WO2025124265A1 - 盖体装置、工艺腔室及半导体工艺设备 - Google Patents

盖体装置、工艺腔室及半导体工艺设备 Download PDF

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Publication number
WO2025124265A1
WO2025124265A1 PCT/CN2024/136985 CN2024136985W WO2025124265A1 WO 2025124265 A1 WO2025124265 A1 WO 2025124265A1 CN 2024136985 W CN2024136985 W CN 2024136985W WO 2025124265 A1 WO2025124265 A1 WO 2025124265A1
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WO
WIPO (PCT)
Prior art keywords
cover
cover body
seat
process chamber
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/136985
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English (en)
French (fr)
Other versions
WO2025124265A9 (zh
Inventor
刘东旭
王广永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Publication of WO2025124265A1 publication Critical patent/WO2025124265A1/zh
Publication of WO2025124265A9 publication Critical patent/WO2025124265A9/zh
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof

Definitions

  • the present application belongs to the field of semiconductor technology, and specifically relates to a cover device, a process chamber and semiconductor process equipment.
  • an embodiment of the present application discloses a cover device, the disclosed cover device comprises a cover, a connecting seat and a cover seat, the first end of the cover seat is rotatably connected to the connecting seat, the cover seat has a first state and a second state, the second end of the cover seat is rotatable around the first end of the cover seat, so that the cover seat switches between the first state and the second state;
  • the cover In a first state at the cover seat, the cover is inclined relative to the plane where the opening is located, and the cover is movable between a position avoiding the opening and a position opposite to the opening;
  • the cover body seat can drive the cover body to rotate to the second state where the cover body is parallel to the plane where the opening is located and drive the cover body to squeeze the first sealing ring.
  • an embodiment of the present application discloses a semiconductor process equipment, and the disclosed semiconductor process equipment includes the process chamber described in the second aspect.
  • the cover device disclosed in the embodiment of the present application can make the cover rotate under the drive of the cover seat, so as to change the inclination angle of the cover, and can move when the cover is inclined relative to a preset plane.
  • the cover since the cover can be tilted and thus move away from the first sealing ring for sealing the opening of the chamber body or drive the first sealing ring for sealing the opening of the chamber body away from the chamber body, it is possible to avoid the wear of the first sealing ring during the movement of the cover.
  • the wear of the first sealing ring can be alleviated, so that the cover and the chamber body can be better sealed through the first sealing ring. It can be seen that the cover device disclosed in the embodiment of the present application is conducive to improving the sealing performance of the process chamber.
  • the first end of the cover body seat only rotates relative to the connecting seat, so that the first end of the cover body seat does not need to occupy a large movable space, which is beneficial to further reduce the space occupied by the process chamber above it.
  • FIG2 is an exploded schematic diagram of a partial structure of a process chamber disclosed in one embodiment of the present application with the cover in an open state;
  • FIG3 is a schematic diagram of a process chamber disclosed in an embodiment of the present application with the cover in an open state;
  • FIG4 is a top view of FIG3
  • Fig. 5 is a right side view of Fig. 2;
  • FIG6 is a schematic diagram of a process chamber disclosed in another embodiment of the present application.
  • FIG7 is a partial schematic diagram of a chamber body disclosed in an embodiment of the present application.
  • FIG8 is a schematic diagram of a partial structure of a process chamber disclosed in an embodiment of the present application.
  • FIG8 is essentially a perspective view, and some outlines are indicated by dotted lines;
  • FIG9 is an exploded schematic diagram of the cooperation between the lifting structure and the sealing cavity disclosed in the embodiment of the present application.
  • FIG10 is a schematic diagram of FIG9 after assembly
  • FIG11 is a top view of FIG10
  • FIG12 is a right side view of FIG10
  • FIG. 13 is a schematic diagram of the structure of the process chamber disclosed in an embodiment of the present application.
  • 60-pressing mechanism 61-third driving mechanism, 62-pressing member, 601-first right angle side, 602-second right angle side, 63-fourth driving mechanism,
  • 70-waste liquid output pipe 71-main pipe, 72-first branch pipe, 73-second branch pipe, 74-third branch pipe, 75-second switch valve, 76-third switch valve, 77-liquid discharge buffer tank, 78-negative pressure exhaust pipe, 79-negative pressure pump, 701-fourth switch valve, 702-connecting pipe,
  • the chamber body 001 is a main peripheral component of the process space of the process chamber, and the chamber body 001 is provided with an opening, which is connected to the internal space of the chamber body 001.
  • the cover body 002 is rotatably provided on the chamber body 001, so as to switch between an open state and a closed state by rotating relative to the chamber body 001.
  • the cover 002 rotates to a position covering the opening and can compress the first sealing ring, so that the first sealing ring is compressed between the cover 002 and the chamber body 001, thereby achieving a seal between the cover 002 and the chamber body 001.
  • the cover 002, the first sealing ring and the chamber body 001 enclose a process space.
  • the first sealing ring is conducive to achieving a sealed isolation between the process space and the external environment of the process chamber.
  • the embodiment of the present application discloses a cover device.
  • the disclosed cover device can be used as a part of the process chamber and applied to the process chamber.
  • the disclosed cover device can adjust the posture of the cover so as to avoid the wear of the first sealing ring during the opening or closing of the cover.
  • the cover body 12 In the first state of the cover body seat 42, the cover body 12 is tilted relative to the preset plane.
  • the preset plane can be a plane parallel to the plane where the opening 02 of the chamber body 11 is located, or a plane where the opening 02 is located, or a surface substantially parallel to the plane where the opening 02 of the chamber body 11 is located.
  • the cover body 12 in the first state of the cover body seat 42, the cover body 12 is tilted relative to the preset plane, so that the cover body 12 will not cause the first sealing ring 13 to wear during the movement.
  • the process chamber involved in the embodiment of the present application involves a first sealing ring.
  • the first sealing ring 13 can be fixedly connected to the cover 12 and move with the cover 12 relative to the chamber body 11.
  • the cover 12 drives the first sealing ring 13 to tilt together, so that the first sealing ring 13 is away from the chamber body 11, so that the cover 12 will not cause the first sealing ring 13 to rub against the chamber body 11 during the movement.
  • the first sealing ring 13 can be fixedly connected to the chamber body 11 and arranged around the opening 02, and the first sealing ring 13 will not move with the cover 12.
  • the cover device disclosed in the embodiment of the present application can make the cover 12 rotate under the drive of the cover seat 42, so as to change the inclination angle of the cover 12, and can move when the cover 12 is inclined relative to a preset plane.
  • the cover 12 since the cover 12 can be moved away from the first sealing ring 13 for sealing the opening 02 of the chamber body 11 by tilting, or the cover 12 drives the first sealing ring 13 for sealing the opening 02 of the chamber body 11 away from the chamber body 11 by tilting, it is possible to avoid the wear of the first sealing ring 13 during the movement of the cover 12.
  • the wear of the first sealing ring 13 can be alleviated, so that the cover 12 and the chamber body 11 can be better sealed through the first sealing ring 13. It can be seen that the cover device disclosed in the embodiment of the present application is conducive to improving the sealing performance of the process chamber.
  • the cover device disclosed in the embodiment of the present application may also include a first driving mechanism 43, which is arranged on the cover seat 42 and connected to the cover 12.
  • the first driving mechanism 43 is used to drive the cover 12 to move when the cover seat 42 is in the first state.
  • the first driving mechanism 43 can be a linear motor, a telescopic cylinder, a telescopic hydraulic cylinder, etc., and the embodiment of the present application does not limit the specific type of the first driving mechanism 43.
  • the first driving mechanism 43 can be connected to the cover 12 through a connecting piece 404. During the driving process, the first driving mechanism 43 can drive the connecting piece 404 to move, and the movement of the connecting piece 404 will drive the cover 12 to move, thereby realizing the driving of the cover 12 to move.
  • the first limiting portion and the second limiting portion have opposite limiting directions.
  • the second limiting portion can be a second limiting buffer portion 47, which is an elastic structural member (such as a rubber block, a spring, etc.) and has a buffering function, so that the second limiting buffer portion 47 can also play a buffering function during the limiting contact with the cover body 12 to avoid rigid collision.
  • the first end of the cover seat 42 may be provided with an opening detection sensor 401, and the cover 12 may be provided with an opening detection trigger 402.
  • the opening detection trigger 402 triggers the opening detection sensor 401, so that the opening detection sensor 401 sends a signal that can indicate that the cover 12 is opened.
  • the first driving mechanism 43 can be closed after receiving this signal.
  • the cover 12 In the first state of the cover seat 42, the cover 12 is inclined relative to the plane where the opening 02 is located (for example, inclined by 0.7-0.8° relative to the plane). In the second state of the cover seat 42, the cover 12 is parallel to the plane where the opening 02 is located. In essence, the cover seat 42 can change the angle between the cover 12 and the plane where the opening 02 is located by rotating.
  • the cover 12 In the first state of the cover seat 42, the cover 12 is inclined relative to the plane where the opening 02 is located, and the cover 12 is movable between a position avoiding the opening 02 and a position opposite to the opening 02. It should be noted that when the cover 12 is at a position opposite to the opening 02, the cover 12 is located directly above the opening 02, and the orthographic projection of the cover 12 on the opening 02 can cover the opening 02.
  • the cover seat 42 can rotate to the first state, thereby preparing for the cover 12 to move toward the open state.
  • the cover seat 42 drives the cover 12 to rotate to the second state in which it is parallel to the plane where the opening 02 is located and drives the cover 12 to press the first sealing ring 13, so that the first sealing ring 13 can be clamped between the cover 12 and the chamber body 11, and finally the cover 12 is in the closed state.
  • the cover seat 42 drives the cover 12 to rotate to the second state, the cover seat 42 will drive the cover 12 to squeeze and press the first sealing ring 13.
  • the cover body seat 42 is in the first state by rotating, and at this time, the cover body 12 is in a state of being inclined relative to the plane where the opening 02 is located (for example, inclined 0.7 to 0.8 degrees relative to the plane where the opening 02 is located) driven by the cover body seat 42. Then, the cover body 12 moves to a position relative to the opening 02 relative to the cover body seat 42 so as to be located above the opening 02. Then, the cover body seat 42 rotates to the second state so that the cover body 12 rotates to a position parallel to the plane where the opening 02 is located so as to compress the first sealing ring 13.
  • the first sealing ring 13 can be compressed between the cover body 12 and the chamber body 11 under the action of the cover body 12, thereby achieving a seal between the cover body 12 and the chamber body 11.
  • the cover body 12 is in an inclined state and will not cause relative friction with the first sealing ring 13 during the movement or will not cause relative friction between the first sealing ring 13 and the chamber body 11 during the movement.
  • the cover seat 42 switches from the second state (at this time, the cover 12 is in a closed state where the first sealing ring 13 is sealed and pressed to form a seal connecting the cover 12 and the chamber body 11) to the first state by rotating, so that the cover 12 is separated from the first sealing ring 13 or the cover 12 drives the first sealing ring 13 to separate from the chamber body 11, and then the cover 12 moves relative to the cover seat 42 to a position misaligned with the opening 02, so that the cover 12 is in an open state.
  • the cover 12 is separated from the first sealing ring 13 by tilting or the cover 12 drives the first sealing ring 13 to separate from the chamber body 11 by tilting, so that the cover 12 will not have relative friction with the first sealing ring 13 during the movement or the first sealing ring 13 will not have relative friction with the chamber body 11 during the movement.
  • the process chamber disclosed in the embodiment of the present application has the cover body 12 movably arranged on the cover body seat 42 that can rotate, so that the cover body seat 42 can guide the cover body 12 to move obliquely relative to the plane where the opening 02 is located in the first state, so as to move between the position avoiding the opening 02 and the position opposite to the opening 02, so that the cover body 12 will not cause the first sealing ring 13 to wear during the process of opening or closing, thereby avoiding the problem of poor sealing caused by the wear of the first sealing ring 13.
  • the process chamber disclosed in the embodiment of the present application only needs the cover body seat 42 to drive the cover body 12 to rotate to an inclined position that can separate the cover body 12 from the first sealing ring 13 or the cover body 12 drives the first sealing ring 13 to separate from the chamber body 11, without driving the cover body 12 to rotate too large an angle, thereby alleviating the occupation of the upper space of the process chamber.
