WO2024070235A1 - Appareil de placage - Google Patents

Appareil de placage Download PDF

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Publication number
WO2024070235A1
WO2024070235A1 PCT/JP2023/028660 JP2023028660W WO2024070235A1 WO 2024070235 A1 WO2024070235 A1 WO 2024070235A1 JP 2023028660 W JP2023028660 W JP 2023028660W WO 2024070235 A1 WO2024070235 A1 WO 2024070235A1
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Prior art keywords
plating
electrode
metal tube
tube
plated
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PCT/JP2023/028660
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English (en)
Japanese (ja)
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智和 嶋田
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株式会社村田製作所
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Publication of WO2024070235A1 publication Critical patent/WO2024070235A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment

Definitions

  • the present invention relates to a plating device.
  • Patent Document 1 JP Patent Publication No. 2021-138999 discloses a jet-type plating equipment.
  • the plating apparatus disclosed in Patent Document 1 is equipped with a plating tank.
  • the plating tank contains a metal tube (cathode) that is a first electrode, a mesh tube (partition) made of an insulating material, and a second electrode (anode).
  • a metal tube is placed inside the mesh tube, and a plating formation portion is formed between the inside of the mesh tube and the outside of the metal tube.
  • the plating formation portion refers to the area (space) where plating is applied to the object to be plated.
  • a second electrode is placed outside the mesh tube.
  • An injection section is provided below the metal tube.
  • the injection section is for generating an upward flow of plating solution inside the metal tube. That is, in the device disclosed in Patent Document 1, the injection section is the source that generates a jet of plating solution.
  • the plating device disclosed in Patent Document 1 contains a plating solution, an object to be plated (such as an electronic component body), and conductive media in a plating tank.
  • insulating balls are contained in the tank as necessary to increase the fluidity of the object to be plated.
  • the workpiece, media, and insulating balls ride the rising current of plating solution generated inside the metal tube, rise inside the metal tube, and are ejected from the top end of the metal tube and agitated.
  • the stirred objects to be plated, media, and insulating balls are then deposited on the upper side of the plating formation section.
  • other objects to be plated, media, and insulating balls are already packed (deposited) inside the plating formation section.
  • the objects to be plated, media, and insulating balls that have deposited on the upper side of the plating formation section then gradually descend inside the plating formation section.
  • a current is applied between the metal tube, which is the first electrode, and the second electrode, forming a plating film in the plating formation area (area where the base electrode, etc. are formed) on the surface of the object to be plated.
  • the object to be plated with the plating film formed, the media, and the insulating balls are pushed out from the bottom end of the plating formation section, and once again rides the rising current of plating solution generated inside the metal tube, rising inside the metal tube, and is ejected from the top end of the metal tube and stirred.
  • the object to be plated circulates through the plating device several to several thousand times until the planned plating film thickness is reached.
  • the media serves to electrically connect the metal tube, which is the first electrode, and the plating formation area on the surface of the object to be plated in the plating formation section.
  • the quantity (volume) and dimensions of the media are adjusted as appropriate depending on the desired state of the plating film.
  • the electrical connection between the metal tube (first electrode) and the plating formation area of the plated object may not be sufficiently established. If the electrical connection between the metal tube (first electrode) and the plating formation area of the plated object is not sufficiently established, it may take a long time to reach the planned plating film thickness, or the thickness of the plating film formed may vary between plated objects.
  • the present invention aims to provide a plating device that solves the above-mentioned problems of the conventional technology, improves the time required for plating, and suppresses the variation in thickness of the deposited plating film.
