WO2024036975A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2024036975A1
WO2024036975A1 PCT/CN2023/084831 CN2023084831W WO2024036975A1 WO 2024036975 A1 WO2024036975 A1 WO 2024036975A1 CN 2023084831 W CN2023084831 W CN 2023084831W WO 2024036975 A1 WO2024036975 A1 WO 2024036975A1
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WO
WIPO (PCT)
Prior art keywords
light
signal
combiner
sub
optical
Prior art date
Application number
PCT/CN2023/084831
Other languages
English (en)
French (fr)
Inventor
慕建伟
吴涛
朱彦军
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202222164722.3U external-priority patent/CN218547061U/zh
Priority claimed from CN202210980557.0A external-priority patent/CN117631162A/zh
Priority claimed from CN202210979652.9A external-priority patent/CN117631161A/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2024036975A1 publication Critical patent/WO2024036975A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the field of communication technology, and in particular, to an optical module.
  • optical communication technology optical modules are tools for realizing mutual conversion of photoelectric signals and are one of the key components in optical communication equipment.
  • the transmission rate of optical modules continues to increase.
  • An optical module includes: a circuit board provided with a mounting hole; a light emitting component electrically connected to the circuit board for emitting multiple signal lights of different wavelengths; wherein the light emitting component includes: a transmitting base, Installed in the mounting hole; a plurality of light emitting chips, arranged in the emitting base, electrically connected to the circuit board, used to generate multiple signal lights of different wavelengths; a combiner, arranged in the emitting base On the base, located in the light emission direction of the signal light, it is used to combine the signal light of different wavelengths into a first sub-signal beam and a second sub-signal beam. The signal light wavelengths in the first sub-signal beam are not adjacent.
  • the signal light wavelengths in the second sub-signal beam are not adjacent; and a polarization combiner, arranged on the launch base, located in the light emission direction of the combiner, used to pair the first sub-signal beam
  • the signal beam is rotated in the polarization direction, and the rotated first sub-signal beam and the second sub-signal beam are combined into a composite signal beam
  • the launch base is provided with a first mounting surface and a second mounting surface, wherein , the height of the first mounting surface is lower than the height of the second mounting surface, wherein the light-emitting chip is mounted on the first mounting surface, and the combiner and polarization combiner are mounted on the second mounting surface.
  • Figure 1 is a connection diagram of an optical communication system according to some embodiments.
  • Figure 2 is a structural diagram of an optical network terminal according to some embodiments.
  • Figure 3 is a structural diagram of an optical module according to some embodiments.
  • Figure 4 is an exploded view of an optical module according to some embodiments.
  • Figure 5 is a partial view of an optical module according to some embodiments.
  • Figure 6 is a partial view 2 of an optical module according to some embodiments.
  • Figure 7 is a schematic diagram of the disassembled structure of the optical transceiver component and circuit board shown in Figure 5;
  • Figure 8 is a schematic structural diagram of a light emitting component according to some embodiments.
  • Figure 9 is a schematic structural diagram 2 of a light emitting component according to some embodiments.
  • Figure 10 is a schematic structural diagram of a launch base according to some embodiments.
  • Figure 11 is a schematic structural diagram of a power transmitting component according to some embodiments.
  • Figure 12 is an optical path diagram 1 of a light emitting component according to some embodiments.
  • Figure 13 is an optical path diagram 2 of a light emitting component according to some embodiments.
  • Figure 14 is a schematic structural diagram of a first combiner according to some embodiments.
  • Figure 15 is a schematic structural diagram of another first combiner according to some embodiments.
  • Figure 16 is a schematic diagram of an optical path of a first polarization combiner according to some embodiments.
  • Figure 17 is a schematic diagram of an optical path of a second first polarization combiner according to some embodiments.
  • Figure 18 is a schematic structural diagram of a circuit board in an optical module according to some embodiments.
  • Figure 19 is a schematic structural diagram of a launch base in an optical module according to some embodiments.
  • Figure 20 is a partially exploded schematic diagram of a light emitting component in an optical module according to some embodiments.
  • Figure 21 is a partial top view of a light emitting component in an optical module according to some embodiments.
  • Figure 22 is a schematic structural diagram of a launch base in an optical module according to some embodiments.
  • Figure 23 is a schematic diagram 2 of the structure of a launch base in an optical module according to some embodiments.
  • Figure 24 is a schematic structural view three of a launch base in an optical module according to some embodiments.
  • Figure 25 is a partial assembly diagram of a circuit board and a launch base in an optical module according to some embodiments.
  • Figure 26 is a schematic diagram 4 of the structure of a launch base in an optical module according to some embodiments.
  • Figure 27 is a cross-sectional view of the assembly of a circuit board and a light-emitting component in an optical module according to some embodiments;
  • Figure 28 is a schematic second structural diagram of a light emitting component in an optical module according to some embodiments.
  • Figure 29 is a schematic structural diagram of a support plate in an optical module according to some embodiments.
  • Figure 30 is a side view of a light emitting component in an optical module according to some embodiments.
  • optical signals are used to carry information to be transmitted, and the optical signals carrying information are transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the transmission of information. Since light has passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by computers and other information processing equipment are electrical signals. Therefore, in order to distinguish between information transmission equipment such as optical fibers or optical waveguides and computers and other information processing equipment To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • Optical modules realize the mutual conversion function of the above-mentioned optical signals and electrical signals in the field of optical communication technology.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (for example, optical modem) through the electrical port.
  • the electrical connection Mainly used for power supply, I2C signal transmission, data information transmission and grounding; optical network terminals transmit electrical signals to computers and other information processing equipment through network cables or wireless fidelity technology (Wi-Fi).
  • Figure 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101 and a network cable 103.
  • the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200.
  • the optical fiber itself can support long-distance signal transmission, such as signal transmission of thousands of meters (6 kilometers to 8 kilometers). On this basis, if a repeater is used, unlimited distance transmission can be theoretically achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers, or hundreds of kilometers.
  • the local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to access the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101;
  • the electrical port is configured to access the optical network terminal 100, so that The optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100 .
  • the optical module 200 realizes mutual conversion between optical signals and electrical signals, thereby establishing an information connection between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100.
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101. Since the optical module 200 is a tool for converting optical signals and electrical signals and does not have the function of processing data, the information does not change during the above-mentioned photoelectric conversion process.
  • the optical network terminal 100 includes a substantially rectangular parallelepiped housing, and an optical module interface 102 and a network cable interface 104 provided on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 Establish a two-way electrical signal connection.
  • the optical module 200 and the network cable 103 are connected through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the electrical signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100 serves as the host computer of the optical module 200 and can monitor the optical module. 200 job.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT), etc.
  • the remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.
  • Figure 2 is a structural diagram of an optical network terminal according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100, Figure 2 only shows the parts of the optical network terminal 100 related to the optical module 200. structure. As shown in Figure 2, the optical network terminal 100 also includes a circuit board 105 provided in the housing, a cage 106 provided on the surface of the circuit board 105, a heat sink 107 provided on the cage 106, and electrical connections provided inside the cage 106. device.
  • the electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has fins and other protrusions that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the optical module 200 is fixed by the cage 106.
  • the heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection.
  • the optical module 200 The optical port is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.
  • Figure 3 is a structural diagram of an optical module according to some embodiments.
  • Figure 4 is an exploded view of an optical module according to some embodiments.
  • the optical module 200 includes a shell, a circuit board 300 and optical transceiver components disposed in the shell.
  • the housing includes an upper housing 201 and a lower housing 202.
  • the upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings; the outer contour of the housing generally presents a square body.
  • the lower case 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and arranged perpendicularly to the bottom plate; the upper case 201 includes a cover plate, and the cover plate covers the two bottom plates of the lower case. lower side plate to form the above-mentioned housing.
  • the lower shell 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the upper shell 201 includes a cover plate and two lower side plates located on both sides of the cover plate and perpendicular to the cover plate. The two upper side plates are combined with the two lower side plates to realize that the upper housing 201 is covered on the lower housing 202.
  • the direction of the connection line between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ).
  • the opening 204 is located at an end of the optical module 200 and the opening 205 is located at a side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger of the circuit board 300 extends from the electrical port 204 and is inserted into the host computer (for example, the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101 so that the external The optical fiber 101 connects the optical transceiver components inside the optical module 200 .
  • the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, optical transceiver components and other components into the housing, and the upper housing 201 and the lower housing 202 form packaging protection for these components.
  • the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, optical transceiver components and other components into the housing, and the upper housing 201 and the lower housing 202 form packaging protection for these components.
  • the deployment of positioning components, heat dissipation components, and electromagnetic shielding components of these components is facilitated, which is conducive to automated production.
  • the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.
  • the optical module 200 also includes an unlocking component located outside its housing.
  • the unlocking component is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixation between the optical module 200 and the host computer. connect.
  • the unlocking component is located on the outer walls of the two lower side panels of the lower housing 202 and has a snap component that matches the host computer cage (for example, the cage 106 of the optical network terminal 100).
  • the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging parts of the unlocking part.
  • the engaging parts of the unlocking part move accordingly, thereby changing the engaging parts.
  • the connection relationship with the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit wiring, electronic components and chips.
  • the electronic components and chips are connected together according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding.
  • Electronic components include, for example, capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET).
  • Chips include, for example, Microcontroller Unit (MCU), laser driver chip, limiting amplifier (limiting amplifier), clock and data recovery (Clock and Data Recovery, CDR) chip, power management chip, digital signal processing (Digital Signal Processing, DSP) chip.
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can smoothly carry the above-mentioned electronic components and chips; when the optical transceiver component is located on the circuit board, the rigid circuit board The circuit board can also provide smooth loading; the rigid circuit board can also be inserted into the electrical connector in the host computer cage.
  • the circuit board 300 also includes gold fingers formed on its end surface, and the gold fingers are composed of a plurality of mutually independent pins.
  • the circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by the gold finger.
  • the golden fingers can be provided only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or can be provided on the upper and lower surfaces of the circuit board 300 to adapt to situations where a large number of pins are required.
  • the golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.
  • flexible circuit boards are also used in some optical modules.
  • Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • a flexible circuit board can be used to connect the rigid circuit board and the optical transceiver component.
  • the optical transceiver component includes a light emitting component 400 and a light receiving component 500.
  • the light emitting component is configured to transmit an optical signal
  • the light receiving component is configured to receive an optical signal.
  • the light emitting component 400 and the light receiving component 500 may be independently disposed on the circuit board 300 .
  • the light emitting component 400 and the light receiving component 500 can also be combined together to form an integrated light transceiver component.
  • the light emitting component 400 and the light receiving component 500 may be located on the same side of the circuit board 300 to facilitate the connection between the light emitting component 400 and the light receiving component 500 with the data processor 301 through signal lines; according to some embodiments, the light emitting component 400 and the light receiving component 500 can be connected to the data processor 301 through signal lines; The transmitting component 400 and the light receiving component 500 can also be located on different sides of the circuit board 300.
  • the light transmitting component 400 is connected to the data processor 301 through the signal line on the front of the circuit board 300, and the light receiving component 500 passes through the signal line on the back of the circuit board 300.
  • the via is connected to the data processor 301.
  • the first light emitting component includes four light emitting chips to achieve the emission of four emitting beams
  • the second light emitting component includes four light emitting chips to achieve the emitting of four emitting beams.
  • the first light receiving component includes four light receivers to receive four receiving light beams; the second light receiving component includes four light receivers to receive four receiving light beams.
  • a multi-wave combining communication method is adopted, that is, multiple groups of signal lights of different wavelengths are combined into a composite beam.
  • the signal light is sent through single-mode optical fiber.
  • four-wave combining is usually used for communication, that is, four wavelengths of signal light are combined into a composite signal light.
  • multi-channel or multi-wavelength optical fiber transmission systems especially in O-band transmission systems, since the optical signal is near the zero-dispersion wavelength, the four-wave mixing effect is particularly obvious.
  • the crosstalk caused by four-wave mixing will severely limit the power of the optical signal entering the fiber, causing the system to be unable to meet the dynamic power requirement of 30km transmission.
  • the single-channel transmission rate increases to 200G, the situation will become more serious.
  • Four-Wave Mixing is a nonlinear effect caused by the dependence of the refractive index on the intensity of optical power (external electric field).
  • Four-wave mixing is an intermodulation phenomenon in which the interaction between three wavelengths produces a fourth wavelength.
  • WDM Wide Wavelength Division Multiplexing
  • the intensity dependence of the refractive index not only causes a phase shift within the channel, but also generates signals at new frequencies, such as 2 ⁇ i- ⁇ j and ⁇ i+ ⁇ j- ⁇ k.
  • Four-wave mixing depends on channel power, channel spacing and fiber dispersion. Reducing the channel spacing will increase the four-wave mixing effect, and reducing dispersion will also increase. Therefore, the effects of four-wave mixing must be considered when channels are closely spaced and/or low dispersion or dispersion shifted fiber is used.
  • the wavelengths corresponding to the optical signals of multiple wavelengths are required to have a certain spacing, that is, lasers with too dense wavelengths cannot be used to transmit optical signals, thus limiting the further improvement of the transmission rate.
  • the present disclosure provides a light emitting component that combines two signal lights with non-adjacent center wavelengths of four different wavelengths into one to form two sub-signal beams, and then uses a polarization device to convert one of the sub-signal beams into one beam. The polarization direction of the signal beam is rotated by a certain angle. The rotated sub-signal beam is combined with another sub-signal beam into a composite signal light.
  • the polarization directions of adjacent signal lights with central wavelengths in the composite signal light differ by 70°-120°. °, making the polarization directions of signal lights with adjacent center wavelengths approximately orthogonal, thereby reducing the four-wave mixing effect, which can further reduce the wavelength interval of adjacent optical signals and increase the optical signal transmission speed of the optical module.
  • Figure 5 is a partial view of an optical module according to some embodiments.
  • Figure 6 is a partial view of an optical module according to some embodiments.
  • Figure 7 is a schematic diagram of the split structure of the optical transceiver component and the circuit board shown in Figure 5.
  • Figures 5 and 6 show the structures of optical transceiver components and circuit boards from different angles.
  • a data processing chip is provided on the upper surface of the circuit board 300 in the optical module, which receives the high-frequency signal transmitted from the gold finger and processes it. The processed signal is transmitted to the laser driver chip.
  • the circuit board is provided with through-mounting holes for installing and fixing the launch base 410 .
  • the light emitting chip 401 of the light emitting component 400 is provided on the emitting base 410.
  • the electrical connection between the circuit board 300 and the light-emitting chip 401 is achieved through wire bonding.
  • the output optical port of the light emitting component 400 is connected to the optical fiber adapter 600 through an internal optical fiber, so that the signal light emitted by the light emitting component 400 is emitted through the internal optical fiber.
  • the light receiving component 500 is disposed on one side of the mounting hole 302.
  • the external optical signal transmitted by the fiber optic adapter 600 is transmitted to the light receiving component 500 through the internal optical fiber.
  • the light receiving component 500 converts the optical signal into an electrical signal, and the electrical signal passes through the surface of the circuit board 300.
  • the laid signal lines are transmitted to the data processor 301, the electrical signals are processed by the data processor 301, and the processed electrical signals are transmitted to the host computer through the golden finger.
  • the launch base 410 includes a first bottom plate 411, a support plate 412 and a second bottom plate 413.
  • the first bottom plate 411 and the second bottom plate 413 are parallel to the circuit board 300.
  • the support plate 412 is disposed between the first bottom plate 411 and the second bottom plate 413. and approximately perpendicular to the circuit board 300 .
  • the upper surface of the first base plate 411 is fixedly connected to the lower surface of the circuit board.
  • the upper surface of the first bottom plate 411 is connected to the lower surface of the support plate 412, and the upper surface of the support plate 412 is connected to the lower surface of the second bottom plate 413, so that the launch base 410 is arranged in a stepped manner.
  • the upper surfaces of the two bottom plates 413 are not on the same plane.
