WO2024111077A1 - Machine de sérigraphie - Google Patents

Machine de sérigraphie Download PDF

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Publication number
WO2024111077A1
WO2024111077A1 PCT/JP2022/043299 JP2022043299W WO2024111077A1 WO 2024111077 A1 WO2024111077 A1 WO 2024111077A1 JP 2022043299 W JP2022043299 W JP 2022043299W WO 2024111077 A1 WO2024111077 A1 WO 2024111077A1
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WO
WIPO (PCT)
Prior art keywords
target point
substrate
mask
amount
displacement
Prior art date
Application number
PCT/JP2022/043299
Other languages
English (en)
Japanese (ja)
Inventor
毅 近藤
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/043299 priority Critical patent/WO2024111077A1/fr
Publication of WO2024111077A1 publication Critical patent/WO2024111077A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat

Definitions

  • the technology disclosed in this specification relates to a screen printing machine.
  • a screen printer that fills the through-holes of a mask with a viscous fluid while holding the mask above a substrate.
  • a screen printer if a gap occurs between the mask and the substrate when the through-holes are filled with the viscous fluid, the viscous fluid may enter the gap.
  • the screen printer of Patent Document 1 presses the axis of an actuator against the upper surface of the mask from above. This causes the mask to displace downward toward the substrate depending on the size of the gap formed between the mask and the substrate.
  • the screen printer measures the distance between the mask and the substrate based on the amount of displacement of the axis of the actuator (i.e., the mask).
  • the above-mentioned screen printing machine presses the shaft of the actuator against the top surface of the mask to measure the distance between the mask and the substrate. This means that there is a risk that the shaft may damage the top surface of the mask.
  • This specification provides a technology that can reduce damage to the top surface of the mask when measuring the distance between the mask and the substrate, compared to conventional technology.
  • the screen printer disclosed in this specification prints a viscous fluid on a substrate using a mask in which a printing pattern consisting of through holes is formed.
  • the screen printer includes a substrate holding device that holds the substrate, a mask holding device that holds an edge of the mask along the outer periphery of the mask at a position above the substrate held by the substrate holding device, an air nozzle capable of ejecting air toward a target point on the upper surface of the mask held at a position above the substrate, and a displacement amount measuring device that measures the amount of vertical displacement of one or more measurement target points on the upper surface that correspond to the target point before and after the ejection of the air when the air is ejected from the air nozzle toward the target point.
  • the mask is displaced by air ejected from the air nozzle without directly touching the upper surface of the mask. This makes it possible to measure the vertical displacement of the measurement target point on the upper surface of the mask in a non-contact manner.
  • the above screen printing machine can reduce damage to the upper surface of the mask when measuring the distance between the mask and the substrate.
  • FIG. 2 is a side view of the screen printing machine of the first embodiment.
  • FIG. 2 is an enlarged view of the area surrounded by the dashed line II in FIG.
  • FIG. 2 is a plan view of a mask arranged in the screen printing machine of the first embodiment.
  • FIG. 2 is a configuration diagram of a control device for the screen printing machine according to the first embodiment.
  • 4 is a flowchart of a board printing process executed by the control device of the first embodiment.
  • 10 is a flowchart of a board printing process executed by a control device according to a second embodiment.
  • the one or more measurement points may include the target point.
  • the target point When air is ejected from the nozzle toward a target point, the target point is likely to experience greater vertical displacement than the points surrounding the target point. With this configuration, the vertical displacement can be measured more easily than with a configuration that measures the amount of vertical displacement of points surrounding the target point.
  • the above screen printing machine may further include a substrate lifting device that lifts the substrate holding device when printing the viscous fluid on the substrate, and a lift amount determination unit that determines the amount of lift of the substrate holding device.
  • the lift amount determination unit may determine the amount of lift based on the amount of displacement of the one or more measurement target points measured by the displacement amount measurement device.
  • the substrate can be brought closer to the mask based on the amount of displacement of one or more measurement points. This makes it possible to reduce the distance between the substrate and the mask when printing a viscous fluid on the substrate.
  • the above screen printing machine may further include a discharge amount determination unit that determines the amount of air discharged by the air nozzle.
  • the target point may include a first target point and a second target point different from the first target point.
