WO2024135308A1 - 固体電解コンデンサ - Google Patents

固体電解コンデンサ Download PDF

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Publication number
WO2024135308A1
WO2024135308A1 PCT/JP2023/043227 JP2023043227W WO2024135308A1 WO 2024135308 A1 WO2024135308 A1 WO 2024135308A1 JP 2023043227 W JP2023043227 W JP 2023043227W WO 2024135308 A1 WO2024135308 A1 WO 2024135308A1
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WIPO (PCT)
Prior art keywords
layer
solid electrolytic
electrolytic capacitor
conductive sheet
flat film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/043227
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English (en)
French (fr)
Japanese (ja)
Inventor
響太郎 真野
亘 大西
直樹 木下
恭丈 福田
健一 鴛海
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2024565744A priority Critical patent/JP7845507B2/ja
Priority to CN202380087701.0A priority patent/CN120418905A/zh
Publication of WO2024135308A1 publication Critical patent/WO2024135308A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/055—Etched foil electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors

Definitions

  • the present invention relates to a solid electrolytic capacitor that comprises a laminate of multiple capacitor elements.
  • Patent Document 1 describes a method for manufacturing a solid electrolytic capacitor and a solid electrolytic capacitor.
  • the solid electrolytic capacitor described in Patent Document 1 includes a solid electrolyte layer and a cathode layer including a carbon layer, a conductive paste layer, and a conductive polymer layer.
  • the conductive polymer layer bonds the carbon particles of the carbon layer and the metal conductive particles of the conductive paste layer.
  • Patent Document 2 describes a solid electrolytic capacitor.
  • the solid electrolytic capacitor described in Patent Document 2 includes a solid electrolyte layer, a carbon cathode layer, and a metal cathode layer.
  • the metal cathode layer is formed of at least two layers.
  • the metal particle diameter of the metal cathode layers other than the innermost layer in the metal cathode layer is larger than the metal particle diameter of the metal cathode layer in the innermost layer.
  • a carbon layer is used between the cathode lead layer (cathode foil) and the conductive polymer layer to improve adhesive strength.
  • the magnetic field generated between the conductive polymer layer and the cathode lead layer (cathode foil) becomes stronger. More specifically, the direction of the current flowing in the normal direction in the capacitor element is constant, so the magnetic field is not canceled out. As a result, the magnetic field becomes stronger, and the ESL of the capacitor element also becomes larger. In other words, the desired characteristics may not be obtained due to the influence of inductance in the high frequency range.
  • the object of the present invention is therefore to provide a solid electrolytic capacitor that can suppress an increase in ESL even when the number of stacked capacitor elements is increased.
  • the solid electrolytic capacitor of the present invention comprises a sheet laminate and an insulating resin.
  • the sheet laminate is formed by alternately stacking a plurality of flat film capacitor elements and a plurality of flat film cathode electrode foils with conductive sheet layers interposed therebetween.
  • the insulating resin seals the sheet laminate.
  • the flat-film capacitor element comprises a flat-film anode electrode foil, a dielectric layer formed on the surface of the anode electrode foil, and a solid electrolyte layer formed within a specified area on the surface of the dielectric layer.
  • the conductive sheet layer has a plurality of conductive fillers, and has a plurality of locations where the current density changes between the flat-film capacitor element and the flat-film cathode electrode foil.
  • the current density can be varied in the conductive sheet layer.
  • the magnitude and direction of the magnetic field generated by the current flowing through the conductive sheet become complex.
  • the magnetic fields cancel each other out, and the magnetic field can be reduced.
  • the ESL is reduced.
  • the solid electrolytic capacitor of the present invention comprises a sheet laminate and an insulating resin.
  • the sheet laminate is formed by alternately stacking a plurality of flat-film capacitor elements and a plurality of flat-film cathode electrode foils with conductive sheet layers interposed therebetween.
  • the insulating resin seals the sheet laminate.
  • the flat-film capacitor element comprises a flat-film anode electrode foil, a dielectric layer formed on the surface of the anode electrode foil, and a solid electrolyte layer formed within a specified area on the surface of the dielectric layer.
