CN117558676B - Wafer detection clamping equipment - Google Patents

Wafer detection clamping equipment Download PDF

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Publication number
CN117558676B
CN117558676B CN202311839208.8A CN202311839208A CN117558676B CN 117558676 B CN117558676 B CN 117558676B CN 202311839208 A CN202311839208 A CN 202311839208A CN 117558676 B CN117558676 B CN 117558676B
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CN
China
Prior art keywords
working
rotating
toothed ring
main body
arm
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Active
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CN202311839208.8A
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Chinese (zh)
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CN117558676A (en
Inventor
孙丰
田斌
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Suzhou Secote Precision Electronic Co Ltd
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Suzhou Secote Precision Electronic Co Ltd
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Priority to CN202311839208.8A priority Critical patent/CN117558676B/en
Publication of CN117558676A publication Critical patent/CN117558676A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a wafer detection clamping device, which comprises: the bearing base is rotatably provided with a rotary main body; the toothed ring is arranged on the rotating main body and can rotate relative to the rotating main body; the working arms are arranged at the top of the rotating body, are distributed at intervals in the circumferential direction of the rotating body and can slide in the radial direction of the rotating body; the working arm has a clamping state when clamping the wafer and a loosening state when separating from the wafer; the middle units are arranged on the toothed ring and comprise swing arms which are linked with the working arms, and the toothed ring is linked with the working arms through the swing arms; the pushing unit is arranged on the bearing base and positioned on the periphery of the rotating body, the pushing unit comprises a pushing block capable of performing linear reciprocating motion in the radial direction of the rotating body, the pushing block is provided with a working position, and when the pushing block is positioned at the working position and the working arm rotates to the pushing unit, the pushing block can act on the swing arm to enable the swing arm to drive the working arm to move towards the pushing block.

Description

Wafer detection clamping equipment
Technical Field
The invention belongs to the technical field of robots, and particularly relates to wafer detection clamping equipment.
Background
A wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. The processing requirement of the wafer is high, and each processed wafer needs to be detected one by one so as to ensure the quality of the wafer.
The wafer detection clamping device is usually provided with a plurality of working arms, and clamping or loosening of the wafer is realized through movement of the working arms. In the prior art, a plurality of working arms generally perform motion control through a plurality of cylinders, so as to realize clamping or loosening of a wafer. The driving structure of the working arm has the defects of high production and manufacturing cost, complex motion control and the like. Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to provide a wafer detection clamping device which is beneficial to reducing the production cost.
In order to solve the above technical problems, the present invention provides a wafer detecting and clamping apparatus, including: the bearing base is rotatably provided with a rotary main body, and the rotary main body is in a circular ring shape; the toothed ring is arranged on the rotating main body and positioned at the periphery of the rotating main body, and can rotate relative to the rotating main body; the working arms are arranged at the top of the rotating body, are distributed at intervals in the circumferential direction of the rotating body and can slide in the radial direction of the rotating body; the working arm is provided with a clamping state when clamping the wafer and a loosening state when separating from the wafer; the middle units are arranged on the toothed ring and correspond to the working arms one by one, each middle unit comprises a swing arm linked with each working arm, and the toothed ring is linked with each working arm through the swing arm; the pushing unit is arranged on the bearing base and is positioned on the periphery of the rotating body, the pushing unit comprises a pushing block capable of linearly and reciprocally moving in the radial direction of the rotating body, the pushing block is provided with a working position, and when the pushing block is positioned at the working position and the working arm rotates to the pushing unit, the pushing block can act on the swing arm to enable the swing arm to drive the working arm to move towards the pushing block; wherein the toothed ring has a second rotational position at which the plurality of the working arms are in a clamped state, and the pushing block moves to the working position in response to an external operation when the toothed ring is in the second rotational position to rotate to the working arms at the pushing unit in a released state.
Preferably, the toothed ring further has a first rotational position in which a plurality of the working arms are in a released state; the detection clamping device for the wafer further comprises: a mechanical stop configured to define the first rotational position and the second rotational position.
Preferably, the mechanical limiting structure comprises a limiting plate fixedly arranged on the rotating main body, a rotating arm rotationally arranged on the toothed ring, a limiting roller rotationally arranged on the rotating arm, and a second biasing member acting on the rotating arm to enable the limiting roller to be in abutting connection with the limiting plate;
the limiting plate is provided with a limiting surface matched with the limiting roller, the limiting surface comprises a first arc-shaped surface, a second arc-shaped surface and a transition surface connecting the first arc-shaped surface and the second arc-shaped surface, the first arc-shaped surface is configured to enable the toothed ring to be kept at a first rotating position, and the second arc-shaped surface is configured to enable the toothed ring to be kept at a second rotating position; when the limiting roller is positioned on the first arc-shaped surface, the working arm is in a loosening state; when the limiting roller is located on the second arc-shaped surface, the working arm is in a clamping state.
Preferably, the rotating main body is provided with a plurality of guide wheels, the guide wheels are distributed at intervals in the circumferential direction of the rotating main body, the rotation axes of the guide wheels extend along the axial direction of the rotating main body, and the toothed ring is arranged on the rotating main body through the guide wheels;
the guide wheels comprise a plurality of first guide wheels and a plurality of second guide wheels, the first guide wheels and the second guide wheels are distributed alternately and located on the same circumference, the first guide wheels are configured to limit the toothed ring from the upper side, and the second guide wheels are configured to limit the toothed ring from the lower side.
