WO2024232203A1 - 脳波測定装置および脳波測定方法 - Google Patents

脳波測定装置および脳波測定方法 Download PDF

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Publication number
WO2024232203A1
WO2024232203A1 PCT/JP2024/014242 JP2024014242W WO2024232203A1 WO 2024232203 A1 WO2024232203 A1 WO 2024232203A1 JP 2024014242 W JP2024014242 W JP 2024014242W WO 2024232203 A1 WO2024232203 A1 WO 2024232203A1
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Prior art keywords
support member
group
measuring device
electrode
head
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PCT/JP2024/014242
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English (en)
French (fr)
Japanese (ja)
Inventor
雄眞 北添
慈厚 尾野
英治 石川
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Priority to EP24803318.5A priority Critical patent/EP4710858A1/en
Priority to JP2024541669A priority patent/JP7670243B2/ja
Publication of WO2024232203A1 publication Critical patent/WO2024232203A1/ja
Anticipated expiration legal-status Critical
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/251—Means for maintaining electrode contact with the body
    • A61B5/256—Wearable electrodes, e.g. having straps or bands
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
    • A61B5/291—Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]

Definitions

  • the present invention relates to an electroencephalogram measuring device and an electroencephalogram measuring method.
  • EEG electroencephalogram
  • a biosignal measuring device that includes a support made of a shape-memory material, which is a headband that is worn on the user's head, and a vital sensor attached to the support for acquiring the user's biosignals (see, for example, Patent Document 1).
  • Patent Document 1 when measuring biosignals, it is possible to easily restore the support to a shape that matches the user's body shape, which has been previously shape-memorized.
  • the present invention has been developed in consideration of these circumstances, and aims to provide a technique for appropriately contacting an electroencephalogram measuring device, particularly electrodes, with the scalp when measuring electroencephalograms.
  • An electroencephalogram measuring device comprising: a support member that is placed along the head of a subject; an electrode unit that is attached to the support member and contacts the scalp of the subject to acquire an electroencephalogram signal; and a support member that supports the placement of the support member on the head, An electroencephalogram measuring device in which the support member is composed of a ribbon-shaped or linear member. 2.
  • the electroencephalogram measuring device according to 1. wherein the support member is made of a non-stretchable material having flexibility such that it can deform to follow the shape of the head. 3.
  • the support member when the support member is configured as a ribbon-shaped member, the support member has a film member disposed between adjacent electrode units. 4. 3. The electroencephalogram measuring device according to 3., wherein the Poisson's ratio of the material constituting the film member is 0.15 to 0.4. 5. 5. The electroencephalogram measuring device according to 3. or 4., wherein the product of the elastic modulus and thickness of a material constituting the film member is 0.4 to 9.1 GPa mm. 6. 3. The electroencephalogram measuring device according to claim 1 or 2, wherein when the support member is configured of a linear member, the linear member is disposed between the electrode units. 7. 7. 7.
  • the electroencephalogram measuring device according to 6., wherein the linear member is provided in the form of at least two extending members spaced apart from each other, and the electrode unit is provided between the two members. 8. 8. The electroencephalogram measuring device according to any one of 1. to 7., wherein the electrode unit has a base, a plurality of convex portions provided on the base, and an electrode portion provided on the convex portions and in contact with a head. 9. 9. The electroencephalogram measuring device according to 8., wherein the convex portion is an elastic member. 10. The electroencephalogram measuring device according to any one of 1. to 9., wherein the support member is provided at an end of the support member, attached to an ear or a chin, and supports the positioning of the support member to the shape of the head. 11. 10. An electroencephalogram measuring method for measuring electroencephalograms by attaching the electroencephalogram measuring device according to any one of 1. to 10. to the head of a subject.
  • the present invention provides a technique for appropriately contacting an electroencephalogram measuring device, particularly electrodes, with the scalp during electroencephalogram measurement.
  • FIG. 1 is a schematic diagram showing a state in which an electroencephalogram measuring device according to a first embodiment is attached to a head.
  • FIG. 2 is a schematic diagram showing a support member and an attachment portion according to the first embodiment.
  • 1 is a diagram for explaining, by modeling, the force acting on the head when the electroencephalogram measuring device according to the first embodiment is worn (electrode pressing force F on the head).
  • FIG. FIG. 2 is a diagram for explaining the capstan principle (equation) used for modeling according to the first embodiment.
  • 3 is a cross-sectional view of the electrode unit according to the first embodiment in a state where it is attached to a support member.
  • FIG. 11 is a schematic diagram showing a state in which an electroencephalogram measuring device according to a second embodiment is attached to a head.
  • FIG. 13A and 13B are schematic diagrams showing a support member and an attachment portion according to a second embodiment.
  • FIG. 11 is a cross-sectional view of an electrode unit according to a second embodiment, in a state where the electrode unit is attached to a support member.
  • FIG. 10 is a diagram illustrating an adjustment unit according to a second embodiment.
  • FIG. 13 is a plan view of an electroencephalogram measuring device according to a third embodiment.
  • FIG. 13 is a front view of an electroencephalogram measuring device according to a third embodiment.
  • FIG. 13 is a plan view focusing on the manner in which support members are attached to two electrode units at electrode positions Cz and C3 according to the third embodiment.
  • FIG. 11 is a cross-sectional view of an electrode unit according to a third embodiment, in a state where the electrode unit is attached to a support member.
  • 1 is a graph showing theoretical values (calculated values) and actual measured values of electrode pressing force F in the examples.
  • FIG. 1 is a schematic diagram showing a state in which an electroencephalogram measuring device 10 is attached to a person's head 99, as viewed from the front.
  • Fig. 2 is a diagram showing a support member 20 and an attachment part 70 that support an electrode unit 30.
  • an electroencephalogram measuring device 10 that measures electroencephalograms at electrode positions Cz, C3, C4, T3, and T4 (International 10-20 system) is shown as an example.
  • the EEG measuring device 10 is attached to a person's head 99, detects brain waves as electrical potential fluctuations from the living body, and outputs the detected brain waves to an EEG display device (not shown).
  • the EEG display device acquires the brain waves detected by the EEG measuring device 10 and displays them on a monitor, stores the data, and performs well-known EEG analysis processing (measurement processing).
  • the EEG measuring device 10 has a number of electrode units 30 that contact the subject's measurement site (i.e., head 99) to acquire brain waves, which are biosignals, a long sheet-like (film base) support member 20 to which the electrode units 30 are attached and supported, and an attachment section 70 that fixes the support member 20 to the head 99.
  • the attachment section 70 is attached to the subject's ear to fix the EEG measuring device 10 to the head 99.
  • the support member 20 is configured to be freely bent to a certain degree at least in the thickness direction. Furthermore, no member (hard member such as a helmet) is provided to surround the support member 20 or give it a pre-defined shape.
  • the support members 20 etc. can be arranged flat without any external force being applied, and when attached to the head 99, the shape changes mainly due to gravity to conform to the shape of the head 99. Both ends of the electrode unit 30 may be floating above the head 99 due to the influence of the hair, etc., so the attachment parts 70 are used to support the electrode unit 30 in conforming to the shape of the head 99.
  • the support member 20 is provided with a concave snap button 25 for fixing the electrode unit 30, and is designed to fit over the convex snap button 35 of the electrode unit 30.
  • the position in the left-right direction where the concave snap button 25 is provided on the support member 20 is exactly at the bent portion 27 where the support member 20 is bent. If the support member 20 is sufficiently thin, the bent portion 27 is not necessary, but the presence of the bent portion 27 allows the support member 20 between the electrode units 30 to be linear.
