WO2024060277A1 - Clamping apparatus, manipulator, and mechanical apparatus - Google Patents

Clamping apparatus, manipulator, and mechanical apparatus Download PDF

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Publication number
WO2024060277A1
WO2024060277A1 PCT/CN2022/121882 CN2022121882W WO2024060277A1 WO 2024060277 A1 WO2024060277 A1 WO 2024060277A1 CN 2022121882 W CN2022121882 W CN 2022121882W WO 2024060277 A1 WO2024060277 A1 WO 2024060277A1
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WIPO (PCT)
Prior art keywords
clamping
clamping device
groove
length direction
base body
Prior art date
Application number
PCT/CN2022/121882
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French (fr)
Chinese (zh)
Inventor
陈定操
裴达飞
蒋孝恩
王崇林
Original Assignee
台湾积体电路制造股份有限公司
台积电(中国)有限公司
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Publication of WO2024060277A1 publication Critical patent/WO2024060277A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Definitions

  • the present application relates to the field of semiconductor manufacturing technology, and in particular to a clamping device, a manipulator and a mechanical device.
  • robotic arms can be used to automatically transport wafer boxes or wafer boats, thus saving manual labor and improving transport efficiency.
  • the gripping devices on the market are only compatible with one type of gripping wafer box or wafer boat. If they are gripped at the same time, the mechanism needs to be replaced. This not only increases the cost of selecting the mechanism, but also is more time-consuming and labor-intensive, affecting the handling efficiency. Therefore, , a new type of device is urgently needed.
  • Embodiments of the present application provide a clamping device, a manipulator and a mechanical device, which can complete the clamping of the wafer box or wafer boat and improve the transportation efficiency.
  • a clamping device for clamping at least one of a wafer box and a wafer boat.
  • the clamping device includes a bearing member and a clamping assembly.
  • the bearing member has a predetermined length and width. and thickness
  • the clamping component is arranged on the bearing member
  • the clamping component includes clamping members arranged in pairs and relatively distributed in the length direction of the bearing member
  • each clamping member is connected to the bearing member, wherein the clamping member includes The first clamping part and the second clamping part are arranged intersectingly.
  • the first clamping part is provided with a first groove that is recessed along the length direction
  • the second clamping part is provided with a recessed groove along the thickness direction of the carrier.
  • the second grooves, the first grooves of the clamping members arranged in pairs are relatively distributed and jointly clamp the crystal box
  • the second grooves of the clamping members arranged in pairs are relatively distributed and jointly clamp the crystal boat.
  • the clamping components are provided at both ends of the bearing member in the length direction, and the first clamping part and the second clamping part are vertically connected.
  • the first grooves of the clamping members arranged in pairs are symmetrically distributed in the length direction
  • the second grooves of the clamping members arranged in pairs are symmetrically distributed in the length direction
  • the first clamping portion includes a first base
  • the second clamping portion includes a second base
  • the first base is connected to the second base
  • one end of the second base away from the first base is at least partially protruded to form a connecting portion
  • the clamping device is connected to the equipment to be installed through the connecting portion.
  • the first clamping part includes a first fixing part
  • the second clamping part includes a second fixing part
  • the second fixing part is disposed on the second base body and abuts against the first base body
  • a fixing part is disposed on the first base body and is spaced apart from the second fixing part.
  • a first groove is formed between the first fixing part and the second fixing part.
  • an end of the second fixing member away from the first base forms a step structure with the second base, and the step structure is a second groove.
  • the connecting part includes a first connecting part and a second connecting part, and the first connecting part and the second connecting part are arranged at intervals in the width direction of the bearing member.
  • the clamping device further includes a measuring piece.
  • the measuring piece is arranged in the first groove and protrudes from the bottom wall of the first groove along the length direction.
  • the measuring piece can be telescopic in the length direction.
  • the measuring member is configured to detect the pressure of the clamping assembly acting on the crystal box.
  • an embodiment of the present application provides a manipulator, including the clamping device as described above.
  • an embodiment of the present application provides a mechanical device, including the robot hand as described above.
  • Embodiments of the present application provide a clamping device, a manipulator and a mechanical device.
  • the first groove can be connected with the crystal box to form an opposite crystal box.
  • the clamping device is clamped and connected with the wafer boat through the second groove to form a clamping of the wafer boat. Therefore, during the transportation process, the clamping device can be used to realize both automated transportation of the crystal box and
  • the automated handling of wafer boats is integrated and dual-purpose, which avoids the replacement of the clamping device during the handling process. It is more convenient to use, saves time and effort, improves handling efficiency, saves the operator's labor, and uses one device at the same time. It replaces two devices and saves the purchase cost of the clamping device, which is in line with the interests of the enterprise.
  • FIG1 is a schematic structural diagram of a clamping device according to an embodiment of the present application.
  • Figure 2 is a top view of a clamping device according to an embodiment of the present application.
  • FIG3 is a front view of a clamping device according to an embodiment of the present application.
  • Figure 4 is a left side view of a clamping device according to the embodiment of the present application.
  • Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished and sliced, it is formed into silicon wafers, also known as wafers. Domestic wafer production lines are mainly 8-inch and 12-inch.
  • wafers are mass-produced in existing manufacturing plants. Since their thickness is often no more than 1 mm, a large number of wafers can be arranged and placed in a wafer boat. For example, 25 wafers can be placed in the wafer boat. The wafer is placed in the wafer box and transported.
  • an embodiment of the present application provides a clamping device 100 for clamping at least one of a wafer box and a wafer boat.
  • the clamping device 100 includes a bearing 10 and a clamping assembly 20.
  • the bearing 10 With a predetermined length, width and thickness, the clamping component 20 is disposed on the bearing 10 .
  • the clamping component 20 includes clamping elements 1 arranged in pairs and relatively distributed in the length direction X of the bearing 10 .
  • Each clamping element 1 is connected to the carrier 10, wherein the clamping member 1 includes a first clamping portion 11 and a second clamping portion 12 arranged to intersect.
  • the first clamping portion 11 is provided with a first recessed portion along the length direction X.
  • the second clamping part 12 is provided with a second groove 14 recessed along the thickness direction Z of the carrier 10, the first grooves 13 of the clamping members 1 arranged in pairs are relatively distributed and jointly clamp the crystal. box, the second grooves 14 of the clamping members 1 arranged in pairs are relatively distributed and jointly clamp the wafer boat.
  • the clamping device 100 completes clamping of the wafer box or wafer boat through the mutual cooperation between the clamping components 20, which are jointly arranged on the carrier 10 to form an integral clamping structure.
  • the clamping assembly 20 includes two clamping members 1 arranged opposite each other in the length direction X.
  • Each clamping member 1 can have a right-angled structure.
  • the angle can also be adjusted according to different structural requirements. It is suitable for different clamping conditions and has better adaptability.
  • the two clamping members 1 are arranged opposite each other in the length direction Finally, the clamping is completed, which can improve the stability of the clamping and avoid falling off during transportation.
  • a clamping assembly 20 with a suitable spacing may be selected according to the volume size of the wafer box or wafer boat being transported, so as to avoid the clamping assembly 20 being too small to accommodate the wafer box or wafer boat, or being too large to cause unstable clamping.
  • the two clamping members 1 in the clamping assembly 20 can be connected through the bearing member 10.
  • the bearing member 10 can be a connecting structure such as a connecting plate. This application does not impose any special restrictions on the specific structure of the bearing member 10.
  • the clamping member 10 can be
  • the holding components 20 can form an integral structure and cooperate with each other.
  • the clamping parts 1 are arranged in pairs to ensure the clamping balance in the length direction X and avoid the tilt of the crystal box or wafer boat during transportation. .
  • each clamping member 1 can be connected to the load-bearing member 10 through bolts.
  • This application does not specifically limit the specific connection method between the clamping member 1 and the load-bearing member 10 .
  • each clamping part 1 includes a first clamping part 11 and a second clamping part 12.
  • the first clamping part 11 and the second clamping part 12 are arranged to intersect with each other. The two can be clamped according to the actual Choose the appropriate intersection angle according to the situation.
  • both the first clamping part 11 and the second clamping part 12 are plate-shaped structures, and they can be connected vertically to form a right-angled plate structure as a whole.
  • Each first clamping part 11 is provided with a first groove 13 recessed along the length direction
  • Two opposite first grooves 13 are respectively engaged with the two ends of the crystal box, thereby fixing the crystal box between the two first grooves 13 to complete the clamping process.
  • the first groove 13 is recessed along the length direction X, and the specific depth of the recess can be determined according to the position of the connecting portion 17 of the crystal box that matches it, as long as the two can snap and fit with each other.
  • the second groove 14 is located on the second clamping part 12, and the second groove 14 is used to connect and cooperate with the wafer boat to complete the clamping process of the wafer boat.