Preferably, the middle unit comprises a swing arm rotationally arranged on the toothed ring, a limiting column fixedly arranged on the toothed ring and used for limiting the swing arm, and a first biasing member acting on the swing arm to enable the swing arm to prop against the limiting column, a rotation axis of the swing arm extends along the axial direction of the rotating main body, the swing arm is provided with a sliding groove, and the working arm is provided with a sliding piece matched with the sliding groove;
the sliding piece responds to the change of the gear ring from the first rotating position to the second rotating position, and moves from the first sliding position to the second sliding position of the sliding groove, so that the working arm is driven to move towards the center of the rotating main body, and the working arm is switched from a loosening state to a clamping state.
Preferably, the outer circumference of the first biasing member is sleeved with a sleeve body, wherein the length of the sleeve body in the direction of the elastic force of the first biasing member is smaller than the length of the first biasing member.
Preferably, the working surface of the pushing block matched with the swing arm is a third arc-shaped surface bent towards the rotating main body, the swing arm is rotatably provided with rolling bodies matched with the working surface, and the rotating axis of the rolling bodies is parallel to the axial direction of the rotating main body; the third arc-shaped surface and the rotating body are coaxially distributed, and the central angle of the third arc-shaped surface is smaller than the included angle between the adjacent working arms.
Preferably, the wafer inspection clamping device further includes: the electric limiting structure comprises a first sensing piece, a second sensing piece and a plurality of photoelectric sensors, wherein the photoelectric sensors are matched with the first sensing piece and the second sensing piece; the first induction piece is fixedly arranged on the rotating main body, the second induction piece is fixedly connected with the toothed ring, and the plurality of photoelectric sensors are fixedly arranged on the bearing base; the second induction piece with the first induction piece is the ring shape, and up-down direction adjacent distribution, the first induction piece is equipped with a plurality of edges the equidistant first induction groove that distributes of circumference of rotating body, be equipped with a plurality of edges on the second induction piece the equidistant second induction groove of circumference of rotating body distributes.
Preferably, the bearing base is further provided with a housing, the housing is covered on the periphery of the rotating main body, the toothed ring and the pushing unit, the housing is provided with an avoidance hole with the same size as the inner ring of the rotating main body, the bearing base is provided with an external housing communicated with the housing, the external housing is connected with external suction equipment, and a filter element is arranged between the external housing and the housing.
Preferably, the bearing base is further provided with a main body driving unit for driving the rotating main body to rotate, the main body driving unit comprises a main body motor, a driving belt pulley, a steel belt and a driven belt pulley, the driven belt pulley is arranged on the rotating main body, the driving belt pulley is in transmission connection with the main body motor, and the steel belt is tensioned between the driving belt pulley and the driven belt pulley; the wheel surface of the driven belt wheel matched with the steel belt is a smooth surface, and the wheel surface of the driving belt wheel matched with the steel belt is also a smooth surface.
The technical scheme provided by the invention has the following advantages:
in the embodiment, the synchronous clamping or synchronous loosening of a plurality of working arms can be realized by rotating the toothed ring, so that the effect of clamping the wafer by the working arms is effectively improved, the use amount of electric driving components can be reduced, and the production cost is greatly reduced;
in this embodiment, when a plurality of work arms are in the clamping state, the border of wafer is acceptd in the screens inslot of work arm, and the partial border of wafer is sheltered from by the work arm, and the camera is at the during operation, pushes away the briquetting under the effect of second cylinder and moves to the working position, and when a certain work arm rotated to pushing away the briquetting, corresponding swing arm is forced to rotate certain angle under pushing away the effect of briquetting, and at this moment, the work arm is in the unclamping state under the drive of swing arm, from this, the camera can shoot the partial border region that was sheltered from before the wafer, has the convenient advantage of detection.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a main body of a wafer inspection and clamping apparatus according to the present invention;
FIG. 2 is a partially exploded view of the structure of FIG. 1;
FIG. 3 is a schematic view of the positional relationship among the toothed ring, the working arm and the intermediate unit;
FIG. 4 is a schematic view of FIG. 3 in a bottom view;
FIG. 5 is a schematic perspective view of a working arm;
FIG. 6 is an enlarged schematic view of the area D in FIG. 4;
fig. 7 is a schematic structural view of the ring gear drive unit;
FIG. 8 is a schematic view of the structure of the area A in FIG. 1;
FIG. 9 is a schematic view of a limiting plate;
FIG. 10 is a schematic diagram illustrating a positional relationship between a rotating arm and a second biasing member;
FIG. 11 is an enlarged schematic view of the area B in FIG. 3;
FIG. 12 is a schematic view of the positional relationship between the swing arm and the first biasing member;
fig. 13 is a schematic structural view of the pressing unit;
FIG. 14 is a schematic view of the structure of the pushing block;
FIG. 15 is a schematic view of the positional relationship between the bearing base and the housing;
FIG. 16 is an exploded view of FIG. 15;
fig. 17 is an enlarged schematic view of the area C in fig. 3.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. The invention will be described in detail hereinafter with reference to the drawings in conjunction with embodiments. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
In the present invention, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present invention.
