WO2024079911A1 - Machine de montage de composants - Google Patents

Machine de montage de composants Download PDF

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Publication number
WO2024079911A1
WO2024079911A1 PCT/JP2022/038470 JP2022038470W WO2024079911A1 WO 2024079911 A1 WO2024079911 A1 WO 2024079911A1 JP 2022038470 W JP2022038470 W JP 2022038470W WO 2024079911 A1 WO2024079911 A1 WO 2024079911A1
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WO
WIPO (PCT)
Prior art keywords
light
component
laser
component mounter
housing
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Application number
PCT/JP2022/038470
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English (en)
Japanese (ja)
Inventor
貴規 ▲高▼木
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株式会社Fuji
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Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/038470 priority Critical patent/WO2024079911A1/fr
Publication of WO2024079911A1 publication Critical patent/WO2024079911A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Definitions

  • the technology disclosed in this specification relates to component mounters.
  • Component mounters that mount components on a board are well known.
  • Conventional component mounters are equipped with a conveyor that transports boards into and out of the work space inside the housing, and a head that mounts components on the board that has been transported in.
  • a reflow device has generally been used as a means for joining the mounted components to the board. In this case, the board is heated in the reflow device, and the components and board are soldered together.
  • a technology has been proposed in which a laser device is provided in the component mounter, and a joining material such as solder is heated and melted by irradiating the board with a laser. Examples of this type of component mounter include the conventional technology disclosed in Japanese Patent Application Laid-Open No. 60-162574 and Japanese Patent Application Laid-Open No. 61-224395.
  • the entrance for loading the board and the exit for unloading the board are open on both sides of the housing. This means that there is a possibility that the laser may leak from these openings when the laser device is in use. Therefore, component mounting machines equipped with a laser device require safety measures to prevent the laser from leaking outside the device.
  • This specification provides technology for safely performing component mounting work using a laser device.
  • a component mounting machine including a conveyor, a head, a laser device, a housing, and a light-shielding unit.
  • the conveyor carries a board into a working space and carries it out of the working space.
  • the head mounts components on the board carried into the working space.
  • the laser device irradiates a laser onto the board or the components mounted on the board.
  • the housing has an entrance for carrying the board into the working space and an exit for carrying the board out of the working space.
  • the housing houses the conveyor, the head, and the laser device, and surrounds the working space.
  • the light-shielding unit has a light-shielding plate. The light-shielding plate is provided at least one of the entrance and the exit.
  • the light-shielding plate blocks at least one of the entrance and the exit when the laser device is in use, preventing leakage of the laser. Therefore, according to the above-mentioned configuration, the laser does not leak through the entrance and the exit, so that component mounting work can be performed safely using the laser device.
  • FIG. 1 is a schematic perspective view showing a component mounter according to an embodiment of the present invention
  • 1 is a schematic cross-sectional side view showing a component mounter according to an embodiment of the present invention
  • 1 is a schematic front sectional view showing a component mounter according to an embodiment of the present invention
  • FIG. 11 is a rear view showing the light blocking unit (closed state) in the component mounter of the embodiment.
  • FIG. 13 is a rear view showing the light blocking unit (open state) in the component mounter of the embodiment.
  • 4 is a flowchart for explaining the operation of the component mounter of the embodiment.
  • the light-shielding unit may be switchable between an open state that allows the board to pass through at least one of the entrance and exit, and a closed state that blocks at least one of the entrance and exit, by driving the light-shielding plate.
  • the light blocking unit may include an air cylinder that drives the light blocking plate to slide up and down.
  • the light blocking plate is slid up and down to open and close the loading entrance or exit, which makes it possible to prevent the space required for placing the light blocking unit from becoming too large.
  • the light shielding unit may be configured as a thin plate and may be attached in a detachable manner to the outer surface of the housing. With this configuration, the light shielding unit can be attached only to component mounters that require it.
  • the light-shielding unit may be controlled to maintain a closed state while the laser device is operating.
  • the light-shielding plate is in a closed state while the laser device is operating, so that leakage of the laser from the inlet or outlet can be effectively suppressed.
  • the component mounting machine disclosed in this specification may further include a monitoring device that monitors the operating state of the light-shielding unit. If the monitoring device detects that the light-shielding plate is not in a closed state, the laser device may be stopped. With this configuration, component mounting work can be performed more safely.
