Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/05—Alcohols; Metal alcoholates
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/15—Heterocyclic compounds having oxygen in the ring
  • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
  • C08K5/1525—Four-membered rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/49—Phosphorus-containing compounds
  • C08K5/51—Phosphorus bound to oxygen
  • C08K5/52—Phosphorus bound to oxygen only
  • C08K5/527—Cyclic esters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates

Definitions

• the present invention relates to a resin composition, pellets, and molded articles.
• the present invention relates to a resin composition whose main component is polycarbonate resin.
• Patent Document 1 discloses polycarbonate resin composition pellets containing a polycarbonate resin (A), an aromatic compound (B) represented by the following formula, and a phosphorus-based stabilizer (C), characterized in that the content of the aromatic compound (B) in the pellets is 0.001 to 1 mass %, and the content of the phosphorus-based stabilizer (C) is 0.003 to 0.5 mass %.
• Y is an organic group that does not contain any of the elements nitrogen, sulfur, and halogen, or a hydrogen atom.
• X is an alkyl group or an aryl group which may have a substituent
• Y is an organic group which does not contain any of the elements nitrogen, sulfur, and halogen
• X is an organic group which does not contain any of the elements nitrogen, sulfur, and halogen
• X and Y may be the same or different.
• g represents an integer of 1 or 2;
• n represents an integer of 0 to 5, and when n is 2 or more, the n X's may be the same or different.
• k represents an integer of 1 to 4, and when k is 2 or more, the two or more -(CH 2 ) g OY groups in which Y is the organic group may be the same or different, provided that n+k is 6 or less.
• resin molded products used for components that require transparency are required to have a low YI value and high transmittance.
• molded products formed from the resin composition described in Patent Document 1 have an excellent YI value.
• a molded article molded from the resin composition described in Patent Document 1 is not necessarily suitable for applications requiring high light transmittance in the visible region.
• the present invention has an object to solve the above problems, and to provide a resin composition, pellets, and a molded article that can provide a molded article having a low YI value and high light transmittance in the visible region.
• a resin composition comprising, per 100 parts by mass of a polycarbonate resin, 0.01 to 1.5 parts by mass of a compound represented by formula (1) and 0.01 to 1.5 parts by mass of an epoxy compound and/or an oxetane compound, wherein the content of a phosphite compound having a structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass of the resin composition.
• R 1 to R 3 are each independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms
• R 4 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms or a group represented by -OR 5
• R 5 is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms
• n is an integer of 0 to 2.
• R 11 to R 31 are each independently a hydrogen atom or a methyl group
• R 41 is a hydrogen atom, a methyl group, or a group represented by —OR 51
• R 51 is a hydrogen atom or a methyl group.
• R 11 is a hydrogen atom or a methyl group
• R 21 is a hydrogen atom or a methyl group
• R 31 is a methyl group or a methoxy group.
• ⁇ 6> The resin composition according to any one of ⁇ 1> to ⁇ 5>, wherein the compound represented by formula (1) is a compound selected from the following: ⁇ 7> Pellets of the resin composition according to any one of ⁇ 1> to ⁇ 6>.
• ⁇ 8> A molded article formed from the resin composition according to any one of ⁇ 1> to ⁇ 6>.
• ⁇ 9> A molded article formed from the pellets according to ⁇ 7>.
• the present invention makes it possible to provide a resin composition, pellets, and molded articles that have a low YI value and a molded article with high light transmittance in the visible range.
• the present embodiment is an example for explaining the present invention, and the present invention is not limited to the present embodiment.
• the word "to” is used to mean that the numerical values before and after it are included as the lower limit and upper limit.
• various physical properties and characteristic values are those at 23° C. unless otherwise specified. If the measurement methods, etc. described in the standards shown in this specification vary from year to year, they will be based on the standards as of January 1, 2023, unless otherwise specified.
• the resin composition of the present embodiment is a resin composition containing 0.01 to 1.5 parts by mass of a compound represented by formula (1) and 0.01 to 1.5 parts by mass of an epoxy compound and/or an oxetane compound, and is characterized in that the content of the phosphite compound having a structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass of the resin composition.
