WO2025100182A1 - 測定装置の製造方法及びロボットアーム - Google Patents

測定装置の製造方法及びロボットアーム Download PDF

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Publication number
WO2025100182A1
WO2025100182A1 PCT/JP2024/036903 JP2024036903W WO2025100182A1 WO 2025100182 A1 WO2025100182 A1 WO 2025100182A1 JP 2024036903 W JP2024036903 W JP 2024036903W WO 2025100182 A1 WO2025100182 A1 WO 2025100182A1
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WIPO (PCT)
Prior art keywords
measuring device
manufacturing
resin
end effector
steps
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PCT/JP2024/036903
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English (en)
French (fr)
Japanese (ja)
Inventor
地人 倉田
耕太郎 森
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DIC Corp
Original Assignee
DIC Corp
Dainippon Ink and Chemicals Co Ltd
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Application filed by DIC Corp, Dainippon Ink and Chemicals Co Ltd filed Critical DIC Corp
Priority to CN202480055966.7A priority Critical patent/CN121752879A/zh
Priority to JP2025519052A priority patent/JPWO2025100182A1/ja
Publication of WO2025100182A1 publication Critical patent/WO2025100182A1/ja
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers

Definitions

  • This disclosure relates to a method for manufacturing a measuring device and a robot arm.
  • This application claims priority to Japanese Patent Application No. 2023-189468, filed on November 6, 2023, the entire disclosure of which is incorporated herein by reference.
  • Patent Document 1 discloses a manufacturing method for a force sensor that can be attached to an end effector and used, and that has higher sensitivity than conventional force sensors.
  • end effectors Due to the weight capacity limitations of robot arms, there is a demand for end effectors, which can also be used as measuring devices that contribute to measuring force, to have fewer parts, be smaller, and be lighter. In addition, there is a demand for end effectors to be waterproof and water resistant so that they can be washed to prevent the spread of infectious diseases and for other hygienic purposes. Generally, end effectors are made of metal, are heavy, and have the problem of rusting when washed.
  • End effectors generally require sensor components to perform their functions. For example, in order for a robot arm to determine whether the end effector has grasped an object, a sensor component such as a force sensor, as in the conventional technology described in Patent Document 1, is additionally installed on the end effector. This makes it difficult to make the end effector smaller and lighter.
  • the present disclosure aims to provide a method for manufacturing a measurement device and a robot arm that can contribute to force measurement with a simpler configuration.
  • a method for manufacturing a measuring device includes: 1.
  • a method for manufacturing a measuring device having an integral sensor that contributes to the measurement of a force comprising the steps of: A first step of forming a body portion of the measuring device based on a first resin; a second step of integrally forming a circuit for outputting an electrical signal that changes in response to a distortion of the main body portion as a plating layer on a surface of the first resin; Includes.
  • the present disclosure makes it possible to provide a method for manufacturing a measuring device and a robot arm that can contribute to force measurement with a simpler configuration.
  • FIG. 1 is an external perspective view illustrating an example of a robot arm according to an embodiment of the present disclosure.
  • FIG. 2 is a block diagram showing an example of the configuration of the robot arm of FIG. 1 .
  • FIG. 2 is a first external perspective view showing an example of an end effector of the robot arm of FIG. 1 .
  • FIG. 2 is a second external perspective view showing an example of an end effector of the robot arm of FIG. 1 .
  • FIG. 4 is a side view showing a part of the configuration of the end effector of FIG. 3 .
  • 6 is an enlarged cross-sectional view showing a schematic enlargement of a part of a cross section taken along the arrow line VI-VI in FIG. 5.
  • 4 is a flowchart illustrating an example of a manufacturing method for manufacturing the end effector of FIG. 1 as a measuring device.
  • FIG. 1 is an external perspective view showing an example of a robot arm 1 according to an embodiment of the present disclosure.
  • FIG. 2 is a block diagram showing an example of the configuration of the robot arm 1 of FIG. 1.
  • FIG. 3 is a first external perspective view showing an example of the end effector 10 of the robot arm 1 of FIG. 1.
  • FIG. 4 is a second external perspective view showing an example of the end effector 10 of the robot arm 1 of FIG. 1.
  • FIG. 5 is a side view showing a part of the configuration of the end effector 10 of FIG. 3.
  • the robot arm 1 has a housing 1a that constitutes the main body, and an end effector 10 that is attached to the housing 1a at the tip of the robot arm 1.
  • the end effector 10 corresponds to the measuring device described in the claims.
  • the end of the end effector 10 opposite the part for gripping an object is attached to the housing 1a, so that the end effector 10 is supported by the housing 1a.
  • the end effector 10 is driven while supported by the housing 1a and grips the object.
  • the end effector 10 contributes to measuring the force received as a reaction when gripping an object.
  • the term "object” includes a solid object that can be grasped by the end effector 10. Without being limited thereto, the object may include any other object that can be grasped by the end effector 10.
  • the end effector 10 is used in a robot.
  • the end effector 10 functions as part of a robot having a robot arm 1.
  • robot includes, for example, industrial robots, nursing robots, marine robots, medical robots, and mobile objects such as vehicles and drones that move by making autonomous decisions.
  • Industrial robots include, for example, collaborative robots that can work together with workers in the same space, and other robots that work in isolation from workers.
  • the end effector 10 is configured as a robot hand or robot gripper in such a robot.
  • the end effector 10 has a main body 11.
  • the main body 11 constitutes the overall external shape of the end effector 10.
  • the main body 11 has an attachment portion 11a that is attached to the housing 1a of the robot arm 1.
  • the main body 11 has a pair of claws 11b that protrude from the end of the attachment portion 11a that is located on the opposite side to the housing 1a.
  • the pair of claws 11b grip an object, for example, by reducing the distance between them to be approximately the same as the width of the object.
  • the claw portion 11b has a gripping portion 11b1 and a detection portion 11b2.
  • the gripping portion 11b1 is located at the tip of the body portion 11 opposite the mounting portion 11a.
  • the gripping portion 11b1 grips an object.
  • the detection portion 11b2 is formed on the body portion 11 so that one end of the detection portion 11b2 is attached to the mounting portion 11a and the other end is continuous with the gripping portion 11b1.
  • the detection portion 11b2 distorts in response to a force applied to the gripping portion 11b1.
  • the detection portion 11b2 is thinner than the gripping portion 11b1 in the separation direction D1 in which the pair of claw portions 11b are separated from each other.
  • the end effector 10 is driven while supported by the housing 1a, and grasps an object with the pair of gripping parts 11b1 located at the tip of the end effector 10 by reducing the separation distance between the pair of gripping parts 11b1 along the separation direction D1 to be approximately the same as the width of the object.
  • the end effector 10 contributes to measuring the force received as a reaction when grasping an object, based on the distortion of the detection part 11b2 caused by the gripping of the object by the gripping parts 11b1.
  • the main body 11 contains resin.
  • the entire main body 11, including the attachment portion 11a and the claw portion 11b, is formed from resin.
  • the detection portion 11b2, which contributes to measuring the reaction force when an object is gripped, also contains resin.
