WO2025169636A1 - フレキシブル多層回路基板、及びフレキシブル多層回路基板集合体 - Google Patents

フレキシブル多層回路基板、及びフレキシブル多層回路基板集合体

Info

Publication number
WO2025169636A1
WO2025169636A1 PCT/JP2024/046004 JP2024046004W WO2025169636A1 WO 2025169636 A1 WO2025169636 A1 WO 2025169636A1 JP 2024046004 W JP2024046004 W JP 2024046004W WO 2025169636 A1 WO2025169636 A1 WO 2025169636A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating layer
circuit board
precursor
multilayer circuit
flexible multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/046004
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
直斗 永見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2025543802A priority Critical patent/JPWO2025169636A1/ja
Publication of WO2025169636A1 publication Critical patent/WO2025169636A1/ja
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a flexible multilayer circuit board and a flexible multilayer circuit board assembly.
  • a wired circuit board As a flexible multilayer circuit board, for example, a wired circuit board has been proposed that includes a porous insulating layer and a conductor layer, arranged in that order toward one side in the thickness direction, and the conductor layer has a first wiring portion and a second wiring portion that is thicker than the first wiring portion (see Patent Document 1).
  • the flexible multilayer circuit board 60 shown in Figure 9 is manufactured by the method shown in Figures 10A to 10G, which will be described below.
  • first connection via precursors 56A are formed so as to penetrate the prepared first insulating layer precursor 52A of the laminate in the thickness direction (FIG. 10B).
  • the wiring portion precursor 54A is selectively etched to form the wiring portion 54, thereby obtaining a first precursor circuit board 70A (FIG. 10C).
  • a second circuit board precursor 70B is prepared, which includes a second conductor layer 53, a second insulating layer precursor 52B arranged on one thickness side of the second conductor layer 53, and a second connecting via precursor 56B that penetrates the second insulating layer precursor 52B in the thickness direction ( Figure 10D).
  • the first circuit board precursor 70A and the second circuit board precursor 70B are arranged so that the wiring portion 54 and the second insulating layer precursor 52B face each other (FIG. 10E).
  • the first circuit board precursor 70A and the second circuit board precursor 70B are bonded together so that the first connection via precursor 56A and the second connection via precursor 56B are in contact with each other.
  • the present invention aims to provide a flexible multilayer circuit board that can suppress fluctuations in the electrical characteristics of the wiring section, and a flexible multilayer circuit board assembly that can suppress fluctuations in the electrical characteristics of the wiring section.
  • a flexible wiring board assembly having: The flexible multilayer circuit board is the flexible multilayer circuit board according to any one of [1] to [3]. Flexible multilayer circuit board assembly.
  • the present invention provides a flexible multilayer circuit board that can suppress fluctuations in the electrical characteristics of the wiring portion, and a flexible multilayer circuit board assembly that can suppress fluctuations in the electrical characteristics of the wiring portion.
  • FIG. 1A is a schematic diagram of one embodiment of a flexible multilayer circuit board.
  • FIG. 1B is a cross-sectional view of the flexible multilayer circuit board of FIG. 1A taken along the line AA.
  • FIG. 2A is a schematic diagram (part 1) for explaining one embodiment of a method for manufacturing a flexible multilayer circuit board.
  • FIG. 2B is a schematic diagram (part 2) for explaining one embodiment of a method for manufacturing a flexible multilayer circuit board.
  • FIG. 2C is a schematic diagram (part 3) for explaining one embodiment of a method for manufacturing a flexible multilayer circuit board.
  • FIG. 2D is a schematic diagram (part 4) for explaining one embodiment of a method for manufacturing a flexible multilayer circuit board.
  • FIG. 1A is a schematic diagram of one embodiment of a flexible multilayer circuit board.
  • FIG. 1B is a cross-sectional view of the flexible multilayer circuit board of FIG. 1A taken along the line AA.
  • FIG. 2A is a schematic diagram (part 1)
  • FIG. 7 is a schematic diagram of another embodiment of a flexible multilayer circuit board.
  • FIG. 8A is a schematic diagram of one embodiment of a flexible multi-layer circuit board assembly.
