WO2024192578A1 - 生物传感器芯片封装结构、pcb板及微流控检测装置 - Google Patents

生物传感器芯片封装结构、pcb板及微流控检测装置 Download PDF

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Publication number
WO2024192578A1
WO2024192578A1 PCT/CN2023/082257 CN2023082257W WO2024192578A1 WO 2024192578 A1 WO2024192578 A1 WO 2024192578A1 CN 2023082257 W CN2023082257 W CN 2023082257W WO 2024192578 A1 WO2024192578 A1 WO 2024192578A1
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WIPO (PCT)
Prior art keywords
chip
integrated circuit
substrate
sensor chip
packaging structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/082257
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English (en)
French (fr)
Inventor
谭阳生
徐讯
章文蔚
董宇亮
黎宇翔
张宇宁
孔六二
云全新
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BGI Shenzhen Co Ltd
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BGI Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BGI Shenzhen Co Ltd filed Critical BGI Shenzhen Co Ltd
Priority to CN202380063610.3A priority Critical patent/CN119768362A/zh
Priority to PCT/CN2023/082257 priority patent/WO2024192578A1/zh
Publication of WO2024192578A1 publication Critical patent/WO2024192578A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems ; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate

Definitions

  • the present invention relates to semiconductor chip packaging technology, and in particular to a biosensor chip packaging structure, a PCB board and a microfluidic detection device.
  • Packaging is the process of assembling integrated circuits into final chip products. Simply put, it is to place the bare integrated circuit chips produced by the wafer factory on a substrate that serves as a carrier, and then fix and package them into a whole.
  • the current chip packaging has evolved from the initial COB packaging to the current common plastic packaging form, which has greatly improved production efficiency and the integration of sensor chips has become increasingly higher.
  • Biosensor chips are usually integrated with MEMS sensor chips and ASIC (Application Specific Integrated Circuit) chips.
  • ASIC Application Specific Integrated Circuit
  • the present invention provides a biosensor chip packaging structure, a PCB board and a microfluidic detection device, in the hope of improving the chip production yield.
  • a first aspect of the present invention provides a biosensor chip packaging structure, which includes: at least one sensor chip for converting a measured parameter into a measurement signal; at least one integrated circuit chip for processing the measurement signal; and a substrate for carrying the sensor chip and the integrated circuit chip; wherein the sensor chip and the integrated circuit chip are independently arranged on the substrate.
  • the biosensor chip packaging structure further includes: the biosensor chip packaging structure further includes: a conductive structure for electrical connection; the sensor chip and the integrated circuit chip are electrically connected via the conductive structure.
  • the conductive structure includes bonding wires; wherein the sensor chip and the integrated circuit chip are directly electrically connected via bonding wires, and the measurement signal does not pass through the substrate; or the sensor chip and the integrated circuit chip are electrically connected to the substrate via bonding wires, respectively, and the measurement signal passes through the substrate. Indirect transmission.
  • the conductive structure further includes a transfer block connected to the substrate, and the transfer block is arranged between the sensor chip and the integrated circuit chip.
  • one end of the bonding wire is connected to the adapter block, and the other end is connected to the sensor chip or the integrated circuit chip.
  • the conductive structure includes a through silicon via that penetrates the sensor chip; the sensor chip is electrically connected to the substrate, and the measurement signal is transmitted from the upper surface of the sensor chip to the substrate through the through silicon via; the integrated circuit chip is flipped and electrically connected to the substrate; the measurement signal is transmitted from the sensor chip to the integrated circuit chip through the substrate.
  • the biosensor chip packaging structure further includes: a plastic packaging body, which covers the substrate to encapsulate the biosensor chip packaging structure; the plastic packaging body is provided with an opening, and the opening allows the sensor chip to be at least partially exposed from the plastic packaging body, so that the sensor chip is in direct contact with external substances.
  • the plastic package body is configured to be transparent in at least a partial area.
  • the biosensor chip packaging structure also includes: a first connection layer and a second connection layer, wherein the first connection layer is arranged on the upper surface of the substrate, and is used to connect the sensor chip and the integrated circuit chip to the substrate; the second connection layer is arranged on the lower surface of the substrate, and is used to connect the biosensor chip packaging structure to an external substrate and electrically connect it.
  • the first connection layer includes at least one of an adhesive, a solder ball, and a solder pad; and the second connection layer is any one of a solder ball and a solder pad.
  • the first connection layer uses a solder ball.
  • a PCB board comprising: a PCB substrate; a biosensor chip packaging structure as described in any one of claims 1 to 10, wherein the biosensor chip packaging structure is connected to the PCB substrate and electrically connected.
  • the third aspect of the present application also provides a microfluidic detection device, a fluid component; such as the above-mentioned biosensor chip packaging structure, the fluid component and the biosensor chip packaging structure are assembled to form a reaction chamber.
  • a fluid component such as the above-mentioned biosensor chip packaging structure, the fluid component and the biosensor chip packaging structure are assembled to form a reaction chamber.
  • the present application also provides a method for manufacturing a biosensor chip packaging structure, the manufacturing method comprising: providing a substrate; forming at least one independent sensor chip and at least one integrated circuit at different positions on the substrate; A conductive structure is provided to connect the sensor chip and the integrated circuit chip.
  • providing a conductive structure to connect the sensor chip and the integrated circuit chip includes: providing a bonding wire to connect the sensor chip and the integrated circuit chip.
  • the providing of a conductive structure to connect the sensor chip and the integrated circuit chip includes: the sensor chip and the integrated circuit chip are electrically connected by respectively providing bonding wires and a substrate.
  • a through silicon via is provided in the sensor chip to transmit the measurement signal from the upper surface of the sensor chip to the lower surface, and the sensor chip and the substrate are electrically connected through the solder balls; the integrated circuit chip is flipped and the integrated circuit chip and the substrate are electrically connected through the solder balls.
  • connecting the sensor chip and the integrated circuit chip through bonding wires further includes: setting at least one adapter block on the substrate; processing a connection area on the adapter block; connecting one end of the bonding wire to the adapter block through the connection area, and connecting the other end to the sensor chip or the integrated circuit chip.
  • the manufacturing method also includes: placing the substrate into a mold cavity of a plastic encapsulation mold, and coating a protective layer at a position of the plastic encapsulation mold corresponding to a sensing area of the sensor chip; using the plastic encapsulation mold to press down on the sensing area to seal the sensing area; injecting a fluid plastic encapsulation body into the mold cavity; using a curing process to form the plastic encapsulation body, and then removing the substrate from the mold cavity to expose at least part of the sensing area.
  • FIG1 is a cross-sectional view showing a biosensor chip packaging structure from a microscopic perspective according to an embodiment of the present invention
  • FIG2 is a top view of the biosensor chip packaging structure illustrated in FIG1 corresponding to an embodiment of the present invention
  • FIG3 is a schematic structural diagram of a biosensor chip packaging structure provided in Embodiment 2 of the present invention.
  • FIG4 is a schematic diagram of the structure of the sensor chip packaging structure provided in the third embodiment of the present invention.
  • FIG5 is a schematic diagram of the structure of a biosensor chip packaging structure provided in Embodiment 4 of the present invention.
  • FIG6 is a schematic diagram of the structure of a biosensor chip packaging structure provided in Embodiment 5 of the present invention.
  • FIG7 is a top view of the biosensor chip packaging structure illustrated in FIG3 corresponding to Embodiment 6 of the present invention.
  • FIG8 is a schematic diagram of the structure of a PCB board provided in an embodiment of the present invention.
  • FIG. 9 is a first flow chart of a method for manufacturing a biosensor chip packaging structure provided by an embodiment of the present invention.
  • FIG. 10 is a second flow chart of the method for manufacturing the biosensor chip packaging structure provided in an embodiment of the present invention.
  • first and second are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality” is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
  • the terms “installed”, “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • installed can be a fixed connection, a detachable connection, or an integral connection
  • it can be a mechanical connection or an electrical connection
  • it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
  • a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium.
  • a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
  • a first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
  • the present invention aims at the problems existing in the prior art and proposes a general inventive concept to solve the technical problem that the packaging method currently used for biosensor chips is prone to lead to the production yield of the entire chip due to the poor MEMS sensor production process, thereby raising the production cost.
