WO2024080331A1 - Ｒｆｉｄモジュール - Google Patents

Ｒｆｉｄモジュール Download PDF

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Publication number
WO2024080331A1
WO2024080331A1 PCT/JP2023/037062 JP2023037062W WO2024080331A1 WO 2024080331 A1 WO2024080331 A1 WO 2024080331A1 JP 2023037062 W JP2023037062 W JP 2023037062W WO 2024080331 A1 WO2024080331 A1 WO 2024080331A1
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WO
WIPO (PCT)
Prior art keywords
coil element
main surface
rfid module
wound portion
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/037062
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English (en)
French (fr)
Japanese (ja)
Inventor
紀行 植木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202380050655.7A priority Critical patent/CN119452522A/zh
Priority to DE112023002274.7T priority patent/DE112023002274T5/de
Priority to JP2024551748A priority patent/JP7704310B2/ja
Publication of WO2024080331A1 publication Critical patent/WO2024080331A1/ja
Priority to US18/985,394 priority patent/US20250117621A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to an RFID module having a substrate on which a coil conductor is mounted.
  • RFID Radio-Frequency Identification
  • RFIC Radio-Frequency Integrated Circuit
  • Patent Document 1 proposes an RFID module that includes a coil conductor in which coil elements with legs for mounting are arranged in a line.
  • the coil conductor in the RFID module disclosed in Patent Document 1 has legs for mounting, so the coil opening diameter is smaller by the amount of mounting space. If you try to maintain the antenna characteristics, the RFID module will become larger.
  • the present invention aims to provide an RFID module that can be miniaturized while maintaining antenna characteristics.
  • An RFID module comprises a substrate having a first and second principal surface opposed to each other, an RFIC chip disposed on the first principal surface side of the substrate, and a coil element having a conductor wound multiple times.
  • One end of the RFIC chip is electrically connected to one end of the coil element, and the other end of the RFIC chip is electrically connected to the other end of the coil element.
  • the coil element has at least one sparsely wound portion, and both ends of the coil element are first densely wound portions in which the conductor is wound with a narrower pitch than the sparsely wound portion.
  • the present invention provides an RFID module that can be miniaturized while maintaining antenna characteristics.
  • FIG. 1 is a vertical cross-sectional view showing an outline of an RFID module according to a first embodiment
  • a perspective view of a coil element Cross-sectional view of the conductor of the coil element
  • FIG. 1 is a plan view showing wiring electrodes on a substrate according to a first embodiment
  • FIG. 11 is a vertical cross-sectional view showing an outline of an RFID module according to a second embodiment.
  • FIG. 1 is a plan view showing each base layer of a laminated substrate
  • FIG. 13 is a longitudinal sectional view showing an outline of an RFID module according to a modified example.
  • FIG. 1 is a longitudinal sectional view of the RFID module 1 according to the first embodiment.
  • FIG. 2 is a perspective view of a coil element.
  • the X-Y-Z coordinate system is used to facilitate understanding of the invention, and does not limit the invention.
  • the X-axis direction indicates the longitudinal direction of the RFID module 1
  • the Y-axis direction indicates the depth (width) direction
  • the Z-axis direction indicates the thickness direction.
  • the X, Y, and Z directions are mutually orthogonal.
  • the positive direction of the Z axis is the upward direction
  • the negative direction of the Z axis is the downward direction.
  • the RFID module 1 of the embodiment includes a substrate 3, a coil element 5 and an RFIC chip 7 arranged on a first main surface 61, which is the upper surface of the substrate 3, and a resin layer 9 that seals the coil element 5 and the RFIC chip 7.
  • the RFIC chip 7 has a first terminal 7a and a second terminal 7b, which are input/output terminals.
  • the substrate 3 in the first embodiment is a double-sided substrate, and the second main surface 62, which is the lower surface of the substrate 3, and the first main surface 61 face each other.
  • the substrate 3 is insulating and is, for example, a glass epoxy substrate or a ceramic substrate.
  • a first resist layer 16 is laminated on the first main surface 61 of the substrate 3, and a second resist layer 17 is laminated on the second main surface 62 of the substrate 3.
