WO2024098761A1 - 一种充电设备和充电系统 - Google Patents

一种充电设备和充电系统 Download PDF

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Publication number
WO2024098761A1
WO2024098761A1 PCT/CN2023/101066 CN2023101066W WO2024098761A1 WO 2024098761 A1 WO2024098761 A1 WO 2024098761A1 CN 2023101066 W CN2023101066 W CN 2023101066W WO 2024098761 A1 WO2024098761 A1 WO 2024098761A1
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WO
WIPO (PCT)
Prior art keywords
contact surface
charging device
elastic heat
liquid cooling
heat conductive
Prior art date
Application number
PCT/CN2023/101066
Other languages
English (en)
French (fr)
Inventor
韦隆和
高强
Original Assignee
华为数字能源技术有限公司
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Publication date
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Publication of WO2024098761A1 publication Critical patent/WO2024098761A1/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L53/00Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
    • B60L53/30Constructional details of charging stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L53/00Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
    • B60L53/30Constructional details of charging stations
    • B60L53/302Cooling of charging equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L53/00Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
    • B60L53/30Constructional details of charging stations
    • B60L53/31Charging columns specially adapted for electric vehicles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/60Other road transportation technologies with climate change mitigation effect
    • Y02T10/70Energy storage systems for electromobility, e.g. batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/60Other road transportation technologies with climate change mitigation effect
    • Y02T10/7072Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors

Definitions

  • the present application relates to the field of energy technology, and in particular to a charging device and a charging system.
  • Charging equipment usually includes many different types of electrical components. Some electronic devices will generate a lot of heat when working. In order to ensure that the charging equipment is within the normal operating temperature range, it is usually necessary to dissipate the heat of some electronic devices in the charging equipment.
  • air cooling is usually used to dissipate heat from electronic devices.
  • a fan is generally used to generate airflow, so that the airflow quickly passes through the surface of the heating device, thereby taking away the heat.
  • this method easily causes dust and other impurities to accumulate on the surface of the electronic device, which will affect the reliability and service life of the electronic device.
  • the noise generated by the fan when running at high speed is also relatively large, which affects the user's charging experience.
  • the present application provides a charging device and a charging system with a simple structure and good heat dissipation efficiency.
  • the present application provides a charging device, comprising an elastic heat conductive member and at least two stacked power components.
  • the power component comprises a housing, a liquid cooling plate and a circuit board assembly, the housing and the liquid cooling plate enclose a receiving cavity, the circuit board assembly is arranged in the receiving cavity and is thermally connected to both the housing and the liquid cooling plate.
  • the liquid cooling plate of each power component has a first contact surface, the housing has a second contact surface, and the first contact surface is opposite to the second contact surface.
  • the first contact surface of one power component is arranged to face the second contact surface of the other power component, and the elastic heat conductive member is located between the first contact surface and the second contact surface, and elastically abuts against the first contact surface and the second contact surface respectively.
  • a liquid cooling plate is used in the power component for heat dissipation, and the outer shell and the liquid cooling plate can enclose a space for accommodating the circuit board assembly, which can improve the airtightness of the circuit board assembly, prevent external dust, water vapor and other impurities from affecting the circuit board assembly, and improve the working safety and reliability of the charging device.
  • the elastic heat conductive part is in thermal contact with the power component, so that the heat of the power component can be dissipated through the elastic heat conductive part, thereby improving the heat dissipation performance of the power component.
  • the heat dissipation performance of the liquid cooling plate is usually greater than the heat dissipation performance of the outer shell, therefore, in two adjacent power components, the heat of the outer shell of one of the power components can be transferred to the liquid cooling plate of the other power component through the elastic heat conductive part, which is beneficial to improve the overall heat dissipation performance of the charging device.
  • the circuit board assembly may include a circuit board and an electronic device disposed on the circuit board, wherein the circuit board includes a first board surface and a second board surface that are separated from each other, and the electronic device is located on the first board surface.
  • the electronic device can be thermally connected to the liquid cooling plate, so that the liquid cooling plate can dissipate heat from the electronic device with higher efficiency.
  • the second plate surface can be thermally connected to the housing.
  • the elastic heat-conducting member may be a corrugated sheet.
  • the elastic heat-conducting member has a simple structure, is easy to manufacture, and has good elasticity.
  • first air duct between the elastic heat conductive member and the first contact surface
  • second air duct between the elastic heat conductive member and the first contact surface
  • the surface of the elastic heat conductive member facing the first contact surface has at least one third contact portion abutting against the first contact surface, and the third contact portion may be a plane, thereby facilitating increasing the contact area between the first contact surface and the elastic heat conductive member.
  • the surface of the elastic heat conductive member facing the second contact surface has at least one fourth contact portion abutting against the second contact surface, and the fourth contact portion is a plane, thereby facilitating increasing the contact area between the second contact surface and the elastic heat conductive member.
  • the elastic heat conductive member is made of a shape memory alloy.
  • the elastic heat conductive member is used to increase the contact area with the first contact surface or the second contact surface when the temperature rises. When the temperature of the first contact surface is high, the contact area between the elastic heat conductive member and the first contact surface or the second contact surface can be increased, which is beneficial to improving the heat dissipation effect of the housing.
  • the charging device may further include a chassis, the power component is installed in the chassis, and the elastic heat conductive member is detachably installed in the chassis, thereby having high flexibility of use.
  • the elastic heat conductive member is fixedly connected to the housing or the liquid cooling plate, thereby improving the convenience in assembling the charging device.
  • the charging device includes a tray, and the elastic heat conductive member is fixedly connected to the tray.
  • the power component can be fixed in the chassis through the tray, and can simultaneously achieve thermal contact with the heat conductive member, which can effectively improve the convenience during assembly.
  • the charging device may further include a radiator, which is connected to the liquid cooling plate via a liquid cooling pipeline and is used to dissipate heat from the liquid cooling plate.
  • the present application also provides a charging system, including a charging terminal and any of the above-mentioned charging devices, the charging device having an output port, and the charging terminal connected to the output port.
  • the electric energy processed by the charging device can be provided to the charging terminal to supplement the electric energy to the powered device (such as a vehicle).