  • the second groove 14 is recessed along the thickness direction Z, and its purpose is to match the connection columnar part of the wafer boat to form a connection to the wafer boat.
  • the second grooves 14 arranged in pairs can be respectively Match the two connecting pillars of the wafer boat to form a more stable connection.
  • the opposite first clamping part 11 can also form a certain enclosure for the wafer boat, thereby further improving the stability of the connection and preventing The wafer boat is deflected or detached.
  • the clamping device 100 provided by the embodiment of the present application can form a first groove 13 and a second groove 14 in the clamping device 100, so that the first groove 13 can be connected with the crystal box to form a pair of crystals.
  • the cassette is clamped and connected with the wafer boat through the second groove 14 to clamp the wafer boat. Therefore, during the transportation process, the clamping device 100 can be used to realize automatic transportation of the wafer box. It can also realize automatic transportation of the wafer boat. It is integrated and dual-purpose, avoiding the replacement of the clamping device 100 during the transportation process. It is more convenient to use, saves time and effort, improves the transportation efficiency, and saves the labor of the operator. At the same time, Replacing two devices with one device also saves the purchase cost of the clamping device 100, which is in line with the interests of the enterprise.
  • the clamping components 20 are provided at both ends of the carrier 10 in the length direction X, and the first clamping part 11 and the second clamping part 12 are vertically connected.
  • the two clamping members 1 in the clamping assembly 20 are disposed at both ends of the carrier 10 in the length direction Balance during the process to avoid imbalance and tilt.
  • the first clamping part 11 and the second clamping part 12 in each clamping part 1 are vertically connected to each other, so that the entire clamping part 1 forms a right-angle structure and can adapt to the outer contour structure of the conventional wafer box or wafer boat. , so that the two can adaptively cooperate, and the crystal box or crystal boat can be more stably accommodated between the two clamping parts 1, thus avoiding structural conflicts.
  • the clamping device 100 provided by the embodiment of the present application maintains the orientation of the wafer box or wafer boat in the length direction X during the clamping process by disposing the clamping components 20 at both ends of the carrier 10 in the length direction X.
  • the balance improves the safety during transportation, and the right-angled structure formed by the vertical connection of the first clamping part 11 and the second clamping part 12 is better suitable for the outer contour of the wafer box or wafer boat and avoids Structural conflicts, with better applicability.
  • the first grooves 13 of the clamping members 1 arranged in pairs are symmetrically distributed in the length direction X, and the second grooves 14 of the clamping members 1 arranged in pairs Symmetrically distributed in the length direction X.
  • the two second grooves 14 opposite to each other in the length direction The process is also regular and can also simplify the process.
  • the clamping device 100 provided by the embodiment of the present application further improves the balance stability during the clamping process of the crystal box or the crystal boat by arranging the first groove 13 and the second groove 14 to be symmetrically distributed. It is more suitable for the clamping of crystal boxes or wafer boats with conventional structures. At the same time, the symmetrical structure has higher regularity, which facilitates the production and molding of the clamping device 100, simplifies the processing process, and improves production efficiency.
  • the first clamping part 11 includes a first base 15 and the second clamping part 12 includes a second base 16 .
  • the first base 15 and the second base 16 For connection, one end of the second base body 16 away from the first base body 15 is at least partially protruded to form a connection portion 17 through which the clamping device 100 is connected to the device to be installed.
  • the first clamping part 11 includes a first base 15 and the second clamping part 12 includes a second base 16.
  • the first clamping part 11 and the second clamping part 12 are arranged to intersect with each other, specifically the first base. 15 and the second base body 16, thereby forming the entire clamping member 1.
  • connection between the first base body 15 and the second base body 16 may be an integral connection or a detachable connection through bolt connection. This application does not specifically limit the specific connection method between the structures.
  • one end of the second base body 16 away from the first base body 15 protrudes in the length direction It can be a robot arm.
  • Connecting parts 17 protrude from the two oppositely arranged second base bodies 16, and the two connecting parts 17 are arranged facing each other. Both connecting parts 17 are detachably connected to the equipment to be installed, which improves the stability of the connection. Optional Ground, the two connecting parts 17 are in different layers to form a staggered distribution, and are adaptively connected to different corresponding tracks.
  • the clamping device 100 provided in the embodiment of the present application forms a connection with the equipment to be installed by providing the connecting portion 17, which is conducive to connecting the clamping device 100 to the equipment, completing the clamping and transportation of the crystal box or wafer boat, and improving the efficiency of the clamping device 100.
  • the flexibility of the connection of the clamping device 100 is improved.
  • the first clamping part 11 includes a first fixing part 18
  • the second clamping part 12 includes a second fixing part 19
  • the second fixing part 19 is provided On the second base 16 and in contact with the first base 15, the first fixing part 18 is provided on the first base 15 and spaced apart from the second fixing part 19, between the first fixing part 18 and the second fixing part 19
  • the first groove 13 is formed.
  • the first groove 13 is specifically formed by a gap between the first fixing part 18 and the second fixing part 19.
  • the first fixing part 18 and the second fixing part 19 may be blocks. Like structure, it can be a kind of fixed block connected to the first base body 15 and the second base body 16 respectively.
  • the second fixing part 19 is connected to the second base body 16 while extending and abutting against the intersecting first base body 15 , and then the first fixing part 18 is connected to the first base body 15 and forms a fixed position with the second fixing part 19 space, so that the space on the first base body 15 forms the first groove 13 .
  • the specific size of the first groove 13 depends on the distance between the first fixing part 18 and the second fixing part 19, and the depth of the first groove 13 depends on the first fixing part 18 and the second fixing part.
  • the thickness of the component 19 ensures that the size can form an effective snap connection with the crystal box.
  • connection between the first fixing part 18 and the second fixing part 19 and the first base body 15 and the second base body 16 may be an integral connection, or other detachable connection methods such as bolt connection may be used.
  • the clamping device 100 provided by the embodiment of the present application provides a structural form that forms a first groove 13, through which the first groove 13 can effectively form a snap connection with the crystal box, and at the same time, the first fixing member 18 is used.
  • the structural form of the second fixing member 19 facilitates the adjustment of the size of the first groove 13, improves the diversity of product structures, is better suitable for various types of crystal boxes, and has stronger clamping adaptability.
  • One end of the second fixing member 19 away from the first base 15 forms a step structure with the second base 16 , and the step structure is the second groove 14 .
  • the second fixing part 19 Since the second fixing part 19 is disposed on the second base 16, the extension length of the second fixing part 19 in the length direction A step-like step structure is formed between them, and this step structure is the second groove 14 .
  • the specific size of the second groove 14 depends on the thickness of the second fixing part 19 and the length difference between the second fixing part 19 and the second base 16.
  • the specific size of the second groove 14 needs to be considered for connection with it.
  • the size of the wafer boat connection part 17 ensures the matching between the two, and ultimately forms the clamping of the wafer boat.
  • the second groove 14 may extend along the width direction Y.
  • the clamping device 100 provided in the embodiment of the present application provides a structural form of a second groove 14.
  • the second groove 14 is used to realize the connection and clamping of the wafer boat.
  • the second fixing member 19 is used to connect and clamp the wafer boat.
  • the staggered layer structure of the second base 16 is also conducive to increasing the diversity of the size of the second groove 14 and can be better adapted to different types of wafer boat structures.
  • the connecting part 17 includes a first connecting part 17 a and a second connecting part 17 b.
  • the first connecting part 17 a and the second connecting part 17 b are within the width of the bearing member 10 arranged at intervals in direction Y.
  • the clamping device 100 provided in the embodiment of the present application can form a connection with the equipment to be installed by providing a first connection part 17a and a second connection part 17b on the second base 16, thereby further improving the stability of the connection. It provides reliable guarantee for the continuous and stable transportation of crystal boxes or crystal boats.
  • the clamping device 100 also includes a measuring piece 2, which is arranged in the first groove 13 and protrudes from the bottom wall of the first groove 13 along the length direction X.
  • the measuring piece 2 can be extended and retracted in the length direction X, and the measuring piece 2 is configured to detect the pressure of the clamping assembly 20 on the crystal box.
  • the crystal box can form a compression fit with the measuring piece 2 during the clamping process, thereby detecting whether the crystal box is in the first groove.
  • the measuring piece 2 has a certain telescopic ability.
  • the measuring piece 2 protrudes from the bottom wall of the first groove 13.
  • the measuring piece 2 will be moderately squeezed. Pressed into a compressed state.
  • the measuring piece 2 can be connected to an external testing device, and the connection state of the crystal box in the first groove 13 can be determined by the compression sensing of the measuring piece 2 by the crystal box, and appropriate adjustments can be made according to different conditions.