  • the first resist layer 16 prevents shorting of the electrodes and wiring arranged on the first base layer 11, and the second resist layer 17 covers and protects the lower ends of the first interlayer connection conductor 55 and the second interlayer connection conductor 57, which will be described later.
  • the first resist layer 16 and the second resist layer are, for example, insulating resin layers.
  • the coil element 5 is formed by winding the conductor 31 multiple times, and the coil element 5 functions as an antenna.
  • the communication frequency band in the RFID module 1 of the embodiment is, for example, the UHF band of 860 MHz to 960 MHz.
  • the number of turns and dimensions of the coil element 5 may be changed according to the communication characteristics.
  • the coil element 5 has a first densely wound portion 5a, a second densely wound portion 5b, and a loosely wound portion 5c.
  • the coil element 5 is an air-core coil that does not have a cavity or magnetic core material along the winding axis.
  • the first densely wound portion 5a is formed at both ends of the coil element 5, and the second densely wound portion 5b is formed between the first densely wound portions 5a at both ends, for example, in the center of the coil element 5.
  • the loosely wound portion 5c is formed between the first densely wound portion 5a and the second densely wound portion 5b.
  • densely wound means that the winding pitch of the conductor 31 is narrower in the first densely wound portion 5a and the second densely wound portion 5b than in the loosely wound portion 5c, and for example, the wire diameter and winding pitch of the conductor 31 may be the same. In this case, the conductor 31 is in contact with each other in the first densely wound portion 5a and the second densely wound portion 5b.
  • the total number of turns of the sparsely wound portion 5c is equal to or greater than the total number of turns of the first densely wound portion 5a and the second densely wound portion 5b, for example, equal to or greater than twice the total number of turns.
  • the number of turns of the conductor 31 is, for example, equal to or greater than two.
  • Each first densely wound portion 5a is connected to the first land 19 and the first electrode 27 arranged on the first main surface of the substrate 3 via solder 23. In this way, the first densely wound portion 5a functions as a solder joint.
  • the second densely wound portion 5b functions as a part to be attached when attached to a component mounter, but may also be connected to the auxiliary electrode 29 arranged on the first main surface of the substrate 3 via solder 23. This makes it possible to prevent the coil element 5 from bending when the resin layer 9 is molded.
  • the length in the X-axis direction of the second densely wound portion 5b is greater than the hole diameter of the suction nozzle of the component mounter.
  • Figure 3 is a cross-sectional view of the conductor 31 of the coil element 5.
  • the conductor 31 of the coil element 5 is covered with an insulating film 33. Note that at the joint portion between the coil element 5 and the solder 23, the insulating film 33 is removed and the conductor 31 and the solder 23 are joined.
  • the coil element 5 may be composed of only the conductor 31 that is not covered with the insulating film 33.
  • the resin layer 9 seals the coil element 5 and the RFIC chip 7, and is laminated on the third main surface 11a of the first base layer 11 and the first resist layer 16.
  • the resin layer 9 is made of a general sealing resin such as an epoxy resin.
  • FIG. 4 is a plan view showing the wiring electrodes on the substrate 3.
  • FIG. 4(a) is a plan view showing the wiring electrodes on the first main surface 61 of the substrate 3.
  • FIG. 4(b) is a perspective plan view seen through the substrate 3, showing the wiring electrodes on the second main surface 62.
  • the dashed and dotted lines in FIG. 4 indicate through-hole connections.
  • a first land 19 connected via solder 23 to the first terminal 7a of the RFIC chip 7 and the first densely wound portion 5a closer to the RFIC chip 7, and a second land 21 connected via solder 23 to the second terminal 7b of the RFIC chip 7 are arranged on the first main surface 61, which is the top surface of the substrate 3. Also arranged on the first main surface 61 of the substrate 3 are an auxiliary electrode 29 connected via solder 23 to the second densely wound portion 5b, and a first electrode connected via solder 23 to the first densely wound portion 5a farther from the RFIC chip 7.
  • a first interlayer connection conductor 55 and a second interlayer connection conductor 57 are formed to penetrate the inside of the substrate 3.