  • the first end of the cover seat 42 only rotates relative to the connecting seat 41, so that the first end of the cover seat 42 does not need to occupy a large movable space, which is beneficial to further reduce the space occupied by the process chamber above it.
  • the first sealing ring 13 can be fixed to the cover 12, so as to move with the cover 12 relative to the chamber body 11.
  • the first sealing ring 13 can also be fixed to the chamber body 11, so that the cover 12 moves relative to the chamber body 11 and the first sealing ring 13.
  • the embodiment of the present application does not limit whether the first sealing ring 13 is installed on the cover 12 or the chamber body 11, as long as it is ensured that the first sealing ring 13 can be pressed by the cover 12 and sealed between the cover 12 and the chamber body 11 when the cover 12 is closed.
  • the chamber body 11 may include a surrounding plate 111 surrounding the opening 02, and the surrounding plate 111 has a large area, thereby facilitating the arrangement of the first sealing ring 13.
  • the surrounding plate 111 may be provided with an annular groove surrounding the opening 02, and the first sealing ring 13 may be fixed in the annular groove, thereby achieving stable installation.
  • the rotational connection between the cover body seat 42 and the connection seat 41 can be realized by a variety of structures.
  • the first end of the cover body seat 42 can be rotatably connected to the connection seat 41 by means of an axis hinge.
  • the connection seat 41 can be installed with a hinge shaft 406, and the first end of the cover body seat 42 can be rotatably connected to the connection seat 41 by means of the hinge shaft 406.
  • the first end of the cover body seat 42 can be rotatably installed on the connection seat 41 by means of a flexible member or an elastic member.
  • the embodiment of the present application does not limit the specific rotational connection method between the first end of the cover body seat 42 and the connection seat 41.
  • all rails 44 and cover seats 42 can be located on the same side of the edge of the opening 02, as shown in Figure 2.
  • This distribution method can avoid the rails 44 occupying the side where the other edges of the opening 02 are located, which is beneficial for the process chamber to occupy a smaller space in other directions.
  • the cover 12 when the cover device includes a first limiting portion, the cover 12 can contact with the first limiting portion when it moves to a position opposite to the opening 02 (ie, a first preset position), thereby preventing the cover 12 from excessively moving along the cover seat 42 .
  • the cover 12 when the cover device includes a second limiting portion, the cover 12 may come into limiting contact with the second limiting portion when it moves to a position avoiding the opening 02 (ie, the second preset position).
  • a closing detection sensor 48 is provided at the second end of the cover seat 42 and a closing detection trigger 49 is provided on the cover 12 , when the cover 12 moves to a position opposite to the opening 02 , the closing detection trigger 49 triggers the closing detection sensor 48 .
  • the process chamber disclosed in the embodiment of the present application may also include a pressing mechanism 60, which can be fixed on the outer wall of the chamber body 11.
  • the pressing mechanism 60 is used to apply pressure to the cover body 12 to squeeze the first sealing ring 13, so that the cover body 12 can better press the first sealing ring 13, and finally the first sealing ring 13 can be better pressed to play a sealing function.
  • the clamping mechanism 60 can be a clamping mechanism. As long as the mechanism can drive the cover body 12 to press the first sealing ring 13 on the chamber body 11, it can be used as the clamping mechanism 60 in the embodiment of the present application. Please refer to Figures 2 to 5 again.
  • the clamping mechanism 60 may include: a third driving mechanism 61 and a clamping member 62.
  • the third driving mechanism 61 can be fixedly connected to the outer wall of the chamber body 11, and the clamping member 62 is connected to the telescopic end of the third driving mechanism 61 to achieve driving cooperation.
  • the third driving mechanism 61 is used to drive the clamping member 62 to switch between a loose state and a clamping state.
  • part of the structure of the clamping member 62 abuts against the side of the cover body 12 facing away from the chamber body 11, and presses the cover body 12 toward the chamber body 11 to squeeze the first sealing ring 13.
  • the pressing member 62 is at least separated from the cover body 12 , thereby providing conditions for the movement of the cover body 12 .
  • the pressing member 62 no longer abuts against the cover body 12 .
  • the edge of the cover 12 is between the partial structure of the pressing member 62 used to abut against the cover 12 and the chamber body 11. Since the cover 12 moves relative to the chamber body 11, the partial structure of the pressing member 62 used to abut against the cover 12 is located above the cover 12, and the chamber body 11 is located below the cover 12. Under the drive of the third driving mechanism 61, the pressing member 62 can be tightened, so that the pressing member 62 presses the cover 12 against the chamber body 11. Of course, the third driving mechanism 61 pushes the pressing member 62 upward to separate the structure of the pressing member 62 located above the cover 12 from the cover 12, thereby loosening the cover 12.
  • the structure of the clamping member 62 can be various.
  • the clamping member 62 can be an L-shaped structural member, and includes a first right-angled side 601 and a second right-angled side 602 that are perpendicularly connected to each other.
  • the first right-angled side 601 is connected to the telescopic end of the third driving mechanism 61 to achieve a driving connection.
  • the edge of the cover body 12 is located between the second right-angled side 602 and the chamber body 11.
  • the angle between the first right-angled side 601 and the second right-angled side 602 can be adjusted to change the structure of the clamping member 62, and the purpose of clamping can also be achieved.
  • the embodiment of the present application does not limit the specific structure of the clamping member 62.
  • This structure enables the clamping member 62 to switch between the loose state and the clamped state only by telescopically moving the third driving mechanism 61.
  • the structure is simple and the operation is relatively simple.
  • the clamping mechanism 60 may further include: a fourth driving mechanism 63, the fourth driving mechanism 63 may be fixed to the telescopic end of the third driving mechanism 61, so that the third driving mechanism 61 drives the fourth driving mechanism 63 to move through the telescopic end.
  • the clamping member 62 is arranged at the telescopic end of the fourth driving mechanism 63, and the fourth driving mechanism 63 is used to drive the clamping member 62 to switch between the first position and the second position.
  • the clamping member 62 When the clamping member 62 is in the first position, the clamping member 62 is located on the side of the cover body 12 facing away from the chamber body 11, and the third driving mechanism 61 can drive the clamping member 62 to switch between the clamping state and the loosening state through the fourth driving mechanism 63.
  • the cover body 12 In the clamping state, the cover body 12 can clamp the first sealing ring 13, and in the loosening state, the cover body 12 can loosen the first sealing ring 13.
  • the clamping member 62 When the clamping member 62 is in the second position, the clamping member 62 and the cover body 12 are staggered, that is, the clamping member 62 avoids the side of the cover body 12 facing away from the chamber body 11. In this case, the clamping member 62 will not interfere with the rotation of the cover body 12 with the cover body seat 42, nor will it interfere with the movement of the cover body 12.
  • the fourth driving mechanism 63 can drive the pressing member 62 to switch between the first position and the second position, there is no need to impose too many restrictions on the structure of the pressing member 62.
  • the pressing member 62 can be a flat plate-shaped structural member, or other structural members.
  • the process chamber disclosed in the embodiment of the present application may also include: a pipeline 03, a sealing plate 05, a second sealing ring 06 and a sealing joint 08.
  • the chamber body 11 may be provided with a mounting hole 04.
  • the sealing plate 05 is detachably fixed on the mounting hole 04 on the chamber body 11, and the mounting hole 04 is sealed by the second sealing ring 06.
  • the sealing plate 05 is provided with a connecting hole 07.
  • the pipeline 03 can be detachably connected to the connecting hole 07 through the sealing joint 08 to communicate with the internal space of the chamber body 11.
  • the pipeline 03 in the embodiment of the present application may include the drying gas input pipe 31, the water film removal gas input pipe 32, the cleaning liquid input pipe 33, the waste liquid output pipe 70, etc. described later, and of course may also include pipelines with other functions configured in the process chamber, which is not limited by the embodiment of the present application.
  • the process chamber disclosed in the embodiment of the present application is a cleaning chamber, please refer to Figures 8 to 13.
  • the process chamber disclosed in the embodiment of the present application includes a sealed chamber 10, a cleaning tank 20, a lifting mechanism 50, and a carrier 80 for carrying a wafer 90.
  • the sealed chamber 10 includes the chamber body 11, the cover 12, and the first sealing ring 13 described above.
  • the cleaning tank 20 and the carrier 80 are arranged in the chamber body 11, and are also located in the process space 01 surrounded by the cover 12, the first sealing ring 13, and the chamber body 11.
  • the space above the cleaning tank 20 in the sealed cavity 10 can be a dry space.
  • the space in the cleaning tank 20 is a cleaning space.
  • the lifting mechanism 50 is at least partially disposed in the sealed cavity 10 and connected to the carrier 80. The lifting mechanism 50 is used to drive the carrier 80 to move up and down between the dry space and the cleaning space.
  • the sealed cavity 10 has an overflow space, which is lower than the overflow port of the cleaning tank 20 (this overflow port can be the notch of the cleaning tank 20, or an overflow hole slightly lower than the notch of the cleaning tank 20), and the overflow space is located outside the cleaning tank 20.
  • the lifting mechanism 50 may be entirely located within the sealed cavity 10, or may be partially located within the sealed cavity 10 and the other part located outside the sealed cavity 10, as shown in FIGS. 8 to 12. Considering that the power source of the lifting mechanism 50 is not suitable to be in a special environment, in some embodiments, a part of the lifting mechanism 50 may be located within the sealed cavity 10, and the other part at least includes the power source and may be located outside the sealed cavity 10. Of course, in this case, the lifting mechanism 50 needs to be sealed with the sealed cavity 10 to prevent the connection between the lifting mechanism 50 and the sealed cavity 10 from connecting the process space 01 and the external environment of the process chamber.
  • the lifting mechanism 50 may include a first substrate 51, a cap 52, a first connecting member 53, a lifting rod 59, a telescopic sleeve 54, a third sealing ring 55, a fourth sealing ring 56 and a fifth sealing ring 57.
  • the first end of the lifting rod 59 is located outside the sealed cavity 10 and is used to connect with the power source.
  • the power source can be a hydraulic telescopic part, a pneumatic telescopic part, a linear motor, etc.
  • the function of the power source is to drive the lifting rod 59 to move up and down.
  • the second end of the lifting rod 59 extends into the sealed cavity 10 and is connected to the first substrate 51 through the first connecting member 53.
  • the cap 52 is sealed on the part of the first connecting member 53 exposed to the first board surface of the first substrate 51 through the third sealing ring 55.
  • the third sealing ring 55 realizes the sealing isolation between the assembly gap between the first connecting member 53 and the first substrate 51 and the process space 01.
  • the first substrate 51 has a first board surface and a second board surface arranged oppositely.
  • the third sealing ring 55 is sleeved on the outer peripheral wall of the lifting rod 59.
  • the cap 52 is sealed on the part of the first connecting member 53 exposed to the first board surface through the third sealing ring 55.
  • the first connecting member 53 can be a screw, a bolt, a rivet, etc., and the embodiment of the present application does not limit the specific type of the first connecting member 53.
  • the telescopic sleeve 54 can be located in the sealed cavity 10 and is sleeved outside the lifting rod 59, that is, the lifting rod 59 is inserted into the telescopic sleeve 54, and the first end of the telescopic sleeve 54 is sealed and docked on the second plate surface of the first substrate 51 through the fourth sealing ring 56, that is, the fourth sealing ring 56 is also sleeved on the outer peripheral wall of the lifting rod 59, and the first end of the telescopic sleeve 54 is sealed and docked on the second plate surface of the first substrate 51 through the fourth sealing ring 56.
  • the fourth sealing ring 56 enables the first end of the telescopic sleeve 54 to be sealed with the second plate surface, and then the internal space of the telescopic sleeve 54 (which is actually connected to the external environment of the process chamber) and the process space 01 can be sealed and isolated at the position where the first end of the telescopic sleeve 54 is located.
  • the second end of the telescopic sleeve 54 is sealed and connected to the sealed cavity 10 through the fifth sealing ring 57 sleeved outside the lifting rod 59.
