TW202532225A - 撓性多層電路基板及撓性多層電路基板集合體 - Google Patents

撓性多層電路基板及撓性多層電路基板集合體

Info

Publication number
TW202532225A
TW202532225A TW113151110A TW113151110A TW202532225A TW 202532225 A TW202532225 A TW 202532225A TW 113151110 A TW113151110 A TW 113151110A TW 113151110 A TW113151110 A TW 113151110A TW 202532225 A TW202532225 A TW 202532225A
Authority
TW
Taiwan
Prior art keywords
insulating layer
multilayer circuit
circuit board
flexible multilayer
conductive layer
Prior art date
Application number
TW113151110A
Other languages
English (en)
Chinese (zh)
Inventor
永見直斗
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202532225A publication Critical patent/TW202532225A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW113151110A 2024-02-07 2024-12-27 撓性多層電路基板及撓性多層電路基板集合體 TW202532225A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024017334 2024-02-07
JP2024-017334 2024-02-07

Publications (1)

Publication Number Publication Date
TW202532225A true TW202532225A (zh) 2025-08-16

Family

ID=96699624

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113151110A TW202532225A (zh) 2024-02-07 2024-12-27 撓性多層電路基板及撓性多層電路基板集合體

Country Status (3)

Country Link
JP (1) JPWO2025169636A1 (https=)
TW (1) TW202532225A (https=)
WO (1) WO2025169636A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745916A (ja) * 1993-07-28 1995-02-14 Fuji Electric Co Ltd プリント配線基板
JP3609539B2 (ja) * 1996-06-27 2005-01-12 ローム株式会社 電子部品の製造方法、電子部品の出荷形態化方法、電子部品集合体、およびこの電子部品集合体の使用方法
JP4494546B2 (ja) * 1999-03-02 2010-06-30 株式会社リコー 打抜加工用基板、打抜基板及び該打抜基板の製造方法
JP2005322878A (ja) * 2004-04-09 2005-11-17 Dainippon Printing Co Ltd 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法
JP2012191054A (ja) * 2011-03-11 2012-10-04 Kyocera Corp 多数個取り配線基板および配線基板
JP2013093366A (ja) * 2011-10-24 2013-05-16 Yamaichi Electronics Co Ltd フレキシブル配線基板およびその製造方法
JP5385967B2 (ja) * 2011-12-22 2014-01-08 イビデン株式会社 配線板及びその製造方法
JP6516023B2 (ja) * 2016-01-07 2019-05-22 株式会社村田製作所 多層基板、電子機器及び多層基板の製造方法
KR102597160B1 (ko) * 2018-07-13 2023-11-02 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 배터리 모듈
JP7288546B2 (ja) * 2018-09-28 2023-06-07 日東電工株式会社 ロール体

Also Published As

Publication number Publication date
WO2025169636A1 (ja) 2025-08-14
JPWO2025169636A1 (https=) 2025-08-14

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