  • the resin contained in the main body portion 11 includes, for example, a thermoplastic resin.
  • the "thermoplastic resin” includes, for example, at least one type selected from the group consisting of general-purpose plastics, engineering plastics, and super engineering plastics.
  • the thermoplastic resin is, for example, a polyarylene sulfide resin. More specifically, the thermoplastic resin includes a polyarylene sulfide resin such as a polyphenylene sulfide resin.
  • the robot arm 1 has an end effector 10 having a main body 11, as well as a memory unit 20, a drive unit 30, and a control unit 40.
  • the memory unit 20, the drive unit 30, and the control unit 40 are housed in a housing 1a of the robot arm 1.
  • the storage unit 20 includes, for example, a semiconductor memory, a magnetic memory, an optical memory, or any combination of these.
  • the storage unit 20 functions, for example, as a main storage device, an auxiliary storage device, or a cache memory.
  • the storage unit 20 stores information used in the operation of the robot arm 1 and information obtained by the operation of the robot arm 1.
  • the storage unit 20 stores system programs, application programs, and various data acquired by any means such as communication.
  • the drive unit 30 includes, for example, any drive mechanism for driving the end effector 10.
  • the drive mechanism includes, for example, a plurality of gears and a motor for rotating the gears.
  • the drive unit 30 drives the end effector 10 in accordance with a control signal from the control unit 40.
  • the drive unit 30 drives the claw portion 11b of the main body portion 11 of the end effector 10 in accordance with a control signal from the control unit 40, for example, so that the claw portion 11b grips an object.
  • the control unit 40 includes a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination of these.
  • the processor is a general-purpose processor such as a CPU or GPU, or a dedicated processor specialized for specific processing.
  • CPU is an abbreviation for Central Processing Unit.
  • GPU is an abbreviation for Graphics Processing Unit.
  • An example of a programmable circuit is an FPGA.
  • FPGA is an abbreviation for Field-Programmable Gate Array.
  • An example of a dedicated circuit is an ASIC.
  • ASIC Application Specific Integrated Circuit.
  • the control unit 40 is communicatively connected to each component that constitutes the robot arm 1, and executes various processes related to the operation of the robot arm 1 while controlling each component.
  • the detection unit 11b2 is formed integrally with the resin and has a circuit CB that outputs an electrical signal that changes according to the distortion of the detection unit 11b2.
  • the circuit CB is formed, for example, on each of the inner surfaces of the pair of claws 11b in the separation direction D1 in which the pair of claws 11b are separated from each other.
  • the inner surface of the claws 11b is a surface that is located on the same side as the ventral side of the claws 11b, which is the side on which the claws 11b grip an object.
  • the circuit CB is formed on the inner surface of the claws 11b over the entire detection unit 11b2 except for the gripping portion 11b1.
  • the circuit CB functions as a sensor that contributes to measuring force.
  • the measurement device has such a sensor integrally.
  • the circuit CB is formed, for example, by drawing directly on the surface of the resin that forms the detection unit 11b2 of the main body 11. In the circuit CB, wiring and electrodes are formed in each area of the surface of the resin that forms the detection unit 11b2.
  • the circuit CB is formed, for example, as a molded circuit using LDS, a type of MID. "MID” is an abbreviation for Molded Interconnect Device. "LDS” is an abbreviation for Laser Direct Structuring.
  • the circuit CB is formed by plating by directly irradiating a laser onto the surface of the detection unit 11b2, which is a molded product.
  • the circuit CB has wiring W formed on the resin surface of the detection portion 11b2.
  • the circuit CB has an input electrode E1 and an output electrode E2 formed on the resin surface of the detection portion 11b2.
  • the input electrode E1 and the output electrode E2 are formed in parallel with each other.
  • the wiring W of the circuit CB includes multiple straight lines connecting the input electrode E1 and the output electrode E2, which are formed integrally with the resin.
  • the wiring W has a connection line W1 that extends linearly from each of the input electrode E1 and the output electrode E2 and is bent at 90 degrees.
  • the wiring W has a gauge line W2 that connects the two ends of the two connection lines W1 that are located on the opposite sides of the input electrode E1 and the output electrode E2.
  • the gauge line W2 functions as a strain gauge.
  • the gauge line W2 is formed by repeatedly folding a straight line 180 degrees at one end and then folding the folded straight line again 180 degrees at the other end.
  • the line width d1 of the wiring W is not particularly limited, but is preferably 1 mm or less, more preferably 500 ⁇ m or less, more preferably 250 ⁇ m or less, more preferably 200 ⁇ m or less, more preferably 150 ⁇ m or less, and even more preferably 100 ⁇ m or less.
  • the lower limit of the width d1 should not be particularly limited, but is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, more preferably 30 ⁇ m or more, more preferably 40 ⁇ m or more, and even more preferably 50 ⁇ m or more.
  • the line spacing d2 between a pair of adjacent gauge lines W2 is not particularly limited, but is preferably 1 mm or less, more preferably 500 ⁇ m or less, more preferably 250 ⁇ m or less, more preferably 200 ⁇ m or less, more preferably 150 ⁇ m or less, and even more preferably 100 ⁇ m or less.
  • the lower limit of the spacing d2 should not be particularly limited, but is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, more preferably 30 ⁇ m or more, more preferably 40 ⁇ m or more, and even more preferably 50 ⁇ m or more.
  • each of the width d1 and the spacing d2 may be narrowed to approximately 50 ⁇ m.
  • the circuit CB formed on the surface of the detection unit 11b2 outputs an electrical signal to the control unit 40 that changes according to the electrical resistance of the wiring W itself.
  • the detection unit 11b2 contributes to the measurement of force by the control unit 40 based on the wiring W itself.
  • the circuit CB includes a strain gauge. More specifically, the circuit CB functions as a strain gauge based on the configuration of the wiring W described above.
  • the wiring W which is formed as multiple straight lines connecting the input electrode E1 and the output electrode E2 is also distorted, and the electrical resistance of the wiring W changes depending on the degree of distortion.
  • the amount of distortion in the detection unit 11b2 and the electrical resistance value of the wiring W are correlated with each other.
  • the voltage between the input electrode E1 and the output electrode E2 changes depending on the distortion of the detection unit 11b2.
  • the circuit CB outputs a voltage signal corresponding to the electrical resistance of the wiring W itself, which changes depending on the distortion of the detection unit 11b2, to the control unit 40 as an example of the above-mentioned electrical signal.
  • the control unit 40 of the robot arm 1 determines whether or not the pair of claws 11b have gripped an object based on an electrical signal output from the circuit CB of the main body 11. At this time, the control unit 40 measures the force applied to the claws 11b based on the electrical signal output from the circuit CB of the detection unit 11b2. For example, the control unit 40 calculates the magnitude of the force applied to the claws 11b based on the electrical signal. More specifically, the control unit 40 measures the magnitude of the force applied to the claws 11b of the end effector 10 by measuring the voltage change between the input electrode E1 and the output electrode E2 based on such an electrical signal. The force magnitude measurement process executed by the control unit 40 of the robot arm 1 will be described.