  • the fifth sealing ring 57 is sleeved on the outer peripheral wall of the lifting rod 59, and the second end of the telescopic sleeve 54 is sealed and connected to the sealed cavity 10 through the fifth sealing ring 57, and the first substrate 51 is connected to the carrier 80.
  • the fifth sealing ring 57 enables sealing between the second end of the telescopic sleeve 54 and the sealing cavity 10 , thereby enabling sealed isolation between the inner space of the telescopic sleeve 54 and the process space 01 at the position where the second end of the telescopic sleeve 54 is located.
  • the telescopic sleeve 54 is sealed and docked with the second board surface of the first substrate 51 through the fourth sealing ring 56, and the second end of the telescopic sleeve 54 is sealed and docked with the sealed cavity 10 through the fifth sealing ring 57.
  • the second end of the lifting rod 59 extending into the sealed cavity 10 is connected to the first substrate 51 through the first connecting member 53, and the cap 52 is covered on the portion of the first connecting member 53 exposed to the first board surface of the first substrate 51 through the third sealing ring 55.
  • the lifting rod 59 one part of which is located outside the sealed cavity 10 and the other part of which is located inside the sealed cavity 10, can ensure connection with the carrier 80 while also ensuring sealed isolation between the process space 01 and the external environment of the process chamber.
  • the second end of the telescopic sleeve 54 can be fixedly connected to the sealed cavity 10 through multiple second connectors 501, and the fifth sealing ring 57 can surround the multiple second connectors 501, thereby preventing the process space 01 from communicating with the connection gaps of the multiple second connectors 501, and finally ensuring sealing.
  • the second connector 501 can be a screw, a bolt, a rivet, etc., and the embodiment of the present application does not limit the specific type of the second connector 501.
  • multiple third connecting members 502 can pass through the first substrate 51 and be connected to the first end of the telescopic sleeve 54.
  • the multiple third connecting members 502 are distributed around the fourth sealing ring 56. Under the premise of ensuring the isolation function of the fourth sealing ring 56, the multiple third connecting members 502 can be simultaneously connected to the first substrate 51, the cap 52 and the first end of the telescopic sleeve 54, thereby achieving the purpose of multiple connections with fewer third connecting members 502.
  • the portion where the lifting rod 59 and the sealing chamber 10 are slidably matched is isolated outside the process space 01 , so that particles will not be generated during the lifting and lowering process of the lifting rod 59 to pollute the process space 01 .
  • the lifting mechanism 50 may further include a second substrate 58, which may be parallel to the first substrate 51 and provided with an avoidance hole 581, and the avoidance hole 581 avoids the first end of the telescopic sleeve 54.
  • the lifting mechanism 50 may further include a leveling device 503, which is used to adjust whether the carrier 80 is horizontal, thereby indirectly leveling the wafer 90 subsequently carried.
  • the cleaning tank 20 may be provided with a first switch valve 21, which is used to discharge the waste liquid in the cleaning tank 20 into the overflow space located outside the cleaning tank 20 in the sealed cavity 10 in the draining state, and finally discharge the waste liquid through the overflow space.
  • This structure enables the waste liquid after cleaning the cleaning tank 20 and the waste liquid overflowing during the cleaning process to enter the overflow space, and finally discharge the waste liquid through the overflow space, so that there is no need to design a discharge structure for the overflow space and the cleaning tank 20 respectively, which is conducive to simplifying the structure of the process chamber.
  • the process chamber disclosed in the embodiment of the present application may further include a drying gas input pipe 31 and a water film removal gas input pipe 32.
  • the drying gas input pipe 31 and the water film removal gas input pipe 32 may be connected to the sealed chamber 10.
  • the drying gas input pipe 31 is used to transport drying gas to the drying space.
  • the drying gas may be an inert gas, such as nitrogen, argon, etc., or other gas that does not affect the process and can be used to dry the wafer 90.
  • the embodiment of the present application does not limit the specific type of drying gas.
  • the water film removal gas input pipe 32 is used to transport water film removal gas, such as isopropyl alcohol, into the drying space.
  • the water film removal gas has low surface tension and volatile properties, so that it can quickly replace the cleaning liquid with high surface tension on the surface of the wafer 90 after the wafer 90 is removed from the cleaning liquid, thereby achieving the purpose of quickly removing the cleaning liquid, and making the subsequent step of using dry gas to dry the wafer 90 easier to achieve.
  • the embodiment of the present application does not limit the type of water film removal gas.
  • the process chamber disclosed in the embodiment of the present application has improved sealing performance and is more suitable for cleaning chambers that use isopropyl alcohol as a water film to remove gas.
  • the process chamber disclosed in the embodiment of the present application may also include a waste liquid output pipe 70, which is used to discharge the waste liquid from the process chamber.
  • the waste liquid output pipe 70 can be a simple one-pipeline structure or a structure of at least two pipelines, which is not limited by the embodiment of the present application.
  • the waste liquid output pipe 70 may include a main pipe 71 and at least two branch pipes, wherein the first end of the main pipe 71 is connected to the overflow space of the sealed chamber 10.
  • One end of the at least two branch pipes is connected in parallel to the second end of the main pipe 71, and the at least two branch pipes can be used to discharge different types of waste liquids respectively.
  • the main pipe 71 is provided with a second switch valve 75, which is used to control the on and off of the main pipe 71 and is also the main switch of the waste liquid output pipe 70.
  • Each branch pipe is provided with a third switch valve 76, and all the third switch valves 76 can realize the separate discharge of waste liquid from a branch pipe by on and off coordination. This structure enables the process chamber to use different cleaning liquids for the cleaning process, and the waste liquids generated after using different types of cleaning liquids can be finally discharged through the corresponding branch pipes.
  • the at least two branch pipes may be provided with a drainage buffer tank 77, which acts as a buffer during the drainage process to avoid the problem of unstable drainage caused by sudden flow changes in the corresponding branch pipes, and also to prevent the discharged waste liquid from returning to the process space 01.
  • the process chamber disclosed in the embodiment of the present application may also include a negative pressure exhaust pipe 78, and the negative pressure exhaust pipe 78 is provided with a negative pressure pump 79 and a fourth switch valve 701.
  • the first end of the negative pressure exhaust pipe 78 may be connected to the overflow space.
  • the first end of the negative pressure exhaust pipe 78 may extend into the sealed cavity 10 and be connected to the cleaning tank 20.
  • the negative pressure exhaust pipe 78 is used to perform negative pressure exhaust on the process space 01, so that all toxic gases in the process space 01 are completely exhausted after the cleaning process is completed, thereby avoiding the residual toxic gas overflowing when the cover body 12 is opened to remove the wafer 90, causing safety problems.
  • the process chamber disclosed in the embodiment of the present application may further include: a cleaning liquid input pipe 33, which is used to input cleaning liquid into the cleaning tank 20.
  • the cleaning liquid input pipe 33 may be connected to the bottom of the cleaning tank 20, so that the cleaning liquid gradually fills the cleaning tank 20 and overflows subsequently by inputting the cleaning liquid into the bottom of the cleaning tank 20.
  • This bottom-up input method of the cleaning liquid can make it easier for the particles washed off the wafer 90 to be discharged from the cleaning tank 20 by overflow during the cleaning process.
  • one end of the cleaning liquid input pipe 33 can be connected between the two ends of the negative pressure exhaust pipe 78, and the cleaning liquid input pipe 33 can be provided with a fifth switch valve 301, and the fifth switch valve 301 is used to control the on-off of the cleaning liquid input pipe 33, thereby controlling the input of the cleaning liquid.
  • the cleaning liquid input pipe 33 can be connected to the cleaning tank 20 through a section (i.e., a part of the pipe section) of the negative pressure exhaust pipe 78, so that the cleaning liquid is input into the cleaning tank 20.
  • the fourth switch valve 701 can be closed, and the fifth switch valve 301 can be opened, and the cleaning liquid in the cleaning liquid input pipe 33 will enter the cleaning tank 20 through a section of the negative pressure exhaust pipe 78.
  • the waste liquid in the cleaning tank 20 is discharged into the overflow space through the first switch valve 21.
  • the fifth switch valve 301 can be closed, and the fourth switch valve 701 can be opened after the waste liquid is discharged, so that the negative pressure exhaust pipe 78 is connected to the empty cleaning tank 20, and then negative pressure exhaust is performed on the entire process space 01.
  • This structure enables the cleaning liquid inlet pipe 33 and the negative pressure exhaust pipe 78 to share part of the pipe section, thereby simplifying the structure of the process chamber.
  • the process chamber disclosed in the embodiment of the present application may also include a connecting pipe 702.
  • the first end of the connecting pipe 702 can be connected between the two ends of the negative pressure exhaust pipe 78 and is located on the side of the fourth switch valve 701 away from the negative pressure pump 79.
  • the second end of the connecting pipe 702 can be directly connected to the overflow space, or the second end of the connecting pipe 702 can be connected to the main pipe 71 and connected to the overflow space through the main pipe 71.
  • the negative pressure pump 79 can also perform negative pressure exhaust on the overflow space through the connecting pipe 702, so that the negative pressure pump 79 can not only perform negative pressure exhaust through the pipe section shared with the cleaning liquid input pipe 33, but also perform negative pressure exhaust through the connecting pipe 702, which can undoubtedly improve the negative pressure exhaust efficiency.
  • the connecting pipe 702 is equivalent to borrowing a part of the pipe section of the main pipe 71 to achieve the connection with the overflow space, and there is no need to design the connecting pipe 702 to be too long, which is conducive to saving consumables of the connecting pipe 702 and can also simplify the piping structure of the process chamber.
  • the process chamber may be a cleaning chamber.
  • the cleaning liquid involved in the cleaning chamber may be water (such as ultrapure water), an acidic liquid, or other types of cleaning liquids that can be used in the semiconductor cleaning field.
  • the embodiment of the present application does not limit the specific type of the cleaning liquid.
  • the drying gas is nitrogen
  • the water film removal gas is isopropyl alcohol
  • the cleaning liquid is ultrapure water.
  • the cleaning process when the process chamber is a cleaning chamber is described in detail: before cleaning, the cover 12 is moved to a closed state so that the cover 12 seals the opening 02 of the chamber body 11. After the cover 12 is in a closed state, the drying gas input pipe 31 sprays nitrogen into the process space 01, and the lifting mechanism 50 drives the carrier 80 to rise to the drying space to prepare for receiving the wafer 90.
  • the drying gas input pipe 31 continues to spray nitrogen, and the fifth switch valve 301 is opened so that the cleaning liquid input pipe 33 inputs ultrapure water into the cleaning tank 20 (the fourth switch valve 701 is closed at this time).
  • the ultrapure water gradually fills the cleaning tank 20, so that the cleaning tank 20 begins to be in a small overflow state.
  • the second switch valve 75 and the third switch valve 76 on the third branch pipe 74 are opened to realize the recovery of ultrapure water (Note: at this time, since the ultrapure water has not yet cleaned the wafer 90, it can be recovered as recycled water).
  • the cover 12 is opened, and the front and rear dry gas input pipes 31 of the cover 12 are opened to continuously spray nitrogen.
  • the water inflow of the cleaning liquid input pipe 33 is adjusted to a preset flow rate (greater than the water inflow in the small overflow state) to continuously rinse the wafer 90, and the dry gas input pipe 31 is adjusted to output nitrogen of a preset flow rate.
  • the water film removal gas input pipe 32 is opened and isopropanol is sprayed into the process space 01.
  • the fifth switch valve 301 can be closed.
  • the dry gas input pipe 31 and the water film removal gas input pipe 32 respectively transport nitrogen and isopropanol into the process space 01.
  • the third switch valve 76 of the first branch pipe 72 is opened and the third switch valve 76 of the third branch pipe 74 is closed.
  • the waste liquid overflowing into the overflow space will be discharged from the overflow space through the first branch pipe 72.
  • the waste liquid at this stage can be used as organic wastewater.
  • the lifting mechanism 50 is controlled to lift the carrier 80 to drive the wafer 90 to move out of the cleaning tank 20.