  • the second bottom plate 413 protrudes from the circuit board 300 so that the lower surface of the second bottom plate 413 is fixedly connected to the upper surface of the circuit board to achieve stability of the overall structure of the optical module. That is, the height difference between the lower surface of the second bottom plate 413 and the upper surface of the first bottom plate 411 is equal to the thickness of the circuit board 300 .
  • the side surfaces of the support plate 412 are fixedly connected to the inner wall of the mounting hole.
  • the width of the supporting plate 412 is not greater than the width of the mounting hole, and the width of the second bottom plate 413 is not greater than the width of the supporting plate 412 .
  • the second base plate 413 and the support plate 412 are passed through the circuit board 300 through the installation holes.
  • the width of the first bottom plate 411 is greater than the width of the mounting hole, so that the first bottom plate 411 is located on the lower surface of the circuit board 300 and the second bottom plate is located on the upper surface of the circuit board.
  • the light emitting component includes a transmitting base 410 and a plurality of light emitting chips 401 arranged on the transmitting base 410, a plurality of collimating lenses 402, a translation prism 403, a first combiner 4041, a second combiner 4042, and a first polarizer.
  • the installation height of the light-emitting chip, the collimating lens and the translation prism is lower than that of the first combiner, the second combiner 4042, the first polarization combiner 4051 and the second polarization combiner. 4052. Installation height of the first optical fiber coupler 4071 and the second optical fiber coupler 4072.
  • Figure 8 is a schematic structural diagram of a light emitting component according to some embodiments.
  • Figure 9 is a schematic structural diagram of a light emitting component according to some embodiments.
  • Figures 8 and 9 illustrate the light emitting component from different angles. exhibit.
  • Figure 10 is a schematic structural diagram of a launch base according to some embodiments.
  • a partial area of the upper surface of the first bottom plate 411 is recessed downward to form a first groove 4111 for carrying the radiation component.
  • the support plate 412 is disposed on one side of the first groove 4111.
  • a lens platform 4121 protruding from the side wall of the support plate 412 is provided on the side of the support plate 412 for carrying the translation prism array.
  • the width of the first groove is greater than the width of the support plate 412 and less than the width of the first bottom plate 411 .
  • the portion located around the first groove 4111 and higher than the first groove 4111 is fixedly connected to the lower surface of the circuit board.
  • the first base plate 411 and the circuit board 300 can be connected and fixed through solid glue or UV glue.
  • FIG 11 is a schematic structural diagram of a power transmitting component according to some embodiments.
  • the emitting component includes: a first substrate 4201, a semiconductor refrigerator 420, a second substrate 4202, a third substrate 4203, a COC structure array 430, a collimating lens 402, and a fourth substrate.
  • the semiconductor refrigerator 420 is located above the first substrate 4021.
  • the semiconductor refrigerator 420 is also provided with a conductive pillar 4181, which is electrically connected to the circuit board to power the semiconductor refrigerator.
  • the mounting hole 302 is also provided with a conductive pillar avoidance portion 303 for installation avoidance of the conductive pillar.
  • the COC structure array includes a plurality of COC structures, including: a first ceramic conductive substrate, a light-emitting chip and a photodetector disposed on the surface of the first ceramic substrate.
  • the upper surface of the first ceramic conductive substrate is provided with conductive traces, which are connected to the signal lines on the circuit board to drive the light emitting chip and the photodetector on the upper surface of the first ceramic conductive substrate.
  • the upper surface of the first ceramic conductive substrate and the upper surface of the circuit board are in the same plane.
  • the signal lines on the circuit board are connected to the conductive traces on the upper surface of the first ceramic conductive substrate through wire bonding.
  • the first substrate 4021 is located inside the first groove, so that the upper surface of the first ceramic conductive substrate is flush with the upper surface of the circuit board.
  • the second substrate 4022 is disposed above the semiconductor refrigerator to provide a precise platform for the COC structure array and the collimating lens.
  • the third substrate is located above the second substrate and provides a precise platform for the COC structure array.
  • the collimating lens array is located on the upper surface of the fourth substrate and is located on the light output path of the COC structure array, and is used to convert the signal light emitted by the light emitting chip from divergent light into parallel light.
  • the number of COC structures in the COC structure array can be set as needed.
  • the number of COC structures in the COC structure array is 8.
  • the corresponding setting consists of 8 light-emitting chips, divided into two light-emitting components.
  • the first light-emitting component The components include a first light emitting chip, a second light emitting chip, a third light emitting chip and a fourth light emitting chip.
  • the central wavelengths of the signal lights emitted by the first light-emitting chip, the second light-emitting chip, the third light-emitting chip and the fourth light-emitting chip are different.
  • the wavelength of the first signal light emitted by the first light emitting chip is ⁇ 1; the wavelength of the first signal light emitted by the second light emitting chip is ⁇ 2; the wavelength of the second signal light emitted by the third light emitting chip is ⁇ 3; the fourth The wavelength of the fourth signal light emitted by the light-emitting chip is ⁇ 4; the values of ⁇ 1, ⁇ 2, ⁇ 3 and ⁇ 4 are different.
  • the values of ⁇ 1, ⁇ 2, ⁇ 3 and ⁇ 4 can be 1331nm, 1311nm, 1291nm, 1271nm; or they can be 1271nm, 1291nm, 1311nm, 1331nm, or 1331nm, 1291nm, 1271nm1311nm; or other different wavelength values.
  • the translation prism array is carried on the lens platform 4121.
  • the translation prism array is used to translate the parallel light passing through the collimating lens to a certain height, and to lift the emitted signal light above the second bottom plate 413 .
  • the translation prism array includes one or more translation prisms.
  • the translation prism array includes 4 translation prisms, corresponding to the four light emitting chips one by one.
  • FIG. 12 is a first optical path diagram of a light emitting component according to some embodiments
  • FIG. 13 is a second optical path diagram of a light emitting component according to some embodiments.
  • the function of the translational prism array is to translate the light beam upward by a certain distance so that all subsequent optical devices are located on the front side of the circuit board and maintain an appropriate gap with the circuit board. This avoids positional conflicts between the optical device and the circuit board, thereby minimizing the hole-digging area of the circuit board, increasing the arrangement area of the electronic devices on the circuit board, and making the wiring of the circuit board easier.
  • a first reflective mirror surface and a second reflective mirror surface that are parallel to each other are arranged in the translation prism, and the normal line of the first emitting mirror surface is 45° to the incident direction of the light.
  • the emitted signal light is reflected by the first After specular reflection, it changes from parallel to the upper surface of the circuit board to perpendicular to the upper surface of the circuit board. Then, after reflection from the second reflecting mirror, it is converted from being perpendicular to the upper surface of the circuit board to being parallel to the upper surface of the circuit board. Only the height of the optical axis changes before and after the emitted signal light passes through the translation prism.
  • the first reflective mirror surface and the second reflective mirror surface are total reflection films, which reflect all the signal light emitted by the light emitting chip.
  • the second bottom plate 413 is provided with a first combiner 4041 and a first polarization combiner 4051.
  • the first combiner 4041 is provided between the polarization combiner and the translation prism array, and is used to combine the received four wavelengths.
  • the signal light is combined into two sub-signal beams, and the sub-signal beams contain two signal lights with non-adjacent wavelengths. For example: when the values of ⁇ 1, ⁇ 2, ⁇ 3 and ⁇ 4 are 1331nm, 1311nm, 1291nm and 1271nm, the first sub-signal beam contains ⁇ 1 and ⁇ 3; the second sub-signal beam contains ⁇ 2 and ⁇ 4.
  • the first combiner 4041 is provided with four light inlets for receiving four transmitted signal lights of different wavelengths, and is provided with two light outlets for emitting two combined sub-signal lights.
  • the first polarization combiner 4051 receives two sub-signal beams and rotates the polarization direction of one of the sub-signal beams at a certain angle, and then merges them into a composite signal light.
  • the first polarization combiner 4051 is provided with two light entrances, which receive the second sub-signal beam and the second sub-signal beam respectively.
  • the first light entrance for receiving the first sub-signal beam is provided with a 1/2 wave plate. , rotating the polarization direction of the first sub-signal beam by approximately 70° to 120°.
  • the first polarization combiner 4051 is provided with a third reflective mirror and a fourth reflective mirror arranged parallel to each other.
  • the third reflective mirror is located on the optical path of the first sub-signal beam and will deflect The subsequent first sub-signal beam is reflected to the fourth reflecting mirror.
  • the fourth reflective mirror reflects the light in the first sub-signal beam and transmits the light in the second sub-signal beam.
  • the first sub-signal beam and the second sub-signal beam combine to form a composite signal beam after passing through the fourth reflective mirror.
  • the first polarization combiner 4051 is provided with a light exit port, which is located on the light exit path of the fourth reflective mirror, and the composite signal beam is emitted through the light exit port.
  • the polarization direction of the first sub-signal light beam may be rotated, for example, by 85° to 95°, for example, by 90°.
  • the third reflecting mirror surface can transmit the light in the first sub-signal beam
  • the fourth reflecting mirror surface is located on the optical path of the second sub-signal beam, reflecting the second sub-signal beam to the third reflecting mirror surface, and then through Third reflection specular reflection.
  • the first sub-signal beam and the second sub-signal beam are combined to form a composite signal beam after passing through the third reflecting mirror.
  • the light exit port of the first polarization combiner 4051 is located on the light exit path of the third reflecting mirror, and the composite signal beam is emitted through the light exit port.
  • the first optical fiber coupler 4071 is disposed on the light outlet side of the first polarization combiner 4051.
  • the optical input end of the first optical fiber coupler 4071 is coupled to the optical output end of the first polarization combiner 4051.
  • the first optical fiber The optical output end of the coupler 4071 is connected to the first optical fiber adapter through an internal optical fiber. In this way, the composite light beam output by the first polarization combiner 4051 is coupled to the internal optical fiber through the first optical fiber coupler 4071, and then transmitted to the internal optical fiber through the internal optical fiber.
  • the first optical fiber adapter is used to realize the emission of a composite beam.
  • the first optical isolator 4061 can be disposed between the first polarization combiner 4051 and the first fiber coupler 4071.
  • the composite light beam emitted by the first polarization combiner 4051 is transmitted through the first fiber coupler 4071.
  • the first optical isolator is used to isolate the reflected beam to prevent the reflected beam from returning to the light emitting chip along the original path.
  • the composite beam may be reflected when transmitted to the light incident surface of the second optical fiber coupler 4072, and the reflected beam may return to the light emitting chip along the original path. , affecting the high-frequency performance of the light-emitting chip.
  • the second optical isolator 4062 can be disposed between the second polarization combiner 4052 and the second fiber coupler 4072.
  • the composite beam emitted by the second polarization combiner 4052 is transmitted through the second fiber coupler 4072.
  • the second optical isolator 4062 is used to isolate the reflected beam to prevent the reflected beam from returning to the light emitting chip along the original path.
  • the first optical fiber coupler 4071 may include a sleeve, a focusing lens and a first single-mode optical fiber flange.
  • the sleeve is placed outside the focusing lens and the first single-mode optical fiber flange, and the internal optical fiber is inserted into the first single-mode optical fiber flange.
  • the light incident surface of the focusing lens faces the first polarization combiner 4051 and the light exit surface faces the first single-mode fiber flange.
  • the composite beam output by the first polarization combiner 4051 passes through the first optical isolation
  • the optical fiber is transmitted to the focusing lens, which focuses the composite beam onto an internal optical fiber inserted within the first single-mode optical fiber flange.
  • the focusing lens is a cylindrical lens, and the outer diameter of the cylindrical lens and the first single-mode optical fiber flange can be slightly smaller than the inner diameter of the casing to ensure coupling between the focusing lens and the first single-mode optical fiber flange.
  • the focusing lens and the first single-mode optical fiber flange are inserted into the sleeve, in order to improve the coupling degree between the focusing lens and the first single-mode optical fiber flange, the focusing lens and the first single-mode optical fiber flange can only be moved axially.
  • the focusing lens protrudes outside the sleeve, reducing the distance between the light incident surface of the focusing lens and the light exit surface of the first optical isolator, so that The structure is more compact.
  • the upper surface of the second bottom plate 413 is provided with two load-bearing surfaces with different heights, that is, with height differences.
  • the height of the first load-bearing surface 4131 Higher than the height of the second bearing surface 4132.
  • the second carrying surface 4132 is used to carry and fix the first optical fiber coupler 4071 and the second optical fiber coupler 4072, and the first carrying surface 4131 is used to carry and fix the first combiner, the second combiner 4042, and the first polarization combiner. 4051, a second polarization combiner 4052, and if necessary a first isolator 4061 and a second isolator 4062.
  • the first substrate 4201 and the semiconductor refrigerator 420 need to be installed in the first groove 4111 of the first bottom plate 411, then the light-emitting chip is installed on the third substrate 4203, and then the light-emitting chip is installed on the third substrate 4203.
  • the transmitting chip and the third substrate are fixed on the semiconductor refrigerator, and then the translation prism is fixed on the lens platform 4121, and then the first combiner, the second combiner 4042, the first polarization combiner 4051, and the second polarization combiner are The combiner 4052, the first isolator 4061, the second isolator 4062, the first optical fiber coupler 4071 and the second optical fiber coupler 4072 are fixed on the bearing surfaces 4131 and 4132 according to the light emission direction. Finally, the collimating lens is fixed according to the light emission direction. The light emitting direction of the emitting chip is fixed on the fourth substrate, while the coupling efficiency in the optical fiber is detected and the position of the collimating lens is optimized.
  • integrated optical components can also be used to combine the first combiner 4041, the second combiner 4042, the first polarization combiner 4051, the second polarization combiner 4052, and the first isolator.
  • 4061, the second isolator 4062, the first optical fiber coupler 4071, the second optical fiber coupler 4072, two internal optical fibers and two optical fiber adapters are assembled into a pre-assembled assembly.
  • the semiconductor refrigerator 420 is fixed in the first recessed area 4111 of the first bottom plate 411, and then the light-emitting chip is installed on the light-emitting chip substrate, and then the light-emitting chip substrate is fixed on the semiconductor refrigerator 420, and then the translation prism is installed according to The light emission direction is fixed on the lens platform 4121, and then the pre-assembled parts are directly fixed on the bearing surfaces 4131 and 4132 of the emission base 410. Finally, the collimating lens is fixed on the fourth substrate according to the light emission direction of the light emission chip, and the third substrate is fixed on the lens platform 4121. The four substrates are fixed on the semiconductor refrigerator 420.
  • Figure 14 is a schematic structural diagram of a first combiner according to some embodiments.
  • the first combiner has four input
  • the light entrance port emits signal light of multiple wavelengths, and each light entrance port is used to inject signal light of one wavelength.
  • the ⁇ 1 signal light enters the first combiner through the first light entrance and passes through the first combiner.
  • the ⁇ 2 signal light enters the first combiner through the second light entrance port and undergoes four different reflections at four different locations in the first combiner.
  • the ⁇ 3 signal light enters the first combiner through the third light entrance and is transmitted to the first light outlet; the ⁇ 4 signal light enters the first combiner through the fourth light entrance. Directly transmitted to the light outlet.
  • the incident signal light of four wavelengths is combined into two sub-signal light beams through the first combiner, and the wavelengths of the signal light in each sub-signal light beam are not adjacent.
  • the first light beam emitted from the first light outlet is
  • the sub-signal beam includes a first signal light with a wavelength of ⁇ 1 and a third signal light with a wavelength of ⁇ 3.
  • the second sub-signal beam emitted from the second light outlet includes a second signal light with a wavelength of ⁇ 2 and a fourth signal with a wavelength of ⁇ 4. Light.
  • the four light entrances of the first combiner for incident signal light of multiple wavelengths are respectively provided with a first filter 40411, a third filter 40412, a fifth filter 40413 and a seventh filter 40414.
  • the light entrances The second filter plate 40415, the fourth filter plate 40416, the sixth filter plate 40417 and the eighth filter plate 40418 are provided on the opposite side.
  • the angle between the normal line of the first combiner and the incident optical axis is 8 to 12°.
