WO2024026732A1 - 显示模组及显示装置 - Google Patents

显示模组及显示装置 Download PDF

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Publication number
WO2024026732A1
WO2024026732A1 PCT/CN2022/109977 CN2022109977W WO2024026732A1 WO 2024026732 A1 WO2024026732 A1 WO 2024026732A1 CN 2022109977 W CN2022109977 W CN 2022109977W WO 2024026732 A1 WO2024026732 A1 WO 2024026732A1
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WO
WIPO (PCT)
Prior art keywords
display module
main body
display
circuit board
flexible circuit
Prior art date
Application number
PCT/CN2022/109977
Other languages
English (en)
French (fr)
Other versions
WO2024026732A9 (zh
Inventor
胡耀
陈义鹏
石领
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202280002540.6A priority Critical patent/CN117882508A/zh
Priority to PCT/CN2022/109977 priority patent/WO2024026732A1/zh
Publication of WO2024026732A1 publication Critical patent/WO2024026732A1/zh
Publication of WO2024026732A9 publication Critical patent/WO2024026732A9/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present disclosure belongs to the field of display technology, and specifically relates to a display module and a display device.
  • narrow frame or frameless display screen has gradually become a mainstream product in the market.
  • achieving narrow borders or no borders is mainly achieved by reducing the lower border of the display screen.
  • the display driver chip, touch driver chip and other components can be folded through the chip on film (COF) process. to the back of the display panel to reduce the bezels.
  • COF chip on film
  • the flip-chip film process generally fixes the touch driver chip and other front components into a flexible circuit board, and then folds it through the flexible circuit board.
  • the flexible circuit board occupies a large amount of space on the back of the display screen, resulting in an obvious lack of space reserved for the battery. In this way, the battery capacity will be significantly reduced, affecting the standby time of the display device.
  • the flexible circuit board can be bent twice to reduce the space it occupies, due to the presence of touch driver chips and other components, the space saved is still limited, and the standby time of the display device still cannot be effectively improved. .
  • the present disclosure aims to solve at least one of the technical problems existing in the prior art and provide a display module and a display device.
  • an embodiment of the present disclosure provides a display module, wherein the display module includes: a display panel, a driving chip and passive components electrically connected to the display panel; the driving chip and the The passive device is packaged in a grid array packaging structure;
  • the grid array packaging structure is integrated on the display panel.
  • the display panel includes: a main body part and a bending part connected to one side of the main body part;
  • the bending portion is bent in a direction away from the display surface of the main body portion and extends in a direction parallel to the main body portion.
  • the grid array packaging structure is located on a side of the bent portion away from the main body portion.
  • the display module further includes: a flexible circuit board bound and connected to a side of the bending portion away from the main body;
  • the flexible circuit board is bent along a side close to the main body part, and is bent to a side of the bending part close to the main body part.
  • the display module further includes: a flexible circuit board bound and connected to a side of the bending portion away from the main body;
  • the flexible circuit board extends along the extending direction of the bending portion and covers the bending portion.
  • the grid array packaging structure is located on a side of the bending part close to the main body part.
  • the display module further includes: a flexible circuit board bound and connected to the side of the bending portion close to the main body;
  • the flexible circuit board is bent along a side away from the main body part, and is bent to a side of the bending part away from the main body part.
  • the display module further includes: a flexible circuit board bound and connected to a side of the bending portion close to the main body;
  • the flexible circuit board extends along the bending part and covers the bending part.
  • the grid array packaging structure is located in an area outside the binding area between the flexible circuit board and the bending portion.
  • the flexible circuit board has a hollow portion; the grid array packaging structure is embedded in the hollow portion.
  • the display module further includes: a connecting device;
  • the connecting device is electrically connected to the flexible circuit board.
  • the driver chip includes: a touch driver chip and a display driver chip;
  • the passive components include: capacitors, resistors, crystal oscillators and memories.
  • the display panel and the flexible circuit board are connected through a first metal trace, and the driver chip and the flexible circuit board are connected through a second metal trace; the first metal trace and the The extending directions of the second metal traces intersect, and an anti-interference layer is provided between them.
  • the display module further includes: a polarizing layer, a touch panel, and a cover;
  • the polarizing layer is located on one side of the display surface of the main body part;
  • the touch panel is located on a side of the polarizing layer away from the main body;
  • the cover is located on a side of the touch panel away from the main body.
  • an embodiment of the present disclosure also provides a display device, wherein the display device includes the display module provided as above and a power supply, and the power supply is located on a side of the main body away from its display surface. .
  • Figure 1 is a schematic structural diagram of an exemplary display module.
  • Figure 2 is a schematic structural diagram of another exemplary display module.
  • FIG. 3 is a schematic structural diagram of a display module provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of another display module provided by an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of another display module provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of yet another display module provided by an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of a grid array packaging structure in a display module according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic plan view of a partial structure of a display module according to an embodiment of the present disclosure.
  • FIG. 9 is a schematic cross-sectional structural diagram of the display module shown in FIG. 8 along the A-A’ direction.
  • FIG. 1 is a schematic structural diagram of an exemplary display module.
  • the display module includes: a display panel 101; the display panel 101 includes: a main body part 101a and a bend connected to one side of the main body part 101a. Folded portion 101b. The bending portion 101b is bent in a direction away from the display surface of the main body portion 101a, and the portion of the bending portion 101b is parallel to the main body portion 101a.
  • the display module also includes: a display driver chip DDIC, a touch driver chip TIC and passive components 102 that are electrically connected to the display panel 101 .
  • the display driver chip DDIC is located on the side of the bent portion 101b away from the main body 101a.
  • the touch driver chip TIC and the passive device 102 are fixed on the flexible circuit board 103, and are bonded to the display panel 101 through the flexible circuit board 103. .
  • the flexible circuit board 103 in the display module directly extends in the direction away from the bending portion 101b to electrically connect with other structures in the display module.
  • the flexible circuit board 103 occupies a large amount of space on the back of the main body 101a. , resulting in an obvious lack of space reserved for the battery, which will significantly reduce the battery capacity and affect the standby time of the display device.
  • FIG 2 is a schematic structural diagram of another exemplary display module.
  • the difference between the display module shown in Figure 2 and the display module shown in Figure 1 is that in the display module shown in Figure 2, the flexible The circuit board 103 is bent twice. Although the flexible circuit board 103 is bent twice to reduce the space it occupies, due to the presence of the touch driver chip TIC and the passive device 102, the space saved is reduced. It is still limited and cannot effectively improve the standby time of the display device.
  • embodiments of the present disclosure provide a display module and a display device.
  • the display module and display device provided by the embodiments of the present disclosure will be further described below in conjunction with the drawings and specific implementations. describe.