  • the mounting part 70 has an ear attachment part 40 and an adjustment part 50, which are connected by a non-stretchable member (here, a string 45).
  • a non-stretchable member here, a string 45.
  • the electrode units 30 are positioned at the vertices of a polygon, and the electrode units 30 are spanned by the support members 20. In other words, the support members 20 are bent exactly at the portions (bending portions 27) where the electrode units 30 are attached.
  • Fig. 3 is a diagram for explaining a model of the force (electrode pressing force F on the head) acting on the head 99 when the electroencephalogram measuring device 10 is worn.
  • Fig. 4 is a diagram for explaining the capstan principle (equation) used in the modeling.
  • the minimum curvature of the inscribed circle is calculated from the height and spacing of the electrode units 30.
  • the maximum curvature is calculated from the electrode pressing force F required for the electrode units 30 and the capstan principle. Note that the electrode pressing force F applied to the head 99 follows the capstan equation, so it is greater on the side of the head than on the top of the head.
  • Electrode unit 30 The electrode units 30 are detachably provided only at the sites required for EEG measurement.
  • the electrode units 30 are attached at positions corresponding to, for example, T3, C3, Cz, C4, and T4 in the International 10-20 electrode placement method, and are arranged symmetrically in front view as shown in FIG.
  • FIG. 5 shows a cross-sectional view of the electrode unit 30 attached to the concave snap button 25 of the support member 20.
  • the electrode unit 30 is configured as a button electrode and has a convex snap button 35 provided as a connection terminal, and the convex snap button 35 is detachably attached to the concave snap button 25 provided at a predetermined position on the support member 20.
  • the concave snap button 25 functions as a mounting part for attaching the electrode unit 30 by a fitting structure.
  • the electrode unit 30 may be made entirely of conductive metal, or may be configured with a rubber-like elastic material as a base on which a conductive material is provided. The following provides an example of a configuration based on a rubber-like elastic material.
  • the electrode unit 30 of this embodiment is an electrode (dry electrode) that does not use so-called EEG electrode paste to ensure conductivity.
  • a method of forming a gel on the tip of the dry electrode (the tip of the protrusion 32) and soaking it in a wetting liquid or the like to ensure moisture may be applied.
  • a method of wetting the tip of the dry electrode with a conductive auxiliary liquid made by mixing a small amount of electrolyte such as salt with a low-viscosity liquid such as lotion may be applied.
  • the dry electrode of this embodiment is not limited to being completely dry, but rather does not intend to use auxiliary agents such as paste that leave significant stains.
  • the electrode unit 30 has a cylindrical base 31, a protrusion 32 integrally provided on one end of the base 31 (here, the base bottom surface 36), a conductive contact portion 33, a signal line portion 34, and a convex snap button 35 provided on the other end of the base 31 (here, the base top surface 37).
  • the base 31 and the protrusion 32 are referred to as the electrode body 39 for convenience.
  • the electrode body 39 is integrally formed from a rubber-like elastic member. The specific material of the elastic member will be described later. Note that the electrode body 39 (i.e., the base 31 and the protrusion 32) is not limited to being integrally formed, and may be formed as separate parts that are attached by adhesive or a fitting structure.
  • the base 31 is generally cylindrical.
  • a circular base underside 36 at one end (the lower side in the figure) of the base 31 is provided with a plurality of generally conical protrusions 32 protruding downward in the figure.
  • the base 31 may be columnar, and the cross section may be a circle or other shape such as a polygon.
  • the shape of the protrusions 32 is not limited to a cone shape, and various shapes such as a pyramid such as a triangular pyramid or a cylinder may be used.
  • a conductive contact portion 33 is provided on at least the tip surface of the protrusion portion 32.
  • the conductive contact portion 33 may be provided on the entire surface of the protrusion portion 32.
  • the conductive contact portion 33 is formed in a thin film, and when the conductive contact portion 33 is provided on the protrusion portion 32, it can be considered to have substantially the same shape as the shape of the protrusion portion 32 alone.
  • the outer diameter of the base 31 is, for example, 10 mm to 50 mm.
  • the height (thickness) of the base 31 is, for example, 0.1 mm to 30 mm.
  • the height of the protrusion 32 is, for example, 1 mm to 20 mm.
  • the width of the protrusion 32 (outer diameter of the base portion) is, for example, 1 mm to 10 mm.
  • the electrode body 39 can be a rubber-like elastic body as described above.
  • the rubber-like elastic body is specifically rubber or a thermoplastic elastomer (also simply called “elastomer (TPE)").
  • the rubber is, for example, silicone rubber.
  • the thermoplastic elastomer is, for example, a styrene-based TPE (TPS), an olefin-based TPE (TPO), a polyvinyl chloride-based TPE (TPVC), a urethane-based TPE (TPU), an ester-based TPE (TPEE), an amide-based TPE (TPAE), etc.
  • the rubber hardness A is, for example, 15 or more and 55 or less, when the type A durometer hardness of the surface of the electrode body 39 measured at 37°C in accordance with JIS K 6253 (1997) is taken as rubber hardness A.
  • the silicone rubber may be a cured product of a silicone rubber-based curable composition.
  • the curing process of the silicone rubber-based curable resin composition may be performed, for example, by heating at 100 to 250° C. for 1 to 30 minutes (first curing) and then post-baking at 100 to 200° C. for 1 to 4 hours (second curing).
  • Insulating silicone rubber is silicone rubber that does not contain conductive filler
  • conductive silicone rubber is silicone rubber that does contain conductive filler
  • the silicone rubber-based hardening composition according to this embodiment may contain a vinyl group-containing organopolysiloxane (A).
  • the vinyl group-containing organopolysiloxane (A) is a polymer that is the main component of the silicone rubber-based hardening composition according to this embodiment.
  • the insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of vinyl group-containing linear organopolysiloxane.
  • the same type of vinyl group-containing linear organopolysiloxane may be different in the amount of vinyl groups in the molecule, the molecular weight distribution, or the amount of vinyl groups added, as long as it contains at least the same vinyl groups as functional groups and has a linear shape.
  • the insulating silicone rubber-based hardenable composition and the conductive silicone rubber-based hardenable composition may further contain different vinyl group-containing organopolysiloxanes.
  • the vinyl group-containing organopolysiloxane (A) may include a vinyl group-containing linear organopolysiloxane (A1) having a linear structure.
  • the vinyl group-containing linear organopolysiloxane (A1) has a linear structure and contains vinyl groups, which become crosslinking points during curing.
  • the vinyl group content of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but for example, it is preferable that the vinyl group content is 15 mol% or less, and more preferably 0.01 to 12 mol%, and that the vinyl group content is two or more in the molecule. This optimizes the amount of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1), and ensures the formation of a network with each component described below. In this embodiment, "to" means that the numerical values at both ends are included.
  • the vinyl group content refers to the mole percent of vinyl group-containing siloxane units when all units constituting the vinyl group-containing linear organopolysiloxane (A1) are taken as 100 mole percent. However, it is considered that there is one vinyl group per vinyl group-containing siloxane unit.
  • the degree of polymerization of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably within the range of about 1,000 to 10,000, and more preferably about 2,000 to 5,000.
  • the degree of polymerization can be determined, for example, as the number average degree of polymerization (or number average molecular weight) in terms of polystyrene in gel permeation chromatography (GPC) using chloroform as a developing solvent.
