WO2024041546A1 - 芯片、芯片组件和成像材料盒 - Google Patents

芯片、芯片组件和成像材料盒 Download PDF

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Publication number
WO2024041546A1
WO2024041546A1 PCT/CN2023/114326 CN2023114326W WO2024041546A1 WO 2024041546 A1 WO2024041546 A1 WO 2024041546A1 CN 2023114326 W CN2023114326 W CN 2023114326W WO 2024041546 A1 WO2024041546 A1 WO 2024041546A1
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WO
WIPO (PCT)
Prior art keywords
contact
area
chip
imaging material
substrate
Prior art date
Application number
PCT/CN2023/114326
Other languages
English (en)
French (fr)
Inventor
范文燚
林东明
Original Assignee
珠海益之印科技有限公司
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Filing date
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Publication of WO2024041546A1 publication Critical patent/WO2024041546A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/1752—Mounting within the printer
    • B41J2/17523—Ink connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17543—Cartridge presence detection or type identification
    • B41J2/17546—Cartridge presence detection or type identification electronically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
    • G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
    • G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
    • G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
    • G03G15/0863—Arrangements for preparing, mixing, supplying or dispensing developer provided with identifying means or means for storing process- or use parameters, e.g. an electronic memory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods

Definitions

  • the present invention relates to the field of imaging, and in particular to an imaging material cartridge detachably installed in an imaging device, a chip and a chip assembly installed in the imaging material cartridge.
  • Imaging equipment includes laser printers, copiers, inkjet printers, etc., and boxes containing imaging materials are installed in these imaging equipments.
  • the imaging materials are also different depending on the type of imaging equipment. For example, when the imaging equipment is a laser printer When the imaging device is an inkjet printer, the imaging material is ink.
  • the chip assembly is installed on the box.
  • the contact portion of the chip assembly contacts the contact pin of the imaging device; existing chips
  • Multiple contact parts are arranged on the same side of the same substrate. In the limited surface area of the substrate, the arrangement density of these contact parts is relatively large, and the design of the contact parts will be greatly restricted. At the same time, these closely arranged Contact parts are also prone to short circuits.
  • the present invention provides a chip, a chip assembly and an imaging material box having the chip to solve or optimize at least one of the above technical problems.
  • the specific solutions are as follows:
  • the projection points of the surface in the and d directions on the straight line D parallel to the y direction are N1 and N2 respectively, and the center line of the line segment N1N2 is L2; along the y direction, the area is divided into adjacent adjacent areas by the center line L2.
  • a region Q1 and a second region Q2 the number of contact pins in the first region Q1 is different from the number of contact pins in the second region Q2;
  • the substrate has an opposite first side and a second side, and a plurality of contact portions including The front contact part on one side and the back contact part provided on the second side; the front contact part is used to electrically connect with the contact pins in the first area Q1, and the back contact part is connected to the contacts in the second area Q2 through the conductor outside the chip.
  • this solution reduces the number of contacts on the same side of the substrate, thereby increasing the design freedom of the chip. At the same time, the arrangement density of the contacts is reduced, and the risk of short circuits between the contacts is also reduced. On the other hand , the size of the chip can also be reduced, thereby making it easier to miniaturize the chip, the imaging material cartridge and the imaging device using the chip.
  • the center line L2 is generated when all contact parts are arranged on the same side of the substrate.
  • the center line L2 can also be that the projection points of the two outermost contact pins located in the y direction on the surface including the y direction and the d direction on the straight line D parallel to the y direction are N1 and N2 respectively, and the line segment N1N2 The center line of is L2.
  • the back contact portion includes a ground terminal.
  • the number of front contacts is greater than the number of back contacts.
  • the contact points formed by the front contact part and the contact pin and the contact points formed by the back contact part and the conductor respectively form projection points on the straight line D on the surface; along the y direction, at all contact points , the connection line between the projection points corresponding to the two outermost contact points on the straight line D has a center line, and the number of contact points on both sides of the center line is the same.
  • the projection points of the contact points formed by the front contact part and the contact pin on the surface respectively form projection points on the straight line D; along the y direction, among the contact points formed by the front contact part and the contact pin, the most The line connecting the projection points corresponding to the two outer contact points on the straight line D has a center line, and the number of contact points on both sides of the center line is the same.
  • the projection points located on the straight line D and respectively located on both sides of the center line are symmetrically arranged.
  • the plurality of contact portions also include data terminals, clock terminals, reset terminals, and power supply terminals, and the back contact portion also includes a power supply terminal.
  • the chip assembly provided by the present invention includes the chip as described above and a conductor in contact with the back contact portion of the chip.
  • the chip and the conductor are formed separately; further, the chip assembly also includes a device for pushing the conductor toward the back contact portion. Forced push.
  • the imaging material box provided by the present invention includes the above-mentioned chip or chip assembly; in the front contact portion, the center line of the line connecting the projection point of the two outermost contact points in the y direction on the surface to the projection point of the straight line D is L6, and the center line passing through the imaging material discharge part is L5. L5 and L6 do not overlap.
  • the housing has a center line L1 in the y direction, and L1 and L6 do not coincide with each other.
  • the housing is provided with mounting slots for placing conductors.
  • the housing has a front side wall and a rear side wall arranged oppositely and a first binding member disposed on the front side wall, the first binding member is used to restrict the imaging material cartridge in the imaging device, and the chip assembly is Installed on the front side wall, the first combining member is movable relative to the housing.
  • the d direction intersects the z direction and the x direction at a non-perpendicular angle.
  • the d direction is the same as the x direction.
  • the d direction is the same as the z direction.
  • Figure 1A is a perspective view of the imaging material cartridge according to the present invention.
  • FIG. 1B is a perspective view of a stylus assembly provided in an imaging device to which the imaging material cartridge according to the present invention is applied.
  • 1C is a schematic diagram of the relative position between the stylus and the imaging material cartridge after the imaging material cartridge according to the present invention is installed on the imaging device.
  • FIG. 2 shows the chip assembly according to Embodiment 1 of the present invention after it is installed in the imaging material box, along the direction perpendicular to the chip substrate. Looking side view.
  • FIG. 3 is a perspective view of the front side of the chip according to Embodiment 2 of the present invention.
  • FIG. 4 is a perspective view of the back side of the chip according to Embodiment 2 of the present invention.
  • FIG. 5 is a state diagram after the chip assembly and the housing of the imaging material cartridge are separated according to Embodiment 2 of the present invention.
  • FIG. 6 is a side view of the chip assembly according to Embodiment 3 of the present invention, viewed in a direction perpendicular to the chip substrate, after it is installed in the imaging material box.
  • FIG. 7 is a state diagram after the chip component and the casing are separated according to Embodiment 4 of the present invention.
  • FIG. 8A is a side view of the chip assembly according to Embodiment 4 of the present invention, viewed in a direction perpendicular to the chip substrate after the chip is installed in the imaging material box.
  • FIG. 8B is a side view of the chip assembly according to Embodiment 4 of the present invention, viewed in a direction perpendicular to the chip substrate, after it is installed in the imaging material box.
  • FIG. 9 is a side view of another chip in the chip assembly according to Embodiment 4 of the present invention.
  • FIG. 10 is a diagram showing a state in which the imaging material cartridge accommodating portions of the imaging material cartridge and the imaging device to which the present invention is applied are separated from each other.
  • FIG. 11 is a diagram of a state after the chip assembly and the housing of the imaging material cartridge are separated according to Embodiment 5 of the present invention.
  • FIG. 12 is a perspective view of some components of the chip assembly according to Embodiment 5 of the present invention.
  • FIG. 13 is a side view viewed along the y direction after the imaging material cartridge equipped with the chip assembly according to Embodiment 5 of the present invention is installed in the imaging device.
  • FIG. 14 is a sectional view of the imaging material cartridge and the imaging device of FIG. 13 taken along a plane perpendicular to the y direction and passing through a contact position of a contact portion and a corresponding contact pin.
  • FIG. 15 is a perspective view of an imaging material cartridge equipped with a chip assembly according to Embodiment 6 of the present invention.
  • FIG. 16 is a perspective view of a chip assembly according to Embodiment 8 of the present invention.
  • FIG. 17 is a perspective view of the chip and the conductor in the chip assembly according to Embodiment 8 of the present invention after separation.
  • FIG. 18A is a side view of the chip assembly according to Embodiment 8 of the present invention, viewed in a direction perpendicular to the chip substrate, after it is installed in the imaging material box.
  • FIG. 18B is a schematic diagram further explaining the chip assembly shown in FIG. 18A.
  • FIG. 18C is a side view of the back contact portion in FIG. 18A viewed in a direction perpendicular to the chip substrate after the first deformation.
  • FIG. 19 is an exploded perspective view of the chip assembly according to Embodiment 9 of the present invention.
  • FIG. 20 is an exploded perspective view of the chip assembly according to Embodiment 10 of the present invention.
  • FIG. 21 is a perspective view of the chip assembly according to Embodiment 10 of the present invention when viewed from the back.
  • Figure 22A shows the chip assembly according to Embodiment 10 of the present invention after it is installed into the imaging material box, along the vertical line perpendicular to the chip substrate. Directionally viewed side view.
  • FIG. 22B is a side view viewed in a direction perpendicular to the chip substrate after the position of the back contact portion in FIG. 22A is deformed.
  • FIG. 23 is a perspective view of a second imaging material cartridge equipped with the chip assembly according to the present invention.
  • FIG. 24 is a perspective view of a third imaging material cartridge equipped with the chip assembly according to the present invention.
  • FIG. 1A is a perspective view of the imaging material cartridge according to the present invention
  • FIG. 1B is a perspective view of a stylus assembly provided in an imaging device to which the imaging material cartridge is applicable
  • FIG. 1C is a perspective view of the imaging material cartridge according to the present invention installed on the imaging device; Schematic diagram of the relative position between the stylus and the imaging material cartridge after the device.
  • the type of imaging material contained in the imaging material box 10 varies according to the type of imaging equipment.
  • the imaging material can be toner.
  • the imaging material box is a process box or a powder cartridge.
  • the material may also be ink, in which case the imaging material cartridge is an ink cartridge.
  • the chip assembly 103 described below is applicable regardless of the type of imaging material.
  • the front of the user's line of sight is defined as the +x direction
  • the rear of the user's line of sight is the -x direction
  • the top of the user's line of sight is +z.
  • the downward direction of the user's line of sight is the -z direction
  • the left side of the user's line of sight is the +y direction
  • the right side of the user's line of sight is the -y direction
  • the x direction including the +x direction and the -x direction is the direction of the imaging material box
  • the length direction, the y direction including the +y direction and -y direction is the width direction of the imaging material box
  • the z direction including the +z direction and -z direction is the z direction of the imaging material box
  • the -z direction Point to the direction of gravity, therefore, the z direction is parallel to the direction of gravity
  • the x direction, y direction and z direction intersect, preferably, the x direction, y direction and z direction are perpendicular to each other.
  • the ink cartridge 10 includes a casing 101 that contains ink, an ink discharge portion 102 (imaging material discharge portion) provided on the casing, and a chip assembly 103.
  • the casing has a front side wall 101a facing forward, a front side wall 101a facing backward, and a chip assembly 103.
  • the rear side wall 101b is opposite in the x direction
  • the upper side wall 101c and the lower side wall 101d are opposite in the z direction
  • the left side wall 101f and the right side wall 101g are opposite in the y direction
  • the cavity for containing ink is at least composed of the front side wall 101a, the rear side wall 101b, the upper side wall 101c, the lower side wall 101d, the left side wall 101f and the right side wall 101g.
  • the ink outlet 102 is provided on the lower side wall 101d.
  • the chip assembly 103 can be disposed on any side wall of the housing 101, or an inclined side wall 101e inclined with respect to the z direction is formed between the front side wall 101a and the lower side wall 101d, and at least a part of the chip assembly 103 is in contact with the side wall 101e.
  • the inclined side walls 101e are opposite to each other.
  • the chip assembly 103 is disposed on the inclined side walls 101e.
  • the chip assembly 103 at least includes a chip 104.
  • the chip 104 includes a substrate 1041, a memory 1044 (as shown in FIG. 4) and at least one contact portion 1042/1043.
  • the memory 1044 and the contact portion 1042 are both disposed on On the substrate 1041, the memory 1044 is used to store chip information and is electrically connected to the contact portion 1042. They can be disposed on the same side of the substrate 1041, or they can be located on both sides of the substrate 1041, or the memory 1044 and the contact portion
  • One of the chips 1042 is disposed on the substrate 1041, and the other is disposed outside the substrate 1041, but the memory 1044 and the contact portion 1042 are connected by wires.
  • the chips 104 described below are all memory 1044 and 1042.
  • the contact portion 1042 is provided on the substrate 1041, and preferably, the chip is mounted on the inclined side wall 101e.
  • the contact pin assembly 90 located in the imaging device includes a plurality of contact pins 91 .
  • the arrangement of the contact portions 1042 in the chip assembly 103 for contacting the plurality of contact pins 91 is consistent with the arrangement of the plurality of contact pins 91 .
  • the method is the same; as shown in Figure 1C, all contacts are provided on the same side of the substrate, and an area is defined along the two straight lines parallel to the d direction and through the outermost side of the substrate 1041, and the two outermost contacts in the y direction
  • the projection points of the contact point C between the bottom and the corresponding contact pin on the plane/surface including the y direction and the d direction on the straight line D parallel to the y direction are N1 and N2 respectively.
  • the center line of the line segment N1N2 is L2. Along the y direction, this area is divided into adjacent first area Q1 and second area Q2 by the center line L2. Along the y direction, the number of contact pins/number of contact parts in the first area Q1 is the same as the number of contact pins in the second area Q2. /The number of contact parts is different.
  • the contact pins located in the first area Q1 are called the first group of contact pins 90a
  • the contact pins located in the second area Q2 are called the second group of contact pins 90b.
  • the number of contact pins in needle 90a is different from the number of contact pins in the second set of contact pins 90b.
  • Each contact pin 91 has a contact end 91a for contacting the chip assembly 103 and a side surface 91b adjacent to the contact end 91a.
  • the contact end 91a can be formed into any one of points/lines/surfaces, preferably , the contact end 91a is formed as a tapered tip, the side surface 91b is a surface adjacent to the tapered tip, and the distal end surface 91c is arranged adjacent to the side surface 91b.
  • the center line L5 passing through the center of the ink outlet 102 coincides with the center line L1 of the ink cartridge 10 in the y direction. That is to say, the ink outlet 102 is disposed on the casing 101 along the y direction. In the intermediate position, at this time, the relative position of the stylus assembly 90 and the center line L5 and the relative position of the stylus assembly 90 and the center line L1 are the same.
  • the center line L5 does not coincide with the center line L1. As shown in FIG. 1C, along the y direction, the center line L5 is closer to the left side wall 101f or the right side wall 101g of the housing 101 than the center line L1. In this way, the number of contact pins/contact portions/contact points of the chip assembly 103 located on both sides of the center line L5 are also different, and the contact portions of the contact pins/chip assembly located further away from the center line L5 are leaked by the ink outlet 102 The probability of ink contamination is reduced, and accordingly, the risk of chip short circuit is also reduced.
  • the center line L2 of the line segment N1N2 is set not to coincide with the center line L1, nor with the center line L5.
  • the number of contact pins located on both sides of the center line L2 is different, and the risk of chip short circuit is reduced. Even if the imaging device shakes to a large extent, the shaking amplitude of the stylus can be reduced, thereby ensuring that the stylus maintains good contact with the contact portion of the chip assembly 103 .
  • FIG. 2 is a side view of the chip assembly according to Embodiment 1 of the present invention, viewed in a direction perpendicular to the chip substrate, after it is installed in the imaging material box.
  • the inclined side wall 101e is inclined with respect to the z direction.
  • the up and down direction of the line of sight will no longer be the z direction, but the d direction shown in Figure 2.
  • the d The direction is perpendicular to the y direction and parallel to the extension direction of the plane on which the contact portion of the substrate 1041 is provided, and the d direction also intersects the z direction and the x direction at non-perpendicular angles; in other embodiments, the housing 101 is not provided with an inclination
  • the side wall 101e or the chip 104 is disposed on the front side wall 101a
  • the d direction will be the same as the z direction.
  • the chip 104 is disposed on the lower side wall 101d
  • the d direction will be the same as the x direction.
  • the center line L1 is perpendicular to the y direction and divides the housing 101 into two parts that are symmetrical in the y direction. That is to say, the straight line L1 is the center line of the housing 101 in the y direction; the contact of the chip 104 There are multiple contact portions 1042, and all contact portions 1042 are located on the same side of the substrate 1041. Each contact portion forms a contact point C with the stylus of the imaging device. Along the y direction, the multiple contact portions 1042 are staggered and arranged along the y direction. In the d direction, multiple contacts are arranged in multiple rows.
  • the straight line D is parallel to the y direction.
