resin, and additives other than the solvent.
• a (modified fluoropolymer):(acrylic polymer) ratio of 8 or less:2 or more the adhesive composition maintains excellent long-term heat resistance while also providing excellent adhesion to smooth substrates, thereby enabling cost reduction.
• the adhesive composition can maintain excellent long-term heat resistance. More specifically, while conventional adhesive compositions containing acrylic polymers have had difficulty in achieving excellent long-term heat resistance, the adhesive composition of the present invention, by containing a modified fluoropolymer, can maintain excellent long-term heat resistance (e.g., maintain adhesive strength even after exposure to an environment of 150°C for 3,000 hours).
• inorganic filler The type of inorganic filler is not particularly limited, and one or more of silica, aluminum hydroxide, magnesium hydroxide, calcium hydroxide, calcium silicate, aluminum silicate, calcium carbonate, aluminum oxide, magnesium oxide, tin oxide, titanium oxide, manganese oxide, zirconium oxide, silicon nitride, aluminum nitride, boron nitride, talc, mica, kaolin, etc. can be used.
• aluminum hydroxide, magnesium hydroxide, and calcium hydroxide also function as flame retardants, but are considered to be included in the "inorganic filler" category in this specification.
• inorganic fillers it is preferable to include at least one material selected from the group consisting of silica, aluminum hydroxide, calcium carbonate, and aluminum oxide, and it is more preferable to include silica.
• silica By including silica as an inorganic filler, even a small amount can significantly improve the coating stability of the adhesive composition.
• the inorganic filler may be an inorganic filler that has been hydrophobized.
• hydrophobization treatments include silicone oil treatment and silane coupling agent treatment.
• the content of inorganic filler in the adhesive composition is not particularly limited, but is preferably 3.0 to 120 parts by weight, more preferably 10 to 100 parts by weight, and even more preferably 15 to 90 parts by weight, per 100 parts by weight of the total weight of the modified fluoropolymer and acrylic polymer.
• the inorganic filler content be 3 parts by weight or more per 100 parts by weight of the total weight of the modified fluoropolymer and acrylic polymer, the compatibility and dispersibility of the modified fluoropolymer and acrylic polymer can be further improved.
• the inorganic filler content be 120 parts by weight or less per 100 parts by weight of the total weight of the modified fluoropolymer and acrylic polymer, it is possible to prevent coating defects due to increased viscosity of the adhesive composition, air inclusion during lamination, and reduced adhesive strength.
• thermosetting resin is not particularly limited as long as it is a resin that cures upon heat treatment.
• One or more of epoxy resins, phenolic resins, xylene resins, guanamine resins, diallyl phthalate resins, vinyl ester resins, unsaturated polyester resins, furan resins, polyimide resins, polyurethane resins, cyanate resins, maleimide resins, benzocyclobutene resins, etc. can be used.
• epoxy resins are preferred in terms of reactivity, heat resistance, and adhesion to substrates.
• epoxy resins are capable of crosslinking with both modified fluoropolymers and acrylic polymers, which can contribute to improving the crosslink density with the modified fluoropolymers and acrylic polymers in the cured product of the adhesive composition.
• the long-term heat resistance and solder heat resistance of the cured product of the adhesive composition can be improved.
• epoxy resins can be used, including bisphenol-type epoxy resins such as bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, and bisphenol S-type epoxy resin; novolac-type epoxy resins such as cresol novolac-type epoxy resin, phenol novolac-type epoxy resin, and bisphenol A novolac-type epoxy resin; alicyclic epoxy resins; aliphatic chain epoxy resins; diglycidyl ether compounds of biphenols; diglycidyl ethers of naphthalenediol; diglycidyl ethers of phenols; diglycidyl ethers of alcohols; and alkyl-substituted and hydrogenated versions of these.
• bisphenol-type epoxy resins such as bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, and bisphenol S-type epoxy resin
• novolac-type epoxy resins such as cresol novolac-type epoxy resin, phenol novolac-type epoxy resin, and bisphenol A novolac-type epoxy resin
• the content of the thermosetting resin in the adhesive composition is preferably 1.0 to 30% by weight, more preferably 2.0 to 20% by weight, and even more preferably 3.0 to 15% by weight, based on 100% by weight of the total amount of components other than the solvent (modified fluoropolymer, acrylic polymer, thermosetting resin, inorganic filler, and optionally the curing agent and curing accelerator for the thermosetting resin, and the total amount of additives other than the solvent). Having the content of the thermosetting resin in the adhesive composition within these ranges ensures excellent compatibility between the modified fluoropolymer and the acrylic polymer.