  • FIG. 1 is a cross-sectional view of a biosensor chip packaging structure 100 from a microscopic perspective according to an embodiment of the present invention
  • FIG. 2 is a top view of the biosensor chip packaging structure 100 shown in FIG. 1 according to an embodiment of the present invention
  • the biosensor chip packaging structure 100 includes: a sensor chip 1, an integrated circuit chip 2 and a substrate 3; the whole is a rectangular block structure, and can also be configured into a special-shaped structure according to its appearance design requirements.
  • the sensor chip 1 may include a MEMS chip.
  • the sensor chip 1 may contact the outside world and convert the external physical and chemical signals into measurement signals.
  • the measurement signals may be electrical signals or other signals.
  • the required sensor chip type can be adaptively changed; such as electrical sensors, photoelectric sensors, etc.; the integrated circuit chip 2 may include an ASIC chip, which further processes and transmits the measurement signal generated by the sensor chip 1 to the next level circuit, and realizes the relevant biological information detection by visualizing the measurement signal.
  • the substrate 3 is used to encapsulate the IC bare chip (in the embodiment of the present invention, the IC bare chip refers to the sensor chip 1 and the integrated circuit chip 2).
  • the substrate 3 is an intermediate product between the sensor chip 1, the integrated circuit chip 2 and the PCB substrate, and is used to carry the sensor chip 1 and the integrated circuit chip 2, and plays the role of protecting, fixing, supporting the sensor chip 1 and the integrated circuit chip 2, and providing a heat dissipation channel; in the embodiment of the present invention, the substrate 3 can be a pure silicon board or a PCB board; for example: the substrate 3 can be arranged with a circuit structure, electronic components, etc. to achieve specific biological functions.
  • the sensor chip 1 and the integrated circuit chip 2 are independently arranged on the substrate 3.
  • the sensor chip 1 and the integrated circuit chip 2 can be arranged in a vertical stacking manner on the substrate 3, or arranged in a horizontal direction, preferably in a horizontal direction to reduce the difficulty of the process, wherein the sensor chip 1 and the integrated circuit chip 2 are directly or indirectly electrically connected.
  • the sensor chip 1 and the integrated circuit chip 2 can be produced independently without interfering with each other.
  • the sensor chip 1 and the integrated circuit chip 2 are packaged as two independent chips in a typical packaging structure, which solves the problem that the sensor chip 1 is scrapped during production and affects the integrated circuit chip 2, thereby improving the production yield and saving production costs.
  • the biosensor chip packaging structure 100 further includes: a conductive structure for electrical connection; the conductive structure can be a bonding wire, a terminal or other methods, and the sensor chip 1 and the integrated circuit chip 2 are electrically connected through the conductive structure 4 to achieve signal transmission.
  • the conductive structure 4 may include a bonding wire 41 as shown in FIG. 1 ; the sensor chip 1 and the integrated circuit chip 2 are both electrically connected to the substrate 3 via the bonding wire 41 .
  • the biosensor chip packaging structure 100 further includes:
  • the plastic package 5 is covered on the substrate 3 to package the biosensor chip packaging structure 100.
  • An opening 51 is provided on any surface of the plastic package 5, and the opening 51 allows the sensing area of the sensor chip 1 to be at least partially exposed to the plastic package 5, so that the sensor chip 1 is in direct contact with external substances, so that the sensor area of the sensor chip 1 detects information of external substances.
  • the sensor chip 1 includes a body 11 and a sensing area 12 , wherein the sensing area 12 is disposed on the upper side of the body 11 , and the opening 51 exposes a portion of the sensing area 12 to contact with the outside.
  • the sensing area 12 is the area where the biosensor chip is in direct or indirect contact with external substances, and can convert the measured parameters into measurement signals for identification by the device.
  • the plastic package 5 is a fluid medium before being formed.
  • the fluid medium such as epoxy film plastic package material can be squeezed into the mold cavity by transfer molding, and the mold cavity is embedded on the substrate 3, and the components therein are embedded and solidified to form a solid package with a certain structural appearance.
  • the function of the plastic package 5 is to protect the internal components from the influence of the external environment; resist external moisture, solvents, and impact; make the chip and the external environment electrically insulated, so that the overall package has good sealing performance, resistance to thermal shock and mechanical vibration, heat diffusion, etc.
  • the biosensor chip packaging structure 100 also includes: a first connection layer 6, which is arranged on the upper surface of the substrate 3, that is, the side of the substrate 3 facing the sensor chip 1 and the integrated circuit chip 2, and is used to connect the sensor chip 1 and the integrated circuit chip 2 to the substrate 3.
  • the first connection layer 6 adheres the sensor chip 1 and the integrated circuit chip 2 to the substrate 3, and plays a role in fixing the chips.
  • the first connection layer 6 may be of the same type or of different types; specifically, it may be adapted according to the chip types of the sensor chip 1 and the integrated circuit chip 2 .
  • the first connection layer 6 can be an adhesive, and epoxy resin adhesive can be used for bonding.
  • epoxy resin adhesive can be used for bonding.
  • silver glue can be used to provide better chip heat dissipation effect.
  • solder balls or pads can also be used to better constrain the position of the sensor chip 1 and the integrated circuit chip 2, and improve the reliability of the entire biosensor chip packaging structure 100.
  • the biosensor chip package structure 100 further includes: a second connection layer 7, which is disposed on a side of the substrate 3 away from the sensor chip 1 and the integrated circuit chip 2, and is used to connect the biosensor chip package structure 100 to an external PCB and electrically connect;
  • the second connection layer 7 can be any one of a solder ball and a solder pad. Specifically, it can be adaptively configured according to the characteristics of the substrate 3 and the material of the PCB board to be connected;
  • connection layer 7 uses solder balls, since the connection is a point connection, the contact area is small, and the gap between the solder balls can be filled by the plastic package body 5 to provide better support and sealing.
  • solder pads When the second connection layer 7 uses solder pads, a relatively more stable connection strength can be provided, so that the substrate 3 is not easy to fall off under the action of external force, thereby improving the reliability of its connection.
  • the object sensor chip packaging structure 100 includes a sensor chip 1, an integrated circuit chip 2 and a substrate 3.
  • the sensor chip 1 and the integrated circuit chip 2 are independently arranged on the substrate 3 and an electrical connection is established between the sensor chip 1 and the integrated circuit chip; thereby abandoning the way in which the sensor chip 1 and the integrated circuit chip 2 are integrated into one in the prior art, so that the sensor chip 1 and the integrated circuit chip 2 are independent chips, so that during the production process, the scrapping of the sensor chip 1 does not affect the integrated circuit chip 2, thereby reducing the scrap rate and saving costs.
  • the sensor chip packaging structure 100 has the following features: the sensor chip packaging structure 100 is a rectangular block structure as a whole.
  • the sensor chip packaging structure 100 includes: a sensor chip 1 , an integrated circuit chip 2 , a substrate 3 , a conductive structure 4 , a plastic package 5 , a first connection layer 6 and a second connection layer 7 .
  • the conductive structure 4 uses a bonding wire 41;
  • the bonding wire 41 may be made of various conductive materials such as gold wire, aluminum wire, copper wire, alloy wire, etc.
  • the sensor chip 1 includes a body 11 and a sensing area 12 .
  • the plastic package 5 has a reserved opening 51 to expose the sensing area 12 .
  • Other areas of the sensor chip 1 and the integrated circuit chip 2 are covered by the plastic package 5 .
  • the first connection layer 6 may optionally use silver glue to provide good heat dissipation
  • the substrate 3 may optionally be a silicon board
  • the integrated circuit chip 2 and the substrate 3 are both adhered to the substrate 3 by silver glue, thereby limiting the sensor chip 1 and the integrated circuit chip 2.
  • the second connection layer 7 uses solder balls for soldering and electrical connection with the external substrate.