  • the first interlayer connection conductor 55 is a conductive via that connects the second land 21 and the conductor pattern 53.
  • the second interlayer connection conductor 57 is a conductive via that connects the first electrode 27 and the conductor pattern 53.
  • the first and second interlayer connection conductors 55, 57 are, for example, conductors formed by filling holes in the insulating substrate 3 with a conductive paste that has been solidified (metallized), but they may also be plated through holes.
  • the first and second interlayer connection conductors 55, 57 are disposed opposite each other in the longitudinal direction of the third substrate.
  • a conductor pattern 53 connecting the first interlayer connection conductor 55 and the second interlayer connection conductor 57 is disposed on the second main surface 62 of the substrate 3.
  • the conductor pattern 53 has, for example, a linear shape extending in the longitudinal direction of the substrate 3. Since the conductor pattern 53 is not disposed outside the first and second interlayer connection conductors 55, 57 in the longitudinal direction, it is possible to prevent the conductor pattern 53 from being scraped off in the event of contact between the RFID module and other items during the manufacturing process or handling after manufacturing.
  • the first land 19, the second land 21, the first electrode 27, the auxiliary electrode 29, and the conductor pattern 53 are each a conductor, for example, copper foil patterned by photolithography.
  • An LC parallel resonant circuit is configured within the RFID module 1 and is matched to radio waves of the communication frequency, so when the coil element 5 receives radio waves of the communication frequency, a current flows through the RFIC chip 7.
  • the coil element 5 has the first densely wound portion 5a at both ends, so that it can be soldered to the board 3, and the fixing strength of the coil element 5 can be increased.
  • the coil element 5 also has a loosely wound portion 5c in which the conductor 31 is wound more loosely than the first densely wound portion 5a at locations other than both ends. Since the coupling coefficient Ka of the first densely wound portion 5a and the second densely wound portion 5b is greater than the coupling coefficient Kb of the loosely wound portion 5c, it is easier to release the magnetic field from the loosely wound portion 5c to the outside of the coil element 5 than from the first densely wound portion 5a and the second densely wound portion 5b.
  • the length of the loosely wound portion 5c is greater than the length of the first densely wound portion 5a.
  • the length of the loosely wound portion 5c is greater than the sum of the length of the first densely wound portion 5a and the length of the second densely wound portion 5b. In this way, the length of the loosely wound portion 5c is large, allowing more magnetic field to be emitted.
  • Figure 5 is a plan view explaining the currents Ia and Ib flowing through the metal plate 101 when the RFID module 1 is placed on the metal plate 101.
  • Figure 6 is a vertical cross-sectional view explaining the current flowing through the metal plate 101 when the RFID module 1 is placed on the metal plate 101. Note that the substrate 3 has been omitted from Figure 5 to make the current flow easier to understand.
  • the coil element 5 of the RFID module 1 couples with the magnetic field generated by the current flowing on the metal plate 101.
  • the currents Ia and Ib flowing on the metal plate 101 flow in opposite directions with the center of the coil element 5 of the RFID module 1 as the boundary.
  • the current density on the metal plate 101 is higher at the ends of the metal plate 101, so the magnetic field at the ends of the metal plate 101 is stronger and the magnetic field at the center of the metal plate 101 is weaker. Even if the second dense winding portion 5b is present in the center of the coil element 5, it does not significantly affect the magnetic field coupling with the metal plate 101.
  • the RFID module 1 of the embodiment includes a substrate 3 having a first main surface 61 and a second main surface 62 facing each other, an RFIC chip 7 arranged on the first main surface 61 side of the substrate 3, and a coil element 5 in which the conductor 31 is wound multiple times.
  • a first terminal 7a of the RFIC chip 7 is electrically connected to one end of the coil element 5, and a second terminal 7b of the RFIC chip 7 is electrically connected to the other end of the coil element 5.
  • the coil element 5 has at least one sparsely wound portion 5c, and both ends of the coil element 5 are first densely wound portions 5a in which the conductor 31 is wound with a narrower pitch than the sparsely wound portions 5c.