Referring to fig. 1 to 14, the present invention provides a wafer inspection and clamping apparatus, which at least includes: a bearing base 100, a rotating body 200, a toothed ring 300, a plurality of working arms 400, a plurality of intermediate units 500, and a pressing unit 600. The bearing base 100 is provided with a connecting hole (not shown) matched with the rotating body 200, the rotating body 200 is in a ring shape, and the rotating body 200 is rotatably arranged at the connecting hole.
As shown in fig. 1, the bearing base 100 is provided with a main body driving unit 110 for driving the rotary main body 200 to rotate, and the main body driving unit 110 includes a main body motor 111, a driving pulley 112, a steel belt 113, and a driven pulley 114. The driving pulley 112 is in driving connection with the main motor 111, and the steel belt 113 is tensioned between the driving pulley 112 and the driven pulley 114. The driven pulley 114 is disposed on the rotating body 200, and when the driven pulley 114 rotates, the rotating body 200 is driven to rotate synchronously. The surface of the driven pulley 114 and the steel belt 113 is smooth, and the surface of the driving pulley 112 and the steel belt 113 is smooth.
The "light surface" mentioned above means: no tooth is provided on the tread surfaces of the driven pulley 114 and the driving pulley 112. The purpose of setting the sheave surfaces of the driven sheave 114 and the driving sheave 112 to be smooth surfaces is to: dust generated in the movement process of the moving part is reduced as much as possible, and dust is prevented from adhering to the wafer from the root, so that the detection of the wafer is affected.
In consideration of the fact that the surfaces of the driven pulley 114 and the driving pulley 112 are smooth, a tensioning structure is provided at the driving pulley 112 in order to prevent the phenomenon of slipping between the steel belt 113 and the driven pulley 114, the driving pulley 112.
Specifically, the main body motor 111 and the driving pulley 112 are disposed on the connection base 115, and the connection base 115 is disposed on the bearing base 100. Wherein, the main body motor 111 is located below the bearing base 100, and the driving pulley 112 and the connection seat 115 are located above the bearing base 100. The bearing base 100 is provided with a through hole, and the main body motor 111 is mounted on the connection base 115 through the through hole. The connection base 115 is provided with an adjusting waist hole 1151, a waist hole bolt (not shown) is arranged in the adjusting waist hole 1151, and the connection base 115 is fastened on the bearing base 100 through the waist hole bolt. The adjustment waist hole 1151 extends in a direction parallel to a center line of the driving pulley 112 and the driven pulley 114. The adjustment of the tension of the steel strip 113 is achieved by adjusting the position of the waist hole bolts in the waist hole 1151.
The bearing base 100 is also provided with a fine adjustment structure for the tension degree of the steel belt 113. The fine tuning structure comprises a fine tuning seat 116 fixedly arranged on the bearing base 100 and a fine tuning bolt 117 screwed on the fine tuning seat 116. The trimming seats 116 are distributed adjacent to the connection seat 115, and the end portions of the trimming bolts 117 are abutted against the connection seat 115. During adjustment, first, the adjustment waist hole 1151 is unscrewed, then, the fine adjustment bolt 117 is screwed, and the force acting on the connection seat 115 by the fine adjustment bolt 117 can push the connection seat 115 to move towards a direction away from the driven pulley 114 due to the abutment of the fine adjustment bolt 117 with the connection seat 115, so that the purpose of tensioning the steel belt 113 is achieved.
In the present embodiment, a plurality of working arms 400 are provided at the top of the rotating body 200, and the plurality of working arms 400 are distributed at intervals in the circumferential direction of the rotating body 200 and are slidable in the radial direction of the rotating body 200. In an embodiment, the plurality of working arms 400 are slidably disposed on the top of the rotating body 200 through linear sliding rail units, respectively.
Referring to fig. 5, the working arm 400 includes an arm body 410, and a clamping block 420 disposed at one end of the arm body 410 near the wafer, wherein the clamping block 420 is provided with a clamping groove 421 for matching with the edge of the wafer. The other end of the arm body 410 away from the wafer is provided with a connecting column 430, the connecting column 430 extends along the axial direction of the rotating body 200, and the bottom of the connecting column 430 is rotatably provided with a sliding member 411. Wherein the clamping block 420 is located at the inner side of the rotating body 200, and the connection post 430 and the slider 411 are located at the outer side of the rotating body 200. The sliding member 411 is a bearing or a wheel.
Further, the top of the rotating body 200 is detachably provided with a ring cover 240, the arm body 410 is located between the rotating body 200 and the ring cover 240, and the bottom end surface of the ring cover 240 is provided with a avoidance groove 241 for the arm body 410 to penetrate. The linear sliding rail unit comprises a sliding rail and a sliding block, and the sliding block is matched with the sliding rail. Wherein, the slider is fixedly arranged in the avoiding groove 241, and the sliding rail is arranged on the arm body 410.
