WO2024009359A1 - レーザ加工ヘッド、及びレーザ加工システム - Google Patents

レーザ加工ヘッド、及びレーザ加工システム Download PDF

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Publication number
WO2024009359A1
WO2024009359A1 PCT/JP2022/026614 JP2022026614W WO2024009359A1 WO 2024009359 A1 WO2024009359 A1 WO 2024009359A1 JP 2022026614 W JP2022026614 W JP 2022026614W WO 2024009359 A1 WO2024009359 A1 WO 2024009359A1
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WO
WIPO (PCT)
Prior art keywords
laser processing
laser
processing head
command
manual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/026614
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
貴士 和泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Priority to JP2024531767A priority Critical patent/JPWO2024009359A1/ja
Priority to US18/876,852 priority patent/US20250367765A1/en
Priority to DE112022007119.2T priority patent/DE112022007119T5/de
Priority to PCT/JP2022/026614 priority patent/WO2024009359A1/ja
Priority to CN202280097571.4A priority patent/CN119451772A/zh
Priority to TW112121838A priority patent/TW202402435A/zh
Publication of WO2024009359A1 publication Critical patent/WO2024009359A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/02—Hand grip control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/04—Foot-operated control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/086—Proximity sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39529—Force, torque sensor in wrist, end effector
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40582—Force sensor in robot fixture, base
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45041—Laser cutting

Definitions

  • the present disclosure relates to a laser processing head and a laser processing system.
  • Patent Document 1 A laser processing head that is applied to a laser processing system that automatically performs a laser emission operation according to a processing program is known.
  • Patent Document 2 a laser processing head manually operated by an operator is also known.
  • the laser emission operation is possible in a manual operation mode in which the control device executes the laser emission operation according to a manual laser emission command, and an automatic operation mode in which the control device automatically executes the laser emission operation according to the processing program.
  • the laser processing head includes a first input device that receives an input operation for transmitting a manual laser emission command to the control device, and a first input device that receives an input operation for transmitting a manual laser emission command to the control device, and a first input device that connects the laser processing head and the workpiece when the control device executes the laser emission operation in automatic operation mode. and a distance measurement sensor that measures the distance to.
  • FIG. 1 is a schematic diagram of a laser processing system according to an embodiment.
  • 2 is a block diagram of the laser processing system shown in FIG. 1.
  • FIG. FIG. 2 is an enlarged view of the mode selection switch shown in FIG. 1;
  • FIG. 2 is an enlarged view of the laser processing head shown in FIG. 1.
  • FIG. 7 shows a first input device according to another embodiment.
  • FIG. 7 is an enlarged view of a laser processing head according to another embodiment.
  • 7 is a block diagram of the laser processing head shown in FIG. 6.
  • FIG. 7 is a diagram for explaining the function of the contact detection device shown in FIG. 6.
  • FIG. FIG. 7 is a diagram for explaining the function of the command cutoff section shown in FIG. 6, and shows a state in which the command cutoff section is blocking a manual laser emission command.
  • FIG. 7 is a diagram for explaining the function of the command cutoff unit shown in FIG. 6, showing a state in which the command cutoff unit allows transmission of a manual laser emission command.
  • FIG. 7 is a flowchart showing an example of the operation flow of the laser processing head shown in FIG. 6.
  • FIG. 12 is a flowchart showing an example of the flow of step S2 in FIG. 11.
  • 12 is a flowchart showing an example of the flow of step S3 in FIG. 11.
  • FIG. 7 is a block diagram of a laser processing head according to still another embodiment.
  • 15 is a flowchart showing an example of the flow of step S2 executed by the laser processing head shown in FIG. 14.
  • the laser processing system 10 is a system that can perform laser processing (laser welding, laser cutting, etc.) on a workpiece W in collaboration with an operator.
  • the laser processing system 10 includes a robot 12, a laser processing head 14, a laser oscillator 16, and a control device 18.
  • the robot 12 moves the laser processing head 14 relative to the workpiece W.
  • the robot 12 is a vertically articulated robot and includes a robot base 20, a rotating trunk 22, a lower arm 24, an upper arm 26, and a wrist 28.
  • the robot base 20 is fixed on the floor of the work cell.
  • the turning trunk 22 is provided on the robot base 20 so as to be able to turn around a vertical axis.
  • the lower arm portion 24 is provided on the rotating trunk 22 so as to be rotatable around a horizontal axis.
  • the upper arm section 26 is rotatably provided at the distal end of the lower arm section 24.
  • the wrist portion 28 includes a wrist base 28a provided at the distal end of the upper arm portion 26 so as to be rotatable around two axes orthogonal to each other, and a wrist flange 28b rotatably provided on the wrist base 28a. and has.
  • Each component of the robot 12 (that is, the robot base 20, the rotating trunk 22, the lower arm 24, the upper arm 26, and the wrist 28) is provided with a plurality of servo motors 30 (FIG. 2), respectively.
  • These servo motors 30 move each movable component of the robot 12 (that is, the rotating trunk 22, the lower arm section 24, the upper arm section 26, the wrist section 28, and the wrist flange 28b) around the drive shaft in response to commands from the control device 18. Rotate it. Thereby, the robot 12 moves the laser processing head 14.
  • the robot 12 is provided with a force sensor 32.
  • Force sensor 32 detects external force F applied to robot 12.
  • the force sensor 32 includes a torque sensor that is provided in each servo motor 30 of the robot 12 and detects the torque applied to the output shaft of the servo motor 30.