  • the specific gravity of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.
  • the vinyl group-containing linear organopolysiloxane (A1) is preferably one having a structure represented by the following formula (1).
  • R 1 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a hydrocarbon group consisting of a combination thereof, each having 1 to 10 carbon atoms.
  • alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred.
  • alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group, with a vinyl group being preferred.
  • the aryl group having 1 to 10 carbon atoms include a phenyl group.
  • R2 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a hydrocarbon group that is a combination of these groups, each having 1 to 10 carbon atoms.
  • alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable.
  • alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group.
  • the aryl group having 1 to 10 carbon atoms include a phenyl group.
  • R3 is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group consisting of a combination thereof.
  • alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable.
  • aryl group having 1 to 8 carbon atoms include a phenyl group.
  • examples of the substituents of R 1 and R 2 in the formula (1) include a methyl group and a vinyl group
  • examples of the substituent of R 3 include a methyl group.
  • the R 1s are independent of each other and may be different from each other or may be the same. The same applies to R 2 and R 3 .
  • m and n are the numbers of repeating units constituting the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1), where m is an integer from 0 to 2000 and n is an integer from 1000 to 10000. m is preferably 0 to 1000, and n is preferably 2000 to 5000.
  • R 1 and R 2 each independently represent a methyl group or a vinyl group, and at least one of them is a vinyl group.
  • the vinyl group-containing linear organopolysiloxane (A1) preferably contains a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more vinyl groups in the molecule and a vinyl group content of 0.4 mol% or less, and a second vinyl group-containing linear organopolysiloxane (A1-2) having a vinyl group content of 0.5 to 15 mol%.
  • the first vinyl group-containing linear organopolysiloxane (A1-1) having a general vinyl group content as raw rubber, which is the raw material of silicone rubber, with the second vinyl group-containing linear organopolysiloxane (A1-2) having a high vinyl group content it is possible to unevenly distribute the vinyl groups, and more effectively form a crosslinking density distribution in the crosslinked network of the silicone rubber. As a result, it is possible to more effectively increase the tear strength of the silicone rubber.
  • the vinyl group-containing linear organopolysiloxane (A1) it is preferable to use, for example, a first vinyl group-containing linear organopolysiloxane (A1-1) having in the molecule two or more units in which R 1 is a vinyl group and/or units in which R 2 is a vinyl group, and containing 0.4 mol % or less of these units in the above formula (1-1), and a second vinyl group-containing linear organopolysiloxane (A1-2) containing 0.5 to 15 mol % of units in which R 1 is a vinyl group and/or units in which R 2 is a vinyl group.
  • A1-1-1 first vinyl group-containing linear organopolysiloxane having in the molecule two or more units in which R 1 is a vinyl group and/or units in which R 2 is a vinyl group, and containing 0.4 mol % or less of these units in the above formula (1-1)
  • A1-2 second vinyl group-containing linear organopolysiloxane
  • the first vinyl group-containing linear organopolysiloxane (A1-1) preferably has a vinyl group content of 0.01 to 0.2 mol %.
  • the second vinyl group-containing linear organopolysiloxane (A1-2) preferably has a vinyl group content of 0.8 to 12 mol %.
  • the ratio of (A1-1) to (A1-2) is not particularly limited, but for example, the weight ratio of (A1-1):(A1-2) is preferably 50:50 to 95:5, and more preferably 80:20 to 90:10.
  • the first and second vinyl group-containing linear organopolysiloxanes (A1-1) and (A1-2) may each be used alone or in combination of two or more.
  • the vinyl group-containing organopolysiloxane (A) may also contain a vinyl group-containing branched organopolysiloxane (A2) having a branched structure.
  • the silicone rubber-based hardenable composition of the present embodiment may contain a crosslinking agent.
  • the crosslinking agent may contain an organohydrogenpolysiloxane (B).
  • the organohydrogenpolysiloxane (B) is classified into a linear organohydrogenpolysiloxane (B1) having a linear structure and a branched organohydrogenpolysiloxane (B2) having a branched structure, and may contain either one or both of these.
  • the insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of crosslinking agent.
  • the same type of crosslinking agent may have at least a common structure such as a linear structure or a branched structure, and may have different molecular weight distributions in the molecule or different functional groups, or may be added in different amounts.
  • the insulating silicone rubber-based hardenable composition and the conductive silicone rubber-based hardenable composition may further contain different crosslinking agents.
  • Linear organohydrogenpolysiloxane (B1) has a linear structure and a structure in which hydrogen is directly bonded to silicon ( ⁇ Si-H), and undergoes a hydrosilylation reaction with the vinyl groups of vinyl group-containing organopolysiloxane (A) and with vinyl groups of components blended into the silicone rubber-based curable composition, forming a polymer that crosslinks these components.
  • the molecular weight of the linear organohydrogenpolysiloxane (B1) is not particularly limited, but for example, it is preferable that the weight average molecular weight is 20,000 or less, and more preferably 1,000 or more and 10,000 or less.
  • the weight average molecular weight of the linear organohydrogenpolysiloxane (B1) can be measured, for example, by polystyrene conversion using GPC (gel permeation chromatography) with chloroform as the developing solvent.
  • the linear organohydrogenpolysiloxane (B1) does not have a vinyl group. This effectively prevents the crosslinking reaction from proceeding within the linear organohydrogenpolysiloxane (B1) molecule.
  • linear organohydrogenpolysiloxane (B1) described above for example, one having a structure represented by the following formula (2) is preferably used.
  • R4 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these groups, or a hydride group having 1 to 10 carbon atoms.
  • alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable.
  • alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group.
  • the aryl group having 1 to 10 carbon atoms include a phenyl group.
  • R5 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these groups, or a hydride group having 1 to 10 carbon atoms.
  • alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable.
  • alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group.
  • the aryl group having 1 to 10 carbon atoms include a phenyl group.
  • the multiple R4s are independent of each other and may be different from each other or may be the same.
  • at least two or more are hydrido groups.
  • R6 is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group that is a combination of these.
  • alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable.
  • aryl group having 1 to 8 carbon atoms include a phenyl group.
  • the multiple R6s are independent of each other and may be different from each other or the same.
  • examples of the substituents R 4 , R 5 and R 6 in the formula (2) include a methyl group and a vinyl group, and from the viewpoint of preventing an intramolecular crosslinking reaction, a methyl group is preferable.
  • m and n are the numbers of repeating units constituting the linear organohydrogenpolysiloxane (B1) represented by formula (2), where m is an integer from 2 to 150 and n is an integer from 2 to 150.
  • m is an integer from 2 to 100 and n is an integer from 2 to 100.
  • the linear organohydrogenpolysiloxane (B1) may be used alone or in combination of two or more.
  • Branched organohydrogenpolysiloxane (B2) has a branched structure, so it forms areas with high crosslink density, and is a component that contributes greatly to the formation of a sparsely-dense crosslink structure in the silicone rubber system. Also, like the linear organohydrogenpolysiloxane (B1), it has a structure in which hydrogen is directly bonded to silicon ( ⁇ Si-H), and undergoes a hydrosilylation reaction with the vinyl groups of the vinyl-group-containing organopolysiloxane (A) and with the vinyl groups of the components blended into the silicone rubber-based hardening composition, forming a polymer that crosslinks these components.
  • the specific gravity of the branched organohydrogenpolysiloxane (B2) is in the range of 0.9 to 0.95.
  • the branched organohydrogenpolysiloxane (B2) does not have a vinyl group. This effectively prevents the crosslinking reaction from proceeding within the branched organohydrogenpolysiloxane (B2) molecule.