  • the contact point C located at the end of the +y direction and the contact point C located at the end of the -y direction are located on the plane passing through the y direction and the d direction (substrate 1041 (the surface on which the contact part is set) is projected onto the straight line D.
  • the projection points are B and A respectively, and the center line of the line segment BA is L6.
  • the center line L1 does not coincide with the center line L6.
  • the plurality of contact portions 1042/contact points C are arranged not to be symmetrical with respect to the center line L1. In other words, multiple contacts All or most of the contact portions 1042/contact points C are disposed on one side of the center line L1, or the number of contact portions 1042/contact points C located on one side of the center line L1 is greater than the number of contact portions 1042/contact points C on the other side of the center line L1.
  • the number of contact points C; the center line L6 does not coincide with the center line L5.
  • At least one contact portion 1042/contact point C is arranged away from the center line L5/L6, and the ink leaked from the ink outlet 102 It is less likely to contaminate the at least one contact portion 1042 .
  • This chip 104 can bring the following beneficial effects:
  • the center line L1 and the center line L6 do not coincide with each other.
  • the center line L6 will be closer to one side/one end of the substrate 1041 than the center line L1. This results in the contact portion 1042/contact point C along the y direction. More concentrated distribution is between the side/one end of the substrate 1041 close to the center line L6 and the center line L6, while more can be arranged between the other side/the other end of the substrate 1041 away from the center line L6 and the center line L6.
  • structure or component, and at the same time, along the y direction, the contact portion 1042/contact point C away from the center line L6 is less likely to be contaminated by ink.
  • Figure 3 is a perspective view of the front side of the chip related to Embodiment 2 of the present invention
  • Figure 4 is a perspective view of the back side of the chip related to Embodiment 2 of the present invention
  • Figure 5 is a separation of the chip assembly and the shell of the imaging material box related to Embodiment 2 of the present invention. The final state diagram.
  • the plurality of contact portions 1042 can be divided into a first group of contact portions 1045 and A second set of contacts 1046, wherein the first set of contacts 1045 is located on one side/first side 1048 of the substrate 1041, and the second set of contacts 1046 is located on the other/second side 1049 of the substrate 1041; hereinafter,
  • the second set of contacts 1046 disposed on the other/second side 1049 of the substrate 1041 includes one or more back contacts 1043, and the first set of contacts 1045 disposed on one/first side 1048 of the substrate 1041 includes one or multiple front contacts 1042. As shown in FIGS.
  • the memory 1044 is provided on the other side/second side 1049 of the substrate 1041 .
  • One back contact 1043 is provided on the same side as the memory 1044 , and multiple contacts are provided on the side opposite to the memory 1044 .
  • the front contact portion 1042 , the front contact portion 1042 and the back contact portion 1043 may be disposed to protrude a predetermined height from the substrate 1041 , or may be coincident with the surface of the substrate 1041 .
  • the back contact portion 1043 can be any one of a power terminal and a ground terminal. When there are multiple back contact portions 1043, both the power terminal and the ground terminal can be set as the back contact portion 1043; as shown in Figure 5
  • the chip assembly 103 also includes a pushing member 106 and a conductor 107. One end of the conductor 107 is used to contact the reverse contact part 1043, and the other end is in contact with the pushing member 106.
  • the pushing member 106 Push the other end of the conductor 107 into contact with a component disposed at a corresponding position of the imaging device, that is, the contact pin in the imaging device for contacting the back contact portion 1043 is located at a different position than the contact pin for contacting the front contact portion 1042 The location of the stylus.
  • the conductor 107 can be preset to be in contact with the back contact portion 1043 , or can be preset not to be in contact with the back contact portion 1043 . Instead, the conductor 107 is in contact with the back contact portion 1043 during the installation process of the ink cartridge 10 .
  • the conductor 107 is disposed on the lower side wall 101d, so that the contact between the conductor 107 and the corresponding contact pin will be more stable by utilizing the gravity of the ink cartridge itself and the thrust of the pushing member 106.
  • the housing 101 is also provided with an installation groove 10e for placing the conductor 107. In this way, the installation position of the conductor 107 is accurately positioned, and the contact between the conductor 107, the reverse contact portion 1043 and the contact pin will be more stable.
  • the back contact portion 1043 is disposed away from the front contact portion 1042, and the projection points of the two outermost contact points C located in the y direction on the plane/surface passing through the y direction and the d direction are at The projection points of straight line D are E and B respectively, and the center line of line segment EB is L3.
  • the back contact part 1043 is far away from the front contact part 1042, and The back contact part 1043 is led out through the conductor 107, and the beneficial effects brought about are as described in the first embodiment and will not be repeated here.
  • the back contact part 1043 and the front contact part 1042 are provided on the substrate 1041 on the same side, the relative position between the center line L3, the center line L1, and the center line L6 will not change.
  • Embodiment 1 and Embodiment 2 when the center line L5 passing through the ink outlet 102 does not coincide with the center line L1, the center line L6 and the center line L3 do not coincide with the center line L5, and the same can be achieved along the y
  • the contact portions 1042/1043 or the contact point C located away from the center line L5 are not easily contaminated by the ink leaked from the ink outlet portion 102 .
  • the back contact portion 1043 should not be limited to the side opposite to the front contact portion 1042.
  • the back contact portion 1043 can also be provided on other surfaces of the substrate 1041, as long as it does not interact with the front contact portion 1042. It only needs to be arranged on the same side. This design reduces the density of contact parts on the side where the front contact part 1042 is located (the first side 1048), and the degree of design freedom on the side where the front contact part 1042 is located can be improved. At the same time, what happens between the various contact parts The risk of short circuits is also reduced.
  • FIG. 6 is a side view of the chip assembly according to Embodiment 3 of the present invention, viewed in a direction perpendicular to the chip substrate, after it is installed in the imaging material box.
  • the plurality of contact portions 1042 in this embodiment are arranged so that along the d direction, at least two contact portions 1042 overlap. More specifically, along the d direction, there are at least two contact points. C coincides.
  • the projection points of the two outermost contact portions 1042/contact points C along the y direction on the plane/surface including the y direction and the d direction respectively on the straight line D are A and B, and the projection points of the line segment AB are
  • the center line is L7, and the center line L1 and the center line L7 do not coincide with each other.
  • the center line L5 passing through the ink outlet 102 does not coincide with the center line L7. This also prevents the contact portions 1042/1043 or the contact point C away from the center line L5 along the y direction from being easily removed. The ink leaked from the ink section 102 is contaminated.
  • FIG. 7 is a state diagram of the chip assembly related to Embodiment 4 of the present invention after being separated from the casing;
  • FIG. 8A is a view of the chip assembly according to Embodiment 4 of the present invention after the chip is installed into the imaging material box, along the direction perpendicular to the chip substrate.
  • 8B is a side view of the chip assembly according to Embodiment 4 of the present invention, viewed in a direction perpendicular to the chip substrate, after it is installed in the imaging material box.
  • the chip assembly 103 is configured to be at least partially movable. As shown in FIG. 7 , the chip assembly 103 includes a chip 104, a pushing member 106 and an adapter 1031. One end of the adapter 1031 is connected to the chip 104/contact portion 1042. The other end is used to contact the stylus, and the pushing member 106 is used to push the adapter 1031 toward the direction of the stylus; the adapter 1031 includes a movable member 103a and a communicating member 103b that are combined with each other, and the two can be formed integrally, or can be Formed separately, the connecting member 103b is made of conductive material, preferably a conductive steel sheet. One end of the connecting member 103b is in contact with the contact portion 1042, and the other end is used to be exposed to the outside through the movable member 103a.
  • the communication member 103b is retracted to the inside of the movable member 103a. In this way, the communication member 103b can be protected to prevent damage to it by external parts.
  • the ink cartridge 10 is installed toward the predetermined position, During the process, the movable member 103a is pressed toward the casing 101, the pushing member 106 undergoes elastic deformation, and the connecting member 103b gradually extends.
  • the connecting member 103b completes contact with the stylus.
  • the pushing member 106 releases the elastic force, causing the connecting member 103b to return to the state of retracting the inside of the movable member 103a; it is also possible that the adapter 1031 is movable as a whole, and when the ink cartridge 10 has not been installed to the predetermined position, the adapter 1031 is not in contact with the contact portion 1042. As the ink cartridge 10 moves toward the predetermined position, the adapter 1031 is pressed toward the housing 101, and the connecting member 103b gradually begins to contact the contact portion 1042.
  • the connecting member 103b After completing the contact with the contact pin and the contact portion 1042, when the ink cartridge 10 is separated from the predetermined position, the pushing member 106 releases the elastic force, so that the adapter 1031 returns to a state not in contact with the contact portion 1042; also for example, when the ink cartridge 10 has not been installed to the predetermined position
  • a part of the communication part 103b is set to be in contact with the contact part 1042, and another part of the communication part 103b is set not to be in contact with the contact part 1042.
  • the other part of the communication part 103b gradually moves closer.
  • the contact part 1042 moves in the direction, and the pushing member 106 is elastically deformed.
  • the connecting member 103b completes the connection with the contact part 1042 and the stylus.
  • the pushing member 106 releases the elastic force, and the connecting member 103b returns to a state where one part of the ink cartridge 10 is in contact with the contact part 1042 and the other part is not in contact with the contact part 1042.
  • the movement mode of the movable member 103a/adapter 1031 may be sliding or swinging, as long as the above movement process of the movable member 103a/adapter 1031 can be realized.
  • the arrangement of the contact portions 1042 of the chip 104 will no longer be limited. As shown in FIG. 8A , along the y direction, the arrangement of the contact portions 1042 is located at the end of the plurality of contact portions.
  • the projection points of the contact point C of the two outer contact parts on the plane/surface passing through the y direction and the d direction on the straight line D are respectively A and B.
  • the center line L8 and the center line L1 of the line segment AB coincide with each other, that is to say , at this time, the contact portion 1042/contact point C is set to be symmetrical along the y direction, but the connecting member 103b used to connect the contact portion 1042 and the contact pins will be changed according to the arrangement of the contact pins, as shown in Figure 8B.
  • the contact point between the component 103b and the contact pin is C1.
  • the projection points of the two outermost contact points C1 on the plane/surface including the y direction and the d direction on the straight line D are F and G respectively.
  • the center line L4 of the line segment FG does not coincide with the center line L1.
  • the contact point C1 is set asymmetrically along the y direction.
  • the chip component 103 involved in this embodiment still has the beneficial effects of the first embodiment.
  • the chip 104 can continue to use the existing chip, and the ink cartridge manufacturer can select the corresponding adapter 1031 according to the arrangement of the contact pins in the imaging device. Not only It is beneficial to reduce the cost of the ink cartridge and can also make the chip have better versatility; conversely, when there are a large number of chips 104 with contact portions 1042 asymmetrically arranged in the y direction, the adapter can also be installed to make these chips 104 more versatile.
  • the chip 104 can be applied to an imaging device in which the stylus is symmetrically arranged in the y direction.
  • the center line L5 passing through the ink outlet 102 does not coincide with the center line L8, which also makes the contact portion 1042/1043 or the contact point C away from the center line L5 along the y direction less likely to be ink ejected.
  • the ink leaking from the ink outlet 102 is contaminated; further, the center line L5 does not coincide with the center line L4, which also makes the connecting member 103b or the contact point C1 away from the center line L5 along the y direction less likely to be contaminated by the ink leaking from the ink outlet 102.
  • the adapter 1031 has a first end that is in contact with the chip contact portion (the contact portion of the chip assembly) 1042, and a second end that is in contact with the contact pin. Both the first end and the second end are provided with A plurality of adapter contact portions, wherein one of the adapter contact portion at the first end and the adapter contact portion at the second end is configured to be symmetrical along the y direction, and the adapter contact portion at the other end is configured to be asymmetrical along the y direction; further , according to the design requirements of the chip 104 and/or the arrangement of the contact pins, the adapter contact portion at the first end and the adapter contact portion at the second end can also be configured to be asymmetrical along the y direction; further , both the adapter 1031 and the pushing member 106 can be separated from the ink cartridge 10 and become an independent component.
  • the adapter 1031 Before installing the ink cartridge 10, the adapter 1031 is first installed on the imaging device. When the ink in the ink cartridge 10 is consumed, the user only needs to The ink cartridge 10 can be replaced, and the adapter 1031 and the pushing member 106 can continue to be used.
  • FIG. 9 is a side view of another chip in the chip assembly according to Embodiment 4 of the present invention.
  • multiple contact portions 1042/contact points C are arranged in a straight line along the d direction. At this time, the multiple contact portions 1042/contact points C are still symmetrical along the y direction.
  • the adapter 1031 can also be adapted to the chip 104.
  • the chip 104 includes a first contact portion (first terminal) and at least one second contact portion (second terminal).
  • the first contact portion is used to detect whether there is a short circuit between it and the second contact portion.
  • the chip 104 also includes at least one third contact portion (third terminal), the at least one second contact portion is located in an area (Q2) different from the area (Q1) in which the first contact portion is located, along the y direction, the The second contact part is closer to the third contact part.
  • the three contact portions 1042 are data terminals, clock terminals and ground terminals respectively; when the number of contact portions 1042 is set to five, as shown in Figure 8A, The five contact portions 1042 are respectively the first terminal 10421 (data terminal cpd), the second terminal 10422 (clock terminal cpc), the third terminal 10423 (reset terminal cpr), the fourth terminal 10424 (power terminal cpvd) and the Five terminals 10425 (ground terminal cpvs), of course, the number of contact parts 1042 can be set to more, for example, seven, nine, etc., and the function of each contact part 1042 can be set according to design requirements.
  • the ink cartridge 10 is not in this vacuum environment. Especially if the ink cartridge 10 has not been used for a long time, more dust or impurities will inevitably adhere to the surface of the chip 104. In addition, the ink leaking from the ink outlet 102 will also It will adhere to the surface of the chip 104 under the action of the surface tension of the liquid. These problems may cause the chip 104 to be short-circuited and damaged. For this reason, the applicant further proposes a solution in the embodiment described below.
  • Figure 10 is a diagram showing a state in which the imaging material cartridge according to the present invention is separated from the housing of the imaging material cartridge in an imaging device to which it is applicable;
  • Figure 11 is a diagram showing the separation of the chip assembly and the housing of the imaging material cartridge according to Embodiment 5 of the present invention.
  • Figure 12 is a perspective view of some components of the chip assembly according to Embodiment 5 of the present invention;
  • Figure 13 is a diagram showing the imaging material box equipped with the chip assembly according to Embodiment 5 of the present invention after it is installed into the imaging device, along y 14 is a sectional view of the imaging material cartridge and the imaging device of FIG. 13 taken along a plane perpendicular to the y direction and passing through the contact position of a contact portion and the corresponding contact pin.
  • the imaging material cartridge as an ink cartridge as an example.
  • the ink cartridge accommodating portion 20 in the imaging device to which the ink cartridge 10 is applicable will be described.
  • the ink cartridge 10 is defined to have the x direction, the y direction and the z direction as shown in FIG. 10 based on the posture when the ink cartridge 10 is installed in the imaging device.
  • the ink cartridge accommodating part 20 is set to have In the same orientation as the ink cartridge 10 , the left side of FIG. 10 shows the orientation of the ink cartridge accommodating portion 20 , and the right side shows the orientation of the ink cartridge 10 .
  • the ink cartridge accommodating part 20 includes a frame, a stylus mechanism 9 provided on the frame, and a device-side circuit board 25.
  • a slot 26 open in the +z direction is formed between the stylus mechanism 9 and the device-side circuit board 25.
  • a plurality of device-side terminals 251 are provided on the surface of the circuit board 25, and one side plate 21 of the frame is provided with a device-side restricting element 23.
  • the device-side restricting element 23 is provided with a device-side restricting portion 232 for restricting the ink cartridge 10, as shown in Figure
  • the equipment side restricting portion 232 is a stepped body protruding from the side plate 21 .
  • the stylus mechanism 9 includes a main body 92 and a stylus assembly 90 disposed on the main body 92.
  • Each ink cartridge corresponds to a stylus assembly 90, and each stylus assembly 90 has a plurality of stylus 91 arranged at intervals along the y direction.
  • the number of contact pins 91 is the same as the number of chip contact parts 1042 and device-side terminals 251, and the structure of each contact pin 91 is the same. To show the structure of the contact pins 91 more clearly, Figure 10 shows the structure of one of the contact pins. Stereo view.
  • the contact pin 91 includes an outer contact piece 911, an inner contact piece 913 and a connecting piece 912 connecting the outer contact piece and the inner contact piece.
  • the needle 91 is made of conductive material as a whole, the outer contact 911 is used for electrical connection with the chip assembly 103, the inner contact 912 is used for electrical connection with the device side terminal 251, the connecting piece 912 matches the shape of the main body 92, a common connection
  • the member 912 is arranged in a "J" shape as shown in the figure, including a first connecting portion 912a extending along the z direction, a second connecting portion 912b extending along the x direction, and a third connecting portion 912c extending along the z direction.
