WO2024078541A1 - 一种压焊带工装 - Google Patents

一种压焊带工装 Download PDF

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Publication number
WO2024078541A1
WO2024078541A1 PCT/CN2023/124053 CN2023124053W WO2024078541A1 WO 2024078541 A1 WO2024078541 A1 WO 2024078541A1 CN 2023124053 W CN2023124053 W CN 2023124053W WO 2024078541 A1 WO2024078541 A1 WO 2024078541A1
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WIPO (PCT)
Prior art keywords
pressing
press
pin
pressure
needle
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PCT/CN2023/124053
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English (en)
French (fr)
Inventor
仇科健
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无锡奥特维科技股份有限公司
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Publication of WO2024078541A1 publication Critical patent/WO2024078541A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present application is set in the field of battery production, specifically a pressure welding strip tooling.
  • the battery cell and the soldering tape are arranged in a predetermined order, and the soldering tape covers the glue point of the corresponding battery cell. Then, the soldering tape is pressed tightly on the battery cell using a soldering tape pressing tool.
  • the glue point is UV glue
  • the battery cell is irradiated with a UV light source, and the soldering tape is melted by the light and bonded to the battery cell.
  • the traditional press welding tool is a steel plate with a press pin, which presses the welding tape onto the battery cell.
  • the glue spots on the battery cell are dense, and the press pins can easily press on the glue spots, causing tooling contamination and affecting the reuse of the tooling.
  • the press pins are generally opaque metal press pins, and UV light is difficult to directly irradiate the glue spots, affecting the curing effect of the glue spots, and further affecting the bonding effect.
  • a press-welding strip tooling includes a press-pin mounting plate and a plurality of press-pin rows mounted on the press-pin mounting plate, each press-pin row including a plurality of press-pins, wherein:
  • Each row of press pins is used to press a solder ribbon onto the glue point of the battery cell
  • the pressing pin is a light-transmitting pressing pin.
  • the glue point is located at the light-transmitting part of the pressing pin.
  • An anti-sticking layer is provided on at least the bottom surface of the pressing pin that contacts the solder strip.
  • the press pin of the welding tape tool provided by the present application is a light-transmitting press pin.
  • the glue point is located at the light-transmitting part of the press pin, so that UV light can be directly irradiated to the glue point through the press pin, thereby ensuring the curing effect of UV light on the glue point.
  • an anti-sticking layer is provided on the bottom surface of the press pin in contact with the welding tape, so that the bottom surface of the press pin will not be adhered to the glue material, thereby realizing anti-pollution protection of the welding tape tool.
  • the pressing needle is a hollow structure, and a through hole is formed inside the pressing needle, which runs through from top to bottom.
  • the glue dot is located at the through hole, and UV light irradiates the glue dot through the through hole.
  • UV light can directly irradiate the glue point through the through hole in the pressing needle.
  • the through hole includes an upper through hole section and a lower through hole section, wherein the aperture of the upper through hole section is smaller than the aperture of the lower through hole section, and the upper through hole section and the lower through hole section are connected via a tapered hole section whose aperture gradually expands from top to bottom.
  • a tapered hole section with a gradually expanding aperture from top to bottom is formed between the upper through hole section and the lower through hole section, so that the UV light reflected from the battery cell to the hole wall of the tapered hole section can be reflected back to the glue point again, thereby reducing light loss and further improving the curing effect of the UV light.
  • the pressing pins are made of a light-transmitting material.
  • the pressing pins cover the glue dots, and UV light shines through the pressing pins to illuminate the glue dots.
  • the pressing needle is made of light-transmitting material, and the entire pressing needle is light-transmitting. Therefore, when the pressing needle presses the solder strip, UV light can pass through the pressing needle and irradiate onto the glue point.
  • the pressing needle is a PC pressing needle, an acrylic pressing needle or a glass pressing needle.
