CN213212139U - Clamping device of wafer carrier - Google Patents
Clamping device of wafer carrier Download PDFInfo
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- CN213212139U CN213212139U CN202120570882.0U CN202120570882U CN213212139U CN 213212139 U CN213212139 U CN 213212139U CN 202120570882 U CN202120570882 U CN 202120570882U CN 213212139 U CN213212139 U CN 213212139U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the application provides a clamping device for a wafer carrier, which comprises a mechanical arm, a clamping assembly and a plane precise positioning piece, wherein the plane precise positioning piece is connected between the mechanical arm and the clamping assembly, the mechanical arm drives the clamping assembly to move in space, the plane precise positioning piece comprises a transmission frame, a driving wheel, a driven wheel and a conveying belt, the transmission frame is connected with the mechanical arm, the driving wheel and the driven wheel are rotatably connected with the transmission frame, and the conveying belt is connected with the driving wheel and the driven wheel; the clamping assembly comprises a clamping frame, two clamping pieces and a driving assembly, the clamping frame extends along a first direction and is fixed to the driven wheel, the two clamping pieces are arranged on the first direction relatively and can be connected to the clamping frame in a sliding mode, and the driving assembly is arranged on the clamping frame and drives the two clamping pieces to be close to or far away from the clamping frame. The clamping device provided by the embodiment of the application can realize multi-angle clamping of the wafer carrier, and meets the use requirements under different conditions.
Description
Technical Field
The application belongs to the technical field of semiconductor processing, especially relates to a device is got to clamp of wafer carrier.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and generally needs to be subjected to multiple processes to finally form a product.
The existing clamping device usually clamps a carrier at a specific angle, the flexibility of the clamping device is not high, when the position of the carrier deviates, the clamping device and the carrier are easy to have the problems of insufficient clamping force and the like, and long-time use can cause relative sliding between the clamping device and the carrier to influence the clamping reliability.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a device is got to clamp of wafer carrier can realize multi-angle centre gripping wafer carrier, and the flexibility is strong.
The embodiment of the application provides a clamping device of a wafer carrier, which comprises a mechanical arm, a clamping assembly and a plane precise positioning piece, wherein the plane precise positioning piece is connected between the mechanical arm and the clamping assembly, and the mechanical arm drives the clamping assembly to move in space;
the plane accurate positioning piece comprises a transmission frame, a driving wheel, a driven wheel and a conveying belt, the transmission frame is connected with the mechanical arm, the driving wheel and the driven wheel are rotatably connected with the transmission frame, and the conveying belt is connected with the driving wheel and the driven wheel;
the clamping assembly comprises a clamping frame, two clamping pieces and a driving assembly, the clamping frame extends along a first direction and is fixed to the driven wheel, the two clamping pieces are arranged on the first direction relatively and can be connected to the clamping frame in a sliding mode, and the driving assembly is arranged on the clamping frame and drives the two clamping pieces to be close to or far away from the clamping frame.
In some embodiments, the driving assembly comprises a driving piece and a first sliding connection piece, the driving piece drives the first sliding connection piece to slide, and the two clamping pieces are slidably connected with the clamping frame through the first sliding connection piece;
the first sliding connecting piece comprises a first sliding piece and a first guide rail which are matched with each other, one of the first sliding piece and the first guide rail is connected with the clamping piece, and the other one of the first sliding piece and the first guide rail is connected with the clamping frame or the driving piece.
In some embodiments, the first sliding connection member includes two first guide rails parallel to each other and two first sliding members corresponding to the two first guide rails one by one, the first guide rails are disposed on the driving member to extend along the first direction, one of the clamping members is fixedly connected to one of the first sliding members, and the two clamping members are close to and away from each other to clamp or release the wafer carrier.
In some embodiments, the clamping member includes a body portion, a first clamping portion and a second clamping portion, and the first clamping portion and the second clamping portion are located on the same side of the body portion in the first direction and are spaced apart from each other in the thickness direction of the clamping frame by a predetermined distance to form a clamping space for clamping the edge of the wafer carrier.
In some embodiments, the clamping assembly further comprises a first detecting device disposed in the clamping space for determining whether the edge of the wafer carrier is within a predetermined range.
In some embodiments, the driving assembly further comprises a second sliding connector, the second sliding connector comprises a second sliding member and a second guide rail, the second sliding member and the second guide rail are used in cooperation, the second sliding member is connected with the clamping member, the second guide rail is connected with the clamping frame or the driving member, and the second guide rail extends along the first direction to limit the moving track of the clamping member.