  • the housing may have a window, and the window may be provided with a resin plate capable of blocking the laser emitted from the laser device.
  • the housing may include a housing body and a cover that is removably attached to at least one of the faces of the housing body on the entrance side and the exit side.
  • the light-shielding unit may be provided on the cover.
  • the cover may also have a window portion. With this configuration, the cover is attached only to the face where the light-shielding unit or window portion is required.
  • Fig. 1 is a schematic perspective view of the component mounter 11 of Example 1
  • Fig. 2 is a schematic side cross-sectional view of the component mounter 11
  • Fig. 3 is a schematic front cross-sectional view of the component mounter 11. Note that Figs. 1 to 3 show a simplified depiction of the component mounter 11. XYZ coordinates are also defined in the figures.
  • the component mounter 11 is a device for mounting components 2 on a board 1. As shown in FIG. 1, multiple component mounters 11 are arranged side by side in one direction (i.e., the X-axis direction). In FIG. 1, two component mounters 11 are arranged side by side, but this is not limited to this, and three or more component mounters 11 may be arranged side by side. For ease of explanation, the component mounter 11 located on the left side of FIG. 1 may be called the "previous stage component mounter 11A," and the component mounter 11 located on the right side of FIG. 1 may be called the "next stage component mounter 11B.” The board 1 is transported sequentially from the previous stage component mounter 11A to the subsequent stage component mounter 11B. Each component mounter 11 mounts components on the board 1 that is transported sequentially. In other words, multiple mounting processes are performed on one board 1 by multiple component mounters 11.
  • the component mounter 11 includes a conveyor 21, a display device 26, a component feeder 31, an XY robot 36, a head unit 41, a control device 46, a laser device 51, a component pressing head 52, a housing 61, a light shielding unit 71, etc.
  • the conveyor 21 is a device for carrying the board 1 into the working space 22 within the device, and carrying the board 1 out of the working space 22 after components are mounted on it.
  • the conveyor 21 is equipped with a support device (not shown) that supports the board 1 from below, and a drive device (not shown) for driving the conveyor.
  • the conveyor 21 transports the board 1 from the negative to the positive direction of the X-axis (from left to right in Figures 1 and 3).
  • Conveyors 23A and 23B are also installed upstream of the component mounter 11A in the front stage and downstream of the component mounter 11B in the rear stage, respectively.
  • the conveyors 21, 23A, and 23B form a board transport line 24.
  • the XY robot 36 is a moving mechanism that moves the head unit 41 between above the component feeder 31 and above the board 1 by moving the moving bases 36a and 36b in the X and Y directions.
  • the XY robot 36 is composed of guide rails that guide the moving bases 36a and 36b, a moving mechanism that moves the moving bases 36a and 36b along the guide rails, and a motor that drives the moving mechanism.
  • the XY robot 36 is housed inside the housing 61 and is positioned above the board 1.
  • a head unit 41 is attached to the moving bases 36a and 36b. The head unit 41 moves in the space from above the component feeder 31 to above the board 1 by the XY robot 36.
  • Each component feeder 31 stores multiple components 2.
  • the component feeder 31 is detachably attached to the feeder holding portion 32 and supplies the components 2 to the head unit 41.
  • the specific configuration of the component feeder 31 is not limited. For example, it may be a tape type feeder that stores multiple components 2 on a tape, a tray type feeder that stores multiple components 2 on a tray, or a bulk type feeder that stores multiple components 2 randomly in a container.
  • the head unit 41 is a movable unit that mounts the components 2 on the board 1.
  • the head unit 41 includes a holder 41a and a component mounting head 41b.
  • the holder 41a is attached to the underside of the moving base 36b.
  • the component mounting head 41b is detachably supported by the holder 41a.
  • the component mounting head 41b includes a plurality of suction nozzles 42.
  • the plurality of suction nozzles 42 are detachably supported by the component mounting head 41b.
  • the plurality of suction nozzles 42 are raised and lowered in the vertical direction (Z direction in the drawing) by an actuator (not shown) housed in the component mounting head 41b, and are configured to be able to pick up the components 2.
  • the laser device 51 and the component pressing head 52 are attached near the holder 41a on the underside of the moving base 36b.