  • the plating apparatus includes a plating tank for storing plating solution, a cylindrical metal tube having a hollow portion as a first electrode, a cylindrical mesh tube having a hollow portion made of an insulating material, and a second electrode, the metal tube, mesh tube, and second electrode are each contained in the plating tank, the metal tube is disposed in the hollow portion of the mesh tube, a plating formation portion is formed between the inside of the mesh tube and the outside of the metal tube, the second electrode is disposed on the outside of the mesh tube, an upward flow that raises the plating solution is generated in the hollow portion of the metal tube, the object to be plated rises on the upward flow of the plating solution in the hollow portion of the metal tube, is discharged outside the metal tube, is stirred, and then descends through the plating formation portion, and during the descent, a current is applied between the metal tube, which is the first electrode, and the second electrode, so that the plating apparatus
  • the auxiliary electrode assists in the electrical connection between the first electrode (metal tube) and the plating formation area of the object to be plated, improving the time it takes to reach the desired plating thickness.
  • the auxiliary electrode assists in the electrical connection between the first electrode, which is the metal tube, and the plating formation area of the object to be plated, and a uniform current is supplied to the plating formation area, thereby suppressing variations in the thickness of the formed plating film.
  • FIG. 1 is a cross-sectional view of a plating apparatus 100 according to a first embodiment.
  • 2 is a cross-sectional view of the plating apparatus 100, showing the portion indicated by the dashed dotted arrows A-A in FIG.
  • Fig. 3(A) is a front view of the main parts of the metal tube 2 and auxiliary electrode 15 of the plating apparatus 100.
  • Fig. 3(B) is a cross-sectional view of the main parts of the metal tube 2 and auxiliary electrode 15 of the plating apparatus 100.
  • Fig. 3(C) is a plan view of the main parts of the metal tube 2 and auxiliary electrode 15 of the plating apparatus 100.
  • FIG. 4(A) is a front view of a main part of the metal tube 2 of a plating apparatus 1100 according to a comparative example.
  • Fig. 4(B) is a cross-sectional view of a main part of the metal tube 2 of the plating apparatus 1100.
  • Fig. 4(C) is a plan view of a main part of the metal tube 2 of the plating apparatus 1100.
  • 5A is a graph showing the distribution (frequency) of the thickness of the plating film of Example 1 in Experiment 1.
  • FIG. 5B is a graph showing the distribution (frequency) of the thickness of the plating film of Comparative Example 1 in Experiment 1.
  • 1 is a graph showing the variation in thickness of the plating film in Example 1 and Comparative Example 1 in Experiment 1.
  • FIG. 11 is a front view of a main part of a plating apparatus 200 according to a second embodiment.
  • Fig. 8A is a cross-sectional view of a main part of a plating apparatus 200A
  • Fig. 8B is a cross-sectional view of a main part of a plating apparatus 200B
  • Fig. 8C is a cross-sectional view of a main part of a plating apparatus 200C.
  • 13 is a graph showing the variation in thickness of the plating film in Examples 21, 22, and 23 in Experiment 2.
  • each embodiment is an illustrative example of how the present invention can be implemented, and the present invention is not limited to the contents of the embodiment. It is also possible to combine the contents described in different embodiments, and the implementation in such cases is also included in the present invention.
  • the drawings are intended to aid in understanding the specification, and may be drawn diagrammatically, and the dimensional ratios of the depicted components or between the components may not match the dimensional ratios of those components described in the specification. Components described in the specification may be omitted in the drawings, or the number of components may be omitted when drawn.
  • FIG. 1 is a cross-sectional view of the plating apparatus 100.
  • Figure 2 is also a cross-sectional view of the plating apparatus 100, showing the portion A-A indicated by the dashed-dotted arrow in Figure 1.
  • Figure 3(A) is a front view of the main parts of the plating apparatus 100, showing a metal tube 2 and an auxiliary electrode 15, which will be described later.
  • Figure 3(B) is a cross-sectional view of the main parts of the metal tube 2 and the auxiliary electrode 15.
  • Figure 3(C) is a plan view of the main parts of the metal tube 2 and the auxiliary electrode 15.
  • the plating apparatus 100 is equipped with a plating tank 1.
  • the plating tank 1 is open at the top.