  • the conductive sheet layer contains a resin layer containing multiple conductive fillers.
  • the current density can be varied in the conductive sheet layer.
  • the magnitude and direction of the magnetic field generated by the current flowing through the conductive sheet become complex.
  • the magnetic fields cancel each other out, and the magnetic field can be reduced.
  • the ESL is reduced.
  • This invention provides a solid electrolytic capacitor that can suppress an increase in ESL even when the number of stacked capacitor elements is increased.
  • FIG. 1 is a side cross-sectional view showing the configuration of the solid electrolytic capacitor according to the first embodiment.
  • Figure 2(A) is a side cross-sectional view showing the configuration of a combination of a capacitor element and a conductive sheet layer before individualization
  • Figure 2(B) is a side cross-sectional view showing the configuration of a combination of a capacitor element and a conductive sheet layer after individualization.
  • FIG. 3 is a side cross-sectional view showing an outline of the structure of the capacitor element.
  • FIG. 4 is a side cross-sectional view showing a model of the structure of the conductive sheet layer.
  • FIG. 5 is a diagram showing electric field vectors in the conductive sheet layer.
  • FIG. 6 is a contour diagram of the electric field distribution in the conductive sheet layer.
  • FIG. 7 is a graph showing the inspection target area of the solid electrolytic capacitor according to the first embodiment.
  • 3 is a flowchart showing an example of a schematic flow of a method for manufacturing the solid electrolytic capacitor according to the first embodiment.
  • FIG. 9 is a flow chart showing an example of a process for forming a capacitor element sheet.
  • FIG. 10A is an external perspective view showing the shape of electrodes of a capacitor element before being singulated
  • FIG. 10B is an external perspective view showing the shape of a capacitor element before being singulated.
  • FIG. 11 is a flow chart showing an example of a process for forming a sheet laminate.
  • FIG. 12A is an exploded perspective view showing a state in which a capacitor element sheet, a conductive sheet layer 15, and a cathode electrode 20 are laminated
  • FIG. 12B is an external perspective view of the solid electrolytic capacitor 1 in the multi-layer state.
  • FIG. 13 is a side cross-sectional view showing an outline of the structure of a capacitor element according to the second embodiment.
  • FIG. 14 is a side cross-sectional view showing the configuration of a capacitor element and a cathode electrode according to the third embodiment.
  • Fig. 1 is a side cross-sectional view showing the configuration of a solid electrolytic capacitor according to a first embodiment.
  • Fig. 1 only the insulating resin, the external electrodes, and the conductive sheet layer are hatched to make the drawing easier to see.
  • Fig. 2(A) is a side cross-sectional view showing the configuration of a set of a capacitor element and a conductive sheet layer before singulation
  • Fig. 2(B) is a side cross-sectional view showing the configuration of a set of a capacitor element and a conductive sheet layer after singulation.
  • the solid electrolytic capacitor 1 comprises a capacitor element laminate 100, insulating resin 50, external electrode 61, and external electrode 62.
  • the capacitor element laminate 100 comprises a plurality of flat film-shaped capacitor elements 10 and a plurality of flat film-shaped cathode electrodes 20.
  • the number (number) of the flat film-shaped capacitor elements 10 and the cathode electrodes is four, but this is not limited to this.
  • the cathode electrode 20 corresponds to the "cathode electrode foil" in the present invention.
  • the side cross-sectional views in FIG. 1, FIG. 2(A), and FIG. 2(B) are cross-sectional views taken along a plane perpendicular to the top surface 101 and bottom surface 102 of the capacitor element laminate 100 in FIG. 1.
  • the capacitor element 10 includes a flat electrode 11, a dielectric layer 12, and a CP layer (solid electrolyte layer) 13.
  • the electrode 11 has many holes. In other words, the electrode 11 is in a porous state (porous body). The ratio of the thickness of the porous portion on one side of the electrode 11 to the thickness of the core metal portion and the porous portion on the other side is about 1:1:1.