The work arm 400 has a clamped state when clamping a wafer and an unclamped state when detaching the wafer. When the working arm 400 is shifted from the released state to the clamped state, the working arm 400 moves toward the center of the rotating body 200; when the working arm 400 is shifted from the clamped state to the unclamped state, the working arm 400 gradually moves away from the center of the rotating body 200.
The ring gear 300 is provided on the rotating body 200 and is located at the outer circumference of the rotating body 200. The toothed ring 300 can rotate relative to the rotating body 200, and there are various ways in which the toothed ring 300 can be rotatably provided to the rotating body 200, and the toothed ring can be provided by a rotary bearing or a guide wheel. The following description will be made taking an example in which the toothed ring 300 is provided on the rotary body 200 through a guide wheel.
In this embodiment, referring to fig. 3, 4 and 6, a bearing ring 210 is fixed on the rotating body 200, and the bearing ring 210 is located at the outer periphery of the rotating body 200. The bottom of the bearing ring 210 is provided with a plurality of guide wheels, and the toothed ring 300 is arranged on the rotating body 200 through the plurality of guide wheels. The guide wheels are spaced apart along the circumference of the rotating body 200, and the rotation axes of the guide wheels extend along the axial direction of the rotating body 200.
The plurality of guide wheels comprises a plurality of first guide wheels 220 and a plurality of second guide wheels 230, and the first guide wheels 220 and the second guide wheels 230 are distributed at intervals and positioned on the same circumference. Wherein, the upper portion of the first guide wheel 220 is provided with an upper limit flange for limiting the toothed ring 300 from above. The lower portion of the second guide wheel 230 is provided with a lower limit flange for limiting the toothed ring 300 from below. The above-mentioned setting mode of leading wheel can effectively prevent that ring gear 300 from being blocked in the rotation in-process, and ring gear 300's atress performance is better.
The toothed ring 300 has a second rotational position in which the plurality of working arms 400 are in a clamped state and a first rotational position in which the plurality of working arms 400 are in a released state. In order to drive the toothed ring 300 to rotate, the wafer inspection and clamping apparatus further includes: a toothed ring driving unit 320. The toothed ring driving unit 320 is disposed on the bearing base 100 and can be in driving engagement with the toothed ring 300 to drive the toothed ring 300 to rotate. The switching of the position of the toothed ring 300 between the first rotational position and the second rotational position is achieved by the toothed ring drive unit 320 described above.
Referring to fig. 7, the ring gear driving unit 320 includes a driving gear 321 equally spaced from the ring gear 300, a gear motor 322 driving the driving gear 321 to rotate, and a first cylinder 323 connected to the gear motor 322. The first cylinder 323 is fixed on the bearing base 100 through a first cylinder seat, and the first cylinder 323 is used for driving the driving gear 321 to approach or depart from the toothed ring 300 along the radial direction of the rotating body 200.
When the driving gear 321 approaches the toothed ring 300, it is able to form a meshing relationship with the toothed ring 300, and the gear motor 322 is able to drive the toothed ring 300 to rotate by the driving gear 321. When the ring gear 300 does not need to be rotated, the driving gear 321 drives the driving gear 321 away from the ring gear 300, so that the driving gear 321 is out of engagement with the ring gear 300.
To define the first rotational position and the second rotational position of the ring gear 300, the wafer inspection clamping apparatus further includes: a mechanical stop structure 310. Referring to fig. 8 to 10, the mechanical limiting structure 310 includes a limiting plate 311 fixed on the rotating body 200, a rotating arm 312 rotatably disposed on the toothed ring 300, a limiting roller 313 rotatably disposed on the rotating arm 312, and a second biasing member 314 acting on the rotating arm 312 to make the limiting roller 313 abut against the limiting plate 311.
The limiting plate 311 is fastened to the ring cover 240, and is located on an outer ring of the ring cover 240. The rotating arm 312 and the second biasing member 314 are both provided on the toothed ring 300, and the second biasing member 314 is a spring. The rotation axis of the limiting roller 313 is parallel to the rotating body 200, and the rotation axis of the limiting roller 313 and the rotation axis of the rotating arm 312 are distributed at two opposite ends of the rotating arm 312.
The toothed ring 300 is fixedly provided with a second spring seat 315, and the second biasing member 314 is abutted between the rotating arm 312 and the second spring seat 315. The rotating arm 312 is provided with a protrusion matched with the second biasing member 314, the protrusion is provided with a concave groove, one end of the second biasing member 314 is abutted in the concave groove, and the concave groove has a limiting function.
The limiting plate 311 is provided with a limiting surface matched with the limiting roller 313. The limiting surface comprises a first arc-shaped surface 3111, a second arc-shaped surface 3112 and a transition surface connecting the first arc-shaped surface 3111 and the second arc-shaped surface 3112. Wherein the first arcuate surface 3111 is configured to retain the ring gear 300 in the first rotational position. The second arcuate surface 3112 is configured to retain the ring gear 300 in the second rotational position. The transition surface may be an arcuate surface, which may be a fold line surface, the transition surface defining a rotational angle between the first rotational position and the second rotational position. The limiting roller 313 can move from the first arc 3111 to the second arc 3112 or from the second arc 3112 to the first arc 3111 under the connection of the transition faces.