  • branched organohydrogenpolysiloxane (B2) is preferably one represented by the following average composition formula (c).
  • R7 is a monovalent organic group, a is an integer ranging from 1 to 3, m is the number of H a ( R7 ) 3-a SiO 1/2 units, and n is the number of SiO 4/2 units.
  • R7 is a monovalent organic group, preferably a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an aryl group, or a hydrocarbon group consisting of a combination thereof.
  • alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable.
  • aryl group having 1 to 10 carbon atoms include a phenyl group.
  • a is the number of hydride groups (hydrogen atoms directly bonded to Si) and is an integer ranging from 1 to 3, preferably 1.
  • m is the number of H a (R 7 ) 3-a SiO 1/2 units
  • n is the number of SiO 4/2 units.
  • Branched organohydrogenpolysiloxane (B2) has a branched structure.
  • Linear organohydrogenpolysiloxane (B1) and branched organohydrogenpolysiloxane (B2) differ in that their structures are linear or branched, and the number of alkyl groups R bonded to Si (R/Si), where the number of Si is 1, is in the range of 1.8 to 2.1 for linear organohydrogenpolysiloxane (B1) and 0.8 to 1.7 for branched organohydrogenpolysiloxane (B2).
  • the branched organohydrogenpolysiloxane (B2) has a branched structure, for example, when heated in a nitrogen atmosphere to 1000°C at a heating rate of 10°C/min, the amount of residue is 5% or more.
  • the linear organohydrogenpolysiloxane (B1) is linear, the amount of residue after heating under the above conditions is almost zero.
  • branched organohydrogenpolysiloxane (B2) include those having a structure represented by the following formula (3):
  • R7 is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group consisting of a combination thereof, or a hydrogen atom.
  • alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable.
  • aryl group having 1 to 8 carbon atoms include a phenyl group.
  • the substituent of R7 include a methyl group.
  • R 7s are independent of each other and may be different from each other or may be the same.
  • the branched organohydrogenpolysiloxane (B2) may be used alone or in combination of two or more.
  • the amount of hydrogen atoms (hydride groups) directly bonded to Si in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is not particularly limited.
  • the total amount of hydride groups in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is preferably 0.5 to 5 moles, more preferably 1 to 3.5 moles, per mole of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1).
  • the silicone rubber-based hardening composition according to the present embodiment contains a non-conductive filler.
  • the non-conductive filler may contain silica particles (C) as necessary. This can improve the hardness and mechanical strength of the elastomer.
  • the insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of non-conductive filler.
  • the non-conductive fillers of the same type may have at least a common constituent material, and may differ in particle size, specific surface area, surface treatment agent, or the amount of the surface treatment agent added.
  • the insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.
  • the silica particles (C) are not particularly limited, but for example, fumed silica, calcined silica, precipitated silica, etc. may be used. These may be used alone or in combination of two or more types.
  • the silica particles (C) preferably have a specific surface area, as measured by the BET method, of, for example, 50 to 400 m 2 /g, and more preferably 100 to 400 m 2 /g, and the average primary particle size of the silica particles (C) is preferably, for example, 1 to 100 nm, and more preferably about 5 to 20 nm.
  • silica particles (C) that have a specific surface area and average particle size within this range, it is possible to improve the hardness and mechanical strength of the silicone rubber formed, particularly the tensile strength.
  • the silicone rubber-based hardenable composition of this embodiment may contain a silane coupling agent (D).
  • the silane coupling agent (D) may have a hydrolyzable group.
  • the hydrolyzable group is hydrolyzed by water to become a hydroxyl group, and the hydroxyl group undergoes a dehydration condensation reaction with the hydroxyl group on the surface of the silica particles (C), thereby modifying the surface of the silica particles (C).
  • the insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of silane coupling agent.
  • the same type of silane coupling agent may have at least a common functional group, but may have different other functional groups in the molecule or different amounts added.
  • the insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.
  • the silane coupling agent (D) may contain a silane coupling agent having a hydrophobic group. This provides the surface of the silica particles (C) with this hydrophobic group, which reduces the cohesive force of the silica particles (C) in the silicone rubber-based curable composition and, in turn, in the silicone rubber (less cohesion due to hydrogen bonds caused by silanol groups). As a result, it is presumed that the dispersibility of the silica particles (C) in the silicone rubber-based curable composition is improved. This increases the interface between the silica particles (C) and the rubber matrix, enhancing the reinforcing effect of the silica particles (C).
  • the slipperiness of the silica particles (C) in the matrix is improved during deformation of the rubber matrix.
  • the improved dispersibility and slipperiness of the silica particles (C) improve the mechanical strength (e.g., tensile strength, tear strength, etc.) of the silicone rubber due to the silica particles (C).
  • the silane coupling agent (D) may contain a silane coupling agent having a vinyl group. This introduces a vinyl group onto the surface of the silica particles (C). Therefore, when the silicone rubber-based curable composition is cured, that is, when the vinyl group of the vinyl group-containing organopolysiloxane (A) and the hydride group of the organohydrogenpolysiloxane (B) undergo a hydrosilylation reaction to form a network (crosslinked structure), the vinyl group of the silica particles (C) also participates in the hydrosilylation reaction with the hydride group of the organohydrogenpolysiloxane (B), and the silica particles (C) are also incorporated into the network. This allows the formed silicone rubber to have a low hardness and a high modulus.
  • silane coupling agent (D) a silane coupling agent having a hydrophobic group and a silane coupling agent having a vinyl group can be used in combination.
  • silane coupling agent (D) is one represented by the following formula (4).
  • n represents an integer of 1 to 3.
  • Y represents a functional group having a hydrophobic group, a hydrophilic group, or a vinyl group. When n is 1, it is a hydrophobic group. When n is 2 or 3, at least one of them is a hydrophobic group.
  • X represents a hydrolyzable group.
  • the hydrophobic group is an alkyl group having 1 to 6 carbon atoms, an aryl group, or a hydrocarbon group that is a combination of these, such as a methyl group, an ethyl group, a propyl group, or a phenyl group, and among these, a methyl group is particularly preferred.
  • hydrophilic group examples include a hydroxyl group, a sulfonic acid group, a carboxyl group, and a carbonyl group, and among these, a hydroxyl group is particularly preferred.
  • a hydrophilic group may be included as a functional group, but it is preferable that it is not included from the viewpoint of imparting hydrophobicity to the silane coupling agent (D).
  • examples of the hydrolyzable group include alkoxy groups such as methoxy and ethoxy groups, chloro groups, and silazane groups, among which silazane groups are preferred due to their high reactivity with silica particles (C). Note that those having silazane groups as hydrolyzable groups have two (Y n -Si-) structures in the above formula (4) due to their structural characteristics.
  • silane coupling agent (D) represented by the above formula (4) are as follows.
  • the functional group having a hydrophobic group include alkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, and decyltrimethoxysilane; chlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, and phenyltrichlorosilane; and hexamethyldisilazane.
  • silane coupling agents having a trimethylsilyl group including one or more selected from the group consisting of hexamethyldisilazane, trimethylchlorosilane, trimethylmethoxysilane, and trimethylethoxysilane, are preferred.
  • silane coupling agent having a vinyl group as the functional group examples include alkoxysilanes such as methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylmethyldimethoxysilane; chlorosilanes such as vinyltrichlorosilane and vinylmethyldichlorosilane; and divinyltetramethyldisilazane.