  • the control unit 40 acquires actual measurement data, for example, in a pre-calibration operation before actually gripping an object using the end effector 10 of the robot arm 1, and stores the data in the memory unit 20.
  • actual measurement data includes, for example, data in which the voltage value of the electrical signal output from the detection unit 11b2 and the magnitude of the force received by the gripping portion 11b1 of the claw portion 11b are associated with each other. Based on such actual measurement data, the control unit 40 calculates an approximation equation or the like that indicates the relationship between the voltage value and the magnitude of the force received by the gripping portion 11b1, and stores the calculated data in the memory unit 20.
  • control unit 40 When the control unit 40 measures the magnitude of the force received by the claws 11b and determines whether the pair of claws 11b has gripped an object, it calculates the magnitude of the force corresponding to the voltage value of the electrical signal output from the detection unit 11b2 while referring to the above approximation formula based on past actual measurement data previously stored in the memory unit 20. The control unit 40 calculates the magnitude of the force received by the gripping unit 11b1 based on past actual measurement data previously acquired by calibration work.
  • a force is applied to the gripping unit 11b1 as a reaction to the force, and the control unit 40 determines that the pair of claws 11b has gripped an object when, for example, the magnitude of the calculated force exceeds a predetermined threshold value.
  • Figure 6 is an enlarged schematic cross-sectional view of a portion of the cross section taken along the line VI-VI in Figure 5.
  • the elastic modulus of the resin contained in the detection section 11b2 located on the claw portion 11b of the end effector 10 is not particularly limited, but is preferably, for example, 1 GPa or more and 50 GPa or less.
  • the circuit CB is integrally formed as a plating layer on the surface of the resin contained in the detection unit 11b2.
  • the gauge wire W2 of the wiring W is shown as part of the circuit CB.
  • the configuration of the gauge wire W2 described below using FIG. 6 also applies to other components of the circuit CB, such as the input electrode E1, output electrode E2, and connection wire W1.
  • the plating layer includes a first layer W21, a second layer W22, and a third layer W23, in that order from the side of the resin contained in the detection portion 11b2.
  • the first layer W21 is formed integrally with the resin contained in the detection portion 11b2.
  • the first layer W21 includes a first metal.
  • the first metal includes a metal that corresponds to the metal oxide.
  • the first metal includes, for example, copper.
  • the second layer W22 is formed directly on the first layer W21.
  • the second layer W22 contains a second metal that reduces rusting of the first metal contained in the first layer W21.
  • the second metal includes, for example, nickel.
  • the third layer W23 is formed directly on the second layer W22.
  • the third layer W23 contains a third metal that has the smallest electrical resistance of the plating layers.
  • the third metal includes, for example, gold.
  • the overall thickness of the plating layer is not particularly limited, but is preferably, for example, 1 ⁇ m to 30 ⁇ m.
  • the thickness of the first layer W21 is not particularly limited, but is preferably, for example, 2 ⁇ m.
  • the thickness of the second layer W22 is not particularly limited, but is preferably, for example, 2 ⁇ m.
  • the thickness of the third layer W23 is not particularly limited, but is preferably, for example, 0.03 ⁇ m.
  • a protective layer P is further formed directly on the circuit CB.
  • the protective layer P covers the circuit CB.
  • the protective layer P is formed directly on the circuit CB where the circuit CB is formed, and is formed directly on the resin contained in the detection section 11b2 while filling in the gaps of the circuit CB where the circuit CB is not formed.
  • the protective layer P contains a resin.
  • the resin contained in the protective layer P includes, for example, a thermosetting resin.
  • "Thermosetting resin” is, for example, an acrylic resin and an epoxy resin.
  • the total thickness of the protective layer P i.e., the height from the surface of the detection portion 11b2, is not particularly limited, but is preferably, for example, 15 ⁇ m.
  • FIG. 7 is a flowchart that explains an example of a manufacturing method for manufacturing the end effector 10 of FIG. 1 as a measuring device.
  • the flowchart shown in FIG. 7 focuses mainly on the steps that are characteristic of this disclosure among all the steps in the manufacturing method of the measuring device, and shows an overview of the manufacturing method of the measuring device.
  • step S101 the method for manufacturing the measuring device includes a first process of forming the main body 11 of the measuring device based on a resin (first resin).
  • the method of manufacturing the measuring device includes a second step of integrally forming a circuit CB, which outputs an electrical signal that changes in response to the distortion of the main body portion 11, on the surface of the first resin as a plating layer.
  • the circuit CB is formed as a plating layer on the surface of the detection portion 11b2 as a molded product by laser irradiation based on LDS.
  • the second step further includes a step of forming a first layer W21 containing a first metal, a step of forming a second layer W22 containing a second metal, and a step of forming a third layer W23 containing a third metal.
  • step S103 the method for manufacturing the measuring device includes a third process of forming a protective layer P that covers the plating layer based on a resin (second resin).
  • the resin used for the main body 11 of the end effector 10 is preferably a thermoplastic resin.
  • the thermoplastic resin is not particularly limited, but examples thereof include polyolefin resins such as polypropylene, polyethylene, and polybutene; polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polyamide resins or aromatic polyamide resins such as nylon-6 and nylon 6,6; thermoplastic polyimide resins; polyamideimide resins; polystyrene resins such as polystyrene, syndiotactic polystyrene, acrylonitrile-styrene copolymer resin, and acrylonitrile-butadiene-styrene copolymer resin; polyarylene sulfide resins such as polyphenylene sulfide; polyphenylene ether resins; polyurethane resins; polylactic acid; polyether ether ketone resins; polyetherimide resins; polyketone resins
  • thermoplastic resins used in one embodiment are preferably so-called engineering plastics or super engineering plastics that have excellent heat resistance and mechanical properties, such as thermoplastic polyimide resins, polyamideimide resins, polyarylene sulfide resins, polyphenylene ether resins, polyether ether ketone resins, polyetherimide resins, polyketone resins, polyarylate resins, and liquid crystal polyester resins.
  • engineering plastics or super engineering plastics that have excellent heat resistance and mechanical properties, such as thermoplastic polyimide resins, polyamideimide resins, polyarylene sulfide resins, polyphenylene ether resins, polyether ether ketone resins, polyetherimide resins, polyketone resins, polyarylate resins, and liquid crystal polyester resins.
  • polyarylene sulfide resins are more preferable, and among polyarylene sulfide resins (hereinafter also referred to as "PAS resins”), polyphenylene sulfide resins (hereinafter also referred to as “PPS resins”) are particularly preferable.
  • PAS resins polyarylene sulfide resins
  • PPS resins polyphenylene sulfide resins
  • the above resins may be used alone or in the form of a polymer alloy in which a plurality of the above resins are mixed.
  • the resin according to one embodiment may contain a filler.
  • the resin containing a filler may contain the filler described below and the above resin, and may be in the form of a composition containing any of the additive components described below (colorant, antistatic agent, antioxidant, heat stabilizer, UV stabilizer, UV absorber, foaming agent, flame retardant, flame retardant assistant, rust inhibitor, coupling agent, silane coupling agent, thermoplastic elastomer, or synthetic resin) as necessary.
