WO2024040804A1 - 封装结构内的零件提取方法和研磨治具 - Google Patents

封装结构内的零件提取方法和研磨治具 Download PDF

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Publication number
WO2024040804A1
WO2024040804A1 PCT/CN2022/139047 CN2022139047W WO2024040804A1 WO 2024040804 A1 WO2024040804 A1 WO 2024040804A1 CN 2022139047 W CN2022139047 W CN 2022139047W WO 2024040804 A1 WO2024040804 A1 WO 2024040804A1
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Prior art keywords
adhesive
packaging structure
parts
package structure
packaging
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PCT/CN2022/139047
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English (en)
French (fr)
Inventor
毛柠
刘庆根
李卓
黄善玉
王卫新
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闻泰通讯股份有限公司
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Publication of WO2024040804A1 publication Critical patent/WO2024040804A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • B09B3/30—Destroying solid waste or transforming solid waste into something useful or harmless involving mechanical treatment
    • B09B3/35—Shredding, crushing or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass

Definitions

  • the present disclosure relates to a part extraction method and a grinding jig within a package structure.
  • the packaging structure is often used in a wide range of use environments because packaging materials are packaged on the outside of the component, so that it has extremely excellent performance.
  • the packaging material will affect the recycling of parts, thereby causing a waste of resources.
  • the packaging structure is encapsulated with packaging materials on the outside of the parts.
  • packaging materials will affect the recycling of the parts, resulting in a waste of resources.
  • a part extraction method and a grinding jig within a package structure are provided.
  • a method for extracting parts within a package structure including the following steps:
  • the step of grinding the package structure until parts are exposed includes: grinding the package structure until the circuit board is taken out; softening the adhesive, and taking out the parts.
  • the packaging structure put the packaging structure into the adhesive with the side of the packaging structure away from the circuit board facing up, and solidify the adhesive; grind the packaging structure again, until the parts are exposed.
  • the step of grinding the package structure until the circuit board is taken out includes: grinding the package structure until the welding points between the parts and the circuit board are exposed. , and the surface finish after grinding is not lower than the predetermined value.
  • the step of softening the adhesive and taking out the packaging structure includes: heating the adhesive to a molten state again; taking out the packaging structure; and removing the packaging structure.
  • the adhesive is adhered to the surface of the packaging structure.
  • the grinding jig is provided with a groove; the step of placing an adhesive in the grinding jig and softening the adhesive includes: The adhesive is placed in the groove; the adhesive is heated to a molten state.
  • the heating temperature for heating the adhesive to a molten state is 90°C ⁇ T1 ⁇ 110°C.
  • the grinding jig containing the adhesive is placed in a heating device to heat the adhesive to a molten state.
  • the packaging structure is placed into the adhesive with the circuit board-encapsulating side of the packaging structure facing upward, and the adhesive is cured.
  • the steps include: placing the packaging structure into the adhesive with a side of the packaging structure encapsulating the circuit board facing up; applying pressure to the packaging structure so that the side of the packaging structure encapsulating the circuit board is in contact with the side of the circuit board.
  • the surfaces of the grinding fixture are on the same horizontal plane.
  • the packaging structure is placed into the adhesive with the side of the packaging structure away from the circuit board facing upward, and the adhesive is placed
  • the step of curing includes: placing the side of the packaging structure encapsulated with the circuit board facing the adhesive and placing it into the adhesive; applying pressure to the packaging structure until the unencapsulated part of the packaging structure The side with the circuit board is on the same level as the surface of the grinding jig.
  • the step of grinding the packaging structure to expose the parts includes: grinding and removing the packaging material in the packaging structure until the surface of the part is exposed; polishing the surface of the part , until the identification information on the surface of the part is exposed.
  • the step of grinding the packaging structure until the parts are exposed further includes: removing residual packaging material on the edges of the parts.
  • residual packaging material on the edge of the part is removed by grinding or laser cutting.
  • the step of softening the adhesive and taking out the parts includes: heating the adhesive to a molten state again; taking out the parts; and using a glue remover. Remove the adhesive from the surface of the part.
  • a grinding jig used in the method of extracting parts from the packaging structure is used to accommodate the adhesive and the packaging structure.
  • At least one side surface of the grinding jig is provided with a groove, and the groove is used to accommodate the adhesive and the packaging structure.