• the adhesive composition may contain an amine compound as a curing agent for the thermosetting resin.
• the amine compound is preferably an aromatic diamine compound.
• the amount of the curing agent for the thermosetting resin used is preferably 0 to 70 parts by weight, more preferably 1 to 50 parts by weight, and even more preferably 3 to 30 parts by weight, per 100 parts by weight of the thermosetting resin.
• the adhesive composition may contain imidazoles as curing accelerators to accelerate curing.
• imidazole compounds used as curing accelerators include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-(2-cyanoethyl)2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 2,4-diamino-6-[2-methylimidazoline-(1)]-ethyl s-triazine, and 2,4,6-tris(dimethylaminomethyl)phenol.
• the amount of the curing accelerator for thermosetting resins used is preferably 0 to 10 parts by weight, more preferably 0.1 to 5.0 parts by weight, and even more preferably 1.0 to 3.0 parts by weight, per 100 parts by weight of the thermosetting resin.
• the adhesive composition may contain a solvent as needed.
• solvents include acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), toluene, xylene, methanol, ethanol, 1-propanol, 2-propanol (IPA), 1-butanol, 2-butanol, cyclohexane, cyclohexanone, cyclohexanol, n-hexane, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, and N-methylpyrrolidone (NMP).
• NMP N-methylpyrrolidone
• solvents may be used alone or in combination of two or more.
• a solvent in the adhesive composition By containing a solvent in the adhesive composition, other components can be dissolved, improving the coatability of the adhesive composition.
• solvents with different volatility such as methyl ethyl ketone (MEK), toluene, ethyl acetate, and isobutyl acetate, foaming of the coating film of the adhesive composition can be suppressed when the adhesive composition is applied and then dried.
• MEK methyl ethyl ketone
• toluene ethyl acetate
• isobutyl acetate foaming of the coating film of the adhesive composition can be suppressed when the adhesive composition is applied and then dried.
• the adhesive composition may contain additives other than the modified fluoropolymer, acrylic polymer, thermosetting resin, and inorganic filler, as needed.
• modified fluoropolymers have excellent flame retardancy
• the adhesive composition may not contain a flame retardant.
• the adhesive composition may contain a certain amount of flame retardant to meet the flame retardancy requirements.
• flame retardants include phosphorus-based flame retardants, nitrogen-based flame retardants, and metal hydroxides.
• the metal hydroxide flame retardant is aluminum hydroxide, magnesium hydroxide, or calcium hydroxide
• the aluminum hydroxide, magnesium hydroxide, or calcium hydroxide also functions as an "inorganic filler.”
• aluminum hydroxide, magnesium hydroxide, and calcium hydroxide are referred to herein as "inorganic fillers.”
• the adhesive composition may contain known additives, such as dispersants, antifoaming agents, and rheology control agents, as needed.
• the method for producing the adhesive composition is not particularly limited, but examples include a method in which a first solution containing a modified fluoropolymer and a second solution containing an acrylic polymer are prepared, and the first solution, the second solution, a thermosetting resin, an inorganic filler, and, if necessary, a curing agent for the thermosetting resin, a curing accelerator, and additives are mixed in a mixing device such as a ball mill to produce the adhesive composition.
• Heat may be applied during mixing of the raw materials for the adhesive composition, or heat may be applied to the resulting adhesive composition. Applying heat during mixing of the raw materials for the adhesive composition can improve the solubility of the raw materials for the adhesive composition.
• heating a solvent-containing adhesive composition can promote the crosslinking reaction between the modified fluoropolymer and acrylic polymer and the thermosetting resin, thereby increasing viscosity and thereby favorably controlling coatability.
• the adhesive composition contains a modified fluoropolymer, an acrylic polymer, a thermosetting resin, and an inorganic filler.
• the modified fluoropolymer and the acrylic polymer are not crosslinked to the thermosetting resin, and the thermosetting resin is not cured.