  • Polyarylene sulfide resin has a resin structure in which a repeating unit is a structure in which an aromatic ring and a sulfur atom are bonded, and specifically, it is a resin in which the repeating unit is a structural portion represented by the following general formula (1) and, if necessary, a trifunctional structural portion represented by the following general formula (2).
  • R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a nitro group, an amino group, a phenyl group, a methoxy group, or an ethoxy group.
  • the trifunctional structural portion represented by formula (2) is preferably present in an amount of 0.001 to 3 mol %, particularly preferably 0.01 to 1 mol %, based on the total number of moles of the trifunctional structural portion and the other structural portions.
  • the structural portion represented by the above general formula (1) are preferably hydrogen atoms from the viewpoint of the mechanical strength of the PAS resin.
  • examples of the structural portion include those bonded at the para position represented by the following formula (3) and those bonded at the meta position represented by the following formula (4).
  • a structure in which the bond of the sulfur atom to the aromatic ring in the repeating unit is bonded at the para position represented by the above general formula (3) is particularly preferred in terms of the heat resistance and crystallinity of the PAS resin.
  • the PAS resin may contain not only the structural moieties represented by the general formula (1) or (2) above, but also the structural moieties represented by the following structural formulae (5) to (8) in an amount of 30 mol % or less of the total of the structural moieties represented by the general formula (1) and the general formula (2) above.
  • the structural moieties represented by the general formulae (5) to (8) are preferably 10 mol % or less in terms of the heat resistance and mechanical strength of the PAS resin.
  • the bonding mode thereof may be either a random copolymer or a block copolymer.
  • the above PAS resin may have naphthyl sulfide bonds or the like in its molecular structure, but this is preferably 3 mol % or less, and particularly preferably 1 mol % or less, relative to the total number of moles including other structural parts.
  • the physical properties of the PAS resin are not particularly limited as long as they do not impair the effects of one embodiment, but are as follows:
  • the melt viscosity of the PAS resin is not particularly limited, but in order to obtain a good balance between fluidity and mechanical strength, the melt viscosity (V6) measured at 300°C is preferably in the range of 2 Pa ⁇ s or more, preferably in the range of 1000 Pa ⁇ s or less, more preferably in the range of 500 Pa ⁇ s or less, and even more preferably in the range of 200 Pa ⁇ s or less.
  • the non-Newtonian index of the PAS resin is not particularly limited, but is preferably in the range of 0.90 or more to 2.00 or less.
  • the non-Newtonian index is preferably in the range of 0.90 or more, more preferably in the range of 0.95 or more to preferably in the range of 1.50 or less, more preferably in the range of 1.20 or less.
  • Such a polyarylene sulfide resin is excellent in mechanical properties, fluidity, and abrasion resistance.
  • SR is the shear rate (sec -1 )
  • SS is the shear stress (dyne/ cm2 )
  • K is a constant.
  • the resin used in the main body 11 of the end effector 10 is blended with a metal oxide containing at least one of copper and chromium for the purpose of forming a molded circuit using LDS.
  • the metal oxide generates heat when irradiated with a laser in the resulting molded product, melting the resin and roughening the surface of the molded product, and is activated by laser irradiation to selectively form a plating layer.
  • the metal oxide contains at least one of copper and chromium.
  • the metal oxide may further contain other metals such as iron, aluminum, gallium, boron, molybdenum, tungsten, and selenium.
  • the metal oxide include, but are not limited to , CuFe0.5B0.5O2.5 , CuAl0.5B0.5O2.5 , CuGa0.5B0.5O2.5 , CuB2O4 , CuB0.7O2 , CuMo0.7O3 , CuMo0.5O2.5 , CuMoO4 , CuWO4 , CuSeO4 , and CuCr2O4 .
  • the metal oxide is preferably CuCr2O4 , CuFe0.5B0.5O2.5 , or CuAl0.5B0.5O2.5 , and more preferably CuCr2O4 or CuFe0.5B0.5O2.5 .
  • These metal oxides may be used alone or in combination of two or more .
  • the average particle size of the metal oxide is preferably in the range of 0.01 ⁇ m or more, more preferably 0.05 ⁇ m or more, to preferably 50 ⁇ m or less, more preferably 30 ⁇ m or less.
  • the average particle size of the metal oxide is 0.01 ⁇ m or more, efficient and stable production is possible, which is preferable.
  • the average particle size of the metal oxide is 50 ⁇ m or less, it is preferable because material strength can be maintained.
  • "average particle size of the metal oxide” means the number average particle size, and the value measured by electron microscopy is adopted. Specifically, the particle sizes of 100 arbitrarily selected metal oxide particles in one field of view of the electron microscope are measured, and the average value is calculated.
  • the Mohs hardness of the metal oxide is preferably in the range of 4.0 or more, preferably 6.5 or less, more preferably 6.0 or less.
  • the amount of the metal oxide is preferably 15 parts by mass or more, more preferably 20 parts by mass or more, and even more preferably 25 parts by mass or more, and preferably 90 parts by mass or less, relative to 100 parts by mass of the PAS resin.
  • the amount of the metal oxide is 15 parts by mass or more relative to 100 parts by mass of the PAS resin, it is preferable from the viewpoints that the surface roughening and activation of the metal oxide due to laser irradiation can be highly generated in the obtained molded product, and that plating properties are excellent.
  • the amount of the metal oxide is 90 parts by mass or less relative to 100 parts by mass of the PAS resin, it is preferable because the material strength can be maintained.
  • fillers may be any known or commonly used material that does not impair the effect of one embodiment, and examples of such fillers include fillers of various shapes, such as fibrous fillers and non-fibrous fillers such as granular or plate-shaped fillers.
  • fibrous fillers such as glass fiber, carbon fiber, silane glass fiber, ceramic fiber, aramid fiber, metal fiber, potassium titanate, silicon carbide, calcium silicate, wollastonite, and natural fibers
  • non-fibrous fillers such as glass beads, glass flakes, barium sulfate, clay, pyrophyllite, bentonite, sericite, mica, talc, kerolite, pimelite, pyrophyllite, hydrotalcite, kaolinite, attapulgite, ferrite, calcium silicate, calcium carbonate, glass beads, zeolite, milled fiber, and calcium sulfate may also be used.
  • the amount of filler is not particularly limited as long as it does not impair the effect of the embodiment.
  • the amount of filler to be mixed is, for example, preferably 1 part by mass or more, more preferably 10 parts by mass or more, and preferably 600 parts by mass or less, more preferably 200 parts by mass or less, per 100 parts by mass of resin. This range is preferable because the resin exhibits good mechanical strength and moldability.
  • the resin used in the main body 11 of the end effector 10 can contain a silane coupling agent as an optional component, if necessary.
  • a silane coupling agent there are no particular limitations on the silane coupling agent as long as it does not impair the effects of the embodiment, but preferred examples include silane coupling agents having a functional group that reacts with a carboxy group, such as an epoxy group, an isocyanato group, an amino group, or a hydroxyl group.