  • the settings of each filter in the first combiner are: the first filter transmits ⁇ 1 and reflects signal light of other wavelengths; the second filter reflects ⁇ 1; the third filter transmits ⁇ 2 and ⁇ 1 reflects; the fourth filter reflects ⁇ 1 and ⁇ 2; the fifth filter transmits ⁇ 3 and reflects ⁇ 1 and ⁇ 2; the sixth filter transmits ⁇ 1 and ⁇ 3 and reflects ⁇ 2; the seventh filter transmits ⁇ 4 and reflects ⁇ 2 ; The eighth filter transmits ⁇ 2 and ⁇ 4. That is, the first filter is coated with a ⁇ 1 transmission film, and the second filter is coated with a ⁇ 1 reflection film. The third filter is provided with a ⁇ 2 transmission film and a ⁇ 1 reflection film.
  • the fourth filter is equipped with ⁇ 1 and ⁇ 2 reflective films
  • the fifth filter is equipped with ⁇ 3 transmission film and ⁇ 1 and ⁇ 2 reflective films.
  • the sixth filter is provided with ⁇ 1 and ⁇ 3 transmission films and a ⁇ 2 reflection film.
  • the seventh filter is provided with a ⁇ 4 transmission film and a ⁇ 2 reflection film.
  • the eighth filter is provided with ⁇ 2 and ⁇ 4 transmission films.
  • the ⁇ 1 signal light enters the first combiner through the first light entrance port, undergoes four different reflections at four different positions in the first combiner and reaches the first light exit port; the ⁇ 2 signal light enters through the second light entrance port The first combiner undergoes four different reflections at four different positions in the first combiner and reaches the second light outlet; the ⁇ 3 signal light enters the first combiner through the third light entrance and is transmitted to the third light outlet.
  • One light outlet; the ⁇ 4 signal light enters the first combiner through the fourth light entrance and is directly transmitted to the light outlet.
  • the polarization directions of the arrows ⁇ 1, ⁇ 2, ⁇ 3, and ⁇ 4 shown in the figure are parallel to the surface of the drawing paper (or parallel to the upper surface of the circuit board).
  • Figure 15 is a schematic structural diagram of another first combiner according to some embodiments.
  • the first combiner is provided with four light entrances for incident signal light of multiple wavelengths, and each light entrance is used for incident signal light of one wavelength.
  • the ⁇ 1 signal light enters the first combiner through the first light entrance, and passes through the first combiner.
  • the ⁇ 3 signal light enters the first combiner through the second light entrance port and undergoes two different reflections at four different positions in the first combiner.
  • the ⁇ 2 signal light enters the first combiner through the third light entrance, undergoes two different reflections at two different positions in the first combiner, and reaches the second Light exit port;
  • ⁇ 4 signal light enters the first combiner through the fourth light entrance port and is directly transmitted to the light exit port.
  • the incident signal light of four wavelengths is combined into two sub-signal light beams through the first combiner, and the wavelengths of the signal light in each sub-signal light beam are not adjacent.
  • the first light beam emitted from the first light outlet is The sub-signal beam includes ⁇ 1 and ⁇ 3, and the second sub-signal beam emitted from the second light outlet includes ⁇ 2 and ⁇ 4.
  • the first filter transmits ⁇ 1; the second filter reflects ⁇ 1; the third filter transmits ⁇ 3 and reflects ⁇ 1; the fourth filter Reflects ⁇ 1 and ⁇ 3; the fifth filter transmits ⁇ 2 and reflects ⁇ 1 and ⁇ 3; the sixth filter transmits ⁇ 1 and ⁇ 3 and reflects ⁇ 2; the seventh filter transmits ⁇ 4 and reflects ⁇ 2; the eighth filter transmits ⁇ 2 , ⁇ 4 transmission.
  • the first combiner can be set according to the arrangement of the light signals from the light-emitting chips in the light-emitting array. Other adjustments within a reasonable range will not be described here.
  • Figure 16 is a schematic diagram of the optical path of a first polarization combiner according to some embodiments.
  • the first polarization combiner 4051 is provided with two light entrances, which respectively receive the second sub-signal beam and
  • the first light entrance is equipped with a 1/2 wave plate, which rotates the polarization direction of the first sub-signal beam by about 90°, that is, from the original polarization direction parallel to the paper in the figure to perpendicular to the paper.
  • the polarization direction of the surface (from the polarization direction parallel to the upper surface of the circuit board, rotated to perpendicular to the upper surface of the circuit board).
  • the first polarization combiner 4051 is provided with a third reflective mirror 40511 and a fourth reflective mirror 40512 arranged parallel to each other.
  • the third reflective mirror 40511 is located on the optical path of the first sub-signal beam and deflects the deflected first sub-signal.
  • the light beam is reflected to the fourth reflecting mirror 40512.
  • the fourth reflective mirror reflects the light in the first sub-signal beam and transmits the light in the second sub-signal beam.
  • the first sub-signal beam and the second sub-signal beam combine to form a composite signal light after passing through the fourth reflective mirror.
  • the first polarization combiner 4051 is provided with a light outlet, which is located on the light outlet path of the fourth reflective mirror, and the composite signal light is emitted through the light outlet.
  • Figure 17 is a schematic diagram of the optical path of the second first polarization combiner according to some embodiments.
  • the first polarization combiner 4051 is provided with two light entrances to receive the second sub-signal beam respectively. and the second sub-signal beam.
  • the second light entrance is equipped with a 1/2 wave plate to rotate the polarization direction of the second sub-signal beam by approximately 90°, that is, from the original polarization direction parallel to the paper surface of the diagram to perpendicular to The polarization direction of the paper (from the polarization direction parallel to the upper surface of the circuit board, rotated to perpendicular to the upper surface of the circuit board).
  • the first polarization combiner 4051 is provided with a third reflective mirror 40511 and a fourth reflective mirror 40512 arranged parallel to each other.
  • the third reflective mirror 40511 is located on the optical path of the first sub-signal beam. Reflect the first sub-signal beam to the fourth reflecting mirror 40512.
  • the fourth reflective mirror reflects the light in the first sub-signal beam and transmits the light in the deflected second sub-signal beam.
  • the first sub-signal beam and the deflected second sub-signal beam pass through the fourth reflective mirror. and then recombine to form a composite signal light.
  • the first polarization combiner 4051 is provided with a light outlet, which is located on the light outlet path of the fourth reflective mirror, and the composite signal light is emitted through the light outlet.
  • the four light emitting chips in the COC structure array emit four different wavelengths of signal light, the first signal light, the second signal light, the third signal light and the fourth signal light: ⁇ 1, ⁇ 2, ⁇ 3 and ⁇ 4.
  • the collimating lens array is located on the output light path of the light-emitting chip and converts the signal light emitted by the light-emitting chip from divergent light into parallel light. Then, by translating the prism array 403, the emitted signal light is lifted above the second bottom plate 413.
  • a first combiner 4041 and a first polarization combiner 4051 are provided on the output optical path of the translation prism array. The first combiner 4041 is provided between the polarization combiner 4051 and the translation prism array, and is used to combine the four received signals.
  • the first polarization combiner 4051 receives two sub-signal beams and rotates the polarization direction of one of the sub-signal beams at a certain angle, and then merges them into a composite signal light. By combining two signal lights with non-adjacent center wavelengths of four different wavelengths into one, two sub-signal beams are formed, and then the polarization direction of one of the sub-signal beams is rotated by a certain angle through the polarization device.
  • the rotated sub-signal beam is combined with another sub-signal beam into a composite signal light.
  • the polarization directions of the signal lights with adjacent central wavelengths in the composite signal light differ by 70°-90°, so that the signal lights with adjacent central wavelengths
  • the polarization directions are approximately orthogonal, thereby reducing the four-wave mixing effect, which can further reduce the wavelength interval of adjacent optical signals and increase the optical signal transmission speed of the optical module.
  • the first optical fiber coupler 4071 is disposed on the light outlet side of the first polarization combiner 4051.
  • the optical input end of the first optical fiber coupler 4071 is coupled and connected to the optical output end of the first multiplexer.
  • the first optical fiber coupler The light output end of 4071 is connected to the first optical fiber adapter through an internal optical fiber.
  • the composite light beam output by the first polarization combiner 4051 is coupled to the internal optical fiber through the first optical fiber coupler 4071, and then transmitted to the first optical fiber through the internal optical fiber.
  • Fiber optic adapter to achieve the emission of composite beams.
  • Figure 18 is a schematic structural diagram of a circuit board in an optical module according to some embodiments.
  • the mounting hole 302 on the circuit board 300 includes a first side 3021, a second side 3022, a third side 3023, a fourth side 3024, a fifth side 3025 and a sixth side 3026.
  • the first side 3021 and The second side 3022 is located on the same side, and the first side 3021 protrudes from the second side 3022; the fourth side 3024 and the fifth side 3025 are located on the same side, and the fifth side 3025 protrudes from the fourth side 3024.
  • the first side 3021 is opposite to the fifth side 3025
  • the second side 3022 is opposite to the fourth side 3024
  • the third side 3023 is opposite to the sixth side 3026. Therefore, the first side 3021, the second side 3022, the third side 3023 and the sixth side 3026 are arranged oppositely.
  • the three side surfaces 3023 , the fourth side surface 3024 , the fifth side surface 3025 and the sixth side surface 3026 form the mounting hole 302 .
  • the length dimension of the first side 3021 is greater than the length dimension of the second side 3022
  • the length dimension of the fourth side 3024 is greater than the length dimension of the fifth side 3025
  • the length dimension of the first side 3021 is greater than the length dimension of the fifth side 3025 length size.
  • the distance between the first side 3021 and the fifth side 3025 is smaller than the distance between the first side 3021 and the fourth side 3024.
  • the distance between the side surfaces 3024 is smaller than the distance between the second side surface 3022 and the fourth side surface 3024 (ie, the width dimension of the third side surface 3023).
  • Figure 19 is a schematic structural view of the emitting base in the optical module according to some embodiments.
  • Figure 20 is a partially exploded schematic view of the light emitting component in the optical module according to some embodiments.
  • Figure 21 is a schematic diagram of the light emitting component in the optical module according to some embodiments.
  • the light emitting component 400 may include an emitting base 410a.
  • the emitting base 410a includes a base body 410a-1 and a boss 410a-2.
  • the boss 410a-2 is formed from the base body 410a-1.
  • the bottom surface 4107a extends toward the lower housing 202, and the boss 410a-2 is embedded in the mounting hole 302.
  • the launch base 410a also includes a launch cover 4101a, the base body 410a-1 forms an opening on one side toward the upper housing 201, and the launch cover 4101a is covered on the opening, so that the launch base 410a and the launch cover Plate 4101a forms the emission cavity.
  • a top surface 4103a is provided on the side of the base body 410a-1 facing the upper housing 201.
  • the assembly surface 4104a is recessed from the top surface 4103a; the installation groove 4105a is further recessed from the assembly surface 4104a to form an emission cavity of the light emitting component 400.
  • the emission cover 4101a when the emission cover 4101a is covered on the base body 410a-1, the emission cover 4101a is attached to the assembly surface 4104a, so that the emission cover 4101a and the base body 410a-1 are assembled together, so that the emission The cover plate 4101a and the launch base 410a form a launch chamber.
  • the emission cover 4101a is bonded to the assembly surface 4104a of the groove through glue, making it inconvenient to disassemble and assemble the emission cover 4101a.
  • a protruding plate 4102a is provided on one side of the launch cover 4101a, and the protruding plate 4102a extends from the side of the launch cover 4101a toward the direction of the data processor 301.
  • a notch 4106a is provided on the top surface 4103a.
  • the notch 4106a is connected with the assembly surface 4104a of the groove, and the position of the notch 4106a corresponds to the position of the protruding plate 4102a.
  • the mounting groove 4105a is provided with a plurality of light emitting chips 401a, a plurality of collimating lenses 402a, a combiner 404a, a polarization combiner 405a, an optical isolator 406a and an optical fiber coupler.
  • Chips 401a are arranged side by side in the mounting slot 4105a, aligned
  • the lens 402a is located in the light emitting direction of the light emitting chip 401a, and the collimating lens 402a is arranged in one-to-one correspondence with the light emitting chip 401a.
  • the front side of the circuit board 300 extends into the mounting slot 4105a of the emitting base 410a, and the wiring height of the light emitting chip 401a is equal to that of the front side of the circuit board 300.
  • the heights are the same to facilitate the connection between the light-emitting chip 401a and the circuit board 300 through wiring and reduce the length of the wiring.
  • Figure 22 is a schematic structural view 1 of a transmitting base in an optical module according to some embodiments
  • Figure 23 is a schematic structural view 2 of a transmitting base in an optical module according to some embodiments
  • Figure 24 is a schematic view 2 of a transmitting base in an optical module according to some embodiments Schematic diagram 3 of the structure of the launch base in the optical module.
  • the base body 410a-1 includes a bottom surface 4107a, which faces the lower housing 202, and the boss 410a-2 extends from the bottom surface 4107a in the direction of the lower housing 202 to increase emission.
  • the thickness dimension of the base 410a in the up and down direction.
  • the boss 410a-2 includes a first plane 4108a, a second plane 4109a, a connecting surface 4110a, a third plane 4112a, a fourth plane 4114a, a fifth plane 4117a and a sixth plane 4115a.
  • the first plane 4108a and the second plane 4109a are located at On the same side of the boss 410a-2, the second plane 4109a protrudes from the first plane 4108a, and the first plane 4108a is connected to the second plane 4109a through the connecting surface 4110a.
  • the fourth plane 4114a is the side opposite to the first plane 4108a and the second plane 4109a.
  • the third plane 4112a connects the first plane 4108a and the fourth plane 4114a, and the third plane 4112a faces the optical fiber adapter 600.
  • a through hole 4113a is provided on the third plane 4112a.
  • the through hole 4113a extends from the third plane 4112a to the direction of the fifth plane 4117a, and the through hole 4113a is connected with the installation groove 4105a to realize the connection between the internal optical fiber and the installation groove 4105.
  • the light emitting device is connected.
  • the fifth plane 4117a is opposite to the third plane 4112a, and an opening 4118a is provided on the fifth plane 4117a.
  • the circuit board 300 is inserted into the mounting slot 4105a through the opening 4118a.
  • the opening 4118a and the mounting groove 4105a are connected with the opening on the top surface 4103a to facilitate wiring connection between the light-emitting chip 401a in the mounting groove 4105a and the front surface of the circuit board 300.
  • the sixth plane 4115a is arranged opposite to the bottom surface 4107a, and the sixth plane 4115a is connected to the first plane 4108a, the second plane 4109a, the connecting surface 4110a, the third plane 4112a, the fourth plane 4114a, and the fifth plane 4117a, that is, the sixth plane 4115a is arranged opposite to the bottom surface 4107a.
  • Plane 4115a is the bottom surface of boss 410a-2.
  • Figure 25 is a partial assembly diagram of a circuit board and a launch base in an optical module according to some embodiments. As shown in Figure 25, when the launch base 410a is embedded in the mounting hole 302, the boss 410a-2 of the launch base 410a is inserted into the mounting hole 302, and the bottom surface 4107a abuts the front of the circuit board 300 to support and fix the launcher through the circuit board 300. Base 410a.
  • the first plane 4108a abuts the fifth side 3025
  • the second plane 4109a abuts the fourth side 3024
  • the fifth plane 4117a abuts the third side 3023
  • the fourth plane 4114a In contact with the first side 3021, the third plane 4112a and the sixth side 3026 can be in contact. There can also be a certain gap between the third plane 4112a and the sixth side 3026 to facilitate embedding the launch base 410a in the installation hole.
  • the front surface of the circuit board 300 is fixedly connected to the bottom surface 4107a of the launch base 410a, so that the circuit board 300 supports and fixes the launch base 410a, so as to fix the bottom surface 4107a of the launch base 410a to the circuit board 300. on the front.