  • the component pressing head 52 presses the component 2 mounted on the board 1 to temporarily fix it before bonding.
  • the laser device 51 is a device for heating and melting the bonding material (e.g. solder) between the board 1 and the component 2, and is provided on both sides of the component pressing head 52.
  • the pair of laser devices 51 generate a high-class laser and output the high-class laser downward.
  • the high-class laser is deflected diagonally downward by a mirror (not shown) and is irradiated onto the board 1 or the component 2 mounted on the board 1.
  • the suction nozzle 42 is moved downward until the suction surface of the suction nozzle 42 comes into contact with the component 2 contained in the component feeder 31.
  • the suction nozzle 42 picks up the component 2, and the suction nozzle 42 is moved upward.
  • the XY robot 36 is driven to position the component mounting head 41b with respect to the board 1.
  • the suction nozzle 42 is lowered toward the board 1, so that the component 2 is placed on the board 1.
  • the component pressing head 52 is moved above the component 2 mounted on the board 1.
  • the pressing part of the component pressing head 52 is lowered toward the component 2, so that the upper surface of the component 2 is pressed and the component 2 is temporarily fixed to the board 1.
  • a high-class laser is output from the laser device 51 toward the board 1 to heat and melt the joining material, thereby completely joining the component 2 to the board 1.
  • the housing (61, 62) houses the component feeder 31, the XY robot 36, the head unit 41, the laser device 51, the component pressing head 52, etc., and surrounds the working space 22.
  • the housing (61, 62) includes a housing body 61 and a side cover 62 (one example of a cover) that is removably attached to the side 61a of the housing body 61. Openings 61b are formed on both side surfaces 61a of the housing body 61.
  • a side cover 62 is attached to the side surface 61a on the negative side of the X-axis of the housing body 61 of the preceding stage component mounter 11A, and the opening 61b formed on the side surface 61a is closed by the side cover 62.
  • a horizontally elongated rectangular entrance 64 is formed in the side cover 62 for carrying the board 1 into the component mounter 11A.
  • the entrance 64 is provided at approximately the same height as the top surface of the conveyor 21.
  • the side cover 62 is not attached to the side surface 61a on the positive X-axis side of the housing body 61 of the previous stage component mounter 11A, and the opening 61b formed in the side surface 61a on the positive X-axis side is not closed. Therefore, in the previous stage component mounter 11A, the opening 61b formed in the side surface 61a on the positive X-axis side functions as an "export" for carrying the board 1 out of the component mounter 11A.
  • a side cover 62 is attached to the side surface 61a on the X-axis positive side of the housing body 61 of the later stage component mounter 11B, and the opening 61b formed in the side surface 61a is closed by the side cover 62.
  • This side cover 62 has a horizontally long rectangular carry-out port 65 for carrying the board 1 out of the component mounter 11B.
  • the carry-out port 65 is provided at approximately the same height as the upper surface of the conveyor 21.
  • the side cover 62 is not attached to the side surface 61a on the X-axis negative side of the housing body 61 of the later stage component mounter 11B, and the opening 61b formed in the side surface 61a on the X-axis negative side is not closed. Therefore, in the later stage component mounter 11B, the opening 61b formed in the side surface 61a on the X-axis negative side functions as an "entrance" for carrying the board 1 into the component mounter 11B.
  • the side surface 61a on the positive side of the X-axis of the front stage component mounter 11A and the side surface 61a on the negative side of the X-axis of the rear stage component mounter 11B are arranged in close proximity (e.g., with a gap of several mm between them). Therefore, even if the side covers 62 are not attached to these side surfaces 61a, there is no problem with the laser leaking from the gap between the front stage component mounter 11A and the rear stage component mounter 11B.
  • the side cover 62 has a rectangular window 67 formed at a position above and toward the front of the carry-in entrance 64 or the carry-out exit 65, for visually checking the inside of the device.
  • the window 67 is provided with a resin plate 57 that can block the laser irradiated from the laser device 51.
  • a display device 26 is provided on the upper part of the front surface 63 of the housing 61.
  • the display device 26 is a display for displaying various information.
  • the display device 26 may function as an operation device (a so-called touch panel) for receiving instructions from a user.
  • an operation device such as a keyboard may be provided.
  • a rectangular window portion 66 for visually checking the inside of the device is formed in the front surface 63 of the housing 61 below the display device 26.