  • PC pressing pins, acrylic pressing pins or glass pressing pins have excellent light transmittance and can ensure the curing effect of the glue points.
  • a glue point avoidance groove is provided at the bottom of the pressing needle.
  • the glue point avoidance groove can reduce the contact area between the bottom of the pressing needle and the glue point, thereby further reducing the contamination of the pressing needle by the glue point.
  • the release layer is a transparent or translucent release film or release coating.
  • the transmittance of UV light can be effectively improved to ensure the curing effect of the glue points;
  • the anti-sticking layer is in the form of lamination or coating, and the process is simple and easy to implement.
  • the anti-sticking layer is a Teflon anti-sticking film or a Teflon anti-sticking coating.
  • Teflon anti-stick film and Teflon anti-stick coating have good anti-stick properties, low friction coefficient, good wear resistance, high temperature resistance and light transmittance, and are very suitable as the anti-stick layer at the bottom of the pressing needle in this application.
  • a pressure needle mounting hole that passes through the pressure needle mounting plate is provided on the pressure needle mounting plate, and the pressure needle is slidably connected in the pressure needle mounting hole; the upper end of the pressure needle extends upward from the pressure needle mounting hole, and a limiting retaining ring is provided at the upper end of the pressure needle; the lower end of the pressure needle extends downward from the pressure needle mounting hole, and a spring limiting portion is provided on the side wall of the pressure needle; a spring is provided on the pressure needle, the upper end of the spring rests on the pressure needle mounting plate, and the lower end of the spring rests on the spring limiting portion.
  • the pressing needle can elastically press the solder ribbon onto the glue point to prevent the pressing needle from damaging the solder ribbon and the battery cell, and ensure that each pressing needle can effectively press the solder ribbon.
  • the pressure pin mounting plate is a hollow frame plate or a whole panel.
  • Using a hollow frame plate as a pressure needle mounting plate can reduce the weight of the pressure welding strip tooling; while using a whole panel as a pressure needle mounting plate makes the structure of the pressure welding strip tooling more concise.
  • FIG1 is a schematic structural diagram of a pressure welding strip tooling according to an embodiment of the present application at a viewing angle
  • FIG2 is a schematic structural diagram of a pressure welding strip tooling according to an embodiment of the present application from another perspective;
  • Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2;
  • FIG4 is a schematic diagram of the structure of a pressing needle in one embodiment of the present application.
  • Fig. 5 is a cross-sectional view taken along line B-B of Fig. 4;
  • FIG6 is a schematic structural diagram of a pressure welding strip tooling according to another embodiment of the present application at a viewing angle
  • FIG7 is a schematic structural diagram of a pressure welding strip tooling according to another embodiment of the present application from another viewing angle;
  • Fig. 8 is a cross-sectional view taken along line C-C of Fig. 7;
  • Figures 1 to 8 include:
  • Press needle mounting plate 1 press needle row 2, press needle 3, through hole 4, limit retaining ring 5, spring 6, glue dot avoidance groove 7, spring limit part 31, upper through hole section 41, lower through hole section 42, tapered hole section 43.
  • the traditional press welding tool is a steel plate with a press pin, which presses the welding tape onto the battery cell.
  • the glue spots on the battery cell are dense, and the press pins can easily press on the glue spots, causing tooling contamination and affecting the reuse of the tooling.
  • the press pins are generally opaque metal press pins, and UV light is difficult to directly irradiate the glue spots, affecting the curing effect of the glue spots, and further affecting the bonding effect.
  • the present application provides a pressure welding strip tooling, which can ensure that the UV light is fully irradiated on the glue point, thereby ensuring the curing effect of the UV light on the glue point, and will not stick to the glue.
  • the following will use two embodiments to exemplarily introduce the pressure welding strip tooling of the present application.
  • the pressure welding strip tooling of this embodiment includes a pressure pin mounting plate 1 and a plurality of pressure pin rows 2 mounted on the pressure pin mounting plate 1 , each pressure pin row 2 includes a plurality of pressure pins 3 , wherein:
  • Each row of pressing pins 2 is used to press a solder strip onto a glue point of a battery cell.