  • FIG. 8B is a cross-sectional view of the flexible multi-layer circuit board assembly of FIG. 8A taken along line AA.
  • FIG. 9 is a schematic diagram of an example of a conventional flexible multilayer circuit board.
  • FIG. 10A is a schematic diagram for explaining an example of a method for manufacturing a conventional flexible multilayer circuit board (part 1).
  • FIG. 10B is a schematic diagram for explaining an example of a method for manufacturing a conventional flexible multilayer circuit board (part 2).
  • FIG. 10C is a schematic diagram for explaining an example of a method for manufacturing a conventional flexible multilayer circuit board (part 3).
  • FIG. 10A is a schematic diagram for explaining an example of a method for manufacturing a conventional flexible multilayer circuit board (part 1).
  • FIG. 10B is a schematic diagram for explaining an example of a method for
  • the flexible multilayer circuit board of the present invention comprises an insulating layer, a first conductor layer, a second conductor layer, a wiring portion, and a connection via.
  • the first conductor layer is disposed on one side of the insulating layer in the thickness direction.
  • the second conductor layer is disposed on the other side of the insulating layer in the thickness direction.
  • the wiring portion is embedded in the insulating layer.
  • the connection via connects the first conductor layer and the second conductor layer, and penetrates the insulating layer in the thickness direction.
  • the flexible multilayer circuit board further comprises non-connecting vias. The non-connection vias are embedded in the insulating layer and do not penetrate the insulating layer in the thickness direction.
  • the non-connected vias are significantly harder than the insulating layer and are less likely to deform under pressure.
  • the flexible multilayer circuit board of the present invention can suppress deformation of the insulating layer due to pressure when manufacturing the flexible multilayer circuit board. As a result, fluctuations in the electrical characteristics of the wiring portion of the flexible multilayer circuit board can be suppressed.
  • FIG. 1A is a schematic diagram of one embodiment of a flexible multilayer circuit board, the schematic diagram being a cross-sectional view perpendicular to the length of the wiring portion.
  • FIG. 1B is a cross-sectional view of the flexible multilayer circuit board of FIG. 1A taken along the line AA.
  • 1A includes an insulating layer 2, a first conductor layer 1, a second conductor layer 3, a wiring portion 4, and a connection via 6.
  • the flexible multilayer circuit board 10 further includes a non-connection via 5.
  • the first conductor layer 1 is disposed on one side in the thickness direction of the insulating layer 2.
  • the first conductor layer 1 is in contact with the insulating layer 2 on one side in the thickness direction of the insulating layer 2.
  • the thickness direction of the insulating layer 2 is the vertical direction on the paper surface in FIG. 1A .
  • the second conductor layer 3 is disposed on the other side in the thickness direction of the insulating layer 2.
  • the second conductor layer 3 is in contact with the insulating layer 2 on the other side in the thickness direction of the insulating layer 2.
  • the other side is opposite to the one side.
  • the wiring portion 4 is embedded in the insulating layer 2.
  • the wiring portion 4 transmits, for example, an electrical signal.
  • the connection vias 6 electrically connect the first conductor layer 1 and the second conductor layer 3.
  • the connection vias 6 penetrate the insulating layer 2 in the thickness direction.
  • the non-connection vias 5 are embedded in the insulating layer 2 and do not penetrate the insulating layer 2 in the thickness direction.
  • the first conductor layer 1 and the second conductor layer 3 extend in the length direction of the wiring portion 4.
  • the length direction of the wiring portion 4 is a direction perpendicular to the up-down direction and left-right direction of the paper in Fig. 1A, and is the up-down direction of the paper in Fig. 1B. 1B
  • the connection vias 6 are aligned in rows in the longitudinal direction of the wiring portion 4.
  • the connection vias 6 have the role of, for example, earthing weak currents that affect the wiring portion 4.
  • the non-connection vias 5 are regularly scattered in the longitudinal direction of the wiring portion 4.
  • the arrangement of the non-connection vias 5 in the longitudinal direction of the wiring portion 4 may be regularly scattered or irregularly scattered, but regularly scattered is preferable.