• R 1 to R 3 are each independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms
• R 4 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms or a group represented by -OR 5
• R 5 is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms
• n is an integer of 0 to 2.
• a resin composition capable of providing a molded article having a low YI value and a high light transmittance in the visible region can be obtained.
• a resin composition capable of providing a molded article having a low initial YI value and a low YI value after heating can be obtained.
• a resin composition capable of providing a molded article having a small ⁇ YI value (YI value after heating - initial YI value) can be obtained. That is, in this embodiment, the improvement of the hue is achieved by blending the compound represented by formula (1). It is considered that the -CH2 portion of the benzene ring of the compound represented by formula (1) undergoes a reduction reaction, suppressing an increase in the hue.
• the epoxy compound and/or the oxetane compound can suppress the decrease in the light transmittance of visible light. Furthermore, the epoxy compound and/or the oxetane compound can moderate the degree of increase in the YI value upon heating.
• the content of the phosphite compound having the structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass of the resin composition. That is, the resin composition does not contain, or substantially does not contain, the phosphite compound having the structure represented by formula (P).
• the resin composition of the present embodiment contains a polycarbonate resin.
• the polycarbonate resin is preferably an aromatic polycarbonate resin, and more preferably a polycarbonate resin having a bisphenol skeleton.
• the polycarbonate resin having a bisphenol skeleton is preferably a structural unit having a bisphenol skeleton in 90 mol % or more of all structural units, more preferably a structural unit having at least one skeleton of bisphenol A, bisphenol C, and bisphenol AP, and even more preferably a structural unit having a bisphenol A skeleton in 90 mol % or more of all structural units.
• the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 10,000 or more, more preferably 12,000 or more, and even more preferably 15,000 or more. By making it equal to or more than the lower limit, the durability of the molded article obtained tends to be further improved.
• the upper limit of the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 50,000 or less, more preferably 40,000 or less, even more preferably 30,000 or less, even more preferably 25,000 or less, and even more preferably 20,000 or less. By making it equal to or less than the upper limit, the moldability of the molded article tends to be further improved.
• the viscosity average molecular weight is the viscosity average molecular weight of the mixture.
• the method for producing the polycarbonate resin is not particularly limited, and polycarbonate resins produced by the conventionally known phosgene method (interfacial polymerization method) or melt method (ester exchange method) can be used.
• polycarbonate resins with an adjusted amount of OH groups in the terminal groups can be used.
• the polycarbonate resin used in this embodiment may be recycled polycarbonate resin (including recovered products, material recycled products, chemical recycled products, etc.), rejected products, or scraps from thermoplastic resin molding.
• the content of the polycarbonate resin in the resin composition of this embodiment is preferably 85% by mass or more of the resin composition, more preferably 90% by mass or more, even more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 98% by mass or more.
• the upper limit of the content of the polycarbonate resin in the resin composition is an amount such that the total of the polycarbonate resin, the compound represented by formula (1), and the epoxy compound and/or the oxetane compound is 100% by mass.
• the resin composition of the present embodiment may contain only one type of polycarbonate resin, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
• the resin composition of the present embodiment contains 0.01 to 1.5 parts by mass of the compound represented by formula (1) relative to 100 parts by mass of the polycarbonate resin.
• the YI value of the obtained molded article can be reduced.
• R 1 to R 3 are each independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms
• R 4 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms or a group represented by -OR 5
• R 5 is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms
• n is an integer of 0 to 2.
• R 1 to R 3 are each independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, preferably a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 3 carbon atoms, and even more preferably a hydrogen atom or a methyl group.
• R 4 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms or a group represented by -OR 5 , preferably a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a group represented by -OR 5 , more preferably a hydrogen atom, an unsubstituted alkyl group having 1 to 5 carbon atoms, or a group represented by -OR 5 , more preferably a hydrogen atom, an unsubstituted alkyl group having 1 to 3 carbon atoms, or a group represented by -OR 5 , and even more preferably a hydrogen atom, a methyl group, or a group represented by -OR 5 (preferably a methoxy group).
• R 5 is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, preferably a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 3 carbon atoms, and even more preferably a hydrogen atom or a methyl group.
• n is an integer from 0 to 2, preferably 0 or 1, and more preferably 1.
