WO2024084972A1 - 面接触型熱交換器 - Google Patents

面接触型熱交換器 Download PDF

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Publication number
WO2024084972A1
WO2024084972A1 PCT/JP2023/036257 JP2023036257W WO2024084972A1 WO 2024084972 A1 WO2024084972 A1 WO 2024084972A1 JP 2023036257 W JP2023036257 W JP 2023036257W WO 2024084972 A1 WO2024084972 A1 WO 2024084972A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
heat exchanger
inlet hole
outlet hole
cup plate
Prior art date
Application number
PCT/JP2023/036257
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
煕 久保田
朗 小室
Original Assignee
株式会社ティラド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ティラド filed Critical 株式会社ティラド
Priority to JP2024551464A priority Critical patent/JPWO2024084972A1/ja
Publication of WO2024084972A1 publication Critical patent/WO2024084972A1/ja

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a surface-contact heat exchanger, and in particular to a structure that protects the sealing surface of the flange plate.
  • a casing is formed by a cup plate 1 formed in a cup shape having a bottom, and a flat top plate 5 facing the inner surface of the bottom of the cup plate 1.
  • a flow path through which a heat medium 6 flows is formed between the cup plate 1 and the top plate 5, and the core 3 is disposed in the flow path.
  • a heat exchange object 4 is disposed on the outer surface of the top plate 5.
  • the outer surface of the bottom of the cup plate 1 contacts the inner surface of the flange plate 2.
  • the outer surface of the flange plate 2 has a seal surface 9 at the contact portion with the housing 11, and is attached to the housing 11 via a seal material 10. Heat exchange is performed between the heat medium 6 flowing within the core 3 and the heat exchange object 4 .
  • the cup plate 1, flange plate 2, top plate 5 and core 3 are brazed together using flux.
  • the brazing material or flux applied to the components may move through the outflow path 12 and flow onto the sealing surface 9 of the flange plate 2, as shown in FIG. 8, which may impair the sealing function between the flange plate 2 and the housing 11. Therefore, the present invention provides a structure for preventing the outflow of wax and flux to the sealing surface 9 of the flange plate 2 in a surface-contact type heat exchanger.
  • the first invention for solving the above problem includes a dish-shaped cup plate 1 having a first inlet hole 1a and a first outlet hole 1b for a heat medium 6 in a bottom portion 1c, a flange plate 2 supporting an outer surface of the bottom 1c of the cup plate 1, having a second inlet hole 2a and a second outlet hole 2b communicating with the first inlet hole 1a and the first outlet hole 1b formed therein, and having a seal surface 9 on an outer surface opposite to the cup plate 1; A core 3 to be fitted inside the cup plate 1; a top plate 5 that closes the opening of the cup plate 1 and has an outer surface opposite to the cup plate 1 that is in surface contact with a heat exchange object 4; Equipped with In a surface-contact type heat exchanger in which each part is joined by brazing, An annular protrusion 7 is formed on the edge of the second inlet hole 2a or the second outlet hole 2b of the flange plate 2, and the protrusion 7 is fitted into the first inlet hole 1a or the first outlet hole 1
  • the second invention is a surface-contact heat exchanger according to the first invention, in which the gap 8 is 1 mm or less.
  • the third invention is a surface-contact heat exchanger according to the first invention, in which the height of the ridges 7 is smaller than the thickness of the cup plate 1.
  • a ring-shaped protrusion 7 is formed on the edge of the second inlet hole 2a or the second outlet hole 2b of the flange plate 2, and the protrusion 7 is fitted into the first inlet hole 1a or the first outlet hole 1b of the cup plate 1, and in this fitted state, a gap 8 is formed between the protrusion 7 and the first inlet hole 1a or the first outlet hole 1b.
  • the second invention is the first invention, wherein the gap 8 is set to 1 mm or less.
  • the interfacial tension with the protrusion 7 and the interfacial tension with the first inlet hole 1a or the first outlet hole 1b act in a combined manner, increasing the retention force of the solder or flux in the gap 8, thereby further preventing the solder and flux from flowing out to the sealing surface 9 of the flange plate 2.
  • the third invention is the same as the first invention, except that the height of the ridges 7 is smaller than the thickness of the cup plate 1 . With this configuration, it is possible to prevent the outflow of brazing filler metal and flux onto the sealing surface 9 of the flange plate 2 while reducing the processing costs of the protrusions 7 of the flange plate 2 .
  • FIG. 2 is an exploded perspective view of the surface contact type heat exchanger of the present invention.
  • 2 is a cross-sectional explanatory view of a main part of the heat exchanger in use, taken along the line II-II in FIG. 1 .
  • FIG. 4 is an explanatory view of a main part showing a brazed state of the heat exchanger.
  • FIG. 4 is an explanatory diagram showing the flow of flux through an outflow path 12 in the brazed state of the heat exchanger.