  • the dry gas input pipe 31 stops inputting nitrogen, and the negative pressure pump 79 and the fourth switch valve 701 are opened to evacuate gas (Note: at this time, the fifth switch valve 301 has been closed, so that the cleaning liquid input pipe 33 no longer inputs cleaning liquid into the cleaning tank 20).
  • the negative pressure pump 79 and the fourth switch valve 701 are closed, so that the residual isopropyl alcohol in the process space 01 is completely exhausted.
  • the dry gas input pipe 31 is opened again to input nitrogen into the process space 01 so that the gas pressure in the process space 01 is consistent with the atmospheric pressure in the external environment of the process chamber, so that the opening work of the cover 12 is easy to achieve, and then the cover 12 is opened again, and the wafer 90 is taken away by a transportation device (such as a robot), and finally the cover 12 is closed.
  • a transportation device such as a robot

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Abstract

本申请公开一种盖体装置、工艺腔室及半导体工艺设备，其中，所公开的盖体装置包括盖体、连接座和盖体座，所述盖体座的第一端转动地连接于所述连接座上，所述盖体座具有第一状态和第二状态，所述盖体座的第二端绕所述盖体座的第一端可转动，以使所述盖体座在所述第一状态与所述第二状态之间切换；在所述盖体座的第一状态，所述盖体相对于预设平面倾斜，并且所述盖体相对于所述盖体座可移动；在所述盖体座的第二状态，所述盖体与所述预设平面平行。上述方案能解决相关技术涉及的工艺腔室存在密封不严的问题。

Description

盖体装置、工艺腔室及半导体工艺设备 技术领域
本申请属于半导体技术领域，具体涉及一种盖体装置、工艺腔室及半导体工艺设备。
背景技术
工艺腔室是半导体工艺设备的重要组成部分。工艺腔室用于实现半导体工艺，例如清洗工艺、薄膜沉积工艺等。在半导体工艺进行的过程中，工艺腔室需要确保密封，以避免工艺腔室内的工艺空间与工艺腔室的外部环境连通。一旦工艺腔室内的工艺空间与工艺腔室的外部环境连通，则较容易导致工艺失败。另外，有些工艺(例如清洗工艺)需要的气体有剧毒，这些有毒的气体一旦泄露到工艺腔室的外部环境中，则较容易导致工作人员中毒。
由此可见，对工艺腔室进行密封性设计是工艺腔室结构设计中的重中之重。但是，相关技术中涉及的工艺腔室仍存在密封不严的问题。
发明内容
本申请公开一种盖体装置、工艺腔室及半导体工艺设备，以解决相关技术涉及的工艺腔室存在密封不严的问题。
为了解决上述技术问题，本申请提供如下技术方案：
第一方面，本申请实施例公开一种盖体装置，所公开的盖体装置包括盖体、连接座和盖体座，所述盖体座的第一端转动地连接于所述连接座上，所述盖体座具有第一状态和第二状态，所述盖体座的第二端绕所述盖体座的第一端可转动，以使所述盖体座在所述第一状态与所述第二状态之间切换；
在所述盖体座的第一状态，所述盖体相对于预设平面倾斜，并且所述盖体座相对于所述盖体座移动；在所述盖体座的第二状态，所述盖体与所述预设平面平行。
第二方面，本申请实施例公开一种工艺腔室，所公开的工艺腔室包括第一密封圈、腔室主体和第一方面所述的盖体装置，所述腔室主体设有开口，所述盖体座的所述第一端远离所述开口，所述盖体座的第二端靠近所述开口，所述预设平面为所述开口所在的平面；
在所述盖体座处的第一状态，所述盖体相对于所述开口所在的平面倾斜，并且所述盖体在避让所述开口的位置和与所述开口相对的位置之间可移动；
在所述盖体处在与所述开口相对的位置时，所述盖体座可带动所述盖体转动至使所述盖体与所述开口所在的平面平行的所述第二状态并驱使所述盖体挤压所述第一密封圈。
第三方面，本申请实施例公开一种半导体工艺设备，所公开的半导体工艺设备包括第二方面所述的工艺腔室。
本申请采用的技术方案能够达到以下技术效果：
本申请实施例公开的盖体装置，能够使得盖体在盖体座的带动下转动，从而改变盖体的倾斜角度，在盖体相对于预设平面倾斜的状态下能够移动，在此过程中，由于盖体能够倾斜从而远离用于密封腔室主体的开口的第一密封圈或带动用于密封腔室主体的开口的第一密封圈远离腔室主体，因此能够避免盖体在移动的过程中造成第一密封圈的磨损，最终能够由于第一密封圈的磨损得以缓解而使得盖体与腔室主体之间通过第一密封圈得以更好地密封，由此可见，本申请实施例公开的盖体装置有利于提高工艺腔室的密封性能。
与此同时，在此过程中，盖体座的第一端仅仅相对于连接座转动，从而使得盖体座的第一端无需占用较大的活动空间，有利于进一步减小工艺腔室对其上方空间的占用。
附图说明
图1是相关技术涉及的工艺腔室的示意图，图1中盖体处于未完全打开的状态；
图2是本申请一个实施例公开的工艺腔室在盖体处在打开状态下的部分结构的爆炸示意图；
图3是本申请一个实施例公开的工艺腔室在盖体处在打开状态的示意图；
图4是图3的俯视图；
图5是图2的右视图；
图6是本申请另一个实施例公开的工艺腔室的示意图；
图7是本申请实施例公开的腔室主体的局部示意图；
图8是本申请实施例公开的工艺腔室的部分结构示意图，图8实质为透视图，部分轮廓用了虚线示意；
图9是本申请实施例公开的提升结构与密封腔体的配合处的爆炸示意图；
图10是图9装配后的示意图；
图11是图10的俯视图；
图12是图10的右视图；
图13是本申请实施例公开的工艺腔室的结构示意图。
附图标记说明：
001-腔室主体、002-盖体、003-驱动装置、
10-密封腔体、11-腔室主体、111-围板、12-盖体、13-第一密封圈、
20-清洗槽、21-第一开关阀、
31-干燥气体输入管、32-水膜去除气体输入管、33-清洗液输入管、301-第五开关阀、
41-连接座、42-盖体座、43-第一驱动机构、44-轨道、45-第二驱动机构、46-第一限位缓冲部、47-第二限位缓冲部、48-关闭检测传感器、49-关闭检测触发器、401-打开检测传感器、402-打开检测触发器、404-连接片、405-移动架、406-铰接轴、
50-提升机构、51-第一基板、52-盖帽、53-第一连接件、54-伸缩套、55-第三密封圈、56-第四密封圈、57-第五密封圈、58-第二基板、581-避让孔、59-升降杆、501-第二连接件、502-第三连接件、503-调平装置、
60-压紧机构、61-第三驱动机构、62-压紧件、601-第一直角边、602-第二直角边、63-第四驱动机构、
70-废液输出管、71-主管、72-第一支管、73-第二支管、74-第三支管、75-第二开关阀、76-第三开关阀、77-排液缓冲罐、78-负压抽气管、79-负压泵、701-第四开关阀、702-衔接管、
80-承载架、
90-晶圆、
01-工艺空间、02-开口、03-管路、04-安装孔、05-密封板、06-第二密封圈、07-连通孔、08-密封接头。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
以下结合附图，详细说明本申请各个实施例公开的技术方案。
如本专利申请的背景技术所述，对工艺腔室进行密封设计是工艺腔室的结构设计中的重中之重。基于此，相关技术涉及的工艺腔室包括腔室主体、盖体和用于密封腔室主体的开口的第一密封圈，其中，第一密封圈可以固定在盖体上，或者，第一密封圈可以固定设置在腔室主体的开口位置处。盖体相对于腔室主体移动，从而在打开状态和闭合状态之间切换。但是，本申请的发明人在设计的过程中发现，盖体在实现闭合或打开的移动过程中，由于盖体贴近腔室主体的开口位置移动，盖体会与腔室主体的开口位置处设置的第一密封圈发生较大的摩擦，或者盖体带动第一密封圈移动的过程中会导致第一密封圈与腔室主体的开口发生较大的摩擦，进而使得第一密封圈磨损较快，导致第一密封圈无法较好地发挥密封作用。
基于此，本申请的发明人进一步对工艺腔室的结构进行改进，如图1所示，改进后的工艺腔室仍然包括腔室主体001、盖体002和第一密封圈。
腔室主体001是围成工艺腔室的工艺空间的主要外围构件，腔室主体001设有开口，开口与腔室主体001的内部空间连通。盖体002转动地设于腔室主体001上，从而通过相对于腔室主体001的转动实现在打开状态与闭合状态之间切换。
在打开状态下，盖体002转动至使开口外露并与开口错位的位置，腔室主体001的内部空间与工艺腔室的外部环境连通，操作人员可以进行相应的操作，例如维修操作、取放晶圆等。
在闭合状态下，盖体002转动至覆盖开口的位置，并能够压紧第一密封圈，从而使得第一密封圈被压紧在盖体002与腔室主体001之间，进而实现盖体002与腔室主体001之间的密封。在此种情况下，盖体002、第一密封圈和腔室主体001围成工艺空间。第一密封圈有利于实现工艺空间与工艺腔室的外部环境之间的密封隔离。
图1所示的工艺腔室还可以包括驱动装置003，驱动装置003连接盖体002和腔室主体001，驱动装置003用于驱动盖体002相对于腔室主体001转动。本申请的发明人在对工艺腔室的结构进行设计时进一步发现，此种结构的工艺腔室在盖体002的转动过程中不会去摩擦第一密封圈或不会带动第一密封圈去摩擦腔室主体001，但是盖体002完全打开需要盖体002转动较大的角度(图1仅示意的是盖体002打开过程，图1中的盖体002并未处于完全打开的打开状态)，进而使得工艺腔室的上方需要为盖体002的转动预留较大的空间，这实质导致工艺腔室需要占据较大的上方空间，而工艺腔室的上方往往是布设运载晶圆的运输装置(例如机械手)的空间，倘若工艺腔室需要占据较大的上方的空间，则导致运输装置无法较为紧凑地布设在工艺腔室的上方。
基于此，本申请的发明人对工艺腔室的结构进行又一次的改进来解决上文所述的问题。请参考图2至图4，本申请实施例公开一种盖体装置。所公开的盖体装置可以作为工艺腔室的一部分，应用于工艺腔室上。所公开的盖体装置能够调整盖体的姿态从而能够在盖体打开或闭合的过程中避免造成第一密封圈的磨损。
本申请实施例公开的盖体装置可以包括盖体12、连接座41和盖体座42。盖体12可移动地设于盖体座42上，从而能够相对于盖体座42移动。盖体座42不但为盖体12提供安装基础，还能够通过自身的转动来带动盖体12转动，以调整盖体12的姿态。具体地，盖体座42的第一端转动地连接于连接座41上，盖体座42具有第一状态和第二状态，盖体座42的第二端绕盖体座42的第一端可转动，以使盖体座42在第一状态与第二状态之间切换。