  • the force sensor 32 is provided on a component of the robot 12 (for example, the robot base 20 or the wrist portion 28) and has a 6-axis force sensor capable of detecting forces in 6-axis directions. Based on the detection data of the force sensor 32, the control device 18 identifies the magnitude and direction of the external force F applied to the robot, and the part of the robot 12 to which the external force F is applied (for example, the wrist 28). It is now possible to do so.
  • the laser oscillator 16 internally oscillates a laser in response to a command (laser power command, etc.) from the control device 18 to generate laser light LB.
  • the laser oscillator 16 may be of any type, such as a fiber laser oscillator, a pulsed laser oscillator, a CO 2 laser oscillator, or a solid state laser (YAG laser) oscillator.
  • the laser oscillator 16 supplies the generated laser beam LB to the laser processing head 14 via the light guide path 34.
  • the light guide path 34 may be configured by an optical fiber, a cavity, a light guide material such as crystal, a reflecting mirror, an optical lens, or the like.
  • the control device 18 operates the laser oscillator 16 to emit the laser beam LB from the laser processing head 14, and operates the robot 12 to move the laser processing head 14 attached to the robot 12 to the workpiece W.
  • the movement operation MO to be moved relative to the object is controlled.
  • the control device 18 is a computer having a processor 36, a memory 38, and an I/O interface 40, as shown in FIG.
  • the processor 36 has a CPU, a GPU, etc., and is communicably connected to the memory 38 and the I/O interface 40 via a bus 42, and performs various calculations for executing the laser processing described below while communicating with these components. Perform processing.
  • the memory 38 includes a RAM, a ROM, or the like, and stores, temporarily or permanently, various data used in the arithmetic processing executed by the processor 36 and various data generated during the arithmetic processing.
  • the I/O interface 40 has, for example, an Ethernet (registered trademark) port, a USB port, an optical fiber connector, or an HDMI (registered trademark) terminal, and allows data to be exchanged with an external device under instructions from the processor 36. Communicate by wire or wirelessly.
  • the robot 12 specifically, the servo motor 30 and the force sensor 32), the laser processing head 14, and the laser oscillator 16 are communicatively connected to the I/O interface 40.
  • the control device 18 is further provided with an input device 44 and a display device 46.
  • the input device 44 has a keyboard, a mouse, a touch panel, or the like, and receives data input from an operator.
  • the display device 46 has a liquid crystal display, an organic EL display, or the like, and displays various data.
  • the input device 44 and the display device 46 are connected to the I/O interface 40 so that they can communicate by wire or wirelessly.
  • the input device 44 and the display device 46 may be integrated into the casing of the control device 18, or may be provided separately from the casing of the control device 18, for example as one computer (PC, etc.). may be provided.
  • the control device 18 is provided with a mode selection switch 48.
  • the mode selection switch 48 is for selecting the operation mode DM of laser processing to be executed by the control device 18. As shown in FIG. 3, in this embodiment, the mode selection switch 48 selects the driving mode DM between a manual driving mode DM1 represented as "MANUAL" and an automatic driving mode DM2 represented as "AUTO". It is configured so that it can be switched between.
  • the operator can switch the driving mode DM between the manual driving mode DM1 and the automatic driving mode DM2 by operating the mode selection switch 48.
  • the manual operation mode DM1 the operator holds and carries the laser processing head 14 with his/her hand, causes the control device 18 to manually execute the laser emission operation LO, and targets the workpiece W with the laser beam LB emitted from the laser processing head 14.
  • the operator manually gives a manual laser emission command CM1 to be described later to the control device 18, and the processor 36 of the control device 18 performs the laser emission operation LO in accordance with the manual laser emission command CM1. Execute.
  • the automatic operation mode DM2 is an operation mode DM in which the processor 36 of the control device 18 automatically executes the laser emission operation LO and the movement operation MO according to the machining program PG1 created in advance. Specifically, the processor 36 sequentially generates commands to the laser oscillator 16 according to the processing program PG1, operates the laser oscillator 16 according to the commands, and performs a laser emission operation LO in which the laser beam LB is emitted from the laser processing head 14. Execute automatically.
  • the processor 36 sequentially generates commands (position command, speed command, torque command, etc.) to the robot 12 (specifically, each servo motor 30) according to the machining program PG1, and operates the robot 12 according to the command. Then, a movement operation MO for moving the laser processing head 14 relative to the workpiece W is automatically executed.
  • This machining program PG1 is created by an operator and stored in the memory 38 in advance. Note that FIG. 3 shows a state in which the automatic driving mode DM2 (“AUTO”) is selected by the mode selection switch 48.
  • AUTO automatic driving mode DM2
  • the laser processing head 14 is detachably attached to the wrist flange 28b of the robot 12. Specifically, as shown in FIG. 4, the laser processing head 14 includes a head main body 50, a nozzle 52, a detachable tool 54, a grip section 56, a first input device 58, a second input device 60, and a distance measuring device. A sensor 62 is provided.
  • the head body 50 is hollow, and includes an optical lens (collimating lens, focus lens, etc.) and a lens drive unit (for example, a servo motor) that displaces the optical lens in accordance with a command from the control device 18. ) and other optical system components.
  • the nozzle 52 is hollow and provided at the tip of the head body 50.
  • the nozzle 52 has a truncated conical outer shape whose cross-sectional area decreases from the base end toward the tip end, and an exit port 52a is formed at the end end.
  • a hollow chamber is formed inside the nozzle 52 and the head main body 50, and assist gas AG is supplied into the chamber from an assist gas supply device (not shown) provided outside.
  • the laser beam LB generated by the laser oscillator 16 propagates within the chamber and is emitted along the optical axis A from the emission port 52a together with the assist gas AG.
  • the attachment/detachment tool 54 is provided on the head main body 50 and is attached/detached to/from the wrist flange 28b of the robot 12.