  • the RFID module 1 of this configuration employs a coil element 5 in which the conductor 31 is wound multiple times, allowing the coil opening diameter to be made larger than if a coil element with legs were used, making it possible to reduce the size while maintaining the antenna characteristics.
  • the conductor 31 is wound at a narrower pitch at both ends of the coil element 5 than in the sparsely wound portion 5c, and the conductor 31 is wound at a wider pitch at the sparsely wound portion 5c than at both ends. Therefore, the sparsely wound portion functions as an antenna since the magnetic field is easily released outside the coil element 5, while the densely wound ends can increase the adhesion strength as connection parts for the substrate 3.
  • the length of the loosely wound portion 5c is greater than the length of the first densely wound portion 5a. Because the length of the loosely wound portion 5c is greater than the length of the first densely wound portion 5a, the antenna characteristics of the RFID module 1 can be improved.
  • the second densely wound portion 5b has a second densely wound portion 5b in which the pitch between the conductor wires 31 is narrower than that of the sparsely wound portion 5c.
  • the conductor 31 of the coil element 5 may also be covered with an insulating film 33.
  • the inductance component of the coil element 5 can be increased, so the length of the coil element 5 can be shortened, and the RFID module 1 can be made smaller.
  • the conductor 31 of the coil element 5 does not have to be covered with the insulating film 33. In this case, when mounting it to the substrate 3 via solder, the process of peeling off the insulating film 33 at the joint can be omitted.
  • Fig. 7 is a longitudinal sectional view showing an outline of the RFID module 1A of the second embodiment.
  • Fig. 8 is a plan view showing each base layer of the substrate 3A.
  • Fig. 8(a) is a plan view showing the wiring electrodes on the first main surface 61 of the substrate 3A.
  • Fig. 8(b) is a plan view showing the wiring electrodes on the fifth main surface of the second base layer 13.
  • Fig. 8(c) is a perspective plan view seen through the second base layer 13, showing the wiring electrodes on the sixth main surface 13b.
  • Fig. 8(d) is a perspective plan view seen through the third base layer 15, showing the electrodes on the eighth main surface 15b.
  • the dashed lines in Fig. 8 indicate through-hole connections.
  • the substrate 3A in the second embodiment is a laminated substrate, the first land 19 extends further toward the center of the longitudinal direction of the substrate 3 than in the first embodiment, and a second electrode 47 that is capacitively coupled to the first land 19 is provided within the substrate 3.
  • the configuration of the RFID module 1A in the second embodiment is the same as that of the RFID module 1 in the first embodiment, and a description of the common configuration will be omitted.
  • the substrate 3A has a first substrate layer 11, a second substrate layer 13, and a third substrate layer 15, with the third substrate layer 15 serving as the bottom substrate, the second substrate layer 13 being stacked on the third substrate layer 15 toward the coil element 5, and the first substrate layer 11 being further stacked on the second substrate layer 13.
  • the first substrate layer 11 to the third substrate layer 15 are each insulating and are, for example, a glass epoxy substrate or a ceramic substrate.
  • the third main surface 11a of the first substrate layer 11 corresponds to the first main surface 61 of the substrate 3.
  • the fourth main surface 11b on the second main surface 62 side of the first substrate layer 11 is in contact with the fifth main surface 13a on the first main surface 61 side of the second substrate layer 13.
  • the sixth main surface 13b on the second main surface 62 side of the second substrate layer 13 is in contact with the seventh main surface 15a on the first main surface 61 side of the third substrate layer 15.
  • the eighth main surface 15b which is the lower surface of the third substrate layer 15, faces the seventh main surface 15a and corresponds to the second main surface 62 of the substrate 3.
  • a second electrode 47 is disposed below the first land 19 and the second land 21 on the fifth main surface 13a, which is the upper surface of the second base layer 13.
  • the second electrode 47 faces the first land 19 and the second land 21, and a capacitance C1 is generated between the first land 19, the second land 21, and the second electrode 47.
  • a conductor pattern 53 is disposed on the sixth main surface 13b, which is the lower surface of the second base layer 13.