  • alkoxysilanes such as methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylmethyldimethoxy
  • silane coupling agents having a vinyl group-containing organosilyl group including one or more selected from the group consisting of methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, divinyltetramethyldisilazane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylmethyldimethoxysilane.
  • the silane coupling agent (D) contains two types of silane coupling agents, a silane coupling agent having a trimethylsilyl group and a silane coupling agent having a vinyl group-containing organosilyl group
  • the silane coupling agent having the hydrophobic group is hexamethyldisilazane
  • the silane coupling agent having the vinyl group is divinyltetramethyldisilazane.
  • the ratio of (D1) to (D2) is not particularly limited, but for example, the weight ratio of (D1):(D2) is 1:0.001 to 1:0.35, preferably 1:0.01 to 1:0.20, and more preferably 1:0.03 to 1:0.15.
  • the weight ratio is 1:0.001 to 1:0.35, preferably 1:0.01 to 1:0.20, and more preferably 1:0.03 to 1:0.15.
  • the lower limit of the content of the silane coupling agent (D) is preferably 1 mass% or more, more preferably 3 mass% or more, and even more preferably 5 mass% or more, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A).
  • the upper limit of the content of the silane coupling agent (D) is preferably 100 mass% or less, more preferably 80 mass% or less, and even more preferably 40 mass% or less, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A).
  • the silicone rubber can have appropriate mechanical properties.
  • the silicone rubber-based curable composition according to this embodiment may contain a catalyst.
  • the catalyst may contain platinum or a platinum compound (E).
  • the platinum or platinum compound (E) is a catalyst component that acts as a catalyst during curing.
  • the amount of platinum or platinum compound (E) added is a catalytic amount.
  • the insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of catalyst.
  • the same type of catalyst may have at least a common component material, and may contain different compositions in the catalyst, and the amounts of the catalyst added may be different.
  • the insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different catalysts.
  • Platinum or platinum compounds (E) that can be used are well known, such as platinum black, platinum supported on silica or carbon black, chloroplatinic acid or an alcohol solution of chloroplatinic acid, a complex salt of chloroplatinic acid and an olefin, and a complex salt of chloroplatinic acid and a vinyl siloxane.
  • the platinum or platinum compound (E) may be used alone or in combination of two or more.
  • the content of platinum or platinum compound (E) in the silicone rubber-based curable composition means a catalytic amount and can be set as appropriate, but specifically, it is an amount such that the platinum group metal is 0.01 to 1000 ppm by weight, and preferably 0.1 to 500 ppm, per 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A), the silica particles (C), and the silane coupling agent (D).
  • the silicone rubber-based hardening composition can be hardened at an appropriate rate.
  • the content of platinum or platinum compound (E) equal to or less than the upper limit, it is possible to reduce production costs.
  • the silicone rubber-based hardenable composition according to this embodiment may contain water (F) in addition to the above components (A) to (E).
  • Water (F) functions as a dispersion medium to disperse each component contained in the silicone rubber-based hardening composition, and is also a component that contributes to the reaction between the silica particles (C) and the silane coupling agent (D). Therefore, the silica particles (C) and the silane coupling agent (D) can be more reliably linked to each other in the silicone rubber, and uniform properties can be exhibited overall.
  • the silicone rubber-based hardening composition of the present embodiment may further contain other components in addition to the above components (A) to (F), such as inorganic fillers other than the silica particles (C), such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica, as well as additives such as reaction inhibitors, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, and thermal conductivity improvers.
  • inorganic fillers other than the silica particles (C) such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica, as well as additives such as reaction inhibitors, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, and thermal conductivity improvers.
  • the conductive solution (conductive silicone rubber composition) according to this embodiment contains the above-mentioned conductive filler and solvent in addition to the above-mentioned silicone rubber-based curable composition that does not contain a conductive filler.
  • the above solvent may be any of various known solvents, including, for example, high-boiling point solvents. These may be used alone or in combination of two or more.
  • solvents examples include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, decane, dodecane, and tetradecane; aromatic hydrocarbons such as benzene, toluene, ethylbenzene, xylene, trifluoromethylbenzene, and benzotrifluoride; ethers such as diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3-dioxane, and tetrahydrofuran; haloalkanes such as
  • the conductive solution can be made to have an appropriate viscosity for various application methods, such as spray application or dip application, by adjusting the amount of solids in the solution.
  • the lower limit of the content of the silica particles (C) contained in the electrode body 39 can be, for example, 1 mass% or more, preferably 3 mass% or more, and more preferably 5 mass% or more, based on 100 mass% of the total amount of the silica particles (C) and the conductive filler. This can improve the mechanical strength of the electrode body 39.
  • the upper limit of the content of the silica particles (C) contained in the electrode body 39 can be, for example, 20 mass% or less, preferably 15 mass% or less, and more preferably 10 mass% or less, based on 100 mass% of the total amount of the silica particles (C) and the conductive filler. This can balance the conductivity of the electrode body 39 with the mechanical strength and flexibility.
  • the conductive solution is dried by heating as necessary to obtain a conductive silicone rubber.
  • the conductive silicone rubber may be configured not to contain silicone oil, which can prevent the silicone oil from bleeding out onto the surface of the electrode body 39 and thus reduce the conductivity.
  • the conductive member of the conductive contact portion 33 is, for example, a paste containing a good conductive metal (so-called conductive paste).
  • the good conductive metal includes one or more metals selected from the group consisting of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, and alloys thereof.
  • silver, silver chloride, and copper are preferable from the viewpoints of availability and conductivity.
  • the top of the protrusion portion 32 made of a rubber-like elastic body is dipped (immersion coated) into a paste-like conductive solution containing a highly conductive metal. This forms the conductive contact portion 33 on the surface of the protrusion portion 32.
  • the conductive contact portion 33 may be formed as a conductive resin layer by applying a conductive solution containing a conductive filler and a solvent to the protrusion portion 32.
  • a conductive solution containing a conductive filler and a solvent to the protrusion portion 32.
  • the adhesion of the conductive contact portion 33 (conductive resin layer) can be improved.
  • the conductive solution is dried by heating as necessary to obtain a conductive silicone rubber.
  • the conductive silicone rubber may be configured not to contain silicone oil, which can prevent the silicone oil from bleeding out onto the surface of the conductive contact portion 33 and thus reducing the conductivity.
  • the electrode unit 30 is provided with a signal line portion 34 as a signal path connected to the conductive contact portion 33.
  • the signal line portion 34 may have various wiring structures as long as it is in a form that provides electrical continuity via the base portion 31 and the protrusion portion 32.
  • the signal line portion 34 is provided so as to pass from the conductive contact portion 33 at the tip of the protrusion portion 32 through the inside of the protrusion portion 32 and the base portion 31 and be exposed on the base upper surface 37.
  • a portion protruding from the base upper surface 37 (here, the end portion 34a) is sandwiched between the convex snap button 35 (more specifically, the disk portion 35a described later) and the base upper surface 37, ensuring electrical continuity with the convex snap button 35.
  • the lower end of the signal line portion 34 may have a protruding structure, a structure that is approximately flush with the tip of the protrusion portion 32 or its vicinity, i.e., the area where the conductive contact portion 33 is formed, or a structure that is buried.
  • a protruding structure may be used from the viewpoint of connection stability with the conductive contact portion 33.
  • the protruding portion of the tip of the signal line portion 34 is covered in part or in its entirety by the conductive contact portion 33.