  • the pressing needle 3 is a light-transmitting pressing needle.
  • the glue point is located at the light-transmitting part of the pressing needle 3.
  • An anti-sticking layer is provided on at least the bottom surface of the pressing needle 3 that contacts the solder strip.
  • the pressing needle 3 is a light-transmitting pressing needle, when the pressing needle row 2 presses the solder strip, the glue point is located at the light-transmitting part of the pressing needle 3, so that the UV light can be directly irradiated to the glue point through the pressing needle 3, thereby ensuring the curing effect of the UV light on the glue point.
  • the bottom surface of the pressing needle 3 in contact with the solder strip is provided with an anti-sticking layer, the bottom surface of the pressing needle 3 has anti-sticking properties, thereby realizing anti-pollution protection of the solder strip pressing tooling.
  • a pressure needle mounting hole penetrating the pressure needle mounting plate 1 is provided on the pressure needle mounting plate 1, and the pressure needle 3 is slidably connected in the pressure needle mounting hole.
  • the upper end of the pressure needle 3 extends upward from the pressure needle mounting hole, and a limiting retaining ring 5 is provided on the upper end of the pressure needle.
  • the lower end of the pressure needle 3 extends downward from the pressure needle mounting hole, and a spring limiting portion 31 is provided on the side wall of the pressure needle 3.
  • a spring 6 is sleeved on the pressure needle 3, and the upper end of the spring 6 abuts against the pressure needle mounting plate 1, and the lower end of the spring 6 abuts against the spring limiting portion 31.
  • the pressing needle 3 can elastically press the solder strip onto the glue point to prevent the pressing needle 3 from damaging the solder strip and the battery cell, and ensure that each pressing needle 3 can effectively press the solder strip.
  • the pressing needle 3 in this embodiment is a hollow structure, and a through hole 4 is formed in the pressing needle 3, which runs through from top to bottom.
  • the glue point is located at the through hole 4. Therefore, UV light can directly irradiate the glue point through the through hole 4, thereby ensuring the curing effect of UV light on the glue point.
  • the through hole 4 includes an upper through hole section 41 and a lower through hole section 42 , wherein the aperture of the upper through hole section 41 is smaller than the aperture of the lower through hole section 42 , and the upper through hole section 41 and the lower through hole section 42 are connected via a conical hole section 43 whose aperture gradually expands from top to bottom.
  • the inner wall surface of the through hole 4 of the pressing needle, the bottom surface of the pressing needle and the outer wall surface of the pressing needle can be provided with an anti-sticking layer.
  • an anti-sticking layer on the side and bottom surface of the pressing needle 3, the overall anti-sticking property of the pressing needle 3 can be further improved.
  • the anti-sticking layer is an anti-sticking film applied to the surface of the pressing needle 3 or an anti-sticking coating plated on the surface of the pressing needle 3 .
  • the anti-sticking layer is a Teflon anti-sticking film or a Teflon anti-sticking coating.
  • the Teflon anti-sticking film and the Teflon anti-sticking coating have good anti-sticking properties, low friction coefficient, good wear resistance, and high temperature resistance.
  • the pressure pin mounting plate 1 is a hollow frame plate.
  • the hollow frame plate can reduce the weight of the pressure welding strip tooling.
  • the structure and working principle of the pressure welding belt tooling in the second embodiment of the present application are basically the same as those of the first embodiment mentioned above.
  • this specification only provides a targeted description of the different technical points.
  • the pressing pin 3 of the pressing welding strip tool in this embodiment is made of a light-transmitting material, and the pressing pin 3 has overall light transmittance.
  • the pressing pin row 2 presses the welding strip the pressing pin 3 covers the glue point, and the UV light can directly irradiate the glue point through the transparent pressing pin 3, thereby ensuring the curing effect of the UV light on the glue point.