  • FIG. 26 is a schematic diagram 4 of the structure of a launch base according to some embodiments
  • FIG. 27 is a cross-sectional view of the assembly of a circuit board and a light-emitting component in an optical module according to some embodiments.
  • the mounting groove 4105a includes a first mounting surface 4119a and a second mounting surface 4120a.
  • the first mounting surface 4119a is connected with the opening 4118a, and the first mounting surface 4119a is recessed in the second mounting surface 4120a. .
  • the first mounting surface 4119a is located below the back of the circuit board 300.
  • the first mounting surface 4119a is used to carry the power-emitting component.
  • the power-emitting component includes: a semiconductor refrigerator 420 and a substrate 430.
  • the bottom surface of the semiconductor refrigerator 420 is fixed on the first
  • the substrate 430 is fixed on the cooling surface of the semiconductor refrigerator 420
  • the light emitting chip 401a is disposed on the substrate 430, so as to increase the installation height of the light emitting chip 401a through the semiconductor refrigerator 420 and the substrate 430, so that the light emitting chip
  • the wiring height of 401a is flush with the front surface of the circuit board 300, so as to connect the front surface of the circuit board 300 and the light-emitting chip 401a through the wiring, thus reducing the length of the wiring.
  • the semiconductor refrigerator 420 is also used to control the temperature of the light-emitting chip 401a.
  • the heat generated by the operation of the light-emitting chip 401a is conducted to the semiconductor refrigerator 420 through the substrate 430, and then the heat is conducted through the semiconductor refrigerator 420. to the emitting base 410a, and then conduct the heat to the upper housing 201 and the lower housing 202 through the emitting base 410a to facilitate the heat transfer of the light emitting chip 401a and ensure the working temperature of the light emitting chip 401a.
  • the emitting base 410a In order to improve the heat dissipation efficiency of the light emitting chip 401a, the emitting base 410a needs to be made of tungsten copper or other metal materials with good thermal conductivity, and the mass and bottom area of the emitting base 410a need to be appropriately increased.
  • the substrate 430 is a COC substrate.
  • the upper surface of the COC substrate is provided with a light emitting chip 401a and a photodetector.
  • the upper surface of the COC substrate is also provided with conductive traces.
  • the conductive traces are in contact with the circuit board.
  • the signal lines on 300 are connected to realize the driving of the light emitting chip 401a and the photodetector.
  • the upper surface of the substrate 430 is in the same plane as the front surface of the circuit board 300.
  • the signal lines on the circuit board 300 are connected to the conductive traces on the upper surface of the substrate 430 through wiring.
  • the substrate 430 The conductive traces on the chip are electrically connected to the light-emitting chip 401a through wire bonding to drive the light-emitting chip 401a to generate optical signals.
  • the collimating lens 402a is arranged on the cooling surface of the semiconductor refrigerator 420, and the collimating lens 402a is arranged in one-to-one correspondence with the light emitting chip 401a. In this way, the light emitting chip 401a generates a light signal, and the light signal is converted by the collimating lens 402a. It is parallel light to collimate the divergent beam generated by the light emitting chip 401a.
  • the second mounting surface 4120a is provided with a glue dispensing groove 4121a and a relief groove 4122a.
  • the relief groove 4122a is located on the outer periphery of the glue dispensing groove 4121a to facilitate processing of the glue dispensing groove 4121a on the second mounting surface 4120a.
  • the combiner 404a is fixed on the second mounting surface 4120a through the dispensing groove 4121a, so as to fix the combiner 404a on the second mounting surface 4120a.
  • a glue injection groove 4123a is provided on the inner wall of the launch base 410a, and glue is injected into the glue dispensing groove 4121a through the glue injection groove 4123a to facilitate the injection of glue to fix the combiner 404a.
  • a fiber coupler is inserted into the through hole 4113a.
  • the light input end of the fiber coupler is opposite to the light output end of the combiner 404a.
  • the light output end of the optical fiber coupler is connected to the optical fiber adapter 600 through the internal optical fiber, so that the composite light output by the combiner 404a is coupled to the internal optical fiber through the optical fiber coupler, and then coupled to the optical fiber adapter 600 through the internal optical fiber, thereby realizing light emission.
  • the present disclosure also provides a polarization combiner 405a on the second mounting surface 4120a.
  • the polarization combiner 405a is formed by a combination of a filter and a half-wave plate; the polarization combiner 405a is located on Between the combiner 404a and the optical fiber coupler, while performing four-channel optical multiplexing operations, the polarization directions of adjacent optical channels are in an orthogonal state through the polarization combiner 405a, ultimately achieving the suppression of four-wave mixing. Thereby improving the signal transmission effect.
  • an optical isolator 406a may also be provided on the second mounting surface 4120a.
  • the optical isolator 406a is located between the combiner 404a and the optical fiber coupler to isolate the reflected light so that the reflected light cannot through optical isolator 406a.
  • a translation prism 403 may also be provided between the collimating lens 402a and the combiner 404a to translate the parallel light passing through the collimating lens to a certain height, thereby lifting the signal light emitted by the light emitting chip 401a.
  • One or more translation prisms can be provided to correspond to multiple light emitting chips one by one.
  • the semiconductor refrigerator 420 When assembling the light emitting component 400, it is necessary to first install the semiconductor refrigerator 420 on the first mounting surface 4119a of the emitting base 410a, then install a light emitting chip 401a on a substrate 430, and then fix the four substrates 430 side by side.
  • the dispensing groove 4121a is installed on the second mounting surface 4120a of the emission base 410a, and the four light entrances of the combiner 404a and the four collimating lenses 402a are arranged correspondingly, so that the four light emitting chips 401a emit different wavelengths.
  • the signal light is injected into the combiner 404a through the four light entrances; then the polarization combiner 405a is installed on the second mounting surface 4120a, and the two light output ports of the combiner 404a are connected to the two ends of the polarization combiner 405a.
  • the light entrances are arranged correspondingly, so that the first sub-signal beam output by the combiner 404a is injected into the polarization combiner 405a, and the second sub-signal beam output by the combiner 404a is injected into the polarization combiner through the half-wave plate 4051a.
  • the optical isolator 406a on the second mounting surface 4120a, so that the composite beam output by the polarization combiner 405a directly passes through the optical isolator 406a; then insert the optical fiber coupler 407a into the installation slot through the through hole 4113a
  • the light input end of the fiber coupler 407a is set correspondingly to the light outlet of the polarization combiner 405a, so that the composite light beam output by the polarization combiner 405a is coupled to the internal optical fiber and transmitted to the optical fiber adapter 600 via the internal optical fiber to achieve A multi-wave communication method.
  • the launch base 410a-2 of 410a is inserted into the mounting hole 302.
  • the front of the circuit board 300 is against the bottom surface 4107a of the base body 410a-1 to support and fix the launch base 410a through the circuit board 300; then connect the circuit board 300 through wiring and the light emitting chip 401a to drive the light emitting chip 401a to generate emitted light of different wavelengths.
  • the boss 410a-2 of the launch base 410a is inserted into the mounting hole 302, cover the launch cover 4101a on the assembly surface 4104a of the base body 410a-1, and insert the protruding plate 4102a on the launch cover 4101a into the base body 410a- In the gap 4106a of 1, in order to form an emission cavity through the emission cover 4101a and the emission base 410a, the semiconductor refrigerator 420, the substrate 430, the light emitting chip 401a, the collimating lens 402a, the combiner 404a, the polarization combiner 405a, The optical isolator 406a, the optical fiber coupler 407a, etc. are packaged in the emission cavity.
  • the boss 410a-2 of the emission base 410a can also be inserted into the mounting hole 302 first, and then the semiconductor refrigerator 420, the substrate 430, the light emitting chip 401a, the collimating lens 402a, the combiner 404a, and the polarization combiner can be inserted.
  • the waveguide 405a, the optical isolator 406a, the optical fiber coupler 407a, etc. are installed into the installation groove 4105a in the emission base 410a, and then the emission cover 4101a is covered on the emission base 410a to assemble the light emission component 400.
  • the structure of the emission base 410a in the light emitting component 400 is not limited to the above-mentioned structure, and may also be other structures.
  • FIG. 28 is a schematic structural diagram 2 of a light emitting component in an optical module according to some embodiments
  • FIG. 29 is a schematic structural diagram of a support plate in an optical module according to some embodiments.
  • the light emitting component 400 includes a support plate 410b, the top surface of which is parallel to the front surface of the circuit board 300; the circuit board 300 is provided with a mounting hole 302, and the support plate 410b is arranged on the installation surface. Below the hole 302, the top surface of the support plate 410b and the back surface of the circuit board 300 are bonded and fixed, thereby realizing the fixed assembly of the support plate 410b and the circuit board 300.
  • the support plate 410b includes a third mounting surface 4119b.
  • the third mounting surface 4119b is recessed in the top surface of the support plate 410b.
  • a semiconductor refrigerator 420 is installed on the third mounting surface 4119b.
  • the semiconductor refrigerators 420 are arranged side by side on the cooling surface.
  • a plurality of substrates 430 are provided, each of which is provided with a light emitting chip 401b; a plurality of collimating lenses 402b are also provided side by side on the cooling surface of the semiconductor refrigerator 420, each collimating lens 402b is located on each light emitting chip 401b. In the light emitting direction of the emission chip 401b.
  • the support plate 410b also includes a fourth mounting surface 4120b, which protrudes from the top surface of the support plate 410b, and a first limiting plate 4124b and a second limiting plate 4125b are provided on the fourth mounting surface 4120b.
  • a limiting plate 4124b is arranged opposite to the second limiting plate 4125b.
  • a combiner 404b is provided on the fourth mounting surface 4120b. The combiner 404b is located between the first limiting plate 4124b and the second limiting plate 4125b, and is opposed by the first limiting plate 4124b and the second limiting plate 4125b.
  • the combiner 404b is limited so that the four light input ports of the combiner 404b are arranged opposite to the four light emitting chips 401b. In this way, the emitted light of ⁇ 1, ⁇ 2, ⁇ 3, and ⁇ 4 emitted by the four light emitting chips 401b passes through the four light emitting chips 401b.
  • a light entrance enters the combiner 404
  • the combiner 404b has two light exit ports. One light exit port emits the first sub-signal beams of ⁇ 1 and ⁇ 3 with non-adjacent wavelengths, and the other light exit port emits the second sub-signal beams of ⁇ 2 and ⁇ 4 with non-adjacent wavelengths.
  • the fourth mounting surface 4120b is also provided with a polarization combiner 405b.
  • the polarization combiner 405b has two light entrances, and a half-wave plate 4051b is provided at one light entrance. These two light entrances are connected with the combiner.
  • the two light exit ports of 404b are arranged oppositely, so that the first sub-signal beam emitted from one light exit port of the combiner 404b is injected into the polarization combiner 405b through one light entrance port; the other light exit port of the combiner 404b is emitted.
  • the polarization direction of the second sub-signal beam is rotated through the half-wave plate 4051b, and the rotated second sub-signal beam is injected into the polarization combiner 405b through another light entrance; the first sub-signal beam and the rotated second sub-signal beam
  • the sub-signal beams are polarized and combined in the polarization combiner 405b to output a composite beam, in which the emitted light of each wavelength is in alternating orthogonal polarization directions.
  • the support plate 410b is also provided with a fifth mounting surface 4126b, which protrudes from the top surface of the support plate 410b and is lower than the fourth mounting surface 4120b.
  • An optical fiber coupler 407b is provided on the fifth mounting surface 4126b.
  • the light input end of the optical fiber coupler 407b is arranged corresponding to the light outlet of the polarization combiner 405b.
  • the light outlet of the optical fiber coupler 407b is connected to the internal optical fiber 700, so that the polarization is combined.
  • the composite light beam output by the wave device 405b is coupled to the internal optical fiber 700 through the optical fiber coupler 407b, and is transmitted to the optical fiber adapter 600 through the internal optical fiber 700, thereby realizing light emission.
  • the light incident surface of the optical fiber coupler 407b is prone to reflection due to different media, and the reflected composite beam may return to the light emitting chip 401b along the original path.
  • the fourth mounting surface 4120b is also provided with There is an optical isolator 406b.
  • the optical isolator 406b is arranged corresponding to the light outlet of the polarization combiner 405b.
  • the composite light beam emitted by the polarization combiner 405b directly passes through the optical isolator 406b and enters the optical fiber coupler 407b.
  • the optical fiber coupler 407b The reflected light beam generated by the light incident surface cannot pass through the optical isolator 406b.
  • a translation prism 403 can also be provided between the collimating lens 402b and the combiner 404b to translate the parallel light passing through the collimating lens to a certain height, thereby lifting the signal light emitted by the light emitting chip 401b. .
  • Figure 30 is a side view of a light emitting component in an optical module according to some embodiments. As shown in Figure 30, after the semiconductor refrigerator 420, the substrate 430, the light emitting chip 401b and the collimating lens 402b are installed on the third mounting surface 4119b, the wiring height of the light emitting chip 401b is flush with the front surface of the circuit board 300. , to reduce the wiring length.
  • the combiner 404b, polarization combiner 405b, and optical isolator 406b are installed on the fourth mounting surface 4120b, and the optical fiber coupler 407b is installed on the fifth mounting surface 4126b, the light emitting chip 410b, the collimating lens 402b, and the combiner are
  • the optical axes of the converter 404b, the polarization combiner 405b, the optical isolator 406b and the optical fiber coupler 407b are located on the same straight line.
  • the four light emitting chips 401b generate four emission lights with wavelengths ⁇ 1, ⁇ 2, ⁇ 3, and ⁇ 4.
  • the four channels of emitted light are converted into four channels of parallel light through the collimating lens 402b.
  • the four channels of parallel light are injected into the combiner 404b through the four light entrances of the combiner 404b.
  • the four channels of parallel light are reflected in the combiner 404b.
  • transmission, the first sub-signal beam with wavelengths ⁇ 1 and ⁇ 3 and the second sub-signal beam with wavelengths ⁇ 2 and ⁇ 4 are emitted through the two light outlets.
  • the first sub-signal beam directly enters the polarization combiner 405b, and the second sub-signal beam
  • the light beam undergoes polarization direction rotation through the half-wave plate 4051b and then enters the polarization combiner 405b.
  • the first sub-signal beam and the rotated second sub-signal beam are combined into a composite beam in the polarization combiner 405b.
  • the composite beam passes through the light
  • the isolator 406b is coupled to the internal optical fiber 700 through the optical fiber coupler 407b, and is transmitted to the optical fiber adapter 600 through the internal optical fiber 700, thereby realizing a multi-wave combining communication method.
  • a translation prism 403 is provided between the collimating lens 402b and the combiner 404b for translating the parallel light passing through the collimating lens to a certain height.
  • the translated light beam is located on the same straight line as the optical axes of the combiner 404b, polarization combiner 405b, optical isolator 406b and fiber coupler 407b.
  • the present disclosure integrates a polarization control device in an optical module to control the polarization direction of the laser beam in the LWDM optical system, rotates the polarization direction of part of the laser beam, and then performs a light combining operation, thereby making the adjacent wavelength laser signals entering the optical fiber Being in alternating orthogonal polarization directions, it achieves the suppression effect of four-wave mixing, reduces the interference between channels caused by four-wave mixing, and effectively improves the signal transmission quality of the system.