  • FIG 3 is a schematic structural diagram of a display module provided by an embodiment of the present disclosure.
  • the display module includes: a display panel 101, a driver chip and a passive device 102 electrically connected to the display panel 101;
  • the chip and passive device 102 are packaged in a grid array packaging structure 104; the grid array packaging structure 104 is integrated on the display panel 101.
  • the driver chip and passive device 102 in the display module can provide driving signals to the display panel 101 to control the display panel 101 to display a preset display screen to realize the display function.
  • the driving chip and passive device 102 and other structures are packaged in the grid array packaging structure 104.
  • the grid array packaging structure 104 can be directly electrically connected to the display panel 101 through the metal bumps on it, so that the grid array packaging structure
  • the structure 104 is integrated on the display panel 101 .
  • structures such as the driver chip and the passive device 102 are packaged in the grid array packaging structure 104.
  • the grid array packaging structure 104 is directly integrated on the display panel 101. There is no need to install the driver chip. and passive components 102 and other structures are fixed on the flexible circuit board. This can save the space occupied by the flexible circuit board and provide a larger reserved space for the battery, thereby increasing the capacity of the battery and thereby increasing the standby time of the display device.
  • the display panel 101 includes: a main body part 101a and a bending part 101b connected to one side of the main body part 101a; the bending part 101b is along a direction away from the display surface of the main body part 101a. It is bent and extends in a direction parallel to the main body 101a.
  • the main body part 101a has a display function and can display a preset display screen.
  • the bending part 101b can be bent in a direction away from the display surface of the main body part 101a. It is not necessary to provide a large amount of metal on one side of the display surface of the main body part 101a.
  • the wiring is used to electrically connect the driver chip and other circuit structures to avoid the influence of a large number of metal wiring on the display effect of the main body 101a, thereby reducing the frame of the overall display panel 101 and achieving a narrow frame or frameless display effect. Can improve user experience.
  • the bending portion 101b extends in a direction parallel to the main body portion 101a.
  • the bending portion 101b can provide a relatively flat bearing plane for the grid array packaging structure 104 and avoid the gap between the grid array packaging structure 104 and the bending portion 101. There is a poor connection that affects the display effect.
  • the display module has a display area and a peripheral area surrounding the display area.
  • the main body portion 101a of the display panel 101 is disposed in the display area.
  • the main body portion 101a of the display panel 101 is provided with a plurality of gate lines extending along the first direction and a plurality of data lines extending along the second direction. (Date Line), the first direction and the second direction cross each other. Multiple gate lines and multiple data lines intersect to define multiple pixel areas.
  • Each pixel area is provided with a pixel unit (Pixel).
  • Each pixel unit includes: a pixel driving circuit and a light-emitting device connected to the pixel driving circuit.
  • the pixel driving circuit may specifically have a 7T1C structure, that is, the pixel driving circuit has 7 transistors and 1 storage capacitor.
  • the 7T1C structure For its circuit structure, reference may be made to the 7T1C structure in related technologies.
  • the light-emitting device in the pixel driving circuit can be an organic light-emitting element, such as an organic light-emitting diode (OLED).
  • each of the seven transistors in the pixel driving circuit may be a P-type transistor, or may be an N-type transistor.
  • the first to seventh transistors T1 to T7 may all be P-type transistors or all be N-type transistors.
  • the transistors used in the embodiments of the present disclosure may be thin film transistors, field effect transistors, or other switching devices with the same characteristics.
  • the thin film transistors may include oxide semiconductor thin film transistors, amorphous silicon thin film transistors, or polycrystalline silicon thin film transistors. .
  • the source and drain of a transistor can be symmetrical in structure, so there can be no difference in physical structure between the source and drain.
  • the transistors in addition to the gate electrode as the control electrode, one of them is directly described as the first electrode and the other as the second electrode. Therefore, in the embodiments of the present disclosure, the third electrode of all or part of the transistors is The first and second poles are interchangeable as needed.
  • the pixel driving circuit of the pixel unit can also be a structure including other numbers of transistors, such as a 7T2C structure, a 6T1C structure, 6T2C structure or 9T2C structure, the embodiment of the present disclosure does not limit this.
  • Multiple gate lines can be extended to the peripheral area on one side of the display area and connected to the gate drive circuit.
  • the gate drive circuit can provide scanning signals to the pixel units in the display area through the gate lines, so that the pixel units in the display area are sequentially rows to scan.
  • Multiple data lines can be extended to the peripheral area on one side of the display and connected to the source driving circuit.
  • the source driving circuit can provide data signals to the pixel units in the display area through the data lines, and with the cooperation of the scanning signals, row by row Light the light-emitting devices in each row of pixel units to achieve the display function.
  • the bending portion 101b of the display panel 101 may be disposed in the peripheral area, and the bending portion 101b may face the side of the main body portion 101a of the display panel 101 away from the display surface.
  • the bending portion 101 also has a certain display function, which allows the edge of the display panel 101 to be displayed, so as to hide the frame of the display panel 101, reduce the frame of the display panel 101, and improve the display effect.
  • the display module also has a binding area disposed on a side of the peripheral area away from the display area.
  • a plurality of contact pads are provided in the binding area, and each contact pad is configured to electrically connect the terminals extending from the display area or the peripheral area. signal line.
  • the contact pad can be exposed on the surface of the bonding area, that is, not covered by any film layer, so that the edge is electrically connected to the flexible circuit board 103 .
  • the flexible circuit board 103 is electrically connected to the external control main board, and is configured to transmit signals or power from the external control main board.
  • the contact pad is electrically connected to the common signal line, the contact pad is electrically connected to the touch signal line, the contact pad is electrically connected to the drive signal line, the contact pad is electrically connected to the data connection line (the data connection line is electrically connected to the data line in the display area) Electrical connections and more.
  • the contact pads are electrically connected to each signal line, thus enabling mutual communication between the signal lines and the flexible circuit board 103 . There are no specific restrictions on the number and arrangement of contact pads, and they can be set according to actual needs.
  • the grid array packaging structure 104 is located on a side of the bent portion 101b away from the main body 101a.
  • the grid array packaging structure 104 can be specifically located on the side of the bent portion 101b away from the main body 101a. Since the portion of the bent portion 101b is parallel to the main body 101a, the bent portion 101b facing away from the main body 101a can be the grid array packaging structure 104. A relatively flat carrying plane is provided to avoid poor connection between the grid array packaging structure 104 and the bending portion 101, which would affect the display effect.
  • the display module further includes: a flexible circuit board 103 bound and connected to the side of the bent portion 101b away from the main body 101a; One side is bent to the side of the bent portion 101b close to the main body 101a.