  • the plating tank 1 is used to store a mixture 16 of plating solution, the object to be plated, and media, which will be described later. If necessary, insulating balls may be added to the mixture 16 to increase the fluidity of the object to be plated.
  • the plating apparatus 100 includes a cylindrical metal tube 2 inside a plating tank 1.
  • the metal tube 2 has a hollow portion 2a.
  • the metal tube 2 is a first electrode, and in this embodiment, it is a cathode electrode.
  • the metal tube 2 is cylindrical.
  • the metal tube 2 may also be polygonal cylindrical.
  • the material of the metal tube 2 is arbitrary, and various metals can be used.
  • the dimensions of the metal tube 2, such as the outer diameter, inner diameter, and length, are arbitrary and can be set as appropriate.
  • two conductive rod-shaped support parts 2b are formed integrally with the metal tube 2 at the top of the metal tube 2.
  • the number of support parts 2b is arbitrary, and may be one or more than two.
  • the plating apparatus 100 includes a mesh tube 3 made of an insulating material inside the plating tank 1.
  • the mesh tube 3 has a hollow portion 3a.
  • the mesh tube 3 is cylindrical.
  • the mesh tube 3 may also be a polygonal tube.
  • the mesh tube 3 is formed in a mesh (mesh) shape that allows the plating solution to pass through but does not allow the plated object, media, and insulating balls to pass through.
  • the material of the mesh tube 3 is arbitrary, and for example, various resins can be used.
  • the dimensions of the mesh tube 3, such as the outer diameter, inner diameter, and length, are arbitrary and can be set as appropriate.
  • the inner diameter of the mesh tube 3 is larger than the outer diameter of the metal tube 2.
  • the metal tube 2 is disposed within the hollow portion 3a of the mesh tube 3.
  • a plating formation portion 4 is formed between the inside of the mesh tube 3 and the outside of the metal tube 2.
  • the plating formation portion 4 is the area (space) where plating is applied to the object to be plated. Note that in Figures 1 and 2, the plating formation portion 4 is depicted as being cross-hatched.
  • the plating formation portion 4 is the area between the outer diameter of the metal tube 2 and the inner diameter of the mesh tube 3.
  • the length and other dimensions of the plating formation portion 4 are arbitrary and can be set as appropriate.
  • the object to be plated, the media, and the insulating balls are accumulated inside the plating forming section 4 and gradually descend downward. During this descent, plating is applied to the surface of the object to be plated.
  • the plating apparatus 100 is equipped with a second electrode 5 inside the plating tank 1.
  • the second electrode 5 is an anode electrode.
  • the second electrode 5 is made of a cylindrical metal.
  • the second electrode 5 is disposed on the outside of the mesh tube 3.
  • the material of the second electrode 5 is arbitrary, and various metals can be used.
  • the plating apparatus 100 when viewed in a planar direction, the plating apparatus 100 has the metal tube 2, mesh tube 3, and second electrode 5 arranged concentrically so that their central axes coincide. Therefore, in the plating apparatus 100, a current is applied uniformly between the metal tube 2 (first electrode) and the second electrode 5 in any region of the plating formation section 4, suppressing variation in the thickness of the plating film that is formed.
  • the plating device 100 has an injection section 6 below the metal tube 2.
  • the injection section 6 has an injection port 6a.
  • the injection port 6a injects plating solution toward the hollow portion 2a of the metal tube 2, generating an upward flow of plating solution inside the hollow portion 2a.
  • the plating apparatus 100 is equipped with a circulation line 7 formed of a pipe.
  • One end of the circulation line 7 is connected to a suction port 8 formed in the plating tank 1.
  • the other end of the circulation line 7 is connected to the nozzle 6a of the spray unit 6.
  • a pump 9 and a filter 10 are provided midway along the circulation line 7. When the pump 9 is driven, the circulation line 7 sucks up the plating solution through the suction port 8 and sprays the plating solution from the nozzle 6a.
  • the plating device 100 is provided with a mixing section 11 below the metal tube 2 and mesh tube 3 and above the injection section 6.