  • the dielectric layer 12 covers the outer surface of the electrode 11. Since detailed structure of the electrode 11 is omitted in Fig. 2(A) and Fig. 2(B), the dielectric layer 12 is illustrated as if it were covering the macroscopic surface of the electrode 11. In reality, the dielectric layer 12 covers not only the macroscopic surface of the electrode 11 but also the surfaces of the many holes in the electrode 11.
  • the CP layer 13 covers the surface of the dielectric layer 12.
  • the CP layer 13 is formed inside a frame-shaped dam 14.
  • the dam 14 has insulating properties.
  • the dam 14 restricts the formation area of the CP layer 13.
  • the dam 14 is formed in a frame shape, and then the CP layer 13 is formed inside the dam 14.
  • the dam 14 does not have to be formed in a frame shape. That is, the dam 14 may be formed on one side, or on two sides having a corner. Furthermore, the dam 14 may be formed on two opposing sides in a plan view.
  • the dam 14 may be omitted.
  • the CP layer 13 has a laminated structure of an inner layer CP (inner layer solid electrolyte layer) 131 and an outer layer CP (outer layer solid electrolyte layer) 132.
  • the inner layer CP 131 is formed on the surface of the dielectric layer 12, and the outer layer CP 132 is formed on the surface of the inner layer CP 131.
  • the multiple capacitor elements 10 and the multiple cathode electrodes 20 are alternately stacked so that their flat film surfaces are parallel and overlap when viewed in a plane.
  • a conductive sheet layer 15 is disposed between adjacent capacitor elements 10 and cathode electrodes 20. The detailed structure of the conductive sheet layer 15 will be described later.
  • the first ends 10E1 (see FIG. 2(B)) of the multiple capacitor elements 10 are at approximately the same position in side view.
  • the second ends 10E2 (see FIG. 1, FIG. 2(B)) of the multiple capacitor elements 10 are at approximately the same position in side view.
  • the first ends 20E1 (see FIG. 1, FIG. 2(B)) of the multiple cathode electrodes 20 are at approximately the same position in side view.
  • the second ends 20E2 (see FIG. 1, FIG. 2(B)) of the multiple cathode electrodes 20 are at approximately the same position in side view.
  • the first ends 10E1 of the multiple capacitor elements 10 and the second ends 20E2 of the multiple cathode electrodes 20 are arranged on the first end side of the capacitor element stack 100.
  • the first ends 10E1 of the multiple capacitor elements 10 protrude outward beyond the second ends 20E2 of the multiple cathode electrodes 20.
  • the second ends 10E2 of the multiple capacitor elements 10 and the first ends 20E1 of the multiple cathode electrodes 20 are arranged on the second end side of the capacitor element stack 100.
  • the first ends 20E1 of the multiple cathode electrodes 20 protrude outward beyond the second ends 10E2 of the multiple capacitor elements 10.
  • the capacitor element laminate 100 is realized with this structure.
  • the capacitor element stack 100 is sealed with insulating resin 50. More specifically, as shown in FIG. 1, the insulating resin 50 covers the capacitor element stack 100 except for the first ends 10E1 of the multiple capacitor elements 10 (first ends 10E1 of the electrodes 11) and the first ends 20E1 of the multiple cathode electrodes 20.
  • the external electrode 61 covers the first end of the insulating resin 50 (the first end 10E1 of the electrode 11).
  • the external electrode 61 is connected to the first ends 10E1 of the electrodes 11 of the multiple capacitor elements 10.
  • the external electrode 62 covers the second end of the insulating resin 50 (the first end 20E1 of the cathode electrode 20).
  • the external electrode 62 is connected to the first ends 20E1 of the multiple cathode electrodes 20.
  • Fig. 3 is a side cross-sectional view that shows a schematic structure of the capacitor element 10 and the conductive sheet layer 15, and is an enlarged view of the structure of the capacitor element 10 shown in Fig. 2(A) described above.