在盖体座42的第一状态，盖体12相对于预设平面倾斜。在本申请实施例中，预设平面可以是与腔室主体11的开口02所在的平面相平行的平面，或者是开口02所在的平面，再或者是与腔室主体11的开口02所在的平面大体平行的表面。当然，在盖体座42的第一状态，盖体12相对于预设平面倾斜，从而使得盖体12在移动的过程中不会导致第一密封圈13发生磨损。
在盖体座42的第二状态，盖体12与预设平面平行。在盖体12处在第二状态时，且在盖体12处在与腔室主体11的开口02相对的位置时，盖体12则能够挤压并压紧第一密封圈13，从而密封覆盖腔室主体11的开口02。也就是说，通过盖体座42的第二端绕盖体座42的第一端转动，可以使得盖体座42带动其上的盖体12在与预设平面相对倾斜和相对平行间切换。
如上文所述，本申请实施例涉及的工艺腔室涉及第一密封圈，在一些实施例中，第一密封圈13可以固定连接在盖体12上并跟随盖体12相对于腔室主体11运动，当盖体12相对于预设平面倾斜，则盖体12带动第一密封圈13一并倾斜，使第一密封圈13远离腔室主体11，从而使得盖体12在移动的过程中不会致使第一密封圈13相对于腔室主体11发生摩擦。在另一些实施例中，第一密封圈13可以固定连接在腔室主体11上并围绕开口02设置，第一密封圈13则不会跟随盖体12运动，在此种情况下，当盖体12相对于预设平面倾斜，盖体12则能相对于第一密封圈13和腔室主体11倾斜，使盖体12远离第一密封圈13，从而不会在移动的过程中与第一密封圈13发生摩擦，进而不会磨损第一密封圈13。
本申请实施例公开的盖体装置，能够使得盖体12在盖体座42的带动下转动，从而改变盖体12的倾斜角度，在盖体12相对于预设平面倾斜的状态下能够移动，在此过程中，由于盖体12能够通过倾斜从而远离用于密封腔室主体11的开口02的第一密封圈13，或者盖体12通过倾斜带动其上用于密封腔室主体11的开口02的第一密封圈13远离腔室主体11，因此能够避免盖体12在移动的过程中造成第一密封圈13的磨损，最终能够由于第一密封圈13的磨损得以缓解，使得盖体12与腔室主体11之间通过第一密封圈13得以更好地密封，由此可见，本申请实施例公开的盖体装置有利于提高工艺腔室的密封性能。
为了提高盖体装置的自动化程度，在一些实施例中，本申请实施例公开的盖体装置还可以包括第一驱动机构43，第一驱动机构43设于盖体座42上，且与盖体12相连。第一驱动机构43用于在盖体座42处在第一状态时驱动盖体12移动。第一驱动机构43可以是直线电机、伸缩气缸、伸缩液压缸等，本申请实施例不限制第一驱动机构43的具体种类。具体地，如图2所示，第一驱动机构43可以通过连接片404与盖体12相连，在驱动的过程中，第一驱动机构43能够驱动连接片404移动，连接片404的移动会带动盖体12移动从而实现对盖体12移动的驱动。
在一些实施例中，盖体座42还可以设有导向部，示例性的，导向部可以是轨道44，轨道44一端靠近盖体座42的第一端，轨道44的另一端靠近盖体座42的第二端，盖体12可以与轨道44导向配合，以在盖体座42处在第一状态时，引导盖体12移动。轨道44具有导向作用，从而能够引导盖体12进行更规范的移动，从而提高盖体12的移动准确性。
在一些实施例中，轨道44可以为一个，而在另一些实施例中，轨道44也可以为至少两条。在轨道44为至少两条的情况下，至少两条的轨道44间隔地分布在盖体座42上，并分别与盖体12导向配合。在此种情况下，至少两个轨道44均能够对盖体12实施导向，从而能够进一步提高盖体12移动的准确性。
在本申请的一些实施例中，盖体座42相对于连接座41的转动可以通过手动驱动来实现。当然，为了提高工艺腔室的自动化程度，在如图2和图3所示的实施例中，本申请实施例公开的盖体装置还可以包括第二驱动机构45。第二驱动机构45可以固定连接于腔室主体11的外壁，当然也可以固定连接于其它的安装基础上，本申请实施例不作限制。具体地，第二驱动机构45与盖体座42的第二端相连，第二驱动机构45用于驱动盖体座42的第二端绕着盖体座42的第一端转动，以使盖体座42在第一状态与第二状态之间切换。示例性的，第二驱动机构45可以是直线电机、伸缩气缸、伸缩液压缸等，本申请实施例不限制第二驱动机构45的具体种类。具体地，第二驱动机构45可以与盖体座42的第二端转动相连，以适应盖体座42的转动。
如上文所述，在具体的工作过程中，盖体12相对于盖体座42移动，盖体12相对盖体座42具有第一预设位置和第二预设位置，在盖体12移动至第一预设位置时，盖体12远离盖体座42的第一端，在盖体12移动至第二预设位置时，盖体12靠近盖体座42的第一端。为了避免盖体12发生过度移动。在一种实施例中，盖体座42的第二端可以设有第一限位部，在盖体12移动至第一预设位置时，盖体12能够与第一限位部限位接触，从而避免盖体12沿盖体座42过度移动。需要说明的是，在盖体12移动至第一预设位置时，盖体12移动至与开口02相对的位置。此时，盖体12距盖体座42的转动连接处之间的距离为第一距离。
进一步地，第一限位部可以是第一限位缓冲部46，第一限位缓冲部46为弹性结构件(例如橡胶块、弹簧等)，具有缓冲功能，进而使得第一限位缓冲部46在与盖体12限位接触的过程中不但发挥限位功能，还能够发挥缓冲功能，避免发生刚性碰撞。
在另一些实施例中，盖体座42的第一端可以设有第二限位部，盖体12移动至第二预设位置时，盖体12能够与第二限位部限位接触，从而避免盖体12沿盖体座42过度移动。需要说明的是，在盖体12移动至盖体座42的第二预设位置时，盖体12处在避让开口02的位置。此时，盖体12距盖体座42的转动连接处的距离为第二距离，第一距离大于第二距离。需要说明的是，由于盖体座42的第一端转动地连接于连接座41上，因此，盖体12距盖体座42的转动连接处的距离就相当于是盖体12距离盖体座42第一端的距离。当盖体12移动至第一预设位置时，盖体12位于与开口02相对的位置，因此，盖体12距离盖体座42的第一端较远，因此，对应的第一距离较大；而盖体12移动至第二预设位置时，盖体12处在避让开口02的位置，因此，距离盖体座42的第一端较近，因此，对应的第二距离较小。
需要说明的是，第一限位部与第二限位部的限位方向相反。同理，进一步地，第二限位部可以是第二限位缓冲部47，第二限位缓冲部47为弹性结构件(例如橡胶块、弹簧等)，具有缓冲功能，进而使得第二限位缓冲部47与盖体12限位接触的过程中还能够发挥缓冲功能，避免发生刚性碰撞。
盖体座42的第二端可以设有关闭检测传感器48，盖体12可以设有关闭检测触发器49，在盖体12移动至第一预设位置时，关闭检测触发器49触发关闭检测传感器48，从而使得关闭检测传感器48发出表征盖体12关闭的信号，第一驱动机构43可以在接收到此信号后关闭。
盖体座42的第一端可以设有打开检测传感器401，盖体12可以设有打开检测触发器402，在盖体12移动至第二预设位置时，打开检测触发器402触发打开检测传感器401，从而使得打开检测传感器401发出能表征盖体12打开的信号。第一驱动机构43可以在接收到此信号后关闭。
具体地，关闭检测触发器49和打开检测触发器402可以直接安装在盖体12上并跟随盖体12移动。当然，关闭检测触发器49和打开检测触发器402也可以间接地安装在盖体12上。为了方便安装，进一步的，本申请实施例公开的盖体装置还可以包括移动架405，如图2所示，关闭检测触发器49和打开检测触发器402可以安装在移动架405上，移动架405与盖体12相连，且可随盖体12移动。也就是说，移动架405能够实现关闭检测触发器49和打开检测触发器402在盖体12上的间接安装。在盖体12移动的过程中，移动架405能够携带关闭检测触发器49和打开检测触发器402移动到不同的位置，进而发挥不同的触发功能。
请再次参考图2至图13，本申请实施例公开一种工艺腔室。所公开的工艺腔室包括：腔室主体11、盖体12和第一密封圈13。进一步地，本申请实施例公开的工艺腔室还可以包括：连接座41和盖体座42，也就是说，本申请实施例公开的工艺腔室包括上文实施例所述的盖体装置。
具体地，盖体座42的远离开口02的第一端转动地连接于连接座41上。盖体座42具有第一状态和第二状态，盖体座42的邻近开口02的第二端绕盖体座42的第一端可转动，以在第一状态与第二状态之间切换。盖体座42的第二端处在盖体座42的第一端与腔室主体11的开口02之间。
在盖体座42的第一状态，盖体12相对于开口02所在的平面倾斜(例如相对于平面倾斜0.7～0.8°)。在盖体座42的第二状态，盖体12相对于开口02所在的平面平行。实质上，盖体座42通过转动能改变盖体12与开口02所在的平面之间的角度。
在盖体座42的第一状态，盖体12相对于开口02所在的平面倾斜，并且盖体12在避让开口02的位置和与开口02相对的位置之间可移动。需要说明的是，在盖体12处在与开口02相对的位置的情况下，盖体12位于开口02的正上方，且盖体12在开口02上的正投影能够覆盖开口02。
在盖体12处在与开口02相对的位置时，盖体座42可转动至第一状态，从而为盖体12向着打开状态移动做好准备。或，盖体座42带动盖体12转动至使其与开口02所在的平面平行的第二状态并驱使盖体12压紧第一密封圈13，从而使得第一密封圈13能够被夹紧在盖体12与腔室主体11之间，最终使得盖体12处于闭合状态。也就是说，在盖体座42带动盖体12转动至第二状态时，盖体座42会驱使盖体12挤压并压紧第一密封圈13。
具体来说，在盖体12从打开状态向着闭合状态切换的过程中，盖体座42通过转动而处在第一状态，此时盖体12在盖体座42带动下处于相对于开口02所在的平面倾斜的状态(例如相对于开口02所在的平面倾斜0.7～0.8°)。接着，盖体12相对于盖体座42移动至与开口02相对的位置从而位于开口02的上方，紧接着，盖体座42转动至第二状态进而使得盖体12转动至与开口02所在的平面平行的位置从而压紧第一密封圈13，第一密封圈13能在盖体12的作用下被压紧在盖体12与腔室主体11之间，从而实现盖体12与腔室主体11之间的密封。在此过程中，盖体12处于倾斜状态而不会在移动过程中与第一密封圈13发生相对摩擦或不会在移动过程中使得第一密封圈13与腔室主体11发生相对摩擦。
在盖体12从闭合状态向着打开状态切换的过程中，盖体座42从第二状态(此时，盖体12处在密封压紧第一密封圈13而使得第一密封圈13密封连接盖体12和腔室主体11的闭合状态)通过转动而切换至第一状态，从而使得盖体12与第一密封圈13分离或盖体12带动第一密封圈13与腔室主体11分离，接着，盖体12相对于盖体座42移动至与开口02错位的位置，从而使得盖体12处在打开状态。在此过程中，盖体12通过倾斜而与第一密封圈13分离或者盖体12通过倾斜而带动第一密封圈13与腔室主体11分离，进而使得盖体12在移动的过程中不会与第一密封圈13发生相对摩擦或不会在移动的过程中使得第一密封圈13与腔室主体11发生相对摩擦。
通过上述的工作过程的描述可知，本申请实施例公开的工艺腔室将盖体12可移动地设于能够转动的盖体座42上，从而使得盖体座42在第一状态下能引导盖体12在相对于开口02所在的平面倾斜地移动，从而在避让开口02和与开口02相对的位置之间移动，从而使得盖体12在打开或闭合的过程中均不会导致第一密封圈13发生磨损，进而避免由于第一密封圈13的磨损导致的密封不严的问题。与此同时，本申请实施例公开的工艺腔室在实现盖体12在打开状态和闭合状态之间切换的过程中，只需要盖体座42带动盖体12转动到能使得盖体12与第一密封圈13分离或使得盖体12带动第一密封圈13与腔室主体11分离的倾斜位置即可，无需带动盖体12转动过大的角度，从而能够缓解对工艺腔室的上方空间的占用。
