Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
  • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

• the present disclosure relates to an optical waveguide package.
• An optical waveguide package includes a substrate having a first surface, a cladding located on the first surface, a second surface opposite to the first surface, and a cladding located on the opposite side of the second surface.
• a cladding having a third surface located in the cladding and having an element mounting area opened to the third surface; an entrance surface located in the cladding and facing the element mounting area; and an exit surface exposed from an end surface of the cladding.
• a side wall that at least partially surrounds the element mounting area on the substrate, and the side wall is made of a plurality of materials having different elastic modulus from each other.
• FIG. 1 is an exploded perspective view showing a light emitting device including an optical waveguide package according to an embodiment of the present disclosure.
• 2 is a plan view of the light emitting device shown in FIG. 1.
• FIG. 3 is a sectional view taken along section line IIIA-IIIA in FIG. 2.
• FIG. 3 is a sectional view taken along the section line IIIB-IIIB in FIG. 2.
• FIG. 2 is a partial perspective view showing an optical waveguide layer of the optical waveguide package shown in FIG. 1.
• FIG. FIG. 7 is a plan view showing a light emitting device according to another embodiment of the present disclosure.
• FIG. 7 is a plan view showing a light emitting device according to still another embodiment of the present disclosure.
• FIG. 7 is a plan view showing a light emitting device according to still another embodiment of the present disclosure.
• FIG. 7 is a plan view showing a light emitting device according to still another embodiment of the present disclosure.
• 9 is a sectional view taken along the section line IX-IX in FIG. 8.
• FIG. 7 is a plan view showing a light emitting device according to still another embodiment of the present disclosure.
• Patent Document 1 discloses that an optical waveguide is formed on a substrate, a groove is provided in a direction across the optical waveguide, a light-shielding film is provided on the inner wall of the groove, and the radiation mode generated within the optical waveguide element is a cladding mode light emission.
• a configuration is disclosed that prevents leakage into an optical fiber facing the element.
• Patent Document 2 discloses a configuration in which one end of the core and a gap in which an optical element is located are hermetically sealed by joining a cap to obtain gas barrier properties.
• FIG. 1 is an exploded perspective view showing a light emitting device including an optical waveguide package according to an embodiment of the present disclosure.
• 2 is a plan view of the light emitting device shown in FIG. 1
• FIG. 3A is a sectional view taken from section line IIIA-IIIA in FIG. 2
• FIG. 3B is a sectional view taken from section line IIIB-IIIB in FIG. FIG.
• the materials forming the side walls will be described as having different elastic modulus and light refractive index.
• the optical waveguide package 2 of this embodiment includes a substrate 9 having a first surface 8, a cladding 12 located on the first surface 8, a second surface 10 opposite to the first surface 8, and a second surface 10 opposite to the first surface 8. a cladding 12 having a third surface 11 located on the opposite side of the cladding 10 and an element mounting area 3 opening to the third surface 11; A core 5 having an output surface 15 exposed from an end surface 14 of the cladding 12; and a side wall 16a that at least partially surrounds the element mounting area 3 on the substrate 9 and is made of a plurality of materials M1 and M2 having different elastic coefficients. , is provided.
• the core 5 and the cladding 12 constitute an optical waveguide layer 19.
• the substrate 9 is made of a rectangular plate-like body when viewed from above.
• the light emitting device 1 includes the aforementioned optical waveguide package 2, a light emitting element 4 located within the element mounting area 3, a lens 6 located on the optical path of light emitted from the core 5, and covering the element mounting area 3.
• it includes a box-shaped lid 7 with one side open.
• the lid body 7 is not limited to a box shape, and may be, for example, a plate shape, and can adopt a different shape as appropriate.
• FIG. 4 is a partial perspective view showing the optical waveguide layer of the optical waveguide package shown in FIG. 1.
• the optical waveguide layer 19 may be made of, for example, glass such as quartz, resin, or the like.
• the materials constituting the optical waveguide layer 19 may be either glass or resin, and one of the core 5 and the cladding 12 may be glass and the other resin.
• the core 5 and the cladding 12 have different refractive indexes, and the core 5 has a higher refractive index than the cladding 12. Using this difference in refractive index, the light is totally reflected at the interface between the core 5 and the cladding 12. In other words, by making an optical waveguide using a material with a high refractive index and surrounding it with a material with a low refractive index, light can be confined within the core 5 having a high refractive index.
