WO2024066425A1 - 晶圆传输系统、晶圆传输方法以及缺陷检测装置 - Google Patents

晶圆传输系统、晶圆传输方法以及缺陷检测装置 Download PDF

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Publication number
WO2024066425A1
WO2024066425A1 PCT/CN2023/097014 CN2023097014W WO2024066425A1 WO 2024066425 A1 WO2024066425 A1 WO 2024066425A1 CN 2023097014 W CN2023097014 W CN 2023097014W WO 2024066425 A1 WO2024066425 A1 WO 2024066425A1
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WIPO (PCT)
Prior art keywords
wafer
deviation
image
station
loading
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PCT/CN2023/097014
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English (en)
French (fr)
Inventor
周许超
金攀
陈志刚
张记晨
杨金国
潘炼东
刘涛
Original Assignee
上海微电子装备（集团）股份有限公司
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Publication of WO2024066425A1 publication Critical patent/WO2024066425A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Definitions

  • the present invention relates to the field of semiconductor equipment, and in particular to a wafer transmission system, a wafer transmission method and a defect detection device.
  • the wafer transmission of various machines involves the use of pre-alignment systems.
  • the most widely used is the PU rotary table pre-alignment system, which requires the wafer to rotate one circle to obtain the complete edge information of the wafer for the detection of the center position and notch position of the wafer.
  • this increases the amount of data, it does not improve the data collection accuracy itself, and it is impossible to significantly improve the accuracy of wafer pre-alignment, and it also reduces the efficiency of obtaining the center deviation and notch rotation deviation of the wafer.
  • the wafers need to be transferred to the pre-alignment table for pre-alignment before the robot transfers the wafers from the wafer library to the worktable.
  • the existing transmission scheme requires that the pre-alignment table completes the compensation of the center deviation and notch rotation deviation of the wafer, and then the robot transfers the wafer to the worktable at a predetermined position according to a predetermined path. In this way, the pre-alignment table needs to have the function of position compensation for the wafer, which increases the cost.
  • One of the purposes of the present invention is to provide a wafer transfer system that can use an existing worktable or manipulator to compensate for the wafer loading deviation (i.e., the wafer center deviation and notch rotation deviation), without requiring a predetermined station (e.g., a pre-alignment stage) to have the function of compensating for the wafer loading deviation, thereby simplifying the complexity of the pre-alignment stage and helping to reduce costs.
  • the present invention also provides a wafer transfer method and a defect detection device.
  • the wafer transmission system comprises:
  • Wafer library used to store wafers
  • a robot is used to take out the wafer from the wafer library and transfer the wafer to a predetermined process. Bit;
  • a wafer loading deviation detection module used for obtaining the wafer loading deviation of the wafer at the predetermined work station
  • a wafer loading deviation compensation module calculates a position deviation of the wafer at a handover station between the robot and the worktable based on the wafer loading deviation, the worktable moves to the handover station and adjusts its position based on the position deviation, the robot transfers the wafer from the predetermined station to the handover station, and the worktable carries the wafer from the handover station; or, the wafer loading deviation compensation module calculates a wafer loading path of the robot from the predetermined station to the handover station between the robot and the worktable based on the wafer loading deviation, the wafer loading path includes compensation for the wafer loading deviation, the robot moves to the handover station according to the wafer loading path, and transfers the wafer to the worktable.
  • the wafer loading deviation detection module is used to obtain a first image of the wafer located on the predetermined workstation, and calculate the wafer loading deviation of the wafer based on the first image.
  • the wafer deviation detection module includes a detection light source and a camera, the detection light source emits detection light to the wafer located at the predetermined workstation, and the camera receives reflected light or scattered light from the surface of the wafer to obtain the first image.
  • the wafer loading deviation detection module further includes a detection platform; the detection platform is located at the predetermined workstation, and the robot is used to transfer the wafer from the wafer library to the detection platform located at the predetermined workstation.
  • the surface of the inspection platform for placing the wafer has at least three pre-alignment marking points; and the first image includes images of at least three of the pre-alignment marking points.
  • the wafer loading deviation detection module calculates the wafer loading deviation based on the first image, including: identifying pre-alignment mark points in the first image, and obtaining a mapping transformation matrix according to the actual physical position relationship of at least three of the pre-alignment mark points on the detection table; using the mapping transformation matrix to convert the first image into a top-down plan view, the center of the top-down plan view coincides with the center of the detection table; and based on the top-down plan view, obtaining the wafer loading deviation using a centering and orientation algorithm.
  • the wafer deviation detection module further includes a device for adsorbing the wafer on the detection table.
  • a circular fork is used for adsorbing the surface of the wafer and has at least three pre-alignment mark points; the first image includes images of at least three of the pre-alignment mark points.
  • the wafer loading deviation detection module further includes a wafer fork driving mechanism, and the wafer fork driving mechanism is used to drive the wafer fork to rotate so as to perform macro defect detection on the front side or the back side of the wafer adsorbed on the wafer fork.
  • the wafer loading deviation detection module calculates the wafer loading deviation based on the first image, including: identifying pre-alignment mark points in the first image, and obtaining a mapping transformation matrix according to the actual physical position relationship of at least three of the pre-alignment mark points on the wafer fork; using the mapping transformation matrix to convert the first image into a top-down plan view, the center of the top-down plan view coincides with the center of the wafer fork; based on the top-down plan view, obtaining the wafer loading deviation using a centering and orientation algorithm.
  • the wafer loading deviation detection module obtains the wafer loading deviation of the wafer based on the top-view plan view by using a centering and orientation algorithm, including: automatically selecting a binarization threshold, binarizing the top-view plan view, and filtering out the area of the wafer in the top-view plan view by the connected domain area; extracting edge information of the wafer by using a Canny algorithm, performing circle fitting based on the edge information of the wafer, and obtaining the position of the center of the wafer in the top-view plan view; obtaining the number of deviation pixels between the center of the wafer in the top-view plan view and the center of the top-view plan view; and according to the pixel size of the top-view plan view and the number of deviation pixels, Obtain the center deviation of the wafer; according to the center position of the wafer in the top-down plan view, intercept a number of small images at the edge of the wafer; use the HOG algorithm to extract features in each small image, use the SVM supervised learning algorithm to classify, and
  • the wafer loading deviation detection module calculates the wafer loading deviation based on the first image, including: obtaining a reference image of a reference wafer photographed at the predetermined workstation, and obtaining the center coordinates and notch rotation angle of the reference wafer; and calculating the wafer loading deviation based on the center coordinates of the reference wafer. and the notch rotation angle to determine the reference wafer loading deviation; and obtaining the center coordinates and the notch rotation angle of the wafer in the first image, calculating the difference between the center coordinates and the notch rotation angle of the wafer and the reference wafer, and determining the wafer loading deviation according to the difference and the reference wafer loading deviation.
  • the shooting coordinate system of the reference image and the first image is the same.
  • the wafer transmission method comprises:
  • Step 1 The robot takes out the wafer from the wafer library and transfers the wafer to a predetermined workstation;
  • Step 2 obtaining the wafer loading deviation at the predetermined workstation.
  • Step three based on the loading deviation, calculating the position deviation of the wafer at the handover station between the robot and the worktable, the worktable moves to the handover station and adjusts its position based on the position deviation, the robot transfers the wafer from the predetermined station to the handover station, and the worktable carries the wafer from the handover station; or, the loading deviation compensation module calculates the loading path of the robot from the predetermined station to the handover station between the robot and the worktable based on the loading deviation, the loading path includes compensation for the loading deviation, the robot moves to the handover station according to the loading path, and transfers the wafer to the worktable.
  • the present invention also provides a defect detection device, which includes a workpiece stage, a defect detection system and the above-mentioned wafer transmission system; wherein the wafer transmission system transmits the wafer to the workpiece stage, and the defect detection system performs defect detection on the wafer on the workpiece stage.
  • the defect detection system includes a bright field detection light source or a dark field detection light source, and the defect detection system also includes a detector.