  • the mixing section 11 is an area where the plating solution injected from the injection port 6a of the injection section 6 is mixed with the plated object, media, and insulating balls that have descended through the plating formation section 4.
  • the mixing section 11 is made of an insulating material, and an inverted truncated cone-shaped excavation is formed on the upper surface.
  • An inverted truncated cone is a truncated cone whose upper base is larger than its lower base.
  • the shape of the excavation is arbitrary, and it may be a mortar shape instead of an inverted truncated cone shape.
  • the injection section 6 is formed on the bottom surface of the excavation in the mixing section 11.
  • the plating device 100 is provided with an induction section 12 above the metal tube 2 and mesh tube 3.
  • the induction section 12 is an area where the plated object, media, and insulating balls, which rise on the upward flow of plating solution formed inside the hollow section 2a of the metal tube 2 by the injection from the injection port 6a of the injection section 6 and are discharged (ejected) from the upper opening of the hollow section 2a of the metal tube 2, are stirred and then guided to the plating formation section 4.
  • the induction section 12 is made of an insulating material and has an inverted truncated cone shape.
  • the upper end of the metal tube 2 protrudes from the bottom surface of the induction section 12.
  • the upper end of the hollow section 2a of the metal tube 2 opens at the bottom surface of the induction section 12.
  • the bottom surface of the induction section 12 is connected to the mesh tube 3.
  • the plating device 100 is equipped with an insulating reflector 13 above the opening of the plating tank 1.
  • the reflector 13 is sometimes called a deflector.
  • the reflector 13 plays a role in preventing the plating solution from scattering.
  • the support part 2b of the metal tube 2 is attached to the underside of the reflector 13.
  • a cylindrical suppression plate 13a is formed on the underside of the reflector 13.
  • the suppression plate 13a is disposed within the induction section 12.
  • the plating solution may overflow from the upper edge of the induction section 12, but the suppression plate 13a ensures that only the plating solution overflows from the induction section 12, preventing the plated object, media, and insulating balls from overflowing.
  • the plating apparatus 100 is equipped with a power supply 14.
  • One line of the power supply 14 is connected to the support portion 2b of the metal tube 2, which is the first electrode, and the other line is connected to the second electrode 5.
  • the power supply 14 applies a current between the metal tube 2, which is the first electrode, and the second electrode 5.
  • the plating apparatus 100 is provided with an auxiliary electrode 15, which is an important component of the present invention, in the plating formation section 4.
  • the auxiliary electrode 15 is electrically connected to the metal tube 2, which is the first electrode.
  • the auxiliary electrode 15 plays a role in supporting the metal tube 2, which is the first electrode, when plating is applied to the object to be plated in the plating formation section 4.
  • the metal tube 2, which is the first electrode, and the plating formation area of the object to be plated are electrically connected via a conductive path formed by multiple media, but the plating apparatus 100 is provided with the auxiliary electrode 15, which is electrically connected to the metal tube 2, which is the first electrode, and therefore the number of power supply points is increased, and the electrical connection between the metal tube 2, which is the first electrode, and the plating formation area of the object to be plated is more reliable.
  • the auxiliary electrode 15 is plate-shaped.
  • the shape of the auxiliary electrode 15 is arbitrary and is not limited to a plate shape.
  • the auxiliary electrode 15 may be, for example, rod-shaped or block-shaped.
  • the auxiliary electrode 15 is in the form of a triangular plate.
  • the auxiliary electrode 15 is not limited to a triangular plate shape and may be, for example, in the form of a rectangular plate.
  • the auxiliary electrode 15 is attached to the outside of the metal tube 2, which is the first electrode, and is electrically connected to the metal tube 2.
  • the triangular plate-shaped auxiliary electrode 15 is attached to the outside of the metal tube 2 with one side facing up and the apex opposite that side facing down. Therefore, the auxiliary electrode 15 is unlikely to hinder the passage of the plated object, media, and insulating balls through the plating formation section 4. In other words, the cross-sectional area of the space excluding the part where the auxiliary electrode 15 is present becomes larger from the top to the bottom of the plating formation section 4, so that the plated object, media, and insulating balls can pass through smoothly.