  • the charging device can be installed on the ground or on a wall, etc. This application does not limit the specific installation location and form of the charging device.
  • FIG1 is a schematic diagram of an application scenario of a charging device provided in an embodiment of the present application.
  • FIG2 is a schematic diagram of a cross-sectional structure of a charging device provided in an embodiment of the present application.
  • FIG3 is a schematic diagram of the side structure of an elastic heat-conducting member provided in an embodiment of the present application.
  • FIG4 is a schematic cross-sectional view of a partial structure of a charging device provided in an embodiment of the present application.
  • FIG5 is a schematic cross-sectional view of a partial structure of another charging device provided in an embodiment of the present application.
  • FIG6 is a schematic cross-sectional view of another charging device provided in an embodiment of the present application.
  • FIG7 is a schematic cross-sectional view of a partial structure of another charging device provided in an embodiment of the present application.
  • FIG8 is a schematic cross-sectional view of a partial structure of another charging device provided in an embodiment of the present application.
  • FIG. 9 is a simplified structural diagram of a charging system provided in an embodiment of the present application.
  • a charging device 10 can be used in a scenario of charging an electric vehicle 20.
  • the charging device 10 can be a charging pile, and the charging device 10 can be installed near a parking space.
  • the input end of the charging device 10 can be connected to the power grid 30, and the output end of the charging device 10 can be connected to the charging gun 50 through a cable 40 to facilitate charging the vehicle 20.
  • the electric energy in the power grid 30 can be industrial electricity (such as an AC voltage of 380V), or it can be civil electricity (such as an AC voltage of 22V), etc.
  • the charging device 10 may have functions such as overload protection and power conversion.
  • the charging device 10 generally includes electronic devices such as transistors, transformers, inductors, capacitors, or relays. Some electronic devices generate heat during normal operation. In order to keep the charging device 10 within a normal operating temperature range, the electronic devices need to be cooled.
  • air cooling is generally used to dissipate heat.
  • fans are generally used to generate airflow, which quickly passes through the surface of electronic devices to remove heat.
  • this method easily causes dust and other impurities to accumulate on the surface of electronic devices, which will affect the reliability and service life of electronic devices.
  • the noise generated by the fan when running at high speed is also relatively loud, affecting the user's charging experience.
  • the embodiment of the present application provides a charging device 10 with a simple structure, low cost, and the ability to achieve a high level of protection, as well as a charging system using the charging device 10.
  • the charging device 10 may include a first power component 11a, a second power component 11b, and an elastic heat-conducting member 12.
  • the elastic heat-conducting member 12 is located between the first power component 11a and the second power component 11b, and is in thermal contact with the first power component 11a and the second power component 11b.
  • the heat of the first power component 11a can be dissipated through the elastic heat-conducting member 12 and the second power component 11b, thereby improving the heat dissipation efficiency of the charging device 10.
  • the heat of the second power component 11b can be dissipated through the elastic heat conductive member 12 and the first power component 11a, thereby improving the heat dissipation efficiency of the charging device 10.
  • the elastic heat conductive member 12 can not only effectively dissipate the heat generated by the first power component 11a and the second power component 11b, but also realize the heat transfer between the first power component 11a and the second power component 11b, thereby effectively improving the heat dissipation performance of the charging device 10.
  • both the first power component 11a and the second power component 11b adopt liquid cooling, which has the advantages of high heat dissipation efficiency, good reliability, and low noise. It is beneficial to ensure the airtightness of electronic components and can improve the working stability and service life of the charging device 10.
  • the first power component 11a includes a first housing 111a, a first liquid-cooled plate 112a, and a first circuit board assembly 113a.
  • the first housing 111a and the first liquid-cooled plate 112a form a receiving cavity (not shown in the figure), and the first circuit board assembly 113a is arranged in the receiving cavity and is thermally connected to the first housing 111a and the first liquid-cooled plate 112a.
  • the first liquid-cooled plate 112a has a pipeline 1121a, and the cooling medium can flow in the pipeline 1121a, thereby taking away the heat of the first liquid-cooled plate 112a.
  • the second power component 11b includes a second housing 111b, a second liquid-cooled plate 112b, and a second circuit board assembly 113b.
  • the second housing 111b and the second liquid-cooled plate 112b form a receiving cavity (not shown in the figure), and the second circuit board assembly 113b is arranged in the receiving cavity and is thermally connected to the second housing 111b and the second liquid-cooled plate 112b.
  • the second liquid cooling plate 112 b has a pipeline 1121 b in it, and a cooling medium can flow through the pipeline 1121 b to take away the heat of the second liquid cooling plate 112 b.
  • first power component 11a and the second power component 11b are substantially the same, and the first power component 11a will be taken as an example for detailed description below.
  • the first circuit board assembly 113a is located in the space enclosed by the first housing 111a and the first liquid cooling plate 112a, thereby ensuring the airtightness of the first circuit board assembly 113a and preventing external impurities such as dust and water vapor from corroding the first circuit board assembly 113a.
  • the first circuit board assembly 113a is thermally connected to the first liquid cooling plate 112a and the first housing 111a, and the heat generated by the first circuit board assembly 113a can be dissipated through the first liquid cooling plate 112a and the first housing 111a, thereby improving the heat dissipation efficiency of the first power component 11a.
  • the first circuit board assembly 113a includes a first circuit board 1131a and a plurality of (four are shown in the figure) electronic devices 1132a.
  • the first circuit board 1131a has a first board surface 11311a and a second board surface 11312a, and the first board surface 11311a and the second board surface 11312a are two opposite board surfaces of the first circuit board 1131a, and the plurality of electronic devices 1132a are all arranged on the first board surface 11311a, and are thermally connected to the liquid cooling plate 112a through materials with good thermal conductivity such as thermal conductive silicone grease 13.
  • the first board surface 11311a of the first circuit board 1131a is thermally connected to the first housing 111a through materials with good thermal conductivity such as thermal conductive silicone grease 14.
  • all the electronic devices 1132a are arranged on the first surface 11311a of the first circuit board 1131a, which is conducive to improving the production efficiency of the first circuit board assembly 113a during production.