  • Figure 1 is a schematic flowchart of a method for extracting parts within a package structure provided by one or more embodiments of the present disclosure
  • Figure 2 is a schematic flowchart of the steps of grinding the packaging structure until parts are exposed according to one or more embodiments of the present disclosure
  • Figure 3 is a schematic flowchart of the steps of placing adhesive in a grinding jig and softening the adhesive according to one or more embodiments of the present disclosure
  • FIG. 4 is a schematic flowchart of the steps of placing the packaging structure into the adhesive so that the circuit board-encapsulating side of the packaging structure faces upward and curing the adhesive according to one or more embodiments of the present disclosure
  • Figure 5 is a schematic flowchart of the steps from grinding the packaging structure to removing the circuit board provided by one or more embodiments of the present disclosure
  • Figure 6 is a schematic flowchart of the steps of placing the packaging structure into the adhesive with the side of the packaging structure facing away from the circuit board facing up and curing the adhesive provided by one or more embodiments of the present disclosure
  • Figure 7 is a schematic flowchart of the steps of grinding and removing packaging materials in the packaging structure to expose parts according to one or more embodiments of the present disclosure
  • Figure 8 is a schematic flowchart of the steps of softening the adhesive to remove parts provided by one or more embodiments of the present disclosure
  • Figure 9 is another schematic flowchart of a method for extracting parts within a package structure provided by one or more embodiments of the present disclosure.
  • Figure 10 is a schematic structural diagram of a grinding jig provided by one or more embodiments of the present disclosure.
  • first, second, etc. in the description and claims of the present disclosure are used to distinguish different objects, rather than to describe a specific order of objects.
  • first camera and the second camera are used to distinguish different cameras, rather than to describe a specific order of the cameras.
  • words such as “exemplary” or “for example” mean examples, illustrations or explanations. Any embodiment or design described as “exemplary” or “such as” in the present disclosure is not intended to be construed as preferred or advantageous over other embodiments or designs. To be precise, the use of words such as “exemplary” or “such as” is intended to present relevant concepts in a specific manner. In addition, in the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of "plurality" refers to both one or more than two.
  • Figure 1 is a schematic flow chart of a method for extracting parts within a package structure. The following describes a method for extracting parts 12 within a package structure 11 according to an embodiment of the present disclosure with reference to Figures 1 to 10, which includes the following steps:
  • the softened adhesive can have higher fusion performance, allowing the packaging structure 11 to be placed on the softened adhesive. , thereby enabling the processing of the packaging structure 11 to be realized.
  • the packaging structure 11 into the adhesive and make the side of the packaging structure 11 with the circuit board facing up, and cure the adhesive; in this way, put the side of the packaging structure 11 with the circuit board facing up, and It is convenient to subsequently extract the parts 12 of the packaging structure 11 .
  • the placement of the packaging structure 11 on the grinding jig 10 can be made more stable, so that the parts 12 on the packaging structure 11 can be easily extracted.
  • the packaging structure 11 is ground until the components 12 are exposed; it should be noted that the packaging layer on the packaging structure 11 is removed by grinding, so that the components 12 on the packaging structure 11 are exposed, thereby facilitating the removal of the components from the packaging structure.
  • the packaging structure 11 when taking out the parts 12 in the packaging structure 11, it is suitable to set the packaging structure 11 on the grinding jig 10 through adhesive and then grind the packaging structure 11, so that the packaging structure 11 is packaged on the grinding jig 10.
  • the structure on the outside of the component 12 needs to be suitable for removal, including the packaging material packaged on the outside of the component 12 and the circuit board provided on the outside of the component 12 , so that the component 12 in the packaging structure 11 can be removed to realize the recycling of the component 12 .
  • the package structure 11 is installed on the grinding jig 10 and ground so as to expose the parts so that the parts 12 from the package structure 11 can be taken out, thereby The components 12 on the packaging structure 11 are allowed to be recycled.
  • Figure 2 is a schematic flowchart of the steps of grinding the package structure until the parts are exposed.
  • the step of grinding the package structure 11 until the parts 12 are exposed includes: softening the adhesive and taking out the package structure 11 ; In this way, the adhesive can be reused.
  • a new packaging structure 11 can be placed to take out the parts 12, or it can also be used to take out the parts 12 on the other side of the packaging structure 11.
  • the packaging structure 11 into the adhesive with the side of the packaging structure 11 away from the circuit board facing up, and cure the adhesive; in this way, the parts 12 on the other side of the packaging structure 11 can be taken out , thereby improving the extraction efficiency of taking out the parts 12 in the packaging structure 11 .
  • the packaging material 13 in the packaging structure 11 is again ground and removed until the component 12 is exposed. It can be understood that, in the same manner as the above-mentioned grinding and removal of the circuit board, the packaging material 13 is removed by grinding and the component 12 is exposed, so that the components can be easily removed. 12 extracted.
  • Figure 3 is a schematic flowchart of the step of putting adhesive into the grinding jig and softening the adhesive.