  • the auxiliary electrode 15 may not be attached to the metal tube 2, but may be suspended independently from, for example, the reflector 13.
  • auxiliary electrodes 15 when viewed in a planar direction, four auxiliary electrodes 15 are arranged radially around the metal tube 2. Therefore, the auxiliary electrodes 15 can supply current evenly within the plating formation portion 4.
  • the number of auxiliary electrodes 15 is not limited to four, and may be less than four or more than four.
  • the auxiliary electrode 15 assists in the electrical connection between the first electrode, the metal tube 2, and the plating formation area of the object to be plated, thereby shortening (improving) the time required to reach the desired plating thickness.
  • the auxiliary electrode 15 assists in the electrical connection between the first electrode, the metal tube 2, and the plating formation area of the object to be plated, and a uniform current is supplied to the plating formation section 4, thereby suppressing variations in the thickness of the formed plating film.
  • the object to be plated, media, and insulating balls are introduced into the induction section 12 in the plating tank 1.
  • the order of introduction of the plating solution and the object to be plated, media, and insulating balls may be reversed.
  • the introduced object to be plated, media, and insulating balls are deposited in the plating formation section 4.
  • the pump 9 is driven to spray the plating solution from the nozzle 6a of the spray section 6.
  • an upward flow of plating solution is generated inside the metal tube 2.
  • some of the objects to be plated, media, and insulating balls that had accumulated inside the plating formation section 4 are taken out from the lower end of the plating formation section 4 to the mixing section 11, where they mix with the sprayed plating solution and ride the upward flow upward inside the metal tube 2.
  • the plated object, media, and insulating balls that rise inside the metal tube 2 are ejected from the top end of the metal tube 2 and agitated.
  • stirred objects to be plated, media, and insulating balls are deposited on top of other objects to be plated, media, and insulating balls that are already deposited in the plating formation section 4.
  • the newly accumulated objects to be plated, media, and insulating balls gradually descend as some of the objects to be plated, media, and insulating balls that had accumulated in the plating formation section 4 are removed from the lower end of the plating formation section 4 to the mixing section 11. As a result, the objects to be plated, media, and insulating balls circulate inside the plating device 100.
  • the power supply 14 is driven to apply a current between the first electrode, the metal tube 2, and the second electrode 5. As a result, plating of the object to be plated begins in the plating formation section 4.
  • the power source 14 is turned off, and plating on the object to be plated is stopped.
  • the pump 9 is stopped, and the object to be plated, media, and insulating balls stop circulating inside the plating device 100.
  • the plating process is completed by removing the objects to be plated, media, and insulating balls from plating tank 1 and sorting the objects to be plated.
  • the plating apparatus 100 described above was prepared for Example 1.
  • a plating apparatus 1100 was prepared. As shown in Figures 4(A) to (C), the plating apparatus 1100 omitted the auxiliary electrode 15 that was attached to the metal tube 2 of the plating apparatus 100 (it was structured without the auxiliary electrode 15). The rest of the structure of the plating apparatus 1100 was the same as that of the plating apparatus 100.
  • the length of the plating formation section 4 was set to 220 mm for both plating apparatus 100 and plating apparatus 1100.
  • Example 1 A mixture of the object to be plated, media, and insulating balls was prepared for Example 1 and Comparative Example 1.
  • the mixture for Example 1 and the mixture for Comparative Example 1 had the same composition and mixing amount.
  • the total mixture of the plated object, media, and insulating balls was 1720cc.
  • the mixture ratio was 1376cc (80% by volume) of the plated object, 86cc (5% by volume) of the media, and 258cc (15% by volume) of the insulating balls.
  • Example 1 the plating apparatus 100, the mixture, and the plating solution were used to perform plating on the objects to be plated for 210 minutes.