  • Fig. 3 the structure of one main surface of the capacitor element 10 on which the conductive sheet layer 15 and the cathode electrode 20 are arranged will be described, but the other main surface opposite to the one main surface has a similar structure.
  • the side cross-sectional view in Fig. 3 is a cross-sectional view taken along a plane perpendicular to the top surface 101 and the bottom surface 102 of the capacitor element laminate 100 shown in Fig. 1.
  • each component has been enlarged and exaggerated. Also, in FIG. 3, only one set of capacitor element 10 and cathode electrode 20 is shown, but the solid electrolytic capacitor 1 is formed by stacking multiple such sets.
  • the conductive sheet layer 15 includes a conductive filler 151 and a resin layer 152.
  • the conductive sheet layer 15 is formed of the resin layer 152, and the conductive filler 151 is surrounded by this resin layer 152.
  • the shape of the conductive filler 151 is indefinite.
  • the shape of the conductive filler 151 is a sphere, a polygonal prism, a long sphere, or a prolate ellipsoid.
  • the outer shape of the conductive filler 151 may be rounded or pointed.
  • the surface of the conductive filler 151 may be uneven, or may be flat without any unevenness.
  • the conductive fillers 151 are arranged at an arbitrary interval in the resin layer 152.
  • the conductive sheet layer 15 is a region in which the conductive fillers 151 and the resin layer 152 are mixed. Note that the surface of the conductive sheet layer 15 facing the bottom surface 102 in FIG. 1 is the sheet bottom surface 104, and the surface facing the top surface 101 in FIG. 1 is the sheet top surface 103.
  • the structure of the conductive sheet layer 15 changes four times in the order of resin layer 152, conductive filler 151, resin layer 152, conductive filler 151, and resin layer 152.
  • the structures of the conductive filler 151 and resin layer 152 change aperiodically four times from point A to point B.
  • the above-mentioned conductive sheet layer 15 has a structure having conductive fillers 151, the current vector of the current that enters from point A to point B changes irregularly. This complicates the potential gradient in the conductive sheet layer 15, resulting in a non-uniform current density. In other words, the magnitude and direction of the magnetic field generated by the current become more complex, causing the magnetic fields to cancel each other out. This reduces the magnetic field, making it possible to suppress an increase in ESL.
  • the number of times the conductive filler 151 and the resin layer 152 are changed is preferably at least two times. More preferably, it is more than four times.
  • the number of times the conductive filler 151 and the resin layer 152 are changed is preferably many in accordance with Ampere's law. That is, the ratio (concentration) of the conductive filler 151 contained in the resin layer 152 is, for example, 30% to 85% on average inside the conductive sheet layer 15, and preferably 60% to 80%. This increases the offsetting effect of the generated magnetic field (magnetic field).
  • the conductive sheet layer 15 contains at least 30% conductive filler 151, an effect of offsetting a certain magnetic field (magnetic field) can be obtained.
  • the ratio (concentration) of the conductive filler 151 contained in the resin layer 152 is the ratio of the cross-sectional area of the conductive filler 151 to the cross-sectional area of the resin layer 152, which is 100, when a cross-sectional area of the resin layer 152 is 100, when a cross-sectional area of the center of the capacitor element 10 is observed.
  • the conductive sheet layer 15 becomes closer to a layer of metal alone. In other words, it becomes difficult to obtain the effect of the anisotropy of the electric field, so it is preferable not to include too much, taking into account the ESR of the conductive sheet layer 15.
  • Figure 4 is a side cross-sectional view of a model of the structure of the conductive sheet layer 15.
  • Figure 5 is a diagram showing electric field vectors in the conductive sheet layer 15.
  • Figure 6 is a contour diagram of the electric field distribution in the conductive sheet layer 15.
  • the resin layer 152 is not hatched in order to make the figures easier to understand.
  • the units and values of the current vectors in Figures 5 and 6 are merely examples, and are not limited to these descriptions.
  • the direction of the current is shown macroscopically
  • Figure 5 the electric field vector (the magnitude and direction of the current) is shown macroscopically.