  • the grinding jig 10 is provided with a groove 100; it can be understood that , the groove 100 is suitable for providing a location for the assembly of the packaging structure 11 , so that the packaging structure 11 can be more reliably installed on the grinding jig 10 for extraction of the parts 12 .
  • the steps of placing adhesive in the grinding jig 10 and softening the adhesive include:
  • the adhesive into the groove 100; in this way, the adhesive can be used more rationally and the waste of the adhesive can be avoided.
  • the molten adhesive can facilitate the placement of the packaging structure 11, thereby making the placement of the packaging structure 11 on the grinding jig 10 more stable and reliable, and making the extraction of the parts 12 from the packaging structure 11 easier and more convenient.
  • the packaging structure 11 can be more reliably placed on the grinding jig 10 to facilitate the extraction process of the packaging structure 11, thereby allowing The extraction process of the parts 12 of the package structure 11 is more efficient.
  • T1 90°C
  • T1 93°C.
  • T1 95°C
  • T1 98°C
  • T1 100°C
  • T1 102°C
  • T1 105°C
  • the adhesive be brought into a molten state, but also the impact on the packaging structure 11 during the heating process can be avoided, so that the packaging structure 11 can extract the parts 12 .
  • Figure 4 is a schematic flow chart of the steps of placing the packaging structure into the adhesive with the side of the packaging structure encapsulating the circuit board facing up and curing the adhesive. 11 is placed in the adhesive so that the side of the packaging structure 11 encapsulating the circuit board faces up, and the steps of curing the adhesive include:
  • the packaging structure 11 is placed flushly on the grinding jig 10 by applying pressure, so as to facilitate grinding of the packaging structure 11 , thereby enabling extraction of the parts 12 within the packaging structure 11 .
  • FIG. 5 is a schematic flowchart of the steps of grinding the package structure until the circuit board is taken out
  • the steps of grinding the package structure 11 until the circuit board is taken out include:
  • the package structure 11 is ground until the solder joints between the component 12 and the circuit board are exposed, and the surface finish after grinding is not lower than a predetermined value. In this way, after the soldering points are exposed, the circuit board can be taken out by removing the soldering points.
  • the step of softening the adhesive and taking out the packaging structure 11 includes:
  • Heating the adhesive to a molten state again not only facilitates the removal of the packaging structure 11, but also facilitates the removal of the parts 12 from the packaging structure 11;
  • the packaging structure 11 Take out the packaging structure 11; remove the adhesive adhered to the surface of the packaging structure 11. In this way, by removing the adhesive on the surface of the packaging structure 11 , the parts 12 on the packaging structure 11 can be easily taken out. Moreover, the removed adhesive can be reused, thereby reducing the cost of the extraction method of the parts 12 in the packaging structure 11 .
  • the adhesive is not lost during the grinding process, so the adhesive can be recycled to reduce the operating cost of the packaging structure 11 when extracting parts.
  • Figure 6 is a schematic flow chart of the steps of placing the package structure into the adhesive with the side of the package structure facing away from the circuit board and curing the adhesive.
  • 11 is placed in the adhesive with the side of the packaging structure 11 away from the circuit board facing up, and the step of curing the adhesive includes: placing the side of the packaging structure 11 with the circuit board encapsulated facing the adhesive and placing the adhesive in the agent; apply pressure on the packaging structure until the portion of the packaging structure 11 that is not packaged with the circuit board and the surface of the grinding jig 10 are on the same level.
  • Figure 7 is a schematic flowchart of the step of grinding and removing the packaging material in the packaging structure to expose the parts.
  • the step of grinding and removing the packaging material 13 in the packaging structure 11 and exposing the parts 12 includes: grinding The packaging material 13 in the packaging structure 11 is removed until the surface of the part 12 is exposed; the surface of the part 12 is polished until the identification information on the surface of the part 12 is exposed. In this way, by grinding and polishing the surface of the parts 12, the identification information of the parts 12 can be exposed, and the recycling of different parts 12 can be realized by distinguishing the identification information of the parts 12, thereby facilitating the recycling of multiple packaging structures 11 after taking out the parts 12. use.
  • Figure 8 is a schematic flow chart of the steps of softening the adhesive to remove the part.
  • the step of softening the adhesive and removing the part 12 includes: heating the adhesive to a molten state again. ; In this way, heating the adhesive again makes it easier to take out the part 12; using a glue remover to remove the adhesive on the surface of the part 12.
  • glue remover can remove the adhesive on the surface of the part 12 more efficiently, thereby facilitating the removal of the part 12 and improving the efficiency of the extraction method of the part 12 in the packaging structure 11 .
  • Figure 9 shows a method for extracting parts within a package structure. After the step of softening the adhesive to remove the parts, it also includes removing edge residues of the parts by grinding or laser cutting.