In some embodiments, the clamping assembly further includes a conductive slip ring disposed on a side of the clamping frame near the planar precise positioning element and electrically connected to the driving element to transmit an external data signal to the driving element.
In some embodiments, the robot arm includes a shaft driving member coupled to the driving wheel to drive the driving wheel to rotate.
In some embodiments, the gripping device further comprises a second detection device, and the second detection device is arranged outside the transmission frame and used for detecting the position information of the plane precision positioning piece.
In some embodiments, a tensioning wheel is disposed within the drive frame and cooperates with the conveyor belt.
The clamping device of the wafer carrier comprises a mechanical arm, a clamping assembly and a plane accurate positioning piece, wherein the clamping assembly is used for clamping the wafer carrier and moves to a specific station through the mechanical arm, in the clamping process, the plane accurate positioning piece can adjust the deflection angle of the clamping assembly relative to the mechanical arm according to the difference of the placement angles of the wafer carrier on the station, the clamping angle of the wafer carrier is changed, the use requirements under different conditions are met, the reliability is high, and the flexibility is strong.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is an isometric view of a clamping apparatus of a wafer carrier according to an embodiment of the present application;
fig. 2 is a top view of a grasping apparatus according to an embodiment of the present disclosure;
fig. 3 is a bottom view of a grasping device provided in an embodiment of the present application;
FIG. 4 is an internal block diagram of a clamping assembly provided in an embodiment of the present application;
fig. 5 is a structural view of another view of the gripping device provided in the embodiment of the present application;
fig. 6 is a structural diagram of another view angle of the gripping device according to the embodiment of the present application.
Description of the labeling:
1. a mechanical arm;
2. a planar accurate positioning piece;
21. a transmission frame;
211. a tension wheel;
212. a tension sensor;
22. a driving wheel;
23. a driven wheel;
24. a conveyor belt;
25. a connecting assembly;
251. a mechanical arm connecting piece;
252. the mechanical arm is connected with a reinforcing part;
26. a second detection device;
3. a clamping assembly;
31. a clamping frame;
32. a clamping member;
321. a body portion;
322. a first clamping portion;
323. a second clamping portion;
324. a clamping space;
325. a first detection device;
33. a drive assembly;
331. a drive member;
332. a first sliding connector;
3321. a first slider;
3322. a first guide rail;
333. a second sliding connector;
3331. a second slider;
3332. a second guide rail;
34. a conductive slip ring;
a: a first direction.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative only and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In order to solve the prior art problem, the embodiment of the application provides a clamping device for a wafer carrier, which comprises a mechanical arm 1, a planar accurate positioning part 2 and a clamping assembly 3, wherein the planar accurate positioning part 2 is connected between the mechanical arm 1 and the clamping assembly 3, and the mechanical arm 1 drives the clamping assembly 3 to move in space.
The plane accurate positioning part 2 comprises a transmission frame 21, a driving wheel 22, a driven wheel 23 and a conveyor belt 24, wherein the transmission frame 21 is connected with the mechanical arm 1, the driving wheel 22 and the driven wheel 23 are rotatably connected with the transmission frame 21, and the conveyor belt 24 is connected with the driving wheel 22 and the driven wheel 23;
the clamping assembly 3 includes a clamping frame 31, two clamping members 32 and a driving assembly 33, the clamping frame 31 extends along a first direction a and is fixed on the driven wheel 23, the two clamping members 32 are oppositely disposed on the first direction a and slidably connected to the clamping frame 31, and the driving assembly 33 is disposed on the clamping frame 31 and drives the two clamping members 32 to approach or leave.
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. The high-purity polysilicon is dissolved and doped into silicon crystal seed crystals, then the silicon crystal seed crystals are slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely a wafer. In the wafer processing process, wafers are often required to be clamped and transported by carriers, wherein the clamping assembly 3 is used for fixing and clamping the wafer carriers, and the mechanical arm 1 is used for transporting the wafer carriers.