  • the window portion 66 is also provided with a resin plate 56 capable of blocking the laser irradiated from the laser device 51.
  • the control device 46 is a device that controls each part in the component mounter 11, and is configured as, for example, a microprocessor centered around a CPU. In addition to the CPU, the control device 46 is equipped with a ROM, HDD, RAM, an input/output interface, etc. These are connected to each other so that they can communicate with each other via a bus.
  • the control device 46 is connected to the conveyor 21, the display device 26, the component feeder 31, the XY robot 36, the head unit 41, the control device 46, the laser device 51, the component pressing head 52, the shading unit 71, etc. so that they can communicate with each other.
  • the control device 46 controls each part to mount the components 2 on the board 1, transport the board 1, display various information, etc.
  • the component mounter 11 of this embodiment is equipped with a light shielding unit 71 as shown in Figures 4 and 5.
  • Figure 4 is a rear view showing the light shielding unit 71 in a closed state
  • Figure 5 is a rear view showing the light shielding unit in an open state.
  • the light shielding unit 71 is a device for preventing leakage of laser light by blocking at least one of the inlet 64 and the outlet 65 when the laser device 51 is in use.
  • the light shielding unit 71 is provided on the outer surface of the component mounter 11. More specifically, in the component mounter 11A in the front stage, the light shielding unit 71 is provided on the side cover 62 on the negative side of the X-axis. In the component mounter 11B in the rear stage, the light shielding unit 71 is provided on the side cover 62 on the positive side of the X-axis.
  • the light shielding unit 71 is configured as a thin plate overall. Specifically, the light shielding unit 71 is thin enough to be placed in the narrow space between the side cover 62 of the component mounter 11A in the front stage and the conveyor 23A on the upstream side thereof, and in the narrow space between the side cover 62 of the component mounter 11B in the rear stage and the conveyor 23B on the downstream side thereof.
  • the unit body 73 constituting the light shielding unit 71 is formed so as to be detachable from the outside of the side cover 62 of the housing 61.
  • the unit body 73 has openings 72 of the same size and shape as the inlet 64 and the outlet 65 at positions corresponding to them.
  • a thin air cylinder 75 is attached facing upwards below the opening 72 on the back side of the unit body 73.
  • a light shielding plate 79 is supported and fixed to the tip of the rod 76 of the air cylinder 75 via a support bracket 77.
  • the light shielding plate 79 is a flat member that blocks the inlet 64 or the outlet 65 when the laser device 51 is in use to prevent leakage of the laser. Therefore, the light shielding plate 79 is formed in a horizontally elongated rectangular shape that is slightly larger than the entrance 64 and the exit 65. In addition, the light shielding plate 79 is disposed in contact with the side cover 62 of the housing 61.
  • a solenoid valve 80 which is an electromagnetic valve for switching the flow path, is attached to the left of the air cylinder 75 on the back side of the unit body 73.
  • the solenoid valve 80 is electrically connected to the control device 46 and is driven and controlled by the control device 46.
  • a maintenance cover 74 is provided in an openable and closable manner in the area between the air cylinder 75 and the solenoid valve 80 in the unit body 73.
  • the front end port of the air cylinder 75 and the solenoid valve 80 are connected via a first air flow path 81.
  • the rear end port of the air cylinder 75 and the solenoid valve 80 are connected via a second air flow path 82.
  • Pressurized air is supplied to the solenoid valve 80 from an air supply source (not shown) via a main air flow path 78.
  • position detection sensors 75a and 75b such as limit switches and MR sensors are provided on the front and rear ends of the air cylinder 75, respectively.
  • the position detection sensors 75a and 75b are electrically connected to the control device 46.
  • the air cylinder 75 When pressurized air is supplied to the second air flow path 82 by switching the solenoid valve 80, the air cylinder 75 extends and the light shielding plate 79 is slid toward the upper end position where the opening 72 is located (see FIG. 4). At this time, the light shielding plate 79 blocks the inlet 64 and the outlet 65, and the light shielding unit 71 enters a closed state that does not allow the substrate 1 to pass through the inlet 64 and the outlet 65. In the closed state, the front end position detection sensor 75a outputs an ON signal to the control device 46, and the rear end position detection sensor 75b outputs an OFF signal.