  • the electronic devices 1132a can be arranged on the first surface 11311a of the first circuit board 1131a by using surface mounting and other processes.
  • the first circuit board 1131a needs to be turned over, or secondary welding and other operations need to be performed, so the production process and process will be increased, which is not conducive to improving production efficiency.
  • the first board surface 11311a of the first circuit board 1131a can be arranged toward the first liquid cooling plate 112a, which is conducive to achieving thermal connection between the multiple electronic devices 1132a and the first liquid cooling plate 112a.
  • the first circuit board 1131 a In practical applications, when current flows in the first circuit board 1131 a , heat will be generated. Therefore, the first circuit board 1131 a also has a heat dissipation requirement.
  • the second board surface 11312a of the first circuit board 1131a is arranged toward the first housing 111a, it is beneficial to achieve a thermally conductive connection between the first circuit board 1131a and the first housing 111a.
  • the heat generated by the electronic device 1132a is usually greater than the heat generated by the first circuit board 1131a; the heat dissipation efficiency of the first liquid cooling plate 112a is greater than the heat dissipation efficiency of the first housing 111a, therefore, the first circuit board 1131a can be connected to the first housing 111a by thermal conduction, so that the first circuit board 1131a can dissipate heat through the first housing 111a.
  • the electronic device 1132a is connected to the first liquid cooling plate 112a by thermal conduction, so that the electronic device 1132a can dissipate heat through the first liquid cooling plate 112a.
  • the first shell 111a mainly relies on the heat transfer of the material itself to dissipate heat, and can be made of materials with good thermal conductivity such as steel, copper or aluminum.
  • the first shell 111a has the advantages of being easy to manufacture, low cost and high reliability. In addition, it is also easier to prepare a structure with a complex shape during manufacture.
  • the first liquid cooling plate 112 a since it has a channel inside for the cooling medium to circulate, it is not conducive to preparing a relatively complex shape in practical applications, otherwise problems such as low reliability and significantly increased costs will occur.
  • the heat dissipation requirements of the first circuit board 1131a are also increasing.
  • the first housing 111a is changed to a liquid cooling structure (such as a structure similar to the first liquid cooling plate 112a)
  • the charging Alternatively, if the liquid cooling structure in the first liquid cooling plate 112a is extended into the first housing 111a, the modification cost of the cooling pipeline 1121a will also increase, and the risk of leakage of the cooling pipeline 1121a will also increase.
  • the elastic heat conductive member 12 can improve the heat dissipation effect of the first circuit board 1131 a .
  • the first liquid cooling plate 112a of the first power component 11a has a first contact surface 101a
  • the first shell 111a has a second contact surface 102a
  • the second liquid cooling plate 112b of the second power component 11b has a first contact surface 101b
  • the second shell 111b has a second contact surface 102b.
  • the first contact surface 101b and the second contact surface 102a are arranged opposite to each other, and the elastic heat conductive member 12 is located between the first contact surface 101b and the second contact surface 102a, and elastically abuts against the first contact surface 101b and the second contact surface 102a.
  • the heat generated by the first circuit board 1131a After the heat generated by the first circuit board 1131a is transferred to the first shell 111a, it can be transferred to the second liquid cooling plate 112b through the elastic heat conductive member 12. That is, the second liquid cooling plate 112b of the second power component 11b can dissipate heat for the first circuit board 1131a of the first power component 11a, thereby significantly improving the heat dissipation effect of the first circuit board 1131a.
  • the first contact surface and the second contact surface of each power component are two surfaces arranged away from each other.
  • the first contact surface 101a and the second contact surface 102a are opposite to each other.
  • each power component can be stacked in sequence in substantially the same spatial posture. Therefore, in two adjacent power components, the first contact surface of one power component can be arranged to face the second contact surface of the other power component.
  • the elastic heat-conducting member 12 may have various structural shapes.
  • the elastic heat-conducting member 12 is a wave-shaped plate-like structure. Specifically, the wave crests and wave troughs of the elastic heat-conducting member 12 are both arc surfaces.
  • the height difference between the crest and the trough of the elastic heat conductive member 12 is greater than the distance between the first contact surface 101b and the second contact surface 102a.
  • a first air duct 121 is formed between the elastic heat conductive member 12 and the first contact surface 101b
  • a second air duct 122 is formed between the elastic heat conductive member 12 and the second contact surface 102a.
  • a fan may be provided in the charging device 10 , so as to increase the flow speed of the air flowing through the first air duct 121 or the second air duct 122 .
  • the elastic heat conductive member 12 after the elastic heat conductive member 12 is set to a wave shape, it can not only ensure the elastic abutment between the elastic heat conductive member 12 and the first contact surface 101b and the second contact surface 102a, but also form a first air duct 121 between the elastic heat conductive member 12 and the first contact surface 101b, and form a second air duct 122 between the elastic heat conductive member 12 and the second contact surface 102a, which is beneficial to improve the heat dissipation performance of the charging device 10.
  • the elastic heat conductive member 12 may also be in other shapes.
  • the surface of the elastic heat conductive member 12 facing the first contact surface and the first contact surface 101b have at least one third contact portion 120a that abuts against the first contact surface, and the third contact portion 120a is a plane.
  • the surface of the elastic heat conductive member 12 facing the second contact surface 102a has at least one fourth contact portion 120b that abuts against the second contact surface 102a, and the fourth contact surface 120b is also a plane.
  • the number of the third contact portion 120a and the fourth contact portion 120b are both 6. It can be understood that in other examples, the number of the third contact portion 120a and the fourth contact portion 120b can also be one, two or more, and the present application does not limit this.
  • the contact area between the elastic heat conductive member 12 and the first contact surface 101b can be increased, which is beneficial to improving the heat exchange efficiency between the elastic heat conductive member 12 and the first shell 111a.
  • the contact area between the elastic heat conductive member 12 and the second contact surface 102a can be increased, which is beneficial to improving the heat exchange efficiency between the elastic heat conductive member 12 and the first liquid cooling plate 112a.
  • first contact surface 101b or the second contact surface 102a may also be a curved surface
  • the surface where the elastic heat conductive member 12 contacts the first contact surface 101b or the second contact surface 102a may also be a curved surface, which will not be elaborated here.