Referring to fig. 1 to 3 together, a clamping frame 31 provided in the present application is used for installing a clamping member 32 and a driving assembly 33, the driving assembly 33 is located inside the clamping frame 31 and is responsible for driving the clamping member 32 to move, the clamping member 32 is located below the clamping frame 31 and at least partially extends out of the clamping frame 31, the two clamping members 32 are oppositely disposed along an extending direction of the clamping frame 31, when a wafer needs to be transported, the driving assembly 33 controls the two clamping members 32 to relatively approach and clamp the wafer carrier, the robot arm 1 is used for driving the clamping assembly 3 and the wafer carrier to move to a specific position, and then the driving assembly 33 controls the two clamping members 32 to relatively move away to release the wafer carrier, so that the wafer reaches a specific station and is processed next step. In some optional embodiments, the robot arm 1 may drive the clamping assembly 3 to translate in multiple directions within a spatial range, for example, in a rectangular spatial coordinate system shown in fig. 1, the robot arm 1 may drive the clamping assembly 3 to translate in any two directions of the three directions of XYZ, and may also meet the requirement of moving in three directions at the same time, and the movable direction of the robot arm 1 is determined according to the actual use condition, which is not limited in the present application.
The accurate setting element 2 in plane includes driving frame 21, action wheel 22, follows driving wheel 23 and conveyer belt 24, and driving frame 21 is connected with arm 1, and action wheel 22 and follow driving wheel 23 all are located driving frame 21 and rotate with driving frame 21 and be connected, and 24 covers of conveyer belt are established on action wheel 22 and follow driving wheel 23, play the effect of transmission motion. In some alternative embodiments, the driving wheel 22 and the driven wheel 23 are gears, and the transmission belt 24 is correspondingly provided with corresponding racks, so as to ensure the transmission reliability.
According to the different actual position conditions of the wafer carrier, the driving wheel 22 rotates under the action of external force, the driven wheel 23 is driven to rotate together through the conveying belt 24, the clamping frame 31 moves synchronously along with the driven wheel 23, and the two clamping pieces 32 are driven to rotate at a specific angle simultaneously, so that the clamping requirements are met. Arm 1 in this embodiment drives clamping component 3 with the help of accurate setting element 2 in plane and removes in space range, and clamping component 3 can deflect wantonly to accurate setting element 2 in plane relatively to realize the nimble centre gripping of multi-angle, satisfy the actual transportation needs of getting of pressing from both sides.
In some other embodiments, the driving assembly 33 includes a driving member 331 and a first sliding connector 332, the driving member 331 drives the first sliding connector 332 to slide, and the two clamping members 32 are slidably connected with the clamping frame 31 through the first sliding connector 332; the first sliding connector 332 includes a first sliding member 3321 and a first guide rail 3322 which are engaged with each other, and one of the first sliding member 3321 and the first guide rail 3322 is connected to the holder 32 and the other is connected to the holder 31 or the driving member 331.
The driving member 331 is fixedly mounted inside the clamping frame 31 by means of bolts, etc., and the first guide rail 3322 is slidably connected to the first sliding member 3321 to drive the clamping member 32 to move. First guide rail 3322 can install in the driving piece 331 and be close to the one side of holder 32, also can install in the one end that holder 31 is close to holder 32 to first guide rail 3322 both can be the spout structure, also can be protruding structure etc. of strip, and this application does not all prescribe a limit to this. And the number of the first guide rails 3322 may be one or two, when there is only one first guide rail 3322, two first sliding members 3321 are located on the same first guide rail 3322; when the number of the first guide rails 3322 is two, the two first guide rails 3322 are arranged side by side, and the two first sliding members 3321 are located on different first guide rails 3322.
In some alternative embodiments, referring to fig. 3 and fig. 4, the first sliding connector 332 includes two first guide rails 3322 parallel to each other and two first sliding elements 3321 corresponding to the two first guide rails 3322, the first guide rails 3322 are disposed on the driving element 331 to extend along the first direction a, one of the clamping elements 32 is fixedly connected to one of the first sliding elements 3321, and the two clamping elements 32 are close to or far from each other to clamp or release the wafer carrier. First guide rail 3322 is two parallel to each other and follows the spout structure that first direction A extends, and first guide rail 3322 is located driving piece 331 and is close to one side of holder 32, and two first sliders 3321 respectively with two first guide rail 3322 sliding connection, and respectively with two holder 32 fixed connection, driving piece 331 drives holder 32 through first slider 3321 and is close to each other or keeps away from.