  • the air cylinder 75 contracts and the light shielding plate 79 is slid toward the lower end position, retreated from the position where the opening 72 is located (see FIG. 5).
  • the light shielding plate 79 opens the inlet 64 and the outlet 65, and the light shielding unit 71 is in an open state that allows the substrate 1 to pass through the inlet 64 and the outlet 65.
  • the front end position detection sensor 75a outputs an OFF signal to the control device 46
  • the rear end position detection sensor 75b outputs an ON signal.
  • control device 46 and the position detection sensors 75a and 75b constitute a monitoring device that monitors the operating state of the light shielding unit 71.
  • the control device 46 controls the light shielding unit 71 to maintain a closed state while the laser device 51 is operating. Then, when the control device 46 detects that the light shielding plate 79 is not in a closed state, it stops the laser device 51.
  • a resin plate capable of blocking high-class laser is used as the light-shielding plate 79.
  • a resin plate is appropriately selected taking into consideration the wavelength and OD value (optical density) of the high-class laser to be used.
  • the laser device 51 is a YAG laser that generates a laser with a wavelength of about 950 nm to 1150 nm
  • a colored resin plate made of acrylic resin with an OD value of 6 or more may be used.
  • the colored resin plate may be made of methacrylic resin, vinyl chloride, polycarbonate, polyethylene terephthalate, etc., other than acrylic resin.
  • the above-mentioned resin plates 56 and 57 are also formed using the same resin plate as the light-shielding plate 71.
  • the control device 46 executes the following steps according to the light shielding unit control program.
  • the control device 46 drives the conveyor 21 to carry the substrate 1 outside the device into the work space 22 inside the device (step S110).
  • the control device 46 drives a clamping device (not shown) to position and clamp the substrate 1 at the work position (step S120).
  • the control device 46 drives the air cylinder 75 of the light shielding unit 71 to raise the light shielding plate 79 (step S130).
  • control device 46 reads the output signals from the position detection sensors 75a and 76b, and determines whether the light shielding plate 79 is at the upper end position (i.e., whether the light shielding plate 79 is in a closed state) (step S140). If the control device 46 determines that the light-shielding plate 79 is not at the upper end position (NO in step S140), the control device 46 proceeds to step S145 to stop the laser device 51, and then returns to step S130. At this time, various devices other than the laser device 51 (conveyor 21, XY robot 36, component mounting head 41b, component pressing head 52, etc.) are also maintained in a stopped state.
  • step S140 the control device 46 determines whether or not the light-shielding plate 79 is at the upper end position. If the control device 46 determines that the light-shielding plate 79 is at the upper end position (YES in step S140), the control device 46 proceeds to the next step S150.
  • step S150 the control device 46 determines whether or not the component mounting work on the board 1 has been completed. If the control device 46 determines that the component mounting work has not yet been completed (NO in step S150), the control device 46 proceeds to the next step S160.
  • step S160 the control device 46 drives the XY robot 36, the component mounting head 41b, the component pressing head 52, and the laser device 51 to perform a component mounting operation accompanied by laser heating, and then returns to step S150.
  • step S150 the control device 46 determines that the component mounting operation is completed (YES in step S150). If the control device 46 determines that the component mounting operation is completed (YES in step S150), the control device 46 proceeds to step S170. In step S170, the control device 46 drives the clamp device to unclamp the board 1. Next, the control device 46 drives the air cylinder 75 of the light shielding unit 71 to lower the light shielding plate 79 (step S180). Next, the control device 46 reads the output signals from the position detection sensors 75a and 76b, and determines whether the light shielding plate 79 is at the lower end position (i.e., whether the light shielding plate 79 is in an open state) (step S190).
  • control device 46 determines that the light shielding plate 79 is not at the bottom end position (NO in step S190) If the control device 46 determines that the light shielding plate 79 is not at the bottom end position (NO in step S190), the control device 46 returns to step S180 and lowers the light shielding plate 79. If the control device 46 determines that the light shielding plate 79 is at the bottom end position (YES in step S190), the control device 46 proceeds to the next step S200, drives the conveyor 21, and transports the board 1 after component mounting out of the device.