  • the elastic heat-conducting member 12 can be made of materials with high thermal conductivity, such as copper, aluminum and its alloys.
  • the elastic heat conductive member 12 may also be made of shape memory alloy.
  • the contact area between the elastic heat conductive member 12 and the first contact surface 101b or the second contact surface 102a tends to increase, thereby increasing the contact area between the elastic heat conductive member 12 and the first contact surface 101b or the second contact surface 102a.
  • the elastic heat conductive member 12 since the elastic heat conductive member 12 is in contact with the first contact surface 101b and the second contact surface 102a, when the temperature of the first shell 111a is high, the first shell 111a needs to be cooled down more efficiently. Therefore, when the high temperature of the first shell 111a is transferred to the elastic heat conductive member 12, the elastic heat conductive member 12 will be deformed in a predetermined manner, and this deformation can increase the contact area between the elastic heat conductive member 12 and the first contact surface 101b and the second contact surface 102a, thereby improving the heat exchange efficiency between the first contact surface 101b and the second contact surface 102a.
  • the shape of the elastic heat conductive member 12 when the temperature is low, the shape of the elastic heat conductive member 12 may be similar to the shape shown in Fig. 2. When the temperature is high, the shape of the elastic heat conductive member 12 may be similar to the shape shown in Fig. 3.
  • the relationship between the shape and temperature of the elastic heat-conducting member 12 may also be reasonably set according to different requirements, which will not be elaborated here.
  • the elastic heat conductive member 12 may also be a structure such as a heat conductive pad having elastic compressible properties, which will not be described in detail here.
  • the elastic heat-conducting member 12 may be an independent structural member, or may be a component of a power component.
  • the elastic heat-conducting member 12 may be fixedly connected to the first housing 111 a .
  • the elastic heat-conducting member 12 may be fixedly connected to the second liquid cooling plate 112 b .
  • the charging device 10 including two power components may include three or more power components.
  • the charging device 10 further includes a chassis 15 , and a plurality of power components 11 are stacked in sequence in the chassis 15 .
  • the elastic heat-conducting member 12 can be inserted into the gap between two adjacent power components 11.
  • the power components 11 and the elastic heat-conducting member 12 can be installed in sequence.
  • the chassis 15 may also include a drawer-type structure such as a tray 16, and the power component 11 may be installed in the chassis 15 through the tray 16 and other structures to improve the convenience of installation and maintenance.
  • the tray 16 and the chassis 15 may be connected through a currently commonly used structure such as a slide rail, which is not limited in this application.
  • the elastic heat conductive member 12 can be fixedly connected to the tray 16. Please refer to FIG6 and FIG8 in combination. After the power components 11 located on both sides of the tray 16 are installed in the box 15, the power components 11 can achieve thermal contact with the elastic heat conductive member 12, thereby having a high installation convenience.
  • the charging device 10 further includes a radiator 17, which can be connected to a liquid cooling plate in the power assembly 11 through a pipeline, and a cooling medium can circulate between the radiator 17 and the liquid cooling plate, so that the radiator 17 can cool the liquid cooling plate.
  • the fan 17 may be disposed on the top of the radiator 17 to accelerate the flow velocity of the air flowing through the radiator 17 , thereby improving the heat dissipation efficiency of the radiator 17 .
  • the chassis 15 also has a partition 151, which divides the internal space of the chassis 15 into a power distribution area and an area for installing the power component 11.
  • the power distribution equipment 19 can be set in the power distribution area.
  • the power distribution equipment 19 can include currently commonly used circuit breakers, overload protection circuits, etc.
  • the power distribution equipment 19 can be installed on the inner wall of the chassis 15, or the power distribution equipment 19 can be integrated in a cabinet, which is not limited in the present application.
  • the embodiment of the present application also provides a charging system, including a charging terminal 60 and a charging device 10, and the charging terminal 60 is connected to the output end of the charging device 10 through a cable.
  • the charging device 10 can perform frequency conversion and other processing on the AC power in the power grid, or it can be converted into DC power and then provided to the charging terminal 60.
  • the charging terminal 60 can be connected to a power receiving device (such as a vehicle) so that electric energy can be replenished to the power receiving device.
  • the charging terminal 60 can be in the form of a charging gun or the like.
  • a charging device 10 can be connected to one charging terminal 60, or it can also be connected to multiple charging terminals 60. The present application does not limit the number of charging terminals 60.
  • the charging device 10 can be installed on the ground, or on a wall or other location.
  • the specific installation position and form are not limited.
  • At least one means one or more
  • “more” means two or more.