  • the discharge amount determination unit may determine the amount of air discharged for the second target point to be a second discharge amount different from the first amount of air discharged for the first target point.
  • the displacement amount measuring device may measure the amount of displacement in the vertical direction of a first measurement target point corresponding to the first target point, and may also measure the amount of displacement in the vertical direction of a second measurement target point corresponding to the second target point.
  • the amount of air discharged can be changed depending on the position of the target point. This makes it possible to determine the amount of air discharged that is appropriate for the position of the target point.
  • the above screen printing machine may further include an opening area determination unit that determines the opening area of the outlet of the air nozzle.
  • the target point may include a first target point and a second target point different from the first target point.
  • the opening area determination unit may determine the opening area of the outlet for the second target point to be a second opening area different from the first opening area of the outlet for the first target point.
  • the displacement amount measuring device may measure the vertical displacement amount of a first measurement target point corresponding to the first target point, and may also measure the vertical displacement amount of a second measurement target point corresponding to the second target point.
  • the opening area can be changed depending on the position of the target point. This makes it possible to determine an opening area appropriate for the position of the target point.
  • the above screen printing machine may further include an operation control unit that controls the operation of the substrate holding device, and the substrate holding device may have a clamp that grips the end of the substrate.
  • the operation control unit may cause the clamp to release the end of the substrate and then cause the clamp to grip the end of the substrate again.
  • the substrate When the clamp grips the edge of the substrate, the substrate may bend. In this case, the distance between the mask and the substrate tends to become large. As a result, the vertical displacement of the measurement target point becomes large. With this configuration, when the displacement exceeds a predetermined threshold, the clamp releases the substrate edge and grips the substrate edge again. This can eliminate the substrate deflection.
  • the above screen printing machine may further include a squeegee that fills the through holes of the mask with the viscous fluid, and a squeegee operation determination unit that determines the force with which the squeegee is pressed against the upper surface of the mask and the speed at which the squeegee is moved along the upper surface of the mask.
  • the squeegee operation determination unit may determine at least one of the force and the speed based on the displacement of the measurement target point measured by the displacement amount measuring device.
  • the operation of the squeegee i.e., at least one of the force and the speed
  • the amount of displacement is determined according to the amount of displacement. This allows the screen printer to perform printing appropriate for the distance between the mask and the substrate.
  • the printer 10 is a device that uses a mask 20 to print cream solder 38, which is a viscous fluid, on a circuit board 2 (hereinafter referred to as the board 2), which is a substrate, and transports the printed circuit board 2 to an electronic component mounting device for subsequent processing.
  • the -Y direction in the drawings is expressed as the front side.
  • the +Y direction is expressed as the rear side
  • the +Z direction is expressed as the upper side
  • the -Z direction is expressed as the lower side.
  • Figure 1 shows a side view of the printing machine 10.
  • the printing machine 10 is equipped with a squeegee unit 30, a unit drive device 12, a mask holding device 24, a substrate holding device 14, a gap measurement unit 40, a control device 50, a high-pressure tank 4, and an adjustment valve 6 inside a box-shaped housing. Note that while the housing of the printing machine 10 is shown in perspective in Figure 1, it is actually made of six plate members that divide the interior of the printing machine 10.
  • the squeegee unit 30 includes a squeegee 36, an angle adjustment device 34, and a lifting device 32.
  • the squeegee 36 is a flat member having a rectangular shape extending in the X-axis direction.
  • the squeegee 36 is a metal squeegee made of metal, but in a modified example, it may be, for example, a urethane squeegee.
  • the angle adjustment device 34 adjusts the attitude of the squeegee 36 relative to the substrate 2 (the angle between the top surface of the substrate 2 and the squeegee 36).
  • the lifting device 32 moves the squeegee 36 in the vertical direction.
  • the lifting device 32 also raises and lowers the squeegee 36 in the vertical direction relative to the substrate 2, and adjusts the pressure with which the squeegee 36 is pressed against the mask 20 (hereinafter referred to as the printing pressure).
  • the substrate holding device 14 has a pair of clamps 16F, 16S.
  • the pair of clamps 16F, 16S grip the substrate 2 from the front and rear. This fixes the substrate 2 to the substrate holding device 14.