  • the light shielding unit 71 is provided at least at one of the entrance 64 and the exit 65, and the light shielding plate 79 of the light shielding unit 71 closes at least one of the entrance 64 and the exit 65 when the laser device 51 is in use, preventing the laser from leaking therethrough. Therefore, according to the component mounter 11 of this embodiment, the laser does not leak through the entrance 64 and the exit 65, so component mounting work can be performed safely using the laser device 51.
  • the light shielding unit 71 can be switched between an open state that allows the board 1 to pass through the inlet 64 or the outlet 65, and a closed state that blocks the inlet 64 or the outlet 65, by driving the light shielding plate 79.
  • the light shielding plate 79 blocks the inlet 64 or the outlet 65, thereby preventing leakage of laser through the inlet 64 or the outlet 65.
  • the inlet 64 or the outlet 65 is open, allowing the board 1 to pass through the inlet 64 or the outlet 65, and the board 1 can be loaded and unloaded without hindrance.
  • the light shielding unit 71 drives the light shielding plate 79 to slide up and down by the air cylinder 75.
  • the air cylinder 75 as a driving method, the light shielding unit 71 can have a relatively simple and compact structure.
  • the pressurized air supplied to the component mounter 11 can be used as the driving source, there is no need to use a large driving source such as a motor, and space can be saved.
  • the light shielding unit 71 is configured as a thin plate and is attached to the outer surface of the housing 61 in a detachable state. Therefore, even when an existing component mounter 11 is used, the light shielding unit 71 can be easily retrofitted even if the installation space for the light shielding unit 71 is narrow.
  • the component mounter 11 of this embodiment further includes a monitoring device that monitors the operating state of the light-shielding unit 71, and when the monitoring device detects that the light-shielding plate 79 is not in a closed state, the laser device 51 is stopped. This ensures that the light-shielding unit 71 remains in a closed state while the laser device 51 is in operation.
  • the housing 61 is provided with windows 66, 67, and the windows 66, 67 are provided with resin plates 56, 57 that can block the laser emitted from the laser device 51. This makes it possible to prevent the laser from leaking through the windows 66, 67, and allows for safe visual inspection of the inside of the device.
  • the light shielding unit 71 is used in which the light shielding plate 79 is driven to slide vertically by the air cylinder 75 to open and close, but the present invention is not limited to this configuration.
  • a light shielding unit 71 may be used in which the light shielding plate 79 is driven to slide horizontally by the air cylinder 75 to open and close, or a light shielding unit 71 in which the light shielding plate 79 is rotated by the air cylinder 75 to open and close.
  • the air cylinder 75 is disposed below the light-shielding plate 79, and a drive system is adopted in which the light-shielding plate 79 is raised to a closed state, but this configuration is not limited to the above.
  • a drive system may be adopted in which the air cylinder 75 is disposed above the light-shielding plate 79, and the light-shielding plate 79 is lowered to a closed state.
  • the light shielding plate 79 in the light shielding unit 71 is driven by the air cylinder 75, but this configuration is not limited to this.
  • the light shielding plate 79 may be driven by a fluid pressure actuator other than the air cylinder 75, or may be driven by an electric actuator.
  • the laser device 51 is provided on both sides of the component pressing head 52, but this configuration is not limited to this.
  • the laser device 51 may be provided on only one side of the component pressing head 52.
  • the laser device 51 may also be provided in a location separate from the component pressing head 52.
  • the laser device 51 may be integrated with the head unit 41, and the component pressing head 52 may not be provided.
  • the component mounting operation by the nozzle 42 may also serve as the component pressing operation, and heating by the laser device 51 may be performed in conjunction with this component mounting operation.
  • the control device 46 controls not only the laser device 51 but also various other devices to stop, but this configuration is not limited to this.
  • the laser device 51 may be stopped in this case, while devices other than the laser device 51 may be controlled to operate.
  • the camera may be operated to recognize the alignment mark
  • the clamping device may be operated to clamp or unclamp the substrate 1
  • the head exchange device may be operated to exchange the head.
  • the component 2 can be mounted without using the laser device 51
  • the XY robot 36, component mounting head 41b, etc. may be operated to mount the component 2 on the substrate 1.
  • the laser device 51 is used to melt the solder when joining the component 2 to the substrate 1, but this configuration is not limited to this.
  • the laser device 51 may be used for baking or trimming the conductive metal paste printed on the substrate 1.
  • the laser device 51 may also be used for marking the substrate 1 and the component 2.