  • a connecting part 912a and a third connecting part 912c are arranged at intervals in the x direction, and the first connecting part 912a is also connected to the external contact 911, and the third connecting part 912c is also connected to the internal contact 913.
  • the outer contact 911 and the first connection part 912a face the -x direction and can be opposite to the ink cartridge 10, and the inner contact 913 and the third connection part 912c are located in the slot 26 and face the +x direction and face the circuit board 25. ;
  • the ink cartridge 10 Before the ink cartridge 10 is installed in the ink cartridge accommodating part 20, at least a part of the outer contact 911 extends out of the main body 92, and the inner contact 913 abuts the device-side terminal 251.
  • the inner contact 913 and the third connection part 912c together use the connection between the second connecting part 912b and the third connecting part 912c as the rotation point to retract toward the inside of the main body 92; when the ink cartridge 10 is installed in the predetermined position of the ink cartridge accommodating part 20, the external contact 911 is connected to the first connecting part 912c.
  • the parts 912a are retracted toward the inside of the main body 92 with the connection between the first connecting part 912a and the first connecting part 912a as the rotation point, and the external contact 911 is in contact with the chip assembly 103.
  • the external contact 911 and the inner contact 912 are arranged in a staggered manner. In this way, when the outer contact 911 is also retracted toward the inside of the main body 92, the outer contact 911 and the inner contact 913 do not interfere, and the internal space of the main body 92 can be fully utilized. Overall size can be reduced.
  • the outer contact 911/inner contact 913 are configured to have a tapered tip 91a/913a and a side 91b/913b disposed adjacent to the tapered tip, wherein the side 91b connects the tapered tip 91a and the first connecting portion 912a. 913b connects the tapered tip 913a and the third connecting portion 913a.
  • the ink cartridge 10 in this embodiment is installed and disassembled/removed along the z direction.
  • the ink cartridge 10 also includes a first coupling member 11 located in front of the front side wall 101a/+x direction.
  • the coupling surface 11 a of the first coupling member 11 is in contact with the device-side restricting portion 232 . Therefore, the movement of the ink cartridge 10 in the z direction is restricted and positioning is achieved.
  • the chip assembly 103 in this embodiment includes a separately formed chip 104 and a conductor 107.
  • the conductor 107 is used to lead out at least one contact portion 1042 and connect it with the stylus mechanism 9 and At least one of the device-side terminals 251 is in contact, that is, at least one of the plurality of contact portions provided in the chip 104 is not in direct contact with the stylus mechanism 9.
  • the positions of the plurality of contact portions on the substrate 1041 do not have to be are limited to the same surface, thereby reducing the risk of short circuit in the chip 104; when the contact portion 1042 is set to the above five, at least one of the power terminal 10424 and the ground terminal 10425 can be led out by the conductor 107 and connected with the contact pin mechanism 9 and At least one of the equipment-side terminals 251 is in contact.
  • the ground terminal 10425 is led out by the conductor 107 and is in contact with at least one of the contact pin mechanism 9 and the equipment-side terminal 251 .
  • the plurality of contact portions 1042 are divided into a first group of contact portions 1045 disposed on one side/first side of the substrate 1041 and a group of contact portions 1045 disposed on the other/second side of the substrate 1041
  • the second set of contact portions 1046 is taken as an example that the second set of contact portions 1046 only provides one back contact portion 1043. The position of the back contact portion 1043 on the other/second side of the substrate 1041 does not need to be limited.
  • the back contact portion 1043 when along x When viewed from the direction, the back contact portion 1043 can be located in the first area Q1 or the second area Q2, because the first set of contact portions 1045 and the second set of contact portions 1046 are respectively located on both sides of the substrate 1041, so No matter where the back contact portion 1043 is disposed on the other side of the substrate, the risk of a short circuit in the chip 104 can be reduced.
  • the conductor 107 is used to lead out the back contact portion 1043 and make contact with the corresponding contact pin 91.
  • the conductor 107 includes a first conductive member 1071 and a second conductive member 1072 that are electrically connected to each other. The two can be formed integrally, or It can be formed separately.
  • the second conductive member 1072 is located in front of the substrate 1041. Along the x direction, the second conductive member 1072 and the substrate 1041 are spaced apart from each other. A combination space S will be formed between them.
  • the contact portion 1043 is in contact, and the other end is in contact with the second conductive member 1072. In this way, the back contact portion 1043 is equivalent to being provided on the second conductive member 1072.
  • the back contact portion 1043 is a ground terminal and is disposed on the second conductive member 1072.
  • a region Q1; further, the chip assembly 103 also includes a support member 1032 for supporting the second conductive member 1072, and the end 10721 of the second conductive member 1072 protrudes from the support member 1032; further, the reverse contact portion 1043 can also be connected with
  • the front contact portion 1042 is provided on the same side of the substrate, as long as the conductor 107 can lead out the back contact portion 1043 and make contact with at least one of the contact pin structure 9 and the device-side terminal 251 .
  • the main body 92 of the stylus mechanism 9 enters the combination space S, the external contact member 911 abuts the first set of contact portions 1045 of the contact portion, and the support member 1032 brings the second conductive member 1072 into the slot 26 , the second conductive member 1072 is in contact with at least one of the inner contact member 913 and the device-side terminal 251.
  • the support member 1032 is inserted between the inner contact member 913 and the device-side terminal 251.
  • the support member 1032/second conductive member 1072 abuts the tapered tip 913a of the inner contact member 913, and the inner contact member 913 retracts toward the main body 92 together with the third connecting portion 912c.
  • the second conductive member 1072 contacts the device-side terminal 251.
  • the multiple contact portions 1042 of the chip 104 are directly or indirectly electrically connected to the device-side terminal 251.
  • the first set of contact parts 1045 is electrically connected to the device-side terminal 251 through the contact pin 91
  • the second set of contact parts 1046 is electrically connected to the device-side terminal 251 through the conductor 107 .
  • both the outer contact member 911 and the inner contact member 912 are retracted toward the inside of the main body 91.
  • the contact member 912 will exert a force in the +x direction on the ink cartridge 10.
  • the support member 1032 can also be made entirely of conductive material.
  • the support member 1032 is the second conductive member 1072.
  • the second conductive member 1072 is electrically connected to the device side terminal 251.
  • the second conductive member 1072 can also be contacted through components other than the external contact member 911 of the contact pin 91, thereby achieving electrical connection between the second conductive member 1072 and the device-side terminal 251, for example,
  • the second conductive member 1072 does not enter between the inner contact 913 and the device-side terminal 251, but reaches the upper/+z direction of the tapered tip 913a.
  • the second conductive member 1072 1072 may be in contact with at least any one of the side 913b of the inner contact, the third connection part 912c and the second connection part 912b. Since the tapered tip 913a of the inner contact still remains in contact with the device side terminal 251, the second The conductive member 1072 can form an electrical connection with the device-side terminal 251 .
  • each second conductive part 1072 and inner contact 911 Since the ink outlet 102 is still located on the side of the main body 92 facing the ink cartridge, along the x direction, each second conductive part 1072 and inner contact 911, The contact position of at least one of the second connection part 912b, the third connection part 912c, and the device-side terminal 251 is separated from the ink discharge part 102 by the main body 92, which is also beneficial to reducing the risk of short circuit of the chip 104; according to this modification, many
  • the contact portions 1042 do not have to be limited to be disposed on the same surface. That is to say, all the contact portions 1042 can be disposed on the same surface, at least one contact portion is led out through the conductor 107, and the conductor 107 is not in contact with the outside. 911 , but in contact with components other than the external contact 911 .
  • FIG. 15 is a perspective view of an imaging material cartridge equipped with a chip assembly according to Embodiment 6 of the present invention.
  • the chip 104 in this embodiment is configured to have a structure similar to that in the fifth embodiment, that is, the chip 104 includes a plurality of separate components. As shown in the figure, the chip 104 in this embodiment It includes a first sub-chip 104a and a second sub-chip 104b. Same as the fifth embodiment, the first sub-chip 104a and the second sub-chip 104b can be two independent chips or can establish a communication connection. The two components can either share a memory 1044 or have separate memories.
  • the first sub-chip 104a includes a first sub-substrate 1041a and at least one first sub-contact portion 1042a provided on the first sub-substrate 1041a
  • the second sub-chip 104b includes a second sub-substrate 1041b and a first sub-contact portion 1042a provided on the first sub-substrate 1041a.
  • the second sub-contact portion 1042b of the two sub-substrates 1041b forms a combination space S between the first sub-substrate 1041a and the second sub-substrate 1041b along the x direction.
  • the conductive member 1072 is connected to the second sub-contact portion 1042a.
  • the conductive member 1072 When the ink cartridge 10 is When installed to a predetermined position, the conductive member 1072 is in contact with at least any one of the device-side terminal 251, the side surface 913b of the inner contact, the third connection part 912c and the second connection part 912b, and the first sub-contact part 1042a is in contact with its corresponding contact.
  • the pin outer contacts 911 make contact.
  • the chip component 103 in this embodiment still has the beneficial effects of Embodiment 5, which will not be described again.
  • the support member 1032 For the ink cartridge 10 described in Embodiment 5 and Embodiment 6, since part of the ink cartridge (support member 1032/second conductive member 1072) needs to enter the slot 26, when the ink cartridge 10 needs to be taken out, the support member 1032 The side where it is located (the +x direction side of the ink cartridge) will receive a large friction force in the -z direction, which will cause the ink cartridge 10 to tilt. Please refer to Figure 13. At this time, the -x direction side of the ink cartridge 10 will tilt upward. In other words, taking the upper side wall 101c as a reference, along the z direction, the -x direction end of the upper side wall 101c will be higher than the +x direction end of the upper side wall 101c.
  • the The area below the first coupling member 11 may contact the device-side restricting portion 232, causing the problem that the ink cartridge 10 is stuck and cannot be taken out, or that the removal is not smooth.
  • the ink cartridge 10 of the present invention also includes an escape surface 10i provided below the first coupling surface 11a (in the -z direction).
  • the escape surface 10i is used to prevent the ink cartridge 10 from interfering with the device-side restricting portion 232, and on the other hand, On the one hand, when the ink cartridge 10 interferes with the device-side restricting portion 232, the ink cartridge 10 is guided so that the ink cartridge 10 can be taken out smoothly.
  • the escape surface 10i is set to be inclined relative to the z direction. Specifically, when the ink cartridge 10 is in a predetermined position as shown in FIG. 13, the escape surface 10i faces the +z direction and the +x direction, and the escape surface 10i faces the +z direction and the +x direction. It may be provided on at least any one of the positioning plate 105 used to position the chip substrate in the chip assembly, the side wall of the housing 101 or the first binding member 11 .
  • FIG. 16 is a perspective view of the chip assembly according to Embodiment 8 of the present invention
  • FIG. 17 is a perspective view of the chip assembly according to Embodiment 8 of the present invention after the chips and conductors are separated
  • FIG. 18A is a view of the chip assembly according to Embodiment 8 of the present invention. After being installed into the imaging material box, the side view is viewed along the direction perpendicular to the chip substrate
  • Figure 18B is a schematic diagram further explaining the chip assembly shown in Figure 18A
  • Figure 18C is the first way to make the position of the back contact portion in Figure 18A After deformation, side view viewed in the direction perpendicular to the chip substrate.
  • the chip assembly 103 involved in this embodiment includes a chip 104 and a conductor 107.
  • the chip 104 includes a substrate 1041 and a plurality of contact portions 1042 provided on the substrate 1041, along the y direction and the d direction. Both vertical directions, the substrate 1041 has an opposing first side 1048 and a second side 1049.
  • the first side 1048 is opposite to the contact pin 91
  • the first group of contact portions 1045 of the plurality of contact portions 1042 is disposed on the first side 1048
  • the second group of contact portions 1046 of the plurality of contact portions 1042 is disposed on the second side 1049
  • the first group of contact portions 1045 includes One or more contact portions 1042
  • the second set of contact portions 1046 includes one or more contact portions 1042
  • one or more contact portions 1042 in the first set of contact portions 1045 are also referred to as front contact portions
  • One or more contacts 1042 of the second set of contacts 1046 are also referred to as back contacts 1043 .
  • the front contact portion 1042 directly contacts the contact pin 91 and the back contact portion 1043 contacts the contact pin 91 through the conductor 107; in the chip assembly 103, the conductor 107 is in contact with the back contact portion 1043.
  • the conductor 107 and the chip 104 are combined by snapping, or by welding, or by bonding, or by the chip 104 being connected. The conductor 107 is clamped and combined, etc.
  • the conductor 107 includes a front conductive member 1074 and a back conductive member 1075 that are electrically connected to each other.
  • the front conductive member 1074 is used to contact the contact pin 91 and the back conductive member 1075 is used to contact the back surface. In this way, the back contact portion 1043 and the contact pin 91 can form an electrical connection.
  • the front conductive member 1074 and the back conductive member 1075 are preferably integrally formed by conductive members. For example, a metal sheet is bent according to the design requirements.
  • the front conductive component 1074 and the back conductive component 1075 can also be two independent conductive components, and they are electrically connected through conductive materials.
  • the conductor 107 also includes a contact portion 1076 provided on the back conductive member 1075.
  • the contact portion 1076 is used to contact the back contact portion 1043. It is possible that the abutment portion 1076 and the back contact portion 1043 can form a point. Any one of contact/line contact/surface contact, when line contact or surface contact is formed between the two, the center of the contact line or contact surface can be the contact point, when multiple point contacts are formed between the two and When one of the plurality of line contacts and the plurality of surface contacts is in contact, the contact point can be determined by one of the plurality of point contacts, the plurality of line contacts and the plurality of surface contacts, or the contact point formed by the plurality of point contacts can be used. One of the area/space and the area/space formed by multiple line contacts and the area/space formed by multiple surface contacts determines the contact point.
  • the chip component 103 can be fixedly installed on the housing 101 through snapping, bonding, riveting, welding, etc.
  • the substrate 1041 is provided with a substrate coupling groove 1047
  • the conductor 107 is provided with a conductor coupling groove 1073.
  • the housing 101 or the positioning plate 105 is provided with a coupling column 1051 that is combined with the coupling groove 1047/1073 (as shown in the figure 23).
  • multiple contact portions 1042 are respectively provided on the first side 1048 and the second side 1049 of the substrate. In this way, the contact portions provided on the second side 1049 can be more comprehensively protected.
  • multiple contact portions 1042 are originally provided on the first side 1048 and the second side 1049 of the substrate.
  • the surface area of the first side 1048 of the contact portion 1042 can be reduced.
  • the plane/surface projected area of the substrate 1041 including the d direction and the y direction is reduced. That is to say, the overall size of the chip 104 is reduced.
  • the chip assembly 103 including the chip 104 also needs to be provided with a conductor 107, but the conductor 107 can be set according to the position and size of the contact pin 91. Overall, the chip assembly 103 can still be controlled in the direction of small size, and further Furthermore, when the conductor 107 is made of flexible material, the overall size of the chip assembly 103 can be made smaller.
  • the chip 104 also needs to be provided with the memory 1044.
  • the memory 1044 can be provided on the second side 1049 together with the back contact portion 1043. In this way, the surface area of the second side 1049 can be fully utilized.
  • the memory 1044 can also be disposed on the first side 1048 together with the front contact portion 1042, and the first side 1048 will face the contact pin 91, and the second side 1049 will face the housing 101. Through such an arrangement, The memory 1044 does not have to protrude from the second side 1049.
  • the size of the chip 104 can be reduced from the substrate 1041 toward the housing 101.
  • the housing 101 The space for accommodating the chip 104/chip assembly 103 can be reduced, especially when the conductor 107 is made of a thin material (such as a sheet-like conductive material), even if at least a portion of the reverse conductive member 1075 is opposite to the second side 1049, The size of the chip assembly 103 in the thickness direction from the substrate 1041 toward the housing 101 can still be reduced.
  • a method of setting a power supply in the chip 104 to directly supply power to the circuit board of the chip there is a method of setting a power supply in the chip 104 to directly supply power to the circuit board of the chip.
  • a battery is used as the power supply.
  • the battery can also be disposed on the first side 1048, so that in the thickness direction, the size of the chip 104/chip assembly 103 can also be reduced from the substrate 1041 toward the housing 101.
  • this design is also conducive to the realization of the battery. Quick installation and removal.
  • the five contact portions 1042 are respectively the first terminal 10421 (data terminal cpd), the second terminal 10422 (clock terminal cpc), and the third terminal 10423 (reset terminal cpr), the fourth terminal 10424 (power terminal cpvd) and the fifth terminal 10425 (ground terminal cpvs).