In fig. 8, the limiting roller 313 is located at the first arc surface 3111, and at this time, the ring gear 300 is located at the first rotational position, and the working arm 400 is in the released state. When the limiting roller 313 is located on the second arc surface 3112, the toothed ring 300 is located at the second rotational position, and the working arm 400 is in a clamped state.
The plurality of intermediate units 500 are disposed on the toothed ring 300, and the plurality of intermediate units 500 are disposed in one-to-one correspondence with the plurality of working arms 400. In the present embodiment, the ring gear 300 is coupled to the plurality of working arms 400 through the plurality of intermediate units 500. The above "linkage fit" means: when the ring gear 300 rotates, the ring gear 300 can drive the working arm 400 to slide radially through the intermediate unit 500, thereby changing the state of the working arm 400.
In the present embodiment, the plurality of working arms 400 are shifted from the unclamped state to the clamped state in response to the shift of the ring gear 300 from the first rotational position to the second rotational position, and the plurality of working arms 400 are shifted from the clamped state to the unclamped state in response to the shift of the ring gear 300 from the second rotational position to the first rotational position. That is, the synchronous movement of the plurality of working arms 400 can be realized by rotating the toothed ring 300, the effect of clamping the wafer by the working arms 400 is effectively improved, the use amount of electric driving components can be reduced, and the production cost is greatly reduced.
The plurality of intermediate units 500 are spaced apart in the circumferential direction of the rotating body 200. Referring to fig. 11 and 12, the intermediate unit 500 includes a swing arm 510 rotatably disposed on the gear ring 300 through a rotation shaft 513, a limit post 520 fixedly disposed on the gear ring 300 for limiting the swing arm 510, and a first biasing member 530 acting on the swing arm 510 to make the swing arm 510 abut against the limit post 520.
The rotation axis of the swing arm 510 extends in the axial direction of the rotation body 200, that is, the rotation shaft body 513 extends in the axial direction of the rotation body 200. The swing arm 510 is provided with a sliding slot 511, and the sliding piece 411 of the working arm 400 is matched with the sliding slot 511. The sliding grooves 511 are linear grooves, and the sliding grooves 511 are distributed along the tangential direction of the rotating body 200 or parallel to the tangential direction of the rotating body 200.
In the present embodiment, the working arm 400 and the swing arm 510 are linked by the mating relationship between the slider 411 and the slide slot 511. The toothed ring 300 is coupled to the working arm 400 by the swing arm 510 described above.
The first biasing member 530 is a spring. The toothed ring 300 is provided with a first spring seat 540, and the first biasing member 530 is pressed between the swing arm 510 and the first spring seat 540. The first biasing member 530 has a first abutting end 531 abutting the swing arm 510, and a second abutting end 532 abutting the first spring seat 540. A first groove for accommodating the first abutment end 531 is concavely formed on a side wall of the swing arm 510. The first spring seat 540 has a second groove 541 for accommodating the second abutment 532.
The outer circumference of the first biasing member 530 is sleeved with a sleeve body 550, wherein the length of the sleeve body 550 in the direction of the elastic force of the first biasing member 530 is smaller than the length of the first biasing member 530. The sleeve 550 serves to prevent dust generated during the elastic movement of the first biasing member 530 from drifting to the external environment, minimizing the chance of dust coming into contact with the wafer. In addition, the sleeve 550 can also define a minimum length of the first biasing member 530 that is compressed, acting as a stop.
In this embodiment, the rotating shaft body 513, the limiting post 520, and the first abutting end 531 can be enclosed to form a triangle. The rotating shaft body 513, the limiting post 520 and the first abutting end 531 are the positions of the three vertexes of the triangle, and the limiting post 520 and the first abutting end 531 are located at two sides of the rotating shaft body 513.
When the ring gear 300 is moved from the first rotational position to the second rotational position by the driving gear 321, the ring gear 300 rotates counterclockwise, the limit roller 313 slides from the first arc surface 3111 to the second arc surface 3112, the slider 411 moves from the first sliding position to the second sliding position of the chute 511 in response to the change of the ring gear 300 from the first rotational position to the second rotational position, and the plurality of working arms 400 move toward the center of the rotating body 200 by the slider 411, thereby realizing the transition of the plurality of working arms 400 from the released state to the clamped state. In the present embodiment, the first sliding position of the sliding member 411 is the position of the sliding member 411 in the drawing, and the second sliding position of the sliding member 411 is the middle position of the sliding slot 511 in the drawing.
In the above process, the first biasing member 530 makes the swing arm 510 have a tendency to rotate toward the direction of the limit post 520, so that the swing arm 510 abuts against the limit post 520, when the working arm 400 clamps a wafer, the swing arm 510 has a tendency to rotate away from the direction of the limit post 520, and the first biasing member 530 can buffer an external force that forces the swing arm 510 to rotate away from the direction of the limit post 520, thereby having a buffer protection function on the wafer.
In this embodiment, the intermediate unit 500 further includes an adjusting screw 560 provided on the swing arm 510, and the adjusting screw 560 is used to adjust the position of the swing arm 510. The swing arm 510 is provided with a screw hole through which the adjusting screw 560 passes, and one end of the adjusting screw 560 abuts against the limit post 520 after passing through the screw hole.