In some alternative embodiments, the driving member 331 may be a combination of a servo motor and a helical gear, and the two first sliding members 3321 are provided with racks on opposite surfaces thereof, the servo motor is operative to drive the helical gear to move, and the helical gear is in mesh transmission with the racks on the first sliding members 3321, so as to drive the two first sliding members 3321 to move in opposite directions on the first guide rails 3322. The two first sliding parts 3321 are respectively connected to different clamping parts 32, the first sliding parts 3321 and the clamping parts 32 can be connected by bolts, and the driving part 331 drives the first sliding parts 3321 to move so as to enable the two clamping parts 32 to approach or separate from each other, thereby realizing clamping and placing of the wafer carrier.
In some other embodiments, the clamping member 32 includes a body 321, a first clamping portion 322 and a second clamping portion 323, and the first clamping portion 322 and the second clamping portion 323 are located on the same side of the body 321 in the first direction a and are spaced apart from each other in the thickness direction of the clamping frame 31 by a predetermined distance to form a clamping space 324 for clamping the edge of the wafer carrier.
The first clamping portion 322 and the second clamping portion 323 are respectively fixedly connected to the body portion 321, the first clamping portion 322 and the second clamping portion 323 are located on the same side of the body portion 321 in the first direction a, in some alternative embodiments, the first clamping portion 322 and the second clamping portion 323 are parallel to each other and are both perpendicular to the body portion 321, the first clamping portion 322 may be integrally formed with the body portion 321, and the second clamping portion 323 may also be integrally formed with the body portion 321. The first clamping portion 322, the second clamping portion 323 and the main body 321 are partially enclosed to form a clamping space 324, the size and shape of the clamping space 324 are determined by the corresponding wafer carrier, and according to the shape of the wafer carrier, the two clamping spaces 324 of the two clamping members 32 may be respectively located on the same side of the main body 321 in the first direction a or on different sides. In some alternative embodiments, referring to fig. 4, the two clamping spaces 324 of the two clamping members 32 may be respectively located on different sides of the respective body portion 321 in the first direction a, and the two clamping spaces 324 are oppositely disposed.
In some other embodiments, the clamping assembly 3 further comprises a first detecting device 325, wherein the first detecting device 325 is disposed in the clamping space 324 and is used for determining whether the edge of the wafer carrier is within a predetermined range. The holding space 324 may be used for holding a wafer carrier, and a first detecting device 325 may be further installed, the first detecting device 325 is used for determining whether the wafer carrier is located within a specific distance, the first detecting device 325 may be a slot-shaped photoelectric device, and the slot-shaped photoelectric device is embedded in the holding space 324 of the holding member 32, and will not affect the clamping effect of the clamping assembly 3. When the clamping device works, the mechanical arm 1 drives the clamping pieces 32 to move to the positions flush with the carrier, and if the groove-shaped photo-electricity in the clamping pieces 32 at the two sides senses the edge above the carrier, the driving assembly 33 drives the two clamping pieces 32 to mutually approach to the clamping carrier; if the trough-shaped photoelectric sensor does not sense the carrier at this time, the height position or the angle position of the clamping member 32 needs to be changed by the operation of the mechanical arm 1 or the planar precise positioning member 2 until the carrier is within the detection range of the trough-shaped photoelectric sensor, and then the clamping member 32 moves to clamp the carrier. After the wafer moves to a specific position, the driving assembly 33 controls the two clamping pieces 32 to be far away from the loosened carrier, the mechanical arm 1 drives the clamping pieces 32 to move, and at the moment, the groove-shaped photoelectric sensor cannot detect the existence of the carrier.
In some other embodiments, the driving assembly 33 further comprises a second sliding connector 333, and the second sliding connector 333 comprises a second sliding member 3331 and a second guiding rail 3332 which are used in cooperation with each other. The second sliding member 3331 is connected to the clamping member 32, the second guiding rail 3332 is connected to the clamping frame 31 or the driving member 331, and the second guiding rail 3332 extends along the first direction a to limit the moving track of the clamping member 32.
Referring to fig. 4, the second guide rail 3332 may be a sliding groove disposed on the outer periphery of the driving member 331, or may be a bar-shaped protrusion, etc., which is not limited in the present application as long as the second sliding member 3331 and the second guide rail 3332 can slide relative to each other, and the extending direction of the second guide rail 3332 is parallel to the extending direction of the first guide rail 3322. When the driving part 331 drives the two clamping members 32 to approach to each other or to be away from each other, the clamping members 32 drive the second sliding member 3331 to relatively slide along the second guide rail 3332, and the second guide rail 3332 plays a role of an auxiliary guide rail in the process, so that the moving direction of the clamping members 32 is limited, and the moving reliability of the clamping members 32 is improved.
