WO2024114621A1 - 芯片散热装置和电路板 - Google Patents

芯片散热装置和电路板 Download PDF

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Publication number
WO2024114621A1
WO2024114621A1 PCT/CN2023/134655 CN2023134655W WO2024114621A1 WO 2024114621 A1 WO2024114621 A1 WO 2024114621A1 CN 2023134655 W CN2023134655 W CN 2023134655W WO 2024114621 A1 WO2024114621 A1 WO 2024114621A1
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Prior art keywords
chip
heat sink
board
reduction module
heat dissipation
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PCT/CN2023/134655
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English (en)
French (fr)
Inventor
黄保香
李红彬
Original Assignee
广州视源电子科技股份有限公司
广州视睿电子科技有限公司
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Publication of WO2024114621A1 publication Critical patent/WO2024114621A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of chip heat dissipation structures, for example, to a chip heat dissipation device and a circuit board.
  • the chip is a type of integrated circuit. When the chip is under a heavy workload, it will generate a lot of heat. Since the surface area of the chip is relatively small, the heat exchange efficiency is low, and the heat dissipation efficiency is low, the relevant technology will add a heat sink to the chip to improve the heat dissipation efficiency of the chip through the heat sink.
  • the heat sink is generally made of metal with good thermal conductivity and is fixed to the circuit board with a plastic clip. However, since the chip is set on the circuit board, the heat sink is also set on the circuit board, and the heat sink is located above the chip. The setting method of the heat sink will cause the heat sink and the chip to form a parasitic capacitance. When the chip is working, there will be a momentary charge coupled to the heat sink, and as the momentary charge accumulates, it will cause the heat sink to accumulate a large amount of interference signals, and the interference signal will also cause electromagnetic interference, affecting the operation of the chip.
  • the purpose of this application is to overcome the shortcomings and deficiencies in the related art and to provide a chip heat dissipation device and a circuit board, which can make it easier for interference signals on the heat sink to be discharged to the circuit board, thereby reducing the impact of interference signals on the chip.
  • a first aspect of an embodiment of the present application provides a chip heat dissipation device, which is applied to a circuit board, wherein the circuit board includes a board body and a chip arranged on the board body; the chip heat dissipation device includes: a heat sink, an insulating connector, a conductive foam and an impedance reduction module;
  • the heat sink is mounted above the board through the insulating connector, and the heat sink is attached to the chip; the heat sink is connected to the ground end of the board via the conductive foam and the impedance reduction module in sequence.
  • a second aspect of the embodiments of the present application provides a circuit board, comprising: a board body, a chip, a heat sink, an insulating connector, a conductive foam and an impedance reduction module;
  • the chip is arranged on the board; the heat sink is mounted on the board through the insulating connector, and the heat sink is attached to the chip; the heat sink is connected to the ground end of the board via the conductive foam and the impedance reduction module in sequence.
  • the heat sink of the present application discharges the interference signal on the heat sink to the circuit board through the conductive foam, and is connected to the ground end of the board through the impedance reduction module, so as to reduce the parasitic inductance generated by the connection structure between the conductive foam and the circuit board.
  • the impedance reduction module forms a signal discharge circuit. Since the impedance reduction module is connected in series with the heat sink and the conductive foam, the impedance of the discharge circuit to interference signals of different frequencies is reduced through the impedance reduction module, so that interference signals of different frequencies on the heat sink can be more easily discharged to the ground end of the board, reducing the impact of the interference signal on the chip.
  • FIG. 1 is a circuit diagram of a chip heat dissipation device according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of the circuit connection relationship of a circuit board according to an embodiment of the present application.
  • circuit board 100, circuit board; 101, board body; 103, chip; 200, chip heat dissipation device; 201, heat sink; 203, insulating connector; 205, conductive foam; 207, impedance reduction module.
  • FIG. 1 is a circuit structure diagram of a chip 103 heat dissipation device according to an embodiment of the present application.
  • the chip heat dissipation device is applied to a circuit board 100, and the circuit board 100 includes a board body 101 and a chip 103 arranged on the board body 101.
  • the chip heat dissipation device includes a heat sink 201, an insulating connector 203, a conductive foam 205, and an impedance reduction module 207.