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Abstract

一种光模块，包括：电路板(300)；光发射部件(400)，包括：发射底座(410)，固定安装在安装孔(302)中；多个光发射芯片(401)，设置在发射底座(410)中，与电路板(300)电连接，用于产生不同波长的多个信号光；合波器(4041,4042)，设置在发射底座(410)上，位于信号光的出光方向上，用于将不同波长的信号光复合为第一子信号光束与第二子信号光束，第一子信号光束中的信号光波长不相邻，第二子信号光束中的信号光波长不相邻；以及偏振合波器(4051,4052)，设置在发射底座(410)上，位于合波器(4041,4042)的出光方向上，用于对第一子信号光束进行偏振方向旋转，并将旋转后的第一子信号光束与第二子信号光束复合为复合信号光束。其中，发射底座(410)设置有第一安装面(4119a)和第二安装面(4120a)，其中，第一安装面(4119a)的高度低于第二安装面(4120a)的高度，光发射芯片(401)安装在第一安装面(4119a)上，合波器(4041,4042)和偏振合波器(4051,4052)安装在第二安装面(4120a)上。

Description

一种光模块
本公开要求2022年8月16日提交的申请号为CN202210980557.0、2022年8月16日提交的申请号为CN202222164722.3、以及2022年8月16日提交的申请号为CN202210979652.9的中国专利申请的优先权，其全部内容通过参引的方式结合入本文中。
技术领域
本公开涉及通信技术领域，尤其涉及一种光模块。
背景技术
随着云计算、移动互联网、视频等新型业务和应用模式发展，光通信技术的发展进步变得愈加重要。而在光通信技术中，光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一，并且随着光通信技术发展的需求，光模块的传输速率不断提高。
发明内容
一种光模块，包括：电路板，设有安装孔；光发射部件，与所述电路板电连接，用于发射不同波长的多个信号光；其中，所述光发射部件包括：发射底座，安装在所述安装孔中；多个光发射芯片，设置在所述发射底座中，与所述电路板电连接，用于产生不同波长的多个信号光；合波器，设置在所述发射底座上，位于所述信号光的出光方向上，用于将不同波长的信号光复合为第一子信号光束与第二子信号光束，所述第一子信号光束中的信号光波长不相邻，所述第二子信号光束中的信号光波长不相邻；以及偏振合波器，设置在所述发射底座上，位于所述合波器的出光方向上，用于对所述第一子信号光束进行偏振方向旋转，并将旋转后的第一子信号光束与所述第二子信号光束复合为复合信号光束，其中，所述发射底座设置有第一安装面和第二安装面，其中，第一安装面的高度低于第二安装面的高度，其中，所述光发射芯片安装在第一安装面上，所述合波器和偏振合波器安装在第二安装面上。
附图说明
图1为根据一些实施例的一种光通信系统的连接关系图；
图2为根据一些实施例的一种光网络终端的结构图；
图3为根据一些实施例的一种光模块的结构图；
图4为根据一些实施例的一种光模块的分解图；
图5为根据一些实施例的一种光模块局部图一；
图6为根据一些实施例的一种光模块局部图二；
图7为图5所示的光收发部件与电路板的拆分结构示意图；
图8为根据一些实施例的一种光发射部件的结构示意图一；
图9为根据一些实施例的一种光发射部件的结构示意图二；
图10为根据一些实施例的一种发射底座的结构示意图；
图11为根据一些实施例的一种发射电部件的结构示意图；
图12为根据一些实施例的一种光发射部件的光路图一；
图13为根据一些实施例的一种光发射部件的光路图二；
图14为根据一些实施例的一种第一合波器结构示意图；
图15为根据一些实施例的另一种第一合波器结构示意图；
图16为根据一些实施例的一种第一偏振合波器的光路示意图；
图17为根据一些实施例的第二种第一偏振合波器的光路示意图；
图18为根据一些实施例的一种光模块中电路板的结构示意图；
图19为根据一些实施例的一种光模块中发射底座的结构示意图一；
图20为根据一些实施例的一种光模块中光发射部件的局部分解示意图；
图21为根据一些实施例的一种光模块中光发射部件的局部俯视图；
图22为根据一些实施例的一种光模块中发射底座的结构示意图一；
图23为根据一些实施例的一种光模块中发射底座的结构示意图二；
图24为根据一些实施例的一种光模块中发射底座的结构示意图三；
图25为根据一些实施例的一种光模块中电路板与发射底座的局部装配示意图；
图26为根据一些实施例的一种光模块中发射底座的结构示意图四；
图27为根据一些实施例的一种光模块中电路板与光发射部件的装配剖视图；
图28为根据一些实施例的一种光模块中光发射部件的结构示意图二；
图29为根据一些实施例的一种光模块中支承板的结构示意图；
图30为根据一些实施例的一种光模块中光发射部件的侧视图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
光通信系统中，使用光信号携带待传输的信息，并使携带有信息的光信号通过光纤或光波导等信息传输设备传输至计算机等信息处理设备，以完成信息的传输。由于光通过光纤或光波导传输时具有无源传输特性，因此可以实现低成本、低损耗的信息传输。此外，光纤或光波导等信息传输设备传输的信号是光信号，而计算机等信息处理设备能够识别和处理的信号是电信号，因此为了在光纤或光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，需要实现电信号与光信号的相互转换。
光模块在光通信技术领域中实现上述光信号与电信号的相互转换功能。光模块包括光口和电口，光模块通过光口实现与光纤或光波导等信息传输设备的光通信，通过电口实现与光网络终端(例如，光猫)之间的电连接，电连接主要用于供电、I2C信号传输、数据信息传输以及接地等；光网络终端通过网线或无线保真技术(Wi-Fi)将电信号传输给计算机等信息处理设备。
图1为根据一些实施例的一种光通信系统的连接关系图。如图1所示，光通信系统包括远端服务器1000、本地信息处理设备2000、光网络终端100、光模块200、光纤101及网线103。
光纤101的一端连接远端服务器1000，另一端通过光模块200与光网络终端100连接。光纤本身可支持远距离信号传输，例如数千米(6千米至8千米)的信号传输，在此基础上如果使用中继器，则理论上可以实现无限距离传输。因此在通常的光通信系统中，远端服务器1000与光网络终端100之间的距离通常可达到数千米、数十千米或数百千米。
网线103的一端连接本地信息处理设备2000，另一端连接光网络终端100。本地信息处理设备2000可以为以下设备中的任一种或几种：路由器、交换机、计算机、手机、平板电脑、电视机等。
远端服务器1000与光网络终端100之间的物理距离大于本地信息处理设备2000与光网络终端100之间的物理距离。本地信息处理设备2000与远端服务器1000之间的连接由光纤101与网线103完成；而光纤101与网线103之间的连接由光模块200和光网络终端100完成。
光模块200包括光口和电口，光口被配置为接入光纤101，从而使得光模块200与光纤101建立双向的光信号连接；电口被配置为接入光网络终端100中，从而使得光模块200与光网络终端100建立双向的电信号连接。光模块200实现光信号与电信号的相互转换，从而使得光纤101与光网络终端100之间建立信息连接。示例地，来自光纤101的光信号由光模块200转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块200转换为光信号输入至光纤101中。由于光模块200是实现光信号与电信号相互转换的工具，不具有处理数据的功能，在上述光电转换过程中，信息并未发生变化。
光网络终端100包括大致呈长方体的壳体(housing)，以及设置在壳体上的光模块接口102和网线接口104。光模块接口102被配置为接入光模块200，从而使得光网络终端100与光模块200建立双向的电信号连接；网线接口104被配置为接入网线103，从而使得光网络终端100与网线103建立双向的电信号连接。光模块200与网线103之间通过光网络终端100建立连接。示例地，光网络终端100将来自光模块200的电信号传递给网线103，将来自网线103的电信号传递给光模块200，因此光网络终端100作为光模块200的上位机，可以监控光模块200的工作。光模块200的上位机除光网络终端100之外还可以包括光线路终端(Optical Line Terminal，OLT)等。
远端服务器1000通过光纤101、光模块200、光网络终端100及网线103，与本地信息处理设备2000之间建立了双向的信号传递通道。
图2为根据一些实施例的一种光网络终端的结构图，为了清楚地显示光模块200与光网络终端100的连接关系，图2仅示出了光网络终端100的与光模块200相关的结构。如图2所示，光网络终端100还包括设置于壳体内的电路板105，设置在电路板105表面的笼子106，设置在笼子106上的散热器107，以及设置在笼子106内部的电连接器。电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起部。
光模块200插入光网络终端100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200插入笼子106中后，光模块200的电口与笼子106内部的电连接器连接，从而光模块200与光网络终端100建议双向的电信号连接。此外，光模块200 的光口与光纤101连接，从而光模块200与光纤101建立双向的光信号连接。
图3为根据一些实施例的一种光模块的结构图。图4为根据一些实施例的一种光模块的分解图。如图3、图4所示，光模块200包括壳体(shell)，设置于壳体内的电路板300及光收发部件。
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口的上述壳体；壳体的外轮廓一般呈现方形体。
在本公开的一些实施例中，下壳体202包括底板以及位于底板两侧、与底板垂直设置的两个下侧板；上壳体201包括盖板，盖板盖合在下壳体的两个下侧板上，以形成上述壳体。
在一些实施例中，下壳体202包括底板以及位于底板两侧、与底板垂直设置的两个下侧板；上壳体201包括盖板以及位于盖板两侧、与盖板垂直设置的两个上侧板，由两个上侧板与两个下侧板结合，以实现上壳体201盖合在下壳体202上。
两个开口204和205的连线所在的方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。例如，开口204位于光模块200的端部(图3的右端)，开口205也位于光模块200的端部(图3的左端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。开口204为电口，电路板300的金手指从电口204伸出，插入上位机(例如，光网络终端100)中；开口205为光口，被配置为接入外部光纤101，以使外部光纤101连接光模块200内部的光收发部件。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、光收发部件等器件安装到壳体中，由上壳体201、下壳体202对这些器件形成封装保护。此外，在装配电路板300和光收发部件等器件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化地实施生产。
在一些实施例中，上壳体201及下壳体202一般采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外部的解锁部件，解锁部件被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
示例地，解锁部件位于下壳体202的两个下侧板的外壁上，具有与上位机笼子(例如，光网络终端100的笼子106)匹配的卡合部件。当光模块200插入上位机的笼子里，由解锁部件的卡合部件将光模块200固定在上位机的笼子里；拉动解锁部件时，解锁部件的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的卡合关系，从而可以将光模块200从上位机的笼子里抽出。
电路板300包括电路走线、电子元件及芯片，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如包括微控制单元(Microcontroller Unit，MCU)、激光驱动芯片、限幅放大器(limiting amplifier)、时钟数据恢复(Clock and Data Recovery，CDR)芯片、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳地承载上述电子元件和芯片；当光收发部件位于电路板上时，硬性电路板也可以提供平稳地承载；硬性电路板还可以插入上位机笼子中的电连接器中。
电路板300还包括形成在其端部表面的金手指，金手指由相互独立的多个引脚组成。电路板300插入笼子106中，由金手指与笼子106内的电连接器导通连接。金手指可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以适应引脚数量需求大的场合。金手指被配置为与上位机建立电连接，以实现供电、接地、I2C信号传递、数据信号传递等。
当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。例如，硬性电路板与光收发部件之间可以采用柔性电路板连接。
光收发部件包括光发射部件400及光接收部件500，光发射部件被配置为实现光信号的发射，光接收部件被配置为实现光信号的接收。根据一些实施例，光发射部件400及光接收部件500可独立设置在电路板300上。根据一些实施例，光发射部件400及光接收部件500也可结合在一起，形成一体的光收发部件。
根据一些实施例，光发射部件400与光接收部件500可位于电路板300的同一侧，以方便光发射部件400与光接收部件500通过信号线与数据处理器301连接；根据一些实施例，光发射部件400与光接收部件500也可位于电路板300的不同侧，光发射部件400通过电路板300正面的信号线与数据处理器301连接，光接收部件500通过电路板300背面的信号线、过孔与数据处理器301连接。
对于高传输速率的光模块，如1.6T光模块，为实现1.6T光模块的传输速率，需要在QSFP-DD或OSFP的封装中集成8路光发射器和8路光接收器，因此设置有两个光发射部件和两个光接收部件。第一光发射部件包括4个光发射芯片，以实现4路发射光束的发射，第二光发射部件包括4个光发射芯片，以实现4路发射光束的发射。第一光接收部件包括4个光接收器，以实现4路接收光束的接收；第二光接收部件包括4个光接收器，以实现4路接收光束的接收。
在光模块中为提高通信效率，采用多波合束的通信方式，即将多组不同波长的信号光合并为一束复合 信号光，通过单模光纤发送出去。单光通道速率为200G的系统中，通常采用四波合束的方式进行通信，即将四种波长的信号光进行合束，成为一束复合信号光。在多通道或多波长光纤传输系统中，特别是在O-band传输系统中，由于光信号处于零色散波长附近，四波混频效应尤为明显。比如在400G ER4-30系统中，四波混频造成的串扰将严重限制光信号入纤功率，导致系统无法满足传输30km的动态功率要求。当单通道传输速率提高到200G时，情况会更加严重。
四波混频(Four-Wave Mixing，FWM)属于非线性效应，是由折射率对光功率(外加电场)强度的依赖性引起的。四波混频是一种互调制现象，其中3个波长之间的相互作用产生第4个波长，在使用角频率ω1,…ωn的WDM(Dense Wavelength Division Multiplexing，密集波分复用)系统中，折射率的强度依赖性不仅会在通道内引起相移，还会产生新频率的信号，例如2ωi-ωj和ωi+ωj-ωk。四波混频依赖于信道功率，信道间距和光纤色散，减小通道间距会增加四波混频效果，减少色散也会增加。因此，当通道间隔很近和/或使用低色散或色散位移光纤时，必须考虑四波混频的影响。
如果三个信息携带信号的频率fa，fb，fc发生在光纤的输入端，然后将产生新的拍频，其频率由下式给出：
fcbc＝fa+fb+fc，其中，(a,b,c＝1,2,3)
光纤末端由频率fa，fb，fc相互作用所产生的FWM功率是下式给出：