  • the first terminal 10421 data terminal cpd
  • the second terminal 10422 clock terminal cpc
  • the The three terminals 10423 reset terminal cpr
  • the fourth terminal 10424 power terminal cpvd
  • the fifth terminal 10425 ground terminal cpvs
  • the fifth terminal 10425 is provided on the second side 1049 to form the back contact portion 1043. There are various positions of the back contact portion 1043 on the second side 1049, which will be described below when viewed along the thickness direction.
  • the contact pin 91 forms a contact point C with each front contact portion 1042, the contact pin 91 forms a contact point C1 with the conductor 107/front conductive member 1074, and the back conductive member 1075 and the back contact portion 1043 also form a contact point C.
  • the contact point formed by the contact pin 91 and the first terminal 10421 is Cd
  • the contact point formed by the contact pin 91 and the second terminal 10422 is Cc
  • the contact point formed by the contact pin 91 and the third terminal 10423 is Cr.
  • the contact point formed by 91 and the fourth terminal 10424 is Cvd
  • the contact point formed by the conductor 107 and the fifth terminal 10425 is Cvs
  • the contact point Cd the contact point Cc
  • the contact point Cr the contact point
  • the projection points (final projection points) formed by the projection points of the contact point Cvd and the contact point Cvs on the plane including the y direction and the d direction on the straight line D parallel to the y direction are different, where, along the y direction, the contact point Cc
  • the final projection point of and the final projection point of the contact point Cvs are respectively located on the outermost side of all contact points, and the final projection point of the contact point Cr is located in the middle of the final projection point of all contact points;
  • the contact points formed on the substrate 1041 can be collectively referred to as
  • the contact points formed on conductor 107 may be collectively referred to as contact point C2.
  • the contact point Cc is located on the -y side of the other three contact points
  • the contact point Cd is located on the +y side of the other three contact points
  • the contact point Cvs is located on the +y side of the contact point Cd.
  • y side therefore, among all the contact points located on the substrate 1041, along the y direction, the contact point Cc and the contact point Cvs are respectively located on the outermost side of all (five) contact points, and the contact point Cc and the contact point Cvs are at
  • the projection points of the plane/surface including the y direction and the d direction on the straight line D parallel to the y direction are E and B respectively.
  • the center line of the line segment EB is L3a.
  • the substrate 1041 is on the center line L3a -
  • the third area Q3a is formed in the y direction
  • the fourth area Q4a is formed in the +y direction of the center line L3a.
  • the contact point Cvd, the contact point Cc and the contact point Cr are located in the third area Q3a
  • the contact point Cd and the contact point Cvs are located in the third area Q3a.
  • Four areas Q4a that is to say, the number of contact points/contact pins on both sides of the center line L3a is different. This design is beneficial to reducing the risk of chip short circuit.
  • the back contact part 1043 is hidden on the other side of the substrate 1041 and cannot be observed, and only the front contact part 1042 can be observed.
  • the first terminal 10421 data terminal cpd
  • the second Terminal 10422 clock terminal cpc
  • third terminal 10423 reset terminal cpr
  • fourth terminal 10424 power supply terminal cpvd
  • the contact point Cc and the contact point Cd are respectively located at the outermost of all (four) contact points.
  • the contact point Cc and the contact point Cd are on the plane/surface including the y direction and the d direction.
  • the projection points of the projection point on the straight line D parallel to the y direction are E and B respectively.
  • the center line of the line segment EB is L3b.
  • the substrate 1041 forms a third region Q3b in the -y direction of the center line L3b.
  • the +y direction of L3b forms a fourth area Q4b, the contact point Cvd and the contact point Cc are located in the third area Q3b, the contact point Cd and the contact point Cr are located in the fourth area Q4b, that is to say, the contacts on both sides of the center line L3b
  • the number of points/contact pins is the same. In this way, when the contact part comes into contact with the contact pin 91, the forces on both sides of the center line L3b are balanced, which is helpful to ensure that the front contact part and the contact pin 91 form stable electrical contact.
  • the contact points/contact pins on both sides of the center line L3b can also be arranged symmetrically.
  • the contact point Cr and the contact point Cvd are on the plane/surface including the y direction and the d direction.
  • the projection points of the projection point on the straight line D parallel to the y direction are M and N respectively.
  • the projection point M and the projection point B are located on the +y side of the center line L3b
  • the projection point N and the projection point E are located on the - of the center line L3b.
  • the projection point M and the projection point N are symmetrical about the center line L3b, and the projection point N and the projection point E are symmetrical about the center line L3b.
  • this arrangement of the contact portion/contact point is more conducive to maintaining The forces on both sides of the center line L3b are balanced.
  • the contact point Cvs is set closer to the contact point Cd.
  • the contact point Cvs is disposed closer to the contact point Cd.
  • Point Cc and contact point Cvs are still located at the outermost of all (five) contact points respectively.
  • the projection points of the contact point Cc and contact point Cvs on the plane/surface including the y direction and the d direction are on a straight line parallel to the y direction.
  • the projection points of D are E and B respectively, and the center line of the line segment EB is L3c.
  • the substrate 1041 forms a third region Q3c in the -y direction of the center line L3b, and in the +y direction of the center line L3c.
  • the difference from the structure shown in Figure 18A is that in this deformation method, the center line L3c passes through the contact point Cr, the contact point Cvd and the contact point Cc are located in the third area Q3c, the contact point Cd and the contact point Cvs Located in the fourth area Q4c, it can be seen that in this deformation method, the number of contact points on both sides of the center line L3c is the same. Since the contact point Cvs is closer to the contact point Cd, the size of the substrate 1041 will become smaller along the y direction.
  • the contact points on both sides of the center line L3c can also be arranged symmetrically. This design can also reduce the size of the substrate 1041 in the y direction.
  • FIG. 19 is an exploded perspective view of the chip assembly according to Embodiment 9 of the present invention.
  • the chip assembly 103 in this embodiment also includes a pushing member 106 for contacting the conductor 107 when the chip assembly 103 is installed into the housing 101 or when the conductor 107 is combined with the chip 104 At this time, the pushing member 106 pushes the back conductive member 1075 toward the back contact portion 1043, so that the contact between the abutting portion 1076 and the back contact portion 1043 is more stable.
  • the urging member 106 is configured as an elastic member.
  • the urging member 106 is a sponge/compression spring with one end in contact with the conductor 107 and the other end in contact with the housing 101/positioning plate 105.
  • the urging member 106 can also force the chip 104 and/or the conductor 107 to form stable contact by applying magnetic attraction to them.
  • a magnetic member is installed on the substrate 104. The conductor 107 is combined with the chip 104, and the magnetic component attracts the conductor 107 at a predetermined position, or the magnetic component is installed on the substrate 104 and the conductor 107 at the same time.
  • the urging member 106 can also force the chip 104 and the conductor 107 to form stable contact by exerting a magnetic repulsive force on the conductor 107.
  • the conductor 107 is made of a metal sheet, it is positioned on the housing 101/ The board 105 is mounted with magnetics that force the conductor 107 toward the chip 104 as the conductor 107 engages with the chip 104, or as the chip assembly 103 is installed.
  • FIG. 20 is an exploded perspective view of the chip assembly according to Embodiment 10 of the present invention
  • FIG. 21 is a perspective view of the chip assembly according to Embodiment 10 of the present invention when viewed from the reverse side
  • FIG. 22A is a chip assembly according to Embodiment 10 of the present invention. After being installed in the imaging material box, the side view is viewed along the direction perpendicular to the chip substrate;
  • FIG. 22B is the side view viewed along the direction perpendicular to the chip substrate after the position of the back contact portion in FIG. 22A is deformed.
  • the back contact portion 1043 When the back contact portion 1043 is disposed on the second side 1049 together with the memory 1044, compared with the chip assembly shown in Figures 16 and 17, the back contact portion 1043 in this embodiment is located on the -y side of the memory 1044. Similarly , there are also various changes in the arrangement position of the back contact portion 1043, which will be described below with reference to Figures 22A and 22B.
  • the contact point Cc and the contact point Cd are respectively located at the outermost side of all (five) contact points, and the contact point Cvs is located at the contact point Between Cc and contact point Cd, the projection points of the contact point Cc and contact point Cd on the plane/surface including the y direction and the d direction on the straight line D parallel to the y direction are respectively E and B, and the line segment EB
  • the center line is L3d.
  • the substrate 1041 forms a third region Q3d in the -y direction of the center line L3d, and a fourth region Q4d in the +y direction of the center line L3d.
  • the contact point Cc and the contact point Cvd are located in the third area Q3c, and the contact point Cr and the contact point Cd are located in the fourth area Q4c. That is to say, the contact points on both sides of the center line L3d
  • the balanced force is conducive to ensuring that the front contact part and the contact pin 91 form a stable electrical contact; when considering the back contact part 1043, the contact point Cc, the contact point Cvd and the contact point Cvs are located in the third area Q3c, the contact point Cr and the contact point Point Cd is located in the fourth area Q4c.
  • the number of contact points/contact pins on both sides of the center line L3d is different, which is beneficial to reducing the risk of chip short circuit.
  • the contact point Cvs between the contact point Cc and the contact point Cd along the y direction It will not affect the forces on both sides of the center line L3d. Therefore, in this embodiment, regardless of whether the back contact portion 1043 is considered, the forces on both sides of the center line L3d can be balanced, and the chip 104 and the contact pin 91 can Form a stable electrical contact.
  • the contact point Cvs continues to move in the -y direction based on Figure 22A, and reaches the -y side of the contact point Cc. Therefore, the contact point Cvs and the contact point Cd are respectively located at the outermost of all (five) contact points in the y direction, and the projection points of the contact point Cvs and the contact point Cd on the plane/surface including the y direction and the d direction are between
  • the projection points of the straight line D parallel to the y direction are E and B respectively, and the center line of the line segment EB is L3e.
  • the substrate 1041 forms a third region Q3e in the -y direction of the center line L3e, and in the +y direction of the center line L3e.
  • the direction forms the fourth area Q4e; in this embodiment, the final projection point of the contact point Cvd is located in the middle of the final projection points of all contact points, and the center line L3e passes through the contact point Cvd.
  • the back contact portion 1043 can be disposed at different positions on the second side 1049.
  • the position of the back contact portion 1043 on the second side 1049 can be different from that of the substrate 1041.
  • the +y direction side changes toward the -y direction side. Therefore, the back contact portion 1043 can have different positions on the second side 1049, and all the contact portions are the two contacts at the outermost side in the y direction (ie, the -y side and the +y side).
  • the points are also different, and the center line formed by the two contact points is also different.
  • the position of the back contact part in Figure 22A can be regarded as the second deformation of the position of the back contact part in Figure 18A.
  • the back contact part in Figure 22B The position of the back contact portion can be regarded as the third deformation of the position of the back contact portion in Figure 18A; in a further deformation, the back contact portion 1043 can also be set as the final projection point of at least one back contact portion 1043
  • the final projection point of at least one front contact portion 1042 coincides with the final projection point of at least two of the plurality of back contact portions when the number of back contact portions 1043 is provided.
  • the back contact portion 1043 will face the housing 101, so the back contact portion 1043 can be more effectively protected.
  • the fifth terminal 10425 (ground terminal cpvs) is set as the back contact portion 1043.
  • the first terminal 10421 data terminal cpd
  • the second terminal 10422 clock terminal cpc
  • the Three terminals 10423 reset terminal cpr
  • fourth terminal 10424 power terminal cpvd
  • fifth terminal 10425 ground terminal cpvs
  • the chip 104/chip component 103 can obtain a higher degree of design freedom, and the degree of freedom in the arrangement and design of the contact portions is also improved.
  • the plurality of contact portions at least one contact portion is provided on the second side 1049 to become a back contact portion. Then, the side area of the substrate where the back contact portion is originally provided can be reduced. Overall, the entire chip The size of the substrate 1041 can also be reduced, which is beneficial to miniaturization of the chip 104, thereby miniaturizing the chip assembly 103 and/or miniaturizing the imaging material cartridge 100.
  • this design is also conducive to miniaturization of the imaging material cartridge 100, for example.
  • FIG. 23 is a perspective view of a second imaging material cartridge equipped with the chip assembly according to the present invention.
  • the imaging material cartridge 100 suitable for the chip 104/chip assembly 103 has various forms.
  • the imaging material cartridge 100 can be a process box or a toner cartridge that contains toner, or it can be It is the cartridge that holds the ink.
  • Figure 23 is a perspective view of the second type of ink cartridge 100a suitable for the chip 104/chip assembly 103.
  • the second type of ink cartridge 100a also has a housing 101 for containing ink and an ink outlet 102 provided on the housing 101.
  • the housing The body 101 has a front side wall 101a facing the +x direction and a rear side wall 101b facing the -x direction.
  • the lower side wall 101d is located between the front side wall 101a and the rear side wall 101b.
  • the first coupling member 11 is provided on the front side wall.
  • the second coupling member 12 is provided on the rear side wall 101b
  • the ink outlet 102 is provided on the lower side wall 101d, and compared to the front side wall 101a, the ink outlet 102 is closer to the rear side wall 101b
  • the first coupling member 11 is To guide the installation of the ink cartridge 100a, in some embodiments, the first binding member 11 is also used to restrict the ink cartridge 100 in the imaging device, and the second binding member 12 is used to combine with the imaging device to restrict the ink cartridge 100a in the imaging device.
  • the ink cartridge 100a also has the above-mentioned inclined side wall 101e, and the chip 104/chip assembly 103 is disposed on the inclined side wall 101e. Specifically, the chip 104/chip assembly 103 is disposed on the positioning plate 105 located on the inclined side wall 101e.
  • the ink cartridge 100a also includes an operating device 17 that is movable relative to the housing 101.
  • the operating device 17 includes a locking portion 17c and an unlocking portion 17a.
  • the locking portion 17c is closer to the second combining member 12.
  • the first coupling part 11, therefore, the locking part 17c and the second coupling part 12 can respectively limit the ink cartridge 100a from the +x direction side and the -x direction side of the housing 101, and the unlocking part 17a is used to release the locking part 17c from the ink cartridge 100a. 100a lock.
  • the chip 104/chip assembly 103 is disposed adjacent to the locking portion 17c. In this way, through the locking of the locking portion 17c, the chip 104/chip assembly 103 and the contact pin 91 can form a more stable contact.
  • FIG. 24 is a perspective view of a third imaging material cartridge equipped with the chip assembly according to the present invention.
  • the third imaging material cartridge shown in Figure 24 is an ink cartridge 100b. Different from the ink cartridge 100a, in the ink cartridge 100b, along the x direction, the ink outlet 102 is closer to the front side wall 101a than the rear side wall 101b. , and the first coupling member 11 provided on the front side wall 101a is movable/swingable relative to the housing 101, the first coupling member 11 is provided with an engaging protrusion 11a, and the ink cartridge 100b is limited to the imaging device through the engaging protrusion 11a. , and the deformation movement/swing movement of the first coupling member 11 relative to the housing 101 releases the restriction of the ink cartridge 100b by the engagement protrusion 11a.
  • At least one of the plurality of contact portions in the chip according to the present invention is provided on the second side 1049 of the chip substrate 1041.
  • the contact portion provided on the second side 1049 is connected to the contact portion through the conductor 107 outside the chip 104.
  • Pin contact this structural design is not only conducive to improving the freedom of arrangement and design of the contact parts, but also conducive to miniaturization of the chip 104.
  • the chip assembly 103 including the chip 104, the chip 104 or the chip assembly 103 are installed. Miniaturization of the imaging material cartridge 100/100a/100b also becomes easy.