  • FIGS. 4, 5, and 6 are conceptual diagrams showing the side cross-sectional view shown in FIG. 3.
  • a plurality of conductive fillers 151 are present in the resin layer 152.
  • a current is passed from the bottom surface 104 of the sheet to the top surface 103 of the sheet.
  • a current vector is generated in the overall direction from the bottom surface 104 of the sheet to the top surface 103 of the sheet.
  • the current vector is perpendicular to the bottom surface 104 of the sheet.
  • a magnetic field is generated in response to this current vector.
  • conductive filler 151 is present in the conductive sheet layer 15. That is, as shown in FIG. 5, the magnitude and direction of the current vector perpendicular to the bottom surface 104 of the sheet are complicated due to the presence of this conductive filler 151. Therefore, as shown in FIG. 6, the potential gradient is also complicated. As a result, the magnetic fields generated in the conductive sheet layer 15 cancel each other out, and the magnetic field is reduced. In other words, the ESL is reduced. Therefore, when the configuration of the present invention is used, the ESL can be reduced, and the inductor component that becomes reactance in the high frequency range is reduced.
  • Figure 7 is a graph showing the inspection target area of a solid electrolytic capacitor according to the first embodiment.
  • the solid line indicates reactance due to ESL.
  • the quality of the external electrodes is inspected.
  • detection of the sub-milli-ohm order is required in a frequency range exceeding 1 MHz. This is, for example, the shaded area shown in the graph in Figure 7.
  • the frequency, impedance units, and numerical values in Figure 7 are merely examples and are not limited to this description.
  • the inductor component that becomes reactance in the high frequency range is reduced.
  • the conventional configuration results in the top solid line, but by using the configuration of the present invention, it can be reduced to the bottom solid line. Therefore, at 1 MHz, the reactance can be reduced to less than 1.0 m ⁇ .
  • the ESR of the external electrodes can be accurately inspected, making it possible to suppress defects caused by the quality of the external electrodes (such as breaks). This makes it possible to achieve long-term reliability for solid electrolytic capacitors.
  • the carbon layer for adhesion can be omitted. This makes it possible to suppress the ESR caused by the carbon layer. Therefore, the solid electrolytic capacitor 1 can have a low ESR.
  • Fig. 8 is a flow chart showing an example of a schematic flow of the method for manufacturing the solid electrolytic capacitor according to the first embodiment.
  • a capacitor element sheet is formed (Figure 8: S11).
  • the capacitor element sheet is formed with an array of multiple capacitor elements 10 that form different solid electrolytic capacitors 1.
  • the capacitor element sheets are stacked to form a sheet laminate (FIG. 8: S12).
  • the sheet laminate is a structure in which a plurality of capacitor element laminates 100 are arranged in a plane.
  • the sheet laminate is sealed with insulating resin 50 (FIG. 8: S13). Details will be described later, but at this time, through holes that penetrate from the top surface to the bottom surface of the sheet laminate are provided in the sheet laminate, and resin sealing is performed by compression molding.
  • the solid electrolytic capacitor 1 is in a multi-state (a state in which multiple solid electrolytic capacitors 1 are arranged) before being separated into individual pieces.
  • the sheet laminate sealed with insulating resin 50 is cut and singulated (FIG. 8: S14). Specifically, cutting is performed along cutting lines formed at arbitrary positions. This results in a plurality of solid electrolytic capacitors 1 (referred to as the element body of solid electrolytic capacitor 1) without external electrodes formed thereon.
  • the element body of solid electrolytic capacitor 1 is subjected to secondary sealing with insulating resin 50. More specifically, the side surface of the element body of solid electrolytic capacitor 1 is covered by secondary sealing with insulating resin 50. As a result, the electrodes 11 of capacitor elements 10 that are unnecessarily exposed during singulation are covered with insulating resin 50.
  • FIG. 9 is a flow chart showing an example of a process for forming a capacitor element sheet.
  • Fig. 10(A) is an external perspective view showing the shape of the electrodes of the capacitor element before singulation
  • Fig. 10(B) is an external perspective view showing the shape of the capacitor element before singulation.