  • the flexible circuit board 103 can be bonded and connected to the side of the bending portion 101b away from the main body 101a, and can be bent again, so that the flexible circuit board 103 is bent to the side of the bending portion 101b close to the main body 101a, and the flexibility can be seen.
  • Most of the circuit board 103 is accommodated in the space between the main body part 101a and the bending part 101b. Therefore, the space occupied by the flexible circuit board 103 can be saved, and a larger reserved space can be provided for the battery, thereby improving the battery performance. capacity, thereby improving the standby time of the display device.
  • FIG 4 is a schematic structural diagram of another display module provided by an embodiment of the present disclosure.
  • the display module also includes: a flexible circuit board bound and connected to the side of the bending portion 101b away from the main body 101a. 103;
  • the flexible circuit board 103 is bent along the side away from the main body part 101a, and is bent to the side of the bending part 101b away from the main body part 101a.
  • the difference between the display module shown in Figure 4 and the display module shown in Figure 3 is that the flexible circuit board 103 and the bending portion 101b in the display module shown in Figure 4 are reversely bound, and the flexible circuit The board 103 extends along the bent portion 101b, so that the flexible circuit board 103 can cover the bent portion 101b, but does not cover the edge of the bent portion 101b.
  • the space reserved for the battery can be extended to the edge of the bent portion 101b. , therefore, the space occupied by the flexible circuit board 103 can be further saved, and the reserved space of the battery can be increased, thereby increasing the capacity of the battery, and thereby increasing the standby time of the display device.
  • FIG. 5 is a schematic structural diagram of another display module provided by an embodiment of the present disclosure. As shown in FIG. 5 , the grid array packaging structure 104 is located on the side of the bent portion 101b close to the main body 101a.
  • the grid array packaging structure 104 can also be located on the side of the bent portion 101b close to the main body 101a. Since the portion of the bent portion 101b is parallel to the main body 101a, the bent portion 101b can be a grid array packaging structure away from the main body 101a. 104 provides a relatively flat carrying plane to avoid poor connection between the grid array packaging structure 104 and the bending portion 101, which would affect the display effect.
  • the display module further includes: a flexible circuit board 103 bound and connected to the side of the bending portion 101b close to the main body 101a; the flexible circuit board 103 is along a side away from the main body 101a. Bend the side to the side of the bent portion 101b away from the main body 101a.
  • the flexible circuit board 103 can be bonded and connected to the side of the bending portion 101b close to the main body 101a, and can be bent again, so that the flexible circuit board 103 is bent to the side of the bending portion 101b away from the main body 101a, and the flexibility can be seen.
  • Most of the circuit board 103 is accommodated in the space between the main body part 101a and the bending part 101b. Therefore, the space occupied by the flexible circuit board 103 can be saved, and a larger reserved space can be provided for the battery, thereby improving the battery performance. capacity, thereby improving the standby time of the display device.
  • FIG 6 is a schematic structural diagram of yet another display module provided by an embodiment of the present disclosure.
  • the display module also includes: a flexible circuit board bound and connected to the side of the bending portion 101b close to the main body 101a. 103;
  • the flexible circuit board 103 extends along the bending portion 101b and covers the bending portion 101b.
  • the difference between the display module shown in Figure 6 and the display module shown in Figure 5 is that the flexible circuit board 103 and the bending portion 101b in the display module shown in Figure 6 are reversely bound, and the flexible circuit The board 103 extends along the bent portion 101b, so that the flexible circuit board 103 can cover the bent portion 101b, but does not cover the edge of the bent portion 101b.
  • the space reserved for the battery can be extended to the edge of the bent portion 101b. , therefore, the space occupied by the flexible circuit board 103 can be further saved, and the reserved space of the battery can be increased, thereby increasing the capacity of the battery, and thereby increasing the standby time of the display device.
  • the grid array packaging structure 104 is located in an area outside the binding area of the flexible circuit board 103 and the bending portion 101 b.
  • the flexible circuit board 103 extends in a direction away from the grid array packaging structure 104 after being bound and connected to the bending portion 101 b of the display panel 101 .
  • the flexible circuit board 103 extends in a direction away from the grid array packaging structure 104 .
  • 103 does not cover other areas outside the binding area of the bent portion 101b of the display panel 101, and the grid array packaging structure 104 can be disposed in an area outside the binding area.
  • the flexible circuit board 103 and the grid array packaging structure 104 do not overlap each other, and the traces connecting the two have less overlap. Therefore, it is conducive to simplifying the structure of the display module and simplifying the complexity of the traces in the display module. degree, thereby saving preparation costs.
  • the flexible circuit board 103 has a hollow portion 103a; the grid array packaging structure 104 is embedded in the hollow portion 103a.
  • the flexible circuit board 103 extends toward the defense line close to the grid array packaging structure 104 after being bound and connected to the bending portion 101 b of the display panel 101 .
  • the flexible circuit board 103 It will cover the bent portion 101b of the display panel 101 and cover the grid array packaging structure 104 on the bent portion 101b.
  • a hollow portion 103a can be formed in the flexible circuit board 103, and the grid array packaging structure 104 can be embedded in the hollow portion 103a. This can prevent the flexible circuit board 103 from lifting at the position corresponding to the grid array packaging structure 104, thus ensuring that the flexible circuit board
  • the smooth surface of 103 is conducive to the lamination of other film layers. It can also reduce the thickness of the display module, which is conducive to the thinning of the display module.
  • the display module further includes: a connecting device Connector; the connecting device Connetor is electrically connected to the flexible circuit board 103 .
  • the connecting device Connector can be directly arranged on the circuit structure external to the flexible circuit board 103, such as a control motherboard, etc., and can be connected to the flexible circuit board 103 through the connecting device Connector and input control signals.
  • FIG. 7 is a schematic diagram of a grid array packaging structure in a display module provided by an embodiment of the present disclosure.
  • the grid array packaging structure 104 includes: a packaging substrate 1041; The driver chip and the passive device 102 on the driver chip and the packaging layer 1042 covering the driver chip and the passive device 102 .
  • the driver chip and the passive device 102 can be completely packaged in the packaging space formed by the packaging substrate 1041 and the packaging layer 1042 .
  • the grid array packaging structure 104 can be integrated with the display panel 101 as an independent structure.
  • the driver chip includes: a touch driver chip TIC and a display driver chip DDIC;
  • the passive device 102 includes: a capacitor (not shown in the figure), a resistor R, a crystal oscillator (not shown in the figure) shown) and memory (not shown).
  • a plurality of metal bumps 1043 are provided on the back of the packaging substrate 101.