  • a robot is first used to transfer the wafer from a wafer library to a predetermined station; then, at the predetermined station, the wafer loading deviation is obtained; after obtaining the wafer loading deviation, based on the wafer loading deviation, the position deviation of the wafer at the handover station between the robot and the worktable is calculated, the worktable moves to the handover station and adjusts its position based on the position deviation (i.e., moves to a position after the deviation is compensated based on the position deviation), the robot transfers the wafer from the predetermined station to the handover station, and the worktable carries the wafer from the handover station; or, after obtaining the wafer loading deviation, based on the wafer loading deviation, the wafer loading path of the robot from the predetermined station to the handover station between the robot and the worktable is calculated, and the loading path The path includes compensation for the wafer loading deviation.
  • the robot moves to the handover station according to the wafer loading path and transfers the wafer to the worktable.
  • a predetermined station such as a pre-alignment table
  • a pre-alignment table to have the function of compensating for the wafer loading deviation, thereby simplifying the structural complexity of the pre-alignment table and utilizing the existing worktable or robot to perform wafer loading deviation compensation, thereby enhancing process adaptability and anti-noise interference capability and reducing equipment costs.
  • FIG. 1 is a schematic diagram of a wafer transfer system according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a wafer transport system transporting wafers according to an embodiment of the present invention.
  • FIG. 3 is a schematic plan view of a testing platform according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a wafer transport system transporting wafers according to another embodiment of the present invention.
  • FIG. 5 is a schematic plan view of a slice fork in one embodiment of the present invention.
  • 10-film library 11-robot; 11a-fork body; 11b-robot body; 12-film loading deviation detection module; 121-detection table; 122-film fork; 123-film fork driving mechanism; 13-film loading deviation compensation module; 14-workpiece table; 14a-suction cup; 20-wafer; 30-pre-alignment mark point; 40-vacuum suction cup.
  • the singular forms “a”, “an”, and “the” include plural objects, the term “or” is generally used to include the meaning of “and/or”, the term “several” is generally used to include the meaning of "at least one”, and the term “at least two” is generally used to include the meaning of "two or more”.
  • the terms “first”, “second”, and “third” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the terms “first”, “second”, and “third” are limited to The feature may include one or at least two of the features explicitly or implicitly.
  • One end and “the other end” and “the proximal end” and “the distal end” generally refer to two corresponding parts, which include not only the endpoints.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of the two elements or the interaction relationship between the two elements.
  • an element is arranged on another element, which generally only indicates that there is a connection, coupling, matching or transmission relationship between the two elements, and the connection, coupling, matching or transmission between the two elements can be direct or indirect through an intermediate element, and it cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or one side of another element, unless the content clearly indicates otherwise.
  • the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
  • FIG1 is a schematic diagram of a wafer transfer system of an embodiment of the present invention.
  • the wafer transfer system includes a wafer library 10, a robot 11, a wafer loading deviation detection module 12, and a wafer loading deviation compensation module 13.
  • the wafer library 10 is used to store wafers.
  • the robot 11 takes out the wafer from the wafer library 10 and transfers the wafer to a predetermined workstation.
  • the wafer loading deviation detection module 12 obtains the wafer loading deviation of the wafer at the predetermined workstation.
  • the wafer loading deviation compensation module 13 calculates the position deviation of the wafer at the handover station between the robot 11 and the worktable based on the wafer loading deviation, the worktable moves to the handover station and adjusts its position based on the position deviation (i.e., moves to the position after deviation compensation based on the position deviation), the robot 11 transfers the wafer from the predetermined station to the handover station, and the worktable carries the wafer from the handover station; or, the wafer loading deviation compensation module 13 calculates the wafer loading path of the robot 11 from the predetermined station to the handover station between the robot 11 and the worktable based on the wafer loading deviation, the wafer loading path includes compensation for the wafer loading deviation, the robot 11 moves to the handover station according to the wafer loading path, and transfers the wafer to the worktable.
  • FIG2 is a schematic diagram of a wafer transport system according to an embodiment of the present invention.
  • a wafer storage 10 is used to store wafers 20.
  • the mechanical The hand 11 takes out the wafer 20 from the wafer library 10 and transfers the wafer 20 to a predetermined workstation.
  • the robot 11 may include a fork body 11a and a robot body 11b located at the end of the fork body 11a.
  • the loading deviation detection module 12 obtains the loading deviation of the wafer 20 at the predetermined station. Specifically, the loading deviation detection module 12 can obtain a first image of the wafer 20 located at the predetermined station, and based on the first image, calculate the loading deviation of the wafer 20, the loading deviation of the wafer 20 includes the center deviation and the notch rotation deviation of the wafer 20, so that the center deviation and the notch rotation deviation of the wafer 20 are obtained without the wafer 20 rotating one circle, which is conducive to improving the efficiency of obtaining the loading deviation of the wafer 20, and further improving the efficiency of transferring the wafer 20 to the worktable 14.
  • the wafer deviation detection module 12 may include a detection light source (not shown in the figure) and a camera (not shown in the figure), wherein the detection light source emits detection light to the wafer 20 located at the predetermined position, and the camera receives reflected light or scattered light from the surface of the wafer 20 to obtain the first image.
  • the wafer 20 may be a silicon wafer, but is not limited thereto.
  • the camera may be an area array camera or a line array camera.
  • the area array camera receives reflected light or scattered light from the surface of the wafer 20 to obtain the first image, or the line array camera scans the wafer 20 to obtain the first image.
  • the predetermined station may be a pre-alignment station, but is not limited thereto.
  • the wafer transfer system can be applied to a defect detection device, but is not limited thereto.
  • the detection table also referred to as a macro table
  • the manipulator adsorbs the wafer and moves it to the detection table, and the fork drives the wafer to rotate to achieve macro detection of the front or back of the wafer.
  • the pre-alignment table is not required in the present application to compensate for the upper film deviation of the wafer 20, in some embodiments, as shown in Figure 2, the upper film deviation detection module 12 may also include a detection table 121, and the detection table 121 is located at the predetermined station.
  • the manipulator 11 transfers the wafer 20 from the film library 10 to the detection table 121 located at the predetermined station, so that the detection table 121 of the defect detection device is used as the predetermined station for obtaining the first image, without the need to set an additional pre-alignment table, which is conducive to reducing costs, but is not limited thereto.
  • other platforms or positions can be used as predetermined stations for obtaining the first image.
  • FIG3 is a schematic plan view of a testing platform according to an embodiment of the present invention.
  • the surface of the test platform 121 on which the wafer 20 is placed may have at least three pre-alignment mark points 30.
  • At least three pre-alignment mark points 30 may be arranged around the wafer placement area of the test platform 121.
  • at least three pre-alignment mark points 30 may be arranged on a circumference with the center of the test platform 121 as the center.
  • a vacuum suction cup 40 is provided in the wafer placement area of the test platform 121 for adsorbing the wafer 20.
  • the first image may include images of at least three of the pre-alignment mark points 30 so that the center of the test platform 121 can be determined subsequently.
  • the wafer loading deviation detection module 12 may calculate and obtain the wafer loading deviation of the wafer 20 based on the first image, which may include: identifying the pre-alignment mark points 30 in the first image, and obtaining a mapping transformation matrix according to the actual physical position relationship of at least three of the pre-alignment mark points 30 on the detection platform 121; using the mapping transformation matrix to convert the first image into a top view; and based on the top view, using a centering and orientation algorithm to obtain the wafer loading deviation of the wafer 20.
  • the center of the top view may be made to coincide with the center of the detection platform 121 in the top view, but is not limited thereto.
  • FIG4 is a schematic diagram of a wafer transfer system according to another embodiment of the present invention transferring a wafer.
  • the wafer loading deviation detection module 12 may further include a fork 122 for adsorbing the wafer 20 on the detection table 121.
  • the wafer loading deviation detection module 12 may further include a fork driving mechanism 123, and the fork driving mechanism 123 drives the fork 122 to rotate, so as to perform macro defect detection on the front or back of the wafer 20 adsorbed on the fork 122.
  • the robot 11 first takes out the wafer 20 from the wafer library 10 and transfers the wafer 20 to a predetermined station.
  • the robot 11 can transfer the wafer 20 to the inspection table 121.
  • the wafer fork 122 absorbs the wafer 20 on the predetermined station, and the camera obtains the first image of the wafer 20 located at the predetermined station.
  • the wafer loading deviation detection module 12 calculates and obtains the wafer loading deviation of the wafer 20 based on the first image.