In some other embodiments, referring to fig. 5, the clamping assembly 3 further includes a conductive slip ring 34, the conductive slip ring 34 is disposed on a side of the clamping frame 31 close to the planar precise positioning element 2 and electrically connected to the driving element 331, so as to transmit external data to the driving element 331.
The clamping frame 31 is connected with the driven wheel 23 and realizes synchronous movement, and the conductive slip ring 34 is arranged between the transmission frame 21 and the clamping frame 31. Get device during operation, clamping frame 31 can take place to rotate relative drive frame 21, and driving piece 331 then needs to be connected with external equipment and realizes control, if adopt conventional cable junction mode, the scheduling problem of buckling appears easily in the cable in the use, can't realize the rotation of arbitrary angle, in this embodiment, can realize the rotation of arbitrary angle through the electrically conductive sliding ring 34 that sets up in clamping frame 31 top to the device global reliability is got to the reinforcing clamp.
The conductive slip ring 34 belongs to the application field of electrical contact sliding connection, is a precise power transmission device for realizing image, data signal and power transmission of two relative rotating mechanisms, and is suitable for unlimited arbitrary continuous rotation. The conductive slip ring 34 mainly comprises a rotating part and a static part, wherein the rotating part is positioned at the circle center and rotates along with the clamping frame 31, the static part is positioned at the outer periphery of the rotating part and is fixedly connected with the transmission frame 21, and the static part is electrically connected with external equipment through a lead. In the working process of the clamping device, the rotating part of the conductive slip ring 34 rotates relative to the static part, and data transmission is realized between the static part and the rotating part through connection electric shock, so that the effect of transmitting power or data from a fixed position to a rotating position is realized.
In the present embodiment, the side of the conductive slip ring 34 close to the transmission frame 21 is sequentially stacked with an upper insulating sheet of the conductive slip ring and an upper sealing cover of the conductive slip ring, and the side close to the clamping frame 31 is sequentially stacked with a lower insulating sheet of the conductive slip ring and a lower sealing cover of the conductive slip ring.
In some other embodiments, the driving frame 21 is provided with a connecting assembly 25, and the robot arm 1 is connected to the driving frame 21 through the connecting assembly 25. Referring to fig. 5, the connecting assembly 25 is located above the transmission frame 21, i.e., on a side away from the clamping frame 31, the connecting assembly 25 includes a robot arm connecting member 251 and a robot arm connecting reinforcement member 252, the robot arm connecting member 251 and the robot arm connecting reinforcement member 252 are both provided with connecting holes, and the robot arm 1 is connected to the robot arm connecting member 251 and the robot arm connecting reinforcement member 252 by bolts or the like.
In some other embodiments, the robotic arm 1 includes a spindle drive that drives the capstan 22 in rotation. The rotation shaft driving member (not shown) is located inside the robot arm 1, and in some alternative embodiments, the rotation shaft driving member is a joint of the robot arm 1, and when the joint of the robot arm 1 rotates, the driving wheel 22 is driven to transmit rotation power to rotate the clamping assembly 3.
In some other embodiments, referring to fig. 6, the gripping device further includes a second detecting device 26, and the second detecting device 26 is disposed outside the transmission frame 21 and is used for detecting the position information of the planar precise positioning element 2. The second detecting device 26 is disposed on the outer peripheral side of the transmission frame 21, and the present application does not limit the specific position of the second detecting device 26. The second detecting device 26 is used for detecting the position information of the shelf or the station, when the corresponding shelf or station appears in the detection range of the second detecting device 26, the second detecting device 26 transmits the position information to the external control system, and the control system controls the mechanical arm 1 to move and place the wafer carrier to the destination.
All equipment in this embodiment all realize control through electric mode to press from both sides and get the whole modular design that realizes of device, have advantages such as small and noise are little, and there is not hard friction in the device inside, consequently difficult production particulate matter, can satisfy the required environmental requirement of wafer processing.