  • Figure 8(c) is a perspective view of the fifth main surface 13a from above.
  • first interlayer connection conductor 55A and a second interlayer connection conductor 57A are formed, penetrating the first base material layer 11 and the second base material layer 13, respectively.
  • the first interlayer connection conductor 55 is a conductive via that connects from the first land 19 to the second electrode 47 and the conductor pattern 53.
  • the second interlayer connection conductor 57 is a conductive via that connects the first electrode 27 and the conductor pattern 53.
  • the first and second interlayer connection conductors 55A, 57A are, for example, conductors formed by solidifying (metallizing) a conductive paste filled in holes provided in the insulating first substrate layer 11 and second substrate layer 13, but may also be plated through holes.
  • the first and second interlayer connection conductors 55A, 57A are disposed opposite each other in the longitudinal direction of the first substrate layer 11 and second substrate layer 13, respectively.
  • the coil element 5 has an inductance L1
  • the conductor pattern 53 has an inductance L2.
  • the capacitance C1 is composed of the first land 19, the second land 21, the first substrate layer 11, and the second electrode 47.
  • the RFIC chip 7 also has an internal resistance R and capacitance C2. The larger the capacitance C1, the larger the combined capacitance C becomes, and the smaller the resonant frequency f becomes. If the resonant frequency with the communication frequency needs to be reduced, this can be achieved by increasing the area of the second electrode 47.
  • the substrate 3A has a first base layer 11 arranged on the first main surface 3a side and a second base layer 13 arranged on the second main surface 3b side.
  • the RFID module 1A includes a first land 19 arranged on the first main surface 3a side of the first base layer 11 and connected to a first terminal 7a of the RFIC chip 7, a second land 21 arranged on the first main surface 3a side of the first base layer 11 and connected to a second terminal 7b of the RFIC chip 7, a second electrode 47 facing the first land 19 and the second land 21 and arranged on the first main surface 3a side of the second base layer 13, a first interlayer connection conductor 55A and a second interlayer connection conductor 57A penetrating the first base layer 11 and the second base layer 13, respectively, and a conductor pattern 53 arranged on the second main surface 3b side of the second base layer 13 and connecting the first interlayer connection conductor 55A and the second interlayer connection conductor 57A.
  • the second land 21, the second electrode 47, and one end of the conductor pattern 53 are connected via a first interlayer connection conductor 55A.
  • the other end of the conductor pattern 53 and the other end of the coil element 5 are connected via a second interlayer connection conductor 57A.
  • the first land 19 and one end of the coil element 5 are connected.
  • the resonant frequency of the RFID module 1A can be reduced.
  • the coil element 5 has the second densely wound portion 5b, but this is not limited to this. As shown in FIG. 9, the coil element 5D may not have the second densely wound portion 5b.
  • the RFID module includes a substrate having a first main surface and a second main surface facing each other, an RFIC chip disposed on the first main surface side of the substrate, and a coil element having a conductor wound multiple times.
  • One end of the RFIC chip is electrically connected to one end of the coil element, and the other end of the RFIC chip is electrically connected to the other end of the coil element.
  • the coil element has at least one loosely wound portion, and both ends of the coil element are first densely wound portions in which the conductor is wound with a narrower pitch than the loosely wound portion.
  • a coil element in which the conductor is wound multiple times is used, so the coil opening diameter can be made larger than if a coil element with legs were used.
  • Both ends of the coil element are first densely wound sections in which the conductor is wound with a narrower pitch between the wires than in the sparsely wound section.
  • the sparsely wound section has a wider pitch between the wires than the first densely wound section. Therefore, the magnetic field is easily released to the outside of the coil element in the sparsely wound section, so it functions as an antenna, and both ends, which are first densely wound sections, can increase the fixing strength as connection parts for the board.
  • the length of the loosely wound portion is greater than the length of the first densely wound portion in the winding axis direction of the coil element. Since the length of the loosely wound portion is greater than the length of the first densely wound portion in the coil element, the antenna characteristics of the RFID module can be improved.
  • the RFID module of the first aspect has a second densely wound section in which the conductors are wound with a narrower pitch than the loosely wound section. This allows the second densely wound section to function as a part to be attracted to a component mounter.