  • the pressing needle 3 is a PC pressing needle, an acrylic pressing needle or a glass pressing needle.
  • the pressing needles 3 made of these three materials all have excellent light transmission performance.
  • a glue point avoidance groove 7 is provided at the bottom of the pressing needle 3.
  • the glue point avoidance groove 7 can reduce the contact area between the bottom of the pressing needle 3 and the glue point.
  • the inner wall surface of the glue point avoidance groove 7 of the pressing needle, the bottom surface of the pressing needle and the outer wall surface of the pressing needle can be provided with an anti-sticking layer.
  • an anti-sticking layer on the inner wall, bottom surface and outer wall surface of the groove of the pressing needle 3, the overall anti-sticking property of the pressing needle 3 can be further improved.
  • the anti-adhesive layer is transparent or translucent, and is an anti-adhesive film applied to the surface of the pressing needle 3 or an anti-adhesive coating plated on the surface of the pressing needle 3. Since the pressing needle is made of a transparent material, the anti-adhesive layer is also made of a transparent or translucent material, which can further improve the transmittance of UV light and ensure the curing effect of the glue point.
  • Teflon anti-sticking film and the Teflon anti-sticking coating not only have good anti-sticking properties but also have good light transmittance, they are particularly suitable for use as the anti-sticking layer in this embodiment.

Abstract

本申请提供了一种压焊带工装，包括压针安装板及安装在压针安装板上的若干压针排，每个压针排包括若干个压针，其中：每个压针排用于将一根焊带压紧至电池片的胶点上；压针为透光压针，压针排压住焊带时，胶点位于压针的透光部位，压针的至少与焊带接触的底部表面上设有防粘层。本申请提供的压焊带工装，其压针为透光压针，压针排压住焊带时，胶点位于压针的透光部位，如此，能够保证UV光透过压针直接照射至胶点上，从而保证UV光对胶点的固化效果。此外，压针与焊带接触的底部表面上设有防粘层，因此，压针的底部表面不会粘上胶料，从而实现了对压焊带工装的防污染保护。