  • Fig. 11 is a flow chart showing an example of a process for forming a sheet laminate.
  • the electrode 11 of the capacitor element 10 is subjected to a chemical conversion treatment to form the dielectric layer 12 (Figure 9: S111). At this time, numerous holes are formed on the surface of the electrode 11 by etching, and the area near the surface of the electrode 11 is porous.
  • the dielectric layer 12 covers the surface of the electrode 11, including the inner surfaces of the holes.
  • through holes are formed in the electrode 11 (FIG. 9: S112). More specifically, as shown in FIG. 10(A), a plurality of cylindrical through holes 19C and groove-shaped through holes 19L are formed in the electrode 11. The plurality of cylindrical through holes 19C and groove-shaped through holes 19L are arranged alternately along the direction in which the portions that will become the plurality of electrodes 11 are arranged.
  • a through hole 29C corresponding to the through hole 19C and a through hole 29L corresponding to the groove-shaped through hole 19L are formed in the cathode electrode 20.
  • a CP layer (solid electrolyte layer) 13 is formed on the surface of the dielectric layer 12 (FIG. 9: S113). More specifically, as shown in FIG. 10(B), a dam 14 with a frame-shaped opening is formed so as not to block the anode through-holes (through-holes 19C, 19L). Then, a CP layer 13 (a laminated structure of an inner layer CP 131 and an outer layer CP 132) is formed within the opening of the dam 14.
  • this structure is made in a multi-state in which multiple capacitor elements 10 (structures consisting of electrodes 11, dielectric layers 12, CP layers 13, and dams 14) are arranged two-dimensionally. Cutting is performed along the cutting lines to form solid electrolytic capacitors 1. This results in multiple solid electrolytic capacitors 1 (referred to as solid electrolytic capacitor 1 bodies) without external electrodes being formed.
  • the anode through holes are formed in step S112, and then the dam 14 is formed in step S113.
  • the anode through holes may be formed after the dam 14 is formed.
  • Fig. 11 is a flow chart showing an example of a process for forming a sheet laminate.
  • Fig. 12(A) is an exploded perspective view showing a state in which a capacitor element sheet, a conductive sheet layer 15, and a cathode electrode 20 are laminated
  • Fig. 12(B) is an external perspective view of the solid electrolytic capacitor 1 in the multi-layer state.
  • the capacitor element sheet, the conductive sheet layer 15, and the cathode electrode 20 are stacked alternately (FIG. 11: S121).
  • These through holes are formed in a number corresponding to the number of capacitor elements arranged in the sheet laminate.
  • the sheet laminate is formed with a number of through holes that penetrate from the top surface to the bottom surface of the sheet laminate.
  • the sheet laminate is heated and pressurized (FIG. 11: S122). This bonds the capacitor element sheet, the conductive sheet layer 15, and the cathode electrode 20 together to form a sheet laminate. That is, the capacitor element sheet and the cathode electrode 20 are bonded together by the conductive sheet layer 15 as described above.
  • Fig. 13 is a side cross-sectional view showing the configuration of the solid electrolytic capacitor according to the second embodiment.
  • the solid electrolytic capacitor 1A according to the second embodiment differs from the solid electrolytic capacitor 1 according to the first embodiment in the structure of the conductive sheet layer 15A.
  • the other configuration of the solid electrolytic capacitor 1A is the same as that of the solid electrolytic capacitor 1, and a description of similar parts will be omitted.
  • the conductive sheet layer 15A includes a filler 151A and a resin layer 152.
  • the filler 151A includes, for example, resin particles 153.
  • the surface of the resin particles 153 is covered with a metal film 154.
  • the metal film 154 is made of silver, copper, aluminum, or the like.
  • the conductive sheet layer 15A only the surface of the filler 151A is covered with a metal film 154 having electrical conductivity. In other words, it has a higher resistance than the conductive filler 151 in the first embodiment. However, it is possible to reduce material costs compared to using the conductive filler 151.
  • Fig. 14 is a side cross-sectional view showing the configuration of the solid electrolytic capacitor according to the third embodiment.