  • the touch driver chip TIC and the display driver chip DDIC can be electrically connected to the metal bumps 1043 through gold wires, and the resistor R can be directly connected to the metal bumps 1043.
  • the metal bumps 1043 can be directly electrically connected to the connection pads in the display panel 101, thus eliminating the need for wiring processes.
  • the display panel 101 and the flexible circuit board 103 are connected through a first metal trace 201, and the driver chip and the flexible circuit board 103 are connected through a second metal trace 202; first The extending directions of the metal trace 201 and the second metal trace 202 intersect, and an anti-interference layer 203 is provided between them.
  • the display driver chip DDIC and the touch driver chip TIC are packaged in the grid array packaging structure 104, they still need the first metal trace 201 to be electrically connected to the flexible circuit board 103. At the same time, the display panel 101 and the flexible circuit board 103 are still required to be electrically connected.
  • the circuit boards 103 are electrically connected through second metal traces 202 , and the extending directions of the first metal traces 201 and the second metal traces 202 intersect.
  • An anti-interference layer 203 is provided between the first metal trace 201 and the second metal trace 202 to avoid crosstalk between the signal transmitted in the first metal trace 201 and the signal transmitted in the second metal trace 202 , affecting the display effect.
  • the anti-interference layer can be formed using organic materials using an inkjet printing process, and its thickness can be greater than or equal to 8 microns to ensure a large distance between the first metal trace 201 and the second metal trace 202 to ensure anti-crosstalk. Effect.
  • the thickness of the anti-interference layer 203 should not be too thick, for example, it can be less than or equal to 15 microns, so as to avoid increasing the overall thickness of the display module and affecting the thinness of the display module.
  • the display module also includes: a polarizing layer 105, a touch panel 106, and a cover 107; the polarizing layer 105 is located on one side of the display surface of the main body 101a; the touch panel 106 is located on the polarizing layer 105 away from the main body. The cover 107 is located on the side of the touch panel 106 away from the main body 101a.
  • the display panel 101 may specifically be an organic light-emitting diode (OLED) display panel.
  • the polarizing layer 105 may be located on one side of the display surface of the display panel 101a.
  • the polarizing layer 105 may convert ambient light into linearly polarized light.
  • the linearly polarized light is incident into the main body 101a of the display panel 101, is reflected by the anode and other film layers, and then irradiated to the polarizing layer 105. Due to the reflection, the polarization direction of the linearly polarized light changes and cannot be emitted from the polarizing layer 105. , can prevent the reflection of ambient light, thereby improving the display effect of the display panel 101 .
  • a touch unit is provided in the touch panel 106 to locate the touch position of the user's finger to implement the touch function.
  • the cover 107 can be made of rigid materials such as glass to protect the touch panel 106, display panel 101, etc. covered by it from damage caused by external forces. Of course, in order to achieve functions such as folding, the cover 107 can also be made of flexible and transparent materials such as polyimide.
  • the display panel 101 further includes a barrier located in the peripheral area and surrounding the display area.
  • the barrier has a coffer structure, which can block external water vapor or oxygen from entering the display area, thereby avoiding impact on the display effect.
  • the barrier may be one or more.
  • the blocking ability can be enhanced.
  • the barrier includes a first barrier and a second barrier. The second barrier is located on a side of the first barrier away from the display area. This can further prevent external water vapor or oxygen from entering the display area and provide a double barrier to the display area.
  • the height of the first barrier is less than the height of the second barrier. In this way, the path for external water vapor and oxygen to enter the display area becomes longer, making it more difficult for them to enter the display area, further improving the blocking ability of the barrier.
  • the touch panel 106 includes a touch electrode (TE) and a touch signal line.
  • the touch electrode is located in the display area and is configured to detect the occurrence of a touch in the display area.
  • the touch electrode includes a first touch electrode and a second touch electrode.
  • a plurality of first touch electrodes constitute a first touch electrode line extending along the x direction
  • a plurality of second touch electrodes constitute a second touch electrode line extending along the y direction.
  • the plurality of first touch electrode lines and the plurality of second touch electrode lines cross each other, thereby forming a touch capacitance at the intersection positions of the first touch electrode lines and the second touch electrode lines.
  • the touch position is detected by detecting changes in the touch capacitance caused by, for example, the proximity of a finger during touch.
  • Each touch signal line is configured to be electrically connected to a touch electrode in the display area.
  • the touch signal line includes a first touch signal line and a second touch signal line.
  • Each first touch signal line is electrically connected to a first touch electrode line extending along the x direction
  • each second touch signal line is electrically connected to a second touch electrode line extending along the y direction.
  • each first touch control electrode line is electrically connected to a first touch control signal line
  • each second touch control electrode line is electrically connected to a second touch control signal line.
  • each touch control electrode line is electrically connected to a first touch control signal line.
  • the touch signal generated by the electrode can be transmitted to the peripheral area through the touch signal line, and is electrically connected to the external touch chip through the contact pad in the peripheral area.
  • an embodiment of the present disclosure provides a display device, which includes a display module as provided in any of the above embodiments and a power supply 108.
  • the power supply 108 is located on the side of the main body 101a away from its display surface.
  • the power supply 108 may be a battery.
  • the battery can provide power for other structures in the display module, such as the display panel 101, etc., so that the display module can implement display and touch functions.
  • the driving chips and passive devices 102 in the display module are all packaged in the grid array packaging structure 104.
  • the grid array packaging structure 104 is directly integrated on the display panel 101. There is no need to separate the driving chips, passive devices 102, etc.
  • the structure is fixed on a flexible circuit board.
  • the display device can be any product or component with a display function such as a mobile phone, a tablet computer, a television, a computer monitor, a notebook computer, a digital photo frame, a navigator, etc. Its implementation principle and beneficial effects are the same as those of the above-mentioned display module. The beneficial effects are the same and will not be repeated here.