In some other embodiments, referring to fig. 6, a tension wheel 211 is disposed in the transmission frame 21, and the tension wheel 211 is disposed in cooperation with the transmission belt 24. The take-up pulley 211 sets up inside driving frame 21, and conveyer belt 24 includes flexion and tiling portion, and the flexion cover is established on action wheel 22 and follow driving wheel 23, and take-up pulley 211 corresponds the setting with 24 tiling portions of conveyer belt to guarantee that 24 constantly keep the tensioning state of conveyer belt. In some optional embodiments, a tension sensor 212 is further disposed inside the transmission frame 21, the tension sensor 212 is disposed corresponding to the flat portion of the transmission belt 24 for detecting the tension degree of the transmission belt 24, and the tension sensor 212 and the tension wheel 211 are used together to ensure reliable transmission.
To sum up, the embodiment of the application provides a device is got to clamp of wafer carrier, including arm, centre gripping subassembly and the accurate setting element of plane, the centre gripping subassembly is used for centre gripping wafer carrier to remove to specific station department through the arm, get the in-process when pressing from both sides, the accurate setting element in plane can be according to the wafer carrier on the station place the difference of angle, adjust the deflection angle of the relative arm of centre gripping subassembly, and then change the centre gripping angle to wafer carrier, satisfy the operation requirement under the different situation, the reliability is high, the flexibility is strong. And the device integrally realizes modularization and electromotion design, has the advantages of small volume, low noise and the like, and can meet the environmental requirements required by wafer processing.
Although the embodiments disclosed in the present application are described above, the descriptions are only for the convenience of understanding the present application and are not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims.
As described above, only the specific embodiments of the present application are provided, and it can be clearly understood by those skilled in the art that, for convenience and brevity of description, the corresponding processes in the foregoing method embodiments may be referred to for replacement of the other connection manners described above, and are not described herein again. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application.
Claims (10)
1. A clamping device of a wafer carrier is characterized by comprising a mechanical arm, a clamping assembly and a plane precise positioning piece, wherein the plane precise positioning piece is connected between the mechanical arm and the clamping assembly, and the mechanical arm drives the clamping assembly to move in space;
the planar accurate positioning piece comprises a transmission frame, a driving wheel, a driven wheel and a conveying belt, the transmission frame is connected with the mechanical arm, the driving wheel and the driven wheel are rotatably connected with the transmission frame, and the conveying belt is connected with the driving wheel and the driven wheel;
the clamping assembly comprises a clamping frame, two clamping pieces and a driving assembly, the clamping frame extends along a first direction and is fixed on the driven wheel, the two clamping pieces are arranged oppositely on the first direction and can be connected with the clamping frame in a sliding mode, and the driving assembly is arranged on the clamping frame and drives the two clamping pieces to be close to or far away from.
2. The grasping apparatus according to claim 1, wherein the drive assembly includes a drive member and a first sliding link member, the drive member driving the first sliding link member to slide, both of the gripping members being slidably connected to the gripping frame via the first sliding link member;
the first sliding connecting piece comprises a first sliding piece and a first guide rail which are matched with each other, one of the first sliding piece and the first guide rail is connected with the clamping piece, and the other one of the first sliding piece and the first guide rail is connected with the clamping frame or the driving piece.
3. The gripping apparatus according to claim 2, wherein the first sliding connector includes two of the first guide rails parallel to each other and two of the first sliding members corresponding to the two first guide rails one to one;
the first guide rail extends along the first direction and is arranged on the driving part, one clamping piece is correspondingly and fixedly connected with one first sliding piece, and the two clamping pieces are close to and far away from each other so as to clamp or release the wafer carrier.
4. The clamping apparatus as claimed in claim 2, wherein the clamping member comprises a body portion, a first clamping portion and a second clamping portion, the first clamping portion and the second clamping portion are located on the same side of the body portion in the first direction and are spaced apart from each other in a thickness direction of the clamping frame by a predetermined distance to form a clamping space for clamping an edge of the wafer carrier.
5. The clamping device as claimed in claim 4, wherein the clamping assembly further comprises a first detecting device disposed in the clamping space for determining whether the edge of the wafer carrier is within a predetermined range.
6. The grasping apparatus according to claim 2, wherein the drive assembly further includes a second slide link including a second slide and a second guide rail for cooperating with each other, the second slide being connected to the grasping member, the second guide rail being connected to the holder or the drive member, the second guide rail extending in the first direction to limit a moving trajectory of the grasping member.