与此同时，在此过程中，盖体座42的第一端仅仅相对于连接座41转动，从而使得盖体座42的第一端无需占用较大的活动空间，有利于进一步减小工艺腔室对其上方空间的占用。
如上文所述，第一密封圈13可以固定于盖体12，从而跟随盖体12相对于腔室主体11移动。第一密封圈13也可以固定于腔室主体11上，从而使得盖体12相对于腔室主体11和第一密封圈13发生移动。本申请实施例不限制第一密封圈13具体是安装在盖体12上还是安装在腔室主体11上，只要确保第一密封圈13在盖体12闭合时能够被盖体12压紧而密封在盖体12与腔室主体11之间即可。
在第一密封圈13设于腔室主体11的情况下，为了方便设置第一密封圈13，腔室主体11可以包括围绕开口02的围板111，围板111具有较大的面积，进而方便布设第一密封圈13。进一步地，围板111可以开设有围绕开口02的环形槽，第一密封圈13可以固定在环形槽内，从而实现稳定地安装。
在本申请实施例中，盖体座42与连接座41的转动连接可以通过多种结构实现，例如，盖体座42的第一端可以通过轴铰接的方式转动地连接于连接座41上。如图2所示，连接座41可以安装有铰接轴406，盖体座42的第一端可以通过铰接轴406转动地连接于连接座41上。再例如，盖体座42的第一端可以通过柔性件或弹性件而转动地安装于连接座41上，本申请实施例不限制盖体座42的第一端与连接座41之间的具体转动连接方式。
在盖体装置包括轨道44的情况下，所有的轨道44和盖体座42均可以位于开口02的同一边缘所在的一侧，如图2所示，此种分布方式能够避免轨道44占据开口02的其它边缘所在的一侧，进而有利于使得工艺腔室在其它方向占据较小的空间。
在一些实施例中，在盖体装置包括第一限位部的情况下，盖体12移动至与开口02相对的位置(即第一预设位置)时能与第一限位部限位接触，从而避免盖体12沿盖体座42过度移动。
在另一些实施例中，在盖体装置包括第二限位部的情况下，盖体12移动至避让开口02的位置(即第二预设位置)时可以与第二限位部限位接触。
在盖体座42的第二端设有关闭检测传感器48，且盖体12设有关闭检测触发器49的情况下，在盖体12移动至与开口02相对的位置时，关闭检测触发器49触发关闭检测传感器48。
在盖体座42的第一端可以设有打开检测传感器401，且盖体12可以设有打开检测触发器402的情况下，在盖体12移动至与开口02错位的位置时，打开检测触发器402触发打开检测传感器401。
如上文所述，在盖体座42转动至第二状态的情况下，盖体12能压紧第一密封圈13，从而实现第一密封圈13对盖体12与腔室主体11之间的密封。为了提高密封效果，进一步的，本申请实施例公开的工艺腔室还可以包括压紧机构60，压紧机构60可以固定在腔室主体11的外壁上。在盖体12处在与开口02相对并与开口02所在的平面平行的位置时，压紧机构60用于向盖体12施加挤压第一密封圈13的压力，从而使得盖体12能够更好地压紧第一密封圈13，最终使得第一密封圈13能够被更好地压紧而发挥密封功能。
在本申请的一些实施例中，压紧机构60可以为一个，而在另一些实施例中，压紧机构60也可以为至少两个，本申请实施例不限制压紧机构60的具体种类。在压紧机构60为至少两个的情况下，压紧机构60可以间隔地设于腔室主体11的外壁上。
压紧机构60的种类可以有多种，例如，压紧机构60可以是夹紧机构。只要能够驱使盖体12将第一密封圈13压紧在腔室主体11上的机构均可以作为本申请实施例中的压紧机构60。请再次参考图2至图5，在本申请实施例中，压紧机构60可以包括：第三驱动机构61和压紧件62。第三驱动机构61可以固定连接于腔室主体11的外壁上，压紧件62与第三驱动机构61的伸缩端相连实现驱动配合，第三驱动机构61用于驱使压紧件62在松开状态和压紧状态之间切换。其中，在压紧状态下，压紧件62的部分结构抵接于盖体12背向腔室主体11的一侧，并将盖体12压向腔室主体11而挤压第一密封圈13。在松开状态下，压紧件62至少与盖体12分离，从而为盖体12的运动提供条件，此时压紧件62不再抵接在盖体12上。
具体地，在盖体12移动至盖合开口02的位置时，盖体12的边缘处于压紧件62用于与盖体12抵接的部分结构与腔室主体11之间。由于盖体12相对于腔室主体11移动，因此压紧件62用于与盖体12抵接的部分结构位于盖体12的上方，腔室主体11位于盖体12的下方，在第三驱动机构61的驱动下能够拉紧压紧件62，从而使得压紧件62将盖体12压紧在腔室主体11上。当然，第三驱动机构61向上推动压紧件62则能够实现压紧件62的位于盖体12的上方的结构与盖体12分离，从而实现对盖体12的松开。
压紧件62的结构可以有多种，在一些实施例中，压紧件62可以为L形结构件，且包括相互垂直相连的第一直角边601和第二直角边602，第一直角边601与第三驱动机构61的伸缩端相连而实现驱动连接。在盖体12移动到盖合开口02的位置时，盖体12的边缘位于第二直角边602与腔室主体11之间。当然，可以调整第一直角边601和第二直角边602之间的夹角来改变压紧件62的结构，也能达到压紧的目的，本申请实施例不限制压紧件62的具体结构。此种结构能够使得压紧件62只需要第三驱动机构61伸缩移动即可实现在松开状态和压紧状态之间切换，结构简单，操控也相对简单。
在压紧件62为L形结构件的情况下，第一直角边601和第二直角边602可以为整体式结构(注：由一体式加工工艺制造而成)，也可以为分体式结构并通过焊接、连接件连接等方式装配相连，本申请实施例不作限制。
在其它的实施例中，请参考图6，压紧机构60还可以包括：第四驱动机构63，第四驱动机构63可以固定于第三驱动机构61的伸缩端，从而使第三驱动机构61通过伸缩端驱动第四驱动机构63移动。压紧件62设于第四驱动机构63的伸缩端，第四驱动机构63用于驱使压紧件62在第一位置与第二位置之间切换。在压紧件62处在第一位置时，压紧件62位于盖体12背向腔室主体11的一侧，且第三驱动机构61可通过第四驱动机构63带动压紧件62在压紧状态与松开状态之间切换。在压紧状态下，盖体12能够压紧第一密封圈13，在松开状态下，盖体12能够松开第一密封圈13。
在压紧件62处于第二位置时，压紧件62与盖体12错位分布，也就是压紧件62避让盖体12背向腔室主体11的一侧，在此种情况下，压紧件62不会干涉盖体12随盖体座42的转动，也不会干涉盖体12的移动。
需要说明的是，第三驱动机构61的伸缩端的移动方向可以与第四驱动机构63的伸缩端的移动方向不同，也就是说，第三驱动机构61的伸缩端通过第四驱动机构63带动压紧件62移动的移动方向与第四驱动机构63的伸缩端驱动压紧件62移动的移动方向不同。示例性的，第三驱动机构61的伸缩端的移动方向与第四驱动机构63的伸缩端的移动方向可以相垂直。
由于第四驱动机构63能够驱使压紧件62在第一位置与第二位置之间切换，因此压紧件62的结构更无需过多的限制。例如，压紧件62可以是平板状结构件，当然还可以为其它结构件。
第三驱动机构61和第四驱动机构63的种类及结构可以相同，也可以不同，本申请实施例不作限制。第三驱动机构61和第四驱动机构63可以是液压伸缩件、气压伸缩件、直线电机等，本申请实施例不限制第三驱动机构61和第四驱动机构63的具体种类。
在进行半导体工艺时，需要向工艺空间01中通入工艺气体，例如沉积气体、干燥气体等，为了较好地确保工艺空间01与工艺腔室的外部环境之间的密封隔离，请参考图7，在一种实施例中，本申请实施例公开的工艺腔室还可以包括：管路03、密封板05、第二密封圈06和密封接头08，腔室主体11可以设有安装孔04，密封板05可拆卸地固定在腔室主体11上的安装孔04上，且通过第二密封圈06密封安装孔04，密封板05设有连通孔07，管路03均可以通过密封接头08可拆卸地与连通孔07连接，以与腔室主体11的内部空间连通。
进一步地，管路03可以为一条，也可以为至少两条，密封板05可以设有至少两个连通孔07并与所述管路03一一对应，多条管路03分别通过对应的密封接头08密封连接对应的连通孔07。具体地，各个管路03的功能可以相同，也可以不相同，本申请实施例不作限制。
需要说明的是，本申请实施例中的管路03可以包括后文所述的干燥气体输入管31、水膜去除气体输入管32、清洗液输入管33、废液输出管70等，当然还可以包括工艺腔室配置的其它功能的管路，本申请实施例不作限制。
本申请实施例不限制工艺腔室的具体种类，工艺腔室可以是化学气相沉积工艺腔室、原子层沉积工艺腔室等。当然，工艺腔室还可以是清洗腔室，清洗腔室用于进行清洗工艺以清洗晶圆90。
在本申请实施例公开的工艺腔室为清洗腔室的情况下，请参考图8至图13，本申请实施例公开的工艺腔室包括密封腔体10、清洗槽20、提升机构50和用于承载晶圆90的承载架80，密封腔体10包括上文所述的腔室主体11、盖体12和第一密封圈13。清洗槽20和承载架80设于腔室主体11之内，也位于盖体12、第一密封圈13和腔室主体11围成的工艺空间01中。
密封腔体10内的位于清洗槽20上方的空间可以为干燥空间。清洗槽20内的空间为清洗空间。提升机构50至少部分设于密封腔体10内并与承载架80相连。提升机构50用于驱使承载架80在干燥空间与清洗空间之间升降切换。密封腔体10具有溢流空间，溢流空间低于清洗槽20的溢流口(此溢流口可以是清洗槽20的槽口，也可以是略低于清洗槽20的槽口的溢流孔)，溢流空间位于清洗槽20之外。
提升机构50可以全部位于密封腔体10之内，也可以一部分位于密封腔体10之内，另一部分位于密封腔体10之外，如图8至图12所示。考虑到提升机构50的动力源不宜处在特殊环境中，在一些实施例中，提升机构50的一部分可以位于密封腔体10之内，另一部分至少包含动力源，且可以位于密封腔体10之外。当然，在此种情况下，提升机构50需要与密封腔体10之间进行密封，以避免提升机构50与密封腔体10的连接处连通工艺空间01与工艺腔室的外部环境。
基于此，请再次参考图9至图12，在一些实施例中，提升机构50可以包括第一基板51、盖帽52、第一连接件53、升降杆59、伸缩套54、第三密封圈55、第四密封圈56和第五密封圈57。
升降杆59的第一端位于密封腔体10之外，用于与动力源连接。动力源可以是液压伸缩件、气压伸缩件、直线电机等，动力源的功能在于驱动升降杆59进行升降移动。升降杆59的第二端伸至密封腔体10内，并与第一基板51通过第一连接件53相连，盖帽52通过第三密封圈55而密封罩在第一连接件53外露于第一基板51的第一板面的部位上，第三密封圈55实现第一连接件53和第一基板51之间的装配缝隙与工艺空间01之间的密封隔离。也就是说，第一基板51具有相对设置的第一板面和第二板面，第三密封圈55套在升降杆59的外周壁上，盖帽52通过第三密封圈55而密封罩在第一连接件53外露于第一板面的部位上。示例性的，第一连接件53可以是螺钉、螺栓、铆钉等，本申请实施例不限制第一连接件53的具体种类。