当新产生的频率fabc落在某信道的通光窗口之内时，就会形成这三个通道对该信道的串扰。通常有两种方法降低PFWM的影响：1)降低频率fa，fb，fc的光强；2)增加fa，fb，fc的频率间隔，或采用不均匀的频率间隔。但考虑到实际应用场景，这两种方法并不是最有效的方法。实验证明，通过控制激光偏振方向，使相邻两个信道的偏振方向处于正交状态，则可以使注入功率提高约3dB。
为了避免多个波长的光信号产生四波混频，要求多个波长的光信号对应的波长具备一定间距，即不能采用波长太密集的激光进行光信号的传输，从而限制了传输速率的进一步提升。本公开提供了一种光发射部件，通过将四种不同波长的信号光中心波长不相邻的两束信号光的合为一束，形成两组子信号光束，再通过偏振装置将其中一束子信号光束的偏振方向旋转一定的角度，旋转后的子信号光束与另一子信号光束合为一束复合信号光，复合信号光中的中心波长相邻的信号光的偏振方向相差70°-120°，使得相邻中心波长的信号光的偏振方向近似正交，从而降低四波混频效应，从而可进一步缩小相邻光信号的波长间隔，提高光模块的光信号传输速度。
图5为根据一些实施例的一种光模块局部图一，图6为根据一些实施例的一种光模块局部图二，图7为图5所示的光收发部件与电路板拆分结构示意图。图5和图6从不同的角度对光收发部件与电路板的结构进行展示。如图中所示，光模块中电路板300的上表面设置数据处理芯片，接收金手指端传递的高频信号并进行处理，处理后的信号传递至激光驱动芯片。
电路板上设有贯穿的安装孔，用于发射底座410的安装固定。光发射部件400的光发射芯片401设置在发射底座410上。通过打线实现电路板300与光发射芯片401的电连接。光发射部件400的输出光口通过内部光纤与光纤适配器600连接，以将光发射部件400发射的信号光通过内部光纤发射出去。
光接收部件500设置在安装孔302的一侧，光纤适配器600传输的外部光信号通过内部光纤传输至光接收部件500，光接收部件500将光信号转换为电信号，电信号经电路板300表面布设的信号线传输至数据处理器301，通过数据处理器301对电信号进行处理，处理后的电信号经金手指传输至上位机。
发射底座410包括第一底板411、支撑板412和第二底板413，第一底板411、第二底板413与电路板300平行，支撑板412设置于第一底板411与第二底板413之间、并与电路板300大致垂直。第一底板411的上表面与电路板的下表面固定连接。第一底板411的上表面与支撑板412的下表面连接，支撑板412的上表面与第二底板413的下表面连接，使得发射底座410呈阶梯式设置，第一底板411的上表面与第二底板413的上表面不在同一平面。第二底板413凸出于电路板300设置，使得第二底板413的下表面与电路板的上表面固定连接，以实现光模块整体结构的稳定性。即，第二底板413的下表面与第一底板411的上表面之间的高度差等于电路板300的厚度。支撑板412的侧面与安装孔的内壁固定连接。支撑板412的宽度不大于安装孔的宽度，且第二底板413的宽度不大于支撑板412的宽度。安装时，将第二底板413与支撑板412通过安装孔穿过电路板300。第一底板411的宽度大于安装孔的宽度，使得第一底板411位于电路板300的下表面，第二底板位于电路板的上表面。
光发射部件包括发射底座410及设置在发射底座410上的多个光发射芯片401、多个准直透镜402、平移棱镜403、第一合波器4041、第二合波器4042、第一偏振合波器4051、第二偏振合波器4052、第一隔离器4061、第二隔离器4062、第一光纤耦合器4071与第二光纤耦合器4072。其中，光发射芯片、准直透镜与平移棱镜的安装高度低于第一合波器、第二合波器4042、第一偏振合波器4051、第二偏振合波器 4052、第一光纤耦合器4071与第二光纤耦合器4072的安装高度。
图8为根据一些实施例的一种光发射部件的结构示意图一，图9为根据一些实施例的一种光发射部件的结构示意图二，图8和图9从不同的角度对光发射部件进行展示。图10为根据一些实施例的一种发射底座的结构示意图。
第一底板411的上表面的部分区域向下凹陷形成第一凹槽4111，用于承载发射电部件。支撑板412设置于第一凹槽4111的一侧，支撑板412的侧面设有一凸出于支撑板412的侧壁的透镜平台4121，用于承载平移棱镜阵列。第一凹槽的宽度大于支撑板412的宽度，且小于第一底板411的宽度。第一底板411上表面中，位于第一凹槽4111四周、高于第一凹槽4111的部分与电路板的下表面固定连接。通常，第一底板411与电路板300之间可通过固体胶连接固定，或通过UV胶连接固定。
图11为根据一些实施例的一种发射电部件的结构示意图。如图中所示，发射电部件包括：第一基板4201、半导体制冷器420、第二基板4202、第三基板4203以及COC结构阵列430、准直透镜402、以及第四基板。半导体制冷器420位于第一基板4021的上方，半导体制冷器420还设有导电柱4181，与电路板电连接，为半导体制冷器供电。为减少电路板的挖空面积，提高电路板的坚固性，安装孔302还设有导电柱避让部303，用于导电柱的安装避让。
COC结构阵列包括多个COC结构，包括：第一陶瓷导电基板和设置于第一陶瓷基板表面的光发射芯片、光电探测器。第一陶瓷导电基板的上表面设置导电走线，与电路板上的信号线连接，实现对第一陶瓷导电基板的上表面的光发射芯片、光电探测器的驱动。
为减少光模块中高频信号线的长度，第一陶瓷导电基板的上表面与电路板的上表面在同一平面内。电路板上的信号线通过打线与第一陶瓷导电基板的上表面的导电走线连接。第一基板4021位于第一凹槽内部，用于第一陶瓷导电基板的上表面与电路板的上表面平齐设置。
第二基板4022设置于半导体制冷器的上方，为COC结构阵列与准直透镜提供精密的平台。第三基板位于第二基板的上方，为COC结构阵列与提供精密的平台。准直透镜阵列位于第四基板的上表面，且位于COC结构阵列的出光路径上，用于将光发射芯片发出的信号光由发散光转换为平行光。
COC结构阵列中COC结构的数量可根据需要进行设置，本示例中COC结构阵列中COC结构的数量为8，对应设置由8个光发射芯片，分为两个光发射部件，其中第一光发射部件包括第一光发射芯片、第二光发射芯片、第三光发射芯片和第四光发射芯片。为实现多波合束的光通信方式，第一光发射芯片、第二光发射芯片、第三光发射芯片和第四光发射芯片发出的信号光的中心波长不同。第一光发射芯片发出的第一信号光的波长为λ1；第二光发射芯片发出的第一信号光的波长为λ2；第三光发射芯片发出的第二信号光的波长为λ3；第四光发射芯片发出的第四信号光的波长为λ4；其中λ1、λ2、λ3与λ4的值各不相同。例如，λ1、λ2、λ3与λ4的值可以是1331nm、1311nm、1291nm、1271nm；也可以是1271nm、1291nm、1311nm、1331nm，或1331nm、1291nm、1271nm1311nm；或其他不同波长值。平移棱镜阵列承载在透镜平台4121上。平移棱镜阵列用于将经过准直透镜的平行光平移一定的高度，将发射信号光抬升至第二底板413的上方。平移棱镜阵列包括一个或多个平移棱镜，在本示例中平移棱镜阵列包括4个平移棱镜，与四个光发射芯片一一对应。
图12为根据一些实施例的一种光发射部件的光路图一，图13为根据一些实施例的一种光发射部件的光路图二。结合图12和图13所示，平移棱镜阵列的作用是将光束向上平移一定距离，使得后续所有的光器件位置均位于电路板的正侧，并与电路板保持适当间隙。这样就避免了光学器件与电路板之间的位置冲突，从而可以尽可能的减小电路板的挖孔面积，增加了电路板上电子器件的排布面积，使得电路板的布线更加容易。
为实现对发射信号光的抬升，平移棱镜内设置相互平行的第一反射镜面和第二反射镜面，且第一发射镜面的法线与光的入射方向呈45°，发射信号光经第一反射镜面反射后，由平行于电路板上表面转换为垂直于电路板上表面。而后经过第二反射镜面的反射，由垂直于电路板上表面转换为平行于电路板上表面。发射信号光经平移棱镜前后仅发生了光轴高度的变化。第一反射镜面和第二反射镜面为全反射薄膜，对光发射芯片发出的全部信号光进行反射。
第二底板413上设置有第一合波器4041和第一偏振合波器4051，第一合波器4041设置于偏振合波器与平移棱镜阵列之间，用于将接收的四种波长的信号光合并为两束子信号光束，且子信号光束中包含两种波长不相邻的信号光。如：当λ1、λ2、λ3与λ4的值为1331nm、1311nm、1291nm、1271nm时，第一子信号光束中包含λ1、λ3；第二子信号光束包含λ2和λ4。第一合波器4041设有四个入光口，用于接收四个不同波长的发射信号光；设有两个出光口，用于发出合波后的两束子信号光。第一偏振合波器4051接收两束子信号光束并将其中一束子信号光束的偏振方向旋转一定角度后，合并为一束复合信号光。第一偏振合波器4051设有两个入光口，分别接收第二子信号光束和第二子信号光束，用于接收第一子信号光束的第一入光口设有1/2波片，将第一子信号光束的偏振方向旋转约70°～120°。第一偏振合波器4051内设置有相互平行设置的第三反射镜面、第四反射镜面，第三反射镜面位于第一子信号光束的光路上，将偏转 后的第一子信号光束反射至第四反射镜面。第四反射镜面对第一子信号光束中的光进行反射，对第二子信号光束中的光透射，第一子信号光束和第二子信号光束经过第四反射镜面后复合形成复合信号光束。第一偏振合波器4051设有一个出光口，位于第四反射镜面的出光路径上，复合信号光束经出光口出射。
为提高相邻信号光的偏振角度差值，第一子信号光束的偏振方向可以旋转例如85°～95°，例如旋转90°。
或者，也可以是第三反射镜面对第一子信号光束中的光透射，第四反射镜面位于第二子信号光束的光路上，将第二子信号光束反射至第三反射镜面、再经第三反射镜面反射。第一子信号光束和第二子信号光束经过第三反射镜面后复合形成复合信号光束。第一偏振合波器4051的出光口位于第三反射镜面的出光路径上，复合信号光束经出光口出射。
第一光纤耦合器4071设置于第一偏振合波器4051的出光口一侧，第一光纤耦合器4071的光输入端与第一偏振合波器4051的光输出端相耦合连接，第一光纤耦合器4071的光输出端通过一内部光纤与第一光纤适配器相连接，如此，第一偏振合波器4051输出的复合光束通过第一光纤耦合器4071耦合至内部光纤，再通过内部光纤传输至第一光纤适配器，以实现一复合光束的发射。
第一偏振合波器4051的出光面与第一光纤耦合器4071的入光面之间存在间隙，第一偏振合波器4051输出的复合光束传输至第一光纤耦合器4071的入光面时，因光在不同介质的界面处会发生反射，所以复合光束传输至第一光纤耦合器4071的入光面时可能会发生反射，反射光束可能会按照原路返回至光发射芯片，影响光发射芯片的高频性能。为了避免这一问题，第一光隔离器4061可设置在第一偏振合波器4051与第一光纤耦合器4071之间，第一偏振合波器4051射出的复合光束在第一光纤耦合器4071的入光面发生反射时，第一光隔离器用于将反射光束隔离出去，防止反射光束沿原路返回光发射芯片。
同理，第二偏振合波器4052的出光面与第二光纤耦合器4072的入光面之间存在间隙，第二偏振合波器4052输出的另一复合光束传输至第二光纤耦合器4072的入光面时，因光在不同介质的界面处会发生反射，复合光束传输至第二光纤耦合器4072的入光面时可能会发生反射，反射光束可能会按照原路返回至光发射芯片，影响光发射芯片的高频性能。为了避免这一问题，第二光隔离器4062可设置在第二偏振合波器4052与第二光纤耦合器4072之间，第二偏振合波器4052射出的复合光束在第二光纤耦合器4072的入光面发生反射时，第二光隔离器4062用于将反射光束隔离出去，防止反射光束沿原路返回光发射芯片。
根据一些实施例中，第一光纤耦合器4071可包括套管、聚焦透镜与第一单模光纤法兰，套管套在聚焦透镜与第一单模光纤法兰的外侧，内部光纤插在第一单模光纤法兰内，聚焦透镜的入光面朝向第一偏振合波器4051、出光面朝向第一单模光纤法兰，第一偏振合波器4051输出的复合光束经过第一光隔离器传输至聚焦透镜，聚焦透镜将复合光束汇聚至插在第一单模光纤法兰内的内部光纤。
聚焦透镜为圆柱形透镜，圆柱形透镜与第一单模光纤法兰的外径尺寸可略小于套管的内径尺寸，以保证聚焦透镜与第一单模光纤法兰的耦合度。将聚焦透镜与第一单模光纤法兰插在套管内时，为提高聚焦透镜与第一单模光纤法兰的耦合度，可只轴向移动聚焦透镜与第一单模光纤法兰。
为方便透过第一光隔离器的复合光束射入聚焦透镜内，聚焦透镜突出于套管外，减小了聚焦透镜的入光面与第一光隔离器的出光面之间的距离，使得结构更紧凑。
为了方便第一光纤耦合器4071与第一隔离器4061的光轴的统一，第二底板413的上表面设置有两个不同高度、即具有高度差的承载面，其中第一承载面4131的高度高于第二承载面4132的高度。第二承载面4132用于承载固定第一光纤耦合器4071和第二光纤耦合器4072，第一承载面4131用于承载固定第一合波器、第二合波器4042、第一偏振合波器4051、第二偏振合波器4052、以及在需要时第一隔离器4061和第二隔离器4062。
在装配光发射部件时，需首先将第一基板4201和半导体制冷器420依次安装在第一底板411的第一凹槽4111内，然后将光发射芯片安装在第三基板4203上，然后将光发射芯片和第三基板固定在半导体制冷器上，然后将平移棱镜固定在透镜平台4121上，然后将第一合波器、第二合波器4042、第一偏振合波器4051、第二偏振合波器4052、第一隔离器4061、第二隔离器4062、第一光纤耦合器4071与第二光纤耦合器4072按照光发射方向固定在承载面4131、4132上，最后将准直透镜按照光发射芯片出光方向固定在第四基板上，同时检测光纤中的耦合效率，优化准直透镜的位置。
为减少装配工作量，也可采用一体化的光学组件，将第一合波器4041、第二合波器4042、第一偏振合波器4051、第二偏振合波器4052、第一隔离器4061、第二隔离器4062、第一光纤耦合器4071、第二光纤耦合器4072、两个内部光纤与两个光纤适配器组装为一个预装配件。半导体制冷器420固定在第一底板411的第一凹陷区域4111内，然后将光发射芯片安装在光发射芯片基板上，然后将光发射芯片基板固定在半导体制冷器420上，然后将平移棱镜按照光发射方向固定在透镜平台4121上，再将预装配件直接固定在发射底座410的承载面4131、4132上，最后将准直透镜按照光发射芯片出光方向固定在第四基板上、并将第四基板固定在半导体制冷器420上。
图14为根据一些实施例的一种第一合波器结构示意图。如图14中所示，第一合波器设有四个用于入 射多种波长信号光的入光口，每一入光口用于入射一种波长的信号光。以第一合波器入射λ1、λ2、λ3和λ4的4种波长为例，其中λ1＞λ2＞λ3＞λ4，λ1信号光通过第一入光口进入第一合波器，经过第一合波器内四个不同位置进行了四次不同的反射到达第一出光口；λ2信号光通过第二入光口进入第一合波器，经过第一合波器内四个不同位置进行了四次不同的反射到达第二出光口；λ3信号光通过第三入光口进入第一合波器进行了透射到达第一出光口；λ4信号光通过第四入光口进入第一合波器，直接传输到达出光口。如此，通过第一合波器将4种波长的入射信号光合并为两束子信号光束，且每束子信号光中的信号光的波长不相邻，如本示例中第一出光口出射的第一子信号光束包含波长为λ1的第一信号光和波长为λ3的第三信号光，第二出光口出射的第二子信号光束包含波长为λ2的第二信号光和波长为λ4的第四信号光。
以下，为方便表示以λ1、λ2、λ3、λ4表示四种不同波长的信号光。
第一合波器的中四个用于入射多种波长信号光的入光口分别设置第一滤波片40411、第三滤波片40412、第五滤波片40413和第七滤波片40414，入光口的对侧设置有第二滤波片40415、第四滤波片40416、第六滤波片40417和第八滤波片40418。为方便合波器的合波功能，第一合波器的法线与入射光轴的夹角为8～12°。在本示例中第一合波器的中各滤波波片的设置，第一滤波片对λ1透射，对其他波长的信号光反射；第二滤波片对λ1反射；第三滤波片对λ2透射、λ1反射；第四滤波片对λ1、λ2反射；第五滤波片对λ3透射，λ1、λ2反射；第六滤波片对λ1、λ3透射，对λ2反射；第七滤波片对λ4透射，λ2反射；第八滤波片对λ2、λ4透射。即可在第一滤波片镀有λ1透射薄膜，第二滤波片镀有λ1反射薄膜。第三滤波片设置λ2透射薄膜、λ1反射薄膜。第四滤波片设置λ1、λ2反射薄膜，第五滤波片设置λ3透射薄膜和λ1、λ2反射薄膜。第六滤波片设置λ1、λ3透射薄膜和对λ2反射薄膜。第七滤波片设置λ4透射薄膜和λ2反射薄膜。第八滤波片设置λ2、λ4透射薄膜。
