WO2024037008A1 - 一种阴极导电装置及电镀设备 - Google Patents
一种阴极导电装置及电镀设备 Download PDFInfo
- Publication number
- WO2024037008A1 WO2024037008A1 PCT/CN2023/088861 CN2023088861W WO2024037008A1 WO 2024037008 A1 WO2024037008 A1 WO 2024037008A1 CN 2023088861 W CN2023088861 W CN 2023088861W WO 2024037008 A1 WO2024037008 A1 WO 2024037008A1
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- WIPO (PCT)
- Prior art keywords
- conductive
- tank
- electroplating
- cathode
- groove
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 222
- 239000007788 liquid Substances 0.000 claims abstract description 118
- 230000005540 biological transmission Effects 0.000 claims description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 68
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 45
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 37
- 239000007921 spray Substances 0.000 claims description 37
- 239000010936 titanium Substances 0.000 claims description 37
- 229910052719 titanium Inorganic materials 0.000 claims description 37
- 230000007246 mechanism Effects 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000005406 washing Methods 0.000 claims description 9
- 238000002791 soaking Methods 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 3
- 229910001431 copper ion Inorganic materials 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 16
- 238000007747 plating Methods 0.000 description 12
- 230000006872 improvement Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
Definitions
- the invention relates to the technical field of electroplating, and in particular to a cathode conductive device and electroplating equipment.
- the electroplating process is to pass an electrolyte on a metal film with a certain metal layer, and under the action of current, the copper ions in the electrolyte are plated on the metal film.
- the cathode conductive device of the electroplating equipment uses a conductive roller to conduct electricity. and positioning, however, usually the conductive roller is located above the liquid level, and the metal film passes through the electroplating tank and reaches the conductive roller, which will bring the plating liquid to the conductive roller, affecting the conductivity of the cathode conductive device, and the surface of the conductive roller will also be
- the electroplating solution is plated with copper particles, causing the thickness of the copper plated on the film to vary. The copper particles evaporate and fall off to form crystals, which pierce the film. If more current is gathered at the tip of the copper crystal, the tip will discharge as usual, breaking down the film, affecting the Plating quality and appearance.
- the purpose of the present invention is to provide a cathode conductive device and electroplating equipment to prevent the cathode conductive roller from adsorbing copper ions and improve the quality of electroplating.
- the present invention provides a cathode conductive device, including:
- the upper conductive groove assembly includes an upper conductive groove and a conductive roller set installed in the upper conductive groove.
- the upper conductive groove is arranged on the conductive section frame, wherein the upper conductive groove is filled with liquid, and the upper conductive groove is filled with liquid.
- the conductive roller set is immersed in the liquid;
- a lower conductive groove assembly includes a lower conductive groove, the lower conductive groove accepts the upper conductive groove, and the liquid in the upper conductive groove can flow into the lower conductive groove;
- the circulating liquid supply pipeline is respectively connected to the upper conductive tank and the lower conductive tank, and circulates the liquid entering the lower conductive tank into the upper conductive tank.
- an inner tank and an outer tank are provided in the upper conductive tank, and a water inlet is provided at the bottom of the inner tank, and the water inlet is connected to the circulating liquid supply pipeline;
- a first transmission hole is provided opposite the side; the liquid is injected into the inner tank, and the conductive roller set is arranged in the inner tank;
- a water outlet hole is provided at the bottom of the outer tank on one side of the first transmission hole, and the water outlet hole is connected with the lower conductive groove.
- a water inlet guide box is provided at the bottom of the inner tank, the water inlet guide box is buckled on the water inlet, and a number of water inlet holes are symmetrically provided on both sides of the water inlet guide box;
- a guide box is provided on the upper conductive groove below the water outlet hole, and the guide box is connected with the lower conductive groove; an inner cover of the conductive groove is provided on the inner groove.
- the inner groove on one side of the first transmission hole is provided with a soaking and water-retaining roller set;
- the outer groove on one side of the first transmission hole is provided with a water-washing and water-retaining roller set;
- the soaking Both the water-retaining roller set and the water-washing water-retaining roller set include oppositely arranged water-retaining rollers and a transmission lower roller, and one end of the transmission lower roller is connected to a first transmission mechanism;
- the first transmission mechanism includes a driving device and a main transmission shaft.
- the main transmission shaft passes through the center of the upper conductive groove and is connected to the driving device through a sprocket.
- Several main transmission shafts are provided on the main transmission shaft.
- Gear, one end of the transmission lower roller is provided with a spur gear, and the main transmission gear meshes with the spur gear in one-to-one correspondence;
- Second transmission holes are provided on both sides of the upper conductive groove, and the second transmission holes are provided corresponding to the first transmission holes.
- a water-absorbing sponge wheel is provided on the outer groove on one side of the second transmission hole.
- the upper conductive tank is provided with a cathode connection mechanism
- the cathode connection mechanism includes a titanium-clad copper cathode rod and a plurality of first cathode copper bars connected to the titanium-clad copper cathode rod;
- the conductive roller set includes a plurality of conductive rollers arranged side by side. One end of the conductive rollers is connected to the first cathode copper bar through a conductive connecting shaft in one-to-one correspondence.
- the lower conductive tank is connected to a water inlet valve group; a filter bucket is connected to the bottom of the lower conductive tank, and the filter bucket is connected to the circulating liquid supply pipeline; inside the lower conductive tank A guide plate is provided corresponding to the upper conductive tank; a liquid level detection device is provided on the lower conductive tank.
- the circulating liquid supply pipeline includes a circulation pump and a pipeline, and the circulation pump is respectively connected to the upper conductive tank and the lower conductive tank through pipelines.
- An electroplating equipment includes a cathode conductive device and an electroplating tank as described above.
- the cathode conductive device and the electroplating tank can be connected and transport electroplated parts.
- the electroplating tank is provided with a rectifier unit and a cathode rod, and the cathode rod is connected to the cathode conductive device.
- the rectifier unit includes a plurality of anode copper bars and a plurality of second cathode copper bars. The anode copper bar is connected to the inside of the electroplating tank, and the second cathode copper bar is connected to the cathode rod.
- the electroplating tank includes:
- An upper electroplating tank assembly is arranged on the electroplating tank frame, and includes an upper electroplating tank, an electroplating assembly arranged in the upper electroplating tank, and a second transmission mechanism.
- the electroplating assembly performs electroplating on electroplated parts through electroplating liquid,
- the second transfer mechanism is used to transfer electroplated parts;
- the lower electroplating tank assembly includes a lower electroplating tank, the lower electroplating tank takes over the upper electroplating tank, and the electroplating liquid in the upper electroplating tank can enter the lower electroplating tank;
- the electroplating liquid circulation pipeline is respectively connected to the upper electroplating tank and the lower electroplating tank, and circulates the electroplating liquid entering the lower electroplating tank into the upper electroplating tank.
- the upper electroplating tank is provided with several sub-troughs, and the sub-troughs are connected with each other.
- Each of the sub-troughs is provided with a number of electroplating components, and the electroplating components include an upper and lower double-layer arrangement.
- the anode titanium plate and the spray pipe, the electroplated parts pass between the upper and lower double-layered anode titanium plates, the anode titanium plate is provided with an escape hole, the spray pipe is arranged corresponding to the avoidance hole, and the anode
- the titanium plate is covered with an anode bag;
- the spray pipe includes an upper spray pipe and a lower spray pipe, the upper spray pipe is arranged above the anode titanium plate on the upper layer, and the lower spray pipe is arranged on the anode on the lower layer. underneath the titanium plate.
- the cathode conductive device of the present invention adopts fully immersed cathode conductive transmission, which can effectively prevent crystallization on the conductive roller, thereby preventing crushing and breakdown of electroplated parts, and the liquid can wash away the copper on the upper surface of the conductive roller. , to prevent back plating, thereby improving the quality of electroplating; in order to cooperate with the immersed cathode conduction, the conductive device adopts an upper and lower groove design to recycle the liquid and prevent the liquid temperature in the conductive groove from being too high.