• formula (1) is represented by formula (1-1).
• R 11 to R 31 are each independently a hydrogen atom or a methyl group
• R 41 is a hydrogen atom, a methyl group, or a group represented by —OR 51
• R 51 is a hydrogen atom or a methyl group.
• R 11 is preferably a hydrogen atom or a methyl group
• R 21 is preferably a hydrogen atom or a methyl group
• R 31 is preferably a methyl group or a methoxy group
• R 41 is preferably a hydrogen atom, a methyl group, or a methoxy group.
• the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more. By making it equal to or more than the lower limit, the transmittance in the short wavelength region tends to be further improved.
• the upper limit of the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) is preferably 5 or less, more preferably 4 or less. By making it equal to or less than the upper limit, the transmittance in the short wavelength region tends to be further improved.
• the total number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) and the total number of hydrogen atoms bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) is preferably 3 or more, more preferably 4 or more, even more preferably 5 or more, and even more preferably 6 or more. By making it equal to or greater than the lower limit, the transmittance in the short wavelength region tends to be further improved.
• the upper limit of the total number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) and the total number of hydrogen atoms bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) is preferably 6 or less. By making it equal to or less than the upper limit, the transmittance in the short wavelength region tends to be further improved.
• the resin composition of the present embodiment contains two or more types of compounds represented by formula (1)
• the total number of hydrogen atoms is the sum of the number of hydrogen atoms (or the number of hydrogen atoms at benzyl positions) of each compound represented by formula (1) and the addition concentration.
• the content of the compound represented by formula (1) in the resin composition of this embodiment is 0.01 parts by mass or more, preferably 0.05 parts by mass or more, more preferably 0.08 parts by mass or more, more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and even more preferably 0.5 parts by mass or more, relative to 100 parts by mass of polycarbonate resin.
• the transmittance in the short wavelength region tends to be further improved.
• the content of the compound represented by formula (1) is 1.5 parts by mass or less, preferably 1.3 parts by mass or less, more preferably 1.2 parts by mass or less, even more preferably 1.1 parts by mass or less, even more preferably 1.0 parts by mass or less, and even more preferably 0.9 parts by mass or less, relative to 100 parts by mass of polycarbonate resin.
• the resin composition of the present embodiment may contain only one type of compound represented by formula (1), or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
• the resin composition of the present embodiment contains an epoxy compound and/or an oxetane compound.
• an epoxy compound and/or an oxetane compound By containing an epoxy compound and/or an oxetane compound, it is possible to reduce the YI value and the YI value after heating, and to obtain a molded product having excellent light transmittance in visible light.
• the epoxy compound means a compound containing an epoxy group, and may contain only one epoxy group or two or more epoxy groups in one molecule, but preferably contains one to four epoxy groups, more preferably contains one to three epoxy groups, and even more preferably contains two epoxy groups.
• the oxetane compound means a compound containing an oxetanyl group, and may contain only one oxetanyl group or two or more oxetanyl groups in one molecule, but preferably contains one to four oxetanyl groups, more preferably contains one to three oxetanyl groups, and even more preferably contains two oxetanyl groups.
• the composition contains at least an epoxy compound.
• the molecular weight of the epoxy compound and/or oxetane compound is not particularly limited, but is preferably 100 or more, and is preferably 1500 or less, more preferably 1000 or less, even more preferably 800 or less, and may be 500 or less.
• the epoxy compound and/or the oxetane compound is preferably an alicyclic epoxy compound and/or an alicyclic oxetane compound.
• the alicyclic epoxy compound and/or alicyclic oxetane compound used in the present embodiment is preferably a compound represented by formula (2), a compound represented by formula (3), or a compound represented by formula (4), more preferably a compound represented by formula (2) and/or a compound represented by formula (4), and further preferably a compound represented by formula (2).
• Equation (2) (In formula (2), A 1 represents a divalent organic group.)
• a 1 is preferably a hydrocarbon group having 1 to 10 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, and more preferably an alkylene group having 1 to 10 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups.
• the alkylene group may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear.
• Preferred examples of the compound represented by formula (2) include the following compounds. Equation (3) (In formula (3), A2 and A3 each independently represent a divalent organic group.)