λ1信号光通过第一入光口进入第一合波器，经过第一合波器内四个不同位置进行了四次不同的反射到达第一出光口；λ2信号光通过第二入光口进入第一合波器，经过第一合波器内四个不同位置进行了四次不同的反射到达第二出光口；λ3信号光通过第三入光口进入第一合波器进行了透射到达第一出光口；λ4信号光通过第四入光口进入第一合波器，直接传输到达出光口。在此过程中，如图中所示的箭头λ1、λ2、λ3、λ4的偏振方向为平行于视图纸面(或称平行于电路板上表面)。
图15为根据一些实施例的另一种第一合波器结构示意图。如图15中所示，第一合波器设有四个用于入射多种波长信号光的入光口，每一入光口用于入射一种波长的信号光。以第一合波器入射λ1、λ2、λ3和λ4的4种波长为例，且λ1＞λ2＞λ3＞λ4，λ1信号光通过第一入光口进入第一合波器，经过第一合波器内四个不同位置进行了四次不同的反射到达第一出光口；λ3信号光通过第二入光口进入第一合波器，经过第一合波器内两个不同位置进行了两次不同的反射到达第一出光口；λ2信号光通过第三入光口进入第一合波器，在第一合波器内两个不同位置进行了两次不同的反射到进行了到达第二出光口；λ4信号光通过第四入光口进入第一合波器，直接传输到达出光口。如此，通过第一合波器将4种波长的入射信号光合并为两束子信号光束，且每束子信号光中的信号光的波长不相邻，如本示例中第一出光口出射的第一子信号光束包含λ1和λ3，第二出光口出射的第二子信号光束包含λ2和λ4。
则，本示例中第一合波器的滤波片的作用进行相应调整，第一滤波片对λ1透射；第二滤波片对λ1反射；第三滤波片对λ3透射、λ1反射；第四滤波片对λ1、λ3反射；第五滤波片对λ2透射，λ1、λ3反射；第六滤波片对λ1、λ3透射，对λ2反射；第七滤波片对λ4透射，λ2反射；第八滤波片对λ2、λ4透射。
同理，可根据光发射阵列中光发射芯片的出光信号的排列进行第一合波器的设置，其他合理范围内的调整在此不做一一赘述。
图16为根据一些实施例的一种第一偏振合波器的光路示意图，如图16中所示，第一偏振合波器4051设有两个入光口，分别接收第二子信号光束和第二子信号光束，第一入光口设有1/2波片，将第一子信号光束的偏振方向旋转约90°，即由原平行于图示纸面的偏振方向旋转为垂直于纸面的偏振方向(由平行于电路板上表面的偏振方向，旋转为垂直于电路板上表面)。第一偏振合波器4051其内设置有相互平行设置的第三反射镜面40511、第四反射镜面40512，第三反射镜面40511位于第一子信号光束的光路上，将偏转后的第一子信号光束反射至第四反射镜面40512。第四反射镜面对第一子信号光束中的光进行反射，对第二子信号光束中的光透射，第一子信号光束和第二子信号光束经过第四反射镜面后复合形成复合信号光。第一偏振合波器4051设有一个出光口，位于第四反射镜面的出光路径上，复合信号光经出光口出射。
图17为根据一些实施例的第二种第一偏振合波器的光路示意图，如图17中所示，第一偏振合波器4051设有两个入光口，分别接收第二子信号光束和第二子信号光束，第二入光口设有1/2波片，将第二子信号光束的偏振方向旋转约90°，即由原平行于图示纸面的偏振方向旋转为垂直于纸面的偏振方向(由平行于电路板上表面的偏振方向，旋转为垂直于电路板上表面)。第一偏振合波器4051其内设置有相互平行设置的第三反射镜面40511、第四反射镜面40512，第三反射镜面40511位于第一子信号光束的光路上， 将第一子信号光束反射至第四反射镜面40512。第四反射镜面对第一子信号光束中的光进行反射，对偏转后的第二子信号光束中的光透射，第一子信号光束和偏转后的第二子信号光束经过第四反射镜面后复合形成复合信号光。第一偏振合波器4051设有一个出光口，位于第四反射镜面的出光路径上，复合信号光经出光口出射。
COC结构阵列中4个光发射芯片发出的4种不同波长的信号光，第一信号光、第二信号光、第三信号光合第四信号光：λ1、λ2、λ3与λ4。准直透镜阵列位于光发射芯片的出射光路上，将光发射芯片发出的信号光由发散光转换为平行光。而后，经平移棱镜403阵列，将发射信号光抬升至第二底板413的上方。平移棱镜阵列的出射光路上设置有第一合波器4041和第一偏振合波器4051，第一合波器4041设置于偏振合波器4051与平移棱镜阵列之间，用于将接收的四种波长的信号光合并为两束子信号光束，且子信号光束中包含两种波长不相邻的信号光，第一子信号光束中包含：λ1、λ3；第二子信号光束包含λ2和λ4。第一偏振合波器4051接收两束子信号光束并将其中一束子信号光束的偏振方向旋转一定角度后，合并为一束复合信号光。通过将四种不同波长的信号光中心波长不相邻的两束信号光的合为一束，形成两组子信号光束，再通过偏振装置将其中一束子信号光束的偏振方向旋转一定的角度，旋转后的子信号光束与另一子信号光束合为一束复合信号光，复合信号光中的中心波长相邻的信号光的偏振方向相差70°-90°，使得相邻中心波长的信号光的偏振方向近似正交，从而降低四波混频效应，从而可进一步缩小相邻光信号的波长间隔，提高光模块的光信号传输速度。
第一光纤耦合器4071设置于第一偏振合波器4051的出光口一侧，第一光纤耦合器4071的光输入端与第一合波器的光输出端相耦合连接，第一光纤耦合器4071的光输出端通过一内部光纤与第一光纤适配器相连接，如此，第一偏振合波器4051输出的复合光束通过第一光纤耦合器4071耦合至内部光纤，再通过内部光纤传输至第一光纤适配器，以实现复合光束的发射。
图18为根据一些实施例的一种光模块中电路板的结构示意图。如图18所示，电路板300上的安装孔302包括第一侧面3021、第二侧面3022、第三侧面3023、第四侧面3024、第五侧面3025与第六侧面3026，第一侧面3021与第二侧面3022位于同一侧，且第一侧面3021突出于第二侧面3022；第四侧面3024与第五侧面3025位于同一侧，且第五侧面3025突出于第四侧面3024。
第一侧面3021与第五侧面3025相对设置，第二侧面3022与第四侧面3024相对设置，第三侧面3023与第六侧面3026相对设置，由此，第一侧面3021、第二侧面3022、第三侧面3023、第四侧面3024、第五侧面3025与第六侧面3026组成安装孔302。
根据一些实施例，第一侧面3021的长度尺寸大于第二侧面3022的长度尺寸，第四侧面3024的长度尺寸大于第五侧面3025的长度尺寸，且第一侧面3021的长度尺寸大于第五侧面3025的长度尺寸。
根据一些实施例，第一侧面3021与第五侧面3025之间的距离(即第六侧面3026的宽度尺寸)小于第一侧面3021与第四侧面3024之间的距离，第一侧面3021与第四侧面3024之间的距离小于第二侧面3022与第四侧面3024之间的距离(即第三侧面3023的宽度尺寸)。
图19为根据一些实施例的光模块中发射底座的结构示意图一，图20为根据一些实施例的光模块中光发射部件的局部分解示意图，图21为根据一些实施例的光模块中光发射部件的局部俯视图。如图19、图20、图21所示，光发射部件400可包括发射底座410a，发射底座410a包括底座主体410a-1与凸台410a-2，凸台410a-2自底座主体410a-1的底面4107a向下壳体202的方向延伸，且凸台410a-2嵌入到安装孔302内。
在一些实施例中，发射底座410a还包括发射盖板4101a，底座主体410a-1朝向上壳体201的一侧形成开口，发射盖板4101a盖设于该开口上，如此发射底座410a与发射盖板4101a形成发射腔。
底座主体410a-1的朝向上壳体201的一侧设置有顶面4103a，装配面4104a自顶面4103a凹陷；安装槽4105a进一步从装配面4104a凹陷，形成光发射部件400的发射腔。
根据一些实施例，将发射盖板4101a盖合在底座主体410a-1上时，发射盖板4101a贴装在装配面4104a上，使得发射盖板4101a与底座主体410a-1装配在一起，使得发射盖板4101a与发射底座410a形成发射腔。
根据一些实施例，发射盖板4101a通过胶水粘接在凹槽的装配面4104a上，不便于发射盖板4101a的拆装。为了提高发射盖板4101a与发射底座410a的拆装，发射盖板4101a的一侧设置有突出板4102a，该突出板4102a由发射盖板4101a的侧面向数据处理器301的方向延伸。
顶面4103a上设置有缺口4106a，该缺口4106a与凹槽的装配面4104a相连通，且缺口4106a的位置对应于突出板4102a的位置。将发射盖板4101a盖合在发射底座410a时，将发射盖板4101a的下侧表面、即面向发射腔的内侧面置于凹槽的装配面4104a上，并将突出板4102a插入缺口4106a内，以将发射盖板4101a固定在发射底座410a上。
根据一些实施例，安装槽4105a内设置有多个位于光发射芯片401a、多个准直透镜402a、合波器404a、偏振合波器405a、光隔离器406a与光纤耦合器，多个光发射芯片401a并排设置在安装槽4105a内，准直 透镜402a位于光发射芯片401a的出光方向上，且准直透镜402a与光发射芯片401a一一对应设置。
根据一些实施例，当发射底座410a嵌入电路板300的安装孔302时，电路板300的正面伸入发射底座410a的安装槽4105a内，且光发射芯片401a的打线高度与电路板300正面的高度相同，以方便通过打线连接光发射芯片401a与电路板300，减小打线的长度。
图22为根据一些实施例的一种光模块中发射底座的结构示意图一；图23为根据一些实施例的一种光模块中发射底座的结构示意图二；图24为根据一些实施例的一种光模块中发射底座的结构示意图三。如图22、图23、图24所示，底座主体410a-1包括底面4107a，该底面4107a朝向下壳体202，凸台410a-2由底面4107a向下壳体202的方向延伸，以增加发射底座410a在上下方向的厚度尺寸。
凸台410a-2包括第一平面4108a、第二平面4109a、连接面4110a、第三平面4112a、第四平面4114a、第五平面4117a与第六平面4115a，第一平面4108a与第二平面4109a位于凸台410a-2的同一侧，第二平面4109a突出于第一平面4108a，且第一平面4108a通过连接面4110a与第二平面4109a连接。第四平面4114a为与第一平面4108a、第二平面4109a相对的侧面，第三平面4112a连接第一平面4108a与第四平面4114a，且第三平面4112a朝向光纤适配器600。
第三平面4112a上设置有通孔4113a，该通孔4113a由第三平面4112a向第五平面4117a的方向延伸，且通孔4113a与安装槽4105a相连通，以实现内部光纤与安装槽4105内的光发射器件相连接。第五平面4117a与第三平面4112a相对设置，且第五平面4117a上设置有开孔4118a，将发射底座410a嵌在安装孔302后，电路板300通过该开孔4118a插入安装槽4105a内。该开孔4118a、安装槽4105a与顶面4103a上的开口相连通，以方便实现安装槽4105a内的光发射芯片401a与电路板300正面的打线连接。
第六平面4115a与底面4107a相对设置，且第六平面4115a均与第一平面4108a、第二平面4109a、连接面4110a、第三平面4112a、第四平面4114a、第五平面4117a连接，即第六平面4115a为凸台410a-2的底面。
图25为根据一些实施例的一种光模块中电路板与发射底座的局部装配示意图。如图25所示，将发射底座410a嵌入安装孔302时，发射底座410a的凸台410a-2插入安装孔302内，底面4107a与电路板300的正面相抵接，以通过电路板300支撑固定发射底座410a。
将发射底座410a嵌入安装孔302后，第一平面4108a与第五侧面3025相抵接，第二平面4109a与第四侧面3024相抵接，第五平面4117a与第三侧面3023相抵接，第四平面4114a与第一侧面3021相抵接，第三平面4112a与第六侧面3026之间可以相抵接，第三平面4112a与第六侧面3026之间也可存在一定间隙，以方便将发射底座410a嵌在安装孔302内。
将发射底座410a嵌在安装孔302内后，电路板300的正面与发射底座410a的底面4107a固定连接，使得电路板300支撑固定发射底座410a，以将发射底座410a的底面4107a固定在电路板300的正面上。
图26为根据一些实施例的发射底座的结构示意图四，图27为根据一些实施例的光模块中电路板与光发射部件的装配剖视图。如图26、图27所示，安装槽4105a包括第一安装面4119a、第二安装面4120a，第一安装面4119a与开孔4118a相连通，且第一安装面4119a凹陷于第二安装面4120a。
第一安装面4119a位于电路板300背面的下方，该第一安装面4119a用于承载发射电部件，该发射电部件包括：半导体制冷器420与基板430，半导体制冷器420的底面固定于第一安装面4119a上，基板430固定于半导体制冷器420的制冷面上，光发射芯片401a设置在基板430上，以通过半导体制冷器420、基板430增加光发射芯片401a的安装高度，使得光发射芯片401a的打线高度与电路板300的正面相平齐，以通过打线连接电路板300的正面与光发射芯片401a，如此能够减小打线的长度。
在一些实施例中，半导体制冷器420还用于对光发射芯片401a进行温度控制，如光发射芯片401a工作产生的热量通过基板430传导至半导体制冷器420，再通过半导体制冷器420将热量传导至发射底座410a，再通过发射底座410a将热量传导至上壳体201、下壳体202，以方便光发射芯片401a的热量传递，以保证光发射芯片401a的工作温度。
为提高光发射芯片401a的散热效率，发射底座410a需要选用钨铜或其他具有良好导热性的金属材料，并适当增加发射底座410a的质量以及底部的面积，
在一些实施例中，基板430为COC基板，该COC基板的上表面上设置有光发射芯片401a、光电探测器，COC基板的上表面上还设置有导电走线，该导电走线与电路板300上的信号线连接，以实现对光发射芯片401a、光电探测器的驱动。
为减少光模块中高频信号线的长度，基板430的上表面与电路板300的正面在同一平面内，电路板300上的信号线通过打线与基板430上表面的导电走线连接，基板430上的导电走线通过打线与光发射芯片401a电连接，以驱动光发射芯片401a产生光信号。
准直透镜402a设置在半导体制冷器420的制冷面上，且准直透镜402a与光发射芯片401a一一对应设置，如此光发射芯片401a产生一路光信号，该路光信号经准直透镜402a转换为平行光，以对光发射芯片401a产生的发散光束进行准直。
第二安装面4120a上设置有点胶槽4121a与退让槽4122a，该退让槽4122a位于点胶槽4121a的外周，以方便在第二安装面4120a上加工点胶槽4121a。合波器404a通过该点胶槽4121a固定在第二安装面4120a上，以将合波器404a固定在第二安装面4120a上。
在一些实施例中，发射底座410a的内壁上设置有注胶槽4123a，通过该注胶槽4123a向点胶槽4121a注入胶水，以方便注入胶水来固定合波器404a。
在将合波器404a通过点胶槽4121a固定在第二安装面4120a上后，在通孔4113a内插入光纤耦合器，该光纤耦合器的入光端与合波器404a的出光端相对设置，光纤耦合器的出光端通过内部光纤与光纤适配器600连接，使得合波器404a输出的复合光经光纤耦合器耦合至内部光纤，再经内部光纤耦合至光纤适配器600，实现了光的发射。
为了实现对四波混频的压制，本公开在第二安装面4120a上还设置有偏振合波器405a，该偏振合波器405a由滤波器与半波片组合形成；偏振合波器405a位于合波器404a与光纤耦合器之间，在进行四路光合波操作的同时，通过偏振合波器405a实现相邻光通道的偏振方向处于正交状态，最终实现对四波混频的压制，从而提高信号的传输效果。
根据一些实施例，第二安装面4120a上还可以设置光隔离器406a，该光隔离器406a位于合波器404a与光纤耦合器之间，以对反射的光进行隔离，使得反射后的光无法透过光隔离器406a。
根据一些实施例，在准直透镜402a与合波器404a之间还可设置平移棱镜403，用于将经过准直透镜的平行光平移一定的高度，由此抬升光发射芯片401a发射的信号光。可设置一个或多个平移棱镜，与多个光发射芯片一一对应。