  • FIG. 4 is a cross-sectional view of a main portion showing a second embodiment of the flange plate 2 of the present invention.
  • FIG. 11 is a cross-sectional view of a main portion showing the third embodiment.
  • FIG. 1 is a cross-sectional view illustrating a main portion of a conventional heat exchanger.
  • FIG. 1 is an explanatory diagram showing a state during brazing in a conventional heat exchanger.
  • the heat exchanger of the present invention comprises a cup plate 1 formed in a dish shape, a top plate 5 that closes the opening of the cup plate 1, a core 3 that is fitted inside the cup plate 1, and a flange plate 2 that supports the outer surface of the bottom 1c of the cup plate 1.
  • the cup plate 1 has a first inlet hole 1a and a first outlet hole 1b for the heat medium 6 on the bottom portion 1c.
  • a peripheral wall 1d is formed on the peripheral edge of the bottom portion 1c of the cup plate 1, and a peripheral portion 1e is formed at an end of the peripheral wall 1d.
  • a peripheral edge 5 a of a top plate 5 is connected to an edge portion 1 e of the cup plate 1 .
  • the core 3 mounted inside the cup plate 1 may be a laminate of punched plates as shown in FIG. 1, or may be offset or corrugated fins (not shown).
  • the flange plate 2 has a second inlet hole 2a and a second outlet hole 2b which communicate with the first inlet hole 1a and the first outlet hole 1b of the cup plate 1, and has a sealing surface 9 on the outer surface of the flange plate 2 opposite the surface to which the cup plate 1 is connected. These components are joined together by brazing.
  • the top plate 5 is in surface contact with the heat exchange object 4 on the outer surface opposite to the surface to which the cup plate 1 is connected.
  • the sealing surface 9 of the flange plate 2 is connected to the surface of the housing 11 via a sealing material 10 as shown in FIG.
  • the heat transfer medium 6 is supplied to the core 3 housed in the cup plate 1 through the housing 11, the second inlet hole 2a of the flange plate 2, and the first inlet hole 1a of the cup plate 1, and is discharged from the first outlet hole 1b.
  • This surface-contact heat exchanger exchanges heat between a heat exchange object 4 and a heat medium 6, and can be used, for example, as a cooler for electronic components of an electric vehicle.
  • the heat exchange object 4 is a heat generating element such as various electronic components, for example, an inverter or a power transistor
  • the heat medium 6 is a cooling water or a refrigerant.
  • the heat medium 6 is a heating fluid.
  • annular protrusions 7 are formed on the hole edges of the second inlet hole 2a and the second outlet hole 2b of the flange plate 2 on the side opposite to the sealing surface 9. As shown in Fig. 2, these protrusions 7 fit into the first inlet hole 1a and the first outlet hole 1b of the cup plate 1 with a gap 8 therebetween. As mentioned above, when fitted, a gap 8 is formed between the protrusion 7 of the second inlet hole 2a and the first inlet hole 1a (the configuration of the protrusion 7 of the second outlet hole 2b and the first outlet hole 1b side is the same as the configuration of the first inlet hole 1a and the second inlet hole 2a side, so is not shown in the illustration).
  • the protrusion 7 is preferably a closed ring, but it may be partially open.
  • 3 and 4 are explanatory views showing the operation of the surface-contact heat exchanger of the present invention.
  • an annular protrusion 7 formed on the edge of the second inlet hole 2a of the flange plate 2 is fitted into the first inlet hole 1a of the cup plate 1 with a gap 8. Therefore, the distance on the surface from the brazing portion to the seal surface 9 of the flange plate 2 is long, and the brazing filler and flux that flow out from the brazing portion is held in the gap 8 (see the brazing filler and flux pool 13 in FIG. 4), preventing the brazing filler and flux from flowing out to the seal surface 9 of the flange plate 2.
  • the width S of the gap 8 is 1 mm or less.
  • the protruding height H of the annular ridge 7 (the height from the plane of the flange plate 2 to the top of the ridge 7) is smaller than the plate thickness t of the cup plate 1, as shown in Figures 3 and 4.
  • FIG. 5 shows a second embodiment of the present invention.
  • two concentric ridges 7 are formed in the second inlet hole 2a of the flange plate 2. This can further enhance the effect of preventing the outflow of brazing filler metal and flux.
  • FIG. 6 shows a third embodiment of the present invention.
  • the protrusion 7 is formed with a curved surface without any corners. Even with this protrusion 7, the effects of the present invention can be achieved.
  • the present invention can be widely used as a surface-contact heat exchanger, and is particularly suitable as an inverter cooler for electric vehicles.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
PCT/JP2023/036257 2022-10-21 2023-10-04 面接触型熱交換器 WO2024084972A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024551464A JPWO2024084972A1 (enrdf_load_stackoverflow) 2022-10-21 2023-10-04