  • the attachment/detachment tool 54 may include a fastener such as a bolt, and may be fastened to the wrist flange 28b by the fastener.
  • the attachment/detachment tool 54 has an engaging part that removably engages with an engaged part formed on the wrist flange 28b, and the engaged part and the engaging part are engaged with each other. It may be attached to and detached from the wrist flange 28b.
  • the attachment/detachment tool 54 may include an electromagnet, and may be suctioned and fixed to the wrist flange 28b by the electromagnetic force generated by the electromagnet.
  • the laser processing head 14 is detachably attached to the wrist flange 28b of the robot 12 via this attachment/detachment tool 54.
  • the gripping portion 56 is provided at the base end of the head body 50 so that the operator can grip it with one hand.
  • the grip portion 56 may have a concave and convex portion corresponding to the fingers of one hand so that the operator can easily grip it with one hand.
  • the operator can carry the laser processing head 14 by grasping the gripping portion 56 and removing the laser processing head 14 from the wrist flange 28b.
  • the first input device 58 accepts an input operation for transmitting the manual laser emission command CM1 to the control device 18.
  • the first input device 58 includes a push button, a switch, a touch panel, etc. that can be input manually by the operator, and the first input device 58 includes a push button, a switch, a touch panel, etc. that can be input manually by the operator, and the first input device 58 includes a push button, a switch, a touch panel, etc. that can be input manually by the operator. It is set in.
  • the first input device 58 When the first input device 58 receives an input operation by an operator (for example, pressing a push button by hand, switching a switch, or touching a touch panel), the first input device 58 supplies a manual laser emission command CM1 to the control device 18.
  • the manual laser emission command CM1 may be an ON signal (or a "1" signal).
  • the control device 18 When the control device 18 receives the manual laser emission command CM1 while executing the manual operation mode DM1, it executes the laser emission operation LO in accordance with the manual laser emission command CM1. In this way, in the manual operation mode DM1, the operator manually moves the work W using the laser beam LB emitted along the optical axis A from the emission port 52a of the laser processing head 14 while carrying the laser processing head 14 by hand. Can be laser processed.
  • the first input device 58 is provided adjacent to the grip 56 so that the operator can perform input operations with one hand while gripping the grip 56.
  • the second input device 60 accepts an input operation for issuing a manual gas ejection command CM2 to emit assist gas AG.
  • the second input device 60 has a push button, a switch, a touch panel, etc. that can be operated manually by the operator, and upon receiving an input operation by the operator, the second input device 60 transmits the manual gas injection command CM2 to the control device 18. Send to.
  • the manual gas ejection command CM1 may be an ON signal (or a "1" signal).
  • control device 18 When the control device 18 receives the manual gas ejection command CM2 while executing the manual operation mode DM1, it operates the assist gas supply device to supply the assist gas AG to the laser processing head 14 from the assist gas supply device. As a result, the assist gas AG is emitted along with the laser beam LB from the emitting port 52a of the laser processing head 14 held by the operator's hand.
  • the second input device 60 may be configured to directly transmit the manual gas ejection command CM1 to the assist gas supply device.
  • the second input device 60 is also provided with the grip portion 56 and the It is provided adjacent to one input device 58 .
  • the distance sensor 62 measures the distance d between the laser processing head 14 (for example, the emission port 52a) and the work W when the control device 18 executes the laser emission operation LO in the automatic operation mode DM2.
  • the distance measuring sensor 62 is, for example, a capacitive type, an infrared type, a laser type, or a sonic type (for example, an ultrasonic type) distance measuring sensor.
  • the distance measuring sensor 62 is provided on the head body 50 (or nozzle 52) so as to measure the distance to the object located closest to the laser processing head 14.
  • the distance measurement sensor 62 has a measurement direction D (in other words, a radiation direction of the infrared ray, laser, or sound wave) for measuring the distance to the object that is aligned with the optical axis A. They are attached to the head main body 50 (or nozzle 52) so as to be parallel to each other. That is, in this case, the distance measurement sensor 62 measures the distance d in the direction of the optical axis A between the laser processing head 14 (output port 52a) and the workpiece W.
  • the distance sensor 62 continuously (for example, periodically) measures the distance d when the control device 18 executes the laser emission operation LO in the automatic operation mode DM2.
  • the processor 36 of the control device 18 executes the laser emission operation LO when the distance d measured by the distance sensor 62 is within the predetermined tolerance range RG, and when the distance d is within the predetermined tolerance range RG. If it is outside the allowable range RG, the laser emission operation LO is not performed.
  • the processor 36 stops the operation of the robot 12 when the external force F detected by the force sensor 32 exceeds a predetermined threshold F th while executing the movement operation MO in the automatic operation mode DM2. Thereby, when the robot 12 during the moving operation MO collides with a surrounding object (for example, an operator), the robot 12 can be brought to an emergency stop.
  • a surrounding object for example, an operator
  • the laser processing head 14 operates in the manual operation mode DM1 in which the control device 18 executes the laser emission operation LO in accordance with the manual laser emission command CM1, and in the manual operation mode DM1 in which the control device 18 executes the laser emission operation LO in accordance with the processing program PG1. It is configured to be capable of laser emission operation in automatic operation mode DM2 in which the emission operation LO is automatically executed.
  • the laser processing head 14 has a first input that receives an input operation for transmitting the manual laser emission command CM1 to the control device 18.
  • the apparatus 58 includes a distance measuring sensor 62 that measures the distance d between the laser processing head 14 and the workpiece W when the control apparatus 18 executes the laser emission operation LO in the automatic operation mode DM2.