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Abstract

公开了芯片（104）以及具有该芯片的芯片组件（103）和成像材料盒（10），芯片用于随着成像材料盒可拆卸地安装至设置有多个触针成像设备，芯片包括基板（1041）以及设置在基板上的多个接触部（1042，1043），基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部（1042）和设置在第二侧的反面接触部（1043）；当成像材料盒被安装至成像设备的预定位置时，正面接触部与触针（91）电连接，反面接触部通过芯片外部的导体(107)与触针电连接。因而，接触部的排布设计自由度可被提高，芯片也变得可小型化，进而，设置有该芯片的芯片组件、安装有该芯片或芯片组件的盒以及安装所述盒的成像设备小型化的实现将变得容易实现。

Description

芯片、芯片组件和成像材料盒 技术领域
本发明涉及成像领域，尤其涉及一种可拆卸地安装在成像设备中的成像材料盒以及安装在成像材料盒的芯片和芯片组件。
背景技术
现有的成像设备包括激光打印机、复印机、喷墨打印机等，在这些成像设备中均安装有容纳成像材料的盒，根据成像设备的类型不同，成像材料也不同，例如，当成像设备是激光打印机时，成像材料为碳粉，当成像设备是喷墨打印机时，成像材料为墨水。
通常，为使得盒与成像设备之间建立通信连接，芯片组件被安装在盒上，当盒被安装至成像设备的预定位置时，芯片组件的接触部与成像设备的触针接触；现有芯片的多个接触部被设置在同一块基板的同一侧，在该基板有限的表面面积中，这些接触部的排布密度较大，接触部的设计将受到较大限制，同时，这些紧密排布接触部也容易发生短路。
发明内容
本发明提供一种芯片以及具有该芯片的芯片组件和成像材料盒，以解决或优化上述技术问题至少之一，具体方案如下：
芯片，用于随着成像材料盒可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部；正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接，该方案减少了基板同一侧的接触部数量，进而可提升芯片的设计自由度，同时，接触部的排布密度降低，接触部之间发生短路的风险也被降低，另一方面，芯片的尺寸也能够减小，从而，芯片的小型化、使用该芯片的成像材料盒和成像设备的小型化也变得容易实现。
其中，所述中心线L2为所有接触部均设置在基板的同一侧时所产生。
所述中心线L2还可以是，位于y方向最外侧的两个触针在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线即为L2。
优选地，所述反面接触部包括接地端子。
在一些实施方式中，正面接触部的数量大于反面接触部的数量。
在一些实施方式中，正面接触部与触针形成的接触点以及反面接触部与导体形成的接触点在所述表面的投影点在直线D上各自形成投影点；沿y方向，在所有接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
在一些实施方式中，正面接触部与触针形成的接触点在所述表面的投影点在直线D上各自形成投影点；沿y方向，在正面接触部与触针形成的接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
在一些实施方式中，沿y方向，位于直线D且分别位于中心线两侧的投影点对称设置。
多个接触部还包括数据端子、时钟端子、复位端子和电源端子，反面接触部还包括电源端子。
本发明提供的芯片组件，包括如上所述的芯片以及与芯片中的反面接触部接触的导体，芯片与导体分体形成；进一步地，芯片组件还包括用于将导体向着反面接触部迫推的迫推件。
本发明提供的成像材料盒，包括上述芯片或芯片组件；在正面接触部中，位于y方向最外侧的两个接触点在所述表面的投影点在直线D的投影点的连线的中心线为L6，经过成像材料排出部的中心线为L5，L5与L6不重合。
在一些实施方式中，壳体在y方向具有中心线L1，L1与L6不重合。
在一些实施方式中，壳体设置有放置导体的安装槽。
在一些实施方式中，壳体具有相对布置的前侧壁和后侧壁以及设置在前侧壁的第一结合件，第一结合件用于将成像材料盒限制在成像设备中，芯片组件被安装在前侧壁，所述第一结合件相对于壳体可活动。
在一些实施方式中，d方向与z方向、x方向以非垂直的角度相交。
在一些实施方式中，d方向与x方向相同。
在一些实施方式中，d方向与z方向相同。
附图说明
图1A是本发明涉及的成像材料盒的立体图。
图1B是本发明涉及的成像材料盒所适用的成像设备内设置的触针组件的立体图。
图1C是本发明涉及的成像材料盒安装至成像设备后，触针与成像材料盒之间的相对位置示意图。
图2是本发明实施例一涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的方 向观察的侧视图。
图3是本发明实施例二涉及的芯片正面的立体图。
图4是本发明实施例二涉及的芯片反面的立体图。
图5是本发明实施例二涉及的芯片组件与成像材料盒的壳体分离后的状态图。
图6是本发明实施例三涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图。
图7是本发明实施例四涉及的芯片组件与壳体分离后的状态图。
图8A是本发明实施例四涉及的芯片组件中的芯片被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图。
图8B是本发明实施例四涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图。
图9是本发明实施例四涉及的芯片组件中的又一种芯片的侧视图。
图10是本发明涉及的成像材料盒及其所适用的一种成像设备中成像材料盒容纳部相互分离的状态图。
图11是本发明实施例五涉及的芯片组件与成像材料盒的壳体分离后的状态图。
图12是本发明实施例五涉及的芯片组件中部分部件的立体图。
图13是安装有本发明实施例五涉及的芯片组件的成像材料盒被安装至成像设备后，沿y方向观察的侧视图。
图14是沿与y方向垂直，并经过一个接触部与对应触针的接触位置的平面对图13的成像材料盒以及成像设备剖切后的剖视图。
图15是安装有本发明实施例六涉及的芯片组件的成像材料盒的立体图。
图16是本发明实施例八涉及的芯片组件的立体图。
图17是本发明实施例八涉及的芯片组件中的芯片与导体分离后的立体图。
图18A是本发明实施例八涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图。
图18B是对图18A所示芯片组件进一步解释的示意图。
图18C是图18A中反面接触部的位置做出第一种变形后，沿与芯片基板垂直的方向观察的侧视图。
图19是本发明实施例九涉及的芯片组件被分解后的立体图。
图20是本发明实施例十涉及的芯片组件被分解后的立体图。
图21是从本发明实施例十涉及的芯片组件的反面观察时的立体图。
图22A是本发明实施例十涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的 方向观察的侧视图。
图22B是图22A中反面接触部的位置做出变形后，沿与芯片基板垂直的方向观察的侧视图。
图23是安装有本发明涉及的芯片组件的第二种成像材料盒的立体图。
图24是安装有本发明涉及的芯片组件的第三种成像材料盒的立体图。
具体实施方式
下面结合附图详细描述本发明的实施例。
[成像材料盒]
图1A是本发明涉及的成像材料盒的立体图；图1B是本发明涉及的成像材料盒所适用的成像设备内设置的触针组件的立体图；图1C是本发明涉及的成像材料盒安装至成像设备后，触针与成像材料盒之间的相对位置示意图。
如背景技术所述，成像材料盒10中容纳的成像材料种类根据成像设备的类型不同而不同，所述成像材料可以是碳粉，此时，成像材料盒为处理盒或粉筒，所述成像材料也可以是墨水，此时，成像材料盒为墨盒，然而，无论成像材料的种类如何，下文所述的芯片组件103均可适用。
为使得下文描述更清楚，以用户对成像材料盒进行安装时的成像材料盒姿态为准，定义用户视线的前方为+x方向，用户视线的后方为-x方向，用户视线的上方为+z方向，用户视线的下方为-z方向，用户视线的左方为+y方向，用户视线的右方为-y方向；包括有所述+x方向和-x方向的x方向为成像材料盒的长度方向，包括有所述+y方向和-y方向的y方向为成像材料盒的宽度方向，包括有所述+z方向和-z方向的z方向为成像材料盒的z方向，-z方向指向重力方向，因而，z方向与重力方向平行；所述x方向、y方向和z方向相交，优选地，x方向、y方向和z方向相互垂直。
下文中以墨盒为例进行描述。
如图所示，墨盒10包括容纳墨水的壳体101、设置在壳体上的出墨部102(成像材料排出部)和芯片组件103，壳体具有面向前方的前侧壁101a、面向后方的后侧壁101b、面向上方的上侧壁101c、面向下方的下侧壁101d、面向左方的左侧壁101f和面向右方的右侧壁101g(如图2所示)，前侧壁101a与后侧壁101b在x方向相对，上侧壁101c和下侧壁101d在z方向相对，左侧壁101f和右侧壁101g在y方向相对，用于容纳墨水的腔体至少由前侧壁101a、后侧壁101b、上侧壁101c、下侧壁101d、左侧壁101f和右侧壁101g围合形成，出墨部102设置在下侧壁101d。芯片组件103可被设置在壳体101的任意一个侧壁上，或者，前侧壁101a与下侧壁101d之间形成相对于z方向倾斜的倾斜侧壁101e，芯片组件103的至少一部分与该倾斜侧壁101e相对，优选的，芯片组件103被设置在倾斜侧壁101e。
芯片组件103至少包括芯片104，如图所示，芯片104包括基板1041、存储器1044(如图4所示)和至少一个接触部1042/1043，常见的，存储器1044和接触部1042均被设置在基板1041上，存储器1044用于存储芯片的信息，并与接触部1042电连接，二者可以被设置在基板1041的同一侧，也可以分别位于基板1041的两侧，或者，存储器1044和接触部1042之一被设置在基板1041上，另一个被设置在基板1041之外，但存储器1044和接触部1042之间通过导线连接，为便于理解和说明，下文所述的芯片104均为存储器1044和接触部1042设置在基板1041，优选的，芯片被安装在倾斜侧壁101e。
位于成像设备内的触针组件90包括多个触针91，整体上看，芯片组件103中用于与多个触针91接触的接触部1042的排布方式与多个触针91的排布方式相同；如图1C所示，所有接触部均设置在基板的同一侧，沿与d方向平行的方向并经过基板1041最外侧的两条直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点C在包括y方向和d方向的平面/表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2，沿y方向，该区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，沿y方向，第一区域Q1内的触针数量/接触部数量与第二区域Q2内的触针数量/接触部数量不同，下文中，将位于第一区域Q1内的触针称为第一组触针90a，位于第二区域Q2内的触针称为第二组触针90b，第一组触针90a中的触针数量不同于第二组触针90b中的触针数量。每个触针91均具有用于与芯片组件103接触的接触端91a以及与接触端91a相邻的侧面91b，所述接触端91a可以形成为点/线/面中的任意一种，优选的，接触端91a形成为锥形尖端，侧面91b为与该锥形尖端相邻的表面，远端面91c与侧面91b相邻布置。
在一些实施例中，沿d方向，经过出墨部102中心的中心线L5与墨盒10在y方向的中心线L1重合，也就是说，出墨部102被设置在壳体101沿y方向的中间位置，此时，触针组件90与中心线L5的相对位置以及触针组件90与中心线L1的相对位置相同。
在另一些实施例中，中心线L5与中心线L1不重合，如图1C所示，沿y方向，中心线L5比中心线L1更靠近壳体101的左侧壁101f或右侧壁101g，这样，位于中心线L5两侧的触针数量/芯片组件103的接触部/接触点数量也不相同，设置的更加远离中心线L5的触针/芯片组件的接触部被出墨部102泄漏的墨水污染的几率被降低，相应的，芯片短路风险也被降低。
进一步的，线段N1N2的中心线L2被设置成不与中心线L1重合，也不与中心线L5重合，沿y方向，位于中心线L2两侧的触针数量不同，芯片短路的风险被降低，即使成像设备发生较大幅度的晃动，触针的晃动幅度可被减小，从而确保触针与芯片组件103的接触部保持良好接触。
[芯片组件]
实施例一
图2是本发明实施例一涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图。
如上所述，倾斜侧壁101e相对于z方向倾斜，当沿着与基板1041垂直的方向观察时，视线的上下方向将不再是z方向，而是图2所示的d方向，所述d方向与y方向垂直，并与基板1041设置接触部的平面的延伸方向平行，且d方向还与z方向和x方向以非垂直的角度相交；在另一些实施例中，壳体101不设置倾斜侧壁101e，或者芯片104被设置在前侧壁101a时，所述d方向将与z方向相同，芯片104被设置在下侧壁101d时，所述d方向将与x方向相同。
如图2所示，中心线L1与y方向垂直，并将壳体101分割为在y方向对称的两部分，也就是说，直线L1是壳体101在y方向的中心线；芯片104的接触部1042被设置为多个，且所有接触部1042均位于基板1041的同一侧，每个接触部均与成像设备的触针形成接触点C，沿y方向，多个接触部1042错位布置，沿d方向，多个接触部呈多行布置，直线D与y方向平行，分别位于+y方向末端的接触点C和位于-y方向末端的接触点C在经过y方向和d方向的平面(基板1041设置接触部的表面)的投影点在直线D的投影点分别为B和A，线段BA的中心线为L6。
本实施例中，中心线L1不与中心线L6重合，整体上看，在y方向上，多个接触部1042/接触点C被设置成不关于中心线L1对称，换句话说，多个接触部1042/接触点C的全部或大部分设置在中心线L1的一侧，或者，位于中心线L1一侧的接触部1042/接触点C的数量大于中心线L1另一侧的接触部1042/接触点C的数量；中心线L6也不与中心线L5重合，这样，沿y方向，至少一个接触部1042/接触点C被设置成远离中心线L5/L6，从出墨部102泄漏的墨水更不容易污染所述至少一个接触部1042。
该芯片104可带来以下有益效果：
(1)具有此种芯片104的墨盒10在被安装至成像设备后，即使设备发生较大幅度的晃动，芯片104的晃动幅度可被减小，触针的晃动幅度相应的也被减小，二者晃动幅度的叠加值也较小，具体体现为，接触点C与触针之间仍将保持良好的接触；
(2)沿y方向，当基板1041的中心线与中心线L1重合时，以中心线L1为界，此种芯片104的一侧被使用的面积小于另一侧被使用的面积，那么在具有更大使用面积的一侧可根据设计需求进行其他布置，例如，在该侧设置用于固定芯片的固定部，或者将存储器1044设置在该侧等，由此，芯片104的设计自由度被大幅提升；
(3)中心线L1与中心线L6不重合，沿y方向，中心线L6将比中心线L1更加靠近基板1041的一侧/一个末端，这就造成沿y方向，接触部1042/接触点C更集中的分布在基板1041靠近中心线L6的一侧/一个末端与中心线L6之间，而基板1041远离中心线L6的另一侧/另一个末端与中心线L6之间则能够布置更多的结构或部件，同时，沿y方向，远离中心线L6的接触部1042/接触点C更不容易被墨水污染。
实施例二
图3是本发明实施例二涉及的芯片正面的立体图；图4是本发明实施例二涉及的芯片反面的立体图；图5是本发明实施例二涉及的芯片组件与成像材料盒的壳体分离后的状态图。
本实施例与实施例一的不同之处在于，所述多个接触部1042中的一部分被设置在基板的另一侧，因而，多个接触部1042可被分为第一组接触部1045和第二组接触部1046，其中，第一组接触部1045位于基板1041的一侧/第一侧1048，第二组接触部1046位于基板1041的另一侧/第二侧1049；下文中，被设置在基板1041另一侧/第二侧1049的第二组接触部1046包括一个或多个反面接触部1043，被设置在基板1041一侧/第一侧1048的第一组接触部1045包括一个或多个正面接触部1042。如图3和图4所示，存储器1044被设置在基板1041的另一侧/第二侧1049，与存储器1044同侧设置有一个反面接触部1043，与存储器1044相反的一侧设置有多个正面接触部1042，所述正面接触部1042和反面接触部1043可以被设置成从基板1041突出预定的高度，还可以是与基板1041的表面重合。
具体的，所述反面接触部1043可以是电源端子和接地端子中的任意一个，当反面接触部1043设置为多个时，电源端子和接地端子均可设置为反面接触部1043；如图5所示，芯片组件103还包括迫推件106和导体107，导体107的一端用于与反面接触部1043接触，另一端与迫推件106接触，当墨盒10被安装至成像设备时，迫推件106将导体107的另一端推向与成像设备相应位置设置的部件接触，也就是说，成像设备中用于与反面接触部1043接触的触针所在的位置不同于用于与正面接触部1042接触的触针所在的位置。
所述导体107既可以被预设成与反面接触部1043接触，也可以预设成不与反面接触部1043接触，而是在墨盒10的安装过程中实现导体107与反面接触部1043接触。
优选的，导体107设置在下侧壁101d，这样，利用墨盒自身的重力以及迫推件106的推力，导体107与相应触针的接触将更稳定。进一步的，壳体101还设置有放置导体107的安装槽10e，这样，导体107的安装位置被精确定位，导体107与反面接触部1043和触针的接触将更稳定。
继续如图2所示，沿y方向，反面接触部1043被设置成远离正面接触部1042，位于y方向最外侧的两个接触点C在经过y方向和d方向的平面/表面的投影点在直线D的投影点分别为E和B，线段EB的中心线为L3，本实施例中，沿y方向，无论中心线L1是否与中心线L3重合，反面接触部1043远离正面接触部1042，且反面接触部1043通过导体107被引出，所带来的有益效果如实施例一所述，在此不再赘述；对于实施例一来说，当反面接触部1043与正面接触部1042被设置在基板1041的同一侧时，所述中心线L3与中心线L1、中心线L6之间的相对位置不会发生改变。