在装配光发射部件400时，需首先将半导体制冷器420安装在发射底座410a的第一安装面4119a上，然后将一个光发射芯片401a安装在一个基板430上，然后将四个基板430并排固定在半导体制冷器420的制冷面上，然后将准直透镜402a安装在半导体制冷器420的制冷面上，并使得准直透镜402a位于光发射芯片401a的出光方向上；然后将合波器404a通过点胶槽4121a安装在发射底座410a的第二安装面4120a上，将合波器404a的四个入光口与四个准直透镜402a对应设置，使得四个光发射芯片401a发射的不同波长的信号光经四个入光口射入合波器404a内；然后将偏振合波器405a安装在第二安装面4120a上，将合波器404a的两个出光口与偏振合波器405a的两个入光口对应设置，使得合波器404a输出的第一子信号光束射入偏振合波器405a内，合波器404a输出的第二子信号光束通过半波片4051a射入偏振合波器405a内；然后将光隔离器406a安装在第二安装面4120a上，使得偏振合波器405a输出的一路复合光束直接透过光隔离器406a；然后将光纤耦合器407a通过通孔4113a插入安装槽4105a内，使得光纤耦合器407a的入光端与偏振合波器405a的出光口对应设置，以将偏振合波器405a输出的复合光束耦合至内部光纤，经由内部光纤传输至光纤适配器600，实现了多波合束的通信方式。
将半导体制冷器420、基板430、光发射芯片401a、准直透镜402a、合波器404a、偏振合波器405a、光隔离器406a与光纤耦合器407a安装至发射底座410a内后，将发射底座410a的凸台410a-2插入安装孔302内，此时电路板300的正面抵住底座主体410a-1的底面4107a，以通过电路板300支撑固定发射底座410a；然后通过打线连接电路板300与光发射芯片401a，以驱动光发射芯片401a产生不同波长的发射光。
发射底座410a的凸台410a-2插入安装孔302后，将发射盖板4101a盖合在底座主体410a-1的装配面4104a上，并将发射盖板4101a上的突出板4102a插入底座主体410a-1的缺口4106a内，以通过发射盖板4101a与发射底座410a形成发射腔，将半导体制冷器420、基板430、光发射芯片401a、准直透镜402a、合波器404a、偏振合波器405a、光隔离器406a与光纤耦合器407a等封装在该发射腔内。
根据一些实施例，也可先将发射底座410a的凸台410a-2插入安装孔302，然后将半导体制冷器420、基板430、光发射芯片401a、准直透镜402a、合波器404a、偏振合波器405a、光隔离器406a与光纤耦合器407a等安装至发射底座410a内的安装槽4105a内，然后将发射盖板4101a盖合在发射底座410a上，以实现光发射部件400的装配。
根据一些实施例，光发射部件400中发射底座410a的结构并不仅限于上述的结构，也可是其他结构。
例如，图28为根据一些实施例的一种光模块中光发射部件的结构示意图二；图29为根据一些实施例的一种光模块中支承板的结构示意图支撑板。如图28、图29所示，光发射部件400包括支承板410b，该支承板410b的顶面与电路板300的正面相平行；电路板300上设置有安装孔302，支承板410b布置在安装孔302的下方、支承板410b的顶面与电路板300的背面粘接固定，实现了支承板410b与电路板300的固定装配。
该支承板410b包括第三安装面4119b，该第三安装面4119b凹陷于支承板410b的顶面，且该第三安装面4119b上安装有半导体制冷器420，半导体制冷器420的制冷面上并排设置有多个基板430，每个基板430上均设置有一个光发射芯片401b；半导体制冷器420的制冷面上还并排设置有多个准直透镜402b，每个准直透镜402b位于每个光发射芯片401b的出光方向上。
支承板410b还包括第四安装面4120b，该第四安装面4120b突出于支承板410b的顶面，且第四安装面4120b上设置有第一限位板4124b与第二限位板4125b，第一限位板4124b与第二限位板4125b相对设置。第四安装面4120b上设置有合波器404b，该合波器404b位于第一限位板4124b与第二限位板4125b之间，通过第一限位板4124b与第二限位板4125b对合波器404b进行限位，使得合波器404b的四个入光口与四个光发射芯片401b相对设置，如此四个光发射芯片401b发射的λ1、λ2、λ3、λ4的发射光经由四个入光口射入合波器404b内。
合波器404b具有两个出光口，一个出光口射出波长不相邻的λ1、λ3的第一子信号光束，另一个出光口射出波长不相邻的λ2、λ4的第二子信号光束。
第四安装面4120b上还设置有偏振合波器405b，该偏振合波器405b具有两个入光口，一个入光口处设置有半波片4051b，这两个入光口与合波器404b的两个出光口相对设置，如此，合波器404b的一个出光口射出的第一子信号光束通过一个入光口射入偏振合波器405b内；合波器404b的另一个出光口射出的第二子信号光束经由半波片4051b进行偏振方向的旋转，旋转后的第二子信号光束经由另一个入光口射入偏振合波器405b；第一子信号光束与旋转后的第二子信号光束在偏振合波器405b内进行偏振合波，输出一路复合光束，该复合光束中各波长发射光处于交替正交的偏振方向。
支承板410b上还设置有第五安装面4126b，该第五安装面4126b突出于支承板410b的顶面，且低于第四安装面4120b。第五安装面4126b上设置有光纤耦合器407b，该光纤耦合器407b的入光端与偏振合波器405b的出光口对应设置，光纤耦合器407b的出光口与内部光纤700连接，如此偏振合波器405b输出的复合光束经光纤耦合器407b耦合至内部光纤700，通过内部光纤700传输至光纤适配器600，实现了光的发射。
根据一些实施例，光纤耦合器407b的入光面因介质不同易发生反射，反射后的复合光束可能会按照原路返回光发射芯片401b，为了解决这一问题，第四安装面4120b上还设置有光隔离器406b，该光隔离器406b与偏振合波器405b的出光口对应设置，偏振合波器405b射出的复合光束直接透过光隔离器406b射入光纤耦合器407b，光纤耦合器407b的入光面产生的反射光束无法透过光隔离器406b。
根据一些实施例，在准直透镜402b与合波器404b之间还可设置平移棱镜403，用于将经过准直透镜的平行光平移一定的高度，由此抬升光发射芯片401b发射的信号光。
图30为根据一些实施例的光模块中光发射部件的侧视图。如图30所示，将半导体制冷器420、基板430、光发射芯片401b与准直透镜402b安装在第三安装面4119b后，光发射芯片401b的打线高度与电路板300的正面相平齐，以减小打线长度。
将合波器404b、偏振合波器405b、光隔离器406b安装在第四安装面4120b，将光纤耦合器407b安装在第五安装面4126b后，光发射芯片410b、准直透镜402b、合波器404b、偏振合波器405b、光隔离器406b与光纤耦合器407b的光轴位于同一直线上，如此，四个光发射芯片401b产生波长为λ1、λ2、λ3、λ4的四路发射光，四路发射光经准直透镜402b转换为四路平行光，四路平行光经合波器404b的四个入光口射入合波器404b，四路平行光在合波器404b内进行反射、透射，通过两个出光口射出波长为λ1、λ3的第一子信号光束及波长为λ2、λ4的第二子信号光束，第一子信号光束直接进入偏振合波器405b，第二子信号光束经半波片4051b进行偏振方向旋转后进入偏振合波器405b，第一子信号光束与旋转后的第二子信号光束在偏振合波器405b内复合成一路复合光束，复合光束透过光隔离器406b，经光纤耦合器407b耦合至内部光纤700，通过内部光纤700传输至光纤适配器600，实现了多波合束的通信方式。
根据一些实施例，在准直透镜402b与合波器404b之间设置了平移棱镜403，用于将经过准直透镜的平行光平移一定的高度。平移后的光束与合波器404b、偏振合波器405b、光隔离器406b与光纤耦合器407b的光轴位于同一直线上。
本公开通过在光模块中集成偏振控制器件，从而控制LWDM光学系统中的激光光束的偏振方向，旋转部分激光光束的偏振方向，再进行合光操作，从而使进入光纤中的相邻波长激光信号处于交替正交的偏振方向，实现了对四波混频的压制效果，减小了四波混频产生的通道间的干扰，有效提高了系统的信号传输质量。
由于以上实施方式均是在其他方式之上引用结合进行说明，不同实施例之间均具有相同的部分，本说明书中各个实施例之间相同、相似的部分互相参见即可。在此不再详细阐述。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。
以上所述的本公开实施方式并不构成对本公开保护范围的限定。

Claims (20)

  1. 一种光模块，包括：
    电路板，设有安装孔；
    光发射部件，与所述电路板电连接，用于发射不同波长的多个信号光；
    其中，所述光发射部件包括：
    发射底座，安装在所述安装孔中；
    多个光发射芯片，设置在所述发射底座中，与所述电路板电连接，用于产生不同波长的多个信号光；
    合波器，设置在所述发射底座上，位于所述信号光的出光方向上，用于将不同波长的信号光复合为第一子信号光束与第二子信号光束，所述第一子信号光束中的信号光波长不相邻，所述第二子信号光束中的信号光波长不相邻；以及
    偏振合波器，设置在所述发射底座上，位于所述合波器的出光方向上，用于对所述第一子信号光束进行偏振方向旋转，并将旋转后的第一子信号光束与所述第二子信号光束复合为复合信号光束，
    其中，所述发射底座设置有第一安装面和第二安装面，其中，第一安装面的高度低于第二安装面的高度，其中，所述光发射芯片安装在第一安装面上，所述合波器和偏振合波器安装在第二安装面上。
  2. 根据权利要求1所述的光模块，其中，所述发射底座包括：
    第一底板，其上表面与所述电路板的下表面连接，所述第一安装面形成在第一底板上；
    第二底板，其下表面与所述电路板的上表面连接，所述第二安装面形成在第二底板上；
    支撑板，设置于所述第一底板与所述第二底板之间并连接所述第一底板与所述第二底板。
  3. 根据权利要求2所述的光模块，其中，所述支撑板的侧壁设有透镜平台，其上设置平移棱镜，用于将所述光发射芯片的光轴抬升至所述第二底板的上方。
  4. 根据权利要求2所述的光模块，其中，所述第一底板的宽度大于所述安装孔的宽度，所述支撑板的宽度不大于所述安装孔的宽度，所述第二底板的宽度不大于所述支撑板的宽度。
  5. 根据权利要求2所述的光模块，其中，所述第一底板的上表面的部分区域向下凹陷，以形成所述第一安装面。
  6. 根据权利要求1所述的光模块，进一步包括光纤耦合器，设置在所述发射底座上，位于所述偏振合波器的出光方向上，用于将所述复合信号光束耦合至所述内部光纤，经由内部光纤传输至光纤适配器。
  7. 根据权利要求6所述的光模块，其中所述第二安装面进一步包括第三安装面，所述光纤耦合器安装在所述第三安装面上。
  8. 根据权利要求1所述的光模块，其中，所述多个光发射芯片包括第一光发射芯片、第二光发射芯片、第三光发射芯片和第四光发射芯片，用于发射波长依次增加、且偏振方向一致的第一信号光、第二信号光、第三信号光和第四信号光；
    所述合波器将所述第一信号光和所述第三信号光合并为第一子信号光束，并将所述第二信号光和所述第四信号光合并为第二子信号光束。
  9. 根据权利要求1所述的光模块，其中，所述偏振合波器包括半波片、第一反射镜与第二反射镜，所述半波片与所述合波器的一出光口对应设置，用于对所述出光口射出的子信号光束进行偏振方向旋转；
    所述第一反射镜与所述合波器的另一出光口对应设置，所述第二反射镜与所述第一反射镜平行设置；所述第二反射镜用于将旋转后的所述子信号光束反射至所述第一反射镜，所述第一反射镜用于对所述合波器输出的子信号光束与旋转后的子信号光束进行合波，以输出一路复合光束。
  10. 根据权利要求1所述的光模块，其中，所述第一子信号光束偏振方向的偏转角度为70°-120°。
  11. 根据权利要求8所述的光模块，其中，所述第一子信号光束偏振方向的偏转角度为90°。
  12. 根据权利要求1所述的光模块，其中，
    所述发射底座包括底座主体与凸台，所述凸台自所述底座主体的底面向下延伸，其中，所述凸台嵌在所述安装孔内，使得所述底座主体的底面与所述电路板的正面相抵接；
    所述底座主体与凸台内形成有安装槽，所述多个光发射芯片、合波器、偏振合波器设置在所述安装槽内；
    其中，所述安装槽的一侧设置有开孔，所述电路板通过所述开孔插入所述安装槽内。
  13. 根据权利要求12所述的光模块，其中，所述发射底座还包括发射盖板，所述底座主体朝上的一侧形成开口，发射盖板盖设于该开口上，由此形成发射腔，所述光发射芯片、合波器、偏振合波器设置在所述安装槽内设置在所述发射腔内。
  14. 根据权利要求13所述的光模块，其中，所述第一安装面与所述开孔相连通，半导体制冷器安装在所述第一安装面上，所述半导体制冷器的制冷面上设置有基板；所述光发射芯片设置在所述基板上，并通过打线与电路板的正面电连接。
  15. 根据权利要求14所述的光模块，其中，所述光发射芯片的打线高度与所述电路板的正面平齐。
  16. 根据权利要求12所述的光模块，其特征在于，所述第二安装面上设置有点胶槽，所述合波器通过所述点胶槽固定在所述第二安装面上。
  17. 根据权利要求16所述的光模块，其特征在于，所述发射底座的侧壁上设置有注胶槽，所述注胶槽与所述点胶槽相连通，通过所述注胶槽向所述点胶槽注入胶水。
  18. 根据权利要求1所述的光模块，其中，所述发射底座包括支承板，所述支承板的顶面与电路板的背面粘接固定。
  19. 根据权利要求18所述的光模块，其中，所述第一安装面和第二安装面形成在所述支承板上，所述第一安装面凹陷于支承板的顶面，所述第二安装面突出于支承板的顶面，
    其中，半导体制冷器设置在所述第一安装面上，所述半导体制冷器的制冷面上设置有基板；所述光发射芯片设置在所述基板上，通过打线与所述电路板的正面电连接。
  20. 根据权利要求19所述的光模块，其中，所述光发射芯片的打线高度与所述电路板的正面平齐。
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203638A (ja) * 2000-01-21 2001-07-27 Mitsubishi Electric Corp 光合波回路
JP2002048928A (ja) * 2000-08-02 2002-02-15 Sumitomo Electric Ind Ltd 光通信伝送路および光通信システム
JP2004253931A (ja) * 2003-02-19 2004-09-09 Nec Corp 直交偏波多重伝送装置
CN204925459U (zh) * 2015-07-24 2015-12-30 福州百讯光电有限公司 一种多波长单纤双向光收发模块
CN213457454U (zh) * 2020-09-30 2021-06-15 武汉联特科技股份有限公司 一种具有合波耦合功能的多通道光发射组件
CN214278497U (zh) * 2021-03-31 2021-09-24 青岛海信宽带多媒体技术有限公司 一种光模块
CN114095114A (zh) * 2021-11-23 2022-02-25 四川光恒通信技术有限公司 多波长复用的激光发射器
CN218547061U (zh) * 2022-08-16 2023-02-28 青岛海信宽带多媒体技术有限公司 一种光模块

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203638A (ja) * 2000-01-21 2001-07-27 Mitsubishi Electric Corp 光合波回路
JP2002048928A (ja) * 2000-08-02 2002-02-15 Sumitomo Electric Ind Ltd 光通信伝送路および光通信システム
JP2004253931A (ja) * 2003-02-19 2004-09-09 Nec Corp 直交偏波多重伝送装置
CN204925459U (zh) * 2015-07-24 2015-12-30 福州百讯光电有限公司 一种多波长单纤双向光收发模块
CN213457454U (zh) * 2020-09-30 2021-06-15 武汉联特科技股份有限公司 一种具有合波耦合功能的多通道光发射组件
CN214278497U (zh) * 2021-03-31 2021-09-24 青岛海信宽带多媒体技术有限公司 一种光模块
CN114095114A (zh) * 2021-11-23 2022-02-25 四川光恒通信技术有限公司 多波长复用的激光发射器
CN218547061U (zh) * 2022-08-16 2023-02-28 青岛海信宽带多媒体技术有限公司 一种光模块

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