  • the plastic package 5 wraps the sensor chip 1, the integrated circuit chip 2, and the bonding wires 41 on the substrate 3, exposing the sensing area 12 of the sensor chip 1 to achieve the purpose of detecting external substances; the sensor chip 1 obtains the measurement signal of the external substance, the sensor chip 1 and the integrated circuit chip 2 are electrically connected to the substrate through the bonding wires 41, and the measurement signal is first output from the sensor chip 1 to the substrate 3, and then transmitted to the integrated circuit chip 2 through the substrate 3 for processing. Finally, it is transmitted to the circuit of the substrate 3 through the bonding wires 41. Since the second connection layer 7 is distributed below the substrate 3, it is welded to the external substrate to achieve electrical connection.
  • FIG. 3 is a schematic structural diagram of a biosensor chip packaging structure 200 provided in the second embodiment of the present invention.
  • the biosensor chip packaging structure 200 is similar to the other structural parts of the embodiment 1.
  • the sensor chip packaging structure 100 includes a sensor chip 1, an integrated circuit chip 2, a substrate 3, a conductive structure 4, a plastic package 5, a first connection layer 6 and a second connection layer 7.
  • the other features of the second embodiment of the present invention are the same as those of the first embodiment.
  • the conductive structure 4 in the second embodiment still uses the bonding wire 41.
  • the difference is that in the second embodiment, the sensor chip 1 and the integrated circuit chip 2 are directly connected through the bonding wire 41. At this time, the measurement signal does not pass through the substrate 3, and the measurement signal is transmitted to the integrated circuit chip 2 through the bonding wire 41.
  • the bonding wire 41 may be made of various conductive materials such as gold wire, aluminum wire, copper wire, alloy wire, etc.
  • the sensor chip 1 and the integrated circuit chip 2 are connected via bonding wires 41, and the integrated circuit chip 2 is connected to the substrate 3 via bonding wires 41 or other conductive structures. That is, the sensor chip 1 reads the measured parameter and converts it into a measurement signal, which is directly transmitted to the integrated circuit chip 2 via the bonding wires 41.
  • the integrated circuit chip 2 receives and processes the measurement signal and then transmits it to the substrate 3 for further processing.
  • the sensor chip 1 and the integrated circuit chip 2 are directly connected by bonding wires 41, that is, there is no need to transfer through the substrate 3.
  • the purpose of directly connecting the sensor chip 1 and the integrated circuit chip 2 is to shorten the signal transmission distance, avoid the transfer process, reduce the signal transmission links to increase reliability. At the same time, the line is relatively short to reduce signal loss.
  • FIG. 4 is a schematic diagram of the structure of a sensor chip packaging structure 300 provided in the third embodiment of the present invention.
  • the biosensor chip packaging structure 100 is similar to other structural parts of Example 1.
  • the biosensor chip packaging structure 100 includes a sensor chip 1, an integrated circuit chip 2, a substrate 3, a conductive structure 4, a plastic package 5, a first connection layer 6 and a second connection layer 7.
  • the silicon through hole 42 penetrates the upper surface of the body 11 to the lower surface of the sensor chip 1, and the sensing area 12 obtains the measurement signal, and transmits the measurement signal from the upper surface of the body 11 to the lower surface through the silicon through hole 42.
  • the first connection layer 6 between the body 11 and the substrate 3 uses solder balls to achieve a stable connection and sealing between the body 11 and the substrate 3 .
  • the integrated circuit chip 2 is flip-chip mounted, and the first connection layer 6 between the integrated circuit chip 2 and the substrate 3 also uses solder balls.
  • the first connection layer 6 between the sensor chip 1, the integrated circuit chip 2 and the substrate 3 all adopts point-coated tin solder balls, so that the connection is more stable while also taking into account good conductivity.
  • the sensor chip 1 reads the measured parameter and converts it into a measurement signal, transmits the measurement signal from the sensing area 12 to the substrate 3 through the silicon via 42 and the solder ball of the body 11, and then transmits the measurement signal from the substrate 3 to the integrated circuit chip 2 again through the solder ball at the bottom of the integrated circuit chip 2. After the integrated circuit chip 2 receives and processes the measurement signal, it is fed back to the substrate 3 for further processing.
  • the sensor chip 1 uses the silicon via TSV process instead of the wire bonding process, and the integrated circuit chip 2 adopts the form of a flip chip to increase the connection stability between the sensor chip 1 and the integrated circuit chip 2.
  • the vertical interconnection between the sensor chip 1 and the integrated circuit chip 2 can reduce the interconnection length, reduce signal delay, and reduce capacitance/inductance, so as to achieve low power consumption, high-speed communication, increased bandwidth, and miniaturization of the entire packaging structure of the sensor chip 1 and the integrated circuit chip 2.
  • FIG. 5 is a schematic structural diagram of a biosensor chip packaging structure 400 provided in a fourth embodiment of the present invention.
  • the biosensor chip packaging structure 400 is similar to the other structural parts of the above-mentioned embodiment 2.
  • the sensor chip packaging structure 100 includes a sensor chip 1, an integrated circuit chip 2, a substrate 3, a conductive structure 4, a plastic package 5, a first connection layer 6 and a second connection layer 7, wherein the conductive structure 4 includes a bonding wire 41, and the sensor chip and the integrated circuit chip are directly electrically connected through the bonding wire 41;
  • the conductive structure 4 also includes a transfer block 43 connected to the substrate 3 to adapt to the application scenario where the sensor chip 1 and the integrated circuit chip 2 are far apart and cannot be moved closer together, and the bonding wire 41 cannot directly connect the sensor chip 1 and the integrated circuit chip 2 that are far apart.
  • the transfer block 43 is arranged between the sensor chip 1 and the integrated circuit chip 2; a connection area is processed on the transfer block 43 to realize the electrical connection between the sensor chip 1 and the integrated circuit chip 2.
  • a layer of welding metal is electroplated on the surface area of the transfer block 43 to form a connection area to realize the electrical connection.
  • the welding metal material can be gold, silver, aluminum, etc.
  • One end of the bonding wire 41 is connected to the sensor chip 1 or the integrated circuit chip 2, and the other end is fixedly connected to the connection area of the transfer block 43; the purpose of the transfer block 43 is to provide the function of midway transfer.
  • the connection distance of the bonding wire 41 is shortened by connecting through the adapter block 43 , thereby doubling the connection distance of a single bonding wire 41 and reducing signal loss.
  • FIG. 6 is a schematic structural diagram of a biosensor chip packaging structure 500 provided in a fifth embodiment of the present invention.
  • the biosensor chip packaging structure 500 is similar to any one of the above-mentioned embodiments 1 to 4 in other structural parts.
  • the sensor chip packaging structure 500 includes a sensor chip 1, an integrated circuit chip 2, a substrate 3, a conductive structure 4, a plastic package 5, a first connection layer 6 and a second connection layer 7.
  • the difference is that the second connection layer 7 in the fifth embodiment is a solder pad, and the biosensor chip packaging structure 500 is soldered on the external PCB substrate by screen printing to achieve a close connection between the PCB substrate and the substrate 3.
  • solder pad is the basic building block of the surface mount assembly. Compared with the solder ball, the solder pad has a larger connection area, a more stable connection, and can reduce the vertical thickness to achieve overall compactness.
  • the biosensor chip packaging structure 600 is similar to the other structural parts of any one of the above-mentioned embodiments 2 and 4, that is, the sensor chip packaging structure 600 includes a sensor chip 1, an integrated circuit chip 2, a substrate 3, a conductive structure 4, a plastic package 5, a first connection layer 6 and a second connection layer 7.
  • the conductive structure 4 uses a bonding wire 41.
  • the difference is that at least part of the plastic package 5 is transparent. Specifically, a transparent plastic package material can be used to form the transparent area of the plastic package 5.
  • FIG. 7 a top view of a structure in which the plastic package 5 is entirely made of transparent material is shown.
  • the transparent setting of the plastic package 5 allows the interior of the biosensor chip packaging structure 600 to be visible, so as to facilitate defect detection during process production or maintenance identification after use.
  • the plastic package 5 may be partially made of transparent material to make some areas that need to be inspected visible, and other areas may be made of conventional plastic packages to reduce the impact of the external environment on important components.
  • the plastic package 5 includes at least two layers in at least the vertical direction, wherein the top layer is transparent so that the bonding wires 41 are exposed, and other layers may be non-transparent conventional plastic packages.