  • the operator can perform laser processing while freely switching between manual operation mode DM1 and automatic operation mode DM2 according to the progress of laser processing. This allows a variety of laser processing to be performed. Further, in the manual operation mode DM1, the operator can manually control the laser emission operation LO by operating the first input device 58, while in the automatic operation mode DM2, the control device 18 controls the distance measurement sensor 62. The laser emission operation LO can be automatically controlled based on the distance d to be measured. Therefore, the safety of the laser processing operation can be ensured.
  • the first input device 58 includes a push button, a switch, or a touch panel that can be manually operated by the operator. According to this configuration, the operator can transmit the manual laser emission command CM1 to the control device 18 with a simple operation in the manual operation mode DM1.
  • the laser processing head 14 further includes a second input device 60 that receives an input operation for issuing a manual gas ejection command CM2 to emit the assist gas AG.
  • the operator can also manually control the emission of the assist gas AG in the manual operation mode DM1.
  • the laser processing head 14 includes an attachment/detachment tool 54 that is attached to and detached from the robot 12 (specifically, the wrist flange 28b) that moves the laser processing head 14, and an attachment/detachment tool 54 that can be grasped with one hand by the operator. It further includes a grip part 56.
  • the first input device 58 is provided adjacent to the grip 56 so that it can be operated with one hand holding the grip 56.
  • the operator can operate the attachment/detachment tool 54 to remove the laser processing head 14 from the robot 12 while grasping the grip portion 56 with one hand, and operate the first input device 58 with the one hand. Therefore, the laser emission operation LO in the manual operation mode DM1 can be easily performed.
  • the operator can easily execute the laser emission operation LO in the automatic operation mode DM2.
  • the operator can more smoothly and easily switch between the manual operation mode DM1 and the automatic operation mode DM2.
  • the first input device 58 is not limited to a push button, a switch, or a touch panel, but may include a foot pedal or a foot switch that allows the operator to input input with his/her foot. Such a configuration is shown in FIG. In the laser processing head 14' shown in FIG. 5, the first input device 58' includes a foot pedal or a foot switch, and is provided separately from the head body 50.
  • the first input device 58' is electrically connected to an electronic component (for example, a processor described below) housed inside the head main body 50.
  • an electronic component for example, a processor described below
  • the first input device 58' receives an input operation by the operator (for example, pressing a foot pedal with a foot or switching a foot switch)
  • the first input device 58' transmits a manual laser emission command CM1 via an electronic component in the head body 50. , to the control device 18.
  • the first input devices 58, 58' are not limited to push buttons, switches, touch panels, foot pedals, or foot switches, and may be any type of input device.
  • the first input device 58, 58' may include a microphone that detects the operator's voice and a voice analyzer that analyzes the voice.
  • the first input devices 58, 58' accept a voice input operation by the operator and transmit a manual laser emission command CM1 to the control device 18.
  • the second input device 60 may be omitted from the laser processing head 14 or 14'.
  • the second input device 60 may be provided in the control device 18.
  • the input device 44 described above may function as the second input device 60.
  • the operator may operate the input device 44 to operate the assist gas supply device to supply the assist gas AG to the laser processing head 14 or 14'.
  • the above-mentioned gripping portion 56 may be omitted, and the operator may hold the head main body 50 and carry the laser processing head 14 or 14', for example.
  • the first input device 58 may be provided at any position of the laser processing head 14 or 14', and the operator may hold the grip portion 56 (or the head body 50) with one hand and use the other hand.
  • the grip portion 56 and the first input device 58 may be arranged such that the first input device 58 can be operated by the user.
  • the laser processing head 64 can be applied to the laser processing system 10 instead of the laser processing head 14 described above, and can be detachably attached to the wrist flange 28b of the robot 12.
  • the laser processing head 64 differs from the above-described laser processing head 14 in the following configuration.
  • the laser processing head 64 further includes a mode selection switch 48, a contact detection device 66, and a processor 68.
  • the mode selection switch 48 is provided integrally with the head main body 50, and can be switched between the manual operation mode DM1 and the automatic operation mode DM2, as in the above embodiment.
  • the contact detection device 66 detects whether the laser processing head 64 and the work W are in contact with each other or are not in contact with each other.
  • the contact sensing device 66 includes a conductive cable 66a and a resistance sensor 66b (FIG. 7). One end of the conductive cable 66a is electrically connected to the head body 50 of the laser processing head 64, and the other end is electrically connected to the workpiece W, thereby electrically connecting the laser processing head 64 and the workpiece W. Connect to
  • the head main body 50 and nozzle 52 of the laser processing head 64 are at least partially made of a conductive material (for example, metal). Further, the workpiece W is made of metal (for example, iron or copper). Therefore, if the tip of the nozzle 52 of the laser processing head 64 comes into contact with the workpiece W, as shown in FIG. A closed circuit 70 will be formed.
  • a conductive material for example, metal
  • the workpiece W is made of metal (for example, iron or copper). Therefore, if the tip of the nozzle 52 of the laser processing head 64 comes into contact with the workpiece W, as shown in FIG. A closed circuit 70 will be formed.
  • the resistance sensor 66b measures the resistance R of the closed circuit 70 by applying a voltage to the closed circuit 70.
  • the resistance R measured by the resistance sensor 66b becomes an extremely small value R 0 (R 0 ⁇ 0).
  • the resistance R measured by the resistance sensor 66b has an extremely large value R 1 (R 1 ⁇ R 0 ).
  • the contact detection device 66 is capable of detecting whether the laser processing head 64 and the workpiece W are in contact or not in contact based on the resistance R measured by the resistance sensor 66b. .
  • the resistance sensor 66b supplies measurement data of the measured resistance R or contact determination data indicating contact or non-contact between the laser processing head 64 and the workpiece W to the processor 68 as detection data DD.
