JPWO2025169636A1 - - Google Patents

Info

Publication number
JPWO2025169636A1
JPWO2025169636A1 JP2025543802A JP2025543802A JPWO2025169636A1 JP WO2025169636 A1 JPWO2025169636 A1 JP WO2025169636A1 JP 2025543802 A JP2025543802 A JP 2025543802A JP 2025543802 A JP2025543802 A JP 2025543802A JP WO2025169636 A1 JPWO2025169636 A1 JP WO2025169636A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025543802A
Other languages
Japanese (ja)
Other versions
JPWO2025169636A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025169636A1 publication Critical patent/JPWO2025169636A1/ja
Publication of JPWO2025169636A5 publication Critical patent/JPWO2025169636A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2025543802A 2024-02-07 2024-12-25 Pending JPWO2025169636A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024017334 2024-02-07
PCT/JP2024/046004 WO2025169636A1 (ja) 2024-02-07 2024-12-25 フレキシブル多層回路基板、及びフレキシブル多層回路基板集合体

Publications (2)

Publication Number Publication Date
JPWO2025169636A1 true JPWO2025169636A1 (https=) 2025-08-14
JPWO2025169636A5 JPWO2025169636A5 (https=) 2026-01-15

Family

ID=96699624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025543802A Pending JPWO2025169636A1 (https=) 2024-02-07 2024-12-25

Country Status (3)

Country Link
JP (1) JPWO2025169636A1 (https=)
TW (1) TW202532225A (https=)
WO (1) WO2025169636A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745916A (ja) * 1993-07-28 1995-02-14 Fuji Electric Co Ltd プリント配線基板
JPH1012993A (ja) * 1996-06-27 1998-01-16 Rohm Co Ltd 電子部品の製造方法、電子部品の出荷形態化方法、電子部品集合体、およびこの電子部品集合体の使用方法
JP2000246363A (ja) * 1999-03-02 2000-09-12 Ricoh Co Ltd 打抜加工用基板、打抜基板及び該打抜基板の製造方法
JP2013093366A (ja) * 2011-10-24 2013-05-16 Yamaichi Electronics Co Ltd フレキシブル配線基板およびその製造方法
WO2017119248A1 (ja) * 2016-01-07 2017-07-13 株式会社村田製作所 多層基板、電子機器及び多層基板の製造方法
JP2022189927A (ja) * 2018-09-28 2022-12-22 日東電工株式会社 ロール体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322878A (ja) * 2004-04-09 2005-11-17 Dainippon Printing Co Ltd 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法
JP2012191054A (ja) * 2011-03-11 2012-10-04 Kyocera Corp 多数個取り配線基板および配線基板
JP5385967B2 (ja) * 2011-12-22 2014-01-08 イビデン株式会社 配線板及びその製造方法
KR102597160B1 (ko) * 2018-07-13 2023-11-02 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 배터리 모듈

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745916A (ja) * 1993-07-28 1995-02-14 Fuji Electric Co Ltd プリント配線基板
JPH1012993A (ja) * 1996-06-27 1998-01-16 Rohm Co Ltd 電子部品の製造方法、電子部品の出荷形態化方法、電子部品集合体、およびこの電子部品集合体の使用方法
JP2000246363A (ja) * 1999-03-02 2000-09-12 Ricoh Co Ltd 打抜加工用基板、打抜基板及び該打抜基板の製造方法
JP2013093366A (ja) * 2011-10-24 2013-05-16 Yamaichi Electronics Co Ltd フレキシブル配線基板およびその製造方法
WO2017119248A1 (ja) * 2016-01-07 2017-07-13 株式会社村田製作所 多層基板、電子機器及び多層基板の製造方法
JP2022189927A (ja) * 2018-09-28 2022-12-22 日東電工株式会社 ロール体

Also Published As

Publication number Publication date
TW202532225A (zh) 2025-08-16
WO2025169636A1 (ja) 2025-08-14

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