  • the magnitude of the applied current was 0.17 A/ dm2 .
  • the plating solution was sprayed at a flow rate of 85 L/min.
  • the plating apparatus 1100 was stopped 60 minutes, 90 minutes, 120 minutes, 150 minutes, 180 minutes, and 210 minutes after the start of plating, respectively, and 30 objects to be plated were removed for each time, and the thickness of the plating film formed was measured.
  • the plating apparatus 1100, the mixture, and the plating solution were used to plate the objects to be plated for 210 minutes.
  • the magnitude of the applied current was 0.17 A/ dm2 .
  • the spray flow rate of the plating solution was 85 L/min.
  • the plating apparatus 1100 was stopped 60 minutes, 90 minutes, 120 minutes, 150 minutes, 180 minutes, and 210 minutes after the start of plating, and 30 objects to be plated were removed for each time, and the thickness of the plated film formed was measured.
  • Example 1 Details of Example 1 and Comparative Example 1 are shown in Table 1.
  • Figure 5 (A) shows the distribution (frequency) of the thickness of the plating film formed on 30 plated objects 60 minutes after the start of plating in Example 1.
  • Figure 5 (B) shows the distribution (frequency) of the thickness of the plating film formed on 30 plated objects 60 minutes after the start of plating in Comparative Example 1.
  • Example 1 As can be seen by comparing Figures 5(A) and 5(B), the plating film in Example 1 tends to be thicker overall than in Comparative Example 1.
  • the auxiliary electrode 15 assists in the electrical connection between the metal tube 2 and the plating formation area of the object to be plated, thereby improving the deposition rate of the plating film.
  • Figure 6 shows the variation (CV (%)) in the thickness of the plating film for Example 1 and Comparative Example 1 at 60, 90, 120, 150, 180, and 210 minutes after the start of plating.
  • Example 1 has smaller variability overall.
  • Example 1 has smaller variability than Comparative Example 1 60 minutes, 90 minutes, 120 minutes, and 150 minutes after plating starts.
  • Comparative Example 1 has larger variability, particularly 60 minutes after plating starts. After 180 minutes and 210 minutes, Example 1 and Comparative Example 1 have similar variability.
  • the plating apparatus 100 was able to confirm that the auxiliary electrode 15 assisted in establishing an electrical connection between the metal tube 2 and the plating formation area of the object to be plated, supplied a uniform current to the plating formation area, and suppressed variations in the thickness of the formed plating film.
  • the present invention provides unique and excellent effects.
  • the plating apparatus 200 according to the second embodiment was manufactured.
  • the plating apparatus 200 is obtained by adding some modifications to the configuration of the plating apparatus 100 according to the first embodiment.
  • auxiliary electrodes 15 were attached to the outside of the metal tube 2, which is the first electrode.
  • the plating apparatus 200 this has been modified so that, as shown in FIG. 7, the four auxiliary electrodes 25 are removed from the metal tube 2 and are suspended within the plating formation section 4 by their own conductive rod-shaped supports 25b.
  • the shape of the auxiliary electrodes 25 has been changed from a triangular plate to a rectangular plate.
  • the tips of the supports 25b of the auxiliary electrodes 25 are attached, for example, to the underside of the reflector 13.
  • the auxiliary electrode 25 is electrically connected to the first electrode, the metal tube 2, via the support portion 25b.
  • the auxiliary electrode 25 supports the first electrode, the metal tube 2, and serves to increase the number of power supply points.
  • FIGS 8(A), (B), and (C) are cross-sectional views of the main parts of the plating apparatus 200.
  • the one shown in Figure 8(A) is plating apparatus 200A
  • the one shown in Figure 8(B) is plating apparatus 200B
  • the one shown in Figure 8(C) is plating apparatus 200C.
  • the plating apparatus 200 shown in Figure 7 corresponds to plating apparatus 200B.
  • auxiliary electrodes 25 are arranged on the side of the metal tube 2.