  • the processor 68 can determine whether the laser processing head 64 and the work W are in contact or not in contact based on the detection data DD of the resistance sensor 66b. Note that the resistance sensor 66b may be built into the head main body 50.
  • the processor 68 includes a CPU, a GPU, etc., and is built into the head main body 50.
  • the processor 68 is communicably connected to the mode selection switch 48, the first input device 58, the second input device 60, the distance sensor 62, and the resistance sensor 66b via a bus (or communication line) 72. There is.
  • the processor 68 functions as the command cutoff section 74, and when the condition CD for executing the laser emission operation LO in the manual operation mode DM1 is not satisfied, the processor 68 controls the first input device 58.
  • the manual laser emission command CM1 transmitted from the control device 18 to the control device 18 is cut off.
  • the function of this command cutoff section 74 will be explained with reference to FIGS. 9 and 10.
  • FIG. 9 schematically shows a state in which the command blocking section 74 is blocking the manual laser emission command CM1.
  • the manual laser emission command CM1 transmitted by the first input device 58 is transmitted to the control device 18 through the communication line 76, and the communication line 76 is provided with a cutoff circuit 78. There is.
  • the cutoff circuit 78 includes, for example, an electronically controllable switch 78a (relay, etc.), and is built into the head body 50 of the laser processing head 64.
  • the command cutoff unit 74 opens and closes the switch 78a of the cutoff circuit 78 in accordance with a predetermined condition CD to cut off the manual laser emission command CM1 or permit transmission of the manual laser emission command CM1.
  • the conditions CD for executing the laser emission operation LO in the manual operation mode DM1 are the first condition CD1 that the manual operation mode DM1 is selected by the mode selection switch 48, and the laser processing head 64 is not connected to the workpiece W.
  • a second condition CD2 of being in contact is included.
  • the command cutoff unit 74 opens the switch 78a of the cutoff circuit 78, as shown in FIG. 9, and thereby cuts off the manual laser emission command CM1. do.
  • the command cutoff section 74 closes the switch 78a of the cutoff circuit 78, as shown in FIG. Allow sending.
  • the processor 68 functions as the command cutoff unit 74 and operates the cutoff circuit 78 to cut off the manual laser emission command CM1 or permit transmission of the manual laser emission command CM1 according to the condition CD.
  • the cutoff circuit 78 switch 78a
  • the cutoff circuit 78 shown in FIGS. 9 and 10 is an example, and may be configured by any circuit.
  • step S1 the processor 68 determines whether the manual operation mode DM1 has been selected by the mode selection switch 48. If the manual operation mode DM1 is selected by the mode selection switch 48, the processor 68 determines YES and proceeds to step S2, while if the determination is NO, the processor 68 proceeds to step S3.
  • step S2 the processor 68 executes the flow of manual operation mode DM1. This step S2 will be explained with reference to FIG. 12. Note that at the start of step S2, the processor 68 may open the switch 78a of the cutoff circuit 78 as shown in FIG. 9, or may close the switch 78a as shown in FIG.
  • step S11 the processor 68 transmits a manual operation mode transition command CM3 to the control device 18.
  • the processor 36 (FIG. 2) of the control device 18 receives the manual operation mode transition command CM3
  • the processor 36 (FIG. 2) transitions the operation mode DM to the manual operation mode DM1.
  • the processor 36 of the control device 18 After transitioning to the manual operation mode DM1, the processor 36 of the control device 18 becomes ready to receive the manual laser emission command CM1, and at the same time, the processor 36 enters a state in which it can receive the manual laser emission command CM1. Reject automatic operation start command CM4. Note that in this step S11, the mode selection switch 48 may supply the manual operation mode transition command CM3 to the control device 18. Note that the manual operation mode transition command CM3 may be an ON signal (or a "1" signal).
  • step S12 the processor 68 starts an operation of detecting contact or non-contact between the laser processing head 64 and the workpiece W using the contact detection device 66. Specifically, the processor 68 starts an operation of causing the resistance sensor 66b to measure the resistance R and continuously (for example, periodically) acquiring detection data DD from the resistance sensor 66b.
  • step S13 the processor 68 determines whether the first input device 58 has received an input operation for transmitting the manual laser emission command CM1. If the first input device 58 accepts an input operation by the operator, the processor 68 determines YES and proceeds to step S14, while if the determination is NO, the processor 68 proceeds to step S20.
  • step S14 the processor 68 determines whether manual operation mode DM1 is selected by the mode selection switch 48 (that is, condition CD1 is satisfied), similarly to step S1 described above. If the processor 68 determines YES, the process proceeds to step S15, whereas if the processor 68 determines NO (that is, the mode selection switch 48 is switched to the automatic driving mode DM2 and the condition CD1 is not satisfied), the process proceeds to step S18. move on.
  • step S15 the processor 68 determines whether the laser processing head 64 is in contact with the workpiece W (that is, the condition CD2 is satisfied). Specifically, the processor 68 determines whether contact between the laser processing head 64 and the work W is detected by the contact detection device 66, or non-contact is detected, based on the detection data DD most recently acquired from the resistance sensor 66b. Determine if it is.
  • the processor 68 determines YES if contact between the laser processing head 64 and the workpiece W is detected, and proceeds to step S16, whereas if non-contact between the laser processing head 64 and the workpiece W is detected ( In other words, if the condition CD2 is not satisfied, the determination is NO and the process proceeds to step S19.
  • step S16 the processor 68 permits transmission of the manual laser emission command CM1 from the first input device 58 to the control device 18.
  • the processor 68 functions as a command cutoff section 74, and as shown in FIG. 10, operates the cutoff circuit 78 to close the switch 78a.