  • a clamping device 100 provided in the embodiment of the present application is provided with a measuring piece 2 on the bottom wall of the first groove 13, and the clamping of the crystal box in the first groove 13 is judged by the shrinkage degree of the measuring piece 2. state, the crystal box can be better adjusted to keep it stable in the clamping device 100 .
  • a robot arm provided in an embodiment of the present application includes the clamping device 100 as described above.
  • the above-mentioned clamping device 100 is installed on a robot hand. After the clamping device 100 clamps the crystal box or wafer boat, the robot hand is used to complete the transportation of the crystal box or wafer boat.
  • a mechanical device provided by an embodiment of the present application includes a manipulator as described above.
  • manipulator can be applied not only to the semiconductor field, but also to mechanical devices in other technical fields that require transportation. This application does not specifically limit the specific application fields.
  • the embodiment of the present application provides a clamping device 100, a robot hand and a mechanical device.
  • the first groove 13 can be used to complete the snap connection with the crystal box.
  • the automatic transportation can also realize the automatic transportation of the wafer boat. It is integrated and dual-purpose, which avoids the replacement of the clamping device 100 during the transportation process. It is more convenient to use, saves time and effort, improves the transportation efficiency, and saves operators. The labor force is reduced, and one device is used to replace two devices at the same time, which also saves the purchase cost of the clamping device 100, which is in line with the interests of the enterprise.

Abstract

The present application relates to a clamping apparatus, a manipulator, and a mechanical apparatus, which are used for clamping at least one of a wafer box and a wafer boat. The clamping apparatus comprises a carrying member and a clamping assembly. The carrying member has a predetermined length, width, and thickness. The clamping assembly is disposed on the carrying member. The clamping assembly comprises clamping members that are arranged in pairs and are distributed opposite one another in the length direction of the carrying member. Each clamping member is connected to the carrying member. Each clamping member comprises a first clamping portion and a second clamping portion which are intersectingly disposed, the first clamping portion being provided with a first groove recessed in the length direction, and the second clamping portion being provided with a second groove recessed in the thickness direction of the carrying member. The first grooves of the clamping members arranged in pairs are distributed opposite to one another and jointly clamp the wafer box, and the second grooves of the clamping members arranged in pairs are distributed opposite to one another and jointly clamp the wafer boat. The present solution can implement clamping of a wafer box or wafer boat, and improve carrying efficiency.

Description

夹持装置、机械手以及机械装置Clamping devices, robots and mechanical devices
相关申请的交叉引用Cross-references to related applications
本申请要求享有于2022年09月20日提交的名称为“夹持装置、机械手以及机械装置”的中国专利申请202222485704.5的优先权,该申请的全部内容通过引用并入本文中。This application claims the priority of Chinese patent application 202222485704.5, filed on September 20, 2022, entitled “Gripping device, manipulator and mechanical device”, the entire contents of which are incorporated herein by reference.
技术领域Technical Field
本申请涉及半导体制造技术领域,特别是涉及一种夹持装置、机械手以及机械装置。The present application relates to the field of semiconductor manufacturing technology, and in particular to a clamping device, a manipulator and a mechanical device.
背景技术Background technique
在半导体产业的制造工厂中需要生产并处理大量的晶圆,通常将大量的晶圆放置于晶舟中排布,再将其放置于晶盒中,因此需要对晶盒或晶舟进行搬运等操作。In the manufacturing factories of the semiconductor industry, a large number of wafers need to be produced and processed. A large number of wafers are usually placed in wafer boats and then placed in wafer boxes. Therefore, the wafer boxes or wafer boats need to be transported, etc. operate.
在半导体制造工厂中,通常是操作人员人工搬运,在一些自动化水平较高的工厂中,可利用机械臂实现对晶盒或晶舟的自动化搬运,从而节省了人工劳动力,提高了搬运效率。In semiconductor manufacturing factories, operators usually carry them manually. In some factories with a high level of automation, robotic arms can be used to automatically transport wafer boxes or wafer boats, thus saving manual labor and improving transport efficiency.
然而,市面上的抓取装置对于晶盒或晶舟的抓取只能兼容一种,如果同时抓取则需要更换机构,不仅提高了机构的选取成本,而且更加费时费力,影响搬运效率,因此,亟需一种新型的装置。However, the gripping devices on the market are only compatible with one type of gripping wafer box or wafer boat. If they are gripped at the same time, the mechanism needs to be replaced. This not only increases the cost of selecting the mechanism, but also is more time-consuming and labor-intensive, affecting the handling efficiency. Therefore, , a new type of device is urgently needed.
实用新型内容Utility model content
本申请实施例提供一种夹持装置、机械手以及机械装置,能够完成对晶盒或晶舟的夹持,提高了搬运效率。Embodiments of the present application provide a clamping device, a manipulator and a mechanical device, which can complete the clamping of the wafer box or wafer boat and improve the transportation efficiency.
一方面,根据本申请实施例提出了一种夹持装置,用于夹持晶盒以及晶舟中的至少一者,夹持装置包括承载件和夹持组件,承载件具有预定的 长度、宽度以及厚度,夹持组件设置于承载件上,夹持组件包括在承载件的长度方向成对设置并相对分布的夹持件,每个夹持件与承载件相连接,其中,夹持件包括相交设置的第一夹持部以及第二夹持部,第一夹持部上设置有沿长度方向凹陷设置的第一凹槽,第二夹持部设置有沿承载件的厚度方向凹陷设置的第二凹槽,成对设置的夹持件的第一凹槽相对分布并共同夹持晶盒,成对设置的夹持件的第二凹槽相对分布并共同夹持晶舟。On the one hand, according to embodiments of the present application, a clamping device is proposed for clamping at least one of a wafer box and a wafer boat. The clamping device includes a bearing member and a clamping assembly. The bearing member has a predetermined length and width. and thickness, the clamping component is arranged on the bearing member, the clamping component includes clamping members arranged in pairs and relatively distributed in the length direction of the bearing member, each clamping member is connected to the bearing member, wherein the clamping member includes The first clamping part and the second clamping part are arranged intersectingly. The first clamping part is provided with a first groove that is recessed along the length direction, and the second clamping part is provided with a recessed groove along the thickness direction of the carrier. The second grooves, the first grooves of the clamping members arranged in pairs are relatively distributed and jointly clamp the crystal box, and the second grooves of the clamping members arranged in pairs are relatively distributed and jointly clamp the crystal boat.
根据本申请实施例的一个方面,夹持组件设置于承载件在长度方向上的两端,第一夹持部与第二夹持部垂直连接。According to one aspect of the embodiment of the present application, the clamping components are provided at both ends of the bearing member in the length direction, and the first clamping part and the second clamping part are vertically connected.
根据本申请实施例的一个方面,成对设置的夹持件的第一凹槽在长度方向上对称分布,成对设置的夹持件的第二凹槽在长度方向上对称分布。According to one aspect of the embodiment of the present application, the first grooves of the clamping members arranged in pairs are symmetrically distributed in the length direction, and the second grooves of the clamping members arranged in pairs are symmetrically distributed in the length direction.
根据本申请实施例的一个方面,第一夹持部包括第一基体,第二夹持部包括第二基体,第一基体与第二基体连接,第二基体远离第一基体的一端至少部分凸出设置以形成连接部,夹持装置通过连接部与待安装设备连接。According to one aspect of an embodiment of the present application, the first clamping portion includes a first base, the second clamping portion includes a second base, the first base is connected to the second base, one end of the second base away from the first base is at least partially protruded to form a connecting portion, and the clamping device is connected to the equipment to be installed through the connecting portion.
根据本申请实施例的一个方面,第一夹持部包括第一固定件,第二夹持部包括第二固定件,第二固定件设置于第二基体上且抵接于第一基体,第一固定件设置于第一基体上且与第二固定件间隔分布,第一固定件和第二固定件之间形成第一凹槽。According to one aspect of the embodiment of the present application, the first clamping part includes a first fixing part, the second clamping part includes a second fixing part, the second fixing part is disposed on the second base body and abuts against the first base body, A fixing part is disposed on the first base body and is spaced apart from the second fixing part. A first groove is formed between the first fixing part and the second fixing part.
根据本申请实施例的一个方面,第二固定件远离第一基体的一端与第二基体形成段差结构,段差结构为第二凹槽。According to one aspect of the embodiment of the present application, an end of the second fixing member away from the first base forms a step structure with the second base, and the step structure is a second groove.
根据本申请实施例的一个方面,连接部包括第一连接部和第二连接部,第一连接部和第二连接部在承载件的宽度方向上间隔排布。According to one aspect of the embodiment of the present application, the connecting part includes a first connecting part and a second connecting part, and the first connecting part and the second connecting part are arranged at intervals in the width direction of the bearing member.