  • FIG5 is a schematic plan view of a fork according to an embodiment of the present invention.
  • the surface of the fork 122 adsorbing the wafer 20 may have at least three pre-alignment mark points 30.
  • the at least three pre-alignment mark points 30 may be arranged around the wafer placement area of the fork 122.
  • the at least three pre-alignment mark points 30 may be arranged with the center of the fork 122 as the center of the circle.
  • a vacuum suction cup 40 is provided in the wafer placement area of the fork 122 for sucking the wafer 20.
  • the first image may include images of at least three of the pre-alignment mark points 30.
  • the wafer loading deviation detection module 12 may calculate and obtain the wafer loading deviation of the wafer 20 based on the first image, which may include: identifying the pre-alignment mark points 30 in the first image, and obtaining a mapping conversion matrix according to the actual physical position relationship of at least three of the pre-alignment mark points 30 on the fork 122; using the mapping conversion matrix to convert the first image into a top view; and based on the top view, using a centering and orientation algorithm to obtain the wafer loading deviation of the wafer 20.
  • the center of the top view may be made to coincide with the center of the fork 122 in the top view.
  • the position parameters (i.e., coordinates) of the pre-alignment mark point 30 can be read to determine the approximate area of the pre-alignment mark point 30 in the first image, so as to narrow the detection range of the pre-alignment mark point 30 and improve the detection efficiency.
  • the position of the center of the pre-alignment mark point 30 on the detection table 121 in the first image can be identified through automatic threshold binarization and connected domain screening; in the case where the pre-alignment mark point 30 is set on the fork 122, the position of the center of the pre-alignment mark point 30 on the fork 122 in the first image can be identified through automatic threshold binarization and connected domain screening.
  • the position parameters of the pre-alignment mark point 30 may also be updated for use in subsequent reading of the position parameters of the pre-alignment mark point 30 .
  • the above-mentioned wafer loading deviation detection module 12 may include: automatically selecting a binarization threshold, binarizing the top-down plan view, and filtering out the area of the wafer 20 in the top-down plan view by the connected domain area; extracting the edge information of the wafer 20 by using the Canny algorithm, performing circle fitting according to the edge information of the wafer 20, and obtaining the position of the center of the wafer 20 in the top-down plan view, that is, obtaining the center coordinates (center position) of the wafer 20; obtaining the number of deviation pixels between the center of the wafer 20 in the top-down plan view and the center of the top-down plan view.
  • the number of deviation pixels between the center of the wafer 20 and the center of the detection table 121 in the first image is obtained.
  • the number of deviation pixels between the center of the wafer 20 and the center of the detection table 121 is obtained.
  • the camera in the loading deviation detection module 12 can obtain a first image of the wafer 20.
  • no pre-alignment mark points may be set on the detection table 121 and the fork 122.
  • the loading deviation detection module 12 can calculate the loading deviation of the wafer 20 based on the first image including the wafer but not including the pre-alignment mark points.
  • the wafer loading deviation detection module 12 calculates and obtains the wafer loading deviation of the wafer 20 based on the first image, which may include: obtaining a reference image of a reference wafer photographed at the predetermined workstation, and obtaining the center coordinates and notch rotation angle of the reference wafer, and determining a reference wafer loading deviation of the reference wafer according to the center coordinates and notch rotation angle of the reference wafer; obtaining the center coordinates and notch rotation angle of the wafer 20 in the first image, calculating the difference between the center coordinates and notch rotation angle of the wafer 20 and the reference wafer, and determining the wafer loading deviation of the wafer 20 according to the difference and the reference wafer loading deviation, wherein the wafer loading deviation includes the center deviation and notch rotation deviation of the wafer 20.
  • the positions of the camera, the detection light source, and the predetermined workstation are fixed, a coordinate system for capturing an image is determined.
  • the first image and the reference image acquired at the same predetermined workstation using the fixed camera and the detection light source are captured in the same coordinate system, that is, the reference image and the first image have the same shooting coordinate system. Therefore, according to the reference wafer loading deviation and the first image in the first image, the reference wafer loading deviation is determined.
  • the difference between the center coordinates of the wafer and the reference wafer in the reference image and the notch rotation angle can be used to obtain the wafer loading deviation of the wafer 20 .
  • the deep learning target detection algorithm can be used to directly detect and locate the notch in the first image, and the center coordinates and notch vertex coordinates of the wafer 20 in the first image can be obtained.
  • the notch rotation angle of the wafer 20 can be calculated according to the center coordinates and notch vertex position of the wafer 20, but it is not limited thereto.
  • the center coordinates and notch vertex coordinates of the wafer 20 in the first image can also be obtained by other methods known in the art.
  • the wafer loading deviation compensation module 13 calculates the position deviation of the wafer 20 at the handover station between the manipulator 11 and the worktable 14 based on the loading deviation, the worktable moves to the handover station and adjusts the position based on the position deviation (moves to the position after the deviation compensation based on the position deviation), the manipulator 11 transfers the wafer 20 from the predetermined station to the handover station, and the worktable 14 carries the wafer 20 from the handover station.
  • a micro-motion table may be provided on the worktable 14, and after the worktable 14 moves to the handover station, as shown in FIG.
  • the micro-motion table moves in the X direction, the Y direction and the Rz direction to compensate for the position deviation, wherein the X direction and the Y direction are perpendicular to each other and parallel to the table surface of the worktable 14, the Z direction is perpendicular to the X direction and the Y direction, and the movement in the Rz direction is a rotation with the Z direction as the rotation axis.
  • the wafer loading deviation compensation module 13 calculates the wafer loading path of the robot from the predetermined station to the handover station of the robot 11 and the worktable 14 based on the wafer loading deviation, the wafer loading path includes compensation for the wafer loading deviation, the robot moves to the handover station according to the wafer loading path, and transfers the wafer 20 to the worktable 14.
  • the wafer loading path includes the specific position where the robot 11 places the wafer 20 on the handover station, and the specific position is the position after compensation based on the wafer loading deviation of the wafer 20.
  • a suction cup 14 a is provided in the workpiece stage 14 for sucking and fixing the wafer 20 placed on the workpiece stage 14 .
  • the wafer library 10 is used to store the wafer 20; the robot 11 transfers the wafer 20 from the wafer library 10 to a predetermined station; then the wafer loading deviation detection module 12 obtains the wafer loading deviation of the wafer 20 at the predetermined station; after obtaining the wafer loading deviation of the wafer 20, the wafer loading deviation compensation module 12
  • the module 13 calculates the position deviation of the wafer 20 at the handover station between the robot 11 and the worktable 14 based on the wafer loading deviation, the worktable 14 moves to the handover station and adjusts its position based on the position deviation, the robot 11 transfers the wafer 20 from the predetermined station to the handover station, and the worktable 14 carries the wafer from the handover station; or, after obtaining the wafer loading deviation, the wafer loading deviation compensation module 13 calculates the position deviation of the robot 11 from the predetermined station to the handover station based on the wafer loading deviation.
  • the wafer loading path of the handover station between the manipulator 11 and the worktable 14 includes compensation for the wafer loading deviation.
  • the manipulator 11 moves to the handover station according to the wafer loading path, and transfers the wafer 20 to the worktable 14.
  • a predetermined station such as a pre-alignment table
  • utilizing the existing worktable or manipulator to perform wafer loading deviation compensation thereby enhancing process adaptability and anti-noise interference capability, and reducing equipment costs.
  • the present application also provides a wafer transmission method, and the wafer transmission method is executed when the above-mentioned wafer transmission system is running.
  • the wafer transmission method includes:
  • Step 1 The robot takes out the wafer from the wafer library and transfers the wafer to a predetermined workstation;
  • Step 2 obtaining the wafer loading deviation at the predetermined workstation.
  • Step three based on the loading deviation, calculate the position deviation of the wafer at the handover station between the robot and the worktable, the worktable moves to the handover station and adjusts its position based on the position deviation, the robot transfers the wafer to the handover station, and the worktable carries the wafer from the handover station; or, based on the loading deviation, calculate a loading path of the robot from the predetermined station to the handover station between the robot and the worktable, the loading path includes compensation for the loading deviation, the robot moves to the handover station according to the loading path, and transfers the wafer to the worktable.