  • the processor 36 of the control device 18 executes the laser emission operation LO in response to the manual laser emission command CM1 from the first input device 58, and as a result, the laser beam LB is emitted from the emission port 52a of the laser processing head 64. be done. In this way, the operator can manually laser process the workpiece W.
  • step S17 the processor 68 determines whether an operation end command has been received from the control device 18.
  • the processor 68 determines YES and ends the flow of step S2, thereby ending the flow shown in FIG. 11.
  • the processor 68 determines NO, the process returns to step S13. Note that when the processor 68 determines YES in step S17, it may function as the command cutoff section 74, operate the cutoff circuit 78, and open the switch 78a.
  • step S14 determines whether the manual laser emission command CM1 transmitted from the first input device 58 to the control device 18 in step S18. Specifically, the processor 68 functions as a command cutoff section 74, and operates the cutoff circuit 78 to open the switch 78a, as shown in FIG.
  • step S18 the processor 68 of the laser processing head 64 proceeds to step S3 in FIG.
  • step S19 the processor 68 functions as the command cutoff unit 74, similarly to the above-described step S18, and transmits the command from the first input device 58 to the control device 18. Cut off manual laser emission command CM1. The processor 68 then returns to step S13.
  • step S13 determines in step S20 whether manual operation mode DM1 is selected by the mode selection switch 48, similarly to step S14 described above. If the processor 68 determines YES, the process proceeds to step S17, whereas if the processor 68 determines NO, the process proceeds to step S3 in FIG.
  • the processor 68 continues to permit transmission of the manual laser emission command CM1 in step S16. Thereby, the operator can continue manual laser processing while performing input operations on the first input device 58.
  • step S14 or S15 after determining YES in step S13, the processor 68 interrupts the manual laser emission command CM1 in step S18 or S19. As a result, the laser emission operation LO in the manual operation mode DM1 is prohibited.
  • step S3 the processor 68: Execute the flow of automatic driving mode DM2. This step S3 will be explained with reference to FIG. 13. Note that, at the start of step S3, the processor 68 may open the switch 78a of the cutoff circuit 78, as shown in FIG.
  • step S21 the processor 68 transmits an automatic driving mode transition command CM5 to the control device 18.
  • the processor 36 (FIG. 2) of the control device 18 receives the automatic driving mode transition command CM5, it transitions the driving mode DM to the automatic driving mode DM2.
  • the mode selection switch 48 may supply the automatic driving mode transition command CM5 to the control device 18.
  • the automatic driving mode transition command CM5 may be an OFF signal (or a "0" signal).
  • the processor 36 of the control device 18 After transitioning to the automatic operation mode DM2, the processor 36 of the control device 18 becomes able to accept the above-mentioned automatic operation start command CM4, but rejects the manual laser emission command CM1 from the laser processing head 64.
  • the processor 36 receives an automatic operation start command CM4 from the operator through the input device 44, for example, the processor 36 automatically executes the laser emission operation LO and the movement operation MO in the automatic operation mode DM2 according to the processing program PG1.
  • step S22 the processor 68 starts an operation to obtain the distance d measured by the distance measurement sensor 62.
  • the processor 68 operates the distance measurement sensor 62 to continuously (for example, periodically) measure the distance d between the laser processing head 64 and the workpiece W.
  • the processor 68 continuously (for example, periodically) acquires the distance d measured by the distance measurement sensor 62.
  • step S23 the processor 68 determines whether the distance d most recently acquired from the distance measurement sensor 62 is within a predetermined tolerance range RG.
  • step S24 the processor 68 transmits a laser emission prohibition command CM6 to the control device 18.
  • This laser emission prohibition command CM6 is a command for causing the processor 36 of the control device 18 to prohibit the laser emission operation LO in the automatic operation mode DM2.
  • the processor 36 of the control device 18 receives this laser emission prohibition command CM6, it stops (or does not start) the laser emission operation LO in the automatic operation mode DM1.
  • the processor 68 of the laser processing head 64 functions as the command transmitter 80 (FIG. 7) that transmits the laser emission prohibition command CM6 to the control device 18.
  • the laser emission prohibition command CM6 may be an OFF signal (or a "0" signal).
  • step S24 the processor 68 returns to step S23. In this way, while the processor 68 makes a NO determination in step S23, by transmitting the laser emission prohibition command CM6 in step S24, the processor 68 prevents the control device 18 from executing the laser emission operation LO in the automatic operation mode DM2. prohibited.
  • the processor 68 functions as the command transmitter 80 and transmits the laser emission permission command CM7 to the control device 18 in step S25.
  • This laser emission permission command CM7 is a command for permitting the processor 36 of the control device 18 to execute the laser emission operation LO in the automatic operation mode DM2.
  • the processor 36 of the control device 18 When the processor 36 of the control device 18 receives this laser emission permission command CM7, it becomes possible to execute the laser emission operation LO in the automatic operation mode DM1 in response to the above-mentioned automatic operation start command CM4.
  • the laser emission permission command CM7 may be an ON signal (or a "1" signal).
  • step S26 the processor 68 determines whether manual operation mode DM1 has been selected by the mode selection switch 48, similarly to step S14 described above. If the processor 68 determines YES, the process proceeds to step S28, whereas if the processor 68 determines NO, the process proceeds to step S27.
  • step S27 the processor 68 determines whether or not an operation end command has been received, similar to step S17 described above. If the processor 68 determines YES, it ends the flow of step S3, and thus ends the flow shown in FIG. 11. On the other hand, if the processor 68 determines NO, the process returns to step S23.
  • step S26 the processor 68 transmits a laser emission prohibition command CM6 to the control device 18 in step S28, similarly to step S24 described above.