  • the schematic flow chart of the packaging material, after softening the adhesive and taking out the part 12, also includes the following steps: using grinding or laser cutting to remove the remaining packaging material 13 on the edge of the part 12. Therefore, the laser cutting method can more efficiently remove the packaging material 13 on the edge of the part 12, thereby improving the extraction effect of the part 12 and improving the recycling efficiency of the part 12.
  • FIG 10 is a schematic structural diagram of a grinding jig.
  • the grinding jig 10 is applied to the extraction method of the parts 12 in the package structure 11.
  • At least one side surface of the grinding jig 10 is provided with There is a groove 100 for receiving adhesive and packaging structure 11 .
  • the adhesive can be softened multiple times to reduce the cost of the extraction method of the parts 12 in the packaging structure 11 .
  • the method for extracting parts from the packaging structure provided by the present disclosure can effectively remove the packaging material to realize the removal of the parts on the packaging structure, so that the parts on the packaging structure can be recycled.
  • the adhesive can be softened multiple times to reduce the cost of parts extraction methods within the packaging structure, which has strong industrial practicability.

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

一种封装结构（11）内的零件（12）提取方法和研磨治具（10），零件（12）提取方法包括以下步骤：在研磨治具（10）中放入粘合剂，并将粘合剂软化；将封装结构（11）放入粘合剂中且使封装结构（11）封装有电路板的一面朝上，并将粘合剂固化；研磨封装结构（11），直至露出零件(12)；将粘合剂软化，取出零件（12）。

Description

封装结构内的零件提取方法和研磨治具
相关交叉引用
本公开要求于2022年08月23日提交中国专利局、申请号为202211014423X、发明名称为“封装结构内的零件提取方法和研磨治具”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及一种封装结构内的零件提取方法和研磨治具。
背景技术
在现有技术中，封装结构由于在零件的外侧封装有封装材料，以使其具有极为优秀的使用性能，常被应用于广阔使用环境中。在相关技术中，当封装结构不再使用，需要对其进行回收时，封装材料会影响零件的回收利用，从而造成资源的浪费。
发明内容
(一)要解决的技术问题
在现有技术中，封装结构由于在零件的外侧封装有封装材料，但当封装结构不再使用，需要对其进行回收时，封装材料会影响零件的回收利用，从而造成资源的浪费。
(二)技术方案
根据本公开公开的各种实施例，提供一种封装结构内的零件提取方法和研磨治具。
一种封装结构内的零件提取方法，包括以下步骤：
在研磨治具中放入粘合剂，并将所述粘合剂软化；
将所述封装结构放入所述粘合剂中且使所述封装结构封装有电路板的一面朝上，并将所述粘合剂固化；
研磨所述封装结构，直至露出零件；所述粘合剂软化，取出所述零件。