- Figure 1 is a schematic diagram of the overall structure of the cathode conductive device of the present invention.
- Figure 2 is a schematic diagram of the internal structure of the upper conductive groove of the present invention.
- Figure 3 is a schematic diagram of the roller installation structure in the upper conductive groove of the present invention.
- Figure 4 is a schematic structural diagram of the first transmission mechanism in the upper conductive groove of the present invention.
- Figure 5 is a schematic structural diagram of the inner cover of the conductive groove installed in the upper conductive groove of the present invention.
- Figure 6 is a schematic structural diagram of the lower conductive tank assembly and the circulating liquid supply pipeline of the present invention.
- Figure 7 is a schematic diagram of the structure behind the cathode conductive device of the present invention.
- Figure 8 is a schematic diagram of the overall structure of the electroplating equipment of the present invention.
- Figure 9 is a schematic diagram of the overall back connection structure of the electroplating equipment of the present invention.
- Figure 10 is a schematic diagram of the overall structure of the electroplating tank of the present invention.
- Figure 11 is a schematic diagram of the internal structure of the upper electroplating tank assembly of the present invention.
- Figure 12 is a schematic structural diagram of the electroplating component of the present invention.
- Figure 13 is a schematic structural diagram of the upper and lower double-layer anode titanium plates of the present invention.
- Figure 14 is a schematic diagram of the empty tank structure inside the electroplating tank of the present invention.
- Figure 15 is a schematic structural diagram of the lower electroplating tank assembly of the present invention.
- Figure 16 is a schematic structural diagram of the rear side of the lower electroplating tank assembly and electroplating solution circulation pipeline of the present invention.
- the marks in the figure are: 1. Conductive section frame; 2. Upper conductive trough assembly; 21. Upper conductive trough; 211. Inner trough; 212. Water inlet guide box; 213. Water inlet hole; 214. Outer trough; 215 , Water outlet hole; 22. Conductive roller set; 221. Conductive connecting shaft; 23. Soaking water retaining roller set; 24. Washing water retaining roller set; 25. First transmission mechanism; 251. Main drive shaft; 252. Sprocket; 253. Main transmission gear; 254. Spur gear; 26. First cathode copper bar; 27. Titanium-clad copper cathode rod; 28. Conductive tank inner cover; 29. Exhaust valve group; 3. Lower conductive tank assembly; 31.
- Lower conductive tank 32. Deflector; 33. Float level switch group; 34. Overflow pipe; 35. Water inlet valve group; 36. Liquid level inspection tube; 4. Circulating liquid supply pipeline; 41. Filtration Bucket; 42. Circulation pump; 5. Cathode conductive device; 6. Electroplating tank; 61. Electroplating tank frame; 611. Water tray; 62. Upper electroplating tank assembly; 621. Upper electroplating tank; 6211. Water outlet box; 6212.
- the conductive roller since the conductive roller is passed through cathode electricity, a layer of copper film will be plated on the conductive roller. During the subsequent film running process, this layer of copper film will interact with the conductive roller. The roller has weak bonding force and will easily adhere to the film.
- the copper in the electroplating tank When the film enters the electroplating tank again, the copper in the electroplating tank will be electroplated on the copper film.
- the plating solution brought by the film from the electroplating tank will also be on the conductive roller. On the one hand, it will pierce the film and cause the product to fail. On the other hand, if more current is gathered at the tip of the copper crystal, the tip will discharge as usual, thus burning the film.
- the cathode conductive seat is located next to the electroplating tank during electroplating.
- the mating surface of the cathode conductive rod and the cathode conductive seat is easily oxidized and rusted, which will seriously affect the conductivity of the cathode conductive device. , which in turn affects the quality of electroplated workpieces.
- the upper conductive groove assembly 2 includes an upper conductive groove 21 and a conductive roller set 22 installed in the upper conductive groove 21.
- the upper conductive groove 21 is provided on the conductive section frame 1, wherein the upper conductive groove 21 is filled with liquid to conduct electricity.
- the roller set 22 is immersed in the liquid;
- the lower conductive groove assembly 3 includes a lower conductive groove 31.
- the lower conductive groove 31 receives the upper conductive groove 21, and the liquid in the upper conductive groove 21 can flow into the lower conductive groove 31;
- the circulating liquid supply pipeline 4 is connected to the upper conductive tank 21 and the lower conductive tank 31 respectively, and circulates the liquid entering the lower conductive tank 31 into the upper conductive tank 21 .
- the electroplated parts pass through the upper conductive groove 21 and pass through the conductive roller set 22. Since the conductive roller set 22 is immersed in the liquid, the conductive roller set 22 is always in the liquid during the conductive process, and the liquid can During the conductive process, the conductive roller is prevented from crystallizing and breakdown occurs, and due to the liquid protection, it can effectively prevent the conductive roller from crushing the electroplated parts; at the same time, the conductive groove adopts an upper and lower groove design, and the liquid in the upper conductive groove 21 passes through The lower conductive groove 31 is used cyclically to prevent the temperature of the liquid in the upper conductive groove 21 from being too high and affecting the conductivity.
- the liquid in the conductive tank is pure water, which can effectively reduce the temperature of the conductive roller and avoid crystallization and oxide layer on the surface of the conductive roller.
- this embodiment provides a cathode conductive device.
- an inner groove 211 and an outer groove 214 are provided in the upper conductive groove 21.
- a water inlet is provided at the bottom of the inner groove 211.
- the water inlet It is connected with the circulating liquid supply pipeline 4; first transfer holes are provided on both sides of the inner tank 211 opposite to each other; the inner tank 211 is filled with liquid, and the conductive roller group 22 is arranged in the inner tank 211; the outer tank on one side of the first transfer hole
- a water outlet hole 215 is provided at the bottom of 214, and the water outlet hole 215 is connected with the lower conductive groove 31.
- the upper conductive groove 21 adopts the design of inner and outer grooves 214.
- the inner groove 211 performs wet conduction
- the outer groove 214 performs liquid circulation coordination and transmission operations. Specifically, the liquid entering the inner groove 211 through the water inlet is due to both sides. The existence of the first transfer hole will overflow the inner tank 211 into the outer tank 214, and flow into the lower conductive groove 31 from the water outlet hole 215 of the outer tank 214, completing the liquid connection between the upper and lower conductive grooves 31.
- a water inlet guide box 212 is provided at the bottom of the inner tank 211.
- the water inlet guide box 212 is buckled on the water inlet.
- a number of water inlet holes 213 are symmetrically provided on both sides of the water inlet guide box 212.
- the water inlet guide box 212 passes through several water inlet holes 213.
- the water inlet hole 213 allows the liquid to enter the inner tank 211 evenly, and because the water inlet hole 213 has different water inlet directions, it can flow to each conductive roller, thereby improving the liquid flushing effect.
- a guide box is provided on the upper conductive groove 21 below the water outlet hole 215.
- the guide box is connected with the lower conductive groove 31 to guide the liquid to flow into the lower conductive groove 31.
- the inner groove 211 is provided with an inner cover of the conductive groove. 28. Prevent liquid from overflowing the inner tank 211.
- the inner groove 211 on the side of the first transmission hole is designed to be provided with a soaking water retaining roller group 23; the outer groove 214 on the side of the first transmission hole is designed There is a water-washing water-retaining roller set 24 on the top, that is, a soaking water-retaining roller set 23 and a water-washing water-retaining roller set 24 are arranged on both sides of the conductive roller set 22.
- the electroplated parts enter on one side and pass through the conductive rollers and pass out from one side;
- Both the soaking water retaining roller set 23 and the washing water retaining roller set 24 include oppositely arranged water retaining rollers and a transmission lower roller.
- the immersion water-retaining roller set 23 needs to block more liquid to slow down the overflow due to the inner tank 211. Therefore, the immersion water-retaining roller set 23 includes two water-retaining rollers, and One end of the two water-retaining rollers are meshed with gears.