The pressing unit 600 is provided on the bearing base 100 and is located at the outer periphery of the rotary body 200. Referring to fig. 13 and 14, the pressing unit 600 includes a pressing block 610 capable of rectilinear reciprocation in the radial direction of the rotary body 200. The pushing block 610 has a working position, and when the pushing block 610 is located at the working position and the working arm 400 rotates to the pushing unit 600, the pushing block 610 can act on the swing arm 510 to enable the swing arm 510 to drive the working arm 400 to move towards the pushing block 610. In the present embodiment, when the ring gear 300 is in the second rotational position, the push block 610 moves to the above-described working position in response to an external operation, so that the working arm 400 rotated to the push unit 600 is in the released state.
As can be seen from the above, the pushing block 610 functions as: when the plurality of working arms 400 are in the clamping state, one or a plurality of working arms 400 are driven to be in the unclamping state. That is, the precondition for the operation of the pressing means 600 is: the ring 300 is in the second rotational position, the plurality of work arms 400 are in a clamped state, and the wafer is clamped by the plurality of work arms 400.
In this embodiment, the working surface 611 of the pushing block 610 and the swing arm 510 is a third arc surface curved toward the rotating body 200, and the working surface 611 is distributed coaxially with the rotating body 200. In order to reduce friction between the swing arm 510 and the working surface 611, the swing arm 510 is rotatably provided with rolling bodies 512 engaged with the working surface 611, and the rotation axis of the rolling bodies 512 is parallel to the axial direction of the rotary body 200.
Wherein the central angle of the working surface 611 is smaller than the included angle between the adjacent working arms 400, thereby ensuring that the pushing block 610 only drives one working arm 400 at a time to be in a released state. Referring to fig. 14, the central angle N of the working surface 611 has a value ranging from 40 ° to 60 °, and preferably has a value of 50 °.
The pressing unit 600 further includes a second cylinder 620, and the pressing block 610 is disposed on a movable rod of the second cylinder 620. The movable rod of the second cylinder 620 drives the pushing block 610 to approach the rotating body 200 or to be away from the rotating body 200 along the radial direction of the rotating body 200.
The number of the pressing units 600 may be one or two, and may be specifically selected according to a photographing locus of a camera (not shown). When the pressing units 600 are provided in two, a pair of pressing units 600 are distributed 180 ° apart.
When the plurality of work arms 400 are in the clamping state, the edge of the wafer is accommodated in the clamping groove 421 of the work arm 400, and part of the edge of the wafer is blocked by the work arm 400. When the camera works, the pushing block 610 moves to the working position under the action of the second air cylinder 620, and when a certain working arm 400 rotates to the pushing block 610, the corresponding swing arm 510 is forced to rotate a certain angle under the action of the pushing block 610, at this time, the working arm 400 is in a loosening state under the driving of the swing arm 510, so that the camera can shoot a part of the edge area of the wafer, which is shielded before the wafer.
In the above-described process, the swing arm 510 has a trigger state when it abuts against the pressing block 610 and a reset state when it is disengaged from the pressing block 610. The first biasing member 530 is also configured to provide an elastic force that urges the swing arm 510 to transition from the triggered state to the reset state when the swing arm 510 is disengaged from the push block 610.
The detection clamping equipment of the wafer further comprises: an electrical spacing structure 900. Referring to fig. 1, 8 and 17, the electrical limiting structure 900 includes a first sensing piece 910, a second sensing piece 920, and a plurality of photoelectric sensors 930, where the plurality of photoelectric sensors 930 are matched with the first sensing piece 910 and the second sensing piece 920. The first sensing piece 910 is fixedly arranged on the rotating body 200, the second sensing piece 920 is fixedly connected with the toothed ring 300, and the plurality of photoelectric sensors 930 are fixedly arranged on the bearing base 100.
The second sensing piece 920 and the first sensing piece 910 are annular and are adjacently distributed in the up-down direction, the first sensing piece 910 is provided with a plurality of first sensing grooves which are uniformly distributed along the circumferential direction of the rotating body 200, and the second sensing piece 920 is provided with a plurality of second sensing grooves which are uniformly distributed along the circumferential direction of the rotating body 200.
When the ring gear 300 is at the first rotation position, as shown in fig. 8, the second sensing groove is located directly above the first sensing groove, and the plurality of working arms 400 are in the released state. When the toothed ring 300 rotates to the second rotation position, the toothed ring 300 drives the second sensing piece 920 to rotate synchronously, at this time, the second sensing piece 920 shields the first sensing groove, the plurality of photoelectric sensors 930 are triggered, and the plurality of working arms 400 are in a clamping state. In the present embodiment, the first sensing piece 910 serves to sense the rotational position of the rotating body 200, thereby obtaining the positions of the plurality of working arms 400.
In this embodiment, as shown in fig. 15 and 16, a housing 800 is further provided on the bearing base 100, and the housing 800 is provided on the outer circumference of the rotating body 200, the toothed ring 300, the pressing unit 600, the mechanical limiting structure 310, the toothed ring driving unit 320, the steel belt 113 and the connecting seat 115. The cover 800 is provided with a relief hole having a size corresponding to that of the inner ring of the rotary body 200. The function of the cover 800: the moving element is covered, so that dust generated in the moving process of the moving element is prevented from adhering to the wafer, and the detection of the wafer is prevented from being influenced.