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022169088 2022-10-21
JP2022-169088 2022-10-21

Publications (1)

Publication Number Publication Date
WO2024084972A1 true WO2024084972A1 (ja) 2024-04-25

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ID=90737347

Family Applications (1)

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PCT/JP2023/036257 WO2024084972A1 (ja) 2022-10-21 2023-10-04 面接触型熱交換器

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WO (1) WO2024084972A1 (enrdf_load_stackoverflow)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0694386A (ja) * 1992-09-14 1994-04-05 Sanden Corp 熱交換器
JP2001091105A (ja) * 1999-09-22 2001-04-06 Mitsubishi Electric Corp 冷媒分配器とその製造方法
JP2004205055A (ja) * 2002-12-20 2004-07-22 Toyo Radiator Co Ltd プレート型熱交換器
JP2013183021A (ja) * 2012-03-01 2013-09-12 Toyota Industries Corp 冷却器
JP2019186237A (ja) * 2018-04-02 2019-10-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両
WO2020153462A1 (ja) * 2019-01-25 2020-07-30 株式会社ティラド 熱交換器
JP2021103060A (ja) * 2019-12-25 2021-07-15 昭和電工パッケージング株式会社 熱交換器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0694386A (ja) * 1992-09-14 1994-04-05 Sanden Corp 熱交換器
JP2001091105A (ja) * 1999-09-22 2001-04-06 Mitsubishi Electric Corp 冷媒分配器とその製造方法
JP2004205055A (ja) * 2002-12-20 2004-07-22 Toyo Radiator Co Ltd プレート型熱交換器
JP2013183021A (ja) * 2012-03-01 2013-09-12 Toyota Industries Corp 冷却器
JP2019186237A (ja) * 2018-04-02 2019-10-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両
WO2020153462A1 (ja) * 2019-01-25 2020-07-30 株式会社ティラド 熱交換器
JP2021103060A (ja) * 2019-12-25 2021-07-15 昭和電工パッケージング株式会社 熱交換器

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