- the other water-retaining roller moves toward each other to form a better buffering and blocking effect; the water-retaining rollers in the water-washing water retaining roller set 24 Further prevent the electroplating liquid from entering the inner tank 211 or the liquid being taken out of the upper conductive tank 21; second transfer holes are provided on both sides of the upper conductive tank 21, and the second transfer holes are provided correspondingly to the first transfer holes.
- a water-absorbing sponge wheel is provided on the outer tank 214, and the second transmission hole is the transmission hole for external connection of the upper conductive tank 21.
- the water-absorbing sponge wheel can first reduce or prevent the electroplating liquid from being brought into the conductive tank, and the other end can reduce or prevent the electroplating liquid from being brought into the conductive tank.
- One end prevents liquid from being carried out.
- the first transmission mechanism 25 includes a driving device and a main transmission shaft 251.
- the main transmission shaft 251 passes through the center of the upper conductive groove 21 and is connected to the driving device through a sprocket 252; the main transmission A number of main transmission gears 253 are provided on the shaft 251, and a spur gear 254 is provided at one end of the lower transmission roller.
- the main transmission gears 253 mesh with the spur gears 254 in a one-to-one correspondence; in this embodiment, the driving device can be a motor, and the motor is connected
- the sprocket 252 penetrates into the upper conductive groove 21 and is connected to the main transmission shaft 251 arranged on the outer groove 214, thereby driving the main transmission shaft 251 to rotate.
- the main transmission shaft 251 drives the main transmission gear 253 to rotate and thereby drives the spur gear 254. Rotate, the spur gear 254 drives the transmission roller to rotate to transmit the electroplated parts.
- the upper conductive tank 21 is provided with a cathode connection mechanism.
- the cathode connection mechanism includes a titanium-coated copper cathode rod 27 and a plurality of first cathode copper bars 26 connected to the titanium-coated copper cathode rod 27;
- the conductive roller group 22 includes Several conductive rollers are arranged side by side. One end of the conductive roller is connected to the first cathode copper bar 26 through a conductive connecting shaft 221 in a one-to-one correspondence.
- the plurality of first cathode copper bars 26 are respectively connected to the corresponding conductive rollers, that is, the current is shared, so that The current of the conductive roller is smaller, which reduces the possibility of back plating and crystallization, and can increase the power of the cathode and the service life of the conductive roller.
- the upper conductive tank 21 adopts a hinged glass upper cover to facilitate observation of the internal conditions and operation; as shown in Figure 5, the upper conductive tank 21 is also connected with an exhaust valve group 29 for forming a vacuum conductive space.
- this embodiment provides a cathode conductive device.
- the lower conductive groove 31 is also provided on the conductive groove frame and obliquely below the upper conductive groove 21 to form a butt joint; the lower conductive groove 31 31 is connected to a water inlet valve group 35 for liquid inlet; the bottom of the lower conductive tank 31 is connected with a filter barrel 41, and the filter barrel 41 is connected to the circulating liquid supply pipeline 4.
- the water entering the upper conductive tank 21 from the lower conductive tank 31 The liquid must be filtered to improve the quality of the liquid; a guide plate 32 is provided in the lower conductive groove 31 corresponding to the upper conductive groove 21 to guide the liquid flowing in from the upper conductive groove 21 to the lower conductive groove 31; the lower conductive groove 31
- the liquid level detection device can be a float level switch group 33 and a liquid level sight tube 36, which are used to observe the internal liquid position and prevent overflow, and further prevent overflow.
- An overflow pipe 34 is inserted. One end of the overflow pipe 34 is inserted into the lower conductive tank 31 and the other end is connected to the outside. When the liquid is higher than the overflow pipe 34, the liquid flows out to the outside through the overflow pipe 34 to prevent liquid in the inner tank 211. excess.
- the circulating liquid supply pipeline 4 includes a circulating pump 42 and a pipeline.
- the circulating pump 42 is connected to the upper conductive tank 21 and the lower conductive tank 31 through the pipelines, and circulates the liquid in the lower conductive tank 31 into the upper conductive tank. 21, a circulating liquid supply is formed, and a ball valve for adjusting flow or switching is provided on the pipeline.
- the circulating pump 42 can be placed on the conductive tank frame and arranged below the upper conductive tank 21 to facilitate stable pumping of liquid.
- this embodiment provides an electroplating equipment, including the cathode conductive device 5 as described in the above specific embodiments or examples, and also includes an electroplating tank 6, the cathode conductive device 5 and the electroplating tank 6 Able to dock and transfer electroplated parts.
- the electroplating tank 6 is provided with a rectifier unit 7 and a cathode rod 73.
- the cathode rod 73 is connected to the cathode conductive device 5.
- the rectifier unit 7 includes a plurality of anode copper bars 71 and a plurality of second cathode copper bars 72.
- the anode copper bar 71 is connected to the electroplating tank 6.
- the rectifier unit 7 specifically includes a rectifier frame, a chassis and several rectifiers installed in the chassis.
- the rectifiers pass through the anode copper bar 71 and the second cathode copper bar 72 and pass through the chassis downwards toward the electroplating tank 6
- the cathode conductive device 5 provides current, and multiple rectifiers realize high-power power supply current through multiple sets of copper bars to meet long-distance power supply. The cooperation can involve a longer electroplating tank 6 to assist in improving the electroplating quality.
- this embodiment provides an electroplating tank, including:
- Electroplating tank frame 61
- the upper electroplating tank assembly 62 is arranged on the electroplating tank frame 61, and includes an upper electroplating tank 621, an electroplating assembly 622 arranged in the upper electroplating tank 621, and a second transmission mechanism 623.
- the electroplating assembly 622 electroplats electroplated parts through electroplating liquid.
- the second transfer mechanism 623 is used to transfer electroplated parts;
- the lower electroplating tank assembly 63 includes a lower electroplating tank 631.
- the lower electroplating tank 631 takes over the upper electroplating tank 621, and the electroplating liquid in the upper electroplating tank 621 can enter the lower electroplating tank 631;
- the electroplating liquid circulation pipeline 64 is respectively connected to the upper electroplating tank 621 and the lower electroplating tank 631, and circulates the electroplating liquid entering the lower electroplating tank 631 into the upper electroplating tank 621.
- the entire electroplating tank 6 uses up and down circulating electroplating liquid to electroplat the electroplated parts.
- the electroplated parts are transferred into the upper electroplating tank 621 through the second transfer mechanism 623.
- the electroplating assembly 622 electroplates the electroplated parts. After the electroplating liquid is electroplated, the electroplated parts will be electroplated. It flows from the upper electroplating tank 621 into the lower electroplating tank 631. After being processed by the electroplating liquid circulation pipeline 64, it is injected into the electroplating component 622 in the upper electroplating tank 621 for repeated use to electroplat the electroplated parts and circulate the electroplating liquid so that the electroplating liquid can maintain a certain constant temperature. , thereby improving the plating quality.
- the upper electroplating tank 621 is provided with several sub-troughs, which are connected to each other. Each sub-trough is provided with a number of electroplating components 622.
- the purpose of the sub-trough design is to achieve better electroplating effects and circulation of the plating solution.
- the electroplating solution can be injected into different sub-troughs to form a split flow. The split flow is more conducive to the cooling and uniformity of the electroplating solution, so that the plating effect of the electroplating solution is uniform and the activity of each part remains consistent.
- different sub-troughs are provided with The inner cover 624 prevents the electroplating liquid from flying out, and the inner cover 624 is provided above the electroplating assembly 622.
- the electroplating assembly 622 includes an upper and lower double-layer anode titanium plate 6221 and a spray pipe 6222.
- the electroplated parts can pass through the upper and lower anode titanium plates.