  • silane coupling agents include epoxy group-containing alkoxysilane compounds such as ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane, and ⁇ -(3,4-epoxycyclohexyl)ethyltrimethoxysilane; isocyanato group-containing alkoxysilane compounds such as ⁇ -isocyanatopropyltrimethoxysilane, ⁇ -isocyanatopropyltriethoxysilane, ⁇ -isocyanatopropylmethyldimethoxysilane, ⁇ -isocyanatopropylmethyldiethoxysilane, ⁇ -isocyanatopropylethyldimethoxysilane, ⁇ -isocyanatopropylethyldiethoxysilane, and ⁇ -isocyanatopropyltrichlorosilane; amino group-containing alkoxysilane compounds such
  • the silane coupling agent is not an essential component, but if it is used, the amount of the silane coupling agent is not particularly limited as long as it does not impair the effect of the embodiment, and is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, to preferably 10 parts by mass or less, more preferably 5 parts by mass or less, relative to 100 parts by mass of the resin. In such a range, the resin has good corona resistance and moldability, especially releasability, and the molded product exhibits excellent adhesion to the epoxy resin while also improving mechanical strength, which is preferable.
  • the resin used in the main body 11 of the end effector 10 may contain a thermoplastic elastomer as an optional component, if necessary.
  • thermoplastic elastomers include polyolefin-based elastomers, fluorine-based elastomers, and silicone-based elastomers, of which polyolefin-based elastomers are preferred.
  • the amount of the elastomers is not particularly limited as long as it does not impair the effects of the embodiment, but is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, to preferably 10 parts by mass or less, more preferably 5 parts by mass or less, per 100 parts by mass of resin (A). This range is preferable because it improves the impact resistance of the resulting resin.
  • the polyolefin-based elastomer may be a homopolymer of an ⁇ -olefin, a copolymer of two or more ⁇ -olefins, or a copolymer of one or more ⁇ -olefins and a vinyl polymerizable compound having a functional group.
  • examples of the ⁇ -olefin include ⁇ -olefins having 2 or more to 8 or less carbon atoms, such as ethylene, propylene, and 1-butene.
  • Examples of the vinyl polymerizable compound having the functional group include one or more of vinyl acetate; ⁇ , ⁇ -unsaturated carboxylic acids such as (meth)acrylic acid; alkyl esters of ⁇ , ⁇ -unsaturated carboxylic acids such as methyl acrylate, ethyl acrylate, and butyl acrylate; metal salts of ⁇ , ⁇ -unsaturated carboxylic acids such as ionomers (metals include alkali metals such as sodium, alkaline earth metals such as calcium, and zinc); glycidyl esters of ⁇ , ⁇ -unsaturated carboxylic acids such as glycidyl methacrylate; ⁇ , ⁇ -unsaturated dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid; and derivatives of the above ⁇ , ⁇ -unsaturated dicarboxylic acids (monoesters, diesters, and acid anhydrides).
  • the resin used in the main body 11 of the end effector 10 may further contain synthetic resins such as polyester resin, polyamide resin, polyimide resin, polyetherimide resin, polycarbonate resin, polyphenylene ether resin, polysulfone resin, polyethersulfone resin, polyetheretherketone resin, polyetherketone resin, polyarylene resin, polyethylene resin, polypropylene resin, polytetrafluoroethylene resin, polydifluoroethylene resin, polystyrene resin, ABS resin, phenolic resin, urethane resin, and liquid crystal polymer (hereinafter simply referred to as synthetic resin) as optional components depending on the application.
  • synthetic resins such as polyester resin, polyamide resin, polyimide resin, polyetherimide resin, polycarbonate resin, polyphenylene ether resin, polysulfone resin, polyethersulfone resin, polyetheretherketone resin, polyetherketone resin, polyarylene resin, polyethylene resin, polypropylene resin, polytetrafluoroethylene resin, poly
  • the above synthetic resins are not essential components, but when they are added, the ratio of the synthetic resins is not particularly limited as long as it does not impair the effects of one embodiment, and it differs depending on each purpose and cannot be generally defined, but the ratio of the synthetic resin to be added to the resin according to one embodiment is, for example, in the range of 5 parts by mass or more and 15 parts by mass or less per 100 parts by mass of resin.
  • the ratio of resin (A) to the total of resin (A) and synthetic resin is preferably in the range of (100/115) or more, and more preferably in the range of (100/105) or more, based on mass.
  • the resin used in the main body 11 of the end effector 10 may contain other known and commonly used additives, such as colorants, antistatic agents, antioxidants, heat stabilizers, UV stabilizers, UV absorbers, foaming agents, flame retardants, flame retardant assistants, rust inhibitors, and coupling agents, as optional components, as necessary.
  • additives are not essential components, and may be used in an amount, for example, preferably 0.01 parts by mass or more and preferably 1000 parts by mass or less per 100 parts by mass of resin, adjusted appropriately according to the purpose and application so as not to impair the effects of one embodiment.
  • the manufacturing method of the resin used for the main body 11 of the end effector 10 in one embodiment is described in detail below.
  • the resin used in the main body 11 of the end effector 10 is a mixture of the essential components and, as necessary, other optional components.
  • the method for producing the resin used in the main body 11 of the end effector 10 in one embodiment is not particularly limited, but includes a method of blending the essential components and, as necessary, the optional components, and melt-kneading them, or, more specifically, a method of uniformly dry-mixing them in a tumbler or Henschel mixer, as necessary, and then feeding them into a twin-screw extruder to melt-knead them.
  • the melt kneading can be carried out by heating the resin to a temperature range in which the resin temperature is equal to or higher than the melting point of the resin, preferably equal to or higher than the melting point + 10°C, more preferably equal to or higher than the melting point + 10°C, even more preferably equal to or higher than the melting point + 20°C, preferably equal to or lower than the melting point + 100°C, more preferably equal to or lower than the melting point + 50°C.
  • the melt kneader is preferably a twin-screw kneading extruder from the viewpoint of dispersibility and productivity.
  • the melt kneader is preferably a twin-screw kneading extruder from the viewpoint of dispersibility and productivity.
  • the components may be added and mixed simultaneously or in portions to the melt kneader.
  • the position of the side feeder is preferably such that the ratio of the distance from the extruder resin input section (top feeder) to the side feeder to the total screw length of the twin-screw kneading extruder is 0.1 or more, and more preferably 0.3 or more. This ratio is preferably 0.9 or less, and more preferably 0.7 or less.
  • the resin according to one embodiment obtained by melt kneading in this manner is a molten mixture containing the above essential components, optional components added as necessary, and components derived from these.
  • the molded product is made by molding a resin.
  • the manufacturing method of the molded product in one embodiment includes a step of melt molding the resin. This is described in detail below.
  • the resin used for the main body 11 of the end effector 10 is subjected to injection molding.
  • molding can be performed using a typical method.
  • the resin is melted in an injection molding machine at a temperature range above the melting point of the resin, preferably above the melting point + 10°C, more preferably from the melting point + 10°C to the melting point + 100°C, and even more preferably from the melting point + 20°C to the melting point + 50°C, after which the resin is injected from a resin outlet into a mold for molding.
  • the mold temperature can also be set to a known temperature range, for example, room temperature (23°C) to 300°C, preferably 120 to 180°C.