根据本申请实施例的一个方面,夹持装置还包括测量件,测量件设置于第一凹槽内并沿长度方向凸出于第一凹槽的底壁面设置,测量件能够在长度方向上伸缩,测量件被配置为检测夹持组件作用于晶盒的压力。According to one aspect of the embodiment of the present application, the clamping device further includes a measuring piece. The measuring piece is arranged in the first groove and protrudes from the bottom wall of the first groove along the length direction. The measuring piece can be telescopic in the length direction. , the measuring member is configured to detect the pressure of the clamping assembly acting on the crystal box.
另一个方面,根据本申请实施例提供一种机械手,包括如上所述的夹持装置。In another aspect, an embodiment of the present application provides a manipulator, including the clamping device as described above.
另一个方面,根据本申请实施例提供一种机械装置,包括如上所述的机械手。In another aspect, an embodiment of the present application provides a mechanical device, including the robot hand as described above.
本申请实施例提供一种夹持装置、机械手以及机械装置,通过在夹持装置中形成第一凹槽和第二凹槽,能够通过第一凹槽与晶盒完成卡接,形成对晶盒的夹持,并通过第二凹槽与晶舟完成卡接,形成对晶舟的夹持,从而在搬运过程中,利用该夹持装置,既可以实现对晶盒的自动化搬运,又可以实现对晶舟的自动化搬运,一体两用,避免了在搬运过程中对夹持装置的更换,使用时更加便捷,省时省力,提高了搬运效率,节省了操作人员的劳动力,同时用一种装置取代了两种装置,也节省了对夹持装置的采购成本,符合企业的利益需求。Embodiments of the present application provide a clamping device, a manipulator and a mechanical device. By forming a first groove and a second groove in the clamping device, the first groove can be connected with the crystal box to form an opposite crystal box. The clamping device is clamped and connected with the wafer boat through the second groove to form a clamping of the wafer boat. Therefore, during the transportation process, the clamping device can be used to realize both automated transportation of the crystal box and The automated handling of wafer boats is integrated and dual-purpose, which avoids the replacement of the clamping device during the handling process. It is more convenient to use, saves time and effort, improves handling efficiency, saves the operator's labor, and uses one device at the same time. It replaces two devices and saves the purchase cost of the clamping device, which is in line with the interests of the enterprise.
附图说明Description of drawings
下面将参考附图来描述本申请示例性实施例的特征、优点和技术效果。The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.
图1是本申请实施例的一种夹持装置的结构示意图;FIG1 is a schematic structural diagram of a clamping device according to an embodiment of the present application;
图2是本申请实施例的一种夹持装置的俯视图;Figure 2 is a top view of a clamping device according to an embodiment of the present application;
图3是本申请实施例的一种夹持装置的正视图;FIG3 is a front view of a clamping device according to an embodiment of the present application;
图4是本申请实施例的一种夹持装置的左视图。Figure 4 is a left side view of a clamping device according to the embodiment of the present application.
附图标记:Reference signs:
100-夹持装置;10-承载件;20-夹持组件;100-clamping device; 10-carrying member; 20-clamping component;
X-长度方向;Y-宽度方向;Z-厚度方向;X-length direction; Y-width direction; Z-thickness direction;
1-夹持件;11-第一夹持部;12-第二夹持部;13-第一凹槽;14-第二凹槽;15-第一基体;16-第二基体;17-连接部;17a-第一连接部;17b-第二连接部;18-第一固定件;19-第二固定件;1-clamping piece; 11-first clamping part; 12-second clamping part; 13-first groove; 14-second groove; 15-first base body; 16-second base body; 17- Connecting part; 17a-first connecting part; 17b-second connecting part; 18-first fixing part; 19-second fixing part;
2-测量件。2-Measurement piece.
在附图中,相同的部件使用相同的附图标记。附图并未按照实际的比例绘制。In the drawings, identical components have the same reference numerals. The drawings are not drawn to actual scale.
具体实施方式Detailed ways
下面将详细描述本申请的各个方面的特征和示例性实施例。在下面的详细描述中,提出了许多具体细节,以便提供对本申请的全面理解。但 是,对于本领域技术人员来说很明显的是,本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请的更好的理解。在附图和下面的描述中,至少部分的公知结构和技术没有被示出,以便避免对本申请造成不必要的模糊;并且,为了清晰,可能夸大了部分结构的尺寸。此外,下文中所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。Features and exemplary embodiments of various aspects of the application are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, it will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of the present application by illustrating examples of the present application. In the drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the present application; and, the dimensions of some structures may be exaggerated for clarity. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.
下述描述中出现的方位词均为图中示出的方向,并不是对本申请的夹持装置、机械手以及机械装置的具体结构进行限定。在本申请的描述中,还需要说明的是,除非另有明确的规定和限定,术语“安装”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是直接相连,也可以间接相连。对于本领域的普通技术人员而言,可视具体情况理解上述术语在本申请中的具体含义。The directional words appearing in the following description are the directions shown in the figures, and do not limit the specific structures of the clamping device, manipulator and mechanical device of the present application. In the description of this application, it should also be noted that, unless otherwise clearly stated and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection, or Connected integrally; either directly or indirectly. For those of ordinary skill in the art, the specific meanings of the above terms in this application may be understood based on specific circumstances.
随着电子产品的逐渐普及和发展,人们对电子产品的需求越来越大,因此对于电子产品所需半导体原材料的制作来说,生产效率成为不可忽视的问题,如何提高生产效率成为各大企业共同面对的问题,对于技术改进等方向面临更大的挑战。With the gradual popularization and development of electronic products, people's demand for electronic products is increasing. Therefore, for the production of semiconductor raw materials required for electronic products, production efficiency has become an issue that cannot be ignored. How to improve production efficiency has become a major issue for major enterprises. We face common problems and face greater challenges in technological improvement and other directions.
晶圆是指制作硅半导体电路所用的硅晶片,其原始材料是硅。高纯度的多晶硅溶解后掺入硅晶体晶种,然后慢慢拉出,形成圆柱形的单晶硅。硅晶棒在经过研磨、抛光以及切片后,形成硅晶圆片,也就是晶圆。国内晶圆生产线以8英寸和12英寸为主。Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished and sliced, it is formed into silicon wafers, also known as wafers. Domestic wafer production lines are mainly 8-inch and 12-inch.
晶圆作为半导体及芯片制备的原材料在现有的制造工厂中批量制造生产,因其厚度往往不超过1mm,可将大量的晶圆排布放置于晶舟中,例如可在晶舟中装25片晶圆,再将其放置于晶盒中后进行搬运。As raw materials for semiconductor and chip preparation, wafers are mass-produced in existing manufacturing plants. Since their thickness is often no more than 1 mm, a large number of wafers can be arranged and placed in a wafer boat. For example, 25 wafers can be placed in the wafer boat. The wafer is placed in the wafer box and transported.
申请人发现,在制造工厂中往往是操作工人手动进行搬运,增加了操作工人的工作量,在一些自动化程度较高的工厂中,是通过机械臂夹持晶盒或晶舟完成搬运,减轻了操作工人的劳动负担,但是现有的夹取装置只能夹取晶盒或者晶舟的一种,若同时需要夹取晶盒或者晶舟时,只能更换设备完成夹取,不仅费时费力,降低了搬运效率,还增加了前期的设备采购成本。基于上述问题,申请人提出了本方案。The applicant found that in manufacturing factories, operators often carry out manual transportation, which increases the workload of operators. In some factories with a higher degree of automation, the transportation is completed by clamping wafer boxes or wafer boats with robotic arms, which reduces the workload. The operator's labor burden is heavy, but the existing clamping device can only clamp one of the crystal box or the wafer boat. If the crystal box or the wafer boat needs to be clamped at the same time, the equipment can only be replaced to complete the clamping, which is not only time-consuming and labor-intensive, but also This reduces the handling efficiency and increases the initial equipment purchase cost. Based on the above problems, the applicant proposed this plan.
为了更好地理解本申请,下面结合图1至4对本申请实施例的夹持装置、机械手以及机械装置进行详细描述。In order to better understand the present application, the clamping device, manipulator and mechanical device of the embodiment of the present application will be described in detail below with reference to FIGS. 1 to 4 .