  • the heat sink 201 is mounted above the board body 101 through the insulating connector 203, and the heat sink 201 is attached to the chip 103; the heat sink 201 is connected to the ground end of the board body 101 via the conductive foam 205 and the impedance reduction module 207 in turn.
  • the heat sink 201 includes a thermal conductive surface and a heat dissipation surface.
  • the thermal conductive surface of the heat sink 201 is smooth, and the thermal conductive surface of the heat sink 201 contacts the chip 103 so that the thermal conductive surface of the heat sink 201 fits the chip 103, so that the heat of the chip 103 is transferred to the thermal conductive surface of the heat sink 201;
  • the heat dissipation surface of the heat sink 201 is provided with a plurality of heat dissipation fins, and the heat sink 201 increases the contact area with the air through the heat dissipation fins to improve the efficiency of heat exchange with the air, thereby quickly volatilizing the heat of the chip 103 obtained by the thermal conductive surface.
  • the insulating connector 203 is used to reduce the pressure exerted by the heat sink 201 on the components on the board 101.
  • the insulating connector 203 may be a buckle made of insulating material, such as a plastic buckle.
  • the conductive foam 205 is disposed between the heat sink 201 and the board 101 to connect the heat sink 201 and the ground of the board 101 so that interference signals on the heat sink 201 can be discharged to the ground of the board 101 through the conductive foam 205 .
  • the impedance reduction module 207 refers to a module or component used to reduce the impedance of the interference signal in the circuit.
  • the interference signal is distributed at various positions of the heat sink 201.
  • parasitic inductance may also exist in the layout of the wires. Since the parasitic inductance has a large impedance to the interference signal, it is difficult for the interference signal on the heat sink 201 to be discharged to the circuit board 100.
  • the embodiment of the present application can reduce the impedance of the parasitic inductance to the interference signal of the specified frequency through the impedance reduction module 207, so that the heat sink can discharge the interference signal to the ground end of the board body 101, thereby reducing the influence of the interference signal on the chip.
  • the heat sink 201 of the present application discharges the interference signal on the heat sink 201 to the circuit board 100 through the conductive foam 205, and is connected to the ground end of the board body 101 through the impedance reduction module 207, and the parasitic inductance generated by the connection structure of the conductive foam 205 connecting the circuit board 100 and the impedance reduction module 207 form a signal discharge circuit. Since the impedance reduction module 207 is connected in series with the heat sink 201 and the conductive foam 205, the impedance of the discharge circuit to interference signals of different frequencies is reduced by the impedance reduction module 207, so that the interference signals of different frequencies on the heat sink 201 can be more easily discharged to the ground end of the board body 101.
  • the number of impedance reduction modules 207 is not limited, and the number of components and circuit structure of each impedance reduction module 207 of the same chip 103 heat dissipation device can be different.
  • the impedance of each discharge circuit to the interference signal of the specified frequency can be reduced, so that interference signals of different frequencies can be discharged to the ground end of the circuit board 100 through different discharge circuits.
  • the impedance reduction module 207 includes one or more capacitors; a first end of each capacitor is connected to the conductive foam 205 , and a second end of each capacitor is connected to the ground end of the board 101 .
  • the impedance reduction module 207 since the impedance reduction module 207 includes a capacitor, and the impedance reduction module 207 is connected in series with the parasitic inductance, the capacitor of the impedance reduction module 207 is also connected in series with the parasitic inductance to form a series LC resonant circuit.
  • the resonant frequency of the interference signal of the heat sink 201 is approximately close to that of the LC resonant circuit.
  • the upper surface of the chip 103 is provided with thermally conductive silicone, and the thermally conductive silicone contacts the heat sink 201, so that the heat sink 201 is attached to the chip 103.
  • the direct contact between the thermally conductive silicone and the chip 103 can accelerate the heat transfer of the chip 103, so that the heat of the chip 103 is more efficiently transferred to the heat sink 201.
  • the conductive foam 205 is filled between the heat sink 201 and the board 101 to suppress electromagnetic leakage.
  • the heat sink 201 is reduced in direct contact with the chip 103 and the impedance module 207 and other components disposed on the board 101, electromagnetic leakage is suppressed, and a shielding effect is played, thereby reducing the electromagnetic interference to the components on the board 101 during operation.
  • the impedance reduction module 207 further includes magnetic beads, which are connected in parallel to both ends of each capacitor.