• each A 2 is independently preferably a hydrocarbon group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms, and even more preferably an alkylene group having 1 to 3 carbon atoms.
• a 3 is preferably a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, and even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, or a group consisting of a combination of two or more of the above groups.
• the end of A 3 is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, and even more preferably an alkylene group having 1 to 10 carbon atoms.
• Preferred examples of the compound represented by formula (3) include the following compounds. n is an arbitrary integer, preferably 1 to 11.
• Equation (4) (In formula (4), A4 and A5 each independently represent a divalent organic group.
• R a is an alkyl group having 1 to 5 carbon atoms, and nb is 0 or 1.)
• a 4 is preferably each independently a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, or a group consisting of a combination of two or more of the above groups, still more preferably an alkylene group having 1 to 10 carbon atoms, still more preferably an alkylene group having 1 to 3 carbon atoms, and still more preferably an ethylene group or a methylene group.
• the end of A5 is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, even more preferably an alkylene group having 1 to 10 carbon atoms, and even more preferably an alkylene group having 1 to 3 carbon atoms.
• R a is preferably an alkyl group having 1 to 3 carbon atoms, and is preferably a methyl group or an ethyl group.
• nb is preferably 1.
• Preferred examples of the compound represented by formula (4) include the following compounds.
• Preferred examples of the epoxy compound and/or oxetane compound used in this embodiment include, in addition to the above, the compounds described in paragraphs 0043 to 0069 of JP2021-038306A and paragraphs 0023 to 0037 of JP2021-031658A, the contents of which are incorporated herein by reference.
• the content of the epoxy compound and/or oxetane compound (preferably epoxy compound) in the resin composition of this embodiment is 0.01 parts by mass or more, preferably 0.05 parts by mass or more, more preferably 0.08 parts by mass or more, even more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and even more preferably 0.5 parts by mass or more, relative to 100 parts by mass of the polycarbonate resin.
• the long-term thermal stability tends to be further improved.
• the content of the epoxy compound and/or oxetane compound is 1.5 parts by mass or less, preferably 1.3 parts by mass or less, more preferably 1.2 parts by mass or less, even more preferably 1.1 parts by mass or less, even more preferably 1.0 parts by mass or less, and even more preferably 0.9 parts by mass or less, relative to 100 parts by mass of the polycarbonate resin.
• the resin composition of the present embodiment may contain only one type of epoxy compound and oxetane compound (preferably an epoxy compound), or may contain two or more types. When two or more types are contained, it is preferable that the total amount is in the above range.
• the resin composition of the present embodiment may contain a stabilizer other than the phosphite compound having the structure represented by formula (P).
• the stabilizers include heat stabilizers and antioxidants. Examples of the stabilizer include phenol-based, amine-based, phosphorus-based, and thioether-based stabilizers. Among these, in the present embodiment, it is preferable to include a phosphorus-based heat stabilizer.
• any known phosphorus-based heat stabilizer can be used.
• Specific examples include phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate; phosphates of Group 1 or Group 2B metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; organic phosphate compounds, organic phosphite compounds, and organic phosphonite compounds, with organic phosphite compounds other than those having the structure represented by formula (P) being particularly preferred.
• phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid
• metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphat
• organic phosphite compound examples include triphenyl phosphite, tris(mononylphenyl)phosphite, tris(mononyl/dinonyl-phenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, monooctyldiphenyl phosphite, dioctylmonophenyl phosphite, monodecyldiphenyl phosphite, didecylmonophenyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, and 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite.
• organic phosphite compounds include "ADK STAB (registered trademark; the same applies hereinafter) 1178,""ADK STAB 2112," and “ADK STAB HP-10” manufactured by ADEKA CORPORATION, "JP-351,””JP-360,” and “JP-3CP” manufactured by Johoku Chemical Industry Co., Ltd., and "IRGAFOS (registered trademark; the same applies hereinafter) 168" manufactured by BASF SE.
• a hindered phenol-based antioxidant is preferably used as the phenol-based antioxidant.
• Specific examples of hindered phenol-based antioxidants include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphate, 4,6-bis(
• pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate are preferred.