  • the biosensor chip package structure 600 may not be directly powered on for testing, if the lead is distorted and short-circuited during the plastic sealing process of the biosensor chip package structure 600, it will not be possible to conduct electrical testing to detect it, resulting in the outflow of defective products.
  • the internal components that need to be checked can be The parts are visible and can be directly inspected visually or screened for good products in the production process with the help of image recognition, thus improving the production yield of the biosensor chip packaging structure.
  • the bonding wires may be distorted and short-circuited when injected into the plastic package 5 during the plastic packaging process of the sensor chip 1 and the integrated circuit chip 2, resulting in failure to pass the electrical test. It is difficult to troubleshoot defects and trace problems after a defective product occurs, which can easily lead to the outflow of defective products and reduce the overall reliability of the product.
  • the biosensor chip packaging structure does not need to pass the electrical test, and can only be judged by visual inspection whether the bonding wire is short-circuited. Further improve the product yield of the biosensor chip packaging structure.
  • FIG. 8 is a schematic diagram of the structure of a PCB board 200 provided in an embodiment of the present invention.
  • the embodiment of the present invention further provides a PCB board 200 , including:
  • the PCB substrate 201 and the above-mentioned biosensor chip package structure 100 (or the biosensor chip package structures 200 - 500 in other embodiments), the biosensor chip package structure 100 is connected to the PCB substrate 201 and is electrically connected to the PCB substrate 201 .
  • the embodiment of the present invention further provides a microfluidic detection device (not shown in the figure), comprising:
  • the fluid component and the biosensor chip packaging structure as described in the above embodiments form a reaction chamber at the sensor chip after the fluid component and the biosensor chip packaging structure are assembled.
  • the sensor chip 1 of the biosensor chip packaging structure on the microfluidic detection device is directly connected to the reaction chamber, it can sense signals faster and more accurately, even if the signal is weak.
  • the biosensor chip packaging structure is simplified, which can laterally reduce the overall volume of the microfluidic detection device, making it have the advantages of high sensitivity, strong portability and fast detection.
  • the overall production yield of the biosensor chip packaging structure can be improved.
  • FIG. 9 is a first flow chart of a method for manufacturing a biosensor chip packaging structure provided by an embodiment of the present invention.
  • the embodiment of the present invention also provides a method for manufacturing a biosensor chip packaging structure, comprising:
  • Step S1 providing a substrate
  • Step S2 forming at least one independent sensor chip and at least one integrated circuit chip at different positions on the substrate;
  • Step S3 setting a conductive structure to connect the sensor chip and the integrated circuit chip.
  • the substrate in step S1 is not limited to a PCB board or a silicon board;
  • Step S2 Processing at least one sensor chip and at least one integrated circuit chip on different positions of the substrate by bonding or welding, and then setting a conductive structure to achieve signal interconnection between the sensor chip and the integrated circuit chip.
  • providing a conductive structure to connect the sensor chip and the integrated circuit chip includes: providing a bonding wire to connect the sensor chip and the integrated circuit chip.
  • connecting the sensor chip and the integrated circuit chip through bonding wires further includes:
  • At least one adapter block is arranged on the substrate
  • One end of the bonding wire is connected to the transfer block through the connection area, and the other end is connected to the sensor chip or the integrated circuit chip.