• the light emitting device 1 includes: a first electrode 20 located within the element mounting area 3 and on which the light emitting element 4 is mounted; a second electrode 21 connected to the first electrode 20 and extending outward from the element mounting area 3; Furthermore, it is equipped with.
• the lens 6 is located on the optical path of the light emitted from the core 5, and may collimate or condense the light emitted from the core 5.
• the lens 6 may be, for example, a plano-convex lens having a flat entrance surface and a convex exit surface.
• the substrate 9 may be, for example, an organic wiring board whose dielectric layer is made of an organic material.
• the organic wiring board include a printed wiring board, a build-up wiring board, and a flexible wiring board.
• the organic material used for the organic wiring board include epoxy resin, polyimide resin, polyester resin, acrylic resin, phenol resin, and fluororesin.
• the substrate 9 may be a ceramic wiring board whose dielectric layer is made of a ceramic material.
• ceramic materials used in the ceramic wiring board include aluminum oxide sintered bodies, mullite sintered bodies, silicon carbide sintered bodies, aluminum nitride sintered bodies, and glass ceramic sintered bodies.
• the material of the substrate 9 may be silicon, silicon dioxide, or silicon oxynitride (SiON), which is also called silicon oxynitride.
• the light emitting element 4 includes a light emitting element 4R that emits red light R, a light emitting element 4G that emits green light G, and a light emitting element 4B that emits blue light B.
• These light emitting elements 4R, 4G, and 4B may be, for example, light emitting diodes (LEDs) or laser diodes (LDs).
• LEDs light emitting diodes
• LDs laser diodes
• Each of the light emitting elements 4R, 4G, and 4B is arranged such that the emitting end of each color of light faces the incident surface 13R, 13G, and 13B exposed toward the element mounting area 3 of the core 5.
• the core 5 includes a plurality of dividing paths 41R, 41G, and 41B having incident surfaces 13R, 13G, and 13B, a combining section 17 where the plurality of dividing paths 41R, 41G, and 41B meet, and a combining section 17 and an output surface 15. It may also have an integrated path 18 extending between the two.
• Each light emitting element 4R, 4G, 4B is arranged so that each optical axis of each light emitting element 4R, 4G, 4B coincides with the center of the incident end surface 4a, 4b, 4c of the optical axis dividing path 41a, 41b, 41c. It is positioned within the mounting area 3.
• the element mounting area 3 may be a recess or a through hole opening in the third surface 11 of the cladding 12.
• the element mounting area 3 is a through hole that penetrates from the third surface 11 to the second surface 10 of the cladding 12.
• a bonding material 22 is positioned annularly on the third surface 11 of the cladding 12 so as to surround the opening of the element mounting area 3. 11.
• the inside of the element mounting area 3 is hermetically sealed with a lid 7, and the light emitting element 4 is protected.
• the lid body 7 is made of, for example, a glass material such as quartz, borosilicate, or sapphire.
• the material for the bonding material may be any material that can bond the cladding 12 and the lid 7 together and hermetically seal them, such as Au-Sn-based or Sn-Ag-Cu-based solder, or metals such as Ag or Cu. Nanoparticle paste, glass paste, or the like can be used.
• the core 5 of this embodiment may be made of silicon oxynitride (SiON), also called silicon oxynitride, and the cladding 12 may be made of silicon oxide (SiO 2 ).
• SiON silicon oxynitride
• SiO 2 silicon oxide
• the plurality of materials M1, M2, ..., M m-1 , M m having different elastic coefficients E are a first refractive index material M1 having a first refractive index n1 and a second refractive index material M1 having a first refractive index n1, and a second refractive index material M1 having a first refractive index n1. a second refractive index material M2 having a index n2.
• the shape restoring force of the cladding 12 deformed by the pressing force applied to the remaining structure excluding the lid 7 due to joining of the lid 7, etc. Since the shape retention force of the core 5 becomes dominant, deformation of the core 5 from the designed shape can be reduced and a predetermined shape can be reliably achieved. Furthermore, when the elastic modulus of the core 5 is smaller than the elastic modulus of the cladding 12, the cladding 12 deforms less due to the action of external force, so that less deformation is transmitted from the cladding 12 to the core 5. By reducing the deformation of the core 5, it is possible to reduce the decrease in optical transmission efficiency. By constructing the side wall 16a with a plurality of materials M1 and M2 having different elastic modulus from each other in this manner, resistance to stress caused by thermal deformation or the like can be improved, for example.
