JPWO2024084972A1 - - Google Patents

Info

Publication number
JPWO2024084972A1
JPWO2024084972A1 JP2024551464A JP2024551464A JPWO2024084972A1 JP WO2024084972 A1 JPWO2024084972 A1 JP WO2024084972A1 JP 2024551464 A JP2024551464 A JP 2024551464A JP 2024551464 A JP2024551464 A JP 2024551464A JP WO2024084972 A1 JPWO2024084972 A1 JP WO2024084972A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024551464A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024084972A1 publication Critical patent/JPWO2024084972A1/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
JP2024551464A 2022-10-21 2023-10-04 Pending JPWO2024084972A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022169088 2022-10-21
PCT/JP2023/036257 WO2024084972A1 (ja) 2022-10-21 2023-10-04 面接触型熱交換器

Publications (1)

Publication Number Publication Date
JPWO2024084972A1 true JPWO2024084972A1 (enrdf_load_stackoverflow) 2024-04-25

Family

ID=90737347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024551464A Pending JPWO2024084972A1 (enrdf_load_stackoverflow) 2022-10-21 2023-10-04

Country Status (2)

Country Link
JP (1) JPWO2024084972A1 (enrdf_load_stackoverflow)
WO (1) WO2024084972A1 (enrdf_load_stackoverflow)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0694386A (ja) * 1992-09-14 1994-04-05 Sanden Corp 熱交換器
JP3932733B2 (ja) * 1999-09-22 2007-06-20 三菱電機株式会社 冷媒分配器
JP2004205055A (ja) * 2002-12-20 2004-07-22 Toyo Radiator Co Ltd プレート型熱交換器
JP5821702B2 (ja) * 2012-03-01 2015-11-24 株式会社豊田自動織機 冷却器
JP7116576B2 (ja) * 2018-04-02 2022-08-10 富士電機株式会社 冷却装置、半導体モジュールおよび車両
DE112020000122T5 (de) * 2019-01-25 2021-07-22 T.Rad Co., Ltd. Wärmetauscher
JP7353164B2 (ja) * 2019-12-25 2023-09-29 株式会社レゾナック・パッケージング 熱交換器

Also Published As

Publication number Publication date
WO2024084972A1 (ja) 2024-04-25

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