  • the length of the loosely wound portion is greater than the sum of the lengths of the first densely wound portion and the second densely wound portion. Since the length of the loosely wound portion in the coil element is greater than the sum of the lengths of the first densely wound portion and the second densely wound portion, the antenna characteristics of the RFID module can be improved.
  • the conductor of the coil element is covered with an insulating film. This increases the inductance component of the coil element, shortening the length of the coil element and enabling the RFID module to be miniaturized.
  • the conductor of the coil element is not covered with an insulating film. This makes it possible to omit the step of peeling off the insulating film at the joint when mounting the RFID module on the board via solder.
  • an auxiliary electrode is provided on the first main surface side of the substrate, and the second dense winding portion is connected to the auxiliary electrode via solder. This makes it possible to prevent the coil element from bending.
  • the substrate has a first base material layer arranged on the first main surface side and a second base material layer arranged on the second main surface side.
  • the RFID module includes a first land arranged on the first main surface side of the first base material layer and connected to one end of the RFIC chip, a second land arranged on the first main surface side of the first base material layer and connected to the other end of the RFIC chip, a second electrode facing the first land and the second land and arranged on the first main surface side of the second base material layer, first and second interlayer connection conductors penetrating the first and second base material layers, respectively, and a conductor pattern arranged on the second main surface side of the second base material layer and connecting the first interlayer connection conductor and the second interlayer connection conductor.
  • the second land, the second electrode, and one end of the conductor pattern are connected via the first interlayer connection conductor.
  • the other end of the conductor pattern and the other end of the coil element are connected via the second interlayer connection conductor, and the first land and one end of the coil element are connected. Since capacitance occurs between the first and second lands and the second electrode, the resonant frequency of the RFID module can be lowered.
  • the substrate further includes a third substrate layer on which the second main surface side of the second substrate layer is laminated.
  • the third substrate layer can protect the conductor pattern arranged on the second main surface side of the second substrate layer.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Coils Or Transformers For Communication (AREA)
PCT/JP2023/037062 2022-10-14 2023-10-12 Ｒｆｉｄモジュール Ceased WO2024080331A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202380050655.7A CN119452522A (zh) 2022-10-14 2023-10-12 Rfid模块
DE112023002274.7T DE112023002274T5 (de) 2022-10-14 2023-10-12 RFID-Modul
JP2024551748A JP7704310B2 (ja) 2022-10-14 2023-10-12 Ｒｆｉｄモジュール
US18/985,394 US20250117621A1 (en) 2022-10-14 2024-12-18 Rfid module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-165734 2022-10-14
JP2022165734 2022-10-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/985,394 Continuation US20250117621A1 (en) 2022-10-14 2024-12-18 Rfid module

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Publication Number Publication Date
WO2024080331A1 true WO2024080331A1 (ja) 2024-04-18

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PCT/JP2023/037062 Ceased WO2024080331A1 (ja) 2022-10-14 2023-10-12 Ｒｆｉｄモジュール

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US (1) US20250117621A1 (https=)
JP (1) JP7704310B2 (https=)
CN (1) CN119452522A (https=)
DE (1) DE112023002274T5 (https=)
WO (1) WO2024080331A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007041666A (ja) * 2005-08-01 2007-02-15 Ricoh Co Ltd Ｒｆｉｄタグ及びその製造方法
JP2012216996A (ja) * 2011-03-31 2012-11-08 Nippon Sheet Glass Co Ltd アンテナ用コイル装置
WO2018101315A1 (ja) * 2016-12-02 2018-06-07 株式会社村田製作所 Ｒｆｉｄタグ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007041666A (ja) * 2005-08-01 2007-02-15 Ricoh Co Ltd Ｒｆｉｄタグ及びその製造方法
JP2012216996A (ja) * 2011-03-31 2012-11-08 Nippon Sheet Glass Co Ltd アンテナ用コイル装置
WO2018101315A1 (ja) * 2016-12-02 2018-06-07 株式会社村田製作所 Ｒｆｉｄタグ

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