  • the end effector 10 as a measuring device obtained by the manufacturing method according to one embodiment as described above can contribute to force measurement with a simpler configuration.
  • the end effector 10 is manufactured by the second process in which the circuit CB, which outputs an electrical signal that changes according to the distortion of the main body 11, is integrally formed as a plating layer on the surface of the resin, and therefore there is no need to additionally mount sensor components such as strain gauges to measure force, as in the conventional technology.
  • the force sensor exists as a separate component and needs to be separately attached to the target device. Therefore, it is necessary to provide extra space in the target device to attach the force sensor as a separate component, or this leads to an increase in the weight of the target device.
  • the end effector 10 can omit the arrangement of lead wires corresponding to the strain gauge.
  • the end effector 10 does not require the arrangement of a separate sheet or film for the sensor components, a substrate for forming an electrical circuit, etc.
  • the end effector 10 does not require the provision of separate joints or bonding parts for the sheets, films, substrates, etc.
  • the end effector 10 can contribute to force measurement with the above-mentioned simpler configuration.
  • the end effector 10 can be made smaller and lighter, with fewer parts, and can satisfy the weight capacity limit of the robot arm 1.
  • the end effector 10 can also improve the freedom of design of its shape.
  • the end effector 10 has improved waterproofing and water resistance because the main body 11 contains resin, and can be washed to prevent the spread of infectious diseases and for other hygienic purposes. Unlike conventional metal end effectors, the end effector 10 is light and rust during washing can be suppressed.
  • the end effector 10 can be manufactured by the manufacturing method shown in FIG. 7, which makes it possible to shorten the manufacturing process. Therefore, the end effector 10 can be delivered as a product in a short delivery time, and it is also possible to reduce the costs from manufacturing to delivery.
  • the manufacturing process for the circuit pattern is diverse, including coating ⁇ resist application ⁇ pre-baking ⁇ exposure ⁇ development and rinsing ⁇ post-baking ⁇ etching ⁇ resist removal.
  • the end effector 10 is manufactured based on the third process in which a protective layer P that covers the plating layer is formed based on a second resin, thereby making it possible to protect the circuit CB as a plating layer.
  • the protective layer P of the end effector 10 makes it possible to reduce defects such as dirt, scratches, and damage to the circuit CB.
  • the circuit CB has wiring W formed on the surface of the resin, and outputs an electrical signal that changes according to the electrical resistance of the wiring W itself.
  • the end effector 10 becomes an integrated molded product that contributes to force measurement by directly drawing the circuit CB on the end effector 10. Since the drawn circuit CB itself serves as the means for transmitting electrical signals in the end effector 10, there is no need to provide additional wiring such as a harness and a board.
  • the end effector 10 does not require a shape and space to accommodate a wired harness and a board on which a circuit is formed, and it is possible to simplify its configuration while avoiding a complex shape.
  • the end effector 10 tends to become electrically charged because the main body 11 contains resin, but even in such cases, the charge can be easily removed by the plated wiring W in the metal circuit CB formed on the surface.
  • the end effector 10 can effectively remove the static electricity that accumulates due to the path shape of the wiring W that is drawn directly on its surface.
  • the end effector 10 can form an optimal circuit pattern according to the ease of bending of the detection portion 11b2, which changes depending on the thickness and material of the claw portion 11b, by setting the line width d1 of the wiring W to 10 ⁇ m or more and 1 mm or less.
  • the resin of the detection portion 11b2 has a high elastic modulus and is formed as a hard claw portion 11b, it is desirable to narrow the width d1 in order to more easily cause a change in the electrical resistance of the wiring W itself even in response to a small distortion in the detection portion 11b2.
  • the end effector 10 can variably set the value of the line width d1 of the wiring W, thereby allowing the detection portion 11b2 to function as a strain gauge with appropriate sensitivity according to the elastic modulus of the resin of the claw portion 11b.
  • the end effector 10 can form an optimal circuit pattern according to the ease of bending of the detection unit 11b2, which changes depending on the thickness and material of the claw portion 11b, by setting the spacing d2 between the lines of the wiring W to 10 ⁇ m or more and 1 mm or less.
  • the resin of the detection unit 11b2 has a high elastic modulus and is formed as a hard claw portion 11b, it is desirable to narrow the spacing d2 in order to more easily cause a change in the electrical resistance of the wiring W itself even in response to a small distortion in the detection unit 11b2.
  • the end effector 10 can variably set the value of the spacing d2 between the lines of the wiring W, thereby allowing the detection unit 11b2 to function as a strain gauge with appropriate sensitivity according to the elastic modulus of the resin of the claw portion 11b.
  • the end effector 10 narrows the width d1 and the spacing d2 to about 50 ⁇ m, so that even minute strains in the detection portion 11b2 can more easily cause changes in the electrical resistance of the wiring W itself. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is minute or the elastic modulus of the resin of the detection portion 11b2 is high. The end effector 10 can cause the detection portion 11b2 to function as a more sensitive strain gauge.
  • the plating layer is formed integrally with the first resin and includes the first layer W21 containing the first metal, which improves the adhesion of the interface between the first resin, which is formed by blending, for example, a metal oxide containing the same metal as the first metal, and the first layer W21. Therefore, the end effector 10 can stably form a plating layer on the surface of the resin of the detection section 11b2.
  • the end effector 10 can reduce rust of the first metal by forming the second layer W22 containing the second metal directly on the first layer W21.
  • the end effector 10 can reduce the electrical resistance experienced by the electrical signal transmitted through the circuit CB by forming the third layer W23 containing the third metal with the smallest electrical resistance directly on the second layer W22.
  • the end effector 10 can contribute to force measurement even when the magnitude of the force is minute or the elastic modulus of the resin of the detection portion 11b2 is high.
  • the end effector 10 can cause the detection portion 11b2 to function as a more sensitive strain gauge.
  • the circuit CB of the end effector 10 includes a strain gauge, it is possible for the end effector 10 to output a voltage signal corresponding to the force applied to the gripping portion 11b1 to the control unit 40. This allows the end effector 10 to contribute to the process of measuring the magnitude of force by the control unit 40.
  • the control unit 40 can accurately calculate the magnitude of the force applied to the gripping portion 11b1 based on the voltage signal obtained from the end effector 10.
  • the resin contains a thermoplastic resin, and the thermoplastic resin is a polyarylene sulfide resin, so that the end effector 10 can have improved waterproof and water resistance.
  • the end effector 10 can also have improved chemical resistance and heat resistance. This enables the end effector 10 to be used in chemicals and high-temperature substances. For example, the end effector 10 can also grip objects that require chemical resistance.
  • the end effector 10 is made of resin containing at least one of copper and chromium, which makes it easy to form molded circuits using LDS.
  • the end effector 10 generates heat when irradiated with a laser due to the metal oxide containing at least one of copper and chromium, and can provide functions such as melting the resin and roughening its surface, and being activated by laser irradiation to selectively form a plating layer.