- an avoidance hole 6225 is provided on the anode titanium plate 6221, and a spray pipe is provided corresponding to the avoidance hole 6225; an upper spray pipe is provided above the upper anode titanium plate 6221, and a lower spray pipe is provided below the lower anode titanium plate 6221.
- the existing anode plates all use a large-area titanium plate.
- each titanium plate can be independently equipped with filtering devices such as anode bags to filter the liquid, eliminating gloss agent consumption and bubble generation problems; there are avoidance holes 6225 on the anode titanium plate 6221 to effectively spray the
- the shower pipe 6222 provides sufficient flow and spray space, and uses upper and lower double-layered small titanium plates to evenly plate the electroplated parts up and down to improve the plating quality. At the same time, there are spray pipes 6222 above and below, making the electroplating solution sprayed more evenly.
- the upper and lower anode titanium plates 6221 cooperate with the upper and lower spray pipes 6222 for electroplating.
- a set of electroplating components 622 includes two upper and lower anode titanium plates 6221 and a spray pipe 6222.
- the anode titanium plate 6221 is fixed by a bracket.
- One end of the anode titanium plate 6221 extends out of the upper electroplating tank 621 through the anode connecting plate 6223 and is connected to the anode copper bar 71 for electrical conduction.
- one anode titanium plate 6221 is connected to one anode copper bar 71 through an anode connecting plate 6223.
- the second transmission mechanism 623 includes a number of transmission rollers and driving mechanisms. Transmission rollers are installed in the middle of each group of electroplating components 622 and on both sides of the entire upper electroplating tank 621. One end of the rollers is connected to the driving mechanism.
- the form of this driving mechanism can be Using a form similar to the first transmission mechanism 25 in Embodiment 1, the transmission roller can also be designed to drive the transmission roller according to needs, so that it can normally and smoothly transmit the parts to be plated in the upper electroplating tank 621 .
- Each spray pipe 6222 corresponds to the avoidance hole 6225 on the anode titanium plate 6221 one by one, so that the spray pipes 6222 has sufficient flow and spray space to improve the uniformity and adequacy of electroplating and improve the quality of electroplating.
- This embodiment provides an electroplating equipment, as shown in Figures 10 to 14.
- a water outlet box 6211 is provided under the tank body of the upper electroplating tank 621, and a number of water holes 6212 are provided on both sides of the water outlet box 6211.
- the sprayed electroplating liquid reaches the bottom of the upper electroplating tank 621 and flows downward through the water hole 6212.
- the bottom of the upper electroplating tank 621 is a double-layer design. Therefore, the water hole 6212 flows through the bottom space. Designated positions, such as through guide plates or diversion troughs, eventually flow down to the electroplating tank 631.
- the porous water outlet design of the water outlet box 6211 allows the electrolyte flowing down to enter the circulation from all directions, effectively preventing liquid accumulation and overflow; in order to further prevent When the liquid overflows, several groups of shunt pipes 6213 are designed at the bottom of the upper electroplating tank 621. One end of the shunt pipes 6213 is inserted into the bottom of the upper electroplating tank 621, and the height is lower than the lower anode titanium plate 6221. The other end is uniformly connected to the lower electroplating tank 631.
- an upper electroplating tank side guide plate 625 may also be provided on one side of the upper electroplating tank 621, which is connected to the lower electroplating tank 631, so that splashed electroplating liquid can enter the lower electroplating tank 631.
- a water baffle 6214 is provided on one side of the upper electroplating tank 621, and a bottom hole 6215 is provided at the bottom between the water baffle 6214 and the outgoing tank wall, so that the electroplating liquid can flow out of the upper plating tank 621.
- the excess electroplating liquid enters the lower electroplating tank 631.
- Water-blocking rollers are designed on both sides of the water-blocking plate 6214.
- Water-absorbing sponge wheels are installed on one side of the outlet of the upper electroplating tank 621, which is similar to the water-blocking design on both sides of the conductive tank. There is no duplication. Repeat.
- the electroplating liquid enters the lower electroplating tank 631 from the upper electroplating tank 621.
- a drainage device is designed in the lower electroplating tank 631 to make the electroplating liquid flow to the bottom of the tank.
- the bottom of the tank is connected to the electroplating liquid circulation pipeline 64.
- Electroplating The circulation pipeline includes a pump 641 arranged on one side below the lower electroplating tank 631.
- the pump 641 draws out the electroplating liquid at the bottom of the tank through the pipeline and pumps it into the filter 642.
- the filter 642 passes through the spray pipe 643.
- each spray pipe 6222 in the upper electroplating tank 621 for spraying Enter each spray pipe 6222 in the upper electroplating tank 621 for spraying; further, two filters 642 are respectively provided at both ends of the lower electroplating tank 631, and two circulation pumps are correspondingly provided below, and both circulation pumps are provided from the bottom.
- the electroplating liquid is extracted from the electroplating tank 631 and pumped into two filters 642 respectively.
- the two filters 642 respectively correspond to a set of spray pipes 643.
- the electroplating liquid in a group of spray pipes 643 flows upward to the spray pipe 6222.
- the electroplating solution in another set of spray pipes 643 flows down the spray pipe, splits the flow, and is driven into both ends of the circulation pipe, which can effectively improve the activity and uniformity of the potion, and the temperature and liquid level can be guaranteed to be consistent, improving The quality of the equipment for making boards.
- the upper electroplating tank 621 and the lower electroplating tank 631 are both installed on the electroplating tank frame 61, and a water tray 611 is provided under the electroplating tank frame 61.
- the upper electroplating tank 621 and the lower electroplating tank 631 are both in the water tray 611. Above, prevent the electroplating liquid from flowing out and causing pollution.
- the electroplating equipment of the present invention has an upper and lower small titanium plate anode conductive design through a cyclic spray design, and cooperates with a shunt circulation pipeline system to effectively improve the uniformity of electroplating, reduce electroplating differences, and improve electroplating quality.