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  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本公开提供一种显示模组及显示装置，属于显示技术领域，其可解决现有的显示模组中电池预留的空间明显不足，电池的容量会明显缩减，影响显示装置的待机时间的问题。本公开的显示模组包括：显示面板、及与显示面板电连接的驱动芯片和无源器件；驱动芯片和无源器件封装于栅格阵列封装结构中；栅格阵列封装结构集成于显示面板上。

Description

显示模组及显示装置 技术领域
本公开属于显示技术领域，具体涉及一种显示模组及显示装置。
背景技术
随着显示技术的发展，为了实现更大的显示面积和触控面积，窄边框或无边框的显示屏幕已经逐渐成为市场上的主流产品。目前，实现窄边框或无边框主要是通过减少显示屏幕下边框的方式来实现，可以将显示驱动芯片、触控驱动芯片和其他元器件等通过覆晶薄膜(chip on film，COF)工艺翻折到显示面板的背面，以实现减小边框的目的。
覆晶薄膜工艺一般是将触控驱动芯片和其他前器件等固定到柔性线路板中，再经柔性线路板进行翻折。然而，柔性线路板占用了显示屏幕背面大量的空间，导致为电池预留的空间明显不足，这样电池的容量会明显缩减，影响显示装置的待机时间。虽然可以对柔性线路板进行二次弯折来减小其所占用的空间，但是由于触控驱动芯片和其他元器件的存在，使得所节省的空间依然有限，依然无法有效提升显示装置的待机时间。
发明内容
本公开旨在至少解决现有技术中存在的技术问题之一，提供一种显示模组及显示装置。
第一方面，本公开实施例提供了一种显示模组，其中，所述显示模组包括：显示面板、及与所述显示面板电连接的驱动芯片和无源器件；所述驱动芯片和所述无源器件封装于栅格阵列封装结构中；
所述栅格阵列封装结构集成于所述显示面板上。
可选地，所述显示面板包括：主体部及与所述主体部的一侧连接的弯折部；
所述弯折部沿着背离所述主体部的显示面的方向弯折，且沿着与所述主体部平行的方向延伸。
可选地，所述栅格阵列封装结构位于所述弯折部背离所述主体部的一侧。
可选地，所述显示模组还包括：与所述弯折部背离所述主体部的一侧绑定连接的柔性线路板；
所述柔性线路板沿着靠近所述主体部的一侧弯折，并弯折至所述弯折部靠近所述主体部的一侧。
可选地，所述显示模组还包括：与所述弯折部背离所述主体部的一侧绑定连接的柔性线路板；
所述柔性线路板沿着所述弯折部延伸方向延伸并覆盖所述弯折部。
可选地，所述栅格阵列封装结构位于所述弯折部靠近所述主体部的一侧。
可选地，所述显示模组还包括：与所述弯折部靠近所述主体部一侧绑定连接的柔性线路板；
所述柔性线路板沿着背离所述主体部的一侧弯折，并弯折至所述弯折部背离所述主体部的一侧。
可选地，所述显示模组还包括：与所述弯折部靠近所述主体部的一侧绑定连接的柔性线路板；
所述柔性线路板沿着所述弯折部延伸并覆盖所述弯折部。
可选地，所述栅格阵列封装结构位于所述柔性线路板与所述弯折部的绑定区域之外的区域。
可选地，所述柔性线路板具有镂空部；所述栅格阵列封装结构嵌入所述 镂空部内。
可选地，所述显示模组还包括：连接器件；
所述连接器件与所述柔性线路板电连接。
可选地，所述驱动芯片包括：触控驱动芯片和显示驱动芯片；
所述无源器件包括：电容、电阻、晶振和存储器。
可选地，所述显示面板与所述柔性线路板通过第一金属走线连接，所述驱动芯片与所述柔性线路板通过第二金属走线连接；所述第一金属走线和所述第二金属走线的延伸方向相交，且二者之间设置有抗干扰层。
可选地，所述显示模组还包括：偏光层、触控面板、及盖板；
所述偏光层位于所述主体部的显示面的一侧；
所述触控面板位于所述偏光层背离所述主体部的一侧；
所述盖板位于所述触控面板背离所述主体部的一侧。
第二方面，本公开实施例还提供了一种显示装置，其中，所述显示装置包括如上述提供的显示模组及供电源，所述供电源位于所述主体部背离其显示面的一侧。
附图说明
图1为一种示例性的显示模组的结构示意图。
图2为另一种示例性的显示模组的结构示意图。
图3为本公开实施例提供的一种显示模组的结构示意图。
图4为本公开实施例提供的另一种显示模组的结构示意图。
图5为本公开实施例提供的又一种显示模组的结构示意图。
图6为本公开实施例提供的再一种显示模组的结构示意图。
图7为本公开实施例提供的显示模组中的栅格阵列封装结构的示意图。
图8为本公开实施例提供的显示模组中局部的结构的平面示意图。
图9为图8所示的显示模组沿A-A’方向上的截面结构示意图。
具体实施方式
为使本领域技术人员更好地理解本公开的技术方案，下面结合附图和具体实施方式对本公开作进一步详细描述。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
图1为一种示例性的显示模组的结构示意图，如图1所示，该显示模组包括：显示面板101；显示面板101包括：主体部101a及与主体部101a的一侧连接的弯折部101b。弯折部101b沿着背离主体部101a的显示面方向弯折，且弯折部101b的部分与主体部101a平行。显示模组还包括：与显示面板101电连接的显示驱动芯片DDIC、触控驱动芯片TIC和无源器件102。其中，显示驱动芯片DDIC位于弯折部101b背离主体部101a的一侧，触控驱动芯片TIC和无源器件102固定于柔性线路板103上，并通过柔性线路板103与显示面板101邦定连接。
由图1可见，显示模组中的柔性线路板103直接沿着远离弯折部101b的方向延伸以与显示模组中的其他结构电连接，柔性线路板103占用了主体 部101a背面大量的空间，导致为电池预留的空间明显不足，这样电池的容量会明显缩减，影响显示装置的待机时间。
图2为另一种示例性的显示模组的结构示意图，图2所示的显示模组与图1所示的显示模组的不同之处在于，图2所示的显示模组中，柔性线路板103进行了二次弯折，虽然对柔性线路板103进行二次弯折来减小其所占用的空间，但是由于触控驱动芯片TIC和无源器件102的存在，使得所节省的空间依然有限，依然无法有效提升显示装置的待机时间。
为了至少解决上述的技术问题之一，本公开实施例提供了一种显示模组及显示装置，下面将结合附图及具体实施方式，对本公开实施例提供的显示模组及显示装置进行进一步详细描述。
图3为本公开实施例提供的一种显示模组的结构示意图，如图3所示，显示模组包括：显示面板101、及与显示面板101电连接的驱动芯片和无源器件102；驱动芯片和无源器件102封装于栅格阵列封装结构104中；栅格阵列封装结构104集成于显示面板101上。