  • a substrate lifting device 15 and a substrate transport device 16 are disposed below the substrate holding device 14.
  • the substrate lifting device 15 has a servo motor (not shown).
  • the substrate lifting device 15 raises and lowers the substrate holding device 14 by operating the servo motor.
  • the substrate transport device 17 has a servo motor (not shown) and, by operating the servo motor, transports the substrate 2 before printing to the substrate holding device 14 and transports the substrate 2 after printing from the substrate holding device 14 in the +X direction (i.e., toward the front of the paper in FIG. 1).
  • the unit drive device 12 moves the squeegee unit 30 in the front-to-rear direction of the printing machine 10 (i.e., the left-to-right direction on the paper surface of FIG. 1) along a pair of guide rails.
  • the detailed structure by which the unit drive device 12 moves the squeegee unit 30 in the front-to-rear direction is already known, so a description thereof will be omitted here.
  • the mask holding device 24 has a frame body that is arranged along the outer periphery of the mask 20.
  • the frame body of the mask holding device 24 holds the edge of the mask 20. This makes it possible to prevent the position of the mask 20 from shifting when the squeegee unit 30 fills the through holes 22 of the mask 20 with cream solder 38.
  • the mask holding device 24 is provided with a plurality of holding mechanisms 26.
  • the mask holding device 24, which holds the edge of the mask 20, is held in a position above the substrate 2 by the plurality of holding mechanisms 26.
  • the mask 20 has a plurality of through holes 22 formed therein.
  • the plurality of through holes 22 are arranged according to the printing pattern 21.
  • the cream solder 38 is pressed against the upper surface of the mask 20 by the squeegee 36, the cream solder 38 passes through the plurality of through holes 22 (i.e., the printing pattern 21) and adheres to the substrate 2.
  • the cream solder 38 is printed on the upper surface of the substrate 2 according to the printing pattern 21.
  • the gap measurement unit 40 is a unit for measuring the distance (gap) between the mask 20 and the upper surface of the substrate 2 when the cream solder 38 is printed on the substrate 2.
  • the gap measurement unit 40 includes an air nozzle 44 (hereinafter referred to as the nozzle 44), a displacement sensor 46, a lifting device 42, and a driving device 48.
  • the nozzle 44 is connected to the high-pressure tank 4 via the adjustment valve 6. Compressed air is stored in the high-pressure tank 4. When the adjustment valve 6 is opened, the air in the high-pressure tank 4 is discharged from the nozzle 44 toward the mask 20. In addition, the amount of air discharged from the nozzle 44 toward the mask 20 is changed according to the opening degree of the adjustment valve 6.
  • the displacement sensor 46 is a so-called optical sensor.
  • the displacement sensor 46 has a light-projecting section and a light-receiving section inside.
  • the displacement sensor 46 irradiates a laser beam from the light-projecting section towards the object to be measured.
  • the irradiated light is reflected by the object to be measured, and the reflected light is incident on the light-receiving section.
  • the displacement sensor 46 detects the displacement of the object to be measured based on the change in the position of the light incident on the light-receiving section.
  • the displacement sensor 46 may be, for example, an ultrasonic sensor.
  • the lifting device 42 moves the nozzle 44 and the displacement sensor 46 in the up-down direction.
  • the driving device 48 moves the nozzle 44 and the displacement sensor 46 in the X direction.
  • the gap measurement unit 40 can also be moved in the front-to-rear direction (Y direction) of the printing machine 10 by the unit driving device 12. In other words, the gap measurement unit 40 can move the nozzle 44 and the displacement sensor 46 along the top surface of the mask 20.
  • the nozzle 44 and displacement sensor 46 of the gap measurement unit 40 will be described with reference to Figure 2.
  • the nozzle 44 has a cylindrical shape extending in the vertical direction.
  • An opening 47 and an opening adjustment section 45 are provided at the lower end of the nozzle 44.
  • the opening adjustment section 45 is a mechanism for changing the area of the opening 47, and has a wall that defines the opening 47 of the nozzle 44.
  • the area of the opening 47 of the nozzle 44 becomes smaller as the wall of the opening adjustment section 45 moves toward the center of the nozzle 44.
  • the area of the opening 47 of the nozzle 44 becomes larger as the wall of the opening adjustment section 45 moves in a direction away from the center of the nozzle 44.