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Abstract
本发明公开了一种阴极导电装置及电镀设备，包括：导电段机架；上导电槽组件，包括上导电槽以及安装在上导电槽内的导电滚轮组，所述上导电槽设置在所述导电段机架上，其中，所述上导电槽内注有液体，所述导电滚轮组浸泡在所述液体中；下导电槽组件，包括下导电槽，所述下导电槽承接所述上导电槽，所述上导电槽内的液体能够流入所述下导电槽；循环供液管路，分别连接上导电槽和下导电槽，其将进入下导电槽的液体循环注入所述上导电槽内。本发明阴极导电装置能够防止阴极导电辊吸附铜离子，提高电镀质量。
Description
本发明涉及电镀技术领域，具体涉及一种阴极导电装置及电镀设备。
电镀工艺是在具有一定金属层的金属薄膜上面通过电解液，在电流的作用下将电解液中的铜离子镀在金属薄膜上，在电镀过程中，电镀设备的阴极导电装置采用导电辊进行导电和定位，但是，通常导电辊位于液面以上，金属薄膜从电镀槽中穿出后到达导电辊，会将电镀液带到导电辊上，影响阴极导电装置的导电性，导电辊表面也会被电镀液镀上铜颗粒，使得薄膜上所镀铜厚度不一，铜颗粒蒸发脱落形成结晶，刺破薄膜，且在铜结晶的尖端汇聚较多电流也会照常尖端放电，将薄膜击穿，影响电镀质量及外观。
本发明的目的是提供一种阴极导电装置及电镀设备，防止阴极导电辊吸附铜离子，提高电镀质量。
为了解决上述技术问题，本发明提供了一种阴极导电装置，包括：
导电段机架；
上导电槽组件，包括上导电槽以及安装在上导电槽内的导电滚轮组，所述上导电槽设置在所述导电段机架上，其中，所述上导电槽内注有液体，所述导电滚轮组浸泡在所述液体中；
下导电槽组件，包括下导电槽，所述下导电槽承接所述上导电槽，所述上导电槽内的液体能够流入所述下导电槽；
循环供液管路，分别连接上导电槽和下导电槽，其将进入下导电槽的液体循环注入所述上导电槽内。
作为本发明的进一步改进，所述上导电槽内设置有内槽和外槽，所述内槽底部设置有进水口，所述进水口与所述循环供液管路连通；所述内槽两侧相对设置有第一传送孔；所述内槽内注有所述液体，所述导电滚轮组设置在所述内槽内；
所述第一传送孔一侧的所述外槽底部设置有出水孔，所述出水孔与所述下导电槽连通。
作为本发明的进一步改进，所述内槽底部设置有进水导盒，所述进水导盒扣设在所述进水口上，所述进水导盒两侧对称设置有若干进水孔；所述出水孔下方的所述上导电槽上设置有导流盒，所述导流盒与所述下导电槽连通；所述内槽上设置有导电槽内盖。
作为本发明的进一步改进，所述第一传送孔一侧的内槽上设置有浸泡挡水滚轮组；所述第一传送孔一侧的外槽上设置有水洗挡水滚轮组；所述浸泡挡水滚轮组和水洗挡水滚轮组均包括相对设置的挡水滚轮和传送下滚轮，所述传送下滚轮一端连接有第一传送机构；
所述第一传送机构包括驱动装置和主传动轴，所述主传动轴穿过所述上导电槽的中心位置处通过链轮连接所述驱动装置；所述主传动轴上设置有若干主传动齿轮，所述传送下滚轮一端设置有正斜齿轮，所述主传动齿轮与所述正斜齿轮一一对应啮合；
所述上导电槽两侧设置有第二传送孔，所述第二传送孔与所述第一传送孔对应设置，所述第二传送孔一侧的所述外槽上设置有吸水海绵轮。
作为本发明的进一步改进，所述上导电槽上设置有阴极连接机构，所述阴极连接机构包括钛包铜阴极杆和若干连接在所述钛包铜阴极杆上的第一阴极铜排；
所述导电滚轮组包括若干并排设置的导电滚轮，所述导电滚轮一端通过导电连接轴与所述第一阴极铜排一一对应连接。
作为本发明的进一步改进，所述下导电槽连接有进水阀组；所述下导电槽底部连通设置有过滤桶，所述过滤桶连接所述循环供液管路；所述下导电槽内对应承接所述上导电槽处设有导流板；所述下导电槽上设有液位检测装置。
作为本发明的进一步改进，所述循环供液管路包括循环泵和管路，所述循环泵通过管路分别连接所述上导电槽和所述下导电槽。
一种电镀设备，包括如上所述的阴极导电装置和电镀槽，所述阴极导电装置与所述电镀槽能够对接传送电镀件。
作为本发明的进一步改进，所述电镀槽上设置有整流机组和阴极杆，所述阴极杆连接所述阴极导电装置，所述整流机组包括若干阳极铜排和若干第二阴极铜排，所述阳极铜排连接至所述电镀槽内部，所述第二阴极铜排连接所述阴极杆。
作为本发明的进一步改进，所述电镀槽包括：
电镀槽架；
上电镀槽组件，设置在所述电镀槽架上，其包括上电镀槽、设置在所述上电镀槽内的电镀组件和第二传送机构，所述电镀组件通过电镀液对电镀件进行电镀，所述第二传送机构用于对电镀件进行传送；
下电镀槽组件，包括下电镀槽，所述下电镀槽承接所述上电镀槽，所述上电镀槽内的电镀液能够进入所述下电镀槽；
电镀液循环管路，分别连接所述上电镀槽和下电镀槽，其将进入下电镀槽的电镀液循环注入所述上电镀槽。
作为本发明的进一步改进，所述上电镀槽设置有若干分槽，所述分槽与分槽之间连通，所述分槽内均设有若干电镀组件，所述电镀组件包括上下双层设置的阳极钛板和喷淋管，电镀件穿过上下双层设置的阳极钛板之间，所述阳极钛板上设置有避让孔，所述喷淋管对应所述避让孔设置，所述阳极钛板上套设有阳极袋；喷淋管包括上喷淋管和下喷淋管，所述上喷淋管设置在上层的阳极钛板的上方，所述下喷淋管设置在下层的阳极钛板的下方。
本发明的有益效果：本发明阴极导电装置采用完全浸泡式阴极导电传送，能够有效防止导电滚轮上结晶，从而防止对电镀件的压伤和击穿，且液体能够将导电滚轮上表面铜洗掉，防止造成返镀，从而提高电镀质量；为配合浸泡式阴极导电，导电装置采用上下槽设计，对液体进行循环使用，防止导电槽内液体温度过高。
图1是本发明阴极导电装置整体结构示意图；
图2是本发明上导电槽内部结构示意图；
图3是本发明上导电槽内滚轮安装结构示意图；
图4是本发明上导电槽内第一传动机构结构示意图；
图5是本发明上导电槽内安装导电槽内盖结构示意图；
图6是本发明下导电槽组件与循环供液管路结构示意图；
图7是本发明阴极导电装置背后结构示意图；
图8是本发明电镀设备整体结构示意图；
图9是本发明电镀设备整体背部连接结构示意图；
图10是本发明电镀槽整体结构示意图；
图11是本发明上电镀槽组件内部结构示意图；
图12是本发明电镀组件结构示意图；
图13是本发明上下双层阳极钛板结构示意图；
图14是本发明上电镀槽内部空槽结构示意图；
图15是本发明下电镀槽组件结构示意图；
图16是本发明下电镀槽组件与电镀液循环管路后侧结构示意图；
图中的标记为：1、导电段机架；2、上导电槽组件；21、上导电槽；211、内槽；212、进水导盒；213、进水孔；214、外槽；215、出水孔；22、导电滚轮组；221、导电连接轴；23、浸泡挡水滚轮组；24、水洗挡水滚轮组；25、第一传送机构；251、主传动轴；252、链轮；253、主传动齿轮；254、正斜齿轮；26、第一阴极铜排；27、钛包铜阴极杆；28、导电槽内盖；29、抽风阀组；3、下导电槽组件；31、下导电槽；32、导流板；33、浮球液位开关组；34、溢流管；35、进水阀组；36、液位视管；4、循环供液管路；41、过滤桶；42、循环泵；5、阴极导电装置；6、电镀槽；61、电镀槽架；611、接水盘；62、上电镀槽组件；621、上电镀槽；6211、出水盒；6212、流水孔；6213、分流管；6214、挡水板；6215、底孔；622、电镀组件；6221、阳极钛板；6222、喷淋管；6223、阳极连接板；6224、阳极护盖；6225、避让孔；623、第二传送机构；624、内盖；625、上电镀槽侧引流板；63、下电镀槽组件；631、下电镀槽；64、电镀液循环管路；641、泵浦；642、过滤器；643、喷流管路；7、整流机组；71、阳极铜排；72、第二阴极铜排；73、阴极杆。
下面结合附图和具体实施例对本发明作进一步说明，以使本领域的技术人员可以更好地理解本发明并能予以实施，但所举实施例不作为对本发明的限定。