• the first refractive index material M1 is located in the same height range as the entrance surface 13 of the core 5 in the direction perpendicular to the first surface 8. That is, the first refractive index material M1 is located at the center of the rear side wall 16a of the element mounting area 3. As a result, a small amount of unnecessary light emitted from the light emitting element 4 in the direction opposite to the incident surface of the core 5 can be emitted to the outside from the element mounting area 3 through the first refractive index material M1. It is possible to prevent the light from being reflected on the inner surface of the side wall 16a and entering into the core 5 from the entrance surface 13. In this case, in order to emit such unnecessary light from the element mounting area 3 to the outside, the first refractive index material M1 may be positioned from the inner surface to the outer surface of the side wall 16a.
• the side wall 16a is made of a plurality of materials with different elastic modulus, even if a pressing force is applied from the lid 7 to the side wall 16a when joining the lid 7 onto the side wall 16a, the pressing force has a high elastic modulus. It is distributed over the entire side wall 16a along the material, and the pressing force from the dispersed material with a high elastic modulus is absorbed by the material with a low elastic modulus, thereby reducing deformation of the portion defining the element mounting area 3. can.
• the decrease in the amount of incident light can be reduced, and the decrease in light propagation efficiency can be reduced.
• the side wall 16a can be easily manufactured.
• the above-mentioned side wall 16a partially surrounds the element mounting area 3 and has a C-shaped configuration at least in plan view, so that the side wall 16a is a region where the dividing paths 41R, 41G, and 41B of the core 5 are arranged. Therefore, both ends of the side wall 16a in the circumferential direction are located closer to the end surface 14 than the incident surface 13 of the core 5, and the first refractive index material M1 of the side wall 16a passes through. It is possible to prevent unnecessary light from entering the core 5 from the entrance surface 13 of the core 5. Further, when forming the side wall 16a, there is less influence of pressure on the dividing paths 41R, 41G, 41B, and the formation of the side wall 16a can be facilitated. Furthermore, since the first refractive index material M1 is separated from the core 5, unnecessary light that has passed through the first refractive index material M1 is difficult to enter the core 5 not only from the incident surface 13 but also from the side. can do.
• FIG. 5 is a plan view showing a light emitting device according to another embodiment of the present disclosure. Note that the same reference numerals are given to parts corresponding to those in the above-described embodiment.
• the sidewall 16b is formed in a closed loop shape in plan view, and the sidewall 16b is provided around the entire circumference of the element mounting area 3.
• the material of the side wall 16b is the same as that of the side wall 16a described above. With this configuration, the side wall 16b is also interposed between the dividing paths 41R, 41G, and 41B of the core 5, and the effect on the dividing paths 41R, 41G, and 41B, such as the pressing force when the lid body 7 is joined, is alleviated. can do.
• FIG. 6 is a plan view showing a light emitting device according to still another embodiment of the present disclosure. Note that the same reference numerals are given to parts corresponding to those in the above-described embodiment.
• the optical waveguide package 2c of the present embodiment is formed roughly in a closed loop shape in a plan view, and includes regions on both sides of the side wall 16c in the short side direction parallel to the direction in which the light emitting elements 4R, 4G, and 4B are arranged, and In one region on the side facing the incident surfaces 13R, 13G, and 13B in the side direction, the side walls 16c are formed at a plurality of intervals ⁇ L in the extending direction.
• FIG. 7 is a plan view showing a light emitting device according to still another embodiment of the present disclosure. Note that the same reference numerals are given to parts corresponding to those in the above-described embodiment.
• the optical waveguide package 2d of this embodiment has a side wall 16c formed roughly in a closed loop shape when viewed from above.
• the side wall 16c has a side wall 16c extending in the long side direction in an area on both sides in the short side direction parallel to the direction in which the light emitting elements 4R, 4G, and 4B are lined up and in one area on the side opposite to the incident surfaces 13R, 13G, and 13B in the long side direction.
• a plurality of gaps 30 are formed in parallel.