在实施例一和实施例二中，当经过出墨部102的中心线L5不与中心线L1重合时，所述中心线L6、中心线L3也不与中心线L5重合，同样可使得沿y方向远离中心线L5的接触部1042/1043或接触点C不容易被出墨部102泄漏的墨水污染。
可被理解的是，反面接触部1043并不应被限制在与正面接触部1042相对的一侧，所述反面接触部1043还可以被设置在基板1041的其他表面，只要不与正面接触部1042设置在同一侧即可，该设计降低了正面接触部1042所在侧(第一侧1048)的接触部设置密度，正面接触部所在侧的设计自由度可得到提升，同时，各个接触部之间发生短路的风险也被降低。
实施例三
图6是本发明实施例三涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图。
与上述实施例不同的是，本实施例中的多个接触部1042被设置成，沿d方向，至少有两个接触部1042重合，更具体的说，沿d方向，至少有两个接触点C重合。
如图6所示，沿y方向最外侧的两个接触部1042/接触点C分别在包括y方向和d方向的平面/表面的投影点在直线D的投影点为A和B，线段AB的中心线为L7，所述中心线L1与中心线L7不重合，其所带来的有益效果如实施例一所述，在此不再赘述。
本实施例中，沿y方向，经过出墨部102的中心线L5也不与中心线L7重合，同样可使得沿y方向远离中心线L5的接触部1042/1043或接触点C不容易被出墨部102泄漏的墨水污染。
实施例四
图7是本发明实施例四涉及的芯片组件与壳体分离后的状态图；图8A是本发明实施例四涉及的芯片组件中的芯片被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图；图8B是本发明实施例四涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图。
本实施例中，芯片组件103被设置成至少部分可活动，如图7所示，芯片组件103包括芯片104、迫推件106和适配器1031，所述适配器1031的一端与芯片104/接触部1042接触，另一端用于与触针接触，迫推件106用于将适配器1031向着触针的方向迫推；适配器1031包括相互结合的活动件103a和连通件103b，二者可一体形成，也可分体形成，连通件103b为导电材料制成，优选为导电钢片，所述连通件103b的一端与接触部1042接触，另一端用于通过活动件103a向外暴露。
例如，在墨盒10尚未被安装至预定位置时，连通件103b缩回至活动件103a内部，这样，连通件103b可被保护，以防止外部部件对其造成损坏，在墨盒10向着预定位置安装的过程中，活动件103a被向着壳体101的方向压迫，迫推件106发生弹性变形，连通件103b逐渐伸出，当墨盒10到达预定位置时，连通件103b完成与触针的接触，当墨盒10脱离预定位置时，迫推件106释放弹力，使得连通件103b回到缩回活动件103a内部的状态；还可以是，适配器1031整体可活动，在墨盒10尚未被安装至预定位置时，适配器1031不与接触部1042接触，随着墨盒10向着预定位置运动，适配器1031被向着壳体101的方向压迫，连通件103b逐渐开始与接触部1042接触，当墨盒10到达预定位置时，连通件103b完成与触针和接触部1042的接触，当墨盒10脱离预定位置时，迫推件106释放弹力，使得适配器1031回到不与接触部1042接触的状态；还例如，在墨盒10尚未安装至预定位置时，一部分连通件103b被设置成与接触部1042接触，另一部分连通件103b被设置成不与接触部1042接触，随着墨盒10向着预定位置安装，所述另一部分连通件103b逐渐向着靠近接触部1042的方向运动，迫推件106发生弹性变形，当墨盒10到达预定位置时，连通件103b完成与接触部1042和触针 的接触，当墨盒10脱离预定位置时，迫推件106释放弹力，连通件103b再次回到一部分与接触部1042接触，另一部分不与接触部1042接触的状态。
所述活动件103a/适配器1031的运动方式可以是滑动，也可以是摆动，只要能够实现活动件103a/适配器1031的上述运动过程即可。
在活动件103a/适配器1031被设置成可活动的情况下，芯片104的接触部1042的排布方式将不再被限制，如图8A所示，沿y方向，位于多个接触部中的最外侧两个接触部的接触点C在经过y方向和d方向的平面/表面的投影点在直线D的投影点分别为A和B，线段AB的中心线L8和中心线L1重合，也就是说，此时的接触部1042/接触点C被设置成沿y方向对称，但用于连通接触部1042和触针的连通件103b将可根据触针的排布改变，如图8B所示，连通件103b与触针的接触点为C1，沿y方向，位于最外侧的两个接触点C1在包括y方向和d方向的平面/表面的投影点在直线D的投影点分别为F和G，线段FG的中心线L4与中心线L1不重合，此时的接触点C1被设置成沿y方向不对称，同样的，本实施例涉及的芯片组件103仍然具有实施例一的有益效果。
由于芯片104的多个接触部1042被设置成沿y方向对称，因而，芯片104可继续沿用现有芯片，墨盒生产厂商可根据成像设备中触针的排布情况选择对应的适配器1031，不仅有利于降低墨盒的成本，还可使得芯片具有更好的通用性；反过来，当具有在y方向不对称设置的接触部1042的芯片104的数量较多时，同样也可以通过安装该适配器，使得这些芯片104能够适用触针在y方向对称设置的成像设备。
如图8A和图8B所示，经过出墨部102的中心线L5不与中心线L8重合，同样可使得沿y方向远离中心线L5的接触部1042/1043或接触点C不容易被出墨部102泄漏的墨水污染；进一步的，中心线L5也不与中心线L4重合，同样可使得沿y方向远离中心线L5的连通件103b或接触点C1不容易被出墨部102泄漏的墨水污染。
由此可见，所述适配器1031具有与芯片接触部(芯片组件的接触部)1042接触的第一端，以及与触针接触的第二端，在所述第一端和第二端均设置有多个适配器接触部，其中，位于第一端的适配器接触部和位于第二端的适配器接触部之一被设置为沿y方向对称，另一端的适配器接触部被设置为沿y方向不对称；进一步的，根据芯片104的设计需求和/或触针的排布情况，所述第一端的适配器接触部和位于第二端的适配器接触部也可均被设置成为沿y方向不对称；更进一步的，适配器1031和迫推件106均可脱离墨盒10而成为一个独立的部件，在安装墨盒10之前，先将适配器1031安装至成像设备，当墨盒10中的墨水被消耗完后，用户只需要对墨盒10进行更换即可，而适配器1031和迫推件106可被继续使用。
图9是本发明实施例四涉及的芯片组件中的又一种芯片的侧视图。
图9所示的芯片104中，多个接触部1042/接触点C被设置成沿d方向呈一条直线排布，此时，沿y方向，所述多个接触部1042/接触点C仍然对称设置，同样的，适配器1031也能够适用于该芯片104。
上述实施例描述了芯片104为一个整体的情形，其中的接触部1042的数量至少为三个， 例如，芯片104包括第一接触部(第一端子)、至少一个第二接触部(第二端子)，第一接触部用于检测其与第二接触部之间是否存在短路，进一步的，芯片104还包括至少一个第三接触部(第三端子)，所述至少一个第二接触部所处的区域(Q2)位于与第一接触部所处的区域(Q1)不同，沿y方向，第二接触部更靠近第三接触部。
当接触部1042的数量被设置为三个时，所述三个接触部1042分别为数据端子、时钟端子和接地端子；当接触部1042的数量被设置为五个时，如图8A所示，所述五个接触部1042分别为第一端子10421(数据端子cpd)、第二端子10422(时钟端子cpc)、第三端子10423(复位端子cpr)、第四端子10424(电源端子cpvd)和第五端子10425(接地端子cpvs)，当然，接触部1042的数量还可以设置的更多，例如设置为七个、九个等，各个接触部1042的功能可根据设计需求进行设置。
实际使用中，墨盒10并不是处在这真空环境，尤其是长期不用的墨盒10，将不可避免的有较多灰尘或杂质粘附在芯片104表面，另外，从出墨部102泄漏的墨水也会在液体的表面张力作用下粘附在芯片104表面，这些问题都可能导致芯片104发生短路而损毁，为此，本申请人进一步提出下文所述实施例的解决方案。
实施例五
图10是本发明涉及的成像材料盒与其所适用的一种成像设备中成像材料盒容纳部相互分离的状态图；图11是本发明实施例五涉及的芯片组件与成像材料盒的壳体分离后的状态图；图12是本发明实施例五涉及的芯片组件中部分部件的立体图；图13是安装有本发明实施例五涉及的芯片组件的成像材料盒被安装至成像设备后，沿y方向观察的侧视图；图14是沿与y方向垂直，并经过一个接触部与对应触针的接触位置的平面对图13的成像材料盒以及成像设备剖切后的剖视图。
下文中仍以成像材料盒为墨盒为例进行描述，在对本实施例中的墨盒10进行描述前，先对墨盒10所适用的成像设备中的墨盒容纳部20进行描述。
同上述实施例的，以墨盒10被安装至成像设备时的姿态为准定义墨盒10具有图10所示的x方向、y方向和z方向，同时，为便于理解，设定墨盒容纳部20具有与墨盒10相同的方位，图10的左侧示出了墨盒容纳部20的方位，右侧示出了墨盒10的方位。
墨盒容纳部20包括框体、设置在框体上的触针机构9和设备侧电路板25，在触针机构9与设备侧电路板25之间形成有向着+z方向敞口的插槽26，电路板25表面设置有多个设备侧端子251，框体的一个侧板21设置有设备侧限制元件23，该设备侧限制元件23设置有用于限制墨盒10的设备侧限制部232，如图所示，设备侧限制部232为从侧板21突出的台阶体。触针机构9包括主体92以及设置在主体92的触针组件90，每个墨盒对应一个触针组件90，每个触针组件90具有沿y方向间隔排布的多个触针91，所述触针91的数量与芯片接触部1042、设备侧端子251的数量均相同，每个触针91的结构相同，为更清楚的展示触针91的结构，图10示出了其中一个触针的立体图。
触针91包括外接触件911、内接触件913和连接外接触件和内接触件的连接件912，触 针91整体由导电材料制成，外接触件911用于与芯片组件103电连接，内接触件912用于与设备侧端子251电连接，连接件912与主体92的形状匹配，常见的，连接件912被设置成如图所示的“几”字形，包括沿z方向延伸的第一连接部912a、沿x方向延伸的第二连接部912b以及沿z方向延伸的第三连接部912c，第一连接部912a和第三连接部912c在x方向间隔设置，且第一连接部912a还与外接触件911连接，第三连接部912c还与内接触件913连接，当触针91与主体92结合后，外接触件911和第一连接部912a面向-x方向而可与墨盒10相对，内接触件913和第三连接部912c位于插槽26内并面向+x方向而与电路板25相对；在墨盒10被安装至墨盒容纳部20前，外接触件911的至少一部分伸出主体92外部，内接触件913与设备侧端子251抵接，此时，内接触件913和第三连接部912c一起以第二连接部912b和第三连接部912c的连接处为旋转点向着主体92内部缩进；当墨盒10被安装至墨盒容纳部20的预定位置后，外接触件911与第一连接部912a一起以第一连接部912a和第一连接部912a的连接处为旋转点向着主体92内部缩进，外接触件911与芯片组件103抵接，优选的，沿z方向，外接触件911和内接触件912错位布置，这样，当外接触件911也向着主体92内部缩进时，外接触件911和内接触件913可不产生干涉，主体92的内部空间可被充分利用，主体92的整体尺寸可被缩小。
外接触件911/内接触件913被设置为具有锥形尖端91a/913a以及与锥形尖端相邻设置的侧面91b/913b，其中，侧面91b连接锥形尖端91a和第一连接部912a，侧面913b连接锥形尖端913a和第三连接部913a。
本实施例中的墨盒10沿z方向被安装和拆卸/取出，墨盒10还包括位于前侧壁101a前方/+x方向的第一结合件11，当墨盒10被安装至墨盒容纳部20时，位于第一结合件11的结合面11a与设备侧限制部232抵接，因而，墨盒10在z方向的运动被限制而实现定位。
如图11所示，与实施例二类似的，本实施例中的芯片组件103包括分体形成的芯片104和导体107，导体107用于将至少一个接触部1042引出并与触针机构9和设备侧端子251至少之一接触，也就是说，设置在芯片104中的多个接触部中的至少一个不与触针机构9直接接触，这样，多个接触部在基板1041的位置可不必被限制在同一个表面，从而降低芯片104发生短路的风险；当接触部1042设置为上述的五个时，电源端子10424和接地端子10425中的至少一个可被导体107引出并与触针机构9和设备侧端子251至少之一接触，优选的，接地端子10425被导体107引出并与触针机构9和设备侧端子251至少之一接触。
同样与实施例二类似的，本实施例中，多个接触部1042被分成设置在基板1041一侧/第一侧的第一组接触部1045和设置在基板1041另一侧/第二侧的第二组接触部1046，下文以第二组接触部1046仅设置一个反面接触部1043为例，该反面接触部1043在基板1041另一侧/第二侧的位置不必限制，例如，当沿x方向观察时，反面接触部1043可以位于上述第一区域Q1内，也可以位于上述第二区域Q2内，因为第一组接触部1045和第二组接触部1046分别位于基板1041的两侧，所以无论反面接触部1043被设置在基板另一侧的哪个位置，均可降低芯片104发生短路的风险。
导体107用于将反面接触部1043引出并与对应的触针91接触，如图所示，导体107包括相互电连接的第一导电件1071和第二导电件1072，二者可一体形成，也可以分体形成，第二导电件1072位于基板1041的前方，沿x方向，第二导电件1072与基板1041相互间隔，二者之间将形成结合空间S，第一导电件1071的一端与反面接触部1043接触，另一端与第二导电件1072接触，这样，反面接触部1043相当于被设置在第二导电件1072上，优选的，该反面接触部1043为接地端子，并被设置在第一区域Q1；进一步的，芯片组件103还包括用于支撑第二导电件1072的支撑件1032，第二导电件1072的末端10721从支撑件1032突出；更进一步的，反面接触部1043也可以与正面接触部1042设置在基板的同一侧，只要导体107能够将该反面接触部1043引出并与触针结构9和设备侧端子251至少之一接触即可。
当墨盒10被安装时，触针机构9的主体92进入结合空间S，外接触件911与接触部的第一组接触部1045抵接，支撑件1032带着第二导电件1072进入插槽26，第二导电件1072与内接触件913和设备侧端子251至少之一接触。如图14所示，支撑件1032插入内接触件913与设备侧端子251之间，此时，支撑件1032/第二导电件1072与内接触件913的锥形尖端913a抵接，内接触件913与第三连接部912c一起向着主体92内缩进，同时，第二导电件1072与设备侧端子251接触，最后，芯片104的多个接触部1042与设备侧端子251直接或间接实现电连接，第一组接触部1045通过触针91与设备侧端子251电连接，第二组接触部1046则通过导体107与设备侧端子251电连接。
进一步的，当墨盒10到达预定位置时，外接触件911和内接触件912均向着主体91内侧缩进，沿x方向，外接触件911将向墨盒10施加一个向着-x方向的力，内接触件912将向墨盒10施加一个向着+x方向的力，这两个方向相反的力将使得墨盒10能够更稳定的定位在墨盒容纳部20中；同时，芯片104的多个接触部不再被设置在基板1041的同一个表面，芯片104短路的风险可被有效降低。
作为本实施例的一种变形方式，支撑件1032还可以整体由导电材料制成，此时，支撑件1032整体为第二导电件1072，同样的，当墨盒10被安装后，第二导电件1072与设备侧端子251电连接。
作为本实施例的另一种变形方式的，第二导电件1072还可以通过触针91的外接触件911以外的部件接触，进而实现第二导电件1072与设备侧端子251电连接，例如，当墨盒10被安装至预定位置时，第二导电件1072不进入内接触件913与设备侧端子251之间，而是到达锥形尖端913a的上方/+z方向，此时，第二导电件1072可以与内接触件的侧面913b、第三连接部912c和第二连接部912b中的至少任意一个接触，由于内接触件的锥形尖端913a仍然与设备侧端子251保持接触，因而，第二导电件1072能够与设备侧端子251形成电连接。
更进一步的，当芯片104的所有接触部1042均通过导体107引出而不与外接触件911接触时，也就是说，芯片104的所有接触部1042均通过导体107进入插槽26，并与内接触件911、第二连接部912b、第三连接部912c、设备侧端子251中的至少一个接触，由于出墨口102仍然位于主体92面向墨盒的一侧，沿x方向，各个第二导电件1072与内接触件911、 第二连接部912b、第三连接部912c、设备侧端子251中的至少一个的接触位置与出墨部102被主体92隔开，同样有利于降低芯片104短路的风险；根据该变形方式，多个接触部1042不必被限定是否设置在同一个表面上，也就是说，所有接触部1042可被设置在同一个表面上，至少有一个接触部通过导体107被引出，且导体107不与外接触件911接触，而是与外接触件911以外的部件接触。
实施例六
图15是安装有本发明实施例六涉及的芯片组件的成像材料盒的立体图。
与实施例五不同的是，本实施例中的芯片104被设置成类似实施例五的结构，即芯片104包括多个分体部件结合而成，如图所示，本实施例中的芯片104包括第一子芯片104a和第二子芯片104b，与实施例五相同的，所述第一子芯片104a和第二子芯片104b既可以是两个相互独立的芯片，也可以是可建立通信连接的两个部件，二者既可以共用一个存储器1044，也可以分别具有存储器。
如图15所示，第一子芯片104a包括第一子基板1041a和设置在第一子基板1041a的至少一个第一子接触部1042a，第二子芯片104b包括第二子基板1041b以及设置在第二子基板1041b的第二子接触部1042b，沿x方向，第一子基板1041a和第二子基板1041b之间形成结合空间S，导电件1072与第二子接触部1042a连接，当墨盒10被安装至预定位置时，导电件1072与设备侧端子251、内接触件的侧面913b、第三连接部912c和第二连接部912b中的至少任意一个接触，第一子接触部1042a与其对应的触针外接触件911接触。
本实施例中的芯片组件103仍然具有实施例五的有益效果，在此不再赘述。
实施例七