• hindered phenol-based antioxidants include "Irganox (registered trademark; the same applies below) 1010" and “Irganox 1076" manufactured by BASF, and "Adeka STAB AO-50" and "Adeka STAB AO-60” manufactured by ADEKA.
• the content of the stabilizer (preferably a phosphorus-based stabilizer other than a phosphite compound having a structure represented by formula (P)) in the resin composition of this embodiment is usually 0.001 part by mass or more, preferably 0.005 part by mass or more, more preferably 0.01 part by mass or more, and usually 1 part by mass or less, preferably 0.5 part by mass or less, more preferably 0.3 part by mass or less, relative to 100 parts by mass of the polycarbonate resin.
• the resin composition of the present embodiment may contain only one type of stabilizer, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
• the content of the phosphite compound having the structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass, preferably less than 0.001% by mass, and more preferably less than 0.0001% by mass.
• the resin composition by configuring the resin composition to be substantially free of the compound represented by formula (P), a molded product having excellent light transmittance for visible light can be obtained.
• Examples of compounds represented by formula (P) include distearyl pentaerythritol diphosphite, bis(decyl)pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, and bis(nonylphenyl)pentaerythritol diphosphite.
• the resin composition of the present embodiment may contain a mold release agent.
• a mold release agent By blending a mold release agent, the mold releasability can be further improved.
• the release agent include aliphatic carboxylic acids, salts of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15,000, polysiloxane-based silicone oils, ketone waxes, and light amides. Of these, aliphatic carboxylic acids, salts of aliphatic carboxylic acids, and esters of aliphatic carboxylic acids and alcohols are preferred.
• the release agent For details of the release agent, please refer to paragraphs 0055 to 0061 of JP2018-095706A, the contents of which are incorporated herein by reference.
• the content thereof in the resin composition is preferably 0.01 to 3 mass %.
• the resin composition of the present embodiment may contain only one type of release agent, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
• the resin composition of the present embodiment may contain other components as necessary, as long as the desired physical properties are not significantly impaired.
• the other components include various resin additives.
• resin additives include ultraviolet absorbers, colorants (dyes, pigments), antistatic agents, flame retardants, flame retardant assistants, anti-dripping agents, anti-fogging agents, anti-blocking agents, flow improvers, plasticizers, dispersants, antibacterial agents, etc.
• the resin additives may be contained alone or in any combination and ratio of two or more kinds.
• the resin composition of this embodiment preferably has a low YI value when molded into a 300 mm long optical path molded product.
• the YI value when the resin composition of this embodiment is molded into a 300 mm long optical path molded product is preferably 17.4 or less, more preferably 15.0 or less, and even more preferably 13.0 or less.
• the lower limit of the YI value is ideally 0, but even if it is 1.0 or more, further 5.0 or more, and particularly 10.0 or more, the required performance is sufficiently met.
• Such a low YI value is achieved by blending a compound represented by formula (1).
• the resin composition of this embodiment preferably has a low YI value when molded into a 300 mm long optical path molded product and heated.
• the ⁇ YI value when the resin composition of this embodiment is molded into a 300 mm long optical path molded product and heated at 120 ° C. for 500 hours is preferably 15 or less, more preferably 10 or less, and even more preferably 5 or less.
• the lower limit of the YI value is ideally 0, but 1.0 or more, further 5 or more, and particularly 15 or more will sufficiently satisfy the required performance.
• Such a low YI value is achieved by blending the compound represented by formula (1) with an epoxy compound and/or an oxetane compound.
• the resin composition of this embodiment preferably has a light transmittance at a wavelength of 400 nm when molded into a 300 mm long optical path molded product of 40% or more, more preferably 42% or more, more preferably 48% or more, even more preferably 50% or more, and even more preferably 52% or more.
• the upper limit of the light transmittance at a wavelength of 400 nm is not particularly set, but 42% or less is practical, and even 40% or less sufficiently satisfies the required performance.
• the resin composition of this embodiment preferably has a light transmittance at a wavelength of 420 nm when molded into a 300 mm long optical path molded product of 52% or more, more preferably 55% or more, more preferably 59% or more, even more preferably 61% or more, and even more preferably 63% or more.
• a light transmittance at a wavelength of 420 nm is practical, and even 50% or less sufficiently satisfies the required performance.