所背景技术所述，由于导电辊上通有阴极电，因此，会在导电辊上会镀上一层铜薄膜，这一层铜薄膜在接下来的走膜过程中，由于该铜薄膜与导电辊结合力弱，会很容易附着在薄膜上，当薄膜再次进入电镀槽时，会使得电镀槽中的铜电镀到该铜薄膜上，薄膜从电镀槽中带来的镀液也会在导电辊上蒸发，从而形成结晶，一方面会刺破薄膜，造成产品不合格，另一方面，在铜结晶的尖端汇聚较多电流也会照常尖端放电，从而将薄膜烧断。
此外，在电镀中阴极导电座位于电镀槽的边上，在电镀的酸碱潮湿的环境中阴极导电杆和阴极导电座的配合面极易氧化和生锈， 这将严重影响阴极导电装置导电性，进而影响电镀工件的质量。
如图1-图7所示，为解决上述问题，发明人潜心研究发现通过湿式导电能够防止结晶和返镀，因此发明了一种阴极导电装置，包括：
导电段机架1；
上导电槽组件2，包括上导电槽21以及安装在上导电槽21内的导电滚轮组22，上导电槽21设置在导电段机架1上，其中，上导电槽21内注有液体，导电滚轮组22浸泡在液体中；
下导电槽组件3，包括下导电槽31，下导电槽31承接上导电槽21，上导电槽21内的液体能够流入下导电槽31；
循环供液管路4，分别连接上导电槽21和下导电槽31，其将进入下导电槽31的液体循环注入上导电槽21内。
本发明在使用过程中，电镀件穿过上导电槽21经过导电滚轮组22，由于导电滚轮组22浸泡在液体中，导电滚轮组22在进行导电的过程中，一直处在液体中，液体能在导电的过程中防止导电滚轮结晶，防止了击穿的发生，且由于液体保护，能有效防止导电滚轮对电镀件的压伤；同时，导电槽采用上下槽设计，上导电槽21的液体通过下导电槽31循环使用，可防止液体在上导电槽21内温度过高，对导电造成影响。
进一步地，导电槽内的液体为纯水，可以有效降低导电滚轮的温度，避免到导电滚轮表面结晶及氧化层。
基于上述实施方式，本实施例提供一种阴极导电装置，如图1和图2所示，上导电槽21内设置有内槽211和外槽214，内槽211底部设置有进水口，进水口与循环供液管路4连通；内槽211两侧相对设置有第一传送孔；内槽211内注有液体，导电滚轮组22设置在内槽211内；第一传送孔一侧的外槽214底部设置有出水孔215，出水孔215与下导电槽31连通。
为了不影响传送过程，上导电槽21采用内外槽214设计，内槽211进行湿式导电，外槽214来进行液体循环配合和传送操作，具体的，通过进水口进入内槽211的液体由于两侧第一传送孔的存在，会溢出内槽211进入外槽214，并从外槽214的出水孔215流入下导电槽31，完成上下导电槽31的液体承接。
具体的，内槽211底部设置有进水导盒212，进水导盒212扣设在进水口上，进水导盒212两侧对称设置有若干进水孔213，进水导盒212通过若干进水孔213使液体均匀进入内槽211，且由于进水孔213进水方向不一，可流向各个导电滚轮，提高液体冲洗效果。出水孔215下方的上导电槽21上设置有导流盒，导流盒与下导电槽31连通，引导液体流入下导电槽31；如图5所示，内槽211上设置有导电槽内盖28，防止液体溢出内槽211。
进一步地，如图3所示，为了配合湿式导电且不影响正常传动，设计第一传送孔一侧的内槽211上设置有浸泡挡水滚轮组23；第一传送孔一侧的外槽214上设置有水洗挡水滚轮组24，即导电滚轮组22两侧均依次设置浸泡挡水滚轮组23和水洗挡水滚轮组24，一侧电镀件进入，经过导电滚轮后从一侧穿出；浸泡挡水滚轮组23和水洗挡水滚轮组24均包括相对设置的挡水滚轮和传送下滚轮，传送下滚轮一端连接有第一传送机构25，第一传送机构25带动传送下滚轮运行，从而带动电镀件传动；在本实施例中，浸泡挡水滚轮组23由于在内槽211，需要阻挡更多的液体减缓溢出的速度，因此，浸泡挡水滚轮组23包括两个挡水滚轮，且两个挡水滚轮的一端通过齿轮啮合，在其中一个挡水滚轮被液体带动产生转动后另一个挡水滚轮相向运动，形成更好的缓冲阻挡作用；水洗挡水滚轮组24中的挡水滚轮进一步阻挡电镀液进入内槽211或液体被带出上导电槽21；上导电槽21两侧设置有第二传送孔，第二传送孔与第一传送孔对应设置，第二传送孔一侧的外槽214上设置有吸水海绵轮，第二传送孔是上导电槽21对外连接的传送孔，因此，一端由于对接电镀槽，吸水海绵轮可以先减少或避免电镀液被带入导电槽，另一端可以避免液体被带出。
进一步地，如图4和图7所示，第一传送机构25包括驱动装置和主传动轴251，主传动轴251穿过上导电槽21的中心位置处通过链轮252连接驱动装置；主传动轴251上设置有若干主传动齿轮253，传送下滚轮一端设置有正斜齿轮254，主传动齿轮253与正斜齿轮254一一对应啮合；在本实施例中，驱动装置可以是电机，电机连接链轮252，链轮252穿入上导电槽21并连接设置在外槽214上的主传动轴251，从而驱动主传动轴251转动，主传动轴251带动主传动齿轮253转动从而带动正斜齿轮254转动，正斜齿轮254带动传送下滚轮转动从而对电镀件进行传输。
在导电方向上，上导电槽21上设置有阴极连接机构，阴极连接机构包括钛包铜阴极杆27和若干连接在钛包铜阴极杆27上的第一阴极铜排26；导电滚轮组22包括若干并排设置的导电滚轮，导电滚轮一端通过导电连接轴221与第一阴极铜排26一一对应连接，通过多个第一阴极铜排26分别连接对应导电滚轮，即对电流进行分摊，使到导电滚轮的电流较小，减小返镀和结晶的可能性，且能提高阴极的功率和导电滚轮的使用寿命。
进一步地，上导电槽21采用铰链玻璃上盖，便于观察内部情况和操作；如图5所示，上导电槽21上还联通有抽风阀组29，用于形成真空导电空间。
基于上述实施方式，本实施例提供一种阴极导电装置，如图6和图7所示，下导电槽31也设置在导电槽架上且在上导电槽21斜下方，形成对接；下导电槽31连接有进水阀组35，用于进液；下导电槽31底部连通设置有过滤桶41，过滤桶41连接循环供液管路4，因此，从下导电槽31进入上导电槽21的液体必须经过过滤，提高液体质量；下导电槽31内对应承接上导电槽21处设有导流板32，用于引导从上导电槽21流入的液体到下导电槽31内；下导电槽31上设有液位检测装置，在本实施例中，液位检测装置可以是浮球液位开关组33、液位视管36，用于观察内部液体位置，防止溢流，进一步为防止溢流插入有溢流管34，溢流管34一端插入下导电槽31内部，一端通入外部，当液体高于溢流管34时，液体通过溢流管34流出到外部，防止内槽211内液体过量。
进一步地，循环供液管路4包括循环泵42和管路，循环泵42通过管路分别连接上导电槽21和下导电槽31，将下导电槽31内的液体循环泵42入上导电槽21内，形成循环供液，管路上设置有用于调节流量或开关的球阀，循环泵42可放置在导电槽架上并设置在上导电槽21下方，方便液体稳定泵入。
如图8-图11所示，本实施例提供了一种电镀设备，包括如上具体实施方式或实施例中所述的阴极导电装置5，还包括电镀槽6，阴极导电装置5与电镀槽6能够对接传送电镀件。电镀槽6上设置有整流机组7和阴极杆73，阴极杆73连接阴极导电装置5，整流机组7包括若干阳极铜排71和若干第二阴极铜排72，阳极铜排71连接至电镀槽6内部，第二阴极铜排72连接阴极杆73。在本实施例中，整流机组7具体包括整流机架、机箱和安装在机箱内的若干整流机，整流机通过阳极铜排71和第二阴极铜排72穿出机箱向下，向电镀槽6和阴极导电装置5提供电流，多台整流机通过多组铜排实现大功率供电流满足长距离供电，配合可涉及较长的电镀槽6，辅助提高电镀质量。
具体的，本实施例提供了一种电镀槽，包括：
电镀槽架61；
上电镀槽组件62，设置在电镀槽架61上，其包括上电镀槽621、设置在上电镀槽621内的电镀组件622和第二传送机构623，电镀组件622通过电镀液对电镀件进行电镀，第二传送机构623用于对电镀件进行传送；
下电镀槽组件63，包括下电镀槽631，下电镀槽631承接上电镀槽621，上电镀槽621内的电镀液能够进入下电镀槽631；