显示模组中的驱动芯片和无源器件102可以为显示面板101提供驱动信号，来控制显示面板101显示预设的显示画面，以实现显示功能。其中，驱动芯片和无源器件102等结构均封装于栅格阵列封装结构104中，栅格阵列封装结构104可以通过其上的金属凸块与显示面板101直接电连接，以使得栅格阵列封装结构104集成于显示面板101上。
本公开实施例提供的显示模组中，驱动芯片和无源器件102等结构均封装于栅格阵列封装结构104中，栅格阵列封装结构104直接集成于显示面板101上，可以不必将驱动芯片和无源器件102等结构固定在柔性线路板上。这样可以节省柔性线路板所占用的空间，为电池提供较大的预留空间，从而可以提高电池的容量，进而可以提高显示装置的待机时间。
在一些实施例中，如图3所示，显示面板101包括：主体部101a及与 主体部101a的一侧连接的弯折部101b；弯折部101b沿着背离主体部101a的显示面的方向弯折，且沿着与主体部101a平行的方向延伸。
主体部101a具有显示功能，可以显示预设的显示画面，弯折部101b可以沿着背离主体部101a的显示面的方向弯折，可以不必在主体部101a的显示面的一侧设置大量的金属走线来与驱动芯片等电路结构进行电连接，避免大量的金属走线对主体部101a的显示效果造成影响，从而可以缩小整体显示面板101的边框，实现窄边框或无边框的显示效果，进而可以提高用户的使用体验。同时，弯折部101b沿着与主体部101a平行的方向延伸，弯折部101b可以为栅格阵列封装结构104提供较为平整的承载平面，避免栅格阵列封装结构104与弯折部101之间出现连接不良而影响显示效果。
在此需要说明的是，显示模组具有显示区及围绕显示区的外围区。其中，显示面板101的主体部101a设置于显示区中，显示面板101的主体部101a中设置有沿第一方向延伸的多条栅线(Gate Line)和沿第二方向延伸的多条数据线(Date Line)，第一方向和第二方向相互交叉。多条栅线和多条数据线交叉限定出多个像素区，每个像素区中设置有像素单元(Pixel)，每个像素单元包括：像素驱动电路及与像素驱动电路连接的发光器件。其中，像素驱动电路具体可以为7T1C结构，即像素驱动电路中具有7个晶体管，1个存储电容，其电路结构可以参考相关技术中的7T1C结构。像素驱动电路中的发光器件可以为有机发光元件，例如有机发光二极管(Organic Light-Emitting Diode，OLED)。
在示例性实施方式中，像素驱动电路中的七个晶体管均可以是P型晶体管，或者可以是N型晶体管。像素驱动电路中采用相同类型的晶体管可以简化工艺流程，减少显示面板的工艺难度，提高产品的良率。在一些可能的实现方式中，第一晶体管T1到第七晶体管T7可以均为P型晶体管或者均为N型晶体管。需要说明的是，本公开的实施例中采用的晶体管可以为薄膜晶体 管或场效应晶体管或其他特性相同的开关器件，薄膜晶体管可以包括氧化物半导体薄膜晶体管、非晶硅薄膜晶体管或多晶硅薄膜晶体管等。晶体管的源极、漏极在结构上可以是对称的，所以其源极、漏极在物理结构上可以是没有区别的。在本公开的实施例中，为了区分晶体管，除作为控制极的栅极，直接描述了其中一极为第一极，另一极为第二极，所以本公开的实施例中全部或部分晶体管的第一极和第二极根据需要是可以互换的。
在示例性实施方式中，像素单元的像素驱动电路除了可以为上述的7T1C(即七个晶体管和一个电容)结构之外，还可以为包括其他数量的晶体管的结构，如7T2C结构、6T1C结构、6T2C结构或者9T2C结构，本公开实施例对此不作限定。
多条栅线可以延伸接到显示区一侧外围区，并连接栅极驱动电路，栅极驱动电路可以通过栅线为显示区中的像素单元提供的扫描信号，使得显示区中的像素单元逐行进行扫描。多条数据线可以延伸至显示一侧的外围区，并连接源极驱动电路，源极驱动电路可以通过数据线为显示区中的像素单元提供数据信号，并在扫描信号的配合下，逐行点亮各行像素单元中的发光器件，以实现显示功能。
显示面板101的弯折部101b可以设置于外围区，弯折部101b的可以朝着显示面板101的主体部101a背离显示面的一侧。弯折部101同样具有一定的显示功能，其可以使得显示面板101的边缘同样可以进行显示，以将显示面板101的边框隐藏，减小显示面板101的边框，提高显示效果。
显示模组还具有设置于外围区远离显示区一侧的绑定区，绑定区中设置有多个接触垫片，每个接触垫片被配置为电连接从显示区或外围区延伸出来的信号线。接触垫片可以暴露在绑定区的表面，即不被任何膜层覆盖，这样边缘电连接到柔性线路板103。柔性线路板103与外部的控制主板电连接，被配置为传输来自外部的控制主板的信号或电力。例如，接触垫与公共信号 线电连接，接触垫与触控信号线电连接，接触垫与驱动信号线电连接，接触垫与数据连接线(数据连接线与显示区中的数据线电连接)电连接等等。接触垫与各个信号线电连接，这样能实现信号线与柔性线路板103之间相互通信。对于接触垫的个数和布置方式此处不做具体限制，可以根据实际需要设置。
在一些实施例中，如图3所示，栅格阵列封装结构104位于弯折部101b背离主体部101a的一侧。
栅格阵列封装结构104具体可以位于弯折部101b背离主体部101a的一侧，由于弯折部101b的部分与主体部101a平行，弯折部101b背离主体部101a可以为栅格阵列封装结构104提供较为平整的承载平面，避免栅格阵列封装结构104与弯折部101之间出现连接不良而影响显示效果。
在一些实施例中，如图3所示，显示模组还包括：与弯折部101b背离主体部101a的一侧绑定连接的柔性线路板103；柔性线路板103沿着靠近主体部101a的一侧弯折，并弯折至弯折部101b靠近主体部101a的一侧。
柔性线路板103可以与弯折部101b背离主体部101a的一侧邦定连接，并且可以再次进行弯折，使得柔性线路板103弯折至弯折部101b靠近主体部101a的一侧，可见柔性线路板103大部分均被容纳在主体部101a与弯折部101b之间的空间内，因此可以节省柔性线路板103所占用的空间，为电池提供较大的预留空间，从而可以提高电池的容量，进而可以提高显示装置的待机时间。
图4为本公开实施例提供的另一种显示模组的结构示意图，如图4所示，显示模组还包括：与弯折部101b背离主体部101a的一侧绑定连接的柔性线路板103；柔性线路板103沿着背离主体部101a的一侧弯折，并弯折至弯折部101b背离主体部101a的一侧。