  • the protruding structure of the tip of the signal line portion 34 may be a structure that is not folded back, that is folded back, or that is wrapped around the surface of the tip of the protrusion portion 32.
  • Other wiring structures for the signal line portion 34 include a structure in which the signal line portion 34 is provided on the surface of the protrusion portion 32 and the base portion 31, or a wiring structure in which a part of the signal line portion is provided inside and a part of the signal line portion is provided on the surface. In other words, it is sufficient that the signal detected by the conductive contact portion 33 is ultimately transmitted to the convex snap button 35.
  • the signal line portion 34 may be made of a known material, for example, a conductive fiber.
  • the conductive fiber may be one or more selected from the group consisting of metal fiber, metal-coated fiber, carbon fiber, conductive polymer fiber, conductive polymer-coated fiber, and conductive paste-coated fiber. These may be used alone or in combination of two or more.
  • the metal material of the above metal fibers and metal-coated fibers is not limited as long as it is conductive, but examples include copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, stainless steel, aluminum, silver/silver chloride, and alloys thereof. These may be used alone or in combination of two or more. Among these, silver can be used from the viewpoint of conductivity. In addition, it is preferable that the metal material does not contain metals that impose a burden on the environment, such as chromium.
  • the fiber materials for the metal-coated fibers, conductive polymer-coated fibers, and conductive paste-coated fibers are not particularly limited, and may be synthetic fibers, semi-synthetic fibers, or natural fibers. Of these, it is preferable to use polyester, nylon, polyurethane, silk, cotton, etc. These may be used alone or in combination of two or more types.
  • Examples of the carbon fibers include PAN-based carbon fibers and pitch-based carbon fibers.
  • the conductive polymer material for the conductive polymer fibers and conductive polymer-coated fibers is, for example, a mixture of conductive polymers such as polythiophene, polypyrrole, polyaniline, polyacetylene, polyphenylenevinylene, polynaphthalene, and derivatives thereof, and binder resin, or an aqueous solution of a conductive polymer such as PEDOT-PSS ((3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid)).
  • PEDOT-PSS ((3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid)
  • the resin material contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, but it is preferable that the resin material has elasticity, and may contain, for example, one or more selected from the group consisting of silicone rubber, urethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, and ethylene propylene rubber. These may be used alone or in combination of two or more.
  • the conductive filler contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, and may be any known conductive material, but may include one or more selected from the group consisting of metal particles, metal fibers, metal-coated fibers, carbon black, acetylene black, graphite, carbon fibers, carbon nanotubes, conductive polymers, conductive polymer-coated fibers, and metal nanowires.
  • the metal constituting the conductive filler is not particularly limited, but may include, for example, at least one of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, silver/silver chloride, or alloys thereof, or two or more of these.
  • silver or copper is preferred because of its high conductivity and ease of availability.
  • the signal line portion 34 may be made of a twisted yarn made by twisting together multiple linear conductive fibers. This can prevent breakage of the signal line portion 34 during deformation.
  • the coating of conductive fibers does not simply mean covering the outer surface of the fiber material, but also includes, in the case of a twisted yarn made by twisting single fibers together, impregnating the gaps between the fibers in the twisted yarn with metal, conductive polymer, or conductive paste to coat each of the single fibers that make up the twisted yarn.
  • the tensile elongation at break of the signal line portion 34 is, for example, 1% to 50%, and preferably 1.5% to 45%. By keeping it within this range, excessive deformation of the protrusion portion 32 can be suppressed while also suppressing breakage during deformation.
  • the convex snap button 35 is made of, for example, a conductive metal and has a disk-shaped disk portion 35a and a convex button-shaped button portion 35b extending from the center of the upper surface of the disk portion 35a.
  • a conductive metal examples include stainless steel, copper alloy, aluminum alloy, brass, etc.
  • the disk portion 35a is attached to the base upper surface 37 of the base 31 with a conductive adhesive or the like. At this time, as described above, the end portion 34a of the signal line portion 34 is sandwiched between the disk portion 35a and the base upper surface 37, and electrical continuity with the convex snap button 35 is ensured.
  • the button portion 35 b is attached so as to fit into a recessed snap button 25 provided on the support member 20 .
  • the concave snap button 25, like the convex snap button 35, is made of a highly conductive metal, and outputs the brain waves acquired by the electrode unit 30 to an brain wave display device or the like via a specified wiring structure (not shown).
  • the support member 20 has a ribbon-shaped member. More specifically, the support member 20 is configured to have a long strip-shaped film substrate.
  • the support member 20 may be configured from one type of film substrate, or may be a composite member configured from a plurality of film substrates.
  • the support member 20 is configured to have sufficient strength for attaching the electrode unit 30. That is, when the recessed snap button 25 is provided and the electrode unit 30 is attached, the support member 20 has sufficient strength not to be broken.
  • the support member 20 has a physical property of not stretching (non-stretching) so that the plurality of electrode units 30 are pressed against the head 99 with an appropriate pressure, that is, so that a certain tension acts.
  • the non-stretching property means, for example, that the Poisson's ratio described later is within a predetermined range.
  • the vertical width (depth length) of the support member 20 depends on the size of the electrode unit 30 to be attached, but can be, for example, 5 mm to 50 mm.
  • the width (length in the left-right direction) of the support member 20 depends on the size of the head 99 and the electrode positions, but can be, for example, 200 mm to 400 mm.
  • the thickness of the support member 20 depends on the material, but can be, for example, 0.01 mm to 5 mm. By setting the thickness of the support member 20 within the above range, the electrode unit 30 can be pressed with a constant tension.
  • the support member 20 may be curved to such an extent that the tension does not substantially change depending on the shape of the head 99 and the condition of the hair.
  • the support member 20 may be made of, for example, a resin member, a metal member, or a glass film.
  • Resin members include polyimide resin films, polyetherimide resin films, polyamideimide resin films, and other polyimide resin-based films, polyamide resin films, and other polyamide resin films, polyester resin films, and other polyester resin films, PET (polyethylene terephthalate) resin films, and PS (polystyrene) resin films. Of these, polyimide resin films are particularly preferred from the viewpoint of improving flexibility, elasticity, and heat resistance.
  • Metal members may be made of, for example, aluminum foil or copper foil.
  • the physical properties (Poisson's ratio, Young's modulus, maximum thickness, Young's modulus ⁇ thickness) of the support member 20 are defined as follows, for example.
  • the Poisson's ratio of the support member 20 is 0.15 to 0.4.
  • the lower limit of the Poisson's ratio is preferably 0.2 or more, and more preferably 0.25 or more.
  • the upper limit of the Poisson's ratio is preferably 0.38 or less, and more preferably 0.35 or less.
  • the electroencephalogram measuring device 10 when the electroencephalogram measuring device 10 is attached to the head 99, a force acts in the direction in which the support member 20 extends when the electrode unit 30 is pressed against the head 99. That is, tension acts.
  • the support member 20 is an elastic member such as rubber, the support member 20 may extend inappropriately, causing the tension of the electrode unit 30 on the head 99 to change and the pressing force to become uneven. As a result, the signal quality of the obtained electroencephalogram may be reduced.
  • the force with which the electrode unit 30 presses against the head 99 can be controlled within a certain range, enabling stable electroencephalogram measurement.
  • the Young's modulus (elastic modulus) of the support member 20 is 0.4 GPa to 150 GPa.
  • the lower limit of the Young's modulus is preferably 3 GPa or more, and more preferably 5 GPa or more.
  • the upper limit is preferably 140 GPa or less, and more preferably 135 GPa or less.