对于实施例五和实施例六所述的墨盒10而言，由于墨盒的一部分(支撑件1032/第二导电件1072)需要进入到插槽26中，当墨盒10需要被取出时，支撑件1032所在侧(墨盒的+x方向侧)将受到向着-z方向的较大摩擦力，进而导致墨盒10呈倾斜状，可参考图13，此时，墨盒10的-x方向侧将向上翘起，或者说，以上侧壁101c为参考，沿z方向，上侧壁101c的-x方向末端将高于上侧壁101c的+x方向末端，当墨盒10继续被向着+z方向拉起时，第一结合件11以下(-z方向)的部位可能与设备侧限制部232接触，从而产生墨盒10被卡住而无法取出，或者取出不顺利的问题。
为此，本发明涉及的墨盒10还包括设置在第一结合面11a下方(-z方向)侧的避让面10i，一方面，避让面10i用于防止墨盒10与设备侧限制部232干涉，另一方面，在墨盒10与设备侧限制部232发生干涉时对墨盒10进行引导，使得墨盒10可顺利的取出。
优选的，避让面10i被设置成相对于z方向倾斜，具体的，在图13所示的墨盒10处于预定位置的姿态时，避让面10i面向+z方向和+x方向，所述避让面10i可以被设置在芯片组件中用于对芯片基板进行定位的定位板105、壳体101的侧壁或第一结合件11中的至少任意一个上。
实施例八
图16是本发明实施例八涉及的芯片组件的立体图；图17是本发明实施例八涉及的芯片组件中的芯片与导体分离后的立体图；图18A是本发明实施例八涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图；图18B是对图18A所示芯片组件进一步解释的示意图；图18C是图18A中反面接触部的位置做出第一种变形后，沿与芯片基板垂直的方向观察的侧视图。
与上述实施例二类似的，本实施例涉及的芯片组件103包括芯片104和导体107，所述芯片104包括基板1041以及设置在基板1041上的多个接触部1042，沿与y方向和d方向均垂直的方向，基板1041具有相对的第一侧1048和第二侧1049，当芯片104/芯片组件103随着墨盒100被安装至成像设备的预定位置时，第一侧1048与触针91相对，多个接触部1042中的第一组接触部1045设置在第一侧1048，多个接触部1042中的第二组接触部1046设置在第二侧1049，其中，第一组接触部1045包括一个或多个接触部1042，第二组接触部1046包括一个或多个接触部1042，为便于说明，第一组接触部1045中的一个或多个接触部1042也被称为正面接触部，第二组接触部1046中的一个或多个接触部1042也被称为反面接触部1043。
当安装有该芯片组件103的成像材料盒10被安装至成像设备后，正面接触部1042直接与触针91接触，反面接触部1043通过导体107与触针91接触；在芯片组件103中，导体107与反面接触部1043接触，除此之外，芯片104的其他部位与导体107的其他部位是否相互结合在此不做限定，当芯片104的其他部位与导体107的其他部位需相互结合时，二者的结合方式多种多样，在此不应被限定，例如，导体107与芯片104通过卡接的方式结合，或者通过焊接的方式结合，或者通过粘接的方式结合，或者通过芯片104被导体107夹持的方式结合等。
继续如图16和图17所示，导体107包括相互电连接的正面导电件1074和反面导电件1075，其中，正面导电件1074用于与触针91接触，反面导电件1075用于与反面接触部1043接触，这样，反面接触部1043与触针91可形成电连接，所述正面导电件1074和反面导电件1075优选由导电件一体形成，例如，将金属片按照设计要求折弯形成，可选的，正面导电件1074和反面导电件1075还可以为两个独立的导电部件，二者之间通过导电材料电连接。
进一步地，导体107还包括设置在反面导电件1075的抵接部1076，所述抵接部1076用于与反面接触部1043接触，可实现的，抵接部1076与反面接触部1043可以形成点接触/线接触/面接触中的任意一种，当二者之间形成线接触或面接触时，可以以接触线或接触面的中心为接触点，当二者之间形成多个点接触和多个线接触和多个面接触其中之一时，可以以所述多个点接触和多个线接触和多个面接触其中之一确定接触点，也可以以所述多个点接触所形成的面积/空间和多个线接触所形成的面积/空间和多个面接触所形成的面积/空间之一确定接触点。
可实现的，芯片组件103可以通过卡接、粘接、铆接、焊接等方式被固定安装在壳体101 上，如图所示，基板1041上设置基板结合槽1047，导体107上设置导体结合槽1073，相应的，壳体101或定位板105设置与结合槽1047/1073结合的结合柱1051(如图23所示)。
本实施例中，多个接触部1042分别被设置在基板的第一侧1048和第二侧1049，这样，设置在第二侧1049的接触部能够得到更全面的保护，另外，原本设置多个接触部1042的第一侧1048的表面积可减小，相应的，基板1041在包括d方向和y方向的平面/表面投影面积减小，也就是说，芯片104的整体尺寸得到减小，虽然，包括有该芯片104的芯片组件103还需要设置导体107，但所述导体107可根据触针91的位置和大小进行设置，整体上，芯片组件103仍然可被朝着小尺寸的方向控制，进一步地，导体107采用柔性材质时，芯片组件103的整体尺寸可变的更小。
一般的，芯片104还需设置所述存储器1044，基于本发明的发明构思，存储器1044可以与反面接触部1043一起设置在第二侧1049，这样，第二侧1049的表面积可被充分利用，在一些实施方式中，存储器1044还可以与正面接触部1042一起设置在第一侧1048，而所述第一侧1048将面向触针91，第二侧1049将面向壳体101，通过这样的设置，存储器1044不必从第二侧1049突出，在与d方向和y方向垂直的方向(芯片104的厚度方向)上，芯片104从基板1041朝向壳体101的尺寸可减小，相应的，壳体101上用于容纳芯片104/芯片组件103的空间可减小，尤其是当导体107采用薄型材质(如片状导电材料)制成时，即使反面导电件1075的至少一部分与第二侧1049相对，芯片组件103在所述厚度方向上从基板1041朝向壳体101的尺寸仍然可减小。
为提升或改善芯片104的整体性能，已有在芯片104中设置为芯片的电路板直接供电的电源的方式，一般的，采用电池作为电源，当将部分接触部设置在基板第二侧1049时，电池还可以设置在第一侧1048，这样，在所述厚度方向上，芯片104/芯片组件103从基板1041向着壳体101的尺寸也能减小，同时，该设计还有利于实现电池的快速安装和拆卸。
当接触部1042设置为五个时，如上所述，所述五个接触部1042分别为第一端子10421(数据端子cpd)、第二端子10422(时钟端子cpc)、第三端子10423(复位端子cpr)、第四端子10424(电源端子cpvd)和第五端子10425(接地端子cpvs)，在一些实施方式中，第一端子10421(数据端子cpd)、第二端子10422(时钟端子cpc)、第三端子10423(复位端子cpr)和第四端子10424(电源端子cpvd)形成第一组接触部1045，第五端子10425(接地端子cpvs)形成为第二组接触部1046，所述第五端子10425(接地端子cpvs)被设置在第二侧1049而成为反面接触部1043，所述反面接触部1043在第二侧1049的位置有多种，下面以沿着所述厚度方向观察进行说明。
在图18A中，触针91与各个正面接触部1042形成接触点C，触针91与导体107/正面导电件1074形成接触点C1，反面导电件1075与反面接触部1043也形成接触点C，具体的，触针91与第一端子10421形成的接触点为Cd，触针91与第二端子10422形成的接触点为Cc，触针91与第三端子10423形成的接触点为Cr，触针91与第四端子10424形成的接触点为Cvd，导体107与第五端子10425形成的接触点为Cvs，所述接触点Cd、接触点Cc、接触点Cr、接 触点Cvd和接触点Cvs在包括y方向和d方向的平面的投影点在与y方向平行的直线D上各自形成的投影点(最终投影点)位置不同，其中，沿y方向，接触点Cc的最终投影点和接触点Cvs的最终投影点分别位于所有接触点的最外侧，接触点Cr的最终投影点位于所有接触点的最终投影点的中间；形成在基板1041上的接触点可被统称为接触点C，形成在导体107上的接触点可被统称为接触点C2。
沿y方向，在第一组接触部1045中，接触点Cc位于其他三个接触点的-y侧，接触点Cd位于其他三个接触点的+y侧，接触点Cvs位于接触点Cd的+y侧，因而，在位于基板1041的所有接触点中，沿y方向，接触点Cc和接触点Cvs分别位于所有(五个)接触点的最外侧，，所述接触点Cc和接触点Cvs在包括y方向和d方向的平面/表面的投影点在与y方向平行的直线D的投影点分别为E和B，线段EB的中心线为L3a，沿y方向，基板1041在中心线L3a的-y方向形成第三区域Q3a，在中心线L3a的+y方向形成第四区域Q4a，所述接触点Cvd、接触点Cc和接触点Cr位于第三区域Q3a，接触点Cd和接触点Cvs位于第四区域Q4a，也就是说，中心线L3a两侧的接触点数量/触针数量不同，该设计有利于降低芯片短路的风险。
如图18B所示，反面接触部1043处于隐藏在基板1041另一侧而不会被观察到，仅正面接触部1042能够被观察到，具体的，第一端子10421(数据端子cpd)、第二端子10422(时钟端子cpc)、第三端子10423(复位端子cpr)和第四端子10424(电源端子cpvd)可被观察到，在仅考虑所述位于基板第一侧1048上的四个端子的情况下，沿y方向，接触点Cc和接触点Cd分别位于所有(四个)接触点的最外侧，此时，所述接触点Cc和接触点Cd在包括y方向和d方向的平面/表面的投影点在与y方向平行的直线D的投影点分别为E和B，线段EB的中心线为L3b，沿y方向，基板1041在中心线L3b的-y方向形成第三区域Q3b，在中心线L3b的+y方向形成第四区域Q4b，所述接触点Cvd和接触点Cc位于第三区域Q3b，接触点Cd和接触点Cr位于第四区域Q4b，也就是说，中心线L3b两侧的接触点/触针数量相同，这样，接触部在与触针91接触时，中心线L3b两侧的受力均衡，有利于确保正面接触部与触针91形成稳定的电接触。
在图18B的变形实施方式中，中心线L3b两侧的接触点/触针还可以对称设置，如图18B所示，接触点Cr和接触点Cvd在包括y方向和d方向的平面/表面的投影点在与y方向平行的直线D的投影点分别为M和N，其中，投影点M和投影点B位于中心线L3b的+y侧，投影点N和投影点E位于中心线L3b的-y侧，所述投影点M和投影点N关于中心线L3b对称，投影点N和投影点E关于中心线L3b对称，对于芯片104来说，接触部/接触点的此种布置更有利于维持中心线L3b两侧的受力平衡。
如图18C所示，在第一种变形方式中，沿y方向，接触点Cvs更加靠近接触点Cd设置，此时，在位于基板1041的所有(五个)接触点中，沿y方向，接触点Cc和接触点Cvs仍然分别位于所有(五个)接触点的最外侧，所述接触点Cc和接触点Cvs在包括y方向和d方向的平面/表面的投影点在与y方向平行的直线D的投影点分别为E和B，线段EB的中心线为L3c，沿y方向，基板1041在中心线L3b的-y方向形成第三区域Q3c，在中心线L3c的+y方 向形成第四区域Q4c，与图18A所示结构不同的是，本变形方式中，中心线L3c经过接触点Cr，接触点Cvd和接触点Cc位于第三区域Q3c，接触点Cd和接触点Cvs位于第四区域Q4c，可见，本变形方式中，中心线L3c两侧的接触点数量相同，由于接触点Cvs更加靠近接触点Cd，沿y方向，基板1041的尺寸将变得更小。
同图18B的变形方式的，在图18C的变形方式中，中心线L3c两侧的接触点还可以对称设置，此种设计同样也能减小基板1041在y方向的尺寸。
实施例九
图19是本发明实施例九涉及的芯片组件被分解后的立体图。
在实施例八的基础上，本实施例中的芯片组件103还包括用于与导体107抵接的迫推件106，当芯片组件103被安装至壳体101，或者当导体107与芯片104结合时，迫推件106将反面导电件1075向着反面接触部1043迫推，使得抵接部1076与反面接触部1043的接触更稳定。
具体的，迫推件106设置为弹性件，例如，迫推件106为一端与导体107抵接，另一端与壳体101/定位板105抵接的海绵/压缩弹簧等，在一些实施方式中，迫推件106还可以通过向芯片104和/或导体107施加磁性吸引力而迫使二者形成稳定接触，例如，当导体107由金属片制成时，在基板104上安装磁性件，随着导体107与芯片104结合，磁性件将导体107吸附在预定位置，或者在基板104和导体107同时安装磁性件。
在另一些实施方式中，迫推件106还可以通过向导体107施加磁性排斥力而迫使芯片104和导体107形成稳定接触，例如，当导体107由金属片制成时，在壳体101/定位板105安装磁性件，随着导体107与芯片104结合，或者随着芯片组件103被安装，磁性件将导体107向着芯片104迫推。
实施例十
图20是本发明实施例十涉及的芯片组件被分解后的立体图；图21是从本发明实施例十涉及的芯片组件的反面观察时的立体图；图22A是本发明实施例十涉及的芯片组件被安装至成像材料盒后，沿与芯片基板垂直的方向观察的侧视图；图22B是图22A中反面接触部的位置做出变形后，沿与芯片基板垂直的方向观察的侧视图。
当反面接触部1043与存储器1044一起设置在第二侧1049时，与图16和图17所示的芯片组件相比，本实施例中的反面接触部1043位于存储器1044的-y侧，同样的，反面接触部1043的设置位置也有多种变化，下面结合图22A和图22B进行描述。
如图22A所示，沿y方向，在位于基板1041的所有(五个)接触点中，接触点Cc和接触点Cd分别位于所有(五个)接触点的最外侧，接触点Cvs位于接触点Cc和接触点Cd之间，所述接触点Cc和接触点Cd在包括y方向和d方向的平面/表面的投影点在与y方向平行的直线D的投影点分别为E和B，线段EB的中心线为L3d，沿y方向，基板1041在中心线L3d的-y方向形成第三区域Q3d，在中心线L3d的+y方向形成第四区域Q4d。
在图22A中，在不考虑反面接触部1043时，接触点Cc和接触点Cvd位于第三区域Q3c，接触点Cr和接触点Cd位于第四区域Q4c，也就是说，中心线L3d两侧的受力均衡，有利于确保正面接触部与触针91形成稳定的电接触；在考虑反面接触部1043时，接触点Cc、接触点Cvd和接触点Cvs位于第三区域Q3c，接触点Cr和接触点Cd位于第四区域Q4c，中心线L3d两侧的接触点数量/触针数量不同，有利于降低芯片短路的风险，同时，沿y方向位于接触点Cc和接触点Cd之间的接触点Cvs不会对中心线L3d两侧的受力造成影响，因而，在该实施方式中，无论是否考虑反面接触部1043，中心线L3d两侧的受力均可保持平衡，芯片104与触针91能够形成稳定的电接触。
如图22B所示，在反面接触部的位置做出另一种变形后，沿y方向，接触点Cvs在图22A的基础上继续向着-y方向移动，并到达接触点Cc的-y侧，因而，接触点Cvs和接触点Cd分别位于所有(五个)接触点在y方向的最外侧，所述接触点Cvs和接触点Cd在包括y方向和d方向的平面/表面的投影点在与y方向平行的直线D的投影点分别为E和B，线段EB的中心线为L3e，沿y方向，基板1041在中心线L3e的-y方向形成第三区域Q3e，在中心线L3e的+y方向形成第四区域Q4e；本实施例中，接触点Cvd的最终投影点位于所有接触点的最终投影点的中间，中心线L3e经过接触点Cvd。
与图22A相比，图22B中的正面接触部的位置并没有改变，因而，在不考虑反面接触部1043的情况下，图22B中正面接触部的受力情况与图22A相同，在此不再赘述。
在图22B中，当考虑反面接触部1043时，接触点Cvs和接触点Cc位于第三区域Q3e，接触点Cr和接触点Cd位于第四区域Q4e，同图18C所示的，中心线L3e两侧的接触点数量相同，沿y方向，基板1041的尺寸将变得更小。
结合图18A、图18C、图22A和图22B可知，反面接触部1043可被设置在第二侧1049的不同位置，沿y方向，反面接触部1043在第二侧1049的位置可以从基板1041的+y方向侧向着-y方向侧变化，因而，反面接触部1043在第二侧1049可以具有不同的位置，所有接触部在y方向最外侧(即-y侧和+y侧)的两个接触点也不同，所述两个接触点形成的中心线也不同，图22A中反面接触部的位置可以看作是图18A中反面接触部的位置做出的第二种变形，图22B中反面接触部的位置可以看作是图18A中反面接触部的位置做出的第三种变形；在进一步的变形方式中，反面接触部1043还可以被设置为，至少一个反面接触部1043的最终投影点与至少一个正面接触部1042的最终投影点重合，当反面接触部1043设置为多个时，所述多个反面接触部中至少两个反面接触部的最终投影点重合。
无论中心线如何变化，设置在第二侧1049的反面接触部1043将能够获得以下有益效果：
1.当芯片104/芯片组件103被安装至壳体101时，反面接触部1043将面向壳体101，因而，反面接触部1043能够被更有效的保护。
2.上述实施例描述了将第五端子10425(接地端子cpvs)设置为反面接触部1043，实际中，所述第一端子10421(数据端子cpd)、第二端子10422(时钟端子cpc)、第三端子10423(复位端子cpr)、第四端子10424(电源端子cpvd)和第五端子10425(接地端子cpvs)中 的任意一个或多个均可被设置为反面接触部1043，因而，芯片104/芯片组件103可获得较高的设计自由度，所述接触部的排布设计自由度也得到提升。
3.所述多个接触部中，至少一个接触部被设置在第二侧1049而成为反面接触部，那么，原本还设置有该反面接触部的基板侧面面积可减小，整体上，整个芯片基板1041的尺寸也可减小，有利于实现芯片104小型化，从而实现芯片组件103的小型化和/或成像材料盒100的小型化。
4.在将至少一个接触部被设置在第二侧1049而成为反面接触部后，当芯片基板1041的尺寸不变时，该设计同样有利于实现成像材料盒100的小型化，实现方式例如是，利用第一侧1048中原本设置反面接触部的位置放置原本设置在第二侧1049的存储器1044，即将一个或多个接触部与存储器1044的位置互换，或者，将电池设置在第一侧1048，这样，整个芯片104从基板1041向着壳体101的方向突出的尺寸可被减小，相应的，壳体101中用于容纳芯片104/芯片组件103的空间可减小。
5.如4中所述的，当将电池设置在第一侧1048时，所述电池的更换和维护将变得更加简单和方便。