图4所示的显示模组与图3所示的显示模组的不同之处在于，图4所示 的显示模组中的柔性线路板103与弯折部101b进行反向绑定，柔性线路板103沿着弯折部101b进行延伸，这样柔性线路板103可以覆盖弯折部101b，但是并不覆盖弯折部101b的边缘，可以将为电池预留的空间延伸至弯折部101b的边缘，因此可以进一步节省柔性线路板103所占用的空间，提升电池的预留空间，从而可以提高电池的容量，进而可以提高显示装置的待机时间。
图5为本公开实施例提供的又一种显示模组的结构示意图，如图5所示，栅格阵列封装结构104位于弯折部101b靠近主体部101a的一侧。
栅格阵列封装结构104具体还可以位于弯折部101b靠近主体部101a的一侧，由于弯折部101b的部分与主体部101a平行，弯折部101b背离主体部101a可以为栅格阵列封装结构104提供较为平整的承载平面，避免栅格阵列封装结构104与弯折部101之间出现连接不良而影响显示效果。
在一些实施例中，如图5所示，显示模组还包括：与弯折部101b靠近主体部101a一侧绑定连接的柔性线路板103；柔性线路板103沿着背离主体部101a的一侧弯折，并弯折至弯折部101b背离主体部101a的一侧。
柔性线路板103可以与弯折部101b靠近主体部101a的一侧邦定连接，并且可以再次进行弯折，使得柔性线路板103弯折至弯折部101b背离主体部101a的一侧，可见柔性线路板103大部分均被容纳在主体部101a与弯折部101b之间的空间内，因此可以节省柔性线路板103所占用的空间，为电池提供较大的预留空间，从而可以提高电池的容量，进而可以提高显示装置的待机时间。
图6为本公开实施例提供的再一种显示模组的结构示意图，如图6所示，显示模组还包括：与弯折部101b靠近主体部101a的一侧绑定连接的柔性线路板103；柔性线路板103沿着弯折部101b延伸并覆盖弯折部101b。
图6所示的显示模组与图5所示的显示模组的不同之处在于，图6所示的显示模组中的柔性线路板103与弯折部101b进行反向绑定，柔性线路板 103沿着弯折部101b进行延伸，这样柔性线路板103可以覆盖弯折部101b，但是并不覆盖弯折部101b的边缘，可以将为电池预留的空间延伸至弯折部101b的边缘，因此可以进一步节省柔性线路板103所占用的空间，提升电池的预留空间，从而可以提高电池的容量，进而可以提高显示装置的待机时间。
在一些实施例中，如图3和图5所示，栅格阵列封装结构104位于柔性线路板103与弯折部101b的绑定区域之外的区域。
图3和图5所示的显示模组中，柔性线路板103在与显示面板101的弯折部101b进行绑定连接后，朝着远离栅格阵列封装结构104的方向进行延伸，柔性线路板103不会覆盖显示面板101的弯折部101b的绑定区域之外的其他区域，栅格阵列封装结构104可以设置在绑定区域之外的区域。柔性线路板103与栅格阵列封装结构104相互不交叠，且连接二者的走线也较少交叠，因此有利于简化显示模组的结构，同时简化显示模组中的走线的复杂程度，从而可以节约制备成本。
在一些实施例中，如图4和图6所示，柔性线路板103具有镂空部103a；栅格阵列封装结构104嵌入镂空部103a内。
图4和图6所示的显示模组中，柔性线路板103在与显示面板101的弯折部101b进行绑定连接后，朝着靠近栅格阵列封装结构104的防线延伸，柔性线路板103会覆盖显示面板101的弯折部101b，并覆盖弯折部101b上的栅格阵列封装结构104。可以在柔性线路板103中形成镂空部103a，栅格阵列封装结构104可以嵌入镂空部103a中，可以避免柔性线路板103在对应栅格阵列封装结构104的位置翘起，因此可以保证柔性线路板103表面平整，有利于其他膜层的贴合，同时可以降低显示模组的厚度，有利于显示模组的轻薄化。
在一些实施例中，如图3至图6所示，显示模组还包括：连接器件Connetor；连接器件Connetor与柔性线路板103电连接。连接器件Connetor 可以直接设置于柔性线路板103外接的电路结构上，例如，控制主板等，可以通过连接器件Connetor与柔性线路板103连接，并输入控制信号。
在一些实施例中，图7为本公开实施例提供的显示模组中的栅格阵列封装结构的示意图，如图7所示，栅格阵列封装结构104包括：封装基底1041、位于封装基底1041上的驱动芯片和无源器件102、及覆盖驱动芯片和无源器件102的封装层1042。驱动芯片和无源器件102可以被完全封装在封装基底1041与封装层1042所形成的封装空间内。这样，栅格阵列封装结构104可以作为一个独立的结构集成与显示面板101上。
在一些实施例中，如图7所示，驱动芯片包括：触控驱动芯片TIC和显示驱动芯片DDIC；无源器件102包括：电容(图中未示出)、电阻R、晶振(图中未示出)和存储器(图中未示出)。
在封装基底101的背面设置多个金属凸块1043，触控驱动芯片TIC和显示驱动芯片DDIC可以通过金线与金属凸块1043电连接，电阻R可以金属凸块1043直接接触连接。在与显示面板101集成过程中，金属凸块1043可以直接与显示面板101中的连接焊盘电连接，可以省去布线的工艺。
在一些实施例中，如图8和图9所示，显示面板101与柔性线路板103通过第一金属走线201连接，驱动芯片与柔性线路板103通过第二金属走线202连接；第一金属走线201和第二金属走线202的延伸方向相交，且二者之间设置有抗干扰层203。
在实际应用中，显示驱动芯片DDIC和触控驱动芯片TIC虽然封装在栅格阵列封装结构104中，但是依然需要第一金属走线201与柔性线路板103电连接，同时，显示面板101与柔性线路板103之间通过第二金属走线202电连接，第一金属走线201与第二金属走线202的延伸方向相交。在第一金属走线201和第二金属走线202之间设置有抗干扰层203，可以避免第一金属走线201中传输的信号与第二金属走线202中传输的信号之间发生串扰， 影响显示效果。抗干扰层可以采用有机材料利用喷墨打印工艺形成，其厚度可以大于或等于8微米，以保证第一金属走线201与第二金属走线202之间具有较大的距离，保证防串扰的效果。同时，抗干扰层203的厚度也不宜过厚，例如可以小于或等于15微米，以避免增加显示模组整体的厚度，影响显示模组的轻薄化。