  • the processor 68 then proceeds to step S2 in FIG.
  • control device when the laser processing head 64 does not satisfy the conditions CD (CD1, CD2) for executing the laser emission operation LO in the manual operation mode DM1 (that is, in step S14 or S15
  • the control device further includes a command cutoff section 74 that cuts off the manual laser emission command CM1 transmitted from the first input device 58 to the control device 18 when the determination is NO in the above step.
  • the manual laser emission command CM1 is cut off, so that the laser beam LB is emitted from the laser processing head 64. can be prohibited from being done. Thereby, the safety of the operator in manual operation mode DM1 can be ensured.
  • the laser processing head 64 further includes a mode selection switch 48 that can select manual operation mode DM1 or automatic operation mode DM2. Further, the condition CD has a first condition CD1 that the manual operation mode DM1 is selected by the mode selection switch 48.
  • the command cutoff unit 74 cuts off the manual laser emission command CM1 (step S18).
  • the laser processing head 64 further includes a contact detection device 66 that detects contact or non-contact between the laser processing head 64 and the workpiece W. Furthermore, the condition CD has a second condition CD2 that the laser processing head 64 is in contact with the workpiece W. Then, if the contact detection device 66 detects non-contact (NO in step S15), the command blocking unit 74 blocks the manual laser emission command CM1 (step S19).
  • the laser processing head 64 when performing the laser emission operation LO in the manual operation mode DM, the laser processing head 64 separates from the workpiece W, and the laser beam LB from the laser processing head 64 is directed in an unintended direction. (for example, in the direction of the operator). Thereby, the safety of the operator in manual operation mode DM1 can be more reliably ensured.
  • the contact detection device 66 includes a conductive cable 66a that electrically connects the laser processing head 64 and the work W, the work W, the laser processing head 64 that contacts the work W, and the conductive cable 66a that electrically connects the laser processing head 64 and the work W.
  • the resistance sensor 66b measures the resistance R of the closed circuit 70 formed by the resistance sensor 66a.
  • the contact detection device 66 is configured to detect contact or non-contact between the laser processing head 64 and the work W based on the resistance R measured by the resistance sensor 66b. According to this configuration, contact or non-contact between the laser processing head 64 and the workpiece W can be detected quickly and reliably with a relatively simple configuration.
  • the laser processing head 64 controls the control device when the distance d measured by the distance sensor 62 is outside the predetermined tolerance range RG (that is, when the determination is NO in step S23).
  • the control device 18 further includes a command transmitting unit 80 that transmits a laser emission prohibition command CM6 to the control device 18 for prohibiting the laser emission operation LO in the automatic operation mode DM2.
  • the laser emission operation LO when executed in the automatic operation mode DM2, if the workpiece W is not placed at an appropriate position with respect to the laser processing head 64, the laser emission operation LO can be prohibited. Thereby, the safety of the laser processing work performed in the automatic operation mode DM2 can be improved.
  • the mode selection switch 48 may be omitted from the laser processing head 64, and the mode selection switch 48 may be provided in the control device 18 as in the embodiment shown in FIG. Further, the contact detection device 66 may be omitted from the laser processing head 64. In this case, steps S15 and S19 may be omitted from the flow shown in FIG. 12. Note that the contact detection device 66 is not limited to a configuration having a conductive cable 66a and a resistance sensor 66b, but may include any sensor such as a proximity sensor capable of detecting contact between the laser processing head 64 and the workpiece W. good.
  • the command transmitter 80 may be omitted from the laser processing head 64.
  • the processor 68 (or the distance measurement sensor 62) of the laser processing head 64 may supply measurement data of the distance d measured by the distance measurement sensor 62 to the control device 18. Then, the processor 36 of the control device 18 may determine whether or not the laser emission operation LO can be executed in the automatic operation mode DM2 based on the measurement data.
  • the processor 36 of the control device 18 continuously (for example, periodically) acquires measurement data of the distance d from the distance measurement sensor 62 while executing the laser emission operation LO and the movement operation MO in the automatic operation mode DM2. You can.
  • the processor 36 may then perform gap control to control the distance d between the laser processing head 14 and the workpiece W to a predetermined target distance d0 based on the acquired measurement data.
  • This target distance d 0 may be predetermined as a value within the above-mentioned tolerance range RG.
  • Laser processing head 84 can be applied to laser processing system 10 instead of laser processing head 64 described above.
  • the laser processing head 84 differs from the above-described laser processing head 64 in that it further includes a clock section 86.
  • the timer 86 is built into the head body 50 together with the processor 68 and the resistance sensor 66b, for example, and measures the elapsed time t from a certain point in time.
  • step S2 executed by the laser processing head 84 will be described with reference to FIG. 15.
  • the processor 68 of the laser processing head 84 executes the flow shown in FIG. 15 as step S2 in FIG. Note that in the flow shown in FIG. 15, processes similar to those in the flow shown in FIG. 12 are given the same step numbers, and redundant explanations will be omitted.
  • the processor 68 starts from the time t0 when the contact detection device 66 detects non-contact between the laser processing head 84 and the workpiece W (that is, the determination is NO in step S15), A waiting time tth until the manual laser emission command CM1 is cut off in S19 is set in advance.
  • the processor 68 obtains the waiting time t th from the control device 18 and registers the setting information of the waiting time t th in a register built into the processor 68, for example.
  • the laser processing head 84 may further include a memory (ROM, RAM, etc.), and the processor 68 may register the setting information of the standby time t th in the memory.
  • the processor 68 presets the waiting time t th . Therefore, the processor 68 functions as a standby time setting unit 82 (FIG. 14) that sets the standby time t th .