伸缩套54可以位于密封腔体10中，且套在升降杆59之外，也就是说，升降杆59穿设在伸缩套54内部，伸缩套54的第一端通过第四密封圈56而密封对接在第一基板51的第二板面上，也就是说，第四密封圈56同样套在升降杆59的外周壁上，伸缩套54的第一端通过第四密封圈56而密封对接在第一基板51的第二板面上，第四密封圈56使得伸缩套54的第一端与第二板面之间实现密封，进而能够在伸缩套54的第一端所在的位置处实现伸缩套54的内部空间(实质与工艺腔室的外部环境连通)与工艺空间01之间的密封隔离。伸缩套54的第二端通过套在升降杆59之外的第五密封圈57而密封连接在密封腔体10，换句话说，第五密封圈57套在升降杆59的外周壁上，伸缩套54的第二端通过第五密封圈57而密封连接在密封腔体10上，第一基板51与承载架80相连。第五密封圈57使得伸缩套54的第二端与密封腔体10之间实现密封，进而能够在伸缩套54的第二端所在的位置处实现伸缩套54的内部空间与工艺空间01之间的密封隔离。
在此种情况下，伸缩套54通过第四密封圈56而与第一基板51的第二板面密封对接，伸缩套54的第二端通过第五密封圈57与密封腔体10密封对接，升降杆59伸至密封腔体10内的第二端通过第一连接件53与第一基板51连接，而且盖帽52通过第三密封圈55罩设在第一连接件53外露于第一基板51的第一板面的部位上，从而最终使得一部分位于密封腔体10之外而另一部分位于密封腔体10之内的升降杆59确保与承载架80连接的同时，还能够确保工艺空间01与工艺腔室的外部环境之间的密封隔离。
伸缩套54的第二端可以通过多个第二连接件501固定连接于密封腔体10，第五密封圈57可以围绕多个第二连接件501，进而避免工艺空间01与多个第二连接件501的连接间隙连通，最终确保密封。示例性的，第二连接件501可以是螺钉、螺栓、铆钉等，本申请实施例不限制第二连接件501的具体种类。
示例性的，盖帽52可以通过围绕第三密封圈55的多个第三连接件502而与第一基板51相连，盖帽52内的第一连接件53与盖帽52之外的多个第三连接件502会被第三密封圈55密封隔离。示例性的，第三连接件502可以是螺钉、螺栓、铆钉等，本申请实施例不限制第三连接件502的具体种类。
进一步的，多个第三连接件502可以穿过第一基板51并与伸缩套54的第一端相连，多个第三连接件502围绕第四密封圈56分布，确保第四密封圈56的隔离功能的前提下，能够使得多个第三连接件502同时连接第一基板51、盖帽52和伸缩套54的第一端，从而实现采用较少的第三连接件502实现多重连接的目的。
与此同时，升降杆59与密封腔体10滑动配合的部位被隔离在工艺空间01之外，因此不会在升降杆59升降过程中产生颗粒而污染工艺空间01。
请再次参考图9，提升机构50还可以包括第二基板58，第二基板58可以与第一基板51平行，且设有避让孔581，避让孔581避让伸缩套54的第一端。提升机构50还可以包括调平装置503，调平装置503用于调节承载架80是否水平，进而间接调平后续承载的晶圆90。
在本申请实施例中，清洗槽20可以设有第一开关阀21，第一开关阀21在排液状态下用于将清洗槽20内的废液排放到密封腔体10内且位于清洗槽20之外的溢流空间中，并最终通过溢流空间将废液排走。此种结构能够使得清洗槽20清洗完之后的废液和清洗过程中溢流的废液都能够进入到溢流空间中，并最终通过溢流空间将废液排放，从而无需分别为溢流空间和清洗槽20设计排放结构，这有利于简化工艺腔室的结构。
在工艺腔室为清洗腔室的情况下，本申请实施例公开的工艺腔室还可以包括干燥气体输入管31和水膜去除气体输入管32。干燥气体输入管31和水膜去除气体输入管32可以与密封腔体10连通。其中，干燥气体输入管31用于向干燥空间中输送干燥气体，干燥气体可以是惰性气体，例如氮气、氩气等，也可以为其它不影响工艺的可用于吹干晶圆90的气体，本申请实施例不限制干燥气体的具体种类。
水膜去除气体输入管32用于向干燥空间中输送水膜去除气体，例如异丙醇。水膜去除气体具有较低的表面张力和易挥发特性，从而能够在晶圆90从清洗液中移出后快速取代晶圆90的表面的具有高表面张力的清洗液，从而达到快速去除清洗液的目的，进而使得后续采用干燥气体吹干晶圆90的步骤更容易实现。当然，本申请实施例不限制水膜去除气体的种类。
由于异丙醇为致癌物，且易挥发，一旦发挥到工艺腔室的外部环境中极易与外部环境中的空气发生混合而形成爆炸混合物，这会带来较大的安全隐患。基于此，本申请实施例公开的工艺腔室由于密封性能得以提升，较为适用于采用异丙醇作为水膜去除气体的清洗腔室中。
如上文所述，在清洗过程中溢流到溢流空间中已被用过的清洗液为废液，在清洗完成后残留在清洗槽20中待排的清洗液也为废液，废液需要最终从工艺腔室中排走。基于此，本申请实施例公开的工艺腔室还可以包括废液输出管70，废液输出管70用于将废液从工艺腔室中排走。废液输出管70可以是简单的一条管路的结构，也可以是至少两条管路的结构，本申请实施例不作限制。
在一种实施例中，废液输出管70可以包括主管71和至少两个支管，主管71的第一端与密封腔体10的溢流空间连通。所述的至少两个支管的一端并联在主管71的第二端，所述的至少两个支管可以分别用于排放不同种类的废液，主管71设有第二开关阀75，第二开关阀75用于控制主管71的通断，也是废液输出管70的总开关，每个支管均设有第三开关阀76，所有的第三开关阀76之间通过通断配合，能够实现一条支管的单独排放废液。此种结构能够使得工艺腔室在采用不同的清洗液进行清洗工艺时，使用不同种类的清洗液后产生的废液可以分别通过相应的支管进行最终的排放。
当然，在工艺腔室采用同一种类的清洗液进行清洗工艺时，不同阶段的废液可以通过相应的支管进行最终的排放。在一种实施例中，所述的至少两个支管可以包括第一支管72、第二支管73和第三支管74，第一支管72、第二支管73和第三支管74可以分别用于排放有机废水、一般工业废水和回收水。此种结构能够实现废液的分类排放，进而有利于节约厂务端的废液处理成本，节能增效。
进一步的，所述的至少两个支管均可以设有排液缓冲罐77，排液缓冲罐77在排液过程中起到缓冲的作用，避免相应的支管内由于流量突变导致的排液不稳的问题发生，同时也能够避免排出的废液返回到工艺空间01中。
请再次参考图13，本申请实施例公开的工艺腔室还可以包括负压抽气管78，负压抽气管78设有负压泵79和第四开关阀701。在一种实施例中，负压抽气管78的第一端可以与溢流空间连通。或者，在另一种实施例中，负压抽气管78的第一端可以延伸至密封腔体10内并与清洗槽20连通。负压抽气管78用于对工艺空间01进行负压抽气，以便在清洗工艺完成后将工艺空间01内的有毒的气体全部抽干净，从而避免打开盖体12取出晶圆90时残留的有毒的气体溢出而造成安全问题。
本申请实施例公开的工艺腔室还可以包括：清洗液输入管33，清洗液输入管33用于向清洗槽20内输入清洗液。具体地，清洗液输入管33可以与清洗槽20的底部连通，以通过向清洗槽20的底部输入清洗液而使得清洗液逐渐填满清洗槽20并进行后续的溢流。此种自下而上的输入清洗液的方式能够使得在清洗的过程中使得晶圆90上被冲洗掉的颗粒物更容易通过溢流的方式而排出清洗槽20。
在一种较为可行的实施例中，清洗液输入管33的一端可以连接在负压抽气管78的两端之间，清洗液输入管33可以设有第五开关阀301，第五开关阀301用于控制清洗液输入管33的通断，进而来控制清洗液的输入。在此种情况下，清洗液输入管33可以通过负压抽气管78的一段(即一部分管段)而与清洗槽20连通，从而向清洗槽20中输入清洗液。在具体的工作过程中，可以将第四开关阀701关闭，并打开第五开关阀301，清洗液输入管33中的清洗液会通过负压抽气管78的一段而进入到清洗槽20中。当然，在清洗工艺完成后，清洗槽20中的废液通过第一开关阀21排放到溢流空间中，接着，可以关闭第五开关阀301，并在废液排完后打开第四开关阀701，从而使得负压抽气管78通过与排空的清洗槽20连通，进而对整个工艺空间01实施负压抽气工作。
此种结构能够使得清洗液输入管33和负压抽气管78实现部分管段的共用，从而能够精简工艺腔室的结构。
请再次参考图13，进一步的，本申请实施例公开的工艺腔室还可以包括衔接管702。衔接管702的第一端可以连接于负压抽气管78的两端之间，并位于第四开关阀701的背离负压泵79的一侧。衔接管702的第二端可以直接与溢流空间连通，或者，衔接管702的第二端可以连接在主管71上并通过主管71与溢流空间连通。在此种情况下，在负压泵79进行负压抽气的过程中，负压泵79还可以通过衔接管702对溢流空间进行负压抽气，最终使得负压泵79不但能够通过与清洗液输入管33共用的管段进行负压抽气，还能够通过衔接管702进行负压抽气，这无疑能够提高负压抽气效率。
当然，在衔接管702的第二端与主管71连接，并通过主管71与溢流空间连通的情况下，衔接管702相当于借用了主管71的一部分管段来实现与溢流空间的连通，进而无需将衔接管702设计的过长，这有利于节省衔接管702的耗材，同时还能够精简工艺腔室的管路结构。
需要说明的是，在本申请实施例中，工艺腔室可以是清洗腔室。清洗腔室涉及的清洗液可以是水(例如超纯水)、也可以是酸性药液，还可以是其它种类的能应用于半导体清洗领域中的清洗液，本申请实施例不限制清洗液的具体种类。
请再次参考图13，下面结合干燥气体是氮气，水膜去除气体是异丙醇，清洗液是超纯水为例，详细说明一下工艺腔室为清洗腔室的情况下的清洗过程：在清洗之前先移动盖体12至闭合状态，使得盖体12密封腔室主体11的开口02，在盖体12处于闭合状态后，干燥气体输入管31向工艺空间01中喷入氮气，提升机构50驱动承载架80上升到干燥空间，进而准备接收晶圆90，在此过程中，干燥气体输入管31持续喷射氮气，开启第五开关阀301使得清洗液输入管33向着清洗槽20中输入超纯水(此时第四开关阀701闭合)。随着超纯水的持续输入，超纯水逐渐将清洗槽20灌满，使清洗槽20开始处于小溢流状态，此时开启第二开关阀75和第三支管74上的第三开关阀76进而实现超纯水的回收(注：此时由于超纯水还未清洗晶圆90，故可以作为回收水回收)，接着打开盖体12，盖体12打开前后干燥气体输入管31持续喷射氮气，氮气占据腔室主体11的内部空间以确保工艺腔室的外部环境中的气体不会侵入到腔室主体11中。接着，承载架80接收完晶圆90后下降，在承载架80的带动下，晶圆90落入到清洗槽20内的超纯水中，之后，关闭盖体12。
再接着，调节清洗液输入管33的进水量到预设流量(大于小溢流状态的进水量)来持续冲洗晶圆90，并调节干燥气体输入管31输出预设流量的氮气。当冲洗第一预设时间段后，打开水膜去除气体输入管32并向工艺空间01内喷射异丙醇，此时可以关闭第五开关阀301，在此种情况下，干燥气体输入管31和水膜去除气体输入管32分别向工艺空间01中输送氮气和异丙醇，在清洗过程中，第一支管72的第三开关阀76打开而第三支管74的第三开关阀76关闭，溢流到溢流空间中的废液会从溢流空间中通过第一支管72排走，此阶段的废液可以作为有机废水。当喷射第二预设时间段后，控制提升机构50将承载架80升起以带动晶圆90从清洗槽20中移出。
干燥气体输入管31和水膜去除气体输入管32持续喷射氮气和异丙醇，同时提升机构50带动晶圆90上升到预设位置，在此过程中异丙醇能够使得晶圆90上的水膜快速去除进而为后续的干燥气体的吹干做好准备，当提升机构50带动晶圆90达到预设位置的情况下，干燥气体输入管31喷射氮气进行吹干晶圆，水膜去除气体输入管32则不再喷射异丙醇。此时，第一开关阀21开启，从而使得清洗槽20内的废液排放到溢流空间中，接下来，溢流空间中的废液会通过第一支管72被排放走，当废液排放完之后关闭第二开关阀75。
接着干燥气体输入管31停止输入氮气，并开启负压泵79和第四开关阀701进行抽气(注：此时第五开关阀301已被关闭，从而使得清洗液输入管33不再向清洗槽20内输入清洗液)，当工艺空间01内的压力达到预设值的情况下，关闭负压泵79和第四开关阀701，从而使得工艺空间01内残留的异丙醇彻底排完。接着再打开干燥气体输入管31向工艺空间01中输入氮气以使工艺空间01内的气体压力与工艺腔室的外部环境中的大气压力一致，进而使得盖体12的打开工作易于实现，接着再打开盖体12，并通过运输装置(例如机械手)取走晶圆90，最后关闭盖体12。