  • the magnetic beads are connected in parallel with the capacitors, and the high-frequency inductance characteristics of the magnetic beads are used to prevent the high-frequency signals of the corresponding frequencies from passing through the signal discharge circuit connected in parallel with the magnetic beads, so that the user can plan the discharge of interference signals of different frequencies on the heat sink 201. condition.
  • the impedance reduction module 207 further includes an inductor, which is connected in parallel to both ends of each capacitor.
  • the inductor is connected in parallel with the capacitor to form a parallel LC resonant circuit.
  • the parallel LC resonant circuit prevents high-frequency signals of corresponding frequencies from passing through the signal discharge circuit in parallel with the inductor, making it convenient for users to plan the discharge of interference signals of different frequencies on the heat sink 201.
  • the second aspect of the embodiment of the present application provides a circuit board 100, including: a board body 101, a chip 103 and a chip heat sink; the chip 103 is arranged on the board body 101; the chip heat sink includes a heat sink 201, an insulating connector 203, a conductive foam 205 and an impedance reduction module 207.
  • the heat sink 201 is mounted on the board body 101 through the insulating connector 203, and the heat sink 201 is attached to the chip 103; the heat sink 201 is connected to the ground end of the board body 101 through the conductive foam 205 and the impedance reduction module 207 in turn.
  • the components of the chip heat sink of the embodiment of the present application are exactly the same as those of the previous embodiment, and are not described in detail here.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请提供一种芯片散热装置和电路板，所述芯片散热装置应用于电路板，所述电路板包括板体以及设置在板体上的芯片；所述芯片散热装置包括：散热片、绝缘连接件、导电泡棉和降阻抗模块；所述散热片通过所述绝缘连接件架设在所述板体上方，且所述散热片贴合于所述芯片；所述散热片依次经由所述导电泡棉以及所述降阻抗模块与所述板体的地端连接。本申请可以降低对散热片上的干扰信号的阻抗，使散热片上的干扰信号可以更容易地泄放到板体的地端。

Description

芯片散热装置和电路板
本申请要求于2022年11月28日提交国家知识产权局、申请号为202223195080.X、发明名称为“芯片散热装置和电路板”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及芯片散热结构的技术领域，例如涉及一种芯片散热装置和电路板。