  • connection area can be a layer of welding metal electroplated on the adapter block, such as copper, nickel, titanium, tin, gold, silver, etc., the purpose of which is to make the bonding wire tightly welded to the adapter block to prevent the bonding wire from falling off during the processing process, so as to increase the reliability of information exchange between chips.
  • step S3 providing a conductive structure to connect the sensor chip and the integrated circuit chip includes:
  • the sensor chip and the integrated circuit chip are respectively provided with bonding wires and electrically connected to the substrate.
  • step S3 providing a conductive structure to connect the sensor chip and the integrated circuit chip includes:
  • a through-silicon via is set in the sensor chip to transmit the measurement signal from the upper surface of the sensor chip to the lower surface, and the sensor chip and the substrate are electrically connected through the solder ball; the integrated circuit chip is set upside down and connected through the solder ball The integrated circuit chip and the substrate are electrically connected.
  • FIG. 10 is a second flow chart of the method for manufacturing the biosensor chip packaging structure provided by an embodiment of the present invention. Further, the manufacturing method also includes:
  • Step S4 placing the substrate into a mold cavity of a plastic encapsulation mold, and coating a protective layer at a position of the plastic encapsulation mold corresponding to the sensing area of the sensor chip;
  • Step S5 using a plastic sealing mold to press down on the sensing area to seal the sensing area;
  • Step S6 injecting the fluid plastic sealing body into the mold cavity
  • Step S7 After the plastic package is formed by a curing process, the substrate is separated from the mold cavity to expose at least a portion of the sensing area.
  • the plastic encapsulation mold is pressed on the surface of the MEMS chip, and a protective layer is coated at the position of the plastic encapsulation mold corresponding to the sensing area of the sensor chip.
  • the protective layer can be polytetrafluoroethylene to prevent the sensing area of the sensor chip from being contaminated.
  • the substrate after completing step S3 is placed in a preset mold cavity, and a certain pressure is applied downward to the sensing area by the plastic encapsulation mold to make the sensing area completely sealed. Then, pressure is applied to press the plastic encapsulation material into the cavity. After the plastic encapsulation material is cured, the plastic encapsulation mold is opened to expose the sensing area, thereby completing the plastic encapsulation process.

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Abstract

一种生物传感器芯片封装结构（100）、PCB板(201)及微流控检测装置。生物传感器芯片封装结构包括：传感器芯片（1）、集成电路芯片（2）和基板（3），传感器芯片（1）用于和外界物质接触，将被测参数转换成测量信号；集成电路芯片（2）用于处理测量信号；传感器芯片(1)和集成电路芯片(2)分别互相独立设置在基板（3）上，传感器芯片(1)和集成电路芯片(2)通过基板(3)电性连接。生物传感器芯片封装结构中，传感器芯片的报废不影响集成电路芯片，减少报废率，减少工艺难度；可单独检测或者维护，提高维修经济性。

Description

生物传感器芯片封装结构、PCB板及微流控检测装置 技术领域
本发明涉及及半导体芯片封装技术，尤其是涉及一种生物传感器芯片封装结构、PCB板及微流控检测装置。
背景技术
封装是是把集成电路装配为芯片最终产品的过程，简单地说，就是把晶圆厂生产出来的集成电路裸片放在一块起到承载作用的基板上，然后固定包装成为一个整体。目前的芯片封装从起初的COB封装到如今普遍的塑封形式，生产效率大大提高，传感器芯片也集成度越来越高。
生物传感器芯片通常采用MEMS传感器芯片和AISC(Application Specific Integrated Circuit：应用型专用集成电路)芯片集成在一起。但是在实际生产过程，该类封装方式很容易因为单体件的不良导致整颗芯片的报废，从而影响整个芯片的生产良率。由于ASIC芯片的成本较高，一旦发生报废则引起成本的提升。
由此，亟需提供一种可提高产品良率的封装结构。
发明内容
本发明提供了一种生物传感器芯片封装结构、PCB板及微流控检测装置，以期望于能够改善芯片生产良率。
本发明第一方面提供一种生物传感器芯片封装结构，该生物传感器芯片封装结构包括：将被测参数转换成测量信号的至少一传感器芯片；处理所述测量信号的至少一集成电路芯片；用于承载所述传感器芯片和集成电路芯片的基板；其中，所述传感器芯片和集成电路芯片分别互相独立设置在所述基板上。
在本申请进一步的方案中，生物传感器芯片封装结构还包括：所述生物传感器芯片封装结构还包括：用于电性连接的传导结构；所述传感器芯片和集成电路芯片通过传导结构电性连接。
在本申请进一步的方案中，所述传导结构包括键合线；其中，所述传感器芯片和所述集成电路芯片通过键合线直接电性连接，所述测量信号不经由基板；或者所述传感器芯片和所述集成电路芯片分别通过键合线和基板电性连接，所述测量信号通过所述基板 间接传输。
在本申请可选的方案中，所述传感器芯片和所述集成电路芯片通过键合线直接电性连接；所述传导结构还包括连接在所述基板上的转接块，所述转接块设置在所述传感器芯片和所述集成电路芯片之间。
在本申请可选的方案中，所所述键合线一端连接转接块，另一端连接所述传感器芯片或者所述集成电路芯片。
在本申请可选的另一种方案中，所述传导结构包括贯穿所述传感器芯片的硅通孔；所述传感器芯片和所述基板电性连接，并通过所述硅通孔将测量信号从所述传感器芯片的上表面传递到基板；所述集成电路芯片倒装设置并和所述基板电性连接；所述测量信号通过所述基板从所述传感器芯片传输至所述集成电路芯片。
在本申请进一步的方案中，所述生物传感器芯片封装结构还包括：塑封体，所述塑封体覆盖在所述基板上，以对所述生物传感器芯片封装结构进行封装；所述塑封体设置有开口，所述开口使得所述传感器芯片至少部分露出于所述塑封体，以使得所述传感器芯片和外界物质直接接触。
在本申请进一步的方案中，所述塑封体设置为至少部分区域透明。