作为本公开实施例一种可选的实施方式，在研磨所述封装结构，直至露出零件的步骤包括：研磨所述封装结构，直至取出所述电路板；将所述粘合剂软化，取出所述封装结构；将所述封装结构放入所述粘合剂中且使所述封装结构背离所述电路板的一侧朝上，并将所述粘合剂固化；再次研磨所述封装结构，直至露出零件。
作为本公开实施例一种可选的实施方式，研磨所述封装结构，直至取出所述电路板的步骤包括：研磨所述封装结构，直至露出所述零件和所述电路板之间的焊接点，且研磨后的平面光整度不低于预定值。
作为本公开实施例一种可选的实施方式，将所述粘合剂软化，取出所述封装结构的步骤包括：将所述粘合剂再次加热至熔融状态；取出所述封装结构；去除所述封装结构表面粘附的所述粘合剂。
作为本公开实施例一种可选的实施方式，所述研磨治具中设置有凹槽；在研磨治具中放入粘合剂，并将所述粘合剂软化的步骤包括：在所述凹槽内放入所述粘合剂；将所述粘合剂加热至熔融状态。
作为本公开实施例一种可选的实施方式，将所述粘合剂加热至熔融状态的加热温度为90℃≤T1≤110℃。
作为本公开实施例一种可选的实施方式，将放有所述粘合剂的所述研磨治具放入加热设备中，以将所述粘合剂加热至熔融状态。
作为本公开实施例一种可选的实施方式，将所述封装结构放入所述粘合剂中且使得所述封装结构封装电路板的一面朝上，并将所述粘合剂固化的步骤包括：将所述封装结构放入所述粘合剂中且使得所述封装结构封装电路板的一面朝上；对所述封装结构施加压力，使所述 封装结构封装电路板的一面与所述研磨治具的表面处于同一水平面上。
作为本公开实施例一种可选的实施方式，将所述封装结构放入所述粘合剂中且使所述封装结构背离所述电路板的一侧朝上，并将所述粘合剂固化的步骤包括：将所述封装结构封装有所述电路板的一面朝向所述粘合剂并放入所述粘合剂中；对所述封装结构施加压力，直至所述封装结构的未封装有电路板的一面与所述研磨治具的表面处于同一水平面上。
作为本公开实施例一种可选的实施方式，研磨所述封装结构，露出零件的步骤包括：研磨去除所述封装结构中的封装材料，直至露出所述零件的表面；抛光所述零件的表面，直至露出所述零件表面的标识信息。
作为本公开实施例一种可选的实施方式，研磨所述封装结构，直至露出零件的步骤还包括：去除零件边缘残留的封装材料。
作为本公开实施例一种可选的实施方式，研磨或激光切割去除零件边缘残留的封装材料。
作为本公开实施例一种可选的实施方式，将所述粘合剂软化，取出所述零件的步骤包括：将所述粘合剂再次加热至熔融状态；取出所述零件；采用去胶液去除所述零件表面的所述粘合剂。
一种应用于所述封装结构内的零件提取方法的研磨治具，所述研磨治具用于容置所述粘合剂和所述封装结构。
作为本公开实施例一种可选的实施方式，所述研磨治具的至少一侧表面设置有凹槽，所述凹槽用于容置所述粘合剂和所述封装结构。
本公开的其他特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本公开而了解。本公开的目的和其他优点在说明书、权利要求书以及附图中所特别指出的结构 来实现和获得，本公开的一个或多个实施例的细节在下面的附图和描述中提出。
为使本公开的上述目的、特征和优点能更明显易懂，下文特举可选实施例，并配合所附附图，作详细说明如下。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用来解释本公开的原理。
为了更清楚地说明本公开实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本公开一个或多个实施例提供的封装结构内的零件提取方法的流程示意图；
图2是本公开一个或多个实施例提供的研磨封装结构直至露出零件步骤的流程示意图；
图3是本公开一个或多个实施例提供的研磨治具中放入粘合剂并将粘合剂软化步骤的流程示意图；
图4是本公开一个或多实施例提供的将封装结构放入粘合剂中且使得封装结构封装电路板的一面朝上并将粘合剂固化步骤的流程示意图；
图5是本公开一个或多个实施例提供的研磨封装结构直至取出电路板步骤的流程示意图；
图6是本公开一个或多个实施例提供的将封装结构放入粘合剂中且使封装结构背离电路板的一侧朝上并将粘合剂固化步骤的流程示意图；
图7是本公开一个或多个实施例提供的研磨去除封装结构中的封装材料以露出零件步骤的流程示意图；
图8是本公开一个或多个实施例提供的将粘合剂软化以取出零件步骤的流程示意图；
图9是本公开一个或多个实施例提供的封装结构内的零件提取方法的另一种流程示意图；
图10是本公开一个或多个实施例提供的研磨治具的结构示意图。
附图标记：
研磨治具10，封装结构11，零件12，封装材料13，凹槽100。
具体实施方式
为了能够更清楚地理解本公开的上述目的、特征和优点，下面将对本公开的方案进行进一步描述。需要说明的是，在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合。