  • “And/or” describes the association relationship of associated objects, indicating that there can be three relationships. For example, A and/or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)

Abstract

本申请提供了一种充电设备和充电系统,涉及能源技术领域,以解决充电设备散热效果不好的技术问题。本申请提供的充电设备包括弹性导热件和至少两个堆叠设置的功率组件;功率组件包括外壳、液冷板和电路板组件,外壳和液冷板围成容纳腔,电路板组件设置在容纳腔内并与外壳和液冷板导热连接;每个功率组件的液冷板具有第一接触面,外壳具有第二接触面;在相邻的两个功率组件中,其中一个功率组件的第一接触面与另一个功率组件的第二接触面相向设置,弹性导热件位于第一接触面和第二接触面之间,并与第一接触面和第二接触面弹性抵接。通过使用弹性导热件,能够使得相邻的两个功率组件的散热结构能够相互依赖,有助于提升充电设备的散热性能。

Description

一种充电设备和充电系统
相关申请的交叉引用
本申请要求在2022年11月07日提交中国专利局、申请号为202211383168.6、申请名称为“一种充电设备和充电系统”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及能源技术领域,尤其涉及一种充电设备和充电系统。
背景技术
随着电动车辆的广泛普及,业界对充电设备(如充电桩)的需求也越来越大。充电设备中通常会包括多种不同类型的电气元件,一些电子器件在工作时会产生大量的热,为了保证充电设备处于正常的工作温度范围内,通常需要对充电设备中的一些电子器件进行散热。目前,通常采用风冷的方式对电子器件进行散热。在风冷方式中,一般采用风扇产生气流,使气流快速经过发热器件的表面,从而带走热量。但是,这种方式容易使灰尘等杂质积累在电子器件的表面,会影响电子器件的可靠性和使用寿命。另外,风扇在高速运转时产生的噪音也比较大,影响用户的充电体验。
发明内容
本申请提供了一种结构简单,散热效率好的充电设备和充电系统。
第一方面,本申请提供了一种充电设备,包括弹性导热件和至少两个堆叠设置的功率组件。功率组件包括外壳、液冷板和电路板组件,外壳和液冷板围成容纳腔,电路板组件设置在容纳腔内并与外壳和液冷板均导热连接。每个功率组件的液冷板具有第一接触面,外壳具有第二接触面,第一接触面与第二接触面相背离。其中,在相邻的两个功率组件中,其中一个功率组件的第一接触面与另一个功率组件的第二接触面相向设置,弹性导热件位于第一接触面和第二接触面之间,并与第一接触面和第二接触面分别弹性抵接。
在本申请提供的充电设备中,功率组件中采用液冷板进行散热,外壳也液冷板能够围成用于容纳电路板组件的空间,能够提升电路板组件的密闭性,防止外界的灰尘、水汽等杂质对电路板组件产生影响,能提升充电设备的工作安全性和可靠性。另外,弹性导热件与功率组件导热接触,使得功率组件的热量能够通过弹性导热件进行散发,从而能提升功率组件的散热性能。由于液冷板的散热性能通常会大于外壳的散热性能,因此,在相邻的两个功率组件中,其中一个的功率组件的外壳的热量能够通过弹性导热件传递至另一个功率组件的液冷板,因此,有利于提升充电设备的整体散热性能。
在具体设置时,电路板组件中可以包括电路板和设置在电路板上的电子器件。其中,电路板包括相背离的第一板面和第二板面,电子器件位于第一板面。
在具体设置时,电子器件可以与液冷板导热连接,从而能够使液冷板对电子器件进行较高效率的散热。第二板面可以与外壳导热连接。
在一种示例中,弹性导热件可以为波浪形的片体。弹性导热件具有结构简单、便于制作,并且具有较好的弹性。
另外,弹性导热件与第一接触面之间具有第一风道,弹性导热件与第一接触面之间具有第二风道。流经第一风道和第二风道的空气可以快速带走第一接触面、第二接触面和弹性导热件的热量,有利于提升充电设备的散热性能。
在一种示例中,弹性导热件朝向所述第一接触面的表面具有至少一个与第一接触面相抵的第三接触部,且第三接触部可以为平面,从而有利于提升第一接触面与弹性导热件之间的接触面积。
在一种示例中,弹性导热件朝向所述第二接触面的表面具有至少一个与第二接触面相抵的第四接触部,且第四接触部为平面,从而有利于提升第二接触面与弹性导热件之间的接触面积。
在一种示例中,弹性导热件的材质包括形状记忆合金。其中,弹性导热件用于当温度上升时,趋于增加与第一接触面或第二接触面之间的接触面积。使得在第一接触面的温度较高时,能够增加弹性导热件与第一接触面或第二接触面之间的接触面积,有利于提升对外壳的散热效果。
在一种示例中,充电设备还可以包括机箱,功率组件安装在机箱内,弹性导热件可拆卸的安装在机箱内,从而具有较高的使用灵活性。
在一种示例中,弹性导热件与外壳或液冷板固定连接,从而能够提升在对充电设备进行装配时的便利性。
在一种示例中,充电设备包括托盘,弹性导热件与托盘固定连接。其中,功率组件可以通过托盘固定在机箱内,并且,可同时实现与导热件之间的导热接触,能有效提升装配时的便利性。
在一种示例中,充电设备还可以包括散热器,散热器通过液冷管路与液冷板连接,用于对液冷板进行散热。
第二方面,本申请还提供了一种充电系统,包括充电终端和上述任一种充电设备,充电设备具有输出端口,充电终端与输出端口连接。经充电设备处理后的电能可以提供给充电终端,以便于向受电设备(如车辆)补充电能。
在具体设置时,充电设备可以是用于安装在地面上,也可以安装在墙面等位置,本申请对充电设备的具体安装位置和形态不作限制。
附图说明
图1为本申请实施例提供的一种充电设备的应用场景示意图;
图2为本申请实施例提供的一种充电设备剖面结构示意图;
图3为本申请实施例提供的一种弹性导热件的侧面结构示意图;
图4为本申请实施例提供的一种充电设备的部分结构的剖面结构示意图;
图5为本申请实施例提供的另一种充电设备的部分结构的剖面结构示意图;
图6为本申请实施例提供的另一种充电设备剖面结构示意图;
图7为本申请实施例提供的另一种充电设备的部分结构的剖面结构示意图;
图8为本申请实施例提供的另一种充电设备的部分结构的剖面结构示意图;
图9为本申请实施例提供的一种充电系统的结构简图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的充电设备,下面首先介绍一下其应用场景。