  • the pressure applied to the insulating layer 2 during the manufacture of a flexible multilayer circuit board can be evenly distributed, and deformation of the insulating layer 2 due to pressure can be further suppressed.
  • the plurality of unconnected vias 5 are each electrically connected to the first conductor layer 1 or the second conductor layer 3, but the unconnected vias 5 may or may not be electrically connected to the first conductor layer 1 or the second conductor layer 3.
  • the unconnected vias 5 can be said to be completely embedded in the insulating layer 2.
  • the material of the wiring portion is not particularly limited, and examples thereof include metal materials such as copper, nickel, gold, solder, and alloys of two or more of these.
  • the thickness of the wiring portion is not particularly limited and is, for example, 3 ⁇ m or more, preferably 5 ⁇ m or more, and for example, 50 ⁇ m or less, preferably 30 ⁇ m or less. Note that, since the wiring portion is embedded in the insulating layer, the thickness of the wiring portion is usually thinner than the thickness of the insulating layer.
  • the ratio (X 2 :Y 2 ) of the length (X 2 ) of the non-connected via in the length direction of the wiring portion to the length (Y 2 ) of the non-connected via in the width direction of the wiring portion may be, for example, 3: 1 to 1:3, or 1:2 to 2:1, or may be 1:1.
  • the ratio (X 2 :Y 2 ) is 1:1, the shape of the non-connected via in a cross section perpendicular to the thickness direction of the flexible multilayer circuit board is, for example, square or circular.
  • FIGS. 2A and 1B An embodiment of a method for manufacturing the flexible multilayer circuit board shown in FIGS. 1A and 1B will be described with reference to FIGS. 2A to 2G.
  • a laminate of a wiring portion precursor 4A and a first insulating layer precursor 2A is prepared (FIG. 2A). Both the wiring portion precursor 4A and the first insulating layer precursor 2A are layer-shaped.
  • first connection via precursors 6A and non-connection vias 5 are formed to penetrate the prepared first insulating layer precursor 2A in the thickness direction of the laminate (FIG. 2B).
  • a circuit board second precursor 20B which includes a second conductor layer 3, a second insulating layer precursor 2B disposed on one side of the second conductor layer 3 in the thickness direction, and a second connection via precursor 6B and a non-connection via 5 penetrating the second insulating layer precursor 2B in the thickness direction (FIG. 2D).
  • the second insulating layer precursor 2B is layered.
  • the method for forming the second connection via precursor 6B and the non-connection via 5 is not particularly limited, and examples include a method in which through holes are formed in the second insulating layer precursor 2B using a laser, and then the second connection via precursor 6B and the non-connection via 5 are filled into the formed through holes by plating.
  • the non-connection vias 5 may be filled in non-through holes formed in the insulating layer first precursor 2C, in which case the non-connection vias 5 do not penetrate the insulating layer first precursor 2C in the thickness direction.
  • the non-connection vias 5 do not need to be in electrical contact with the second conductor layer 3.
  • the first precursor connection via 6C penetrates the first precursor insulating layer 2C in the thickness direction and is in electrical contact with the second conductor layer 3.
  • the second precursor circuit board 20D includes a second precursor insulating layer 2D, a non-connection via 5, and a second precursor connection via 6D.
  • the non-connection vias 5 penetrate the insulating layer second precursor 2D in the thickness direction.
  • the non-connection vias 5 may be filled in non-through holes formed in the insulating layer second precursor 2D, in which case the non-connection vias 5 do not penetrate the insulating layer second precursor 2D in the thickness direction.
  • the second connection via precursor 6D penetrates the second insulating layer precursor 2D in the thickness direction.
  • the third circuit board precursor 20E includes a third insulating layer precursor 2E, a first conductor layer 1, non-connection vias 5, and a third connection via precursor 6E.
  • the first conductor layer 1 is disposed on one side in the thickness direction of the third insulating layer precursor 2E.
  • the non-connection vias 5 penetrate the insulating layer third precursor 2E in the thickness direction.
  • the non-connection vias 5 are in electrical contact with the first conductor layer 1.
  • the non-connection vias 5 may be filled in non-through holes formed in the insulating layer third precursor 2E, in which case the non-connection vias 5 do not penetrate the insulating layer third precursor 2E in the thickness direction.