在本申请进一步的方案中，所述生物传感器芯片封装结构还包括：第一连接层及第二连接层，所述第一连接层设置在基板的上表面，用于将所述传感器芯片、集成电路芯片连接在基板上；所述第二连接层设置在基板的下表面，用于将所述生物传感器芯片封装结构连接在外部基板上并电连接。
在本申请进一步的方案中，所述第一连接层包括粘接胶、焊球、焊盘的至少一者；所述第二连接层为焊球、焊盘的任一者。
在本申请进一步的方案中，当所述传导结构包括硅通孔时，所述第一连接层采用锡焊球。
在本申请的第二方面还提供一种PCB板，包括：PCB基板；如权利要求1～10任一项所述的传感生物传感器芯片封装结构，所述传感生物传感器芯片封装结构连接在所述PCB基板上并电性连接。
本申请的第三方面还提供一种微流控检测装置，流体组件；如上述的生物传感器芯片封装结构，流体组件与生物传感器芯片封装结构装配形成有反应室。
最后，本申请还提供一种生物传感器芯片封装结构的制作方法，制作方法包括：提供一基板；在所述基板上的不同位置分别形成独立的至少一传感器芯片和至少一集成电 路芯片；设置传导结构连接所述传感器芯片和所述集成电路芯片。
在本申请可选的方案中，所述设置传导结构连接所述传感器芯片和所述集成电路芯片包括：设置键合线连接所述传感器芯片和所述集成电路芯片。
在本申请可选的方案中，所述设置传导结构连接所述传感器芯片和所述集成电路芯片包括：所述传感器芯片和所述集成电路芯片分别设置键合线和基板电性连接。
在本申请进一步的方案中，在所述传感器芯片设置贯穿的硅通孔，将测量信号从传感器芯片上表面传递到下表面，并通过所述锡焊球将所述传感器芯片和所述基板电性连接；将所述集成电路芯片倒装设置，并通过所述锡焊球将所述集成电路芯片和所述基板电性连接。
在本申请进一步的方案中，通过键合线连接传感器芯片和集成电路芯片进一步包括：基板上设置至少一转接块；在转接块上加工连接区域；将键合线的一端通过连接区域连接在转接块上，另一端连接传感器芯片或集成电路芯片。
在本申请进一步的方案中，制作方法还包括：将基板置入一塑封模具的模腔中，在塑封模具对应传感器芯片的传感区域的位置涂覆保护层；采用塑封模具下压在传感区域上以密封传感区域；向模腔中注入流体态的塑封体；采用固化工艺使得塑封体成型后，将基板脱离模腔以使传感区域的至少部分露出。
有益效果：
综上，本发明提供一种生物传感器芯片封装结构，该生物传感器芯片封装结构包括传感器芯片、集成电路芯片及基板，通过将传感器芯片和集成电路芯片独立设置在基板上并建立传感器芯片和集成电路芯片的电连接；从而摒弃现有技术中的传感器芯片和集成电路芯片集成一体的方式，使得传感器芯片和集成电路芯片作为独立的芯片，可实现以下技术效果：
1、在生产过程中传感器芯片的报废不影响集成电路芯片，从而提高生物传感器芯片封装结构整体的生产良率，减少报废率即侧面节约成本；
2、传感器芯片和集成电路芯片作为独立的芯片可减少工艺难度；
3、使用过程中由于传感器芯片和集成电路芯片不集成一体化，可单独检测或者维护，提高维修经济性。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案，下面将对具体实 施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例示例性的展示一种生物传感器芯片封装结构微观视角下的剖视图；
图2是本发明实施例所对应图1所演示的生物传感器芯片封装结构的俯视图；
图3是本发明实施例二所提供的生物传感器芯片封装结构的结构示意图；
图4是本发明实施例三所提供的传感器芯片封装结构的结构示意图；
图5是本发明实施例四所提供的生物传感器芯片封装结构的结构示意图；
图6是本发明实施例五所提供的生物传感器芯片封装结构的结构示意图；
图7是本发明实施例六所对应图3所演示的生物传感器芯片封装结构的俯视图；
图8是本发明实施例所提供的PCB板的结构示意图；
图9是本发明实施例所提供的生物传感器芯片封装结构的制作方法的第一流程图；
图10是本发明实施例所提供的生物传感器芯片封装结构的制作方法的第二流程图。
附图标记
100～500、生物传感器芯片封装结构；      1、传感器芯片；
2、集成电路芯片；                       3、基板；
4、传导结构；                           5、塑封体；
6、第一连接层；                         7、第二连接层；
41、键合线；                            42、硅通孔；
43、转接块；                            51、开口；
11、本体；                              12、传感区域；
200、PCB板；                            201、PCB基板。
具体实施方式
为了使本发明的上述以及其他特征和优点更加清楚，下面结合附图进一步描述本发明。应当理解，本文给出的具体实施例是出于向本领域技术人员解释的目的，仅是示例性的，而非限制性的。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、 “水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
本发明针对现有技术所存在的问题，提出了一个总的发明构思，以旨在解决目前生物传感器芯片所采用的封装方式，容易由于MEMS传感器生产过程的不良导致整个芯片的生产良率，从而抬高生产成本的技术问题。
【总发明构思】
首先请参阅图1～图2，图1是本发明实施例示例性的展示一种生物传感器芯片封装结构100微观视角下的剖视图，图2是本发明实施例所对应图1所演示的生物传感器芯片封装结构100的俯视图；
该生物传感器芯片封装结构100包括：传感器芯片1和集成电路芯片2及基板3；整体为一矩形块状结构，也可以根据其外形设计需求设置成异形结构。
传感器芯片1可包括MEMS芯片，传感器芯片1可接触外界，把外界的物理、化学信号转换成测量信号，测量信号可以是电信号也可以为其他信号，具体根据生物传感器所 需的传感器芯片类型适应性改变；如电传感器、光电传感器等；集成电路芯片2可包括ASIC芯片，集成电路芯片2是把传感器芯片1产生的测量信号进一步处理和传输到下一级电路，通过将测量信号进行数据可视化从而实现相关的生物信息检测。
在本发明实施例中，基板3用以封装IC裸芯片(在本发明实施例中IC裸芯片指代传感器芯片1和集成电路芯片2)，基板3作为传感器芯片1、集成电路芯片2和PCB基板的中间产品，用于承载传感器芯片1和集成电路芯片2，起到保护、固定、支撑传感器芯片1和集成电路芯片2、及提供散热通道等作用；在本发明实施例中，基板3可以是纯硅板或者采用PCB板；示例性的如：其基板3内部可以布局有线路结构、电子元器件等，以实现生物方面的特定功能。
在本发明实施例中的一个总发明构思中，传感器芯片1和集成电路芯片2分别互相独立设置在基板3上。从结构上，传感器芯片1和集成电路芯片2可以在基板3上的垂直方向采用上下堆叠式排布，或者采用在水平方向采用左右排布，优选水平方向排布以降低工艺难度，其中传感器芯片1和集成电路芯片2直接或者间接电性连接。
可以理解，通过传感器芯片1和集成电路芯片2分别互相独立设置在基板3上替代集成设计，传感器芯片1和集成电路芯片2可独立生产互不干扰，传感器芯片1和集成电路芯片2作为两个独立的芯片封装起来的典型封装结构，解决传感器芯片1生产报废影响集成电路芯片2的问题，以提升生产良率；节约生产成本。
基于以上的总发明构思，在传感器芯片1和集成电路芯片2的电性连接方式上，生物传感器芯片封装结构100还包括：用于电性连接的传导结构；传导结构可以为键合线、端子或者其他方式，传感器芯片1和集成电路芯片2通过传导结构4电性连接以实现信号的传输。
实例性的如本发明实施例中一种可选的方案中，传导结构4可以包括如图1所示的键合线41；传感器芯片1和集成电路芯片2均通过键合线41和基板3电性连接。
在本发明实施例中另一种可选的方案中，也可以采用其他工艺替代线键合工艺，仅需实现传感器芯片1和集成电路芯片2可实现信号传输即可，具体可参照后文。
在本申请中，生物传感器芯片封装结构100还包括：
塑封体5，塑封体5覆盖在基板3上，以对生物传感器芯片封装结构100进行封装。在塑封体5的任一表面设置有开口51，开口51使得传感器芯片1的传感区域至少部分露出于塑封体5，以使得传感器芯片1和外界物质直接接触，使得传感器芯片1的传感器区域探测到外界物质信息。
具体地，传感器芯片1包括本体11和传感区域12，其中传感区域12设置在本体11的上侧，开口51使得传感区域12的部分露出以和外部进行接触。
可以理解，传感器芯片1的传感区域12表面被裸露出来，传感区域12是生物传感器芯片与外界物质直接或者间接接触的区域，可以将被测参数转换成测量信号，以供设备进行识别。
可以理解，塑封体5在未成型时为流体介质，可采用传递成型法将如环氧膜塑封料等流体介质挤压入模腔，通过将模腔嵌在基板3上，并将其中的元器件包埋后固化成型，成为具有一定结构外型的固态封装体。塑封体5其功能为保护内部的元器件不受外界环境的影响；抵抗外部湿气、溶剂，以及冲击；使得芯片和外界环境电绝缘，使得整体的封装具备良好的密封性能、抵抗热冲击和机械振动、热扩散等。
进一步地，生物传感器芯片封装结构100还包括：第一连接层6，第一连接层6设置在基板3的上表面，即基板3朝向传感器芯片1、集成电路芯片2的一面上，用于将传感器芯片1、集成电路芯片2连接在基板3上。
可以理解，第一连接层6将传感器芯片1、集成电路芯片2粘接到基板3上，起到固定芯片的作用。
进一步地，第一连接层6可采用同一类，也可采用不同类；具体可根据传感器芯片1、集成电路芯片2的芯片类型进行适配。
示例性的如：根据芯片所需的工艺要求，第一连接层6可以为粘接胶，可采用环氧树脂类粘接胶实现粘接，对于一些散热需求较高的芯片，可以用银胶提供更好的芯片散热效果。在一些实施例中，也可采用焊球或者焊盘，作用在于更好地约束传感器芯片1、集成电路芯片2的位置度，提高整个生物传感芯片封装结构100的可靠性等。