请参阅图1,本申请实施例提出了一种夹持装置100,用于夹持晶盒以及晶舟中的至少一者,夹持装置100包括承载件10和夹持组件20,承载件10具有预定的长度、宽度以及厚度,夹持组件20设置于承载件10上,夹持组件20包括在承载件10的长度方向X成对设置并相对分布的夹持件1,每个夹持件1与承载件10相连接,其中,夹持件1包括相交设置的第一夹持部11以及第二夹持部12,第一夹持部11上设置有沿长度方向X凹陷设置的第一凹槽13,第二夹持部12设置有沿承载件10的厚度方向Z凹陷设置的第二凹槽14,成对设置的夹持件1的第一凹槽13相对分布并共同夹持晶盒,成对设置的夹持件1的第二凹槽14相对分布并共同夹持晶舟。Referring to Figure 1, an embodiment of the present application provides a clamping device 100 for clamping at least one of a wafer box and a wafer boat. The clamping device 100 includes a bearing 10 and a clamping assembly 20. The bearing 10 With a predetermined length, width and thickness, the clamping component 20 is disposed on the bearing 10 . The clamping component 20 includes clamping elements 1 arranged in pairs and relatively distributed in the length direction X of the bearing 10 . Each clamping element 1 is connected to the carrier 10, wherein the clamping member 1 includes a first clamping portion 11 and a second clamping portion 12 arranged to intersect. The first clamping portion 11 is provided with a first recessed portion along the length direction X. Groove 13, the second clamping part 12 is provided with a second groove 14 recessed along the thickness direction Z of the carrier 10, the first grooves 13 of the clamping members 1 arranged in pairs are relatively distributed and jointly clamp the crystal. box, the second grooves 14 of the clamping members 1 arranged in pairs are relatively distributed and jointly clamp the wafer boat.
在本实施例中,夹持装置100通过夹持组件20之间的相互配合完成对晶盒或晶舟的夹持,夹持组件20共同设置于承载件10上以形成整体的夹持结构。In this embodiment, the clamping device 100 completes clamping of the wafer box or wafer boat through the mutual cooperation between the clamping components 20, which are jointly arranged on the carrier 10 to form an integral clamping structure.
可选地,夹持组件20包括两个在长度方向X上相对设置的夹持件1,每个夹持件1可呈直角形结构,当然,也可根据不同的结构需求对角度进行调整,以适用于不同的夹持工况,具有更好的适应能力。Optionally, the clamping assembly 20 includes two clamping members 1 arranged opposite each other in the length direction X. Each clamping member 1 can have a right-angled structure. Of course, the angle can also be adjusted according to different structural requirements. It is suitable for different clamping conditions and has better adaptability.
将两个夹持件1在长度方向X上相对设置是考虑到所夹晶盒或晶舟的体积尺寸,确保两个夹持件1之间的间距足够大,能够将晶盒或晶舟容纳后完成夹持,从而可以提高夹持的稳定性,避免搬运过程中的脱落。The two clamping members 1 are arranged opposite each other in the length direction Finally, the clamping is completed, which can improve the stability of the clamping and avoid falling off during transportation.
可选地,可根据所搬运的晶盒或晶舟的体积尺寸选择间距适合的夹持组件20,避免夹持组件20尺寸过小无法容纳,或尺寸过大造成夹持不稳。Optionally, a clamping assembly 20 with a suitable spacing may be selected according to the volume size of the wafer box or wafer boat being transported, so as to avoid the clamping assembly 20 being too small to accommodate the wafer box or wafer boat, or being too large to cause unstable clamping.
夹持组件20中的两个夹持件1可通过承载件10连接,可选地,承载件10可以是连接板等连接结构,本申请对承载件10的具体结构不作特殊限定,能够使夹持组件20形成整体结构并相互配合均可。The two clamping members 1 in the clamping assembly 20 can be connected through the bearing member 10. Alternatively, the bearing member 10 can be a connecting structure such as a connecting plate. This application does not impose any special restrictions on the specific structure of the bearing member 10. The clamping member 10 can be The holding components 20 can form an integral structure and cooperate with each other.
考虑到对晶盒或晶舟夹持时的平衡性,所以将夹持件1成对设置,以确保在长度方向X上的夹持平衡,避免出现晶盒或晶舟在搬运过程中发生 倾斜。Considering the balance when clamping the crystal box or wafer boat, the clamping parts 1 are arranged in pairs to ensure the clamping balance in the length direction X and avoid the tilt of the crystal box or wafer boat during transportation. .
可选地,每个夹持件1可与承载件10通过螺栓连接,本申请对夹持件1与承载件10的具体连接方式不作特殊限定。Optionally, each clamping member 1 can be connected to the load-bearing member 10 through bolts. This application does not specifically limit the specific connection method between the clamping member 1 and the load-bearing member 10 .
每个夹持件1的具体结构中包括第一夹持部11以及第二夹持部12,第一夹持部11以及第二夹持部12之间相交设置,两者可根据实际夹持情况选取合适的相交角度。The specific structure of each clamping part 1 includes a first clamping part 11 and a second clamping part 12. The first clamping part 11 and the second clamping part 12 are arranged to intersect with each other. The two can be clamped according to the actual Choose the appropriate intersection angle according to the situation.
可选地,第一夹持部11以及第二夹持部12均为板状结构,两者可垂直连接,整体形成直角板结构。Optionally, both the first clamping part 11 and the second clamping part 12 are plate-shaped structures, and they can be connected vertically to form a right-angled plate structure as a whole.
在每个第一夹持部11上设置沿长度方向X凹陷设置的第一凹槽13,第一凹槽13主要用于对晶盒的卡接,如此一来,在长度方向X上形成了两个相对的第一凹槽13,两个第一凹槽13分别卡接于晶盒的两端,从而将晶盒固定于两个第一凹槽13之间,完成夹持过程。Each first clamping part 11 is provided with a first groove 13 recessed along the length direction Two opposite first grooves 13 are respectively engaged with the two ends of the crystal box, thereby fixing the crystal box between the two first grooves 13 to complete the clamping process.
可选地,第一凹槽13沿长度方向X凹陷,具体的凹陷深度可根据与之匹配的晶盒的连接部17位而定,两者能够相互卡接配合即可。Optionally, the first groove 13 is recessed along the length direction X, and the specific depth of the recess can be determined according to the position of the connecting portion 17 of the crystal box that matches it, as long as the two can snap and fit with each other.
所设的第二凹槽14位于第二夹持部12上,第二凹槽14用于与晶舟的连接配合,完成对晶舟的夹持过程。The second groove 14 is located on the second clamping part 12, and the second groove 14 is used to connect and cooperate with the wafer boat to complete the clamping process of the wafer boat.
可选地,第二凹槽14是沿厚度方向Z凹陷设置的,其目的是与晶舟的连接柱状部位相匹配,形成对晶舟的连接,而成对设置的第二凹槽14可分别匹配晶舟的两个连接柱状部位,从而形成更加稳固的连接。Optionally, the second groove 14 is recessed along the thickness direction Z, and its purpose is to match the connection columnar part of the wafer boat to form a connection to the wafer boat. The second grooves 14 arranged in pairs can be respectively Match the two connecting pillars of the wafer boat to form a more stable connection.
在晶舟与第二夹持部12上的第二凹槽14形成连接的同时,相对的第一夹持部11也能够对晶舟形成一定的围护,从而进一步提高连接的稳定性,防止晶舟的偏移或者脱落。While the wafer boat is connected to the second groove 14 on the second clamping part 12, the opposite first clamping part 11 can also form a certain enclosure for the wafer boat, thereby further improving the stability of the connection and preventing The wafer boat is deflected or detached.
本申请实施例提供的一种夹持装置100,通过在夹持装置100中形成第一凹槽13和第二凹槽14,能够通过第一凹槽13与晶盒完成卡接,形成对晶盒的夹持,并通过第二凹槽14与晶舟完成卡接,形成对晶舟的夹持,从而在搬运过程中,利用该夹持装置100,既可以实现对晶盒的自动化搬运,又可以实现对晶舟的自动化搬运,一体两用,避免了在搬运过程中对夹持装置100的更换,使用时更加便捷,省时省力,提高了搬运效率,节省了操作人员的劳动力,同时用一种装置取代了两种装置,也节省 了对夹持装置100的采购成本,符合企业的利益需求。The clamping device 100 provided by the embodiment of the present application can form a first groove 13 and a second groove 14 in the clamping device 100, so that the first groove 13 can be connected with the crystal box to form a pair of crystals. The cassette is clamped and connected with the wafer boat through the second groove 14 to clamp the wafer boat. Therefore, during the transportation process, the clamping device 100 can be used to realize automatic transportation of the wafer box. It can also realize automatic transportation of the wafer boat. It is integrated and dual-purpose, avoiding the replacement of the clamping device 100 during the transportation process. It is more convenient to use, saves time and effort, improves the transportation efficiency, and saves the labor of the operator. At the same time, Replacing two devices with one device also saves the purchase cost of the clamping device 100, which is in line with the interests of the enterprise.
作为一种可选的实施例,请参阅图1,夹持组件20设置于承载件10在长度方向X上的两端,第一夹持部11与第二夹持部12垂直连接。As an optional embodiment, please refer to FIG. 1 . The clamping components 20 are provided at both ends of the carrier 10 in the length direction X, and the first clamping part 11 and the second clamping part 12 are vertically connected.