如图1所示,在本申请提供的一种示例中,充电设备10可以应用在对电动车辆20进行充电的场景中。具体的,充电设备10具体可以是充电桩,充电设备10可以安装在停车位附近。在实际应用中,充电设备10的输入端可以与电网30进行连接,充电设备10的输出端可以通过一段线缆40与充电枪50进行连接,以便于对车辆20进行充电。其中,电网30中的电能可以是工业用电(如交流电压为380V),也可以是民用电(如交流电压为22V)等。
在实际应用中,充电设备10可具备过载保护、功率转换等功能。在充电设备10中通常会包括晶体管、变压器、电感、电容或继电器等电子器件。其中,一些电子器件在正常工作时会产生热量,为了使得充电设备10处于正常的工作温度范围内,需要对电子器件进行散热。
在目前的充电设备中,一般采用风冷的方式对充电设备进行散热。在采用风冷方式的充电设备中,一般采用风扇产生气流,使气流快速经过电子器件的表面,从而带走热量。但是,这种方式容易使灰尘等杂质积累在电子器件的表面,会影响电子器件的可靠性和使用寿命。另外,风扇在高速运转时产生的噪音也比较大,影响用户的充电体验。
有鉴于此,本申请实施例提供了一种结构简单,成本较低,能实现较高防护等级的充电设备10以及应用该充电设备10的充电系统。
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图和具体实施例对本申请作进一步地详细描述。
如图2所示,在本申请提供的一种示例中,充电设备10可以包括第一功率组件11a、第二功率组件11b和弹性导热件12。弹性导热件12位于第一功率组件11a和第二功率组件11b之间,并与第一功率组件11a和第二功率组件11b导热接触。其中,在一些情况下,第一功率组件11a的热量可以通过弹性导热件12和第二功率组件11b进行散发,从而能够提升充电设备10的散热效率。相应的,在一些情 况下,第二功率组件11b的热量可以通过弹性导热件12和第一功率组件11a进行散发,从而能够提升充电设备10的散热效率。概括来说,弹性导热件12不仅能够对第一功率组件11a和第二功率组件11b所产生的热量进行有效散发,另外,还能够实现第一功率组件11a与第二功率组件11b之间热量的传递,从而能够有效提升充电设备10的散热性能。
另外,在本申请提供的示例中,第一功率组件11a和第二功率组件11b均采用液冷的散热方式,具有散热效率高、可靠性好、噪声低等优势,有利于保证电子器件的密闭性,能提升充电设备10的工作稳定性和使用寿命。
具体来说,第一功率组件11a包括第一外壳111a、第一液冷板112a和第一电路板组件113a。第一外壳111a和第一液冷板112a围成容纳腔(图中未示出),第一电路板组件113a设置在容纳腔内并与第一外壳111a和第一液冷板112a导热连接。第一液冷板112a内具有管路1121a,冷却介质可以在管路1121a中流通,从而带走第一液冷板112a的热量。第二功率组件11b包括第二外壳111b、第二液冷板112b和第二电路板组件113b。第二外壳111b和第二液冷板112b围成容纳腔(图中未示出),第二电路板组件113b设置在容纳腔内并与第二外壳111b和第二液冷板112b导热连接。第二液冷板112b内具有管路1121b,冷却介质可以在管路1121b中流通,从而带走第二液冷板112b的热量。
在本申请提供的示例中,第一功率组件11a和第二功率组件11b的结构基本相同,下面将以第一功率组件11a为例进行具体说明。
第一电路板组件113a位于第一外壳111a和第一液冷板112a围成的空间内,从而有利于保证第一电路板组件113a的密闭性,能防止外界的灰尘、水汽等杂质对第一电路板组件113a造成腐蚀。
另外,第一电路板组件113a与第一液冷板112a和第一外壳111a导热连接,第一电路板组件113a产生的热量能够通过第一液冷板112a和第一外壳111a进行散发,能够提升第一功率组件11a的散热效率。
具体的,在本申请提供的示例中,第一电路板组件113a包括第一电路板1131a和多个(图中示出有四个)电子器件1132a。其中,第一电路板1131a具有第一板面11311a和第二板面11312a,且第一板面11311a和第二板面11312a为第一电路板1131a的相背离的两个板面,多个电子器件1132a均设置在第一板面11311a,并通过导热硅脂13等导热性较好的材料与液冷板112a导热连接。第一电路板1131a的第一板面11311a通过导热硅脂14等导热性较好的材料与第一外壳111a导热连接。
在本申请提供的示例中,将电子器件1132a均设置在第一电路板1131a的第一板面11311a,在进行制作时,有利于提升第一电路板组件113a的制作效率。例如,可以采用表贴等工艺将电子器件1132a均设置在第一电路板1131a的第一板面11311a。或者,可以理解的是,若将多个电子器件1132a分别设置在第一电路板1131a的第一板面11311a和第二板面11312a时,需要对第一电路板1131a进行翻转,或者需要进行二次焊接等操作,因此,会增加制作流程和工艺,不利于提升制作效率。
另外,在对第一功率组件11a进行装配时,可以使第一电路板1131a的第一板面11311a朝向第一液冷板112a设置,有利于实现多个电子器件1132a与第一液冷板112a之间的导热连接。
在实际应用中,在第一电路板1131a中有电流流通时,会产生热量,因此,第一电路板1131a也存在散热需求。
在本申请提供的示例中,由于第一电路板1131a的第二板面11312a朝向第一外壳111a设置,因此,有利于实现第一电路板1131a与第一外壳111a之间的导热连接。
可以理解的是,在实际应用中,电子器件1132a的发热量通常会大于第一电路板1131a的发热量;第一液冷板112a的散热效率大于第一外壳111a的散热效率,因此,可以将第一电路板1131a与第一外壳111a进行导热连接,使得第一电路板1131a能够通过第一外壳111a进行散热。将电子器件1132a与第一液冷板112a进行导热连接,使得电子器件1132a能够通过第一液冷板112a进行散热。
其中,第一外壳111a主要依靠材料本身的热传递进行散热,可以由钢、铜或铝等热传导性较好的材料制作,第一外壳111a具有便于制作、成本较低、可靠性较高的优势。另外,在进行制作时,也比较容易制备形状比较复杂结构。
对于第一液冷板112a,由于其内部具有供冷却介质进行流通的通道,在实际应用中,不利于制备比较复杂的形状,否则会出现可靠性低、成本明显增高等问题。