7. The gripping apparatus of claim 2, wherein the gripping assembly further comprises a conductive slip ring disposed on a side of the gripping frame proximate the planar precision positioning element and electrically coupled to the driver to transmit external data signals to the driver.
8. The grasping apparatus according to claim 1, wherein the robotic arm includes a pivot drive coupled to the drive wheel to drive the drive wheel in rotation.
9. The gripping device of claim 1, further comprising a second detection device disposed outside the transmission frame for detecting the position information of the planar precision positioning element.
10. The gripping apparatus of claim 1, wherein a tensioning wheel is disposed within the drive frame, the tensioning wheel cooperating with the conveyor belt.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120570882.0U CN213212139U (en) | 2021-03-19 | 2021-03-19 | Clamping device of wafer carrier |
| PCT/CN2021/082821 WO2022193347A1 (en) | 2021-03-19 | 2021-03-24 | Clamping device for wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120570882.0U CN213212139U (en) | 2021-03-19 | 2021-03-19 | Clamping device of wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213212139U true CN213212139U (en) | 2021-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120570882.0U Active CN213212139U (en) | 2021-03-19 | 2021-03-19 | Clamping device of wafer carrier |
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| Country | Link |
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| CN (1) | CN213212139U (en) |
| WO (1) | WO2022193347A1 (en) |
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| CN114082999A (en) * | 2021-12-24 | 2022-02-25 | 伯朗特机器人股份有限公司 | Positioning structure and loading and unloading device |
| CN115632023A (en) * | 2022-12-22 | 2023-01-20 | 河北博特半导体设备科技有限公司 | Double-arm wafer transmission device |
| WO2024059975A1 (en) * | 2022-09-19 | 2024-03-28 | Abb Schweiz Ag | Fixture and method for handling stacking objects |
| WO2024060277A1 (en) * | 2022-09-20 | 2024-03-28 | 台湾积体电路制造股份有限公司 | Clamping apparatus, manipulator, and mechanical apparatus |
| CN118335682A (en) * | 2024-06-12 | 2024-07-12 | 马丁科瑞半导体(浙江)有限公司 | Clamping jaw mechanism, frame transmission module and die bonder |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05146984A (en) * | 1991-07-08 | 1993-06-15 | Murata Mach Ltd | Robot for handling wafer cassette |
| JP2004025427A (en) * | 2002-02-27 | 2004-01-29 | Hirata Corp | Work conveyance device |
| JP2005022001A (en) * | 2003-06-30 | 2005-01-27 | Star Seiki Co Ltd | Industrial robot |
| JP2011115914A (en) * | 2009-12-04 | 2011-06-16 | Mitsubishi Electric Corp | Robot hand |
| KR20110123696A (en) * | 2010-05-07 | 2011-11-15 | 나노세미콘(주) | Cassettes transportation robot of semiconductor processing device |
| CN110039514A (en) * | 2018-01-15 | 2019-07-23 | 均豪精密工业股份有限公司 | The control method of mechanical arm device and mechanical arm device |
-
2021
- 2021-03-19 CN CN202120570882.0U patent/CN213212139U/en active Active
- 2021-03-24 WO PCT/CN2021/082821 patent/WO2022193347A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114082999A (en) * | 2021-12-24 | 2022-02-25 | 伯朗特机器人股份有限公司 | Positioning structure and loading and unloading device |
| CN114082999B (en) * | 2021-12-24 | 2023-06-09 | 伯朗特机器人股份有限公司 | Positioning structure and feeding and discharging device |
| WO2024059975A1 (en) * | 2022-09-19 | 2024-03-28 | Abb Schweiz Ag | Fixture and method for handling stacking objects |
| WO2024060277A1 (en) * | 2022-09-20 | 2024-03-28 | 台湾积体电路制造股份有限公司 | Clamping apparatus, manipulator, and mechanical apparatus |
| CN115632023A (en) * | 2022-12-22 | 2023-01-20 | 河北博特半导体设备科技有限公司 | Double-arm wafer transmission device |
| CN115632023B (en) * | 2022-12-22 | 2023-08-04 | 河北博特半导体设备科技有限公司 | Double-arm wafer transmission device |
| CN118335682A (en) * | 2024-06-12 | 2024-07-12 | 马丁科瑞半导体(浙江)有限公司 | Clamping jaw mechanism, frame transmission module and die bonder |
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| Publication number | Publication date |
|---|---|
| WO2022193347A1 (en) | 2022-09-22 |
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