在本实施例中,将夹持组件20中的两个夹持件1设置于承载件10在长度方向X上的两端,从而形成对晶盒或晶舟两端的卡接,确保夹持搬运过程中的平衡,避免出现失衡倾斜的情况。In this embodiment, the two clamping members 1 in the clamping assembly 20 are disposed at both ends of the carrier 10 in the length direction Balance during the process to avoid imbalance and tilt.
每个夹持件1中的第一夹持部11与第二夹持部12相互垂直连接,使得整体夹持件1形成直角结构,同时能够适应常规使用的晶盒或晶舟的外轮廓结构,使两者能够适应性配合,晶盒或晶舟能够更稳定的容纳在两个夹持件1之间,避免了结构上的冲突。The first clamping part 11 and the second clamping part 12 in each clamping part 1 are vertically connected to each other, so that the entire clamping part 1 forms a right-angle structure and can adapt to the outer contour structure of the conventional wafer box or wafer boat. , so that the two can adaptively cooperate, and the crystal box or crystal boat can be more stably accommodated between the two clamping parts 1, thus avoiding structural conflicts.
本申请实施例提供的一种夹持装置100,通过将夹持组件20设置于承载件10在长度方向X上的两端,维持了晶盒或晶舟在夹持过程中在长度方向X上的平衡,提高了搬运过程中的安全性,而第一夹持部11与第二夹持部12垂直连接形成的直角形结构,更好的适用于晶盒或晶舟的外轮廓,避免了结构上的冲突,具有更好的适用性。The clamping device 100 provided by the embodiment of the present application maintains the orientation of the wafer box or wafer boat in the length direction X during the clamping process by disposing the clamping components 20 at both ends of the carrier 10 in the length direction X. The balance improves the safety during transportation, and the right-angled structure formed by the vertical connection of the first clamping part 11 and the second clamping part 12 is better suitable for the outer contour of the wafer box or wafer boat and avoids Structural conflicts, with better applicability.
作为一种可选的实施例,请参阅图1,成对设置的夹持件1的第一凹槽13在长度方向X上对称分布,成对设置的夹持件1的第二凹槽14在长度方向X上对称分布。As an optional embodiment, please refer to Figure 1. The first grooves 13 of the clamping members 1 arranged in pairs are symmetrically distributed in the length direction X, and the second grooves 14 of the clamping members 1 arranged in pairs Symmetrically distributed in the length direction X.
将在长度方向X上相对设置的两个第一凹槽13对称排布,使两者具有相对的位置,并具有相同的尺寸,有利于进一步维持与晶盒的两端卡接平衡,同时简化了两个第一凹槽13的制作工艺,便于生产加工。Arranging the two first grooves 13 opposite each other in the length direction The manufacturing process of the two first grooves 13 is adopted to facilitate production and processing.
将在长度方向X上相对设置的两个第二凹槽14同样对称排布,在对晶舟进行夹持时,也能够维持晶舟的两端卡接平衡,对于第二凹槽14的制作工艺也具有规律性,同样能够简化工艺流程。The two second grooves 14 opposite to each other in the length direction The process is also regular and can also simplify the process.
本申请实施例提供的一种夹持装置100,通过将第一凹槽13和第二凹槽14均设置为对称分布,进一步提高了对晶盒或晶舟夹持过程中的平衡稳定性,更加适用于常规结构的晶盒或晶舟的卡接,同时对称结构具有更高的规律性,便于夹持装置100制作生产的成型,简化了加工流程,提高了生产效率。The clamping device 100 provided by the embodiment of the present application further improves the balance stability during the clamping process of the crystal box or the crystal boat by arranging the first groove 13 and the second groove 14 to be symmetrically distributed. It is more suitable for the clamping of crystal boxes or wafer boats with conventional structures. At the same time, the symmetrical structure has higher regularity, which facilitates the production and molding of the clamping device 100, simplifies the processing process, and improves production efficiency.
作为一种可选的实施例,请参阅图1至图4,第一夹持部11包括第一基体15,第二夹持部12包括第二基体16,第一基体15与第二基体16连接,第二基体16远离第一基体15的一端至少部分凸出设置以形成连接部17,夹持装置100通过连接部17与待安装设备连接。As an optional embodiment, please refer to FIGS. 1 to 4 . The first clamping part 11 includes a first base 15 and the second clamping part 12 includes a second base 16 . The first base 15 and the second base 16 For connection, one end of the second base body 16 away from the first base body 15 is at least partially protruded to form a connection portion 17 through which the clamping device 100 is connected to the device to be installed.
在本实施例中,第一夹持部11包括第一基体15,第二夹持部12包括第二基体16,第一夹持部11与第二夹持部12相交设置具体为第一基体15与第二基体16的连接,从而形成夹持件1整体。In this embodiment, the first clamping part 11 includes a first base 15 and the second clamping part 12 includes a second base 16. The first clamping part 11 and the second clamping part 12 are arranged to intersect with each other, specifically the first base. 15 and the second base body 16, thereby forming the entire clamping member 1.
可选地,第一基体15与第二基体16的连接可以是一体成型连接,也可以是通过螺栓连接等可拆卸连接,本申请对结构间具体的连接方式不作特殊限定。Optionally, the connection between the first base body 15 and the second base body 16 may be an integral connection or a detachable connection through bolt connection. This application does not specifically limit the specific connection method between the structures.
可选地,第二基体16远离第一基体15的一端沿长度方向X上凸出一部分形成连接部17,连接部17上设置有螺栓孔用于与待安装设备连接,其中,该待安装设备可以是机械手。Optionally, one end of the second base body 16 away from the first base body 15 protrudes in the length direction It can be a robot arm.
两个相对设置的第二基体16上均凸出连接部17,形成的两个连接部17相向设置,两个连接部17均与待安装设备可拆卸连接,提高了连接的稳定性,可选地,两个连接部17不同层以形成错层分布,适应性连接于不同对应的轨道。Connecting parts 17 protrude from the two oppositely arranged second base bodies 16, and the two connecting parts 17 are arranged facing each other. Both connecting parts 17 are detachably connected to the equipment to be installed, which improves the stability of the connection. Optional Ground, the two connecting parts 17 are in different layers to form a staggered distribution, and are adaptively connected to different corresponding tracks.
本申请实施例提供的一种夹持装置100,通过设置连接部17形成与待安装设备的连接,有利于夹持装置100连接于设备上,完成对晶盒或晶舟的夹持搬运,提高了夹持装置100连接的灵活性。The clamping device 100 provided in the embodiment of the present application forms a connection with the equipment to be installed by providing the connecting portion 17, which is conducive to connecting the clamping device 100 to the equipment, completing the clamping and transportation of the crystal box or wafer boat, and improving the efficiency of the clamping device 100. The flexibility of the connection of the clamping device 100 is improved.
作为一种可选的实施例,请继续参阅图1至图4,第一夹持部11包括第一固定件18,第二夹持部12包括第二固定件19,第二固定件19设置于第二基体16上且抵接于第一基体15,第一固定件18设置于第一基体15上且与第二固定件19间隔分布,第一固定件18和第二固定件19之间形成第一凹槽13。As an optional embodiment, please continue to refer to FIGS. 1 to 4 , the first clamping part 11 includes a first fixing part 18 , the second clamping part 12 includes a second fixing part 19 , and the second fixing part 19 is provided On the second base 16 and in contact with the first base 15, the first fixing part 18 is provided on the first base 15 and spaced apart from the second fixing part 19, between the first fixing part 18 and the second fixing part 19 The first groove 13 is formed.
在本实施例中,第一凹槽13具体是通过第一固定件18和第二固定件19之间的间隙形成的,可选地,第一固定件18和第二固定件19可选用块状结构,可以是一种固定块分别连接于第一基体15和第二基体16上。In this embodiment, the first groove 13 is specifically formed by a gap between the first fixing part 18 and the second fixing part 19. Optionally, the first fixing part 18 and the second fixing part 19 may be blocks. Like structure, it can be a kind of fixed block connected to the first base body 15 and the second base body 16 respectively.
将第二固定件19连接于第二基体16上同时延伸抵接于相交设置的第 一基体15上,再将第一固定件18连接于第一基体15上并与第二固定件19形成一定间隔,从而使在第一基体15上的该间隔形成了第一凹槽13。The second fixing part 19 is connected to the second base body 16 while extending and abutting against the intersecting first base body 15 , and then the first fixing part 18 is connected to the first base body 15 and forms a fixed position with the second fixing part 19 space, so that the space on the first base body 15 forms the first groove 13 .
可选地,第一凹槽13的具体尺寸取决于第一固定件18和第二固定件19之间的距离,第一凹槽13的深度取决于所设第一固定件18和第二固定件19的厚度,确保该尺寸能够与晶盒形成有效卡接。Optionally, the specific size of the first groove 13 depends on the distance between the first fixing part 18 and the second fixing part 19, and the depth of the first groove 13 depends on the first fixing part 18 and the second fixing part. The thickness of the component 19 ensures that the size can form an effective snap connection with the crystal box.