  • the non-connection vias 5 do not need to be in electrical contact with the first conductor layer 1.
  • the third connection via precursor 6E penetrates the third insulating layer precursor 2E in the thickness direction and is in electrical contact with the first conductor layer 1.
  • the first circuit board precursor 20C, the second circuit board precursor 20D, and the third circuit board precursor 20E are bonded together so that the first connection via precursor 6C and the second connection via precursor 6D are in contact, and the second connection via precursor 6D and the third connection via precursor 6E are in contact.
  • the first insulating layer precursor 2C, the second insulating layer precursor 2D, and the third insulating layer precursor 2E are integrated to form the insulating layer 2.
  • the first connection via precursor 6C, the second connection via precursor 6D, and the third connection via precursor 6E are integrated to form the connection via 6.
  • the flexible multilayer circuit board 10 shown in Figure 3 is obtained.
  • the third precursor circuit board 20H includes a third precursor insulating layer 2H, a non-connection via 5, and a third precursor connection via 6H.
  • the non-connection vias 5 penetrate the third insulating layer precursor 2H in the thickness direction. Note that the non-connection vias 5 may be filled in non-penetrating holes formed in the third insulating layer precursor 2H, in which case the non-connection vias 5 do not penetrate the third insulating layer precursor 2H in the thickness direction.
  • the third connection via precursor 6H penetrates the third insulating layer precursor 2H in the thickness direction.
  • the fourth circuit board precursor 20I includes a fourth insulating layer precursor 2I, a first conductor layer 1, a non-connection via 5, and a fourth connection via precursor 6I.
  • the first conductor layer 1 is disposed on one side in the thickness direction of the fourth insulating layer precursor 2I.
  • the non-connection vias 5 penetrate the fourth insulating layer precursor 2I in the thickness direction.
  • the non-connection vias 5 are in electrical contact with the first conductor layer 1.
  • the non-connection vias 5 may be filled in non-through holes formed in the fourth insulating layer precursor 2I, in which case the non-connection vias 5 do not penetrate the fourth insulating layer precursor 2I in the thickness direction.
  • the non-connection vias 5 do not need to be in electrical contact with the first conductor layer 1.
  • the fourth connection via precursor 6I penetrates the fourth insulating layer precursor 2I in the thickness direction.
  • the fourth connection via precursor 6I is in electrical contact with the first conductor layer 1.
  • the first circuit board precursor 20F, the second circuit board precursor 20G, the third circuit board precursor 20H, and the fourth circuit board precursor 20I are bonded together so that the first connection via precursor 6F and the second connection via precursor 6G are in contact, the second connection via precursor 6G and the third connection via precursor 6H are in contact, and the third connection via precursor 6H and the fourth connection via precursor 6I are in contact.
  • the first insulating layer precursor 2F, the second insulating layer precursor 2G, the third insulating layer precursor 2H, and the fourth insulating layer precursor 2I are integrated to form the insulating layer 2.
  • the first connection via precursor 6F, the second connection via precursor 6G, the third connection via precursor 6H, and the fourth connection via precursor 6I are integrated to form the connection via 6.
  • the flexible multilayer circuit board 10 shown in FIG. 5 is obtained.
  • FIG. 7 is a schematic diagram of another embodiment of a flexible multilayer circuit board. This schematic diagram is a cross-sectional view perpendicular to the longitudinal direction of the wiring portion.
  • the flexible multilayer circuit board shown in FIG. 7 has the same structure as the flexible multilayer circuit board shown in FIG. 1A, except that the wiring portion 4 has two signal lines (a first signal line 41 and a second signal line 42).
  • 7 includes an insulating layer 2, a first conductor layer 1, a second conductor layer 3, a wiring portion 4, and a connection via 6.
  • the flexible multilayer circuit board 10 further includes a non-connection via 5.
  • the first conductor layer 1 is disposed on one side in the thickness direction of the insulating layer 2.
  • the first conductor layer 1 is in contact with the insulating layer 2 on one side in the thickness direction of the insulating layer 2.
  • the thickness direction of the insulating layer 2 is the vertical direction on the paper surface in FIG.