  • the elastic modulus of the first resin of the end effector 10 is between 1 GPa and 50 GPa, so that the bendability of the claw portion 11b including the detection portion 11b2 can be variably set within that numerical range. Therefore, the end effector 10 can realize an optimal bendability for the claw portion 11b according to the circuit pattern of the strain gauge in the detection portion 11b2. The end effector 10 can optimize the elastic modulus of the first resin of the claw portion 11b so that the detection portion 11b2 contributes to the force measurement.
  • the control unit 40 of the robot arm 1 determines whether or not an object has been grasped based on an electrical signal output from the circuit CB of the main body 11, thereby enabling the robot arm 1 to perform operations such as moving the object. Once the robot arm 1 recognizes that it has grasped the object, it can also move the grasped object from one location to another.
  • the detection unit 11b2 is thinner than the gripping unit 11b1 at the claw portion 11b. This allows the end effector 10 to make the gripping unit 11b1 that comes into contact with the object relatively thick to make the gripping unit 11b1 sturdy, while narrowing the width of the detection unit 11b2 including the strain gauge portion in the circuit CB to make it easier to distort. Therefore, the end effector 10 can contribute to measuring force even when the magnitude of the force is minute or the elastic modulus of the resin of the detection unit 11b2 is high. The end effector 10 can cause the detection unit 11b2 to function as a more sensitive strain gauge.
  • the end effector 10 for example, by having the wiring W of the circuit CB have a pattern as shown in FIG. 5, can more easily cause a change in the electrical resistance of the wiring W itself due to distortion of the detection portion 11b2. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is minute or the elastic modulus of the resin of the detection portion 11b2 is high. The end effector 10 can cause the detection portion 11b2 to function as a more sensitive strain gauge.
  • the shape, pattern, size, arrangement, orientation, type, and number of each of the above-mentioned components are not limited to the above description and the contents illustrated in the drawings.
  • the shape, pattern, size, arrangement, orientation, type, and number of each of the components may be configured arbitrarily as long as the function can be realized.
  • Each of the components of the end effector 10 and robot arm 1 illustrated is a functional concept, and the specific form of each component is not limited to that illustrated.
  • each step in a manufacturing method can be rearranged so as not to cause logical inconsistencies, and multiple steps can be combined into one or divided.
  • the measuring device is described as including the end effector 10, but is not limited to this.
  • the measuring device may include any other device.
  • the measuring device may include other devices used in the joint parts of the robot arm 1 and any other parts of a robot having the robot arm 1, or may include devices such as actuators.
  • the measuring device is not limited to devices for robots such as the end effector 10 used in the robot arm 1, but may include devices used in precision machinery and devices attached to the tip of a viscometer in a stirring device.
  • the measuring device may include all devices that require a sensor such as a strain gauge to be integrally formed.
  • the method for manufacturing the measuring device is described as including a third step of forming the protective layer P covering the plating layer based on the second resin, but is not limited to this.
  • the method for manufacturing the measuring device does not have to include such a third step.
  • the protective layer P does not have to be formed directly above the circuit CB in the end effector 10.
  • the circuit CB may be exposed without being covered by the protective layer P.
  • the circuit CB has wiring W formed on the surface of the resin, and outputs an electrical signal that changes according to the electrical resistance of the wiring W itself, but this is not limited to the above.
  • the circuit CB may have a substrate that is integrally molded with the resin of the main body 11, and wiring formed on the substrate, and output an electrical signal that changes according to the electrical resistance of the wiring itself.
  • the circuit CB may be configured based on a substrate that is molded integrally with resin by insert molding, for example.
  • the wiring and electrodes may be formed on the substrate.
  • the circuit CB may be configured as a molded circuit using an IME, for example, of the MID. "IME" is an abbreviation for In-Mold Electronics.
  • the circuit CB may be formed by inserting a flexible substrate or the like during injection molding. In this way, the end effector 10 becomes an integrated molded product that contributes to force measurement by molding the substrate integrally with the resin.
  • the circuit CB has been described as contributing to the force measurement based on the wiring W itself, but this is not limited to the above.
  • the circuit CB may have a sensor component that contributes to the force measurement and is mounted on the circuit CB by soldering or the like, instead of or in addition to the wiring W that contributes to the force measurement.
  • the circuit CB may have a control element that is mounted on the circuit CB by soldering or the like and that executes the processes necessary to realize the force measurement.
  • the "control element” may include, for example, a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination of these. This allows the end effector 10 to execute the various processes described above that are performed by the control unit 40 of the robot arm 1 by itself. The end effector 10 can also execute the judgment process, learning process, and any other process by itself.
  • the line width d1 of the wiring W is described as being 10 ⁇ m or more and 1 mm or less, but is not limited to this.
  • the line width d1 of the wiring W does not have to be included in such a numerical range.
  • the spacing d2 between the lines of the wiring W is described as being 10 ⁇ m or more and 1 mm or less, but is not limited to this.
  • the spacing d2 between the lines of the wiring W does not have to be included in this numerical range.
  • the plating layer is described as including the first layer W21, the second layer W22, and the third layer W23, in that order, but is not limited to this.
  • the plating layer is not limited to a three-layer structure, and may include at least one layer.
  • the plating layer is described as containing copper, nickel, and gold as the first metal, the second metal, and the third metal, respectively, but is not limited to this.
  • the plating layer may contain a nickel alloy.
  • nickel alloy includes nickel-copper alloy, nickel-gold alloy, nickel-chromium alloy, etc. This improves the properties of the plating layer, such as corrosion resistance, thermal conductivity, and oxidation resistance.
  • the thickness of the plating layer is described as being 1 ⁇ m or more and 30 ⁇ m or less, but is not limited to this.
  • the thickness of the plating layer does not have to be included in such a numerical range.
  • the circuit CB is described as including a strain gauge, but is not limited to this.
  • the circuit CB may include any other components that can contribute to the force measurement of the end effector 10.
  • the elastic modulus of the first resin is described as being 1 GPa or more and 50 GPa or less, but is not limited to this.
  • the elastic modulus of the first resin does not have to be included in such a numerical range.
  • the first resin is described as being composed of a metal oxide containing at least one of copper and chromium, but this is not limited thereto.
  • the first resin does not have to be composed of such a metal oxide. Even if the first resin does not contain a metal oxide, the formation of a plating layer by LDS is possible due to the anchor effect.
  • the plating is physically integrated with the first resin by flowing a plating catalyst into holes formed by melting the resin with laser irradiation and roughening the surface of the molded product.
  • control unit 40 of the robot arm 1 determines whether or not an object has been grasped based on the electrical signal output from the circuit CB of the main body 11, but this is not limited to the above.
  • the control unit 40 does not have to perform such a determination process.
  • the end effector 10 contributes to measuring the force, and the control unit 40 of the robot arm 1 calculates the magnitude of the force applied to the claw portion 11b based on the electrical signal, but this is not limited to the above.
  • the end effector 10 may contribute to measuring not only the magnitude of the force but also the direction of the force, for example, by appropriately arranging multiple strain gauges.
  • the end effector 10 may also contribute to measuring, for example, six axial directions, i.e., three axial directions of the X-axis, Y-axis, and Z-axis, as well as the rotational directions around each axis.