  • Young's modulus x thickness The product of Young's modulus (elastic modulus) and thickness of the material constituting the film member is 0.4 to 9.1 GPa ⁇ mm. Even if the material is easily deformed (i.e., a material with a small Young's modulus), the force with which the electrode unit 30 presses against the head 99 can be controlled within a certain range without substantial deformation as long as the material has a certain degree of thickness. Furthermore, in the case of a hard material (i.e., a material with a large Young's modulus), unless the material is thinned to a certain degree, the characteristic of the electroencephalogram measuring device 10 to follow the shape of the head 99 is significantly reduced.
  • the force with which the electrode unit 30 attached to the support member 20 presses against the head 99 can be controlled within a certain range, and stable electroencephalogram measurement can be realized.
  • the mounting parts 70 are attached to both longitudinal ends of the support member 20 (both left and right ends in Figures 1 and 2), and are placed between the support member 20 and a part of the subject other than the measurement part (here, the ear), and press the electrode unit 30 against the head 99 with a predetermined electrode pressing force F.
  • the attachment part 70 has an adjustment part 50 and an ear attachment part 40, and has a string 45 that connects them.
  • the ear attachment part 40 is attached to the subject's ear.
  • the ear attachment part 40 is attached by wrapping it around the ear.
  • the adjustment unit 50 is attached to each end of the support member 20.
  • the adjustment unit 50 has a plate-shaped member 52 that is attached to the support member 20, and a locking unit 51 for fixing the length of the plate-shaped member 52.
  • the plate-like member 52 is a long strip with multiple teeth arranged in a row.
  • the locking portion 51 has an opening with a claw formed therein, through which the plate-like member 52 is inserted to lock it in the desired position.
  • the locking portion 51 also has a release portion that works in conjunction with the claw to release the locked state.
  • the material for the adjustment portion 50 but various types of plastics can be used. From the standpoint of physical properties, workability, cost, etc., nylon 66 is preferably used.
  • the electrode unit 30 is fixed to the support member 20 made of a film base material, and forms a polygon with the electrode units 30 attached only to the necessary parts as vertices. This allows the electrode unit 30 to conform well to the shape of the head. Furthermore, by modeling the wearing state of the EEG measuring device 10 using the capstan equation, the electrode pressing force F by the electrode unit 30 can be appropriately understood.
  • Second Embodiment The second embodiment will be described with reference to Figures 6 to 9.
  • the differences between this embodiment and the first embodiment are (1) that the mounting structure of the electrode unit 30 to the support member 20 is a screw-fitting structure, (2) that an electrode mounting portion 160 is provided instead of the recessed snap button 25 as a structure for mounting the electrode unit 30 in accordance with the adoption of the screw-fitting structure, and (3) the structure and installation position of the adjustment portion 150.
  • the differences from the first embodiment will be mainly described, and similar configurations will be appropriately designated with the same reference numerals and description thereof will be omitted.
  • Figure 6 is a schematic diagram showing the EEG measuring device 110 attached to a person's head 99, as seen from the front.
  • Figure 7 is a plan view showing the EEG measuring device 110 when not attached to the head 99.
  • Figure 8 shows a cross-sectional view of the electrode unit 30 attached to the electrode attachment portion 160 of the support member 20.
  • the support member 20 is provided with an electrode attachment portion 160 for attaching the electrode unit 30.
  • the electrode attachment portion 160 has a mounting portion main body 161 that is circular when viewed from above, and a female screw 162 provided in the center of the mounting portion main body 161.
  • the outer diameter of the attachment body 161 is set to be approximately the same as the outer diameter of the electrode unit 30.
  • the upper surface of the attachment body 161 is formed from a hard insulating substrate and is equipped with a circuit section 163 (preamplifier) that performs primary amplification of the brain waves acquired by the electrode unit 30.
  • the upper surface of the attachment body 161 is covered with an insulating cover member as necessary.
  • a female screw 162 made of a conductive material is attached to the center of the mounting body 161.
  • the male screw type connection terminal 135 (protrusion 135b) of the electrode unit 30 is screwed into the female screw 162.
  • a male screw type connection terminal 135 made of a conductive material is provided on the upper surface of the electrode unit 30, instead of the convex snap button 35 of the first embodiment.
  • the male screw type connection terminal 135 has a disk-shaped disk portion 135a and a protruding portion 135b extending from the center of the upper surface of the disk portion 135a.
  • the protruding portion 135b is formed in a cylindrical shape and has a male screw with a thread formed on its circumferential surface.
  • the female screw 162 is connected to the circuit portion 163.
  • the electrode unit 30 is attached to the support member 20 by screwing the female screw 162 into the male screw type connection terminal 135 (i.e., the convex portion 135b).
  • the brainwave signal acquired by the electrode unit 30 is transmitted to the circuit section 163 from the male screw type connection terminal 135 via the female screw 162.
  • the brainwave signal that has been primarily amplified by the circuit section 163 is output to an brainwave display device or the like via a signal path not shown.
  • the attachment part By using screw fitting as the attachment method for the electrode unit 30 and the support member 20, the attachment part can be stabilized and noise generation can be suppressed.
  • ⁇ Adjustment Unit 150> 9 shows the adjustment unit 150.
  • Fig. 9(a) is a side view
  • Fig. 9(b) is a plan view.
  • the adjustment portion 150 is sewn to the support member 20 between the electrode positions C3 and T3 and between the electrode positions C4 and T4.
  • the adjustment unit 150 has a plate-like member 152 that is attached to the support member 20, and a locking unit 151 that slides the plate-like member 152 and fixes it at a desired position.
  • the locking unit 151 is provided with a string attachment unit 154 to which the string 45 is attached.
  • a convex string guide portion 126 is provided on both longitudinal ends of the support member 20.
  • the string guide portion 126 has an opening that communicates in the left-right direction, through which the string 45 is inserted. This ensures that the string 45 always passes through both ends of the base material 21, ensuring that the EEG measuring device 10 is worn properly.
  • the plate-like member 152 is a long, rail-like band with multiple protrusions 152a arranged in a row.
  • the locking portion 151 is slidably fitted into the rail formed by the protrusions 152a.
  • the locking portion 151 has a locking mechanism 156 that keeps it from sliding. The non-slidable state is released by performing a specific operation on the locking mechanism 156 (for example, pushing it sideways).
  • the distance between the ear attachment portion 40 attached to the string 45 and the support member 20 can be adjusted.
  • the third embodiment will be described with reference to Figures 10 to 13.
  • the present embodiment differs from the first and second embodiments in that (1) the support member 220 is a linear member 221, and (2) the linear member 221 is configured to be removable. Below, the differences from the first and second embodiments will be mainly described.
  • Figure 10 is a plan view of the EEG measuring device 210 of this embodiment.
  • Figure 11 is a front view of the EEG measuring device 210.
  • Figures 10 and 11 show the EEG measuring device 210 when not attached to the head 99.
  • Figure 12 is a plan view focusing on the attachment manner of the support member 220 for the two electrode units 30 at electrode positions Cz and C3.
  • Figure 13 shows a cross-sectional view of the electrode unit 30 attached to the electrode attachment portion 260.
  • the electrode unit 30 is attached to an electrode mounting portion 260 having a similar configuration to the electrode mounting portion 160 shown in the second embodiment, and is supported by a support member 220.
  • the support member 220 is provided with two parallel linear members 221 that are placed between adjacent electrode units 30 (i.e., electrode mounting portions 260).