电镀液循环管路64，分别连接上电镀槽621和下电镀槽631，其将进入下电镀槽631的电镀液循环注入上电镀槽621。
在使用过程中，整个电镀槽6采用上下循环电镀液对电镀件进行电镀，电镀件又第二传送机构623代入上电镀槽621中，电镀组件622对电镀件进行电镀，电镀液进行电镀后会从上电镀槽621流入下电镀槽631，经过电镀液循环管路64处理后注入会上电镀槽621中的电镀组件622重复使用对电镀件进行电镀，循环电镀液，使得电镀液能够保持一定恒温，进而提高电镀质量。
进一步地，上电镀槽621设置有若干分槽，分槽与分槽之间连通，分槽内均设有若干电镀组件622，分槽设计的目的是为了更好的电镀效果和电镀液的循环，电镀液可注入不同分槽内，形成分流，分流更有利于电镀液的降温和均匀性，使得电镀液电镀效果均匀，各部分活性保持一致，在本实施例中不同分槽内均设置有内盖624，防止电镀液飞出，内盖624在电镀组件622上方设置。
基于实施例3，本实施例提供一种电镀设备，如图12和图13所示，电镀组件622包括上下双层设置的阳极钛板6221和喷淋管6222，电镀件能够穿过上下阳极钛板6221的中间，阳极钛板6221上设置有避让孔6225，喷淋管对应避让孔6225设置；上层的阳极钛板6221上方设置有上喷淋管，下层的阳极钛板6221下方设置有下喷淋管，现有的阳极板都采用一块大面积钛板，电流过大容易击穿电镀件，且只有一个钛板，电镀时从一个方向进行，电镀不均匀，同时，现有设备阳极采用整块或者喷管一体式钛板，均不能加装阳极袋等装置，这样就没用办法消除光泽剂的消耗过大问题，以及没用办法过滤药水因为流动产生的气泡问题，而本发明采用小面积的阳极钛板6221，每块钛板都可以独立装配阳极袋等过滤装置，对药水进行过滤，消除光泽剂消耗及产生气泡问题；阳极钛板6221上开有避让孔6225可以有效的给喷淋管6222提供足够的流量和喷洒空间，且采用上下双层小钛板，对电镀件上下进行均匀电镀，提高电镀质量，同时上下方都有喷淋管6222，使得喷洒电镀液更均匀。
上下层阳极钛板6221与上下喷淋管6222进行配合进行电镀，具体采用以下结构说明：一组电镀组件622包括上下两个阳极钛板6221和喷淋管6222，阳极钛板6221通过支架固定，阳极钛板6221的一端通过阳极连接板6223伸出上电镀槽621连接到阳极铜排71上，进行导电，连接过程中，一个阳极钛板6221对应通过一个阳极连接板6223连接一个阳极铜排71，分摊来自整流机组7的大功率电流，上下较小的电流通过铱板，对电镀件更均匀的进行电镀，在本实施例中，在上电镀槽621内部，阳极连接板6223上方设置阳极护盖6224，防止电镀液飞溅，对阳极供电端造成损害。在传送方向上，第二传送机构623包括若干传送滚轮和驱动机构，每一组电镀组件622中间及整个上电镀槽621内部两边均安装有传送滚轮，滚轮一端连接驱动机构，此驱动机构形式可以采用类似实施例1中第一传送机构25形式，也可根据需要设计对传动滚轮进行驱动，使其在上电镀槽621中正常平稳传动待电镀件。配合阳极钛板6221的上方和下方分别两个喷淋管6222，即一组四个喷淋管6222，每个喷淋管6222一一对应阳极钛板6221上的避让孔6225，使得喷淋管6222具有足够的流量和喷洒空间，提高电镀均匀性和充分性，提高电镀质量。
本实施例提供一种电镀设备，如图10-图14所示，为实现循环供液，上电镀槽621的槽体下设置有出水盒6211，出水盒6211两侧设置有若干流水孔6212，喷淋后的电镀液到上电镀槽621的槽底，通过流水孔6212流通向下，在本实施例中，上电镀槽621的槽底是双层设计，因此，流水孔6212通过底部空间流向指定位置，比如通过导向板或导流槽，最终流向下电镀槽631，出水盒6211多孔出水设计，使得流下来的电解液从各个方向向下进入循环，有效防止了液体堆积溢出；为了进一步防止液体溢出，还在上电镀槽621的槽底设计了若干组分流管6213，分流管6213一端插入上电镀槽621底，高度低于下层的阳极钛板6221，另一端统一接入下电镀槽631内，当电镀液高于分流管6213在上电镀槽621内的高度时，及时通过各溢流管进行排流，保证了电镀的正常进行，且通过多分流设计，有效的对电镀液进行了降温，更利于循环使用。在本实施例中，还可以在上电镀槽621一侧设置上电镀槽侧引流板625，其连通至下电镀槽631，使飞溅的电镀液能够进入下电镀槽631。
进一步地，为了减少电镀液被带出上电镀槽621，上电镀槽621内一侧设置有挡水板6214，挡水板6214与传出的槽壁之间的底部设置有底孔6215，流出多余的电镀液，进入下电镀槽631，挡水板6214两侧设计挡水滚轮，上电镀槽621传出口一侧设置吸水海绵轮，类似导电槽内两侧挡水设计，重复之处不再赘述。
如图15和图16所示，电镀液从上电镀槽621进入下电镀槽631，通过在下电镀槽631内设计引流装置使电镀液都流向槽底，槽底连通电镀液循环管路64，电镀循环管路包括设置在下电镀槽631下方一侧的泵浦641，泵浦641通过管路将槽底的电镀液抽出并泵入到过滤器642中，再有过滤器642经过喷流管路643进入上电镀槽621中的各喷淋管6222中进行喷淋；进一步地，在下电镀槽631上两端分别设置两个过滤器642，下方对应设置两个循环泵，两个循环泵均从下电镀槽631中抽取电镀液并分别泵入两个过滤器642中，两个过滤器642分别对应一组喷流管路643，一组喷流管路643中的电镀液流向上喷淋管6222，另一组喷流管路643中的电镀液流向下喷流管，分流循环，且循环管道两端打入可以有效的提高药水的活性与均匀性，温度及液位都能保证一致，提高设备做板的品质。
进一步地，上电镀槽621和下电镀槽631均安装在电镀槽架61上，且电镀槽架61下设置有接水盘611，上电镀槽621和下电镀槽631均均在接水盘611上方，防止有电镀液流出，造成污染。
本发明电镀设备，通过循环喷淋设计已经上下小钛板阳极导电设计，配合分流循环的管路系统，有效提高电镀均匀性效果，减少电镀差异，提高电镀质量。
以上所述实施例仅是为充分说明本发明而所举的较佳的实施例，本发明的保护范围不限于此。本技术领域的技术人员在本发明基础上所作的等同替代或变换，均在本发明的保护范围之内。本发明的保护范围以权利要求书为准。
Claims (10)
- 一种阴极导电装置，其特征在于：包括：导电段机架；上导电槽组件，包括上导电槽以及安装在上导电槽内的导电滚轮组，所述上导电槽设置在所述导电段机架上，其中，所述上导电槽内注有液体，所述导电滚轮组浸泡在所述液体中；下导电槽组件，包括下导电槽，所述下导电槽承接所述上导电槽，所述上导电槽内的液体能够流入所述下导电槽；循环供液管路，分别连接上导电槽和下导电槽，其将进入下导电槽的液体循环注入所述上导电槽内。
- 如权利要求1所述的一种阴极导电装置，其特征在于：所述上导电槽内设置有内槽和外槽，所述内槽底部设置有进水口，所述进水口与所述循环供液管路连通；所述内槽两侧相对设置有第一传送孔；所述内槽内注有所述液体，所述导电滚轮组设置在所述内槽内；所述第一传送孔一侧的所述外槽底部设置有出水孔，所述出水孔与所述下导电槽连通。
- 如权利要求2所述的一种阴极导电装置，其特征在于：所述内槽底部设置有进水导盒，所述进水导盒扣设在所述进水口上，所述进水导盒两侧对称设置有若干进水孔；所述出水孔下方的所述上导电槽上设置有导流盒，所述导流盒与所述下导电槽连通；所述内槽上设置有导电槽内盖。
- 如权利要求2所述的一种阴极导电装置，其特征在于：所述第一传送孔一侧的内槽上设置有浸泡挡水滚轮组；所述第一传送孔一侧的外槽上设置有水洗挡水滚轮组；所述浸泡挡水滚轮组和水洗挡水滚轮组均包括相对设置的挡水滚轮和传送下滚轮，所述传送下滚轮一端连接有第一传送机构；所述第一传送机构包括驱动装置和主传动轴，所述主传动轴穿过所述上导电槽的中心位置处通过链轮连接所述驱动装置；所述主传动轴上设置有若干主传动齿轮，所述传送下滚轮一端设置有正斜齿轮，所述主传动齿轮与所述正斜齿轮一一对应啮合；所述上导电槽两侧设置有第二传送孔，所述第二传送孔与所述第一传送孔对应设置，所述第二传送孔一侧的所述外槽上设置有吸水海绵轮。