  • the second conductor layer 3 is disposed on the other side in the thickness direction of the insulating layer 2.
  • the second conductor layer 3 is in contact with the insulating layer 2 on the other side in the thickness direction of the insulating layer 2.
  • the other side is opposite to the one side.
  • the wiring portion 4 is embedded in the insulating layer 2 .
  • the connection vias 6 electrically connect the first conductor layer 1 and the second conductor layer 3.
  • the connection vias 6 penetrate the insulating layer 2 in the thickness direction.
  • the non-connection vias 5 are embedded in the insulating layer 2 and do not penetrate the insulating layer 2 in the thickness direction.
  • the wiring section 4 has two signal lines (a first signal line 41 and a second signal line 42).
  • the first signal line 41 and the second signal line 42 form differential wiring for differential signal transmission.
  • Flexible multilayer circuit boards are used as flexible multilayer circuit boards for high-speed transmission in electronic devices such as mobile phones, smartphones, tablet devices, and digital cameras, as they become smaller, lighter, and more functional.
  • the flexible multilayer circuit board assembly of the present invention includes a plurality of flexible multilayer circuit boards and a frame portion.
  • the frame portion is formed on the outer periphery of the plurality of flexible multilayer circuit boards.
  • Each flexible multilayer circuit board is used after being separated from the flexible multilayer circuit board assembly.
  • the timing of separating each flexible multilayer circuit board from the flexible multilayer circuit board assembly is not particularly limited, and may be, for example, after or before components are mounted.
  • the frame portion includes, for example, a third conductor layer and a fourth conductor layer.
  • the material of the third conductor layer and the fourth conductor layer is not particularly limited and may be, for example, a metal material, such as copper, nickel, gold, solder, or an alloy of two or more of these.
  • the thickness of the third conductor layer and the fourth conductor layer is not particularly limited and is, for example, 3 ⁇ m or more, preferably 5 ⁇ m or more, and for example, 50 ⁇ m or less, preferably 30 ⁇ m or less. It is preferable that the third conductor layer is integral with each of the first conductor layers of the plurality of flexible multilayer circuit boards, in terms of facilitating the production of the flexible multilayer circuit board assembly.
  • the fourth conductor layer is integral with each of the second conductor layers of the plurality of flexible multilayer circuit boards, in terms of facilitating the production of the flexible multilayer circuit board assembly.
  • the third conductor layer being integral with each of the first conductor layers of the plurality of flexible multilayer circuit boards means that the third conductor layer and the first conductor layer are formed from a single plate material.
  • the fourth conductor layer being integral with each of the second conductor layers of the plurality of flexible multilayer circuit boards means that the fourth conductor layer and the second conductor layer are formed from a single plate material.
  • the frame portion includes, for example, a second insulating layer.
  • materials constituting the second insulating layer include resins.
  • the second insulating layer includes, for example, resins.
  • resins include polycarbonate resins, polyimide resins, fluorinated polyimide resins, epoxy resins, phenolic resins, urea resins, melamine resins, diallyl phthalate resins, silicone resins, thermosetting urethane resins, fluororesins, cycloolefin polymers, and liquid crystal polymers.
  • Preferred examples include polyimide resins, cycloolefin polymers, and liquid crystal polymers.
  • the thickness of the second insulating layer is not particularly limited and is, for example, 5 ⁇ m or more, preferably 10 ⁇ m or more, and for example, 1000 ⁇ m or less, preferably 600 ⁇ m or less.
  • the second insulating layer may be porous or non-porous.
  • the flexible multilayer circuit board 10 includes an insulating layer 2, a first conductor layer 1, a second conductor layer 3, a wiring portion 4, and a connection via 6.
  • the flexible multilayer circuit board 10 further includes a non-connection via 5.
  • the first conductor layer 1 is disposed on one side in the thickness direction of the insulating layer 2.
  • the first conductor layer 1 is in contact with the insulating layer 2 on one side in the thickness direction of the insulating layer 2.
  • the thickness direction of the insulating layer 2 is the vertical direction on the paper surface in FIG. 8B .
  • the second conductor layer 3 is disposed on the other side in the thickness direction of the insulating layer 2.