当然，在清洗液为酸性药液的情况下，在清洗过程中溢流出来的废液可以通过第二支管73作为工业废水排放走。
通过上文的清洗过程可知，在清洗过程中，干燥气体输入管31喷射的干燥气体不但发挥防止工艺腔室的外部环境的气体侵入的功能，还能发挥干燥功能，同时还能够发挥调节工艺空间01内的压力的作用，通过在负压抽气工作完成之后对工艺空间01及时充气，使得工艺空间01内的压力不至于过低，最终能够避免工艺空间01内的压力过低而导致盖体12较难打开的问题出现。
基于本申请实施例公开的工艺腔室，本申请实施例进一步公开一种半导体工艺设备。所公开的半导体工艺设备包括上文实施例所述的工艺腔室。
本申请上文实施例中重点描述的是各个实施例的不同，各个实施例的不同的技术特征只要不矛盾，均可以组合形成更具体的实施例，考虑到行文简洁，在此则不再赘述。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (29)

  1. 一种盖体装置，其特征在于，包括盖体、连接座和盖体座，所述盖体座的第一端转动地连接于所述连接座上，所述盖体座具有第一状态和第二状态，所述盖体座的第二端绕所述盖体座的第一端可转动，以使所述盖体座在所述第一状态与所述第二状态之间切换；
    在所述盖体座的第一状态，所述盖体相对于预设平面倾斜，并且所述盖体相对于所述盖体座可移动；
    在所述盖体座的第二状态，所述盖体与所述预设平面平行。
  2. 根据权利要求1所述的盖体装置，其特征在于，
    所述盖体装置还包括：第一驱动机构，所述第一驱动机构设于所述盖体座上，且与所述盖体相连，所述第一驱动机构用于在所述盖体座处在所述第一状态时驱动所述盖体移动。
  3. 根据权利要求1所述的盖体装置，其特征在于，
    所述盖体座设有导向部，所述盖体与所述导向部导向配合，以在所述盖体座处在所述第一状态时引导所述盖体移动。
  4. 根据权利要求3所述的盖体装置，其特征在于，
    所述导向部为至少两个，且间隔分布在所述盖体座上。
  5. 根据权利要求1所述的盖体装置，其特征在于，
    所述盖体装置还包括：第二驱动机构，所述第二驱动机构与所述盖体座相连，所述第二驱动机构用于驱动所述盖体座的第二端绕所述盖体座的第一端转动，以使所述盖体座在所述第一状态与所述第二状态之间切换。
  6. 根据权利要求1所述的盖体装置，其特征在于，
    所述盖体相对所述盖体座具有第一预设位置，在所述盖体移动至所述第一预设位置时，所述盖体远离所述盖体座的第一端；所述盖体座设有第一限位缓冲部，所述第一限位缓冲部用于与移动至所述第一预设位置的所述盖体限位配合；和/或，
    所述盖体相对所述盖体座具有第二预设位置，在所述盖体移动至所述第二预设位置时，所述盖体靠近所述盖体座的第一端；所述盖体座设有第二限位缓冲部，所述第二限位缓冲部用于与移动至所述第二预设位置的所述盖体限位配合。
  7. 根据权利要求1所述的盖体装置，其特征在于，
    所述盖体相对所述盖体座具有第一预设位置，在所述盖体移动至所述第一预设位置时，所述盖体远离所述盖体座的第一端；
    所述盖体座设有关闭检测传感器，所述盖体设有关闭检测触发器，所述关闭检测触发器用于在所述盖体移动至所述第一预设位置时触发所述关闭检测传感器；和/或，
    所述盖体相对所述盖体座具有第二预设位置，在所述盖体移动至所述第二预设位置时，所述盖体靠近所述盖体座的第一端；
    所述盖体座设有打开检测传感器，所述盖体设有打开检测触发器，所述打开检测触发器用于在所述盖体移动所述第二预设位置时，触发所述打开检测传感器。
  8. 一种工艺腔室，其特征在于，包括第一密封圈、腔室主体和权利要求1至7中任一项所述的盖体装置，所述腔室主体设有开口，所述第一密封圈用于密封所述开口，所述盖体座的第一端远离所述开口，所述盖体座的第二端靠近所述开口，所述预设平面与所述开口所在的平面相平行；
    在所述盖体座的第一状态，所述盖体相对于所述开口所在的平面倾斜，并且所述盖体在避让所述开口的位置和与所述开口相对的位置之间可移动；
    在所述盖体处在与所述开口相对的位置时，所述盖体座可带动所述盖体转动至使所述盖体与所述开口所在的平面平行的所述第二状态并驱使所述盖体挤压所述第一密封圈。
  9. 根据权利要求8所述的工艺腔室，其特征在于，
    所述工艺腔室还包括：压紧机构，所述压紧机构连接在所述腔室主体的外壁上，在所述盖体处在与所述开口相对并与所述开口所在的平面平行的位置时，所述压紧机构用于向所述盖体施加挤压所述第一密封圈的压力。
  10. 根据权利要求9所述的工艺腔室，其特征在于，
    所述压紧机构为至少两个，且间隔地设于所述腔室主体的外壁上。
  11. 根据权利要求9所述的工艺腔室，其特征在于，
    所述压紧机构包括：第三驱动机构和压紧件，所述第三驱动机构与所述腔室主体连接，所述压紧件与所述第三驱动机构驱动配合，所述第三驱动机构用于驱动所述压紧件在松开状态和压紧状态之间切换，
    在所述压紧状态下，所述压紧件的部分结构抵接于所述盖体背向所述腔室主体的一侧，并将所述盖体压向所述腔室主体，以使所述盖体挤压所述第一密封圈；
    在所述松开状态下，所述压紧件至少与所述盖体分离。
  12. 根据权利要求11所述的工艺腔室，其特征在于，
    所述盖体相对于所述腔室主体可移动，在所述盖体移动到盖合所述开口的位置时，所述盖体的边缘处于所述压紧件用于与所述盖体抵接的部分结构与所述腔室主体之间。
  13. 根据权利要求12所述的工艺腔室，其特征在于，
    所述压紧件为L形结构件，且包括相互垂直且相连的第一直角边和第二直角边，所述第一直角边与所述第三驱动机构驱动连接，在所述盖体移动到盖合所述开口的位置时，所述盖体的边缘位于所述第二直角边与所述腔室主体之间。
  14. 根据权利要求11所述的工艺腔室，其特征在于，
    所述压紧机构还包括：第四驱动机构，所述第四驱动机构连接于所述第三驱动机构的伸缩端，所述压紧件连接于所述第四驱动机构的伸缩端，所述第三驱动机构通过所述第四驱动机构驱动所述压紧件在所述压紧状态与所述松开状态之间切换；所述第四驱动机构用于驱动所述压紧件在第一位置与第二位置之间切换，
    在所述压紧件的第一位置，所述压紧件位于所述盖体背向所述腔室主体的一侧；
    在所述压紧件的第二位置，所述压紧件与所述盖体错位分布，所述第三驱动机构驱动所述压紧件的移动方向与所述第四驱动机构驱动所述压紧件的移动方向不同。
  15. 根据权利要求14所述的工艺腔室，其特征在于，
    所述压紧件为平板状结构件。
  16. 根据权利要求8所述的工艺腔室，其特征在于，
    所述工艺腔室还包括：管路、密封板、第二密封圈和密封接头，所述腔室主体设有安装孔，所述密封板可拆卸地固定于所述腔室主体的所述安装孔处，且通过所述第二密封圈密封所述安装孔，所述密封板设有连通孔，所述管路均通过所述密封接头可拆卸地与所述连通孔连接，以与所述腔室主体连通。
  17. 根据权利要求16所述的工艺腔室，其特征在于，
    所述管路为多条，所述密封板设有至少两个所述连通孔并与所述管路一一对应，多条所述管路分别通过对应的所述密封接头密封连接对应的所述连通孔。
  18. 根据权利要求16所述的工艺腔室，其特征在于，
    所述密封接头与相对应的所述连通孔通过密封螺纹配合的方式密封连通。
  19. 根据权利要求8至18中任一项所述的工艺腔室，其特征在于，所述工艺腔室包括密封腔体，所述密封腔体包括所述腔室主体、所述盖体和所述第一密封圈，所述工艺腔室还包括清洗槽、提升机构和用于承载晶圆的承载架，其中：
    所述清洗槽和所述承载架设于所述密封腔体内，所述密封腔体内的位于所述清洗槽上方的空间为干燥空间，所述清洗槽内的空间为清洗空间，所述提升机构至少部分设于所述密封腔体内并与所述承载架相连，所述提升机构用于驱动所述承载架在所述干燥空间与所述清洗空间之间升降切换，所述密封腔体具有溢流空间，所述溢流空间低于所述清洗槽的溢流口且位于所述清洗槽之外。
  20. 根据权利要求19所述的工艺腔室，其特征在于，所述提升机构包括：第一基板、盖帽、第一连接件、升降杆和伸缩套，其中：
    所述第一基板具有相对设置的第一板面和第二板面，
    所述升降杆的第一端位于所述密封腔体之外，所述升降杆的第二端伸至所述密封腔体内，并与所述第一基板通过所述第一连接件相连，所述盖帽密封罩在所述第一连接件外露于所述第一板面的部位上；
    所述伸缩套位于所述密封腔体中，且套在所述升降杆之外，所述伸缩套的第一端密封对接在所述第二板面上，
    所述伸缩套的第二端密封连接在所述密封腔体上，所述第一基板与所述承载架相连。
  21. 根据权利要求19所述的工艺腔室，其特征在于，
    所述清洗槽设有第一开关阀，所述第一开关阀用于在排液状态下将所述清洗槽内的废液排放到所述溢流空间中。
  22. 根据权利要求19所述的工艺腔室，其特征在于，
    所述工艺腔室还包括：干燥气体输入管和水膜去除气体输入管，所述干燥气体输入管和所述水膜去除气体输入管与所述密封腔体连通，所述干燥气体输入管用于向所述干燥空间中输送干燥气体，所述水膜去除气体输入管用于向所述干燥空间中输送水膜去除气体。
  23. 根据权利要求19所述的工艺腔室，其特征在于，
    所述工艺腔室还包括：废液输出管，所述废液输出管包括：主管和至少两个支管，所述主管的第一端与所述密封腔体的所述溢流空间连通，所述至少两个支管的一端并联在所述主管的第二端，所述至少两个支管分别用于排放不同种类的废液，所述主管设有第二开关阀，每个所述支管均设有第三开关阀。
  24. 根据权利要求23所述的工艺腔室，其特征在于，
    所述至少两个支管包括：第一支管、第二支管和第三支管，所述第一支管、所述第二支管和第三支管分别用于排放有机废水、工业废水和回收水。
  25. 根据权利要求24所述的工艺腔室，其特征在于，
    所述至少两个支管均设有排液缓冲罐。
  26. 根据权利要求23所述的工艺腔室，其特征在于，
    所述工艺腔室还包括：负压抽气管，所述负压抽气管设有负压泵和第四开关阀，所述负压抽气管的第一端与所述溢流空间连通或所述负压抽气管的第一端伸至所述密封腔体内并与所述清洗槽连通，所述负压抽气管的第二端与所述至少两个支管中的至少一者连通。
  27. 根据权利要求26所述的工艺腔室，其特征在于，
    所述工艺腔室还包括：清洗液输入管，所述清洗液输入管的一端连接在所述负压抽气管的两端之间，所述清洗液输入管设有第五开关阀。
  28. 根据权利要求26所述的工艺腔室，其特征在于，
    所述工艺腔室还包括：衔接管，所述衔接管的第一端连接于所述负压抽气管的两端之间，并位于所述第四开关阀的背离所述负压泵的一侧，所述衔接管的第二端连接于所述主管上，并通过所述主管与所述溢流空间连通。
  29. 一种半导体工艺设备，其特征在于，包括权利要求8至28中任一项所述的工艺腔室。
PCT/CN2024/136985 2023-12-15 2024-12-05 盖体装置、工艺腔室及半导体工艺设备 Pending WO2025124265A1 (zh)

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