  • the end effector 10 may have an integrated force sensor as a sensor formed in the detection unit 11b2.
  • the detection portion 11b2 is described as being thinner than the gripping portion 11b1, but this is not limited to the above.
  • the detection portion 11b2 may be the same width as the gripping portion 11b1 or may be thicker than the gripping portion 11b1, as long as the end effector 10 can contribute to measuring the force.
  • the entire body 11 is described as being made of resin, but this is not limited to the above. It is sufficient that at least the portion of the body 11 in which the circuit CB is formed is made of resin, and other parts of the body 11 may be made of any material other than resin.
  • the end effector 10 has only one pair of claws 11b on the main body 11, but this is not limited to the above.
  • the end effector 10 may have three or more claws 11b, or only one.
  • control unit 40 of the robot arm 1 is described as measuring the magnitude of the force based on past actual measurement data acquired in advance by a calibration operation, but this is not limited to the above.
  • the control unit 40 may calculate the magnitude of the force without using such past actual measurement data. For example, if the control unit 40 is able to refer to information such as a theoretical formula for calculating the magnitude of the force, which includes as a parameter the voltage value of the electrical signal output from the circuit CB of the detection unit 11b2, the control unit 40 may calculate the magnitude of the force based on the theoretical formula.
  • a method for manufacturing a measuring device having an integral sensor that contributes to the measurement of a force comprising the steps of: A first step of forming a body portion of the measuring device based on a first resin; a second step of integrally forming a circuit for outputting an electrical signal that changes in response to a distortion of the main body portion as a plating layer on a surface of the first resin; Including, A method for manufacturing a measuring device.
  • [Appendix 2] A method for manufacturing the measurement device according to claim 1, comprising the steps of: The method further includes a third step of forming a protective layer covering the plating layer based on a second resin.
  • a method for manufacturing a measuring device [Appendix 3] A method for manufacturing the measuring device according to claim 1 or 2, comprising the steps of: the circuit has wiring formed on a surface of the first resin, and outputs the electrical signal that changes depending on the electrical resistance of the wiring itself. A method for manufacturing a measuring device.
  • [Appendix 4] A method for manufacturing the measurement device according to claim 3, comprising the steps of: The width of the wiring line is 10 ⁇ m or more and 1 mm or less. A method for manufacturing a measuring device.
  • [Appendix 5] A method for manufacturing a measuring device according to claim 3 or 4, comprising the steps of: The spacing between the lines of the wiring is 10 ⁇ m or more and 1 mm or less.
  • [Appendix 6] A method for manufacturing a measuring device according to any one of claims 1 to 5, comprising the steps of: the plating layer is formed integrally with the first resin and includes, in that order, a first layer containing a first metal, a second layer containing a second metal that reduces rust of the first metal, and a third layer containing a third metal having the smallest electrical resistance; A method for manufacturing a measuring device.
  • [Appendix 7] A method for manufacturing a measuring device according to any one of claims 1 to 6, comprising the steps of: The plating layer contains a nickel alloy.
  • [Appendix 8] A method for manufacturing a measuring device according to any one of claims 1 to 7, comprising the steps of: The thickness of the plating layer is 1 ⁇ m or more and 30 ⁇ m or less.
  • [Appendix 9] A method for manufacturing a measuring device according to any one of claims 1 to 8, comprising the steps of: the circuit includes a strain gauge; A method for manufacturing a measuring device.
  • the first resin includes a thermoplastic resin.
  • a method for manufacturing a measuring device comprising the steps of:
  • the thermoplastic resin includes at least one selected from the group consisting of general-purpose plastics, engineering plastics, and super engineering plastics.
  • a method for manufacturing a measuring device comprising the steps of:
  • the thermoplastic resin is a polyarylene sulfide resin.
  • [Appendix 13] A method for manufacturing a measuring device according to any one of claims 1 to 12, comprising the steps of: The elastic modulus of the first resin is 1 GPa or more and 50 GPa or less.
  • [Appendix 14] A method for manufacturing a measuring device according to any one of claims 1 to 13, comprising the steps of: The first resin is formed by blending a metal oxide containing at least one of copper and chromium.
  • [Appendix 15] A robot arm comprising, as an end effector, a measuring device manufactured by the measuring device manufacturing method according to any one of appendices 1 to 14. [Appendix 16] 16.
  • the robotic arm of claim 15, a control unit that determines whether or not an object is gripped based on the electrical signal output from the circuit of the main body unit, Robot arm.
  • the robot arm of claim 15, The main body of the measuring device is A gripping unit that grips an object; a detection unit that is distorted in response to a force applied to the gripping unit and has the circuit; Equipped with The detection portion is thinner than the grip portion. Robot arm.

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155676A (ja) * 1986-12-19 1988-06-28 Agency Of Ind Science & Technol 触覚センサ
JP2004117172A (ja) * 2002-09-26 2004-04-15 Kyocera Corp 圧力検出装置用パッケージ
JP2006250705A (ja) * 2005-03-10 2006-09-21 Toshiba Corp 触覚センサー
JP2011169749A (ja) * 2010-02-18 2011-09-01 Advanced Telecommunication Research Institute International 触覚センサおよびそれを備えたロボット
JP2014024947A (ja) * 2012-07-26 2014-02-06 Dic Corp ポリアリーレンスルフィド樹脂組成物および成形体
US20140222199A1 (en) * 2013-02-07 2014-08-07 The U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration Grasp assist device with shared tendon actuator assembly
JP2019111590A (ja) * 2017-12-21 2019-07-11 日本精工株式会社 把持装置
JP2020034425A (ja) * 2018-08-30 2020-03-05 トヨタ自動車株式会社 センサシステム、ロボットハンド、センサシステムの較正方法、およびプログラム
JP2021113308A (ja) * 2020-01-20 2021-08-05 ユニチカ株式会社 熱伝導性樹脂組成物およびそれからなる成形体

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155676A (ja) * 1986-12-19 1988-06-28 Agency Of Ind Science & Technol 触覚センサ
JP2004117172A (ja) * 2002-09-26 2004-04-15 Kyocera Corp 圧力検出装置用パッケージ
JP2006250705A (ja) * 2005-03-10 2006-09-21 Toshiba Corp 触覚センサー
JP2011169749A (ja) * 2010-02-18 2011-09-01 Advanced Telecommunication Research Institute International 触覚センサおよびそれを備えたロボット
JP2014024947A (ja) * 2012-07-26 2014-02-06 Dic Corp ポリアリーレンスルフィド樹脂組成物および成形体
US20140222199A1 (en) * 2013-02-07 2014-08-07 The U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration Grasp assist device with shared tendon actuator assembly
JP2019111590A (ja) * 2017-12-21 2019-07-11 日本精工株式会社 把持装置
JP2020034425A (ja) * 2018-08-30 2020-03-05 トヨタ自動車株式会社 センサシステム、ロボットハンド、センサシステムの較正方法、およびプログラム
JP2021113308A (ja) * 2020-01-20 2021-08-05 ユニチカ株式会社 熱伝導性樹脂組成物およびそれからなる成形体

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