  • the second conductor layer 3 is in contact with the insulating layer 2 on the other side in the thickness direction of the insulating layer 2.
  • the other side is opposite to the one side.
  • the wiring portion 4 is embedded in the insulating layer 2.
  • the wiring portion 4 transmits, for example, an electrical signal.
  • the connection vias 6 electrically connect the first conductor layer 1 and the second conductor layer 3.
  • the connection vias 6 penetrate the insulating layer 2 in the thickness direction.
  • the non-connection vias 5 are embedded in the insulating layer 2 and do not penetrate the insulating layer 2 in the thickness direction.
  • the frame portion 11 in the flexible multilayer circuit board assembly 100 shown in Figure 8A comprises a second insulating layer 22, a third conductor layer 21 arranged on one thickness-wise side of the second insulating layer 22, a fourth conductor layer 23 arranged on the other thickness-wise side of the second insulating layer 22, and a non-connected via 5 embedded in the second insulating layer 22 and not penetrating the second insulating layer 22 in the thickness direction.
  • the arrangement of the non-connection vias 5 in the frame portion 11 is not particularly limited, and they may be scattered regularly or irregularly, but it is preferable that they are scattered regularly.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2024/046004 2024-02-07 2024-12-25 フレキシブル多層回路基板、及びフレキシブル多層回路基板集合体 Pending WO2025169636A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025543802A JPWO2025169636A1 (https=) 2024-02-07 2024-12-25

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024017334 2024-02-07
JP2024-017334 2024-02-07

Publications (1)

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JP (1) JPWO2025169636A1 (https=)
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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745916A (ja) * 1993-07-28 1995-02-14 Fuji Electric Co Ltd プリント配線基板
JPH1012993A (ja) * 1996-06-27 1998-01-16 Rohm Co Ltd 電子部品の製造方法、電子部品の出荷形態化方法、電子部品集合体、およびこの電子部品集合体の使用方法
JP2000246363A (ja) * 1999-03-02 2000-09-12 Ricoh Co Ltd 打抜加工用基板、打抜基板及び該打抜基板の製造方法
JP2005322878A (ja) * 2004-04-09 2005-11-17 Dainippon Printing Co Ltd 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法
JP2012191054A (ja) * 2011-03-11 2012-10-04 Kyocera Corp 多数個取り配線基板および配線基板
JP2013131727A (ja) * 2011-12-22 2013-07-04 Ibiden Co Ltd 配線板及びその製造方法
WO2017119248A1 (ja) * 2016-01-07 2017-07-13 株式会社村田製作所 多層基板、電子機器及び多層基板の製造方法
JP2020013978A (ja) * 2018-07-13 2020-01-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板及びこれを含むバッテリモジュール
JP2022189927A (ja) * 2018-09-28 2022-12-22 日東電工株式会社 ロール体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013093366A (ja) * 2011-10-24 2013-05-16 Yamaichi Electronics Co Ltd フレキシブル配線基板およびその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745916A (ja) * 1993-07-28 1995-02-14 Fuji Electric Co Ltd プリント配線基板
JPH1012993A (ja) * 1996-06-27 1998-01-16 Rohm Co Ltd 電子部品の製造方法、電子部品の出荷形態化方法、電子部品集合体、およびこの電子部品集合体の使用方法
JP2000246363A (ja) * 1999-03-02 2000-09-12 Ricoh Co Ltd 打抜加工用基板、打抜基板及び該打抜基板の製造方法
JP2005322878A (ja) * 2004-04-09 2005-11-17 Dainippon Printing Co Ltd 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法
JP2012191054A (ja) * 2011-03-11 2012-10-04 Kyocera Corp 多数個取り配線基板および配線基板
JP2013131727A (ja) * 2011-12-22 2013-07-04 Ibiden Co Ltd 配線板及びその製造方法
WO2017119248A1 (ja) * 2016-01-07 2017-07-13 株式会社村田製作所 多層基板、電子機器及び多層基板の製造方法
JP2020013978A (ja) * 2018-07-13 2020-01-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板及びこれを含むバッテリモジュール
JP2022189927A (ja) * 2018-09-28 2022-12-22 日東電工株式会社 ロール体

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