目前,随着充电设备10功率的不断提升,第一电路板1131a的散热需求也在不断提高。在实际应用中,若将第一外壳111a更改为液冷的结构形式(如与第一液冷板112a相似的结构),会明显增加充 电设备10的成本。或者,若将第一液冷板112a中的液冷结构延伸至第一外壳111a内,也会增加冷却管路1121a的改造成本,同时,也会增加冷却管路1121a泄露的风险。
在本申请提供的示例中,将第一功率组件11a和第二功率组件11b进行堆叠设置后,通过弹性导热件12可以提升对第一电路板1131a的散热效果。
具体来说,第一功率组件11a的第一液冷板112a具有第一接触面101a,第一外壳111a具有第二接触面102a。第二功率组件11b的第二液冷板112b具有第一接触面101b,第二外壳111b具有第二接触面102b。第一接触面101b和第二接触面102a相向设置,弹性导热件12位于第一接触面101b和第二接触面102a之间,并与第一接触面101b和第二接触面102a弹性抵接。第一电路板1131a产生的热量传递至第一外壳111a后,可以通过弹性导热件12传递至第二液冷板112b。即第二功率组件11b的第二液冷板112b能够对第一功率组件11a的第一电路板1131a进行散热,从而能够明显提升对第一电路板1131a的散热效果。
或者可以理解的是,在本申请提供的示例中,每个功率组件的第一接触面和第二接触面为相背离设置的两个表面。
例如,在第一功率组件11a中,第一接触面101a与第二接触面102a相背离。将多个功率组件进行堆叠设置时,每个功率组件可以按照基本相同的空间姿态进行依次堆叠。因此,在相邻的两个功率组件中,其中一个功率组件的第一接触面能够与另一个功率组件的第二接触面相向设置。
在具体应用时,弹性导热件12的结构形状可以是多样的。
例如,如图2所示,在本申请提供的一种示例中,弹性导热件12为波浪形的板状结构。具体来说,弹性导热件12的波峰和波谷均为弧面。
在自然状态下,弹性导热件12的波峰与波谷之间的高度差大于第一接触面101b与第二接触面102a之间的距离。将弹性导热件12设置在第一接触面101b与第二接触面102a之间后,弹性导热件12会受到第一接触面101b和第二接触面102a的挤压力,从而与第一接触面101b和第二接触面102a弹性抵接。另外,弹性导热件12受到挤压后,会产生弹性形变,使得弹性导热件12与第一接触面101b之间的接触面积会得到增加、弹性导热件12与第二接触面102a之间的接触面积会得到增加,有利于保证弹性导热件12与第一接触面101b和第二接触面102a的接触效果。
另外,在本申请提供的示例中,在弹性导热件12与第一接触面101b之间会形成第一风道121,在弹性导热件12与第二接触面102a之间会形成第二风道122。当有空气流经第一风道121时,会带走弹性导热件12和第一接触面101b的热量。相应的,当有空气流经第二风道122时,会带走弹性导热件12和第二接触面102a的热量,有利于提升充电设备10的散热效率。
在实际应用中,可以在充电设备10中设置风扇,从而可以提升流经第一风道121或第二风道122的空气的流动速度。
概括来说,将弹性导热件12设置为波浪形后,不仅能够保证弹性导热件12与第一接触面101b和第二接触面102a之间的弹性抵接,还可以使得弹性导热件12与第一接触面101b之间形成第一风道121、使弹性导热件12与第二接触面102a之间形成第二风道122,从而有利于提升充电设备10的散热性能。
可以理解的是,在其他的示例中,弹性导热件12也可以是其他的形状。
例如,请结合参阅图2和图3,在本申请提供的另一种示例中,弹性导热件12朝向所述第一接触面的表面与第一接触面101b具有至少一个与所述第一接触面相抵的第三接触部120a,所述第三接触部120a为平面。弹性导热件12朝向第二接触面102a的表面具有至少一个与第二接触面102a相抵的第四接触部120b,第四接触面120b也为平面。在图3中提供的示例中,第三接触部120a和第四接触部120b的数量均为6个,可以理解的是,在其他的示例中,第三接触部120a和第四接触部120b的数量也可以是一个、两个或者更多个,本申请对此不作限制。
具体来说,由于第一接触面101b为平面,因此,将弹性导热件12与第一接触面101b相抵的第三接触部120a设置为平面后,可以提升弹性导热件12与第一接触面101b之间的接触面积,有利于提升弹性导热件12与第一外壳111a之间的热交换效率。相应的,由于第二接触面102a为平面,因此,将弹性导热件12与第二接触面102a相抵的第四接触面120b设置为平面后,可以提升弹性导热件12与第二接触面102a之间的接触面积,有利于提升弹性导热件12与第一液冷板112a之间的热交换效率。
当然,在实际应用中,第一接触面101b或第二接触面102a也可以是曲面,弹性导热件12与第一接触面101b或第二接触面102a相接触的表面也可以是曲面,在此不作赘述。
在具体应用时,弹性导热件12可以采用铜、铝及其合金等具有较高导热性的材料进行中制作。
或者,弹性导热件12的材质也包括形状记忆合金。当弹性导热件12的温度上升时,趋于增加与第一接触面101b或第二接触面102a之间的接触面积,从而可以提升弹性导热件12与第一接触面101b或第二接触面102a之间的接触面积。
具体来说,在实际应用中,弹性导热件12由于与第一接触面101b和第二接触面102a进行接触,因此,当第一外壳111a的温度较高时,需要对第一外壳111a进行较高效率的降温。因此,当第一外壳111a的高温传递至弹性导热件12后,会使弹性导热件12产生预定的形变,并且,这种形变可以提升弹性导热件12与第一接触面101b和第二接触面102a之间的接触面积,从而能够提升第一接触面101b和第二接触面102a之间的换热效率。
例如,在温度较低时,弹性导热件12的形状可以是类似于图2中所示出的形状。在温度较高时,弹性导热件12的形状可以是类似于图3中所示的形状。
当然,在其他的示例中,也可以根据不同需求对弹性导热件12的形状与温度的关系合理设置,在此不作赘述。
另外,在其他的示例中,弹性导热件12也可以是具有可弹性压缩特性的导热垫等结构,在此不作赘述。
在实际应用中,弹性导热件12可以是独立的结构件,或者,也可以是功率组件的组成部分。
例如,如图4所示,弹性导热件12可以与第一外壳111a固定连接。
或者,如图5所示,弹性导热件12可以与第二液冷板112b固定连接。