  • the mask 20 is held at a position above the substrate 2 by the mask holding device 24.
  • the substrate 2 is placed below the mask 20 with its ends held by a pair of clamps 16F, 16S of the substrate holding device 14.
  • the mask 20 is a thin film of, for example, 1 mm or less, and therefore can be partially displaced in the vertical direction.
  • the substrate 2 also has a relatively thin flat plate shape, when the ends of the substrate 2 are gripped by the clamps 16F, 16S, it can be deformed, for example, by bending the center upward. As a result, as shown in FIG. 2, a gap of length C1 that varies depending on the location can be created between the lower surface 20D of the mask 20 and the upper surface 2U of the substrate 2.
  • the cream solder 38 will get into the gap when filling the through-holes 22 with the cream solder 38. As a result, a printing defect may occur in which the cream solder 38 is printed in an unintended position on the substrate 2.
  • the gap measuring unit 40 measures the distance between the lower surface 20D of the mask 20 and the upper surface 2U of the substrate 2 before the printing machine 10 executes printing, i.e., before the squeegee 36 moves backward. Specifically, the gap measuring unit 40 ejects air 60 toward a target point PB on the upper surface 20U of the mask 20 by the nozzle 44. If a gap exists between the lower surface 20D of the mask 20 and the upper surface 2U of the substrate 2, the mask 20 is displaced downward by the gap length C1, and the lower surface 20D of the mask 20 abuts against the upper surface 2U of the substrate 2. In other words, the displacement amount of the mask 20 is the gap length C1.
  • the displacement sensor 46 measures the displacement between the target point PB before the air 60 is ejected and the target point PA after the air 60 is ejected. This allows the gap measuring unit 40 to measure the gap length C1. The gap measuring unit 40 transmits the measured gap length C1 to the control device 50.
  • the gap measurement unit 40 of this embodiment measures the gap length at target points P1 to P9.
  • Target points P1, P3, P6, and P8 are located at the four corners of the mask 20.
  • Target point P4 is located at the center of the mask 20.
  • Target points P2, P5, P7, and P9 are located at the centers of each side of the mask 20.
  • the configuration of the control device 50 will be described with reference to FIG. 4.
  • the control device 50 is configured by a computer having a memory 51 and a CPU 54.
  • the control device 50 is connected to each of the devices 6 to 45 of the printing machine 10 so as to be able to communicate with them.
  • the memory 51 is composed of a storage medium such as a HDD.
  • the memory 51 stores a printing program 52.
  • the printing program 52 is a program for printing cream solder 38 on the substrate 2 using the mask 20.
  • the printing program 52 includes a target point table T1, threshold displacement amounts Dth1 and Dth2, and print settings 53.
  • the target point table T1 In the target point table T1, the coordinates of each target point P1 to P9, the discharge amount, and the opening area are stored in association with each other.
  • the target point table T1 is a table for determining the discharge amount of air 60 and the opening area of the nozzle 44 at each target point P1 to P9.
  • the target point table T1 is pre-stored in the printing program 52, but the operator may change, add, or delete the coordinates of the target points based on the actual printing results. The operator may also change the discharge amount and the opening area.
  • the discharge amount V1 is set for the target points P1 to P3 and P6 to P8.
  • the discharge amount V2 is set for the target points P4, P5 and P9.
  • the target points P4, P5 and P9 are located at the center of the front-rear direction of the substrate 2 (i.e., the left-right direction of the paper surface of FIG. 3).
  • the end of the substrate 2 in the front-rear direction is held by a pair of clamps 16F, 16S, so the center part in the front-rear direction is likely to be displaced upward.
  • the distance between the upper surface 2U of the substrate 2 and the lower surface 20D of the mask 20 (i.e., the length of the gap C1) is likely to be small.
  • the length of the gap C1 is likely to be large compared to the target points P4, P5 and P9. Therefore, the discharge amount V1 is set to be larger than the discharge amount V2.
  • the mask 20 can be sufficiently displaced until the lower surface 20D of the mask 20 abuts the upper surface 2U of the substrate 2 by the air 60 with a discharge volume V1 larger than the discharge volume V2.
  • the displacement sensor 46 can accurately measure the gap length C1.