  • steps one to three may include multiple steps or multiple stages, and these steps or stages are not necessarily performed at the same time, but can be performed at different times.
  • the execution order of these steps or stages is not necessarily sequential, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.
  • the step of obtaining the wafer loading deviation may include: obtaining the position A first image of a wafer on the predetermined workstation is obtained, and a loading deviation of the wafer is calculated based on the first image.
  • the predetermined workstation may be a detection station of a defect detection device, but is not limited thereto.
  • the present application provides a defect detection device.
  • the defect detection device includes a workpiece stage 14 , a defect detection system, and the above-mentioned wafer transmission system.
  • the wafer transfer system includes a wafer library 10 , a robot 11 , a wafer loading deviation detection module 12 and a wafer loading deviation compensation module 13 .
  • the wafer library 10 is used to store wafers 20 .
  • the robot 11 takes out the wafer 20 from the wafer library 10 and transfers the wafer 20 to a predetermined workstation.
  • the wafer loading deviation detection module 12 obtains the wafer loading deviation of the wafer 20 at the predetermined workstation.
  • the wafer loading deviation detection module 12 may include a detection light source (not shown in the figure) and a camera (not shown in the figure), wherein the detection light source emits detection light to the wafer 20 located at the predetermined station, and the camera obtains a first image of the wafer 20 located at the predetermined station, for example, the camera may receive reflected light or scattered light from the surface of the wafer 20 to obtain the first image. After obtaining the first image, the wafer loading deviation detection module 12 calculates the wafer loading deviation of the wafer 20 based on the first image.
  • the wafer deviation detection module 12 may also include a detection table 121 (also called a macro table).
  • the detection table 121 does not have a rotation function.
  • the robot 11 transfers the wafer 20 to the detection table 121, and the wafer fork 122 drives the wafer 20 to rotate to achieve macro detection of the front or back of the wafer 20.
  • the detection station 121 can be used as the predetermined station for acquiring the first image without setting up an additional pre-alignment station, which is beneficial to reducing costs.
  • the wafer loading deviation compensation module 13 calculates the position deviation of the wafer 20 at the handover station between the robot 11 and the worktable 14 based on the wafer loading deviation.
  • the worktable 14 moves to the handover station and adjusts its position based on the position deviation.
  • the robot 11 moves the wafer 20 from the handover station to the worktable 14.
  • the predetermined station is transferred to the handover station, and the worktable 14 carries the wafer 20 from the handover station; or, the loading deviation compensation module 13 calculates the loading path of the robot 11 from the predetermined station to the handover station between the robot 11 and the worktable 14 based on the loading deviation, and the loading path includes compensation for the loading deviation.
  • the robot 11 moves to the handover station according to the loading path and transfers the wafer 20 to the worktable 14.
  • the defect detection system (not shown in the figure) performs defect detection on the wafer 20 on the workpiece stage 14 .
  • the defect detection system may include a bright field detection light source or a dark field detection light source, and the defect detection system may also include a detector.