• FIG. 8 is a plan view showing a light emitting device according to still another embodiment of the present disclosure
• FIG. 9 is a cross-sectional view taken along the section line IX-IX in FIG. 8. Note that the same reference numerals are given to parts corresponding to those in the above-described embodiment.
• the optical waveguide package 2e of this embodiment has a side wall 16e formed in a closed loop shape when viewed from above.
• the side wall 16e is located on the third surface 11 of the cladding 12 so as to surround the opening of the element mounting area 3.
• the thickness T of this side wall 16e is set, for example, to 0.1 ⁇ m or more and 10 ⁇ m or less.
• the side wall 16e may be bonded to the third surface 11 using a bonding material, for example.
• the bonding material for example, Au--Sn based solder, Sn--Ag--Cu based solder, metallic nanoparticle paste such as Ag or Cu, or glass paste can be used.
• Au--Sn based solder for example, Au--Sn based solder, Sn--Ag--Cu based solder, metallic nanoparticle paste such as Ag or Cu, or glass paste.
• FIG. 10 is a plan view showing a light emitting device according to still another embodiment of the present disclosure.
• the core 5 may be composed of three independent cores 5R, 5G, and 5B. Similar to the above embodiment, the incident surfaces 13R, 13G, 13B of the three cores 5R, 5G, 5B are connected to the center of the three incident surfaces 13R, 13G, 13B and the light of each light emitting element 4R, 4G, 4B.
• the light emitting elements 4R, 4G, and 4B are spaced apart from each other so that their axes coincide with each other.
• the output surfaces 15R, 15G, and 15B of the three cores 5R, 5G, and 5B are located close to each other, and the output light from the output surfaces 15R, 15G, and 15B of each core 5R, 5G, and 5B is transmitted through, for example, one lens. 6 may be emitted in parallel. Even if the three cores 5R, 5G, 5B are grouped together in close proximity between the entrance surfaces 13R, 13G, 13B and the exit surfaces 15R, 15G, 15B and extend in parallel to the exit surfaces 15R, 15G, 15B. good. In this case, images formed by the light emitted from the three emission surfaces 15R, 15G, and 15B may be combined by, for example, an external device.
• the light emitting element 4 is not limited to a light emitting diode, and may be, for example, an LD (Laser Diode) or a VCSEL (Vertical Cavity Surface Emitting Laser).
• LD Laser Diode
• VCSEL Vertical Cavity Surface Emitting Laser
• the side wall 16a to 16e may be made of three or more types of materials M1, M2, . . . , Mm ⁇ 1 , Mm (m is a positive integer) having different elastic moduli.
• optical waveguide package it is possible to provide an optical waveguide package in which a decrease in optical coupling efficiency between a light emitting element and a waveguide is reduced.
• the present disclosure can be implemented in the following configurations (1) to (6).
• a substrate having a first surface; A cladding located on the first surface, having a second surface opposite to the first surface, and a third surface located on the opposite side of the second surface, and opening to the third surface.
• a cladding having an element mounting area; a core located within the cladding and having an entrance surface facing the element mounting area and an exit surface exposed from an end surface of the cladding; a side wall surrounding the element mounting area on the substrate, In the optical waveguide package, the side wall is made of a plurality of materials having different elastic coefficients.
• the plurality of materials having mutually different elastic coefficients include materials having the same refractive index difference as the refractive index difference between the core and the cladding,
• the plurality of materials having mutually different elastic coefficients include a first refractive index material having a first refractive index and a second refractive index material having a second refractive index lower than the first refractive index,
• the side wall includes a first material made of the same material as the core; and a second material disposed to sandwich the first material and made of the same material as the cladding;
• the side wall includes a first material made of the same material as the core, and a second material disposed to sandwich the first material and made of the same material as the cladding,
• the optical waveguide package according to any one of (1) to (4) above, wherein the first material has a lower elastic modulus than the second material.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Optical Integrated Circuits (AREA)

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• 2023
  • 2023-08-30 CN CN202380061645.3A patent/CN119768718A/zh active Pending
  • 2023-08-30 JP JP2024544352A patent/JPWO2024048686A1/ja active Pending
  • 2023-08-30 WO PCT/JP2023/031635 patent/WO2024048686A1/ja not_active Ceased
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