  • the printing machine 10 can accurately measure the gap C1 by changing the discharge volumes V1 and V2 according to the positions of the target points P1 to P9.
  • the opening area A1 is set for the target points P1 to P3 and P6 to P8.
  • the opening area A2 is set for the target points P4, P5 and P9.
  • the opening area A1 is set to be larger than the opening area A2.
  • the threshold displacement amount Dth1 is a threshold value for determining whether or not the control device 50 resets the pair of clamps 16F, 16S in the board printing process described below.
  • the threshold displacement amount Dth2 is a threshold value for determining whether or not the control device 50 changes the print settings 53 in the board printing process.
  • Each threshold value Dth1, DTh2 is pre-stored in the printing program 52, but may be changed by the operator.
  • the print settings 53 include a printing pressure F1 and a printing speed S1. These are values that are pre-stored in the print program 52.
  • the control device 50 can adjust the printing pressure by the lifting device 32 of the squeegee unit 30.
  • the printing speed is the speed at which the squeegee unit 30 advances backwards while filling the through holes 22 of the mask 20 with cream solder 38.
  • the control device 50 can adjust the printing speed by the unit driving device 12.
  • the CPU 54 executes various processes according to the printing program 52. As a result, the CPU 54 functions as a lift amount determination unit 55, a discharge amount determination unit 56, an opening area determination unit 57, an operation control unit 58, and a squeegee operation determination unit 59.
  • the substrate printing process executed by the CPU 54 of the control device 50 of the printing machine 10 will be described with reference to FIG. 5.
  • the substrate printing process is started in response to a printing start command from an operator after the mask 20 is held by the mask holding device 24 and the substrate 2 is held by the substrate holding device 14.
  • the CPU 54 moves the nozzle 44 and displacement sensor 46 to the target points P1 to P9 in order based on the target point table T1. After the nozzle 44 and displacement sensor 46 have been moved to each of the target points P1 to P9, the CPU 54 causes the nozzle 44 to eject air 60 toward each of the target points P1 to P9. At this time, as described above, the CPU 54 changes the ejection amount V1 or V2 and the opening area A1 or A2 according to the target points P1 to P9 based on the target point table T1.
  • the CPU 54 obtains the amount of displacement of each of the target points P1 to P9 before and after the air 60 is ejected from the displacement sensor 46.
  • the CPU 54 compares each displacement amount obtained from the displacement sensor 46 with the threshold displacement amount Dth1. If the displacement amounts do not include any displacement amount that exceeds the threshold displacement amount Dth1 (S20: NO), the CPU 54 proceeds to S22, and if the displacement amounts include any displacement amount that exceeds the threshold displacement amount Dth1 (S20: YES), the CPU 54 proceeds to S24.
  • the CPU 54 resets the pair of clamps 16F, 16S. Specifically, the CPU 54 causes the pair of clamps 16F, 16S to release the front-rear ends of the substrate 2. The CPU 54 then causes the pair of clamps 16F, 16S to grip the front-rear ends of the substrate 2 again. This can eliminate deformation of the substrate 2 caused by gripping by the pair of clamps 16F, 16S. As a result, the length C1 of the gap described above can be reduced.
  • the CPU 54 adjusts the height of the substrate holding device 14 according to the displacement amount of each of the target points P1 to P9 obtained from the displacement sensor 46 in S12. For example, the CPU 54 causes the substrate lifting device 15 to lift the substrate holding device 14 by the maximum displacement amount among the displacement amounts obtained from the displacement sensor 46 in S12. This allows the lower surface 20D of the mask 20 to come into contact with the upper surface 2U of the substrate 2 when the cream solder 38 is printed on the substrate 2. As a result, the occurrence of the above-mentioned printing defects can be suppressed. In a modified example, the CPU 54 may lift the substrate holding device 14 by the average value of the displacement amounts of each of the target points P1 to P9 obtained from the displacement sensor 46 in S12.
  • the CPU 54 compares the displacement amounts of the target points P1 to P9 obtained from the displacement sensor 46 with the threshold displacement amount Dth2. If the displacement amounts do not include any displacement amounts that exceed the threshold displacement amount Dth2 (S30: NO), the CPU 54 skips S32 and proceeds to S40, and if the displacement amounts include any displacement amounts that exceed the threshold displacement amount Dth2 (S30: YES), the CPU 54 proceeds to S32.