  • the detection light emitted by the bright field detection light source irradiates the surface of the wafer 20 and generates reflected light
  • the detector detects the reflected light to detect defects on the surface of the wafer 20
  • the detection light emitted by the dark field detection light source irradiates the surface of the wafer 20 and generates scattered light
  • the detector detects the scattered light to detect defects on the surface of the wafer 20.

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Abstract

本发明提供一种晶圆传输系统。所述晶圆传输系统包括片库、机械手、上片偏差检测模块和上片偏差补偿模块；机械手用于从片库中取出晶圆，并将晶圆传输至预定工位；上片偏差检测模块用于在预定工位处获取晶圆的上片偏差；上片偏差补偿模块基于上片偏差，计算晶圆在机械手和工件台的交接工位的位置偏差，工件台运动至交接工位并基于位置偏差调整位置，机械手将晶圆传输至交接工位；或者，上片偏差补偿模块基于上片偏差，计算机械手从预定工位到机械手和工件台的交接工位的上片路径，机械手根据上片路径运动至交接工位，并将晶圆传输至工件台。如此补偿晶圆的上片偏差有利于降低成本。本发明还提供一种晶圆传输方法和一种缺陷检测装置。

Description

晶圆传输系统、晶圆传输方法以及缺陷检测装置 技术领域
本发明涉及半导体设备领域，特别涉及一种晶圆传输系统、一种晶圆传输方法和一种缺陷检测装置。
背景技术
在半导体集成电路(IC)生产制造中，多种机台的晶圆传输都涉及到预对准系统的使用。目前使用比较广泛的是PU旋转台预对准系统，该预对准系统对于晶圆的中心位置和缺口位置的检测需要使晶圆旋转一周，来获取晶圆完整的边缘信息。虽然如此增加了数据量，但却未提高数据本身的采集精度，也就无法明显的提高晶圆预对准的精度，同时也降低了获得晶圆的中心偏差和缺口旋转偏差的效率。
目前，在晶圆的生产传输过程中，机械手将晶圆从片库传输到工件台之前，需将晶圆传输至预对准台进行预对准，现有的传输方案需在预对准台完成晶圆的中心偏差和缺口旋转偏差的补偿后，再通过机械手按照既定路径将晶圆传递到位于既定位置的工件台上，如此预对准台需具有对晶圆进行位置补偿的功能，增加了成本。
发明内容
本发明的目的之一是提供一种晶圆传输系统，能够利用现有的工件台或机械手对晶圆的上片偏差(即晶圆的中心偏差和缺口旋转偏差)进行补偿，不需要预定工位(例如为预对准台)具有补偿晶圆的上片偏差的功能，从而能够简化预对准台的机构复杂程度，有利于降低成本。本发明还提供一种晶圆传输方法和一种缺陷检测装置。
为了实现上述目的，本发明一方面提供一种晶圆传输系统。所述晶圆传输系统包括：
片库，用于存放晶圆；
机械手，用于从所述片库中取出所述晶圆，并将所述晶圆传输至预定工 位；
上片偏差检测模块，用于在所述预定工位处获取所述晶圆的上片偏差；以及
上片偏差补偿模块，基于所述上片偏差，计算所述晶圆在所述机械手和工件台的交接工位的位置偏差，所述工件台运动至所述交接工位并基于所述位置偏差调整位置，所述机械手将所述晶圆从所述预定工位传输至所述交接工位，所述工件台从所述交接工位运载所述晶圆；或者，所述上片偏差补偿模块，基于所述上片偏差，计算所述机械手从所述预定工位到所述机械手和所述工件台的交接工位的上片路径，所述上片路径包括对所述上片偏差的补偿，所述机械手根据所述上片路径运动至所述交接工位，并将所述晶圆传输至所述工件台。
可选的，所述上片偏差检测模块用于获取位于所述预定工位上的所述晶圆的第一图像，且基于所述第一图像，计算所述晶圆的上片偏差。
可选的，所述上片偏差检测模块包括检测光源和相机，所述检测光源发出检测光至位于所述预定工位的所述晶圆，所述相机接收所述晶圆表面的反射光或者散射光得到所述第一图像。
可选的，所述上片偏差检测模块还包括检测台；所述检测台位于所述预定工位，所述机械手用于将所述晶圆从所述片库传输至位于所述预定工位的所述检测台。
可选的，所述检测台用于放置所述晶圆的表面具有至少三个预对准标记点；所述第一图像包括至少三个所述预对准标记点的图像。
可选的，所述上片偏差检测模块基于所述第一图像，计算所述晶圆的上片偏差包括：识别所述第一图像中的预对准标记点，根据至少三个所述预对准标记点在所述检测台上的实际物理位置关系，获得映射转换矩阵；利用所述映射转换矩阵将所述第一图像转换为俯视平面图，所述俯视平面图的中心与所述检测台的中心重合；以及基于所述俯视平面图，利用定心定向算法获得所述晶圆的上片偏差。
可选的，所述上片偏差检测模块还包括用于吸附所述检测台上的所述晶 圆的片叉，所述片叉用于吸附所述晶圆的表面具有至少三个预对准标记点；所述第一图像包括至少三个所述预对准标记点的图像。
可选的，所述上片偏差检测模块还包括片叉驱动机构，所述片叉驱动机构用于驱动所述片叉旋转，以对吸附于所述片叉上的晶圆进行正面或者背面的宏缺陷检测。
可选的，所述上片偏差检测模块基于所述第一图像，计算所述晶圆的上片偏差包括：识别所述第一图像中的预对准标记点，根据至少三个所述预对准标记点在所述片叉上的实际物理位置关系，获得映射转换矩阵；利用所述映射转换矩阵将所述第一图像转换为俯视平面图，所述俯视平面图的中心与所述片叉的中心重合；基于所述俯视平面图，利用定心定向算法获得所述晶圆的上片偏差。
可选的，所述上片偏差检测模块基于所述俯视平面图，利用定心定向算法获得所述晶圆的上片偏差包括：自动选择二值化阈值，对所述俯视平面图进行二值化处理，通过联通域面积筛选出所述俯视平面图中所述晶圆的区域；采用Canny算法提取所述晶圆的边缘信息，根据所述晶圆的边缘信息进行圆拟合，获得所述晶圆的中心在所述俯视平面图中的位置；获得所述俯视平面图中所述晶圆的中心与所述俯视平面图的中心的偏差像元数量；根据所述俯视平面图的像元尺寸和所述偏差像元数量，获得所述晶圆的中心偏差；根据所述俯视平面图中所述晶圆的中心位置，在所述晶圆的边缘截取若干张小图；使用HOG算法提取每张所述小图中的特征，利用SVM监督学习算法进行分类，输出存在缺口的小图；利用几何模板匹配算法在所述存在缺口的小图中定位所述晶圆的缺口位置，并将所述缺口位置转换到所述俯视平面图中；以及利用所述俯视平面图中所述晶圆的中心位置和缺口顶点位置，确定所述晶圆的缺口旋转偏差；所述晶圆的上片偏差包括所述晶圆的中心偏差和缺口旋转偏差。
可选的，所述上片偏差检测模块基于所述第一图像，计算所述晶圆的上片偏差包括：获取基准晶圆在所述预定工位处拍摄获得的基准图像，以及获取所述基准晶圆的中心坐标和缺口旋转角度，根据所述基准晶圆的中心坐标 和缺口旋转角度确定所述基准晶圆的基准上片偏差；以及获取所述第一图像中所述晶圆的中心坐标和缺口旋转角度，计算所述晶圆和所述基准晶圆的中心坐标和缺口旋转角度的差值，根据所述差值和所述基准上片偏差确定所述晶圆的上片偏差。
可选的，所述基准图像和所述第一图像的拍摄坐标系相同。
本发明的另一方面提供一种晶圆传输方法。所述晶圆传输方法包括：
步骤一，机械手从片库中取出晶圆，并将所述晶圆传输至预定工位；
步骤二，在所述预定工位处，获取所述晶圆的上片偏差；以及
步骤三，基于所述上片偏差，计算所述晶圆在所述机械手和工件台的交接工位的位置偏差，所述工件台运动至所述交接工位并基于所述位置偏差调整位置，所述机械手将所述晶圆从所述预定工位传输至所述交接工位，所述工件台从所述交接工位运载所述晶圆；或者，所述上片偏差补偿模块，基于所述上片偏差，计算所述机械手从所述预定工位到所述机械手和工件台的交接工位的上片路径，所述上片路径包括对所述上片偏差的补偿，所述机械手根据所述上片路径运动至所述交接工位，并将所述晶圆传输至所述工件台。
本发明还提供一种缺陷检测装置。所述缺陷检测装置包括工件台、缺陷检测系统和上述的晶圆传输系统；其中，所述晶圆传输系统将晶圆传输至所述工件台，所述缺陷检测系统对所述工件台上的所述晶圆进行缺陷检测。
可选的，所述缺陷检测系统包括明场检测光源或者暗场检测光源，所述缺陷检测系统还包括探测器。