6.当所述中心线L3a/L3b/L3c/L3d/L3e两侧的接触点数量不同时，接触点的排布密度可降低，从而，有利于降低芯片短路的风险；当所述中心线L3a/L3b/L3c/L3d/L3e两侧的接触点数量相同时，中心线两侧的受力均衡，有利于确保正面接触部与触针91形成稳定的电接触。
其他说明
图23是安装有本发明涉及的芯片组件的第二种成像材料盒的立体图。
如上所述，本发明实施例所述的芯片104/芯片组件103所适用的成像材料盒100具有多种形式，所述成像材料盒100既可以是容纳碳粉的处理盒或粉筒，也可以是容纳墨水的墨盒。
图23是芯片104/芯片组件103适用的第二种墨盒100a的立体图，第二种墨盒100a也具有容纳墨水的壳体101和设置在壳体101上的出墨部102，沿x方向，壳体101具有面向+x方向的前侧壁101a和面向-x方向的后侧壁101b，下侧壁101d位于前侧壁101a和后侧壁101b之间，第一结合件11设置在前侧壁101a，第二结合件12设置在后侧壁101b，出墨部102设置在下侧壁101d，且相比于前侧壁101a，出墨部102更加靠近后侧壁101b，第一结合件11用于引导墨盒100a安装，在一些实施方式中，第一结合件11还用于将墨盒100限定在成像设备中，第二结合件12用于与成像设备结合而将墨盒100a限定在成像设备中。
进一步地，墨盒100a也具有上述倾斜侧壁101e，芯片104/芯片组件103被设置在倾斜侧壁101e，具体的，芯片104/芯片组件103被设置在位于倾斜侧壁101e的定位板105上。
进一步地，墨盒100a还包括相对于壳体101可活动的操作装置17，所述操作装置17包括锁定部17c和解锁部17a，沿x方向，相对于第二结合件12，锁定部17c更加靠近第一结合件11，因而，锁定部17c和第二结合件12可以分别从壳体101的+x方向侧和-x方向侧对墨盒100a进行限定，解锁部17a用于解除锁定部17c对墨盒100a的锁定。
沿x方向，芯片104/芯片组件103与锁定部17c相邻设置，这样，通过锁定部17c的锁定，芯片104/芯片组件103与触针91能够形成更加稳定的接触。
图24是安装有本发明涉及的芯片组件的第三种成像材料盒的立体图。
图24中所示的第三种成像材料盒是墨盒100b，与墨盒100a不同的是，在墨盒100b中，沿x方向，相比于后侧壁101b，出墨部102更加靠近前侧壁101a，且设置在前侧壁101a的第一结合件11相对于壳体101可活动/摆动，所述第一结合件11设置有卡合突起11a，墨盒100b通过卡合突起11a被限定在成像设备中，并通过第一结合件11相对于壳体101的变形运动/摆动运动而解除卡合突起11a对墨盒100b的限定。
如上所述，本发明涉及的芯片中的多个接触部的至少一个被设置在芯片基板1041的第二侧1049，同时，设置在第二侧1049的接触部通过芯片104外部的导体107与触针接触，该结构设计不仅有利于提升接触部的排布设计自由度，还有利于实现芯片104的小型化，进而，包括该芯片104的芯片组件103、安装有该芯片104或芯片组件103的成像材料盒100/100a/100b的小型化也变得容易实现。

Claims (44)

  1. 芯片，用于随着成像材料盒可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接。
  2. 芯片，用于随着成像材料盒可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接；
    所述中心线L2为所有接触部均设置在基板的同一侧时所产生。
  3. 芯片，用于随着成像材料盒可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    位于y方向最外侧的两个触针在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接。
  4. 根据权利要求1-3中任意一项权利要求所述的芯片，其特征在于，正面接触部的数量与第一区域Q1内的触针数量相同，反面接触部的数量与第二区域Q2内的触针数量相同。
  5. 根据权利要求4所述的芯片，其特征在于，正面接触部的数量大于反面接触部的数量。
  6. 根据权利要求1-3中任意一项权利要求所述的芯片，其特征在于，正面接触部与触针形成的接触点以及反面接触部与导体形成的接触点在所述表面的投影点在直线D上各自形成投影点；
    沿y方向，在所有接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
  7. 根据权利要求1-3中任意一项权利要求所述的芯片，其特征在于，正面接触部与触针形成的接触点在所述表面的投影点在直线D上各自形成投影点；
    沿y方向，在正面接触部与触针形成的接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
  8. 根据权利要求7所述的芯片，其特征在于，沿y方向，位于直线D且分别位于中心线两侧的投影点对称设置。
  9. 芯片，用于随着成像材料盒可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在 第二侧的反面接触部，所述反面接触部包括接地端子；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接。
  10. 芯片，用于随着成像材料盒可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部，所述反面接触部包括接地端子；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接；
    所述中心线L2为所有接触部均设置在基板的同一侧时所产生。
  11. 芯片，用于随着成像材料盒可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    位于y方向最外侧的两个触针在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部，所述反面接触部包括接地端子；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接。
  12. 根据权利要求9-11中任意一项权利要求所述的芯片，其特征在于，正面接触部的数量与第一区域Q1内的触针数量相同，反面接触部的数量与第二区域Q2内的触针数量相同。
  13. 根据权利要求9-11中任意一项权利要求所述的芯片，其特征在于，多个接触部还包括数据端子、时钟端子、复位端子和电源端子，反面接触部还包括电源端子。
  14. 根据权利要求9-11中任意一项权利要求所述的芯片，其特征在于，正面接触部与触针形成的接触点以及反面接触部与导体形成的接触点在所述表面的投影点在与直线D上各自形成投影点；
    沿y方向，在所有接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
  15. 根据权利要求9-11中任意一项权利要求所述的芯片，其特征在于，正面接触部与触针形成的接触点在所述表面的投影点在直线D上各自形成投影点；
    沿y方向，在正面接触部与触针形成的接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
  16. 根据权利要求15所述的芯片，其特征在于，沿y方向，位于直线D且分别位于中心线两侧的投影点对称设置。
  17. 芯片组件，其特征在于，所述芯片组件包括如权利要求1-16中任意一项权利要求所述的芯片以及与芯片中的反面接触部接触的导体，芯片与导体分体形成。
  18. 根据权利要求17所述的芯片组件，其特征在于，芯片组件还包括用于将导体向着反面接触部迫推的迫推件。
  19. 成像材料盒，可拆卸地安装至设置有多个触针的成像设备，成像材料盒包括容纳成像材料的壳体、设置在壳体上的成像材料排出部和芯片，成像材料排出部用于将成像材料从壳体排出；
    成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部；
    成像材料盒还包括导体；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过导体与第二区域Q2内的触针电连接；
    在正面接触部中，位于y方向最外侧的两个接触点在所述表面的投影点在直线D的投影 点的连线的中心线为L6，经过成像材料排出部的中心线为L5，L5与L6不重合。
  20. 成像材料盒，可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接；
    在正面接触部中，位于y方向最外侧的两个接触点在所述表面的投影点在直线D的投影点的连线的中心线为L6，经过成像材料排出部的中心线为L5，L5与L6不重合；
    所述中心线L2为所有接触部均设置在基板的同一侧时所产生。
  21. 成像材料盒，可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    位于y方向最外侧的两个触针在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接；
    在正面接触部中，位于y方向最外侧的两个接触点在所述表面的投影点在直线D的投影点的连线的中心线为L6，经过成像材料排出部的中心线为L5，L5与L6不重合。
  22. 根据权利要求19-21中任意一项权利要求所述的成像材料盒，其特征在于，壳体在y方向具有中心线L1，L1与L6不重合。
  23. 根据权利要求19-21中任意一项权利要求所述的成像材料盒，其特征在于，壳体设置有放置导体的安装槽。
  24. 根据权利要求19-21中任意一项权利要求所述的成像材料盒，其特征在于，正面接触部的数量与第一区域Q1内的触针数量相同，反面接触部的数量与第二区域Q2内的触针数量相同。
  25. 根据权利要求24所述的成像材料盒，其特征在于，正面接触部的数量大于反面接触部的数量。
  26. 根据权利要求19-21中任意一项权利要求所述的成像材料盒，其特征在于，正面接触部与触针形成的接触点以及反面接触部与导体形成的接触点在所述表面的投影点在直线D上各自形成投影点；
    沿y方向，在所有接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
  27. 根据权利要求19-21中任意一项权利要求所述的成像材料盒，其特征在于，正面接触部与触针形成的接触点在所述表面的投影点在直线D上各自形成投影点；
    沿y方向，在正面接触部与触针形成的接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
  28. 根据权利要求27所述的成像材料盒，其特征在于，沿y方向，位于直线D且分别位于中心线两侧的投影点对称设置。
  29. 根据权利要求19-21中任意一项权利要求所述的成像材料盒，其特征在于，壳体具有相对布置的前侧壁和后侧壁以及设置在前侧壁的第一结合件，第一结合件用于将成像材料盒限制在成像设备中，芯片被安装在前侧壁，所述第一结合件相对于壳体可活动。
  30. 根据权利要求19-21中任意一项权利要求所述的成像材料盒，其特征在于，d方向与z方向、x方向以非垂直的角度相交。
  31. 根据权利要求19-21中任意一项权利要求所述的成像材料盒，其特征在于，d方向与x方向相同。
  32. 根据权利要求19-21中任意一项权利要求所述的成像材料盒，其特征在于，d方向与z方向相同。
  33. 成像材料盒，可拆卸地安装至设置有多个触针的成像设备，成像材料盒包括容纳成像材料的壳体、设置在壳体上的成像材料排出部和芯片组件，成像材料排出部用于将成像材料从壳体排出；
    成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片组件包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点在包括y方向和d方向的表面的投影点在与y方向平行的 直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部，所述反面接触部包括接地端子；
    芯片组件还包括导体；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过导体与第二区域Q2内的触针电连接；
    在正面接触部中，位于y方向最外侧的两个接触点在所述表面的投影点在直线D的投影点的连线的中心线为L6，经过成像材料排出部的中心线为L5，L5与L6不重合。
  34. 成像材料盒，可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，位于y方向最外侧的两个接触部与对应触针的接触点在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部，所述反面接触部包括接地端子；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接；
    在正面接触部中，位于y方向最外侧的两个接触点在所述表面的投影点在直线D的投影点的连线的中心线为L6，经过成像材料排出部的中心线为L5，L5与L6不重合。
    所述中心线L2为所有接触部均设置在基板的同一侧时所产生。
  35. 成像材料盒，可拆卸地安装至设置有多个触针的成像设备，成像材料盒具有与重力方向平行的z方向，与z方向相交的x方向和y方向，其中，y方向为成像材料盒的宽度方向；
    芯片包括基板以及设置在基板上的多个接触部，所述接触部用于与触针电连接，基板上设置接触部的表面沿y方向和d方向延伸，所述d方向与y方向垂直；
    位于y方向最外侧的两个触针在包括y方向和d方向的表面的投影点在与y方向平行的直线D的投影点分别为N1和N2，线段N1N2的中心线为L2；
    沿与d方向平行的方向并经过基板最外侧的两个直线限定一个区域，沿y方向，所述区域被中心线L2分隔为相邻的第一区域Q1和第二区域Q2，第一区域Q1内的触针数量与第二 区域Q2内的触针数量不同；
    其特征在于，
    基板具有相对的第一侧和第二侧，多个接触部包括设置在第一侧的正面接触部和设置在第二侧的反面接触部，所述反面接触部包括接地端子；
    正面接触部用于与第一区域Q1内的触针电连接，反面接触部通过芯片外部的导体与第二区域Q2内的触针电连接；
    在正面接触部中，位于y方向最外侧的两个接触点在所述表面的投影点在直线D的投影点的连线的中心线为L6，经过成像材料排出部的中心线为L5，L5与L6不重合。。
  36. 根据权利要求33-35中任意一项权利要求所述的成像材料盒，其特征在于，正面接触部的数量与第一区域Q1内的触针数量相同，反面接触部的数量与第二区域Q2内的触针数量相同。
  37. 根据权利要求33-35中任意一项权利要求所述的成像材料盒，其特征在于，多个接触部还包括数据端子、时钟端子、复位端子和电源端子，反面接触部还包括电源端子。
  38. 根据权利要求33-35中任意一项权利要求所述的成像材料盒，其特征在于，正面接触部与触针形成的接触点以及反面接触部与导体形成的接触点在所述表面的投影点在与直线D上各自形成投影点；
    沿y方向，在所有接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
  39. 根据权利要求33-35中任意一项权利要求所述的成像材料盒，其特征在于，正面接触部与触针形成的接触点在所述表面的投影点在直线D上各自形成投影点；
    沿y方向，在正面接触部与触针形成的接触点中,最外侧的两个接触点在直线D上所对应的投影点的连线具有中心线，所述中心线两侧的接触点数量相同。
  40. 根据权利要求39所述的成像材料盒，其特征在于，沿y方向，位于直线D且分别位于中心线两侧的投影点对称设置。
  41. 根据权利要求33-35中任意一项权利要求所述的成像材料盒，其特征在于，壳体具有相对布置的前侧壁和后侧壁以及设置在前侧壁的第一结合件，第一结合件用于将成像材料盒限制在成像设备中，芯片组件被安装在前侧壁，所述第一结合件相对于壳体可活动。
  42. 根据权利要求33-35中任意一项权利要求所述的成像材料盒，其特征在于，d方向与z方向、x方向以非垂直的角度相交。
  43. 根据权利要求33-35中任意一项权利要求所述的成像材料盒，其特征在于，d方向与x方向相同。
  44. 根据权利要求33-35中任意一项权利要求所述的成像材料盒，其特征在于，d方向与z方向相同。
PCT/CN2023/114326 2022-08-22 2023-08-22 芯片、芯片组件和成像材料盒 WO2024041546A1 (zh)

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CN102896902A (zh) * 2011-07-28 2013-01-30 兄弟工业株式会社 液体盒和图像记录装置
JP2015044419A (ja) * 2014-11-10 2015-03-12 セイコーエプソン株式会社 印刷材カートリッジ、及び、アダプター
CN104985934A (zh) * 2010-09-03 2015-10-21 精工爱普生株式会社 印刷装置、印刷材料盒、印刷材料容纳体适配器以及电路基板
CN106808807A (zh) * 2015-11-27 2017-06-09 精工爱普生株式会社 液体供给单元
CN207790033U (zh) * 2017-12-21 2018-08-31 珠海纳思达企业管理有限公司 用于安装具有芯片的墨盒的安装部、芯片及墨盒

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CN101716854A (zh) * 2008-10-09 2010-06-02 精工爱普生株式会社 电路基板以及液体供应单元
CN104985934A (zh) * 2010-09-03 2015-10-21 精工爱普生株式会社 印刷装置、印刷材料盒、印刷材料容纳体适配器以及电路基板
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