- 如权利要求2所述的一种阴极导电装置，其特征在于：所述上导电槽上设置有阴极连接机构，所述阴极连接机构包括钛包铜阴极杆和若干连接在所述钛包铜阴极杆上的第一阴极铜排；所述导电滚轮组包括若干并排设置的导电滚轮，所述导电滚轮一端通过导电连接轴与所述第一阴极铜排一一对应连接。
- 如权利要求1-5任一项所述的一种阴极导电装置，其特征在于：所述下导电槽连接有进水阀组；所述下导电槽底部连通设置有过滤桶，所述过滤桶连接所述循环供液管路；所述下导电槽内对应承接所述上导电槽处设有导流板；所述下导电槽上设有液位检测装置；所述循环供液管路包括循环泵和管路，所述循环泵通过管路分别连接所述上导电槽和所述下导电槽。
- 一种电镀设备，其特征在于：包括如权利要求1-7中任一项所述的阴极导电装置和电镀槽，所述阴极导电装置与所述电镀槽能够对接传送电镀件。
- 如权利要求7中所述的一种电镀设备，其特征在于：所述电镀槽上设置有整流机组和阴极杆，所述阴极杆连接所述阴极导电装置，所述整流机组包括若干阳极铜排和若干第二阴极铜排，所述阳极铜排连接至所述电镀槽内部，所述第二阴极铜排连接所述阴极杆。
- 如权利要求7中所述的一种电镀设备，其特征在于：所述电镀槽包括：电镀槽架；上电镀槽组件，设置在所述电镀槽架上，其包括上电镀槽、设置在所述上电镀槽内的电镀组件和第二传送机构，所述电镀组件通过电镀液对电镀件进行电镀，所述第二传送机构用于对电镀件进行传送；下电镀槽组件，包括下电镀槽，所述下电镀槽承接所述上电镀槽，所述上电镀槽内的电镀液能够进入所述下电镀槽；电镀液循环管路，分别连接所述上电镀槽和下电镀槽，其将进入下电镀槽的电镀液循环注入所述上电镀槽。
- 如权利要求9中所述的一种电镀设备，其特征在于：所述上电镀槽设置有若干分槽，所述分槽与分槽之间连通，所述分槽内均设有若干电镀组件，所述电镀组件包括上下双层设置的阳极钛板和喷淋管，电镀件穿过上下双层设置的阳极钛板之间，所述阳极钛板上设置有避让孔，所述喷淋管对应所述避让孔设置，所述阳极钛板上套设有阳极袋；喷淋管包括上喷淋管和下喷淋管，所述上喷淋管设置在上层的阳极钛板的上方，所述下喷淋管设置在下层的阳极钛板的下方。
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4459183A (en) * | 1981-10-07 | 1984-07-10 | Chemcut Corporation | Electroplating apparatus and method |
| CN203923419U (zh) * | 2014-06-19 | 2014-11-05 | 亚智系统科技(苏州)有限公司 | 一种适用于rtr阴极导电轮防上铜结晶的电镀设备 |
| CN105143522A (zh) * | 2013-01-16 | 2015-12-09 | 印可得株式会社 | 连续镀敷装置及连续镀敷方法 |
| CN109778288A (zh) * | 2019-02-19 | 2019-05-21 | 昆山科比精工设备有限公司 | 一种卷对卷水平电镀槽装置 |
| CN114318482A (zh) * | 2022-01-11 | 2022-04-12 | 昆山鑫美源电子科技有限公司 | 一种超薄集流体的生产加工系统和生产加工方法 |
| CN114790564A (zh) * | 2022-04-29 | 2022-07-26 | 东莞市佳凡智能科技有限公司 | 带有退镀功能的电镀装置 |
| CN115074795A (zh) * | 2022-08-19 | 2022-09-20 | 昆山科比精工设备有限公司 | 一种阴极导电装置及电镀设备 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2227660Y (zh) * | 1995-07-15 | 1996-05-22 | 于三江 | 作圆运动的电镀阴极移动装置 |
| KR20000024785A (ko) * | 1998-10-01 | 2000-05-06 | 이구택 | 전도롤의 도금방지장치 |
| TW409726U (en) * | 1999-05-18 | 2000-10-21 | Process Automation Int Ltd | Conductance, cover protecting and anti-infiltration device of conductance roller |
| CN2507871Y (zh) * | 2001-12-04 | 2002-08-28 | 亚智科技股份有限公司 | 防止导电滚轮被电镀装置 |
| CN209194097U (zh) * | 2018-07-18 | 2019-08-02 | 惠州市捷成机电设备股份有限公司 | 一种水平连续电镀装置 |
| CN108624943A (zh) * | 2018-07-18 | 2018-10-09 | 惠州市捷成机电设备有限公司 | 一种水平连续电镀装置及其制备方法 |
| CN112663119B (zh) * | 2020-12-04 | 2022-05-31 | 重庆金美新材料科技有限公司 | 一种防止导电辊镀铜的装置及方法 |
| CN214782230U (zh) * | 2021-05-08 | 2021-11-19 | 方伟 | 一种阴极导电压紧式传送滚轮水平镀铜装置 |
-
2022
- 2022-08-19 CN CN202211000142.9A patent/CN115074795B/zh active Active
-
2023
- 2023-04-18 WO PCT/CN2023/088861 patent/WO2024037008A1/zh unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4459183A (en) * | 1981-10-07 | 1984-07-10 | Chemcut Corporation | Electroplating apparatus and method |
| CN105143522A (zh) * | 2013-01-16 | 2015-12-09 | 印可得株式会社 | 连续镀敷装置及连续镀敷方法 |
| CN203923419U (zh) * | 2014-06-19 | 2014-11-05 | 亚智系统科技(苏州)有限公司 | 一种适用于rtr阴极导电轮防上铜结晶的电镀设备 |
| CN109778288A (zh) * | 2019-02-19 | 2019-05-21 | 昆山科比精工设备有限公司 | 一种卷对卷水平电镀槽装置 |
| CN114318482A (zh) * | 2022-01-11 | 2022-04-12 | 昆山鑫美源电子科技有限公司 | 一种超薄集流体的生产加工系统和生产加工方法 |
| CN114790564A (zh) * | 2022-04-29 | 2022-07-26 | 东莞市佳凡智能科技有限公司 | 带有退镀功能的电镀装置 |
| CN115074795A (zh) * | 2022-08-19 | 2022-09-20 | 昆山科比精工设备有限公司 | 一种阴极导电装置及电镀设备 |
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