本发明提供的晶圆传输系统、晶圆传输方法和缺陷检测装置中，首先利用机械手将晶圆从片库传输至预定工位；然后在所述预定工位处，获取所述晶圆的上片偏差；在获得晶圆的上片偏差后，基于所述上片偏差，计算晶圆在机械手和工件台的交接工位的位置偏差，所述工件台运动至所述交接工位并基于所述位置偏差调整位置(即基于所述位置偏差运动至偏差补偿后的位置)，机械手将晶圆从预定工位传输至所述交接工位，工件台从所述交接工位运载所述晶圆；或者，在获得晶圆的上片偏差之后，基于所述上片偏差，计算机械手从预定工位到机械手和工件台的交接工位的上片路径，所述上片路 径包括对所述上片偏差的补偿，所述机械手根据所述上片路径运动至所述交接工位，并将所述晶圆传输至所述工件台，如此不需要预定工位(例如为预对准台)具有补偿晶圆的上片偏差的功能，从而能够简化预对准台的机构复杂程度，且利用现有的工件台或机械手进行上片偏差补偿，增强了工艺适应性与抗噪声干扰能力，降低了设备成本。
附图说明
图1为本发明一实施例的晶圆传输系统的示意图。
图2为本发明一实施例的晶圆传输系统传输晶圆的示意图。
图3为本发明一实施例的检测台的平面示意图。
图4为本发明另一实施例的晶圆传输系统传输晶圆的示意图。
图5为本发明一实施例中片叉的平面示意图。
附图标记说明：
10-片库；11-机械手；11a-叉体；11b-机械手本体；12-上片偏差检测模块；121-检测台；122-片叉；123-片叉驱动机构；13-上片偏差补偿模块；14-工件台；14a-吸盘；20-晶圆；30-预对准标记点；40-真空吸盘。
具体实施方式
以下结合附图和具体实施例对本发明提出的晶圆传输系统以及缺陷检测装置作进一步详细说明。根据下面说明，本发明的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
如在本发明中所使用的，单数形式“一”、“一个”以及“该”包括复数对象，术语“或”通常是以包括“和/或”的含义而进行使用的，术语“若干”通常是以包括“至少一个”的含义而进行使用的，术语“至少两个”通常是以包括“两个或两个以上”的含义而进行使用的，此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三” 的特征可以明示或者隐含地包括一个或者至少两个该特征，“一端”与“另一端”以及“近端”与“远端”通常是指相对应的两部分，其不仅包括端点，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。此外，如在本发明中所使用的，一元件设置于另一元件，通常仅表示两元件之间存在连接、耦合、配合或传动关系，且两元件之间可以是直接的或通过中间元件间接的连接、耦合、配合或传动，而不能理解为指示或暗示两元件之间的空间位置关系，即一元件可以在另一元件的内部、外部、上方、下方或一侧等任意方位，除非内容另外明确指出外。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
为了降低设备成本，本发明提供一种晶圆传输系统。图1为本发明一实施例的晶圆传输系统的示意图。如图1所示，所述晶圆传输系统包括片库10、机械手11、上片偏差检测模块12和上片偏差补偿模块13。所述片库10用于存放晶圆。所述机械手11从所述片库10中取出所述晶圆，并将所述晶圆传输至预定工位。所述上片偏差检测模块12在所述预定工位处获取所述晶圆的上片偏差。所述上片偏差补偿模块13基于所述上片偏差，计算所述晶圆在所述机械手11和工件台的交接工位的位置偏差，所述工件台运动至所述交接工位并基于所述位置偏差调整位置(即基于所述位置偏差运动至偏差补偿后的位置)，所述机械手11将所述晶圆从所述预定工位传输至所述交接工位，所述工件台从所述交接工位运载所述晶圆；或者，所述上片偏差补偿模块13基于所述上片偏差，计算所述机械手11从所述预定工位到所述机械手11和所述工件台的交接工位的上片路径，所述上片路径包括对所述上片偏差的补偿，所述机械手11根据所述上片路径运动至所述交接工位，并将所述晶圆传输至所述工件台。
图2为本发明一实施例的晶圆传输系统传输晶圆的示意图。参考图2所示，片库10用于存放晶圆20。在晶圆传输系统传输晶圆20的过程中，机械 手11从所述片库10中取出所述晶圆20，并将所述晶圆20传输至预定工位。所述机械手11可以包括叉体11a和位于叉体11a端部的机械手本体11b。
在将晶圆20传输至预定工位处后，所述上片偏差检测模块12在所述预定工位处获取所述晶圆20的上片偏差。具体的，所述上片偏差检测模块12可以获取位于所述预定工位上的所述晶圆20的第一图像，且基于所述第一图像，计算所述晶圆20的上片偏差，所述晶圆20的上片偏差包括晶圆20的中心偏差和缺口旋转偏差，如此获取晶圆20的中心偏差和缺口旋转偏差不需要晶圆20旋转一周，有利于提高获取晶圆20的上片偏差的效率，进而提高晶圆20传输至工件台14上的效率。
所述上片偏差检测模块12可以包括检测光源(图中未示出)和相机(图中未示出)，所述检测光源发出检测光至位于所述预定工位的所述晶圆20，所述相机接收所述晶圆20表面的反射光或者散射光得到所述第一图像。晶圆20可以为硅片，但不限于此。
所述相机可以为面阵相机或线阵相机，面阵相机接收晶圆20表面的反射光或者散射光得到所述第一图像，或者线阵相机在晶圆20上扫描获取第一图像。
一些实施例中，所述预定工位可以为预对准台，但不限于此。
所述晶圆传输系统可以应用于缺陷检测装置，但不限于此。缺陷检测装置中的检测台(也可以称为宏观台)不具备旋转功能，在进行缺陷检测时，机械手吸附晶圆运动到检测台上，片叉带动晶圆转动以实现晶圆的正面或背面的宏观检测。由于本申请中不需要预对准台对晶圆20的上片偏差进行补偿，从而一些实施例中，如图2所示，所述上片偏差检测模块12还可以包括检测台121，所述检测台121位于所述预定工位，所述机械手11将所述晶圆20从所述片库10传输至位于所述预定工位的所述检测台121，如此以缺陷检测装置的检测台121作为获取第一图像的预定工位，而不需要设置额外的预对准台，有利于降低成本，但不限于此。在其它实施例中，可以以其它平台或位置作为获取第一图像的预定工位。
图3为本发明一实施例的检测台的平面示意图。一实施例中，如图2所 示，所述检测台121放置所述晶圆20的表面可以具有至少三个预对准标记点30。至少三个预对准标记点30可以环绕设置在检测台121的晶圆放置区域外。为了便于后续计算检测台121的中心，至少三个预对准标记点30可以设置在以检测台121的中心为圆心的圆周上。检测台121的晶圆放置区域内设置有真空吸盘40，用于吸附晶圆20。所述第一图像可以包括至少三个所述预对准标记点30的图像，以便后续确定检测台121的中心。
在获得第一图像之后，所述上片偏差检测模块12基于所述第一图像，计算获取所述晶圆20的上片偏差可以包括：识别所述第一图像中的预对准标记点30，根据至少三个所述预对准标记点30在所述检测台121上的实际物理位置关系，获得映射转换矩阵；利用所述映射转换矩阵将所述第一图像转换为俯视平面图；基于所述俯视平面图，利用定心定向算法获得所述晶圆20的上片偏差。为了便于计算晶圆20的中心偏差和缺口旋转偏差，可以使得所述俯视平面图的中心与所述俯视平面图中检测台121的中心重合，但不限于此。
图4为本发明另一实施例的晶圆传输系统传输晶圆的示意图。一实施例中，参考图1和图4所示，所述上片偏差检测模块12还可以包括用于吸附所述检测台121上的所述晶圆20的片叉122。所述上片偏差检测模块12还可以包括片叉驱动机构123，所述片叉驱动机构123驱动所述片叉122旋转，以对吸附于所述片叉122上的晶圆20进行正面或者背面的宏缺陷检测。
参考图4所示，晶圆传输系统将晶圆20传输至工件台14的流程中，机械手11首先从片库10中取出所述晶圆20，并将所述晶圆20传输至预定工位，例如机械手11可以将晶圆20传输至检测台121上。然后，片叉122吸附预定工位上的晶圆20，相机获取位于所述预定工位上的所述晶圆20的第一图像。接着，所述上片偏差检测模块12基于所述第一图像，计算获取所述晶圆20的上片偏差。
图5为本发明一实施例中片叉的平面示意图。如图5所示，片叉122吸附所述晶圆20的表面可以具有至少三个预对准标记点30。至少三个预对准标记点30可以环绕设置在片叉122的晶圆放置区域外。为了便于后续计算片叉122的中心，至少三个预对准标记点30可以设置在以片叉122的中心为圆心 的圆周上。片叉122的晶圆放置区域内设置有真空吸盘40，用于吸附晶圆20。所述第一图像可以包括至少三个所述预对准标记点30的图像。
在获得所述第一图像之后，所述上片偏差检测模块12基于所述第一图像，计算获取所述晶圆20的上片偏差可以包括：识别所述第一图像中的预对准标记点30，根据至少三个所述预对准标记点30在所述片叉122上的实际物理位置关系，获得映射转换矩阵；利用所述映射转换矩阵将所述第一图像转换为俯视平面图；基于所述俯视平面图，利用定心定向算法获得所述晶圆20的上片偏差。为了便于计算晶圆20的中心偏差和缺口旋转偏差，可以使得所述俯视平面图的中心与所述俯视平面图中片叉122的中心重合。