Further, an external casing 820 is provided on the carrying base 100, which communicates with the casing 800, and the external casing 820 is connected to an external pumping device (not shown). The external suction device can make the inside of the casing 800 in a negative pressure state to form a suction air flow, thereby realizing the suction of dust generated by the moving element. In addition, the suction air flow also has the effect of cooling the camera.
The housing 800 is provided with a communication port 810, and the external housing 820 is communicated with the housing 800 through the communication port 810. The communication port 810 is also symmetrically provided with a pair of adjusting plates 811, and the adjusting plates 811 are used for adjusting the size of the communication port 810, so as to realize the adjustment of the suction air flow. A filtering piece 830 is further disposed between the external casing 820 and the housing 800, and the filtering piece 830 is detachably disposed at the communication port 810, for filtering dust in the suction airflow.
It will be apparent that the embodiments described above are merely some, but not all, embodiments of the invention. Based on the embodiments of the present invention, those skilled in the art may make other different changes or modifications without making any creative effort, which shall fall within the protection scope of the present invention.

Claims (10)

1. The utility model provides a detection clamping equipment of wafer which characterized in that includes:
a bearing base (100) on which a rotary main body (200) is rotatably arranged, wherein the rotary main body (200) is in a circular ring shape;
a toothed ring (300) provided on the rotating body (200) and located on the outer periphery of the rotating body (200), the toothed ring (300) being rotatable relative to the rotating body (200);
a plurality of working arms (400) provided on the top of the rotating body (200), the plurality of working arms (400) being distributed at intervals in the circumferential direction of the rotating body (200) and being slidable in the radial direction of the rotating body (200); the working arm (400) has a clamping state when clamping the wafer and a loosening state when separating from the wafer;
the middle units (500) are arranged on the toothed ring (300) and are in one-to-one correspondence with the working arms (400), the middle units (500) comprise swing arms (510) which are linked with the working arms (400), and the toothed ring (300) is linked with the working arms (400) through the swing arms (510);
the pushing unit (600) is arranged on the bearing base (100) and is positioned on the periphery of the rotating main body (200), the pushing unit (600) comprises a pushing block (610) capable of linearly and reciprocally moving in the radial direction of the rotating main body (200), the pushing block (610) has a working position, and when the pushing block (610) is positioned at the working position and the working arm (400) rotates to the pushing unit (600), the pushing block (610) can act on the swing arm (510) to enable the swing arm (510) to drive the working arm (400) to move towards the pushing block (610);
wherein the toothed ring (300) has a second rotational position in which the plurality of the working arms (400) are in a clamped state, and the pushing block (610) moves to the working position in response to an external operation to put the working arms (400) rotated to the pushing unit (600) in a released state when the toothed ring (300) is in the second rotational position.
2. The wafer inspection gripping device of claim 1, wherein,
the toothed ring (300) also has a first rotational position in which a plurality of the working arms (400) are in a released state;
the detection clamping device for the wafer further comprises: a mechanical stop (310), the mechanical stop (310) configured to define the first rotational position and the second rotational position.
3. The wafer inspection gripping device of claim 2, wherein,
the mechanical limiting structure (310) comprises a limiting plate (311) fixedly arranged on the rotating body (200), a rotating arm (312) rotatably arranged on the toothed ring (300), a limiting roller (313) rotatably arranged on the rotating arm (312), and a second biasing member (314) acting on the rotating arm (312) to enable the limiting roller (313) to be in contact with the limiting plate (311);
the limiting plate (311) is provided with a limiting surface matched with the limiting roller (313), the limiting surface comprises a first arc-shaped surface (3111), a second arc-shaped surface (3112) and a transition surface connecting the first arc-shaped surface (3111) and the second arc-shaped surface (3112), the first arc-shaped surface (3111) is configured to enable the toothed ring (300) to be kept at a first rotation position, and the second arc-shaped surface (3112) is configured to enable the toothed ring (300) to be kept at a second rotation position;
wherein, when the limit roller (313) is positioned on the first arc-shaped surface (3111), the working arm (400) is in a loosening state; when the limit roller (313) is positioned on the second arc-shaped surface (3112), the working arm (400) is in a clamping state.
4. The wafer inspection gripping device of claim 1, wherein,
a plurality of guide wheels are arranged on the rotating main body (200), the guide wheels are distributed at intervals in the circumferential direction of the rotating main body (200), the rotation axes of the guide wheels extend along the axial direction of the rotating main body (200), and the toothed ring (300) is arranged on the rotating main body (200) through the guide wheels;
the guide wheels comprise a plurality of first guide wheels (220) and a plurality of second guide wheels (230), the first guide wheels (220) and the second guide wheels (230) are distributed alternately and located on the same circumference, the first guide wheels (220) are configured to limit the toothed ring (300) from the upper side, and the second guide wheels (230) are configured to limit the toothed ring (300) from the lower side.