  • the solid electrolytic capacitor 1B according to the third embodiment differs from the solid electrolytic capacitor 1 according to the first embodiment in that it includes a carbon layer 16.
  • the other configuration of the solid electrolytic capacitor 1B is the same as that of the solid electrolytic capacitor 1, and a description of similar parts will be omitted.
  • a carbon layer 16 is formed between the outer layer CP132 and the conductive sheet layer 15. With this configuration, the adhesive strength between the capacitor element 10 and the cathode electrode 20 is improved.
  • the current vector of the current that enters from point A to point B changes irregularly, as in the conductive sheet layer 15 of the first embodiment. This complicates the potential gradient in the conductive sheet layer 15, resulting in a non-uniform current density. In other words, the magnitude and direction of the magnetic field generated by the current become more complex, causing the magnetic fields to cancel each other out. This reduces the magnetic field, making it possible to suppress an increase in ESL. Furthermore, by providing the carbon layer 16, the adhesive strength inside the solid electrolytic capacitor 1B can be further improved.
  • the carbon layer 16 may be in a circular ring shape that follows the outer shape of the outer layer CP132, or may be formed only on the end of the outer layer CP132.
  • the solid electrolytic capacitor 1B can be configured to have a carbon layer 16 while increasing the contact area between the conductive sheet layer 15 and the cathode electrode 20. This can reduce the ESR and improve the contact strength compared to the configuration of the first embodiment.
  • the carbon layer 16 may be formed partially near the center of the outer layer CP132 when viewed in a plan view. In other words, it is not necessary to form the carbon layer 16 on the entire surface of the outer layer CP132, as long as the carbon layer 16 is provided on at least a portion of the outer layer CP132.
  • Capacitor element 10 (Description of an example of specific materials of each component of solid electrolytic capacitor 1) (Capacitor element)
  • the capacitor element 10 is realized, for example, with the following materials and thicknesses.
  • the electrode 11 is made of, for example, a metal such as aluminum, tantalum, niobium, titanium, zirconium, magnesium, or copper, or an alloy containing these metals.
  • the electrode 11 is preferably made of aluminum or an aluminum alloy.
  • the electrode 11 may be any valve metal that exhibits a so-called valve action.
  • the electrode 11 is preferably flat, and the thickness of the core of the electrode 11 (the center part that is not reached by the pores of the porous body) is preferably 5 ⁇ m or more and 100 ⁇ m or less.
  • the thickness (thickness of one side) of the porous part (the part where the pores of the porous body are formed) is preferably 5 ⁇ m or more and 200 ⁇ m or less.
  • the dielectric layer 12 is preferably made of an oxide film of the electrode 11.
  • the dielectric layer 12 is formed by oxidizing the electrode 11 in an aqueous solution containing boric acid, phosphoric acid, adipic acid, or their sodium salts, ammonium salts, or the like.
  • the thickness of the dielectric layer 12 is preferably 1 nm or more and 100 nm or less.
  • the inner layer CP131 may be a layer of PEDOT:PSS, which is realized by, for example, a conductive polymer having a skeleton of pyrroles, thiophenes, anilines, etc., or a conductive polymer having a skeleton of thiophenes such as PEDOT [poly(3,4-ethylenedioxythiophene)], which is a conductive polymer having a skeleton of thiophenes, and is composited with polystyrene sulfonic acid (PSS) as a dopant.
  • PEDOT poly(3,4-ethylenedioxythiophene)
  • the inner layer CP131 is formed, for example, by a method of forming a polymer film of poly(3,4-ethylenedioxythiophene) or the like on the surface of the dielectric layer 12 using a treatment liquid containing a monomer such as 3,4-ethylenedioxythiophene, or a method of applying a dispersion of a polymer such as poly(3,4-ethylenedioxythiophene) to the surface of the dielectric part and drying it.
  • the thickness of the outer layer CP132 is preferably 2 ⁇ m or more and 20 ⁇ m or less.
  • the material of the outer layer CP132 is the same as the material of the inner layer CP131.