上述在识别所述第一图像中的预对准标记点30之前，可以读取预对准标记点30的位置参数(即坐标)，确定预对准标记点30在第一图像中的大概区域，以缩小预对准标记点30的检测范围，提高检测效率。
上述识别所述第一图像中的预对准标记点30的过程中，对于预对准标记点30设置在检测台121上的情况，可以通过自动阈值二值化和连通域筛选方式，识别检测台121上的预对准标记点30中心在第一图像中的位置；对于预对准标记点30设置在片叉122上的情况，可以通过自动阈值二值化和连通域筛选方式，识别片叉122上的预对准标记点30中心在第一图像中的位置。
在识别第一图像中的预对准标记点30之后，还可以更新预对准标记点30的位置参数，以供后续读取预对准标记点30的位置参数时使用。
上述上片偏差检测模块12基于所述俯视平面图，利用定心定向算法获得所述晶圆20的上片偏差可以包括：自动选择二值化阈值，对所述俯视平面图进行二值化处理，通过联通域面积筛选出所述俯视平面图中所述晶圆20的区域；采用Canny算法提取所述晶圆20的边缘信息，根据所述晶圆20的边缘信息进行圆拟合，获得所述晶圆20的中心在所述俯视平面图中的位置，即获得晶圆20的中心坐标(中心位置)；获得所述俯视平面图中所述晶圆20的中心与所述俯视平面图的中心的偏差像元数量，具体的，对于在检测台121上设置预对准标记点30的情况，为获取第一图像中晶圆20的中心与检测台121的中心的偏差像元数量，对于在片叉122上设置预对准标记点30的情况，为 获取第一图像中晶圆20的中心与片叉122的中心的偏差像元数量；根据所述俯视平面图的像元尺寸和所述偏差像元数量，获得所述晶圆20的中心偏差；根据所述俯视平面图中所述晶圆20的中心位置，在所述晶圆20的边缘截取若干张小图，还可以进行仿射变换，使得晶圆20的边缘方向保持一致；使用HOG算法提取每张所述小图中的特征，利用SVM监督学习算法进行分类，输出存在缺口的小图；利用几何模板匹配算法在所述存在缺口的小图中定位所述晶圆20的缺口位置，并将所述缺口位置转换到所述俯视平面图中；利用所述俯视平面图中所述晶圆20的中心位置和缺口顶点位置，确定所述晶圆20的缺口旋转角度，其中，根据晶圆20的中心和缺口顶点的连线的倾斜角确定晶圆20的缺口旋转角度，根据缺口旋转角度确定晶圆20的缺口旋转偏差，至此获得了所述晶圆20的上片偏差。需要说明的是，利用定心定向算法获得所述晶圆20的上片偏差的步骤不限于此。
另一实施例中，在机械手11将晶圆20传输至预定工位时，上片偏差检测模块12中的相机可以获取晶圆20的第一图像，这种情况下检测台121和片叉122上可以不设置预对准标记点，上片偏差检测模块12可以基于包括晶圆而不包括预对准标记点的第一图像，计算获得所述晶圆20的上片偏差。
具体的，所述上片偏差检测模块12基于所述第一图像，计算获取所述晶圆20的上片偏差可以包括：获取基准晶圆在所述预定工位处拍摄获得的基准图像，以及获取所述基准晶圆的中心坐标和缺口旋转角度，根据所述基准晶圆的中心坐标和缺口旋转角度确定所述基准晶圆的基准上片偏差；获取所述第一图像中所述晶圆20的中心坐标和缺口旋转角度，计算所述晶圆20和所述基准晶圆的中心坐标和缺口旋转角度的差值，根据所述差值和所述基准上片偏差确定所述晶圆20的上片偏差，晶圆20的上片偏差包括晶圆20的中心偏差和缺口旋转偏差。
需要说明的是，由于相机、检测光源、预定工位的位置固定，从而确定了一拍摄图像的坐标系，在同一预定工位、利用位置固定的相机和检测光源获取的第一图像和基准图像在同一坐标系中拍摄获得，即基准图像和第一图像的拍摄坐标系相同，因此，根据基准晶圆的基准上片偏差以及第一图像中 晶圆和基准图像中基准晶圆的中心坐标和缺口旋转角度的差值能够获得晶圆20的上片偏差。
其中，可以利用深度学习目标检测算法直接对第一图像进行缺口检测和定位，获得第一图像中晶圆20的中心坐标和缺口顶点坐标，根据晶圆20的中心坐标和缺口顶点位置可以计算出晶圆20的缺口旋转角度，但不限于此。还可以利用本领域公知的其它方法获得第一图像中晶圆20的中心坐标和缺口顶点坐标。
在获得晶圆20的上片偏差之后，上片偏差补偿模块13基于所述上片偏差，计算所述晶圆20在所述机械手11和所述工件台14的交接工位的位置偏差，所述工件台运动至所述交接工位并基于所述位置偏差调整位置(基于所述位置偏差运动至偏差补偿后的位置)，所述机械手11将所述晶圆20从所述预定工位传输至所述交接工位，工件台14从所述交接工位运载所述晶圆20。本实施例中，所述工件台14上可以设置有微动台，工件台14运动至交接工位之后，参考图2所示，通过所述微动台进行X方向、Y方向和Rz方向的运动，以补偿所述位置偏差，其中，X方向和Y方向相互垂直且平行于所述工件台14的台面，Z方向垂直于X方向和Y方向，Rz方向的运动为以Z方向为旋转轴的转动。
或者，在获得晶圆20的上片偏差之后，上片偏差补偿模块13基于所述上片偏差，计算所述机械手从所述预定工位到所述机械手11和所述工件台14的交接工位的上片路径，所述上片路径包括对所述上片偏差的补偿，所述机械手根据所述上片路径运动至所述交接工位，并将所述晶圆20传输至工件台14。其中，上片路径包括机械手11将晶圆20放置在交接工位上的具体位置，该具体位置为基于晶圆20的上片偏差进行补偿后的位置。
如图2和图4所示，工件台14中设置有吸盘14a，用于吸附固定放置在工件台14上的晶圆20。
本申请的晶圆传输系统中，片库10用于存放晶圆20；机械手11将晶圆20从片库10传输至预定工位；然后上片偏差检测模块12在所述预定工位处获取所述晶圆20的上片偏差；在获得晶圆20的上片偏差后，上片偏差补偿 模块13基于所述上片偏差，计算所述晶圆20在所述机械手11和工件台14的交接工位的位置偏差，所述工件台14运动至所述交接工位并基于所述位置偏差调整位置，所述机械手11将所述晶圆20从所述预定工位传输至所述交接工位，所述工件台14从所述交接工位运载所述晶圆；或者，在获得晶圆的上片偏差之后，上片偏差补偿模块13基于所述上片偏差，计算所述机械手11从所述预定工位到所述机械手11和所述工件台14的交接工位的上片路径，所述上片路径包括对所述上片偏差的补偿，所述机械手11根据所述上片路径运动至所述交接工位，并将所述晶圆20传输至所述工件台14，如此不需要预定工位(例如为预对准台)具有补偿晶圆的上片偏差的功能，从而能够简化预对准台的机构复杂程度，且利用现有的工件台或机械手进行上片偏差补偿，增强了工艺适应性与抗噪声干扰能力，降低了设备成本。
本申请还提供一种晶圆传输方法，上述的晶圆传输系统运行时执行所述晶圆传输方法。具体的，所述晶圆传输方法包括：
步骤一，机械手从片库中取出晶圆，并将所述晶圆传输至预定工位；
步骤二，在所述预定工位处，获取所述晶圆的上片偏差；以及
步骤三，基于所述上片偏差，计算所述晶圆在所述机械手和工件台的交接工位的位置偏差，所述工件台运动至所述交接工位并基于所述位置偏差调整位置，所述机械手将所述晶圆传输至所述交接工位，所述工件台从所述交接工位运载所述晶圆；或者，基于所述上片偏差，计算所述机械手从所述预定工位到所述机械手和工件台的交接工位的上片路径，所述上片路径包括对所述上片偏差的补偿，所述机械手根据所述上片路径运动至所述交接工位，并将所述晶圆传输至所述工件台。
应该理解的是，上述步骤一至步骤三的至少一部分步骤可以包括多个步骤或者多个阶段，这些步骤或者阶段并不必然是在同一时刻执行完成，而是可以在不同的时刻执行，这些步骤或者阶段的执行顺序也不必然是依次进行，而是可以与其它步骤或者其它步骤中的步骤或者阶段的至少一部分轮流或者交替地执行。
在所述预定工位处，获取所述晶圆的上片偏差的步骤可以包括：获取位 于所述预定工位上的晶圆的第一图像，且基于所述第一图像，计算所述晶圆的上片偏差。
所述预定工位可以为缺陷检测装置的检测台，但不限于此。
本申请提供一种缺陷检测装置。参考图1、图2和图4所示，所述缺陷检测装置包括工件台14、缺陷检测系统、以及上述的晶圆传输系统。
所述晶圆传输系统包括片库10、机械手11、上片偏差检测模块12和上片偏差补偿模块13。
所述片库10用于存放晶圆20。
所述机械手11从所述片库10中取出所述晶圆20，并将所述晶圆20传输至预定工位。
所述上片偏差检测模块12在所述预定工位处获取所述晶圆20的上片偏差。
具体的，所述上片偏差检测模块12可以包括检测光源(图中未示出)和相机(图中未示出)，所述检测光源发出检测光至位于所述预定工位的所述晶圆20，所述相机获取位于所述预定工位上的所述晶圆20的第一图像，例如相机可以接收所述晶圆20表面的反射光或者散射光得到所述第一图像。在获得第一图像后，所述上片偏差检测模块12基于所述第一图像，计算所述晶圆20的上片偏差。