在下面的描述中阐述了很多具体细节以便于充分理解本公开，但本公开还可以采用其他不同于在此描述的方式来实施；显然，说明书中的实施例只是本公开的一部分实施例，而不是全部的实施例。
本公开的说明书和权利要求书中的术语“第一”和“第二”等是用来区别不同的对象，而不是用来描述对象的特定顺序。例如，第一摄像头和第二摄像头是为了区别不同的摄像头，而不是为了描述摄像头的特定顺序。
在本公开实施例中，“示例性的”或者“例如”等词来表示作例子、例证或说明。本公开实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念，此外，在本公开实施例的描述中，除非另有说明，“多个”的含义是指两个或两个以上。
图1为封装结构内的零件提取方法的流程示意图，下面参考图1-图10描述根据本公开实施例的封装结构11内的零件12提取方法，包括以下步骤：
在研磨治具10中放入粘合剂，并将粘合剂软化；如此一来，软化后的粘合剂能有较高的融合性能，能够让封装结构11放置到软化的粘合剂上，从而能够是实现对封装结构11的处理。
将封装结构11放入粘合剂中且使封装结构11封装有电路板的一面朝上，并将粘合剂固化；这样，将封装结构11上设有电路板的一面朝上，能够便于后续对封装结构11的零件12提取。而将粘合剂固化后能够让封装结构11在研磨治具10的设置更为稳定，从而能够便有对封装结构11上的零件12提取。
研磨封装结构11，直至露出零件12；需要说明的是，研磨去除封装结构11上的封装层，以让封装结构11上的零件12露出，从而便于零件从封装结构内的取出。
将粘合剂软化，取出零件12。而将粘合剂软化后，不仅可以实现零件12的取出，还能取出已经去除零件12的封装结构11，从而让另一个封装结构11放置到粘合剂上以实现重复使用，降低封装结构11的取出成本。
也就是说，在取出实现取出封装结构11内的零件12时，适于将封装结构11通过粘合剂设置在研磨治具10上之后对封装结构11进行研磨，让封装结构11上封装在所需零件12外侧的结构适于得到取出，包括封装在零件12外侧的封装材料以及设置在零件12外侧电路板，从而能够将封装结构11内的零件12的取出以实现对零件12的回收。
根据本公开实施例的封装结构11内的零件12提取方法，通过将封装结构11装设到研磨治具10上并对其进行研磨，以使零件露出从而实现封装结构11内零件12取出，从而让封装结构11上的零件12能够进行回收利用。
在一些实施例中，如图2所示，图2为研磨封装结构直至露出零件步骤的流程示意图，在研磨封装结构11，直至露出零件12的步骤包括：将粘合剂软化，取出封装结构11；如此一来，能够实现对粘合剂的重复使用，取出封装结构11后可以放置新的封装结构11进行零件 12的取出，也可以用于取出封装结构11的另一面的零件12。
将封装结构11放入粘合剂中且使封装结构11的封装结构11背离电路板的一侧朝上，并将粘合剂固化；这样，能够对封装结构11的另一面的零件12进行取出，从而提升封装结构11内的零件12取出的提取效率。
再次研磨去除封装结构11中的封装材料13，直至露出零件12；可以理解的是，与上述研磨取出电路板的方式相同，都是通过研磨去除封装材料13，并将零件12露出，以便于零件12提取。
如此一来，通过采用上述方式研磨封装结构11，能够将封装结构11上影响零件12取出的结构得以去除，从而让零件12的取出更为可靠。
在一些实施例中，如图3所示，图3为研磨治具中放入粘合剂并将粘合剂软化步骤的流程示意图，研磨治具10中设置有凹槽100；可以理解的是，凹槽100适于为封装结构11的组装提供位置，以使封装结构11能够更为可靠的装设到研磨治具10上进行零件12的提取。在研磨治具10中放入粘合剂，并将粘合剂软化的步骤包括：
在凹槽100内放入粘合剂；如此一来，能够更为合理的利用粘合剂，避免粘合剂的浪费。
将粘合剂加热至熔融状态。熔融状态的粘合剂能够便于封装结构11的放置，从而让封装结构11在研磨治具10上的放置更为稳定可靠，使得零件12从封装结构11上的提取更为简单方便。
这样，通过将凹槽100内设有粘合剂并对其进行加热软化，以使封装结构11能够更为可靠的设置在研磨治具10上，以便于对封装结构11的提取处理，从而让封装结构11的零件12提取过程更为高效。
在一些具体的实施例中，将放有粘合剂的研磨治具10放入加热设备中，加热温度T1满足关系式：90℃≤T1≤110℃，例如T1＝90℃、T1＝93℃、T1＝95℃、T1＝98℃、T1＝100℃、T1＝102℃、T1＝105℃、 T1＝107℃或T1＝110℃等。不仅能够实现将粘合剂变成熔融状态，而且能够避免加热过程中对于封装结构11的影响，从而让封装结构11能够实现零件12提取。
在一些实施例中，如图4所示，图4为将封装结构放入粘合剂中且使得封装结构封装电路板的一面朝上并将粘合剂固化步骤的流程示意图，将封装结构11放入粘合剂中且使得封装结构11封装电路板的一面朝上，并将粘合剂固化的步骤包括：
将封装结构11放入粘合剂中且使得封装结构11封装电路板的一面朝上；这样，能够便于封装结构11封装有电路板的一面的研磨处理，以让封装结构11上的零件12提取更为简单可靠。