5. The wafer inspection gripping device of claim 2, wherein,
the middle unit (500) comprises a swing arm (510) rotatably arranged on the toothed ring (300), a limit column (520) fixedly arranged on the toothed ring (300) and used for limiting the swing arm (510), and a first biasing member (530) acting on the swing arm (510) to enable the swing arm (510) to be abutted against the limit column (520), wherein the rotation axis of the swing arm (510) extends along the axial direction of the rotation main body (200), the swing arm (510) is provided with a sliding groove (511), and the working arm (400) is provided with a sliding piece (411) matched with the sliding groove (511);
the slider (411) moves from a first sliding position to a second sliding position of the chute (511) in response to a change of the toothed ring (300) from the first rotational position to the second rotational position to drive the working arm (400) to move toward the center of the rotating body (200), so that the working arm (400) is switched from a released state to a clamped state.
6. The wafer inspection gripping device of claim 5, wherein,
the outer circumference of the first biasing member (530) is sleeved with a sleeve body (550), wherein the length of the sleeve body (550) in the direction of the elastic force of the first biasing member (530) is smaller than the length of the first biasing member (530).
7. The wafer inspection gripping device of claim 1, wherein,
the working surface (611) of the pushing block (610) matched with the swing arm (510) is a third arc-shaped surface bent towards the rotating main body (200), the swing arm (510) is rotatably provided with a rolling body (512) matched with the working surface (611), and the rotating axis of the rolling body (512) is parallel to the axial direction of the rotating main body (200);
the third arc-shaped surface and the rotating body (200) are coaxially distributed, and the central angle of the third arc-shaped surface is smaller than the included angle between the adjacent working arms (400).
8. The wafer inspection gripping apparatus according to claim 1, further comprising:
the electric limiting structure (900) comprises a first sensing piece (910), a second sensing piece (920) and a plurality of photoelectric sensors (930), wherein the photoelectric sensors (930) are matched with the first sensing piece (910) and the second sensing piece (920);
the first sensing piece (910) is fixedly arranged on the rotating main body (200), the second sensing piece (920) is fixedly connected with the toothed ring (300), and the plurality of photoelectric sensors (930) are fixedly arranged on the bearing base (100);
the second induction piece (920) with first induction piece (910) are the ring form, and up-down direction adjacent distribution, first induction piece (910) are equipped with a plurality of edges rotatory circumference equidistant distributed's of main part (200 first induction groove, be equipped with a plurality of edges on the second induction piece (920) rotatory circumference equidistant distributed's of main part (200 second induction groove.
9. The wafer inspection gripping device of claim 1, wherein,
still be equipped with housing (800) on loading end base (100), housing (800) cover is located rotating body (200) toothed ring (300) bulldoze the periphery of unit (600), wherein, housing (800) be equipped with the hole of dodging that rotating body (200) inner circle size is unanimous, be equipped with on loading end base (100) with external case (820) of housing (800) intercommunication, external case (820) are connected with outside suction equipment, external case (820) with be equipped with filter (830) between housing (800).
10. The wafer inspection gripping device of claim 1, wherein,
the bearing base (100) is further provided with a main body driving unit (110) for driving the rotating main body (200) to rotate, the main body driving unit (110) comprises a main body motor (111), a driving belt pulley (112), a steel belt (113) and a driven belt pulley (114), the driven belt pulley (114) is arranged on the rotating main body (200), the driving belt pulley (112) is in transmission connection with the main body motor (111), and the steel belt (113) is tensioned between the driving belt pulley (112) and the driven belt pulley (114);
wherein the tread of the driven pulley (114) and the steel belt (113) is smooth, and the tread of the driving pulley (112) and the steel belt (113) is also smooth.
CN202311839208.8A 2023-12-28 2023-12-28 Wafer detection clamping equipment Active CN117558676B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009141027A (en) * 2007-12-04 2009-06-25 Hirata Corp Aligner and edge clamp detecting method using the same
CN103762196A (en) * 2014-02-20 2014-04-30 北京七星华创电子股份有限公司 Disk clamping device and disk rotating platform
CN114603527A (en) * 2022-05-10 2022-06-10 苏州新尚思自动化设备有限公司 Wafer clamping mechanism and overturning system suitable for wafer detection
CN114873209A (en) * 2022-05-05 2022-08-09 苏州赛腾精密电子股份有限公司 Carrier overturning and clamping mechanism
WO2022193347A1 (en) * 2021-03-19 2022-09-22 台湾积体电路制造股份有限公司 Clamping device for wafer carrier

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303876A (en) * 2002-04-10 2003-10-24 Seiko Instruments Inc Semiconductor wafer holding mechanism of sample stage

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009141027A (en) * 2007-12-04 2009-06-25 Hirata Corp Aligner and edge clamp detecting method using the same
CN103762196A (en) * 2014-02-20 2014-04-30 北京七星华创电子股份有限公司 Disk clamping device and disk rotating platform
WO2022193347A1 (en) * 2021-03-19 2022-09-22 台湾积体电路制造股份有限公司 Clamping device for wafer carrier
CN114873209A (en) * 2022-05-05 2022-08-09 苏州赛腾精密电子股份有限公司 Carrier overturning and clamping mechanism
CN114603527A (en) * 2022-05-10 2022-06-10 苏州新尚思自动化设备有限公司 Wafer clamping mechanism and overturning system suitable for wafer detection

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