• the resin composition of this embodiment preferably has a light transmittance at a wavelength of 500 nm when molded into a 300 mm long optical path molded product of 57% or more, more preferably 60% or more, more preferably 63% or more, even more preferably 66% or more, and even more preferably 69% or more.
• a light transmittance at a wavelength of 500 nm is measured according to the method described in the Examples section below.
• the method for producing the resin composition of the present embodiment is not limited, and a wide variety of known methods for producing resin compositions can be used.
• a method in which a polycarbonate resin, a compound represented by formula (1), an epoxy compound and/or an oxetane compound, and other components to be mixed as necessary are mixed in advance using various mixers such as a tumbler or a Henschel mixer, and then melt-kneaded using a mixer such as a Banbury mixer, a roll, a Brabender, a single-screw kneading extruder, a twin-screw kneading extruder, or a kneader can be used.
• the temperature for melt-kneading is not particularly limited, but is usually in the range of 240 to 320°C.
• the molded article of this embodiment is formed from the resin composition or pellets of this embodiment.
• the above-mentioned resin composition (for example, pellets) is molded into a molded article by various molding methods.
• the shape of the molded article is not particularly limited and can be appropriately selected depending on the use and purpose of the molded article, and examples thereof include film-shaped, rod-shaped, cylindrical, annular, circular, elliptical, polygonal, irregular, hollow, frame-shaped, box-shaped, panel-shaped, and button-shaped articles.
• the method for forming the molded product is not particularly limited, and any conventionally known molding method can be used, such as injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, hollow molding, gas-assisted hollow molding, blow molding, extrusion blow molding, IMC (in-mold coating molding), rotational molding, multi-layer molding, two-color molding, insert molding, sandwich molding, foam molding, and pressure molding.
• the resin composition of this embodiment is suitable for molded products obtained by injection molding, injection compression molding, and extrusion molding.
• the resin composition of this embodiment is not limited to molded products obtained by these methods.
• the molded article of this embodiment can be widely used for molded articles containing polycarbonate resin, particularly optical parts. Specifically, it is preferably used in electric/electronic devices/parts, office automation devices/parts, information terminal devices/parts, machine parts, home appliances, vehicle parts, building materials, various containers, leisure goods/miscellaneous goods, lighting equipment, etc., and more specifically, it is preferably used for power covers, lighting lenses, lighting covers, light guiding members, etc. More specifically, it can be used for light guides and lenses that guide light from light sources such as LEDs in vehicle headlamps (headlamps), rear lamps, fog lamps, etc. for automobiles or motorcycles.
• the resin composition of this embodiment in addition to the above, the descriptions in JP-A-2020-189992, paragraphs 0098 to 0105, the contents of which are incorporated herein by reference.
• the 300 mm long light path molded product obtained above was used as a test piece, and the light transmittance at wavelengths of 400 nm, 420 nm, 440 nm, 460 nm, 480 nm, and 500 nm over a 300 mm length was measured using a long light path spectrophotometer with a C light source and a 2°C field of view.
• the long-path spectrophotometric colorimeter used was "ASA1" manufactured by Nippon Denshoku Industries Co., Ltd.
• compound of formula (1) etc. means a compound represented by formula (1) or a comparative compound.
• “proton number at benzylic position” means the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1).
• “Proton number at benzylic position (including OH group)” means the total number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) and the number of hydrogen atoms bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1).
• Relative proton number means the total value obtained by multiplying the proton number at benzylic position of each compound represented by formula (1) and the concentration of the compound.
• the resin composition of this embodiment gave molded articles with low YI values and high light transmittance.
• the YI value was high even when a compound having a similar structure was used.
• the stabilizer was replaced with Adeka STAB 2112 by Adeka STAB PEP-36 (a phosphite compound having a structure represented by formula (P), manufactured by ADEKA CORPORATION) and the other conditions were the same, the YI value became relatively high.

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• 2024
  • 2024-06-25 CN CN202480042070.5A patent/CN121368618A/zh active Pending
  • 2024-06-25 WO PCT/JP2024/022957 patent/WO2025009438A1/ja not_active Ceased
  • 2024-06-25 JP JP2025531505A patent/JPWO2025009438A1/ja active Pending

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