Description

一种压焊带工装 技术领域
本申请设置电池生产领域，具体地说是一种压焊带工装。
 背景技术
电池串的低温焊接工艺中，在完成对电池片的印胶后，将电池片和焊带按预定顺序排成串，并使得焊带覆盖在对应电池片的胶点上。接着，使用压焊带工装将焊带压紧在电池片上，当胶点为UV胶时，采用UV光源照射电池片，焊带经光照融化的胶点与电池片粘接在一起。
传统的压焊带工装为带有压针的钢板，其通过压针将焊带压紧在电池片上。然而，电池片上的胶点密集，压针很容易压在胶点上，从而造成工装污染，影响工装的重复使用。此外，压针一般为不透光的金属压针，UV光难以直接照射至胶点上，影响了胶点的固化效果，进而影响了粘接效果。
 发明内容
为了解决上述技术问题，本申请提供了一种压焊带工装，其具体技术方案如下：
一种压焊带工装，包括压针安装板及安装在压针安装板上的若干压针排，每个压针排包括若干个压针，其中：
每个压针排用于将一根焊带压紧至电池片的胶点上；
压针为透光压针，压针排压住焊带时，胶点位于压针的透光部位，压针的至少与焊带接触的底部表面上设有防粘层。
本申请提供的压焊带工装，其压针为透光压针，压针排压住焊带时，胶点位于压针的透光部位，如此，能够保证UV光透过压针直接照射至胶点上，从而保证UV光对胶点的固化效果。此外，压针与焊带接触的底部表面上设有防粘层，因此，压针的底部表面不会粘上胶料，从而实现了对压焊带工装的防污染保护。
在一些实施例中，压针为中空结构，压针内形成有自上而下贯通的通孔，压针排压住焊带时，胶点位于通孔处，UV光透过通孔照射胶点。
通过将压针设置成中空结构，使得UV光能够透过压针内的通孔直接照射至胶点上。
在一些实施例中，通孔包括上通孔段和下通孔段，其中，上通孔段的孔径小于下通孔段的孔径，上通孔段和下通孔段之间经孔径自上而下渐扩的锥形孔段衔接。
上通孔段和下通孔段之间形成孔径自上而下渐扩的锥形孔段，从而自电池片反射至锥形孔段的孔壁上的UV光，能够被再次反射回胶点上，从而降低了光损耗，进一步提升了UV光的固化效果。
在一些实施例中，压针由透光材料制成，压针排压住焊带时，压针覆盖在胶点上，UV光透过压针照射胶点。
压针由透光材料制成，整根压针均具有透光性，因此压针压住焊带时，UV光能够透过压针照射至胶点上。
在一些实施例中，压针为PC压针、亚克力压针或玻璃压针。
PC压针、亚克力压针或玻璃压针具有优良的透光性能，能够保证胶点的固化效果。
在一些实施例中，压针的底部设置有胶点避让槽。
通过在压针的底部设置胶点避让槽，当压针将焊带压紧至胶点上时，胶点避让槽可减少压针的底部与胶点的接触面积，从而进一步减少胶点对压针的污染。
在一些实施例中，防粘层为透明或半透明的防粘膜或防粘镀层。
对于由透光材料制成的压针，通过将防粘层也选用透明或半透明材质，可以有效提升UV光的透过率，保证胶点的固化效果；防粘层采用覆膜或镀层的形式，工艺简单，便于实现。
在一些实施例中，防粘层为铁氟龙防粘膜或铁氟龙防粘镀层。
铁氟龙防粘膜及铁氟龙防粘涂层既具备良好的防粘性能，且具备较低的摩擦系数，良好的耐磨性、耐高温性能及透光性，非常适合作为本申请中的压针底部的防粘层。
在一些实施例中，压针安装板上设置有贯穿压针安装板的压针安装孔，压针滑动穿接在压针安装孔内；压针的上端向上伸出压针安装孔，压针的上端设置有限位挡圈；压针的下端向下伸出压针安装孔，压针的侧壁上设有弹簧限位部；压针上套设有弹簧，弹簧的上端抵靠在压针安装板上，弹簧的下端抵靠在弹簧限位部上。
通过对压针的安装方式进行设置，使得压针能够将焊带弹性压紧在胶点上，防止压针压损焊带及电池片，并且能够保证每个压针都能有效压紧焊带。
在一些实施例中，压针安装板为镂空框架板或整面板。