背景技术
芯片属于集成电路的一种，芯片在工作负荷较重的时候，会产生大量的热量。由于芯片的表面积比较少，热交换效率低，散热效率低，因此，相关技术会在芯片上增加散热片，通过散热片提高芯片的散热效率。散热片一般采用导热性好的金属，并且通过塑料卡扣固定在电路板上。然而，由于芯片设置于电路板上，散热片也是设置于电路板上，且散热片位于芯片的上方，散热片的设置方式会导致散热片与芯片形成寄生电容，当芯片工作时，会有瞬间电荷耦合到散热片，且随着瞬间电荷的积累，会导致散热片积累大量的干扰信号，且干扰信号还会发生电磁干扰，影响芯片的工作。
发明内容
本申请的目的在于克服相关技术中的缺点与不足，提供一种芯片散热装置和电路板，可以使散热片上的干扰信号更容易泄放到电路板，降低干扰信号对芯片的影响。
本申请实施例的第一方面提供一种芯片散热装置，应用于电路板，所述电路板包括板体以及设置在板体上的芯片；所述芯片散热装置包括：散热片、绝缘连接件、导电泡棉和降阻抗模块；
所述散热片通过所述绝缘连接件架设在所述板体上方，且所述散热片贴合于所述芯片；所述散热片依次经由所述导电泡棉以及所述降阻抗模块与所述板体的地端连接。
本申请实施例的第二方面提供一种电路板，包括：板体、芯片、散热片、绝缘连接件、导电泡棉和降阻抗模块；
所述芯片设置于所述板体；所述散热片通过所述绝缘连接件架设在所述板体上方，且所述散热片贴合于所述芯片；所述散热片依次经由所述导电泡棉以及所述降阻抗模块与所述板体的地端连接。
相对于相关技术，本申请的散热片通过导电泡棉使散热片上的干扰信号泄放到电路板，且通过降阻抗模块与板体的地端连接，将导电泡棉连接电路板的连接结构产生的寄生电感与 降阻抗模块形成信号泄放线路，由于降阻抗模块与散热片和导电泡棉串联，通过降阻抗模块降低泄放线路对不同频率的干扰信号的阻抗，使散热片上的不同频率的干扰信号可以更容易地泄放到板体的地端，降低干扰信号对芯片的影响。
为了能更清晰的理解本申请，以下将结合附图说明阐述本申请的具体实施方式。
附图说明
图1为本申请一个实施例的芯片散热装置的电路结构图。
图2为本申请一个实施例的电路板的电路连接关系示意图。
100、电路板；101、板体；103、芯片；200、芯片散热装置；201、散热片；203、绝缘连接件；205、导电泡棉；207、降阻抗模块。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图1，其是本申请一个实施例的芯片103散热装置的电路结构图。芯片散热装置应用于电路板100，电路板100包括板体101以及设置在板体101上的芯片103。芯片散热装置包括散热片201、绝缘连接件203、导电泡棉205和降阻抗模块207。散热片201通过绝缘连接件203架设在板体101上方，且散热片201贴合于芯片103；散热片201依次经由导电泡棉205以及降阻抗模块207与板体101的地端连接。
其中，散热片201包括导热面和散热面，散热片201的导热面平滑，散热片201的导热面与芯片103接触，以使散热片201的导热面贴合于芯片103，使芯片103的热量传递给散热片201的导热面；散热片201的散热面设有多个散热翅，散热片201通过散热翅增加与空气的接触面积，以提高与空气进行热交换的效率，从而快速将导热面获得的芯片103的热量挥发。
其中，绝缘连接件203用于降低散热片201给板体101上的元器件的压力。绝缘连接件203可以是绝缘材料制造的卡扣，如塑料卡扣。
其中，导电泡棉205设置在散热片201和板体101之间，用于连接散热片201和板体101的地端，使散热片201上的干扰信号可以通过导电泡棉205泄放到板体101的地端。
其中，降阻抗模块207是指用于降低线路中对干扰信号阻抗的模块或元器件。干扰信号是分布在散热片201的各个位置上，从干扰信号的位置到导电泡棉205之间会存在寄生电感， 在散热片201与导电泡棉205之间通过导线连接时，导线的布设也可能会存在寄生电感。由于寄生电感对干扰信号具有很大的阻抗，因此，导致散热片201上的干扰信号将难以泄放到电路板100，本申请实施例通过降阻抗模块207可以降低寄生电感对指定频率的干扰信号的阻抗，从而方便散热片将干扰信号泄放到板体101的地端，降低干扰信号对芯片的影响。
相对于相关技术，本申请的散热片201通过导电泡棉205使散热片201上的干扰信号泄放到电路板100，且通过降阻抗模块207与板体101的地端连接，将导电泡棉205连接电路板100的连接结构产生的寄生电感与降阻抗模块207形成信号泄放线路，由于降阻抗模块207与散热片201和导电泡棉205串联，通过降阻抗模块207降低泄放线路对不同频率的干扰信号的阻抗，使散热片201上的不同频率的干扰信号可以更容易地泄放到板体101的地端。在一个可行的实施例中，降阻抗模块207的数量不限，且同一个芯片103散热装置的各个降阻抗模块207的元器件数量和电路结构可以不同，通过各个降阻抗模块207与对应的寄生电感串联形成各个泄放线路，可以降低各个泄放线路对指定频率的干扰信号的阻抗，使不同频率的干扰信号可以经由不同的泄放线路泄放到电路板100的地端。