对封装结构11施加压力，使封装结构11封装电路板的一面与研磨治具10的表面处于同一水平面上。如此一来，能够便于对研磨治具10的使用，以实现封装结构11上电路板的露出与取出。
由此，采用施加压力的方式将封装结构11以平齐的方式设置在研磨治具10上，以便于对封装结构11进行研磨，从而能够实现对封装结构11内零件12的提取。
在一些实施例中，如图5所示，图5为研磨封装结构直至取出电路板步骤的流程示意图，研磨封装结构11，直至取出电路板的步骤包括：
研磨封装结构11，直至露出零件12和电路板之间的焊接点，且研磨后的平面光整度不低于预定值。这样，将焊接点露出后，能够通过去除焊接点实现电路板的取出。
如此一来，通过对封装结构11进行研磨，让零件12与电路板之间的焊接点得以露出，从而让零件12在封装结构11上的设置得以松动，以能够完成将封装结构11内的零件12的提取。
在一些实施例中，将粘合剂软化，取出封装结构11的步骤包括：
将粘合剂加热至熔融状态；可以理解的是，将粘合剂再次加热到 熔融状态，不仅便于封装结构11的取出，而且能够便于零件12从封装结构11上的取出；
取出封装结构11；去除封装结构11表面粘附的粘合剂。这样，通过去除封装结构11表面的粘合剂，能够便于封装结构11上的零件12取出。且去除的粘合剂能够进行重复使用，降低封装结构11内的零件12提取方法的使用成本。
可以理解的是，粘合剂在研磨过程中并不会得到损耗，因此可以对粘合剂进行回收利用，以降低封装结构11的在进行零件提取时的运行成本。
在一些实施例中，如图6所示，图6为将封装结构放入粘合剂中且使封装结构背离电路板的一侧朝上并将粘合剂固化步骤的流程示意图，将封装结构11放入粘合剂中且使封装结构11背离电路板的一侧朝上，并将粘合剂固化的步骤包括：将封装结构11封装有电路板的一面朝向粘合剂并放入粘合剂中；对封装结构施加压力，直至封装结构11的未封装有电路板的与研磨治具10的表面处于同一水平面上。如此一来，不仅可以让封装结构11上的电路板的提取更为简单方便，便于封装结构11上的零件12取出，而且还能将封装结构11的另一面的零件12进行取出，以提升封装结构11内零件12的取出数量，提升零件12的回收利用效率。
在一些实施例中，如图7所示，图7为研磨去除封装结构中的封装材料以露出零件步骤的流程示意图，研磨去除封装结构11中的封装材料13，露出零件12的步骤包括：研磨去除封装结构11中的封装材料13，直至露出零件12的表面；抛光零件12的表面，直至露出零件12表面的标识信息。这样，通过研磨与抛光零件12的表面，能够露出零件12的标识信息，可以通过对零件12标识信息的区分实现不同零件12的回收处理，从而便于多个封装结构11进行零件12取出后的回收利用。
在一些实施例中，如图8所示，图8为将粘合剂软化以取出零件 步骤的流程示意图，将粘合剂软化，取出零件12的步骤包括：将粘合剂再次加热至熔融状态；这样，将粘合剂再次加热，能够便于取出零件12；采用去胶液去除零件12表面的粘合剂。而采用去胶液能够更为高效的取出零件12表面的粘合剂，从而便于零件12的取出，提升封装结构11内的零件12提取方法的使用效率。
在一些实施例中，如图9所示，图9示出了封装结构内的零件提取方法在将粘合剂软化以取出零件的步骤之后，还包括采用研磨或激光切割的方式去除零件边缘残留的封装材料的流程示意图，将粘合剂软化，取出零件12的步骤之后，还包括以下步骤：采用研磨或激光切割的方式去除零件12边缘残留的封装材料13。由此，采用激光切割的方式，能够更为高效的去除零件12边缘的封装材料13，从而让零件12的提取效果更好，以提升零件12的回收利用效率。
如图10所示，图10为研磨治具的结构示意图，根据本公开实施例的应用于上述封装结构11内的零件12提取方法的研磨治具10，研磨治具10的至少一侧表面设置有凹槽100，凹槽100用于容置粘合剂和封装结构11。这样，通过将封装结构11内的零件12提取方法应用于研磨治具10，通过将封装结构11装设到研磨治具10上并去除封装材料13，以实现封装结构11上的零件12取出，从而让封装结构11上的零件12能够进行回收利用。同时，还能将粘合剂进行多次软化，以降低封装结构11内的零件12提取方法的使用成本。
根据本公开实施例的研磨治具10的其他构成以及操作对于本领域普通技术人员而言都是已知的，这里不再详细描述。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。
尽管已经示出和描述了本公开的实施例，本领域的普通技术人员可以理解：在不脱离本公开的原理和宗旨的情况下可以对这些实施例 进行多种变化、修改、替换和变型，本公开的范围由权利要求及其等同物限定。
工业实用性
本公开提供的封装结构内的零件提取方法，可有效去除封装材料，以实现封装结构上的零件取出，从而让封装结构上的零件能够进行回收利用。同时，还能将粘合剂进行多次软化，以降低封装结构内的零件提取方法的使用成本，具有很强的工业实用性。