• the modified fluoropolymer is crosslinked to the thermosetting resin via the modifying groups introduced into the modified fluoropolymer by the modification treatment, and the acrylic polymer is crosslinked to the thermosetting resin via carboxyl groups, hydroxyl groups, or the like.
• the heat treatment conditions are not particularly limited, but the temperature is preferably 140 to 200°C, more preferably 150 to 190°C, and even more preferably 160 to 180°C, and the time is preferably 1 to 24 hours, more preferably 2 to 18 hours, and even more preferably 3 to 12 hours.
• the adhesive composition can be used for various purposes, and can be used as an adhesive composition for a coverlay, a bonding sheet, an electronic substrate (e.g., FPC), etc. More specifically, it can be used as a coverlay for an electronic substrate containing the adhesive composition, a bonding sheet containing the adhesive composition or a cured product of the adhesive composition, an electronic substrate containing a cured product of the adhesive composition, etc.
• FIG. 1 is a diagram illustrating the manufacturing process for an electronic substrate 10 according to one embodiment, which includes a cured product of the adhesive composition of the present invention. As shown in FIG. 1(a), after a copper foil layer 2 is formed on a base film 1 such as polyimide, a photoresist layer 3 is further formed on the copper foil layer 2.
• a base film 1 such as polyimide
• the adhesive composition contained in the bonding sheet 5, or a cured product of the adhesive composition are excellent in some or all of the following properties: coatability, liquid storage stability, initial peel strength, long-term heat resistance, long-term moisture resistance, insulation reliability, solvent resistance, and solder heat resistance.
• Examples 1 to 8 A commercially available fluoropolymer (Viton A500 (trade name); manufactured by Chemours) was subjected to alkali modification treatment to obtain a modified fluoropolymer having 0.8 mol% of unsaturated bonds in the molecule relative to the total moles of the monomers constituting the modified fluoropolymer.
• the coverlay prepared so that the thickness of the adhesive composition after drying would be 40 ⁇ m, was bonded to a polyimide film (Apical 25NPI (trade name); manufactured by Kaneka Corporation) in a vacuum press at 170°C and 2 MPa, and then post-cured (hardened) in an oven (PH-202 (trade name; manufactured by ESPEC Corporation) at 160°C for 6 hours to obtain evaluation sample B.
• a polyimide film (Apical 25NPI (trade name); manufactured by Kaneka Corporation) in a vacuum press at 170°C and 2 MPa
• PH-202 trade name; manufactured by ESPEC Corporation
• the adhesive compositions of Examples 1 to 8 contain modified fluoropolymer, acrylic polymer, thermosetting resin, and inorganic filler (silica, aluminum hydroxide). Therefore, the cured products of these adhesive compositions have excellent heat resistance (peel strength) of 0.4 N/mm or more over an extended period of time, and also have excellent flame retardancy, solder heat resistance after humidification, and coatability.
• the adhesive compositions of Comparative Examples 1 and 2 did not contain a modified fluoropolymer, and therefore the cured products of these adhesive compositions had a peel strength of 0.2 N/mm after 3,000 hours at 150°C, indicating poor long-term heat resistance, and their flame retardancy was also poor, resulting in a poor rating of "X.”
• the adhesive composition of Comparative Example 3 did not contain inorganic fillers (silica and aluminum hydroxide), resulting in poor dispersion of the modified fluoropolymer and acrylic polymer, making application of the adhesive composition difficult and preventing measurement of other properties.
• the adhesive composition of Comparative Example 4 did not contain an acrylic polymer, and therefore the cured products of this adhesive composition had poor heat resistance, with an initial peel strength of 0.2 N/mm and a peel strength of 0.2 N/mm after a 1,000-hour heat resistance test at 85°C and 85% relative humidity.
• the solder heat resistance after humidification was also low, at " ⁇ 230.”
• the adhesive composition of Comparative Example 5 did not contain a modified fluoropolymer, its solder heat resistance after humidification was low at " ⁇ 230".

Landscapes

• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Inorganic Chemistry (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Adhesive Tapes (AREA)

Priority Applications (1)

Applications Claiming Priority (4)

Publications (1)

Family

ID=97138722

Family Applications (1)

Country Status (3)

Citations (5)

• 2024
  • 2024-12-27 JP JP2025570889A patent/JPWO2025197246A1/ja active Pending
  • 2024-12-27 WO PCT/JP2024/046398 patent/WO2025197246A1/ja active Pending
• 2025
  • 2025-03-11 TW TW114108938A patent/TW202544203A/zh unknown

Patent Citations (5)

Also Published As

Similar Documents

Legal Events