可选地,第一固定件18和第二固定件19与第一基体15和第二基体16的连接可以是一体成型连接,也可以采用螺栓连接等其他可拆卸连接方式。Optionally, the connection between the first fixing part 18 and the second fixing part 19 and the first base body 15 and the second base body 16 may be an integral connection, or other detachable connection methods such as bolt connection may be used.
本申请实施例提供的一种夹持装置100,提供了一种形成第一凹槽13的结构形式,通过该第一凹槽13有效形成与晶盒的卡接,同时利用第一固定件18和第二固定件19的结构形式,便于对第一凹槽13尺寸的调整,提高产品结构的多样性,更好的适用于多种类型的晶盒,具有更强的夹持适应性。The clamping device 100 provided by the embodiment of the present application provides a structural form that forms a first groove 13, through which the first groove 13 can effectively form a snap connection with the crystal box, and at the same time, the first fixing member 18 is used. The structural form of the second fixing member 19 facilitates the adjustment of the size of the first groove 13, improves the diversity of product structures, is better suitable for various types of crystal boxes, and has stronger clamping adaptability.
作为一种可选的实施例,请参阅图1,第二固定件19远离第一基体15的一端与第二基体16形成段差结构,段差结构为第二凹槽14。As an optional embodiment, please refer to FIG. 1 . One end of the second fixing member 19 away from the first base 15 forms a step structure with the second base 16 , and the step structure is the second groove 14 .
由于第二固定件19设置于第二基体16上,可使第二固定件19在长度方向X上的延伸长度小于第二基体16,如此一来,第二固定件19与第二基体16之间形成台阶状的段差结构,该段差结构即为第二凹槽14。Since the second fixing part 19 is disposed on the second base 16, the extension length of the second fixing part 19 in the length direction A step-like step structure is formed between them, and this step structure is the second groove 14 .
可选地,第二凹槽14的具体尺寸取决于第二固定件19的厚度以及第二固定件19与第二基体16的长度差,对于第二凹槽14的具体尺寸需考虑与之连接的晶舟连接部17位的尺寸,确保两者的匹配度,最终形成对晶舟的夹持。Optionally, the specific size of the second groove 14 depends on the thickness of the second fixing part 19 and the length difference between the second fixing part 19 and the second base 16. The specific size of the second groove 14 needs to be considered for connection with it. The size of the wafer boat connection part 17 ensures the matching between the two, and ultimately forms the clamping of the wafer boat.
为了适应与常规晶舟的连接,第二凹槽14可沿宽度方向Y上延伸。In order to adapt to the connection with a conventional wafer boat, the second groove 14 may extend along the width direction Y.
本申请实施例提供的一种夹持装置100,提供了一种第二凹槽14的结构形式,利用第二凹槽14实现了对晶舟的连接夹持,同时采用第二固定件19与第二基体16的错层结构也有利于提高第二凹槽14尺寸的多样性,能够更好的适用于不同类型的晶舟结构。The clamping device 100 provided in the embodiment of the present application provides a structural form of a second groove 14. The second groove 14 is used to realize the connection and clamping of the wafer boat. At the same time, the second fixing member 19 is used to connect and clamp the wafer boat. The staggered layer structure of the second base 16 is also conducive to increasing the diversity of the size of the second groove 14 and can be better adapted to different types of wafer boat structures.
作为一种可选的实施例,请参阅图1至图4,连接部17包括第一连接部17a和第二连接部17b,第一连接部17a和第二连接部17b在承载件10 的宽度方向Y上间隔排布。As an optional embodiment, please refer to FIGS. 1 to 4 . The connecting part 17 includes a first connecting part 17 a and a second connecting part 17 b. The first connecting part 17 a and the second connecting part 17 b are within the width of the bearing member 10 arranged at intervals in direction Y.
本申请实施例提供的一种夹持装置100,通过在第二基体16上设置第一连接部17a和第二连接部17b,可分别与待安装设备形成连接,进一步提高了连接的稳定性,为持续稳定的搬运晶盒或晶舟提供了可靠的保障。The clamping device 100 provided in the embodiment of the present application can form a connection with the equipment to be installed by providing a first connection part 17a and a second connection part 17b on the second base 16, thereby further improving the stability of the connection. It provides reliable guarantee for the continuous and stable transportation of crystal boxes or crystal boats.
作为一种可选的实施例,请参阅图2,夹持装置100还包括测量件2,测量件2设置于第一凹槽13内并沿长度方向X凸出于第一凹槽13的底壁面设置,测量件2能够在长度方向X上伸缩,测量件2被配置为检测夹持组件20作用于晶盒的压力。As an optional embodiment, please refer to Figure 2, the clamping device 100 also includes a measuring piece 2, which is arranged in the first groove 13 and protrudes from the bottom wall of the first groove 13 along the length direction X. The measuring piece 2 can be extended and retracted in the length direction X, and the measuring piece 2 is configured to detect the pressure of the clamping assembly 20 on the crystal box.
在本实施例中,通过在第一凹槽13的底壁面上设置测量件2,使得在夹持过程中,晶盒能够与测量件2形成压缩配合,从而检测出晶盒在第一凹槽13中的卡接程度。In this embodiment, by arranging the measuring piece 2 on the bottom wall of the first groove 13, the crystal box can form a compression fit with the measuring piece 2 during the clamping process, thereby detecting whether the crystal box is in the first groove. The degree of snap-in in 13.
可选地,测量件2具有一定的伸缩能力,在没有夹持晶盒时,测量件2凸出于第一凹槽13的底壁面,当夹持晶盒时,测量件2会被适度挤压形成压缩状态。Optionally, the measuring piece 2 has a certain telescopic ability. When the crystal box is not clamped, the measuring piece 2 protrudes from the bottom wall of the first groove 13. When the crystal box is clamped, the measuring piece 2 will be moderately squeezed. Pressed into a compressed state.
测量件2可外接检测设备,通过测量件2被晶盒的压缩传感判断出晶盒在第一凹槽13中的连接状态,可根据不同的状态进行适度的调整。The measuring piece 2 can be connected to an external testing device, and the connection state of the crystal box in the first groove 13 can be determined by the compression sensing of the measuring piece 2 by the crystal box, and appropriate adjustments can be made according to different conditions.
本申请实施例提供的一种夹持装置100,通过在第一凹槽13的底壁面上设置测量件2,通过测量件2的收缩程度判断出晶盒在第一凹槽13中的卡接状态,能够更好的实现对晶盒的调整,使其在夹持装置100中保持稳定。A clamping device 100 provided in the embodiment of the present application is provided with a measuring piece 2 on the bottom wall of the first groove 13, and the clamping of the crystal box in the first groove 13 is judged by the shrinkage degree of the measuring piece 2. state, the crystal box can be better adjusted to keep it stable in the clamping device 100 .
本申请实施例提供的一种机械手,包括如上所述的夹持装置100。A robot arm provided in an embodiment of the present application includes the clamping device 100 as described above.
可选地,将上述夹持装置100安装于机械手上,夹持装置100对晶盒或晶舟形成夹持后,利用机械手完成对晶盒或晶舟的搬运。Optionally, the above-mentioned clamping device 100 is installed on a robot hand. After the clamping device 100 clamps the crystal box or wafer boat, the robot hand is used to complete the transportation of the crystal box or wafer boat.
本申请实施例提供的一种机械装置,包括如上所述的机械手。A mechanical device provided by an embodiment of the present application includes a manipulator as described above.
需要注意的是,如上所述的机械手不仅能应用于半导体领域中,也可应用于其他需要搬运的技术领域中的机械装置上,本申请对具体的应用领域不作特殊限定。It should be noted that the above-mentioned manipulator can be applied not only to the semiconductor field, but also to mechanical devices in other technical fields that require transportation. This application does not specifically limit the specific application fields.
本申请实施例提供一种夹持装置100、机械手以及机械装置,通过在夹持装置100中形成第一凹槽13和第二凹槽14,能够通过第一凹槽13与 晶盒完成卡接,形成对晶盒的夹持,并通过第二凹槽14与晶舟完成卡接,形成对晶舟的夹持,从而在搬运过程中,利用该夹持装置100,既可以实现对晶盒的自动化搬运,又可以实现对晶舟的自动化搬运,一体两用,避免了在搬运过程中对夹持装置100的更换,使用时更加便捷,省时省力,提高了搬运效率,节省了操作人员的劳动力,同时用一种装置取代了两种装置,也节省了对夹持装置100的采购成本,符合企业的利益需求。The embodiment of the present application provides a clamping device 100, a robot hand and a mechanical device. By forming a first groove 13 and a second groove 14 in the clamping device 100, the first groove 13 can be used to complete the snap connection with the crystal box. , forming a clamping of the crystal box, and completing the clamping with the wafer boat through the second groove 14, forming a clamping of the wafer boat, so that during the transportation process, the clamping device 100 can be used to realize the clamping of the crystal box The automatic transportation can also realize the automatic transportation of the wafer boat. It is integrated and dual-purpose, which avoids the replacement of the clamping device 100 during the transportation process. It is more convenient to use, saves time and effort, improves the transportation efficiency, and saves operators. The labor force is reduced, and one device is used to replace two devices at the same time, which also saves the purchase cost of the clamping device 100, which is in line with the interests of the enterprise.