更进一步地，生物传感器芯片封装结构100还包括：第二连接层7，第二连接层7设置在基板3背离传感器芯片1、集成电路芯片2的一面上，用于将生物传感器芯片封装结构100连接在外部PCB上并电连接；
进一步地，第二连接层7可以采用焊球、焊盘的任一者。具体可根据基板3以及所需连接的PCB板的材料的特征进行适应性配置；
当第二连接层7采用焊球时，由于连接为点位连接，其接触面积小，可通过塑封体5填充焊球的间隙部分起到更好的支撑和密封作用；当第二连接层7采用焊盘时可提供相对更稳固的连接强度，使得基板3外力作用下不容易发生脱落，提高其连接的可靠性。
综上，本发明实施例的总发型构思在于提供一种生物传感器芯片封装结构100，该生 物传感器芯片封装结构100包括传感器芯片1、集成电路芯片2及基板3，通过将传感器芯片1和集成电路芯片2独立设置在基板3上并建立传感器芯片和集成电路芯片的电连接；从而摒弃现有技术中的传感器芯片1和集成电路芯片2集成一体的方式，使得传感器芯片1和集成电路芯片2作为独立的芯片，从而在生产过程中传感器芯片1的报废不影响集成电路芯片2，减少报废率即侧面节约成本。
给予以上的总发明构思，以下通过具体的实施例予以阐述：
【实施例一】
请继续参阅图1，在本发明实施例一中，传感器芯片封装结构100具备以下特征：该传感器芯片封装结构100整体为一矩形块状结构。
传感器芯片封装结构100包括：传感器芯片1、集成电路芯片2、基板3、传导结构4、塑封体5、第一连接层6及第二连接层7。
在该实施例一中，传导结构4采用键合线41；
键合线41的材料可以是金线、铝线、铜线、合金线等各种导电材料。
传感器芯片1和集成电路芯片2水平置放在基板3上排布，传感器芯片1和集成电路芯片2分别通过键合线41和基板3电性连接，测量信号通过基板3间接传输，即传感器芯片1读取被测参数转换为测量信号，通过键合线41传输至基板3，继续通过键合线41将测量信号从基板3传输至集成电路芯片2，集成电路芯片2接收并处理测量信号后又反馈至基板3。
进一步地，传感器芯片1包括本体11和传感区域12，塑封体5预留开口51将传感区域12暴露，传感器芯片1和集成电路芯片2的其他区域均被塑封体5覆盖。
更进一步地，第一连接层6可选地使用银胶，以提供良好的散热，基板3可选地为硅板，集成电路芯片2、基板3均通过银胶粘贴在基板3上，从而对传感器芯片1和集成电路芯片2进行限位。
第二连接层7采用锡焊球，用于和外部基板进行焊接且电性连接。
可以理解，塑封体5将基板3上的传感器芯片1、集成电路芯片2、键合线41包裹起来，将传感器芯片1的传感区域12裸露出来，实现探测外部物质的目的；传感器芯片1获得外部物质的测量信号，传感器芯片1和集成电路芯片2通过键合线41和基板实现电连接，测量信号先从传感器芯片1输出到基板3，然后经过基板3传输到集成电路芯片2进行处理。最后再通过键合线41传输出到基板3的电路。由于第二连接层7分布在基板3下方，和外部基板进行焊接实现电连接。
【实施例二】
请参阅图3，图3是本发明实施例二所提供的生物传感器芯片封装结构200的结构示意图。
生物传感器芯片封装结构200与实施例1其他结构部分相似，传感器芯片封装结构100包括传感器芯片1、集成电路芯片2、基板3、传导结构4、塑封体5、第一连接层6及第二连接层7。
在本发明实施例二中其他特征和实施例一相同，传导结构4在本实施例二中仍采用键合线41，其区别点在于实施例二中通过传感器芯片1和集成电路芯片2通过键合线41直接连接，此时测量信号不经由基板3，由键合线41将测量信号通过键合线41传输至集成电路芯片2。
键合线41的材料可以是金线、铝线、铜线、合金线等各种导电材料。
具体地，传感器芯片1和集成电路芯片2之间通过键合线41连接，集成电路芯片2通过键合线41或者其他传导结构再和基板3连接。即传感器芯片1读取被测参数转换为测量信号，通过键合线41直接传输至集成电路芯片2，集成电路芯片2接收并处理测量信号后传输至基板3进行下一步处理。
可以理解，本发明中传感器芯片1和集成电路芯片2之间直接用键合线41连接，即无需通过基板3转接。传感器芯片1和集成电路芯片2直接互联目的在于缩短信号传输距离，避免了转接过程，较少信号传递环节以增加可靠性。同时使得线路相对短减少信号损失。
【实施例三】
请参阅图4，图4是本发明实施例三所提供的传感器芯片封装结构300的结构示意图。
生物传感器芯片封装结构100与实施例1其他结构部分相似，传感器芯片封装结构100包括传感器芯片1、集成电路芯片2、基板3、传导结构4、塑封体5、第一连接层6及第二连接层7。
在本发明实施例二中其他特征和实施例一相同，传导结构4包括硅通孔42，和实施例一区别点在于取消键合线，通过硅通孔42将测量信号从传感器芯片42的上表面传递到基板。其中传感器芯片1和集成电路芯片2均为垂直互连。
具体地，硅通孔42贯穿传感器芯片1中本体11的上表面至下表面，传感区域12获取测量信号，通过硅通孔42将测量信号从本体11的上表面传递到下表面，同时在本 体11和基板3之间的第一连接层6采用焊球，以实现本体11和基板3之间的稳固连接和密封。
集成电路芯片2采用倒装设置，在集成电路芯片2和基板3之间的第一连接层6同样采用焊球。
进一步地，传感器芯片1、集成电路芯片2和基板3之间的第一连接层6均采用点覆式的锡焊球，使其连接更稳定的同时兼顾良好的导电性。
可以理解，传感器芯片1读取被测参数转换为测量信号，通过本体11的硅通孔42及锡焊球将测量信号从传感区域12传输至基板3，继续通过集成电路芯片2底部的锡焊球将测量信号从基板3再次传输至集成电路芯片2，集成电路芯片2接收并处理测量信号后又反馈至基板3进行下一步处理。传感器芯片1采用硅通孔TSV工艺代替引线键合工艺，集成电路芯片2采用倒装芯片的形式，以增加传感器芯片1和集成电路芯片2的连接稳固性，同时传感器芯片1和集成电路芯片2的垂直互连可减小互联长度，减小信号延迟，降低电容/电感，实现传感器芯片1和集成电路芯片2的低功耗，高速通讯，增加宽带和实现整个封装结构的小型化。
【实施例四】
请参阅图5，图5是本发明实施例四所提供的生物传感器芯片封装结构400的结构示意图。
生物传感器芯片封装结构400与上述实施例二其他结构部分相似，传感器芯片封装结构100包括传感器芯片1、集成电路芯片2、基板3、传导结构4、塑封体5、第一连接层6及第二连接层7，其中传导结构4包括键合线41，传感器芯片和集成电路芯片通过键合线41直接电性连接；
在本发明实施例四中和实施例二的区别在于，传导结构4还包括连接在基板3上的转接块43，以适应当传感器芯片1和集成电路芯片2距离较远，无法通过位置挪动靠近的情况下，键合线41无法直接连接距离较远的传感器芯片1和集成电路芯片2的应用场景。
具体地，转接块43设置在传感器芯片1和集成电路芯片2之间；在转接块43上加工连接区域，以实现传感器芯片1和集成电路芯片2之间的电性连接。示例性的如：在转接块43的表面区域电镀一层焊接金属形成连接区域，以实现电性连接，焊接金属材质可以是金、银、铝等。键合线41一端连接传感器芯片1或者集成电路芯片2，另一端固定连接在转接块43的连接区域上；转接块43所设置的目的在于提供中途转接的作用， 通过转接块43连接以缩短键合线41的连接距离，实现将单根键合线41的连接距离翻倍，减少信号损失。
【实施例五】
请参阅图6，图6是本发明实施例五所提供的生物传感器芯片封装结构500的结构示意图。
生物传感器芯片封装结构500与上述实施例一至实施例四任一者的其他结构部分相似，传感器芯片封装结构500包括传感器芯片1、集成电路芯片2、基板3、传导结构4、塑封体5、第一连接层6及第二连接层7。
在本发明实施例五中，其区别点在于实施例五中的第二连接层7所采用为焊盘，通过丝网印刷的工艺将生物传感器芯片封装结构500焊接在外部的PCB基板上，实现PCB基板和基板3的紧密连接。
可以理解，焊盘为表面贴装装配的基本构成单元，其相对锡焊球连接面积更大，连接更为稳固，且可减少垂向的厚度，实现整体的紧凑化。
【实施例六】
请继续参阅图3、图5及图7；生物传感器芯片封装结构600与上述实施例二和实施例四中任一者的其他结构部分相似，即传感器芯片封装结构600包括传感器芯片1、集成电路芯片2、基板3、传导结构4、塑封体5、第一连接层6及第二连接层7。其中，传导结构4采用键合线41，在本发明实施例六中，其区别点在于塑封体5至少部分区域透明，具体地，可以采用透明材质的塑封料形成塑封体5的透明区域。
在一些实施例中，如图7所演示的为塑封体5全部采用透明材质的结构俯视图，塑封体5透明设置可以使得生物传感器芯片封装结构600的内部可视，以方便在工艺生产中进行缺陷排查或者使用后进行维修判别。
在一些实施例中，塑封体5可部分采用透明材质，将所需排查的部分区域可视，其他区域采用常规塑封体，减少重要元器件受外界环境的影响。
示例性的如：在实施例二(对应图3)和实施例四(对应图5)的情况，将塑封体5包含至少垂直方向上的至少两层，其中最上层采用透明使得键合线41露出，其他层可采用非透明的常规塑封体。
可以理解，由于生物传感器芯片封装结构600可能无法直接进行通电测试，在上述的生物传感器芯片封装结构600中塑封过程中如果引线发生歪曲短路，无法通过电测试排查会导致不良产品流出；通过塑封体5至少部分区域透明化使得所需排查的内部元器 件可视，可在生产工艺中直接目检或配合图像识别对其进行良品筛查，提高生物传感器芯片封装结构的生产良率。
可以理解，当传感器芯片1和集成电路芯片2独立设置，由于传感器芯片1和集成电路芯片2在塑封过程中，键合线在注入塑封体5时可能发生歪曲短路，导致无法通过电测试排查。发生产品不良后排查缺陷和追溯问题难度大，容易导致不良产品流出，导致产品整体的可靠性降低。而通过将塑封体采用透明物质填充的方式，使生物传感器芯片封装结构无需通过电学测试，仅可以用目检的方式判断键合线是否短路。进一步提高该生物传感器芯片封装结构的产品良率。
【一种PCB板】
请参阅图8，图8是本发明实施例所提供的PCB板200的结构示意图；本发明实施例还提供一种PCB板200，包括：