  • the material of the outer layer CP132 may be different from the material of the inner layer CP131.
  • the inner layer CP131 can be formed of PEDOT:PSS, and the outer layer CP132 can be formed of polypyrrole.
  • the insulating resin 50 may contain a filler.
  • the resin are preferably epoxy resin, phenol resin, polyimide resin, silicone resin, polyamide resin, liquid crystal polymer, etc.
  • the filler are preferably insulating oxide particles such as silica particles, alumina particles, titania particles, zirconia particles, etc.
  • the maximum diameter of the filler is preferably, for example, 10 ⁇ m or more and 50 ⁇ m or less.
  • a material containing silica particles in solid epoxy resin and phenol resin is more preferable.
  • the resin layer 152 in the conductive sheet layer 15 is preferably a thermosetting resin (epoxy resin), or may be a thermosetting resin when a certain degree of flexibility is required.
  • ⁇ 1> a sheet laminate formed by alternately laminating a plurality of flat film capacitor elements and a plurality of flat film cathode electrode foils with conductive sheet layers interposed therebetween; an insulating resin that seals the sheet laminate; Equipped with The flat film capacitor element is A flat anode electrode foil; a dielectric layer formed on a surface of the anode foil; a solid electrolyte layer formed within a predetermined region on a surface of the dielectric layer; Equipped with The conductive sheet layer has a plurality of conductive fillers, and has a plurality of locations where the current density changes between the flat film capacitor element and the flat film cathode electrode foil.
  • the conductive sheet layer is When the flat film cathode electrode is viewed in a normal direction from the flat film capacitor element,
  • the conductive sheet layer is The solid electrolytic capacitor according to ⁇ 1> or ⁇ 2>, wherein the number of the fillers is two or less when the flat film cathode electrode is viewed in a normal direction from the flat film capacitor element.
  • the filler has a resin base, The solid electrolytic capacitor according to ⁇ 1> or ⁇ 2>, wherein a surface of the resin is covered with a metal film.
  • ⁇ 6> The solid electrolytic capacitor according to any one of ⁇ 1> to ⁇ 3>, further comprising a carbon layer between the flat film capacitor element and the conductive sheet layer.
  • ⁇ 8> a sheet laminate formed by alternately laminating a plurality of flat film capacitor elements and a plurality of flat film cathode electrode foils with conductive sheet layers interposed therebetween; an insulating resin that seals the sheet laminate; Equipped with The flat film capacitor element is A flat anode electrode foil; a dielectric layer formed on a surface of the anode foil; a solid electrolyte layer formed within a predetermined region on a surface of the dielectric layer; Equipped with The conductive sheet layer is formed of a resin layer, and the resin layer contains a plurality of fillers having electrical conductivity.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2023/043227 2022-12-20 2023-12-04 固体電解コンデンサ Ceased WO2024135308A1 (ja)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521291A (ja) * 1991-07-12 1993-01-29 Nippon Chemicon Corp 固体電解コンデンサ
JP2006324299A (ja) * 2005-05-17 2006-11-30 Matsushita Electric Ind Co Ltd 固体電解コンデンサ
JP2007042832A (ja) * 2005-08-03 2007-02-15 Matsushita Electric Ind Co Ltd 固体電解コンデンサ
JP2011091444A (ja) * 2011-02-04 2011-05-06 Panasonic Corp 固体電解コンデンサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521291A (ja) * 1991-07-12 1993-01-29 Nippon Chemicon Corp 固体電解コンデンサ
JP2006324299A (ja) * 2005-05-17 2006-11-30 Matsushita Electric Ind Co Ltd 固体電解コンデンサ
JP2007042832A (ja) * 2005-08-03 2007-02-15 Matsushita Electric Ind Co Ltd 固体電解コンデンサ
JP2011091444A (ja) * 2011-02-04 2011-05-06 Panasonic Corp 固体電解コンデンサ

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JPWO2024135308A1 (https=) 2024-06-27
CN120418905A (zh) 2025-08-01

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