  • the four auxiliary electrodes 25 are arranged radially around the metal tube 2.
  • the auxiliary electrodes 25 may be in contact with the metal tube 2 or may be separated from it with a small gap.
  • auxiliary electrodes 25 are arranged between the metal tube 2 and the mesh tube 3.
  • the four auxiliary electrodes 25 are arranged radially around the metal tube 2.
  • auxiliary electrodes 25 are arranged on the mesh tube 3 side. Each of the four auxiliary electrodes 25 is arranged so as to be parallel to the mesh surface of the mesh tube 3.
  • Example 21 plating apparatus 200A was used. In Example 22, plating apparatus 200B was used. In Example 23, plating apparatus 200C was used.
  • Example 21 Example 22, and Example 23 the same mixtures of plated objects, media, and insulating balls as those used in Experiment 1 (Example 1 and Comparative Example 1) were prepared.
  • the mixture and the plating solution were used to plate the objects to be plated for 210 minutes.
  • the magnitude of the applied current was 0.17 A/ dm2 .
  • the jet flow rate of the plating solution was 85 L/min.
  • the plating apparatus 1100 was stopped 60 minutes, 90 minutes, 120 minutes, 150 minutes, 180 minutes, and 210 minutes after the start of plating, and 30 objects to be plated were removed for each experiment, and the thickness of the plated film formed was measured.
  • Figure 9 shows the variation (CV (%)) in the thickness of the plating film 60 minutes, 90 minutes, 120 minutes, 150 minutes, 180 minutes, and 210 minutes after the start of plating for each of Examples 21, 22, and 23.
  • Example 21 has smaller variation than Example 22 in which four auxiliary electrodes 25 are arranged between the metal tube 2 and the mesh tube 3 and Example 23 in which four auxiliary electrodes 25 are arranged on the mesh tube 3 side, 60 minutes, 90 minutes, 120 minutes, and 150 minutes after the start of plating.
  • Example 22 in which four auxiliary electrodes 25 are arranged between the metal tube 2 and the mesh tube 3 has smaller variation overall than Example 23 in which four auxiliary electrodes 25 are arranged on the mesh tube 3 side.
  • Example 22 has smaller variation than Example 23, 60 minutes, 90 minutes, 120 minutes, and 180 minutes after the start of plating.
  • plating apparatus 100 and plating apparatus 200 (plating apparatuses 200A, 200B, 200C) according to the embodiments have been described above.
  • the present invention is not limited to the above-described content, and various modifications can be made in accordance with the spirit of the invention.
  • the number of auxiliary electrodes 15, 25 is four, but the number of auxiliary electrodes 15, 25 is arbitrary and may be less than four or more than four.
  • auxiliary electrodes 15 and 25 are triangular or rectangular plates, but the shape of the auxiliary electrodes 15 and 25 is arbitrary and may be other shapes.
  • the plating apparatus according to one embodiment of the present invention is as described in the "Means for solving the problems" section.
  • the first electrode is a cathode electrode and the second electrode is an anode electrode.
  • the auxiliary electrode is attached to the outside of the metal tube and electrically connected to the metal tube.
  • the auxiliary electrode can be easily provided.
  • the auxiliary electrode is suspended within the plating formation portion.
  • the auxiliary electrode can be positioned at any position within the plating formation portion.
  • auxiliary electrodes it is also preferable for the auxiliary electrodes to consist of multiple electrodes. In this case, current can be supplied more uniformly to the plating formation area.
  • the auxiliary electrodes are arranged radially around the metal tube. In this case, current can be supplied more uniformly to the plating formation area.
  • the auxiliary electrode is a metal plate.
  • the auxiliary electrode is prevented from impeding the passage of the plating formation parts, such as the plated object, media, and insulating balls.
  • the metal plate is a triangular plate and is placed within the plating formation section with one side of the triangle on the upper side and the apex opposite the side on the lower side. In this case, it is possible to further prevent the auxiliary electrode from obstructing the passage of the plate formation section of the object to be plated, media, insulating balls, etc.