在一个可行的实施例中，降阻抗模块207包括一个或者多个电容；每个电容的第一端与导电泡棉205连接，每个电容的第二端与板体101的地端连接。
在本实施例中，由于降阻抗模块207包括电容，而降阻抗模块207与寄生电感串联，因此降阻抗模块207的电容也与寄生电感串联，形成串联LC谐振电路，散热片201的干扰信号中与LC谐振电路的谐振频率约接近，LC谐振电路的阻抗越低，因此可以降低信号泄放线路对干扰信号的阻抗，使散热片201上的干扰信号可以更容易地泄放到板体101的地端，而多个电容分别与寄生电感串联，可以降低对不同频率的干扰信号的阻抗，使更多不同频率的干扰信号更容易泄放到板体101的地端。
在一个可行的实施例中，芯片103的上表面设有导热硅胶，导热硅胶接触散热片201，使散热片201贴合于芯片103。通过导热硅胶与芯片103直接接触，可以加快芯片103的热量传递，使芯片103的热量更高效地传递给散热片201。
在一个可行的实施例中，导电泡棉205填充于散热片201和板体101之间，以抑制电磁泄露。通过导电泡棉205填充散热片201与板体101之间，减少散热片201与芯片103以及阻抗模块207等设置在板体101上的元器件直接接触，抑制电磁泄露，起到了屏蔽的作用，进而减少板体101上的元器件在工作过程中受到的电磁干扰。
在一个可行的实施例中，降阻抗模块207还包括磁珠，磁珠并联于每个电容的两端。
在本实施例中，磁珠并联于电容，通过磁珠的高频电感特性，阻止对应频率的高频信号通过并联有磁珠的信号泄放线路，方便用户规划散热片201上不同频率的干扰信号的泄放情 况。
在一个可行的实施例中，降阻抗模块207还包括电感，电感并联于每个电容的两端。
在本实施例中，电感并联于电容，可以组成并联LC谐振电路，通过并联LC谐振电路阻止对应频率的高频信号通过并联有电感的信号泄放线路，方便用户规划散热片201上不同频率的干扰信号的泄放情况。
请参阅图2，本申请实施例的第二方面提供了一种电路板100，包括：板体101、芯片103以及芯片散热装置；芯片103设置于板体101；芯片散热装置包括散热片201、绝缘连接件203、导电泡棉205和降阻抗模块207。散热片201通过绝缘连接件203架设在板体101上方，且散热片201贴合于芯片103；散热片201依次经由导电泡棉205以及降阻抗模块207与板体101的地端连接。本申请实施例的芯片散热装置的各部件与前述实施例完全相同，在此不加以赘述。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。

Claims (10)

  1. 一种芯片散热装置，其中，应用于电路板，所述电路板包括板体以及设置在板体上的芯片；所述芯片散热装置包括：散热片、绝缘连接件、导电泡棉和降阻抗模块；
    所述散热片通过所述绝缘连接件架设在所述板体上方，且所述散热片贴合于所述芯片；所述散热片依次经由所述导电泡棉以及所述降阻抗模块与所述板体的地端连接。
  2. 根据权利要求1所述的芯片散热装置，其中：所述降阻抗模块包括一个或者多个电容；每个所述电容的第一端与所述导电泡棉连接，每个所述电容的第二端与所述板体的地端连接。
  3. 根据权利要求2所述的芯片散热装置，其中：所述降阻抗模块还包括磁珠，所述磁珠并联于每个所述电容的两端。
  4. 根据权利要求2所述的芯片散热装置，其中：所述降阻抗模块还包括电感，所述电感并联于每个所述电容的两端。
  5. 根据权利要求1所述的芯片散热装置，其中：所述芯片的上表面设有导热硅胶，所述导热硅胶接触所述散热片，使所述散热片贴合于所述芯片。
  6. 根据权利要求5所述的芯片散热装置，其中：所述导电泡棉填充于所述散热片和所述板体之间，抑制电磁泄露。
  7. 一种电路板，其中，包括：板体、芯片以及芯片散热装置；所述芯片设置于所述板体；所述芯片散热装置包括散热片、绝缘连接件、导电泡棉和降阻抗模块；
    所述散热片通过所述绝缘连接件架设在所述板体上方，且所述散热片贴合于所述芯片；所述散热片依次经由所述导电泡棉以及所述降阻抗模块与所述板体的地端连接。
  8. 根据权利要求7所述的电路板，其中，所述降阻抗模块包括一个或者多个电容；每个所述电容的第一端与所述导电泡棉连接，每个所述电容的第二端与所述板体的地端连接。
  9. 根据权利要求8所述的电路板，其中：所述降阻抗模块还包括磁珠，所述磁珠并联于每个所述电容的两端。
  10. 根据权利要求8所述的电路板，其中：所述降阻抗模块还包括电感，所述电感并联于每个所述电容的两端。
PCT/CN2023/134655 2022-11-28 2023-11-28 芯片散热装置和电路板 WO2024114621A1 (zh)

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