采用镂空框架板作为压针安装板，能够减轻压焊带工装的重量；而采用整面板作为压针安装板，则使得压焊带工装的结构更加简洁。
 附图说明
图1为本申请一个实施例的压焊带工装在一个视角下的结构示意图；
图2为本申请一个实施例的压焊带工装在另一视角下的结构示意图；
图3为图2的A-A剖视图；
图4为本申请一个实施例中的压针的结构示意图；
图5为图4的B-B剖视图；
图6为本申请另一个实施例的压焊带工装在一个视角下的结构示意图；
图7为本申请另一个实施例的压焊带工装在另一视角下的结构示意图；
图8为图7的C-C剖视图；
图1至图8中包括：
压针安装板1、压针排2、压针3、通孔4、限位挡圈5、弹簧6、胶点避让槽7、弹簧限位部31、上通孔段41、下通孔段42、锥形孔段43。
 实施方式
为使本申请的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本申请作进一步详细的说明。
传统的压焊带工装为带有压针的钢板，其通过压针将焊带压紧在电池片上。然而，电池片上的胶点密集，压针很容易压在胶点上，从而造成工装污染，影响工装的重复使用。此外，压针一般为不透光的金属压针，UV光难以直接照射至胶点上，影响了胶点的固化效果，进而影响了粘接效果。
为了解决传统的压焊带工装存在的上述技术问题，本申请提供了一种压焊带工装，其能够保证UV光充分照射至胶点上，从而保证UV光对胶点的固化效果，且不会粘上胶料。下文将通过两个实施例，对本申请的压焊带工装进行示例性介绍。
实施例
如图1至图2所示，本实施例的压焊带工装包括压针安装板1及安装在压针安装板1上的若干压针排2，每个压针排2包括若干个压针3，其中：
每个压针排2均用于将一根焊带压紧至电池片的胶点上。
压针3为透光压针，压针排2压住焊带时，胶点位于压针3的透光部位，压针3的至少与焊带接触的底部表面上设有防粘层。
可见，由于压针3为透光压针，当压针排2压住焊带时，胶点位于压针3的透光部位，如此，能够保证UV光透过压针3直接照射至胶点上，从而保证UV光对胶点的固化效果。此外，由于压针3与焊带接触的底部表面上设有防粘层，因此，压针3的底部表面具有防粘性能，从而实现了对压焊带工装的防污染保护。
如图3和图4所示，可选的，压针安装板1上设置有贯穿压针安装板1的压针安装孔，压针3滑动穿接在压针安装孔内。压针3的上端向上伸出压针安装孔，压针的上端设置有限位挡圈5，压针3的下端向下伸出压针安装孔，压针3的侧壁上设有弹簧限位部31。压针3上套设有弹簧6，弹簧6的上端抵靠在压针安装板1上，弹簧6的下端抵靠在弹簧限位部31上。
通过对压针3的安装方式进行设置，并在压针3上套设弹簧6，使得压针3能够将焊带弹性压紧在胶点上，防止压针3压损焊带及电池片，并且能够保证每个压针3都能有效压紧焊带。
如图4和图5所示，本实施例中的压针3为中空结构，压针3内形成有自上而下贯通的通孔4，压针排2压住焊带时，胶点位于通孔4处。因此，UV光能够透过通孔4直接照射至胶点上，从而保证UV光对胶点的固化效果。
可选的，如图5所示，通孔4包括上通孔段41和下通孔段42，其中，上通孔段41的孔径小于下通孔段42的孔径，上通孔段41和下通孔段42之间经孔径自上而下渐扩的锥形孔段43衔接。
由于上通孔段41和下通孔段42之间形成孔径自上而下渐扩的锥形孔段43，因此，自电池片反射至锥形孔段43的孔壁上的UV光，能够被再次反射回胶点上，从而降低了UV光损耗，进一步提升了UV光对胶点的固化效果。
可选的，压针的通孔4的内壁面、压针底面以及压针的外壁面均可设置防粘层。通过在压针3的侧面和底面均设置防粘层，可进一步提升压针3的整体防粘性。
可选的，防粘层为贴敷在压针3表面的防粘膜或镀在压针3表面的防粘镀层。
可选的，防粘层为铁氟龙防粘膜或铁氟龙防粘镀层。铁氟龙防粘膜及铁氟龙防粘镀层既具备良好的防粘性能，且具备较低的摩擦系数，良好的耐磨性、耐高温性能。
可选的，本实施例中的压焊带工装，其压针安装板1为镂空框架板。镂空框架板能够减轻压焊带工装的重量。
当然，也可以采用结构更加简单的整面板作为压针安装板1。