  • the shape of the metal plate is arbitrary, and it may be, for example, a rectangular plate.
  • Plating tank 2 Metal tube (first electrode; cathode) 2a: hollow portion 2b: support portion 3: mesh tube 3a: hollow portion 4: plating formation portion 5: second electrode (anode) 6: Injection section 6a: Injection port 7: Circulation line 8: Suction port 9: Pump 10: Filter 11: Mixing section 12: Guiding section 13: Reflector (deflector) 13a: Suppression plate 14: Power source 15, 25: Auxiliary electrode 25a: Support portion

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  • Chemical Kinetics & Catalysis (AREA)
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  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne un appareil de placage avec lequel le temps requis pour le placage est amélioré et l'irrégularité dans l'épaisseur du film de placage obtenu est réduite au minimum.　Cet appareil de placage comprend un réservoir de placage stockant un liquide de placage, un tube métallique cylindrique possédant une partie creuse, un tube en maille cylindrique possédant une partie creuse, et une seconde électrode, le tube métallique étant une première électrode, le tube en maille étant produit à partir d'un matériau isolant, le tube métallique, le tube en maille et la seconde électrode étant logés dans le réservoir de placage, le tube métallique étant disposé dans la partie creuse du tube en maille, une partie de formation de placage étant formée entre le côté interne du tube en maille et le côté externe du tube métallique, la seconde électrode étant disposée sur le côté externe du tube en maille, un écoulement vers le haut élevant le liquide de placage étant généré dans la partie creuse du tube métallique, un objet à plaquer étant élevé dans la partie creuse du tube métallique par l'écoulement vers le haut du liquide de placage, étant évacué vers l'extérieur du tube métallique, étant agité, puis tombant dans la partie de formation de placage et étant plaqué par application d'un courant entre le tube métallique, c'est-à-dire la première électrode, et la seconde électrode pendant la descente de l'objet. Une contre-électrode est présente dans la partie de placage, la contre-électrode étant électriquement connectée au tube métallique, c'est-à-dire à la première électrode.
PCT/JP2023/028660 2022-09-27 2023-08-05 Appareil de placage WO2024070235A1 (fr)

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JP2022-154285 2022-09-27
JP2022154285 2022-09-27

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4171249A (en) * 1977-03-17 1979-10-16 Parel Societe Anonyme Improvements in or relating to circulating bed electrodes
JPH0544083A (ja) * 1991-08-13 1993-02-23 Nisshin Steel Co Ltd 粉末の電気めつき法
JP2004527652A (ja) * 2000-12-28 2004-09-09 テクニツク・インコーポレーテツド 物体を流体と接触させるための噴流層装置
JP2007191726A (ja) * 2006-01-17 2007-08-02 Shimatani Giken:Kk 電気めっき装置
WO2017217216A1 (fr) * 2016-06-16 2017-12-21 株式会社村田製作所 Appareil de placage et procédé de placage
JP2019157145A (ja) * 2018-03-07 2019-09-19 中央機械株式会社 物品処理装置および物品処理方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4171249A (en) * 1977-03-17 1979-10-16 Parel Societe Anonyme Improvements in or relating to circulating bed electrodes
JPH0544083A (ja) * 1991-08-13 1993-02-23 Nisshin Steel Co Ltd 粉末の電気めつき法
JP2004527652A (ja) * 2000-12-28 2004-09-09 テクニツク・インコーポレーテツド 物体を流体と接触させるための噴流層装置
JP2007191726A (ja) * 2006-01-17 2007-08-02 Shimatani Giken:Kk 電気めっき装置
WO2017217216A1 (fr) * 2016-06-16 2017-12-21 株式会社村田製作所 Appareil de placage et procédé de placage
JP2019157145A (ja) * 2018-03-07 2019-09-19 中央機械株式会社 物品処理装置および物品処理方法

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