Claims (15)

  1. 一种封装结构(11)内的零件(12)提取方法，其中，包括以下步骤：
    在研磨治具(10)中放入粘合剂，并将所述粘合剂软化；
    将所述封装结构(11)放入所述粘合剂中且使所述封装结构(11)封装有电路板的一面朝上，并将所述粘合剂固化；
    研磨所述封装结构(11)，直至露出零件(12)；
    将所述粘合剂软化，取出所述零件(12)。
  2. 根据权利要求1所述的封装结构(11)内的零件(12)提取方法，其中，在研磨所述封装结构(11)，直至露出零件(12)的步骤包括：
    研磨所述封装结构(11)，直至取出所述电路板；
    将所述粘合剂软化，取出所述封装结构(11)；
    将所述封装结构(11)放入所述粘合剂中且使所述封装结构(11)背离所述电路板的一侧朝上，并将所述粘合剂固化；
    再次研磨所述封装结构，直至露出零件(12)。
  3. 根据权利要求2所述的封装结构(11)内的零件(12)提取方法，其中，研磨所述封装结构，直至取出所述电路板的步骤包括：
    研磨封装结构(11)，直至露出所述零件(12)和所述电路板之间的焊接点，且研磨后的平面光整度不低于预定值。
  4. 根据权利要求2所述的封装结构(11)内的零件(12)提取方法，其中，将所述粘合剂软化，取出所述封装结构(11)的步骤包括：
    将所述粘合剂加热至熔融状态；
    取出所述封装结构(11)；
    去除所述封装结构(11)表面粘附的所述粘合剂。
  5. 根据权利要求1所述的封装结构(11)内的零件(12)提取方法，其中，所述研磨治具(10)中设置有凹槽(100)；
    在研磨治具(10)中放入粘合剂，并将所述粘合剂软化的步骤包括：
    在所述凹槽(100)内放入所述粘合剂；
    将所述粘合剂加热至熔融状态。
  6. 根据权利要求5所述的封装结构(11)内的零件(12)提取方法，其中，将所述粘合剂加热至熔融状态的加热温度为90℃≤T1≤110℃。
  7. 根据权利要求5所述的封装结构(11)内的零件(12)提取方法，其中，将放有所述粘合剂的所述研磨治具(10)放入加热设备中，以将所述粘合剂加热至熔融状态。
  8. 根据权利要求1所述的封装结构(11)内的零件(12)提取方法，其中，将所述封装结构(11)放入所述粘合剂中且使所述封装结构(11)封装有电路板的一面朝上，并将所述粘合剂固化的步骤包括：
    将所述封装结构(11)放入所述粘合剂中且使得所述封装结构(11)封装电路板的一面朝上；
    对所述封装结构(11)施加压力，使所述封装结构(11)封装电路板的一面与所述研磨治具(10)的表面处于同一水平面上。
  9. 根据权利要求1所述的封装结构(11)内的零件(12)提取方法，其中，将所述封装结构(11)放入所述粘合剂中且使所述封装结构(11)背离所述电路板的一侧朝上，并将所述粘合剂固化的步骤包括：
    将所述封装结构(11)封装有所述电路板的一面朝向所述粘合剂并放入所述粘合剂中；
    对所述封装结构施加压力，直至所述封装结构(11)的未封装有电路板的一面与所述研磨治具(10)的表面处于同一水平面上。
  10. 根据权利要求1所述的封装结构(11)内的零件(12)提取方法，其中，研磨所述封装结构(11)，直至露出零件(12)的步骤包括：
    研磨去除所述封装结构(11)中的封装材料(13)，直至露出所述零件(12)的表面；
    抛光所述零件(12)的表面，直至露出所述零件(12)表面的标识信息。
  11. 根据权利要求10所述的封装结构(11)内的零件(12)提取 方法，其中，研磨所述封装结构(11)，直至露出零件(12)的步骤还包括：
    去除零件(12)边缘残留的封装材料(13)。
  12. 根据权利要求11所述的封装结构(11)内的零件(12)提取方法，其中，研磨或激光切割去除零件(12)边缘残留的封装材料(13)。
  13. 根据权利要求1所述的封装结构(11)内的零件(12)提取方法，其中，将所述粘合剂软化，取出所述零件(12)的步骤包括：
    将所述粘合剂加热至熔融状态；
    取出所述零件(12)；
    采用去胶液去除所述零件(12)表面的所述粘合剂。
  14. 一种应用于权利要求1-13中任一项所述的封装结构(11)内的零件(12)提取方法的研磨治具(10)，其中，所述研磨治具(10)用于容置所述粘合剂和所述封装结构(11)。
  15. 根据权利要求14所述的研磨治具(10)，其中，所述研磨治具(10)的至少一侧表面设置有凹槽(100)，所述凹槽(100)用于容置所述粘合剂和所述封装结构(11)。
PCT/CN2022/139047 2022-08-23 2022-12-14 封装结构内的零件提取方法和研磨治具 WO2024040804A1 (zh)

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