实施例
本申请第二实施例中的压焊带工装的结构及工作原理与上述第一实施例基本相同，为了描述简洁，本说明书仅对其存在的区别技术点进行针对性的描述，其余相同的技术点，请参考上述第一实施例的相关描述。
此外，在不引起混淆的前提下，在对第二实施例的压焊带工装进行描述时，对于相同的或相应的部件，沿用上述第一实施例的附图标记。
如图6至图8所示，本实施例中的压焊带工装，其压针3由透光材料制成，压针3具有整体透光性。当压针排2压住焊带时，压针3覆盖在胶点上，UV光可透过透明的压针3直接照射至胶点上，从而保证UV光对胶点的固化效果。
可选的，压针3为PC压针、亚克力压针或玻璃压针。这三种材质的压针3都具有优良的透光性能。
如图8所示，可选的，压针3的底部设置有胶点避让槽7。当压针3将焊带压紧至胶点上时，胶点避让槽7可减少压针3的底部与胶点的接触面积。
可选的，压针的胶点避让槽7的内壁面、压针底面以及压针的外壁面均可设置防粘层。通过在压针3的槽内壁、底面和外壁面均设置防粘层，可进一步提升压针3的整体防粘性。
可选的，防粘层为透明或半透明的，且贴敷在压针3表面的防粘膜或镀在压针3表面的防粘镀层。由于压针整体由透光材料制成，通过将防粘层也选用透明或半透明材质，可以进一步提升UV光的透过率，保证胶点的固化效果。
由于铁氟龙防粘膜及铁氟龙防粘镀层不仅具备良好的防粘性能，还具备较好的透光性能，因此尤其适合用在本实施例中作为防粘层使用。
上文对本申请进行了足够详细的具有一定特殊性的描述。所属领域内的普通技术人员应该理解，实施例中的描述仅仅是示例性的，在不偏离本申请的真实精神和范围的前提下做出所有改变都应该属于本申请的保护范围。本申请所要求保护的范围是由所述的权利要求书进行限定的，而不是由实施例中的上述描述来限定的。

Claims (10)

  1. 一种压焊带工装，其特征在于，所述压焊带工装包括压针安装板及安装在所述压针安装板上的若干压针排，每个所述压针排包括若干个压针，其中：
    每个所述压针排用于将一根焊带压紧至电池片的胶点上；
    所述压针为透光压针，所述压针排压住焊带时，所述胶点位于所述压针的透光部位，所述压针的至少与焊带接触的底部表面上设有防粘层。
  2. 如权利要求1所述的压焊带工装，其特征在于，所述压针为中空结构，所述压针内形成有自上而下贯通的通孔，所述压针排压住焊带时，所述胶点位于所述通孔处，UV光透过所述通孔照射所述胶点。
  3. 如权利要求2所述的压焊带工装，其特征在于，所述通孔包括上通孔段和下通孔段，其中，所述上通孔段的孔径小于所述下通孔段的孔径，所述上通孔段和所述下通孔段之间经孔径自上而下渐扩的锥形孔段衔接。
  4. 如权利要求1所述的压焊带工装，其特征在于，所述压针由透光材料制成，所述压针排压住焊带时，所述压针覆盖在所述胶点上，UV光透过所述压针照射所述胶点。
  5. 如权利要求4所述的压焊带工装，其特征在于，所述压针为PC压针、亚克力压针或玻璃压针。
  6. 如权利要求4所述的压焊带工装，其特征在于，所述压针的底部设置有胶点避让槽。
  7. 如权利要求4所述的压焊带工装，其特征在于，所述防粘层为透明或半透明的防粘膜或防粘镀层。
  8. 如权利要求1或7所述的压焊带工装，其特征在于，所述防粘层为铁氟龙防粘膜或铁氟龙防粘镀层。
  9. 如权利要求1所述的压焊带工装，其特征在于：
    所述压针安装板上设置有贯穿所述压针安装板的压针安装孔，所述压针滑动穿接在所述压针安装孔内；
    所述压针的上端向上伸出所述压针安装孔，所述压针的上端设置有限位挡圈；所述压针的下端向下伸出所述压针安装孔，所述压针的侧壁上设有弹簧限位部；
    所述压针上套设有弹簧，所述弹簧的上端抵靠在所述压针安装板上，所述弹簧的下端抵靠在所述弹簧限位部上。
  10. 如权利要求1所述的压焊带工装，其特征在于：所述压针安装板为镂空框架板或整面板。
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