  • the light-shielding plate 79 and the resin plates 56, 57 are formed using resin plates of the same material (colored acrylic resin plates), but this is not limited to the configuration.
  • the light-shielding plate 79 and the resin plates 56, 57 may be formed using resin plates of different materials.
  • the operating state of the light-shielding plate 79 is monitored by a monitoring device, and if it is detected that the light-shielding plate 79 is not in a blocked state, the laser device 51 is stopped, but this configuration is not limited to this.
  • a monitoring device for the window portion that also monitors the resin plates 56 and 57 may be provided, and if it is detected that either of these is not in a blocked state, the laser device 51 may be stopped.
  • the sides of the two component mounters 11A, 11B are very close to each other, but this configuration is not limited to this.
  • the sides of the two component mounters 11A, 11B may be spaced apart to a certain extent.
  • a side cover 62 may be attached to the side of the front-stage component mounter 11A, and a side cover 62 may be attached to the side of the rear-stage component mounter 11B, and a light-shielding unit 71 may be attached to each of these side covers 62.
  • two component mounters 11 are arranged side by side to perform component mounting, but this configuration is not limited to this.
  • component mounting may be performed using only one component mounter 11.
  • a light shielding unit 71 may be attached to both the entrance 64 and the exit 65 of the component mounter 11.
  • this specification also discloses the technical idea of changing "the component mounter according to any one of claims 2 to 4" in claim 6 to "the component mounter according to any one of claims 2 to 5", the technical idea of changing “the component mounter according to any one of claims 1 to 4" in claim 7 to “the component mounter according to any one of claims 1 to 6", and the technical idea of changing “the component mounter according to any one of claims 1 to 4" in claim 8 to "the component mounter according to any one of claims 1 to 7".

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  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Est divulguée une machine de montage de composants qui comprend un transporteur, une tête, un dispositif laser, un boîtier et une unité de blocage de lumière. Le transporteur charge un substrat dans un espace de travail, et décharge le substrat à partir de l'espace de travail. La tête monte un composant sur le substrat chargé dans l'espace de travail. Le dispositif laser irradie le substrat ou le composant monté sur le substrat avec un laser. Le boîtier comprend une ouverture de chargement pour charger le substrat, et une ouverture de déchargement pour décharger le substrat. Le boîtier loge le transporteur, la tête et le dispositif laser, et entoure l'espace de travail. L'unité de blocage de lumière comprend des plaques de blocage de lumière. Les plaques de blocage de lumière sont disposées dans l'ouverture de chargement et l'ouverture de déchargement. Les plaques de blocage de lumière ferment l'ouverture de chargement et l'ouverture de déchargement pendant une utilisation du dispositif laser pour empêcher une fuite du laser.
PCT/JP2022/038470 2022-10-14 2022-10-14 Machine de montage de composants WO2024079911A1 (fr)

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PCT/JP2022/038470 WO2024079911A1 (fr) 2022-10-14 2022-10-14 Machine de montage de composants

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06164196A (ja) * 1992-11-27 1994-06-10 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2012119486A (ja) * 2010-11-30 2012-06-21 Panasonic Corp 可搬型データ取得装置、および、実装精度評価システム
JP2014099555A (ja) * 2012-11-15 2014-05-29 Yamaha Motor Co Ltd 基板作業システム、基板搬送装置および基板作業装置
JP2017199709A (ja) * 2016-04-25 2017-11-02 パナソニックＩｐマネジメント株式会社 部品実装装置
WO2019016933A1 (fr) * 2017-07-21 2019-01-24 株式会社Ｆｕｊｉ Système de travail de substrat

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06164196A (ja) * 1992-11-27 1994-06-10 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2012119486A (ja) * 2010-11-30 2012-06-21 Panasonic Corp 可搬型データ取得装置、および、実装精度評価システム
JP2014099555A (ja) * 2012-11-15 2014-05-29 Yamaha Motor Co Ltd 基板作業システム、基板搬送装置および基板作業装置
JP2017199709A (ja) * 2016-04-25 2017-11-02 パナソニックＩｐマネジメント株式会社 部品実装装置
WO2019016933A1 (fr) * 2017-07-21 2019-01-24 株式会社Ｆｕｊｉ Système de travail de substrat

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