所述上片偏差检测模块12还可以包括检测台121(也可以称为宏观台)，所述检测台121不具备旋转功能，在进行缺陷检测时，机械手11将晶圆20传输至检测台121上，片叉122带动晶圆20转动以实现晶圆20的正面或背面的宏观检测。
由于本申请中不需要在所述预定工位(例如预对准台)对晶圆20的上片偏差进行补偿，从而可以以检测台121作为获取第一图像的预定工位，而不需要设置额外的预对准台，有利于降低成本。
所述上片偏差补偿模块13基于所述上片偏差，计算所述晶圆20在所述机械手11和工件台14的交接工位的位置偏差，所述工件台14运动至所述交接工位并基于所述位置偏差调整位置，所述机械手11将所述晶圆20从所述 预定工位传输至所述交接工位，所述工件台14从所述交接工位运载所述晶圆20；或者，所述上片偏差补偿模块13基于所述上片偏差，计算所述机械手11从所述预定工位到所述机械手11和所述工件台14的交接工位的上片路径，所述上片路径包括对所述上片偏差的补偿，所述机械手11根据所述上片路径运动至所述交接工位，并将所述晶圆20传输至所述工件台14。
所述缺陷检测系统(图中未示出)对所述工件台14上的所述晶圆20进行缺陷检测。
具体的，所述缺陷检测系统可以包括明场检测光源或者暗场检测光源，所述缺陷检测系统还可以包括探测器。作为示例，明场检测光源发出的检测光照射到晶圆20的表面并产生反射光，探测器检测该反射光以检测晶圆20表面的缺陷；或者，暗场检测光源发出的检测光照射到晶圆20的表面并产生散射光，探测器检测该散射光以检测晶圆20表面的缺陷。
需要说明的是，本说明书采用递进的方式描述，在后描述的晶圆传输方法和缺陷检测装置重点说明的都是与在前描述的晶圆传输系统的不同之处，各个部分之间相同和相似的地方互相参见即可。
贯穿整个说明书中提及的“一实施例”、“另一实施例”、“一些实施例”或“本实施例”表示与实施例一起描述的特定部件、结构或特征包括在至少一个实施例中。因此，在贯穿整个说明书中的各个地方出现的短语“一实施例”、“另一实施例”、“一些实施例”或“本实施例”不是必须表示同样的实施例。
上述描述仅是对本发明较佳实施例的描述，并非对本发明权利范围的任何限定，任何本领域技术人员在不脱离本发明的精神和范围内，都可以利用上述揭示的方法和技术内容对本发明技术方案做出可能的变动和修改，因此，凡是未脱离本发明技术方案的内容，依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化及修饰，均属于本发明技术方案的保护范围。

Claims (15)

  1. 一种晶圆传输系统，其特征在于，所述晶圆传输系统包括：
    片库，用于存放晶圆；
    机械手，用于从所述片库中取出所述晶圆，并将所述晶圆传输至预定工位；
    上片偏差检测模块，用于在所述预定工位处获取所述晶圆的上片偏差；以及
    上片偏差补偿模块，基于所述上片偏差，计算所述晶圆在所述机械手和工件台的交接工位的位置偏差，所述工件台运动至所述交接工位并基于所述位置偏差调整位置，所述机械手将所述晶圆从所述预定工位传输至所述交接工位，所述工件台从所述交接工位运载所述晶圆；或者，所述上片偏差补偿模块，基于所述上片偏差，计算所述机械手从所述预定工位到所述机械手和所述工件台的交接工位的上片路径，所述上片路径包括对所述上片偏差的补偿，所述机械手根据所述上片路径运动至所述交接工位，并将所述晶圆传输至所述工件台。
  2. 如权利要求1所述的晶圆传输系统，其特征在于，所述上片偏差检测模块用于获取位于所述预定工位上的所述晶圆的第一图像，且基于所述第一图像，计算所述晶圆的上片偏差。
  3. 如权利要求2所述的晶圆传输系统，其特征在于，所述上片偏差检测模块包括检测光源和相机，所述检测光源发出检测光至位于所述预定工位的所述晶圆，所述相机接收所述晶圆表面的反射光或者散射光得到所述第一图像。
  4. 如权利要求2所述的晶圆传输系统，其特征在于，所述上片偏差检测模块还包括检测台；所述检测台位于所述预定工位，所述机械手用于将所述晶圆从所述片库传输至位于所述预定工位的所述检测台。
  5. 如权利要求4所述的晶圆传输系统，其特征在于，所述检测台用于放置所述晶圆的表面具有至少三个预对准标记点；所述第一图像包括至少三个 所述预对准标记点的图像。
  6. 如权利要求5所述的晶圆传输系统，其特征在于，所述上片偏差检测模块基于所述第一图像，计算所述晶圆的上片偏差包括：
    识别所述第一图像中的预对准标记点，根据至少三个所述预对准标记点在所述检测台上的实际物理位置关系，获得映射转换矩阵；
    利用所述映射转换矩阵将所述第一图像转换为俯视平面图，所述俯视平面图的中心与所述检测台的中心重合；以及
    基于所述俯视平面图，利用定心定向算法获得所述晶圆的上片偏差。
  7. 如权利要求4所述的晶圆传输系统，其特征在于，所述上片偏差检测模块还包括用于吸附所述检测台上的所述晶圆的片叉，所述片叉用于吸附所述晶圆的表面具有至少三个预对准标记点；所述第一图像包括至少三个所述预对准标记点的图像。
  8. 如权利要求7所述的晶圆传输系统，其特征在于，所述上片偏差检测模块还包括片叉驱动机构，所述片叉驱动机构用于驱动所述片叉旋转，以对吸附于所述片叉上的晶圆进行正面或者背面的宏缺陷检测。
  9. 如权利要求7所述的晶圆传输系统，其特征在于，所述上片偏差检测模块基于所述第一图像，计算所述晶圆的上片偏差包括：
    识别所述第一图像中的预对准标记点，根据至少三个所述预对准标记点在所述片叉上的实际物理位置关系，获得映射转换矩阵；
    利用所述映射转换矩阵将所述第一图像转换为俯视平面图，所述俯视平面图的中心与所述片叉的中心重合；以及
    基于所述俯视平面图，利用定心定向算法获得所述晶圆的上片偏差。
  10. 如权利要求6或9所述的晶圆传输系统，其特征在于，所述上片偏差检测模块基于所述俯视平面图，利用定心定向算法获得所述晶圆的上片偏差包括：
    自动选择二值化阈值，对所述俯视平面图进行二值化处理，通过联通域面积筛选出所述俯视平面图中所述晶圆的区域；
    采用Canny算法提取所述晶圆的边缘信息，根据所述晶圆的边缘信息进 行圆拟合，获得所述晶圆的中心在所述俯视平面图中的位置；
    获得所述俯视平面图中所述晶圆的中心与所述俯视平面图的中心的偏差像元数量；
    根据所述俯视平面图的像元尺寸和所述偏差像元数量，获得所述晶圆的中心偏差；
    根据所述俯视平面图中所述晶圆的中心位置，在所述晶圆的边缘截取若干张小图；
    使用HOG算法提取每张所述小图中的特征，利用SVM监督学习算法进行分类，输出存在缺口的小图；
    利用几何模板匹配算法在所述存在缺口的小图中定位所述晶圆的缺口位置，并将所述缺口位置转换到所述俯视平面图中；以及
    利用所述俯视平面图中所述晶圆的中心位置和缺口顶点位置，确定所述晶圆的缺口旋转偏差；所述晶圆的上片偏差包括所述晶圆的中心偏差和缺口旋转偏差。
  11. 如权利要求2所述的晶圆传输系统，其特征在于，所述上片偏差检测模块基于所述第一图像，计算所述晶圆的上片偏差包括：
    获取基准晶圆在所述预定工位处拍摄获得的基准图像，以及获取所述基准晶圆的中心坐标和缺口旋转角度，根据所述基准晶圆的中心坐标和缺口旋转角度确定所述基准晶圆的基准上片偏差；以及
    获取所述第一图像中所述晶圆的中心坐标和缺口旋转角度，计算所述晶圆和所述基准晶圆的中心坐标和缺口旋转角度的差值，根据所述差值和所述基准上片偏差确定所述晶圆的上片偏差。
  12. 如权利要求11所述的晶圆传输系统，其特征在于，所述基准图像和所述第一图像的拍摄坐标系相同。
  13. 一种晶圆传输方法，其特征在于，包括：
    步骤一，机械手从片库中取出晶圆，并将所述晶圆传输至预定工位；
    步骤二，在所述预定工位处，获取所述晶圆的上片偏差；以及
    步骤三，基于所述上片偏差，计算所述晶圆在所述机械手和工件台的交 接工位的位置偏差，所述工件台运动至所述交接工位并基于所述位置偏差调整位置，所述机械手将所述晶圆从所述预定工位传输至所述交接工位，所述工件台从所述交接工位运载所述晶圆；或者，所述上片偏差补偿模块，基于所述上片偏差，计算所述机械手从所述预定工位到所述机械手和工件台的交接工位的上片路径，所述上片路径包括对所述上片偏差的补偿，所述机械手根据所述上片路径运动至所述交接工位，并将所述晶圆传输至所述工件台。
  14. 一种缺陷检测装置，其特征在于，包括工件台、缺陷检测系统和如权利要求1至12中任一项所述的晶圆传输系统；其中，所述晶圆传输系统将晶圆传输至所述工件台，所述缺陷检测系统对所述工件台上的所述晶圆进行缺陷检测。
  15. 如权利要求14所述的缺陷检测装置，其特征在于，所述缺陷检测系统包括明场检测光源或者暗场检测光源，所述缺陷检测系统还包括探测器。
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