  • the CPU 54 changes the print settings 53. Specifically, the CPU 54 increases the printing pressure when passing through a target point that indicates a displacement amount exceeding the threshold displacement amount Dth2 from the initial printing pressure F1, and decreases the printing speed from the initial printing speed S1. This allows the squeegee 36 to press the mask 20 more strongly against the substrate 2 at the target point that indicates a displacement amount exceeding the threshold displacement amount Dth2. As a result, the occurrence of printing defects can be suppressed.
  • the print settings 53 may include at least one of the printing pressure F1 and the printing speed S1. In that case, the CPU 54 may change at least one of the printing pressure F1 and the printing speed S1 in S32.
  • the CPU 54 moves the squeegee unit 30 backward and executes printing based on the print settings 53. This causes the cream solder 38 to fill the through holes 22 in the mask 20 and be printed on the board 2.
  • the printer 10 of this embodiment can measure the vertical displacement of the target points P1 to P9 without directly contacting the upper surface 20U of the mask 20 by the air 60 ejected from the nozzle 44. This allows the printer 10 to reduce damage to the upper surface 20U of the mask 20 when measuring the distance between the mask 20 and the substrate 2.
  • Second Example A screen printer 10 of a second embodiment will be described with reference to Figures 4 and 6.
  • the screen printer 10 of the second embodiment has a similar configuration to the screen printer 10 of the first embodiment described above, but the control device 50 of the screen printer 10 of the second embodiment executes a board printing process different from that of the control device 50 of the first embodiment.
  • the printing program 52 of the second embodiment includes one threshold displacement amount Dth3 instead of the two threshold displacement amounts Dth1 and Dth2 of the first embodiment. Furthermore, the printing program 52 of the second embodiment has a corresponding process registered therein.
  • the threshold displacement amount Dth3 is a threshold value for determining whether or not the control device 50 executes the corresponding process in the board printing process shown in FIG. 6.
  • the corresponding processes include a print setting change process, a clamp reset process, and a stop process.
  • the print setting change process is a process for changing the print settings 53 described above.
  • the clamp reset process is a process for resetting the pair of clamps 16F, 16S described above.
  • the print stop process is a process for stopping the board printing process. Before executing the board printing process, the operator selects one of the three processes. The selected process is registered in the printing program 52 as the corresponding process.
  • the board printing process executed by the CPU 54 of the screen printing machine 10 of the second embodiment will be described.
  • S110 and S112 the same processes as S10 and S12 in FIG. 5 are executed.
  • S120 the CPU 54 compares each displacement amount acquired from the displacement sensor 46 with the threshold displacement amount Dth3. If the displacement amounts do not include a displacement amount exceeding the threshold displacement amount Dth3 (S120: NO), the CPU 54 proceeds to S140 and executes the printing process. If the displacement amounts include a displacement amount exceeding the threshold displacement amount Dth3 (S120: YES), the CPU 54 proceeds to S130.
  • the CPU 54 determines whether the corresponding process registered in the printing program 52 is a print stop process. If the corresponding process is a print stop process (S130: YES), the CPU 54 stops the board printing process. This allows the operator to confirm the areas that have been displaced beyond the threshold displacement amount Dth3 and correct the board or mask in those areas.
  • the CPU 54 changes the print settings 53 in S132 and executes the print process (S140). In S132, the same process as S32 in FIG. 5 is executed.
  • the CPU 54 executes a reset of the pair of clamps 16F, 16S in S134 and returns to S120.
  • the displacement sensor 46 may measure the displacement of, for example, four points on the same circumference centered on the target point P when the substrate 2 is viewed in a plan view. By measuring the displacement of the four points corresponding to the target point P, it is possible to accurately measure the length C1 of the gap around the target point P. It is also possible to measure to which side the substrate 2 or mask 20 is tilted around the target point P. In this modified example, the four points are an example of "multiple measurement target points".
  • the nozzle 44 of the printing machine 10 may, for example, eject air 60 toward only one target point P1. In that case, the ejection amounts V1 and V2 do not need to be stored in the target point table T1. In this modified example, the "ejection amount determination unit" can be omitted. In another modified example, the opening areas A1 and A2 do not need to be stored in the target point table T1. In this modified example, the "opening area determination unit" can be omitted.