PCB基板201和如上述的生物传感器芯片封装结构100(或者其他实施例中的生物传感器芯片封装结构200～500)，生物传感器芯片封装结构100连接在PCB基板201上并和PCB基板201电性连接。
可以理解，通过在单块PCB基板201连接至少一个生物传感器芯片封装结构100，作为电子元器件的支撑体实现对应的功能。
【微流控检测装置】
本发明实施例还提供一种微流控检测装置(图未示处)，包括：
流体组件和如上述实施例中所阐述的生物传感器芯片封装结构，该流体组件与生物传感器芯片封装结构装配后在传感器芯片处形成反应室。
该微流控检测装置由于其上的生物传感器芯片封装结构的传感器芯片1直接与反应室连通，能够更快更精准地感测信号，即使信号微弱也能感测，同时生物传感器芯片封装结构结构简化，可侧面缩小微流控检测装置整体的体积，使其具备灵敏度高、便携性强、检测快速的优势。
同时通过生物传感器芯片封装结构中的传感器芯片和集成电路芯片独立设置，可提高生物传感器芯片封装结构整体的生产良率。
进一步，本领域技术人员应当理解，如果将本发明实施例所提供的一种生物传感器芯片封装结构、PCB板及其微流控检测装置，涉及到的全部或部分子模组通过稠合、简单变化、互相变换等方式进行组合、替换，如各组件摆放移动位置；或者将其所构成的产品一体设置；或者可拆卸设计；凡组合后的组件可以组成具有特定功能的设备/装置/ 系统，用这样的设备/装置/系统代替本发明相应组件同样落在本发明的保护范围内。【生物传感器芯片封装结构的制作方法】
请参阅图9，图9是本发明实施例所提供的生物传感器芯片封装结构的制作方法的第一流程图；
本发明实施例还提供一种生物传感器芯片封装结构的制作方法，包括：
步骤S1、提供一基板；
步骤S2、在基板上的不同位置分别形成独立的至少一传感器芯片和至少一集成电路芯片；
步骤S3、设置传导结构连接传感器芯片和集成电路芯片。
其中，步骤S1的基板可不限于PCB板或者硅板；
步骤S2通过粘接工艺或者焊接工艺，在基板上的不同位置加工贴片至少一传感器芯片和至少一集成电路芯片。随后设置传导结构，以实现传感器芯片和集成电路芯片的信号互联。
在对应上述步骤S3的一种可选方式中，设置传导结构连接传感器芯片和集成电路芯片包括：设置键合线连接传感器芯片和集成电路芯片。
基于以上方案，通过键合线连接传感器芯片和集成电路芯片进一步包括：
在基板上设置至少一转接块；
在转接块上加工连接区域；
将键合线的一端通过连接区域连接在转接块上，另一端连接传感器芯片或集成电路芯片。
其中，上述的“连接区域”可以为在转接块上电镀一层焊接金属，如铜、镍、钛、锡、金银等，其目的在于使键合线与转接块紧密焊合，避免键合线在加工过程中脱落，以增加芯片间的信息互通的可靠性。
在对应上述步骤S3的一种可选方式中，设置传导结构连接传感器芯片和集成电路芯片包括：
传感器芯片和集成电路芯片分别设置键合线和基板电性连接。
在对应上述步骤S3的另一种可选方式中，设置传导结构连接传感器芯片和集成电路芯片包括：
在传感器芯片设置贯穿的硅通孔，将测量信号从传感器芯片上表面传递到下表面，并通过锡焊球将传感器芯片和基板电性连接；将集成电路芯片倒装设置，并通过锡焊球 将集成电路芯片和基板电性连接。
请参阅图10，图10是本发明实施例所提供的生物传感器芯片封装结构的制作方法的第二流程图；进一步地，制作方法还包括：
步骤S4、将基板置入一塑封模具的模腔中，在塑封模具对应传感器芯片的传感区域的位置涂覆保护层；
步骤S5、采用塑封模具下压在传感区域上以密封传感区域；
步骤S6、向模腔中注入流体态的塑封体；
步骤S7、采用固化工艺使得塑封体成型后，将基板脱离模腔以使传感区域的至少部分露出。
可以理解，传感器芯片和集成电路芯片在贴片和设置传导结构后，将塑封模具压在MEMS芯片表面，在塑封模具对应传感器芯片的传感区域的位置涂覆保护层，,保护层可以是聚四氟乙烯，以防传感器芯片的传感区域被污染。将完成步骤S3后的基板置入一预设的模腔中，利用塑封模具向下施加一定压力至传感区域，使得传感区域完全密封，之后施压将塑封料压入空腔内，塑封料固化完成后塑封模具开模露出传感区域，从而完成塑封的过程。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (18)

  1. 一种生物传感器芯片封装结构，其特征在于，包括：
    将被测参数转换成测量信号的至少一传感器芯片；
    处理所述测量信号的至少一集成电路芯片；
    用于承载所述传感器芯片和集成电路芯片的基板；
    其中，所述传感器芯片和集成电路芯片分别互相独立设置在所述基板上。
  2. 根据权利要求1所述的生物传感器芯片封装结构，其特征在于，所述生物传感器芯片封装结构还包括：
    用于电性连接的传导结构；
    所述传感器芯片和集成电路芯片通过传导结构电性连接。
  3. 根据权利要求2所述的生物传感器芯片封装结构，其特征在于，所述传导结构包括键合线；
    其中，所述传感器芯片和所述集成电路芯片通过键合线直接电性连接，所述测量信号不经由基板；或者
    所述传感器芯片和所述集成电路芯片分别通过键合线和基板电性连接，所述测量信号通过所述基板间接传输。
  4. 根据权利要求3所述的生物传感器芯片封装结构，其特征在于，
    所述传感器芯片和所述集成电路芯片通过键合线直接电性连接；
    所述传导结构还包括连接在所述基板上的转接块，所述转接块设置在所述传感器芯片和所述集成电路芯片之间；
    所述键合线一端连接转接块，另一端连接所述传感器芯片或者所述集成电路芯片。
  5. 根据权利要求2所述的生物传感器芯片封装结构，其特征在于，
    所述传导结构包括贯穿所述传感器芯片的硅通孔；
    所述传感器芯片和所述基板电性连接，并通过所述硅通孔将测量信号从所述传感器芯片的上表面传递到所述基板；
    所述集成电路芯片倒装设置并和所述基板电性连接；
    所述测量信号通过所述基板从所述传感器芯片传输至所述集成电路芯片。
  6. 根据权利要求1～5任一项所述的生物传感器芯片封装结构，其特征在于，所述生物传感器芯片封装结构还包括：
    塑封体，所述塑封体覆盖在所述基板上，以对所述生物传感器芯片封装结构进行封 装；
    所述塑封体设置有开口，所述开口使得所述传感器芯片至少部分露出于所述塑封体，以使得所述传感器芯片和外界物质直接接触。
  7. 根据权利要求6所述的生物传感器芯片封装结构，其特征在于，所述塑封体设置为至少部分区域透明。
  8. 根据权利要求2～5任一项所述的生物传感器芯片封装结构，其特征在于，所述生物传感器芯片封装结构还包括：第一连接层及第二连接层，所述第一连接层设置在基板的上表面，用于将所述传感器芯片、集成电路芯片连接在基板上；
    所述第二连接层设置在基板的下表面，用于将所述生物传感器芯片封装结构连接在外部基板上并电连接。
  9. 根据权利要求8所述的生物传感器芯片封装结构，其特征在于，
    所述第一连接层包括粘接胶、焊球、焊盘的至少一者；
    所述第二连接层为焊球、焊盘的任一者。
  10. 根据权利要求9所述生物传感器芯片封装结构，其特征在于，
    当所述传导结构包括硅通孔时，所述第一连接层采用焊球，所述焊球为锡焊球。
  11. 一种PCB板，其特征在于，包括：
    PCB基板；
    如权利要求1～10任一项所述的传感生物传感器芯片封装结构，所述传感生物传感器芯片封装结构连接在所述PCB基板上并电性连接。
  12. 一种微流控检测装置，其特征在于，包括：
    流体组件；
    如权利要求1～10任一项所述的生物传感器芯片封装结构，所述流体组件与所述生物传感器芯片封装结构装配形成有反应室。
  13. 一种生物传感器芯片封装结构的制作方法，其特征在于，所述制作方法包括:
    提供一基板；
    在所述基板上的不同位置分别形成独立的至少一传感器芯片和至少一集成电路芯片；
    设置传导结构连接所述传感器芯片和所述集成电路芯片。
  14. 根据权利要求13所述的制作方法，其特征在于，所述设置传导结构连接所述传感器芯片和所述集成电路芯片包括：
    设置键合线连接所述传感器芯片和所述集成电路芯片。
  15. 根据权利要求13所述的制作方法，其特征在于，所述设置传导结构连接所述传感器芯片和所述集成电路芯片包括：
    所述传感器芯片和所述集成电路芯片分别设置键合线和基板电性连接。
  16. 根据权利要求13所述的制作方法，其特征在于，设置传导结构连接所述传感器芯片和所述集成电路芯片包括：
    在所述传感器芯片设置贯穿的硅通孔，将测量信号从传感器芯片上表面传递到下表面，并通过锡焊球将所述传感器芯片和所述基板电性连接；
    将所述集成电路芯片倒装设置，并通过锡焊球将所述集成电路芯片和所述基板电性连接。
  17. 根据权利要求14所述的制作方法，其特征在于，所述设置键合线连接所述传感器芯片和所述集成电路芯片进一步包括：
    在所述基板上设置至少一转接块；
    在所述转接块上加工连接区域；
    将键合线的一端通过连接区域连接在所述转接块上，另一端连接所述传感器芯片或所述集成电路芯片。
  18. 根据权利要求13～17任一项所述的制作方法，其特征在于，所述制作方法还包括：
    将所述基板置入一塑封模具的模腔中，在所述塑封模具对应传感器芯片的传感区域的位置涂覆保护层；
    采用塑封模具下压在所述传感区域上以密封所述传感区域；
    向所述模腔中注入流体态的塑封体；
    采用固化工艺使得塑封体成型后，将基板脱离所述模腔以使所述传感区域的至少部分露出。
PCT/CN2023/082257 2023-03-17 2023-03-17 生物传感器芯片封装结构、pcb板及微流控检测装置 Ceased WO2024192578A1 (zh)

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