  • mounting portions 270 are attached to the electrode mounting portions 260 at the left and right ends (electrode positions T3, T4) on each end side.
  • the electrode attachment portion 260 has an attachment portion main body 261 that is circular when viewed from above, a female screw 262 provided in the center of the attachment portion main body 261, and a circuit portion 163 that primarily amplifies the acquired brain waves.
  • the electrode attachment portion 260 has a plurality of connectors 225 for attaching the support member 220 (linear members 221 ).
  • two connectors 265 are provided on the front and back sides of the right side in the figure at the same position in the left-right direction, and two connectors 265 are provided on the front and back sides of the left side in the same position in the left-right direction.
  • the two connectors 265 on the right side have openings facing the right side, allowing the connectors 225 provided on the linear member 221 to be inserted and removed, respectively.
  • the two connectors 265 on the left side have openings facing the left side, allowing the connectors 225 provided on the linear member 221 to be inserted and removed, respectively.
  • two connectors 265 are lined up on the left side in the figure, one on the front side and one on the back side, and an attachment section 270 (adjustment section 250) is provided near the center on the right side.
  • the two connectors 265 have openings facing the left side, and each can be inserted and removed from the connectors 225 provided on the linear member 221.
  • two connectors 265 are lined up on the right side in the figure, one at the front and one at the back, and an attachment section 270 (adjustment section 250) is provided near the center on the left side.
  • the two connectors 265 have openings facing the right side, allowing the connectors 225 provided on the linear members 221 to be inserted and removed, respectively.
  • the attachment section 270 Similar to the attachment section 70 of the second embodiment, the attachment section 270 has an ear attachment section 240, an adjustment section 250, and a string 245. In this embodiment, the adjustment section 250 is attached to the electrode attachment section 260.
  • the adjustment unit 250 has a locking portion 251 attached to the electrode attachment portion 260 and a plate-shaped member 252 whose position is fixed by the locking portion 251.
  • a string 245 is attached to the plate-shaped member 252.
  • the distance between the ear attachment part 240 attached to the string 245 and the electrode attachment part 260 can be adjusted.
  • the support member 220 includes a linear member 221 and connectors 225 provided on both ends of the linear member 221 .
  • the linear member 221 refers to a linear member such as a string or wire.
  • an electric cable such as a multi-core cable or a flat cable
  • the length of the linear member 221 is set according to the EEG measurement position.
  • the thickness of the linear member 221 needs only to be flexible enough to appropriately follow the shape of the head when the EEG measurement device 210 is attached to the head 99 and EEG measurement is performed, and to be strong enough not to break even with continuous use.
  • the connectors 225 at both ends of the linear member 221 are attached to the connectors 265 of the electrode mounting parts 260 to connect adjacent electrode mounting parts 260 (i.e., electrode units 30).
  • the acquired brainwave signal can be collected at a specified external output terminal (not shown).
  • the posture of the electrode unit 30 in contact with the head 99 can be stabilized.
  • the linear members 221 detachable from the electrode attachment section 260 it is possible to replace the linear members 221 or the electrode attachment section 260 if some of them are damaged.
  • by preparing linear members 221 of different lengths it is possible to set the inter-electrode distance according to the size of the subject's head 99, that is, the optimal electrode position.
  • the support member 220 may be fixed to the electrode attachment section 260 by soldering or the like.
  • Example 1 shows the physical properties (Poisson's ratio, Young's modulus, maximum thickness, Young's modulus ⁇ thickness).
  • Example 1 PET (polyethylene terephthalate) resin
  • Example 2 PI (polyimide) resin
  • Example 3 Aluminum foil
  • Example 4 Copper foil
  • Example 5 PS (polystyrene) resin
  • Example 6 PE (polyethylene) resin
  • Example 7 Glass film
  • Example 1 the positional deviation of the electrodes when a certain tension was applied was small, and electroencephalograms could be obtained stably at the target position.
  • Example 7 the Young's modulus of the support member was smaller than that of Examples 1 to 6, and the thickness was made larger than that of the other samples in an attempt to suppress deformation, but the electrode misalignment was slightly larger when a certain tension was applied.
  • the electroencephalogram measuring device shown in the embodiment was attached to a head model, and the electrode pressing force F was measured using a pressure sensor placed on the surface of the head model, and compared with the calculated value obtained from a model based on the capstan equation.
  • EEG measurement positions 5 locations: T3, C3, Cz, C4, and T4
  • Electrode unit base diameter 10 mm
  • Base thickness 5mm
  • Protrusion height 5 mm
  • Number of protrusions 7
  • Distance between electrodes 70 mm
  • Young's modulus 3.4 GPa Maximum thickness 0.225mm
  • weights of 200 g were attached to both ends to simulate the state in which an electroencephalogram measuring device is worn.
  • Figure 14 shows a graph of the theoretical (calculated) and actual measured values of the electrode pressing force F at five locations: T3, C3, Cz, C4, and T4. As can be seen from the figure, the theoretical and actual measured values are almost identical, confirming the validity of the modeling.
  • EEG measuring device 20 Support member (film substrate) 25 Concave snap button 30 Electrode unit 31 Base 32 Protrusion 33 Conductive contact portion 34 Signal line portion 35 Convex snap button 40 Ear attachment portion 50, 150 Adjustment portion 70 Mounting portion 135 Male screw type connection terminal 160, 260 Electrode mounting portion 161, 261 Mounting portion main body 162, 262 Female screw 220 Support member 221 Linear member 225, 265 Connector

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PCT/JP2024/014242 2023-05-09 2024-04-08 脳波測定装置および脳波測定方法 Ceased WO2024232203A1 (ja)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5900167B2 (ja) 2012-06-01 2016-04-06 ソニー株式会社 生体信号測定装置、生体信号測定用装具及び生体信号測定装置セット
US20170055903A1 (en) * 2015-08-31 2017-03-02 Stichting Imec Nederland Electrode Holding Arrangement and Manufacturing Method Thereof
JP2022013591A (ja) * 2020-07-02 2022-01-18 住友ベークライト株式会社 脳波測定装置
JP2022023458A (ja) * 2020-07-27 2022-02-08 住友ベークライト株式会社 脳波測定用電極および脳波測定装置
WO2022259831A1 (ja) * 2021-06-07 2022-12-15 住友ベークライト株式会社 脳波測定装置および脳波測定方法
JP2023077092A (ja) 2021-11-24 2023-06-05 プライムアースＥｖエナジー株式会社 二次電池用電極、及び二次電池用電極の製造方法

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Publication number Priority date Publication date Assignee Title
JP5900167B2 (ja) 2012-06-01 2016-04-06 ソニー株式会社 生体信号測定装置、生体信号測定用装具及び生体信号測定装置セット
US20170055903A1 (en) * 2015-08-31 2017-03-02 Stichting Imec Nederland Electrode Holding Arrangement and Manufacturing Method Thereof
JP2022013591A (ja) * 2020-07-02 2022-01-18 住友ベークライト株式会社 脳波測定装置
JP2022023458A (ja) * 2020-07-27 2022-02-08 住友ベークライト株式会社 脳波測定用電極および脳波測定装置
WO2022259831A1 (ja) * 2021-06-07 2022-12-15 住友ベークライト株式会社 脳波測定装置および脳波測定方法
JP2023077092A (ja) 2021-11-24 2023-06-05 プライムアースＥｖエナジー株式会社 二次電池用電極、及び二次電池用電極の製造方法

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See also references of EP4710858A1

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