  • the substrate holding device 14 may not have a pair of clamps 16F, 16S. In that case, the substrate 2 may be placed, for example, on the upper surface of the substrate holding device 14. In that case, the CPU 54 may not execute the processes of S20 and S22. In this modified example, the "operation control unit" may be omitted.
  • the CPU 54 does not need to execute the processes of S30 and S32.
  • the "squeegee operation determination unit" can be omitted.
  • the target point table T1 may store the discharge pressure in association with the coordinates of each target point P1 to P9.
  • the discharge pressure associated with the target points P1 to P3 and P6 to P8 may be set to be higher than the discharge pressure associated with the target points P4, P5, and P9.
  • the target point table T1 may further store the discharge pressure in association with the coordinates of each target point P1 to P9.
  • the discharge amount and opening area are changed according to the distance between the target points P1 to P9 and the pair of clamps 16F, 16S.
  • the discharge amount and opening area may be changed, for example, according to the distance between the target points P1 to P9 and the mask holding device 24.
  • a large discharge amount V1 and opening area A1 may be set for the target points P1 to P3 and P5 to P9 that are close to the mask holding device 24 among the target points P1 to P9
  • a small discharge amount V2 and opening area A2 may be set for the target point P4 that is far from the mask holding device 24.
  • this specification also discloses the technical idea of changing "the screen printer according to claim 1" to “the screen printer according to claim 1 or 2" in claim 3.
  • the technical idea of changing “the screen printer according to claim 1" to “the screen printer according to any one of claims 1 to 3" in claim 4 the technical idea of changing "the screen printer according to claim 1” to “the screen printer according to any one of claims 1 to 4" in claim 5
  • the technical idea of changing "the screen printer according to claim 1" to “the screen printer according to any one of claims 1 to 6” in claim 7 are also disclosed.

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  • Mechanical Engineering (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Cette machine de sérigraphie effectue l'impression d'un fluide visqueux sur un substrat à l'aide d'un masque dans lequel est formé un motif d'impression composé d'un trou traversant. Ladite machine de sérigraphie comprend : un appareil de retenue de substrat qui retient le substrat ; un appareil de retenue de masque qui retient une extrémité du masque le long de la périphérie externe du masque, au niveau d'une position au-dessus du substrat retenu par l'appareil de retenue de substrat ; une buse d'air qui permet d'évacuer de l'air vers un point cible sur une surface supérieure du masque retenu au niveau de la position au-dessus du substrat ; et un appareil de mesure de quantités de déplacement qui, lorsque l'air est évacué de la buse d'air vers le point cible, mesure les quantités de déplacement dans la direction verticale, avant et après l'évacuation de l'air, d'un ou d'une pluralité de points sujets de mesure qui sont des points sur la surface supérieure et qui correspondent au point cible.
PCT/JP2022/043299 2022-11-24 2022-11-24 Machine de sérigraphie WO2024111077A1 (fr)

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PCT/JP2022/043299 WO2024111077A1 (fr) 2022-11-24 2022-11-24 Machine de sérigraphie

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04100849U (ja) * 1991-02-05 1992-09-01 富士通テン株式会社 高さ調整装置
JPH05126652A (ja) * 1991-10-31 1993-05-21 Kowa Co 非接触張力測定装置
US20190143670A1 (en) * 2017-11-10 2019-05-16 Boe Technology Group Co., Ltd. Screen printing device and method for adjusting tension in printing mesh thereof
WO2019116545A1 (fr) * 2017-12-15 2019-06-20 株式会社Ｆｕｊｉ Machine de sérigraphie

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04100849U (ja) * 1991-02-05 1992-09-01 富士通テン株式会社 高さ調整装置
JPH05126652A (ja) * 1991-10-31 1993-05-21 Kowa Co 非接触張力測定装置
US20190143670A1 (en) * 2017-11-10 2019-05-16 Boe Technology Group Co., Ltd. Screen printing device and method for adjusting tension in printing mesh thereof
WO2019116545A1 (fr) * 2017-12-15 2019-06-20 株式会社Ｆｕｊｉ Machine de sérigraphie

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