虽然已经参考优选实施例对本申请进行了描述,但在不脱离本申请的范围的情况下,可以对其进行各种改进并且可以用等效物替换其中的部件。尤其是,只要不存在结构冲突,各个实施例中所提到的各项技术特征均可以任意方式组合起来。本申请并不局限于文中公开的特定实施例,而是包括落入权利要求的范围内的所有技术方案。While the present application has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for components thereof without departing from the scope of the application. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any way. The application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims (10)

  1. 一种夹持装置,用于夹持晶盒以及晶舟中的至少一者,其中,所述夹持装置包括:A clamping device for clamping at least one of a wafer box and a wafer boat, wherein the clamping device includes:
    承载件,所述承载件具有预定的长度、宽度以及厚度;A bearing member having a predetermined length, width and thickness;
    夹持组件,设置于所述承载件上,所述夹持组件包括在所述承载件的长度方向成对设置并相对分布的夹持件,每个所述夹持件与所述承载件相连接;A clamping assembly is provided on the bearing member. The clamping assembly includes clamping members arranged in pairs and relatively distributed in the length direction of the bearing member. Each of the clamping members is opposite to the bearing member. connect;
    其中,所述夹持件包括相交设置的第一夹持部以及第二夹持部,所述第一夹持部上设置有沿所述长度方向凹陷设置的第一凹槽,所述第二夹持部设置有沿所述承载件的厚度方向凹陷设置的第二凹槽,成对设置的所述夹持件的所述第一凹槽相对分布并共同夹持所述晶盒,成对设置的所述夹持件的所述第二凹槽相对分布并共同夹持所述晶舟。Wherein, the clamping member includes a first clamping part and a second clamping part arranged to intersect, the first clamping part is provided with a first groove recessed along the length direction, and the second clamping part The clamping part is provided with a second groove recessed along the thickness direction of the carrier, and the first grooves of the clamping members arranged in pairs are relatively distributed and jointly clamp the crystal box. The second grooves of the clamping member are arranged to be relatively distributed and jointly clamp the wafer boat.
  2. 根据权利要求1所述的夹持装置,其中,所述夹持组件设置于所述承载件在所述长度方向上的两端,所述第一夹持部与所述第二夹持部垂直连接。The clamping device according to claim 1, wherein the clamping components are disposed at both ends of the bearing member in the length direction, and the first clamping part is perpendicular to the second clamping part. connect.
  3. 根据权利要求1所述的夹持装置,其中,成对设置的所述夹持件的所述第一凹槽在所述长度方向上对称分布,成对设置的所述夹持件的所述第二凹槽在所述长度方向上对称分布。The clamping device according to claim 1, wherein the first grooves of the clamping members arranged in pairs are symmetrically distributed in the length direction, and the first grooves of the clamping members arranged in pairs are The second grooves are symmetrically distributed in the length direction.
  4. 根据权利要求1所述的夹持装置,其中,所述第一夹持部包括第一基体,所述第二夹持部包括第二基体,所述第一基体与所述第二基体连接,所述第二基体远离所述第一基体的一端至少部分凸出设置以形成连接部,所述夹持装置通过所述连接部与待安装设备连接。The clamping device according to claim 1, wherein the first clamping part includes a first base body, the second clamping part includes a second base body, the first base body is connected to the second base body, One end of the second base body away from the first base body is at least partially protruded to form a connection portion, and the clamping device is connected to the device to be installed through the connection portion.
  5. 根据权利要求4所述的夹持装置,其中,所述第一夹持部包括第一固定件,所述第二夹持部包括第二固定件,所述第二固定件设置于所述第二基体上且抵接于所述第一基体,所述第一固定件设置于所述第一基体上且与所述第二固定件间隔分布,所述第一固定件和所述第二固定件之间形成所述第一凹槽。The clamping device according to claim 4, wherein the first clamping part includes a first fixing part, the second clamping part includes a second fixing part, and the second fixing part is disposed on the first fixing part. On the two base bodies and in contact with the first base body, the first fixing parts are arranged on the first base body and are spaced apart from the second fixing parts. The first fixing parts and the second fixing parts are The first groove is formed between the pieces.
  6. 根据权利要求5所述的夹持装置,其中,所述第二固定件远离所述第一基体的一端与所述第二基体形成段差结构,所述段差结构为所述第二凹槽。The clamping device according to claim 5, wherein an end of the second fixing member away from the first base forms a step structure with the second base, and the step structure is the second groove.
  7. 根据权利要求4所述的夹持装置,其中,所述连接部包括第一连接部和第二连接部,所述第一连接部和第二连接部在所述承载件的宽度方向上间隔排布。The clamping device according to claim 4, wherein the connecting portion includes a first connecting portion and a second connecting portion, and the first connecting portion and the second connecting portion are spaced apart in the width direction of the carrier. cloth.
  8. 根据权利要求1所述的夹持装置,其中,所述夹持装置还包括测量件,所述测量件设置于所述第一凹槽内并沿所述长度方向凸出于所述第一凹槽的底壁面设置,所述测量件能够在所述长度方向上伸缩,所述测量件被配置为检测所述夹持组件作用于所述晶盒的压力。The clamping device according to claim 1, wherein the clamping device further includes a measuring piece, the measuring piece is disposed in the first groove and protrudes from the first concave along the length direction. The bottom wall of the groove is provided, the measuring member can expand and contract in the length direction, and the measuring member is configured to detect the pressure of the clamping assembly acting on the crystal box.
  9. 一种机械手,其中,包括如权利要求1至8任一项所述的夹持装置。A manipulator, which includes the clamping device according to any one of claims 1 to 8.
  10. 一种机械装置,其中,包括如权利要求9所述的机械手。A mechanical device, including the manipulator according to claim 9.
PCT/CN2022/121882 2022-09-20 2022-09-27 Clamping apparatus, manipulator, and mechanical apparatus WO2024060277A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
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CN1105309A (en) * 1994-01-13 1995-07-19 杨泰和 Double-face tongs with combined bearing face
JPH0846009A (en) * 1994-07-29 1996-02-16 Tokyo Electron Ltd Measuring method of discrepancy between gripper and holder, allignment method of gripper and holder, discrepancy measuring jig, diagnosis method of discrepancy between gripper and holder and washer and washing method
JPH09162265A (en) * 1995-12-13 1997-06-20 Henmi Keisanjiyaku Kk Variable pitch wafer transfer equipment
CN213212139U (en) * 2021-03-19 2021-05-14 台湾积体电路制造股份有限公司 Clamping device of wafer carrier
CN216189096U (en) * 2021-10-11 2022-04-05 创微微电子(常州)有限公司 Crystal boat clamping device and manipulator
CN114613707A (en) * 2022-03-11 2022-06-10 北京北方华创微电子装备有限公司 Wafer boat bearing device, paddle arm position adjusting method and semiconductor process equipment
CN114906529A (en) * 2022-05-31 2022-08-16 厦门宏泰智能制造有限公司 Intelligent wafer storage bin and material storing and taking method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1105309A (en) * 1994-01-13 1995-07-19 杨泰和 Double-face tongs with combined bearing face
JPH0846009A (en) * 1994-07-29 1996-02-16 Tokyo Electron Ltd Measuring method of discrepancy between gripper and holder, allignment method of gripper and holder, discrepancy measuring jig, diagnosis method of discrepancy between gripper and holder and washer and washing method
JPH09162265A (en) * 1995-12-13 1997-06-20 Henmi Keisanjiyaku Kk Variable pitch wafer transfer equipment
CN213212139U (en) * 2021-03-19 2021-05-14 台湾积体电路制造股份有限公司 Clamping device of wafer carrier
CN216189096U (en) * 2021-10-11 2022-04-05 创微微电子(常州)有限公司 Crystal boat clamping device and manipulator
CN114613707A (en) * 2022-03-11 2022-06-10 北京北方华创微电子装备有限公司 Wafer boat bearing device, paddle arm position adjusting method and semiconductor process equipment
CN114906529A (en) * 2022-05-31 2022-08-16 厦门宏泰智能制造有限公司 Intelligent wafer storage bin and material storing and taking method thereof

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