在一些实施例中，显示模组还包括：偏光层105、触控面板106、及盖板107；偏光层105位于主体部101a的显示面的一侧；触控面板106位于偏光层105背离主体部101a的一侧；盖板107位于触控面板106背离主体部101a的一侧。显示面板101具体可以为有机电致发光二极管(Organic Light-Emitting Diode，OLED)显示面板，偏光层105可以位于显示面板101a的显示面的一侧，偏光层105可以将环境光线转换为线偏振光，线偏振光入射至显示面板101的主体部101a内，经过其中阳极等膜层的反射后再照射至偏光层105，由于反射作用线偏振光的偏振方向发生了变化，不能由偏光层105出射，可以起到防止环境光反射的效果，从而可以提高显示面板101的显示效果。触控面板106中设置触控单元，可以对用户的手指触控位置进行定位，来实现触控功能。盖板107可以采用玻璃等刚性材料制成，以保护其覆盖的触控面板106、显示面板101等受到外力而造成损坏。当然，为了实现折叠等功能，盖板107还可以采用聚酰亚胺等柔性透明材料制成。
在一些实施例中，显示面板101还包括阻挡物，阻挡物位于外围区中且围绕显示区的四周。至少一个示例中，阻挡物具有围堰结构，该围堰结构能阻挡外部水汽或氧气进入显示区，从而避免对显示效果的影响。例如，阻挡物可以是一个或者多个。进一步地，当阻挡物为多个时，可以增强阻挡能力。例如，阻挡物包括第一阻挡物和第二阻挡物，第二阻挡物位于第一阻挡物的远离显示区的一侧，这样能够进一步防止外部水汽或氧气进入显示区中，为显示区提供双重保护。至少一个示例中，第一阻挡物高度小于第二阻挡物的 高度。这样，外部水汽和氧气进入显示区的路径变长，使其进入显示区的难度增加，进一步提高阻挡物的阻挡能力。
触控面板106包括触控电极(Touching Electrode，TE)和触控信号线，触控电极位于显示区中并且被配置为检测显示区中触摸的发生。例如，触控电极包括第一触控电极和第二触控电极。多个第一触控电极构成沿x方向延伸的第一触控电极线，多个第二触控电极构成沿y方向延伸的第二触控电极线。多个第一触控电极线和多个第二触控电极线彼此交叉，由此在第一触控电极线和第二触控电极线交叉位置处形成触控电容。通过检测在触控时由于例如手指靠近而导致该触控电容的变化而实现触控位置的检测。每条触控信号线被配置为与显示区中的触控电极电连接。例如，触控信号线包括第一触控信号线和第二触控信号线。每个第一触控信号线与沿x方向延伸的第一触控电极线电连接，每个第二触控信号线与沿y方向延伸的第二触控电极线电连接。在具体实现时，每个第一触控电极线与一个第一触控信号线电连接，每个第二触控电极线与一个第二触控信号线电连接，这样，由每个触控电极产生的触控信号可以通过触控信号线传输到外围区，通过外围区的接触垫与外部的触控芯片电连接。
第二方面，本公开实施例提供了一种显示装置，该显示装置包括如上述任一实施例提供的显示模组及供电源108，供电源108位于主体部101a背离其显示面的一侧。具体地，供电源108可以为电池。电池可以为显示模组中的其他结构，例如显示面板101等提供电源，以使得显示模组实现显示及触控功能。显示模组中的驱动芯片和无源器件102等结构均封装于栅格阵列封装结构104中，栅格阵列封装结构104直接集成于显示面板101上，可以不必将驱动芯片和无源器件102等结构固定在柔性线路板上。这样可以节省柔性线路板103所占用的空间，为电池提供较大的预留空间，从而可以提高电池的容量，进而可以提高显示装置的待机时间。该显示装置具体可以为手机、 平板电脑、电视机、电脑显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件，其实现原理及有益效果与上述的显示模组的实现原理及有益效果相同，在此不再进行赘述。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (15)

  1. 一种显示模组，其中，所述显示模组包括：显示面板、及与所述显示面板电连接的驱动芯片和无源器件；所述驱动芯片和所述无源器件封装于栅格阵列封装结构中；
    所述栅格阵列封装结构集成于所述显示面板上。
  2. 根据权利要求1所述的显示模组，其中，所述显示面板包括：主体部及与所述主体部的一侧连接的弯折部；
    所述弯折部沿着背离所述主体部的显示面的方向弯折，且沿着与所述主体部平行的方向延伸。
  3. 根据权利要求2所述的显示模组，其中，所述栅格阵列封装结构位于所述弯折部背离所述主体部的一侧。
  4. 根据权利要求3所述的显示模组，其中，所述显示模组还包括：与所述弯折部背离所述主体部的一侧绑定连接的柔性线路板；
    所述柔性线路板沿着靠近所述主体部的一侧弯折，并弯折至所述弯折部靠近所述主体部的一侧。
  5. 根据权利要求3所述的显示模组，其中，所述显示模组还包括：与所述弯折部背离所述主体部的一侧绑定连接的柔性线路板；
    所述柔性线路板沿着所述弯折部延伸方向延伸并覆盖所述弯折部。
  6. 根据权利要求2所述的显示模组，其中，所述栅格阵列封装结构位于所述弯折部靠近所述主体部的一侧。
  7. 根据权利要求6所述的显示模组，其中，所述显示模组还包括：与所述弯折部靠近所述主体部一侧绑定连接的柔性线路板；
    所述柔性线路板沿着背离所述主体部的一侧弯折，并弯折至所述弯折部背离所述主体部的一侧。
  8. 根据权利要求6所述的显示模组，其中，所述显示模组还包括：与所述弯折部靠近所述主体部的一侧绑定连接的柔性线路板；
    所述柔性线路板沿着所述弯折部延伸并覆盖所述弯折部。
  9. 根据权利要求4或7所述的显示模组，其中，所述栅格阵列封装结构位于所述柔性线路板与所述弯折部的绑定区域之外的区域。
  10. 根据权利要求5或8所述的显示模组，其中，所述柔性线路板具有镂空部；所述栅格阵列封装结构嵌入所述镂空部内。
  11. 根据权利要求4至10任一项所述的显示模组，其中，所述显示模组还包括：连接器件；
    所述连接器件与所述柔性线路板电连接。
  12. 根据权利要求10所述的显示模组，其中，所述驱动芯片包括：触控驱动芯片和显示驱动芯片；
    所述无源器件包括：电容、电阻、晶振和存储器。
  13. 根据权利要求10所述显示模组，其中，所述显示面板与所述柔性线路板通过第一金属走线连接，所述驱动芯片与所述柔性线路板通过第二金属走线连接；所述第一金属走线和所述第二金属走线的延伸方向相交，且二者之间设置有抗干扰层。
  14. 根据权利要求2所述的显示模组，其中，所述显示模组还包括：偏光层、触控面板、及盖板；
    所述偏光层位于所述主体部的显示面的一侧；
    所述触控面板位于所述偏光层背离所述主体部的一侧；
    所述盖板位于所述触控面板背离所述主体部的一侧。
  15. 一种显示装置，其中，所述显示装置包括如权利要求1至14任一项所述的显示模组及供电源，所述供电源位于所述主体部背离其显示面的一侧。
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