可以理解的是,在上述的实施例中,以充电设备10中包括两个功率组件为例进行的具体说明,在实际应用中,充电设备10中可以包括三个或者三个以上的功率组件。
例如,如图6所示,在本申请提供的一种示例中,充电设备10还包括机箱15,多个功率组件11依次堆叠设置在机箱15内。
在进行安装时,可以将功率组件11安装到位后,将弹性导热件12插入相邻的两个功率组件11之间的缝隙内。或者,也可以将功率组件11和弹性导热件12进行依次安装。
如图7所示,在一些示例中,机箱15中还可以包括托盘16等抽屉式结构,功率组件11可以通过托盘16等结构安装在机箱15中,以提升安装和维护时的便利性。其中,托盘16与机箱15之间可以通过滑轨等目前常用的结构进行连接,本申请对此不作限定。
另外,如图8所示,在一些示例中,弹性导热件12可以与托盘16固定连接。请结合参阅图6和图8。位于托盘16两侧的功率组件11安装在箱体15内后,便可实现功率组件11与弹性导热件12的导热接触,从而具有较高的安装便利性。
另外,如图6所示,在本申请提供的一种示例中,充电设备10还包括散热器17,散热器17可以通过管路与功率组件11中的液冷板连接,冷却介质可以在散热器17和液冷板之间进行循环流通,使得散热器17能够对液冷板进行降温。
在具体设置时,风扇17可以设置在散热器17的顶部,用于加速流经散热器17的空气的流动速度,从而提升散热器17的散热效率。
另外,在本申请提供的示例中,机箱15内还具有隔板151,隔板151将机箱15的内部空间分隔为配电区和用于安装功率组件11的区域。配电设备19可以设置在配电区,在对配电设备19进行设置时,配电设备19中可以包括目前常用的断路器、过载保护电路等。配电设备19可以安装在机箱15的内壁,或者,也可以将配电设备19集成设置在一个柜体,本申请对此不作限定。
可以理解的是,在具体应用时,配电设备19中所包含的器件的类型和数量可以根据实际需求进行灵活调整,本申请对此不作限定。
另外,如图9所示,本申请实施例还提供了一种充电系统,包括充电终端60和充电设备10,充电终端60通过一段线缆与充电设备10的输出端连接。在具体应用时,充电设备10可以将电网中的交流电进行变频等处理,或者,可以经交流电转变为直流电后提供给充电终端60.充电终端60可以与受电设备(如车辆)进行连接,从而可以向受电设备补充电能。其中,充电终端60可以是充电枪等形态。另外,一个充电设备10可以与一个充电终端60连接,或者,也可以与多个充电终端60连接,本申请对充电终端60的设置数量不作限制。
在具体设置时,充电设备10可以安装在地面上,也可以安装在墙面等位置。本申请对充电设备10 的具体安装位置和形态不作限制。
在本申请的各个实施例中,如果没有特殊说明以及逻辑冲突,不同的实施例之间的术语和/或描述具有一致性、且可以相互引用,不同的实施例中的技术特征根据其内在的逻辑关系可以组合形成新的实施例。
本申请中,“至少一个”是指一个或者多个,“多个”是指两个或两个以上。“和/或”,描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B的情况,其中A,B可以是单数或者复数。
可以理解的是,在本申请的实施例中涉及的各种数字编号仅为描述方便进行的区分,并不用来限制本申请的实施例的范围。上述各过程的序号的大小并不意味着执行顺序的先后,各过程的执行顺序应以其功能和内在逻辑确定。

Claims (12)

  1. 一种充电设备,其特征在于,包括弹性导热件和至少两个堆叠设置的功率组件;
    所述功率组件包括外壳、液冷板和电路板组件,所述外壳和所述液冷板围成容纳腔,所述电路板组件设置在所述容纳腔内并与所述外壳和所述液冷板均导热连接;
    每个所述功率组件的所述液冷板具有第一接触面,所述外壳具有第二接触面,所述第一接触面与所述第二接触面相背离;
    其中,在相邻的两个所述功率组件中,其中一个所述功率组件的所述第一接触面与另一个所述功率组件的所述第二接触面相向设置,所述弹性导热件位于所述第一接触面和所述第二接触面之间,并与所述第一接触面和所述第二接触面分别弹性抵接。
  2. 根据权利要求1所述的充电设备,其特征在于,所述弹性导热件为波浪形的片体。
  3. 根据权利要求1或2所述的充电设备,其特征在于,所述弹性导热件与所述第一接触面之间具有第一风道,所述弹性导热件与所述第二接触面之间具有第二风道。
  4. 根据权利要求1至3中任一项所述的充电设备,其特征在于,所述弹性导热件朝向所述第一接触面的表面具有至少一个与所述第一接触面相抵的第三接触部,所述第三接触部为平面。
  5. 根据权利要求1至4中任一项所述的充电设备,其特征在于,所述弹性导热件朝向所述第二接触面的表面具有至少一个与所述第二接触面相抵的第四接触部,所述第四接触部为平面。
  6. 根据权利要求1至5中任一项所述的充电设备,其特征在于,所述弹性导热件的材质包括形状记忆合金;
    其中,所述弹性导热件用于当温度上升时,趋于增加与所述第一接触面或所述第二接触面之间的接触面积。
  7. 根据权利要求1至6中任一项所述的充电设备,其特征在于,所述电路板组件包括电路板和电子器件;
    所述电路板包括相背离的第一板面和第二板面,所述电子器件位于所述第一板面;
    其中,所述电子器件与所述液冷板导热连接,所述第二板面与所述外壳导热连接。
  8. 根据权利要求1至7中任一项所述的充电设备,其特征在于,还包括机箱,所述功率组件安装在所述机箱内;
    所述弹性导热件可拆卸的安装在所述机箱内。
  9. 根据权利要求1至8中任一项所述的充电设备,其特征在于,所述弹性导热件与所述外壳或所述液冷板固定连接。
  10. 根据权利要求1至8中任一项所述的充电设备,其特征在于,所述充电设备包括托盘,所述弹性导热件与所述托盘固定连接。
  11. 根据权利要求1至10中任一项所述的充电设备,其特征在于,还包括散热器,所述散热器通过液冷管路与所述液冷板连接。
  12. 一种充电系统,其特征在于,包括充电终端和如权利要求1至11中任一项所述的充电设备,所述充电设备具有输出端口,所述充电终端与所述输出端口连接。
PCT/CN2023/101066 2022-11-07 2023-06-19 一种充电设备和充电系统 WO2024098761A1 (zh)

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