  • step S2 shown in FIG. 15 when the processor 68 determines NO in step S15, it starts counting the elapsed time t in step S31. Specifically, the processor 68 activates the timer 86 to start measuring the elapsed time t from the time t0 for which the determination is NO in step S15.
  • step S32 the processor 68 determines whether the elapsed time t measured by the timer 86 has reached a preset waiting time t th (that is, t ⁇ t th ). If t ⁇ t th , the processor 68 determines YES and proceeds to step S19, while if t ⁇ t th , the processor 68 determines NO and proceeds to step S33.
  • step S33 the processor 68 determines whether contact between the laser processing head 84 and the workpiece W has been detected by the contact detection device 66, as in step S15 described above. If the processor 68 determines YES, the process returns to step S13, whereas if the processor 68 determines NO (that is, the laser processing head 84 and the workpiece W are still in non-contact), the process returns to step S32.
  • steps S31 to S33 will be explained below.
  • the processor 36 of the control device 18 will execute the laser emission operation LO in the manual operation mode DM1.
  • the processor 68 if NO is determined in step S15, the processor 68 returns to the time t 0 at which the determination is NO in step S15.
  • Step S19 is not executed (in other words, the laser emitting operation LO is continued) until the standby time t th has elapsed (that is, until YES is determined in step S32).
  • step S33 if the processor 68 continuously determines NO in step S33 before the waiting time t th elapses (that is, the laser processing head 84 and the workpiece W continue to be out of contact for the period t th If detected), the command cutoff unit 74 executes step S19, and as a result, the laser emission operation LO is prohibited.
  • the laser processing head 84 detects non-contact by the contact detection device 66 while the control device 18 is executing the laser emission operation LO in the manual operation mode DM1 (step
  • the standby time setting unit 82 further includes a standby time setting unit 82 that sets a standby time t th from time t 0 (determined NO in S15) until the command cutoff unit 74 blocks the manual laser emission command CM1 (that is, executes step S19). Be prepared.
  • the command cutoff unit 74 cuts off the manual laser emission command CM1 when the standby time tth set by the standby time setting unit 82 has elapsed from time t0 (determined as YES in step S32). S19).
  • the operator moves the laser processing head 84 to the workpiece W while bringing the tip of the laser processing head 84 into contact with the workpiece W.
  • Laser processing may be performed using laser light LB.
  • the laser processing head 84 may be separated from the workpiece W instantaneously (for example, by 0.3 [sec]) due to the unevenness on the surface of the workpiece W, for example. Even if the laser processing head 84 is momentarily separated from the work W in this way, there is a low possibility that the laser beam LB from the laser processing head 84 will be emitted in the direction of the operator, and therefore the safety of the operator can be ensured. .
  • step S19 by setting the waiting time t th until the manual laser emission command CM1 is interrupted in step S19, the instantaneous separation of the laser processing head 84 from the workpiece W as described above occurs. However, the laser emission operation LO can be continued. On the other hand, if the non-contact between the laser processing head 84 and the workpiece W is still detected even after the waiting time t th has elapsed, step S19 is immediately executed to stop the laser emission operation LO. Can be prohibited. Therefore, according to this embodiment, the laser processing work can be carried out efficiently, and the safety of the operator can be ensured.
  • the processor 68 may execute the flow shown in FIG. 11 according to the computer program PG2.
  • This computer program PG2 may be stored in a memory (ROM, RAM, etc.) built into the laser processing head 14, 64, or 84. Further, the functions of the command cutoff section 74, the command transmission section 80, and the standby time setting section 82 executed by the processor 68 may be functional modules realized by the computer program PG2.
  • the first input device 58' shown in FIG. 5 may be applied to the laser processing head 64 or 84.
  • the processor 68 may execute the flow shown in FIG. 11 and may also control the above-mentioned lens driving section.
  • the clock section 86 may be omitted from the laser processing head 84.
  • a clock section 86 may be provided in the control device 18 , and the processor 68 may acquire information on the elapsed time t from the clock section 86 of the control device 18 .
  • the light guide path 34 may be omitted from the laser processing system 10.
  • the laser oscillator 16 may be coupled directly to the laser processing head 14, 14', 64 or 84.
  • the laser processing head 14, 14', 64, or 84 may be any type of device, such as a laser scanner (or galvano scanner).
  • the laser scanner includes a plurality of mirrors that each reflect the laser beam LB supplied from the laser oscillator 16, a plurality of mirror drive units that individually drive the plurality of mirrors, and a condensing of the laser beam reflected by the mirror. It has an optical lens etc.
  • the laser scanner can move the irradiation point of the laser beam LB irradiated onto the workpiece W at high speed on the surface of the workpiece W by changing the orientation of a plurality of mirrors using a mirror drive unit.
  • the robot 12 is not limited to a vertical articulated robot, but may be a horizontal articulated robot or a parallel link robot, and the robot 12 is not limited to a vertical articulated robot. It may be configured to include a screw mechanism and a third ball screw mechanism that moves the laser processing head 14, 14', 64, or 84 in the vertical direction.
  • control device 18 may include a first control device 18A that controls the movement operation MO of the robot 12, and a second control device 18B that controls the laser emission operation LO of the laser oscillator 16.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Human Computer Interaction (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2022/026614 2022-07-04 2022-07-04 レーザ加工ヘッド、及びレーザ加工システム Ceased WO2024009359A1 (ja)

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US18/876,852 US20250367765A1 (en) 2022-07-04 2022-07-04 Laser machining head and laser machining system
DE112022007119.2T DE112022007119T5 (de) 2022-07-04 2022-07-04 Laserbearbeitungskopf und laserbearbeitungssystem
PCT/JP2022/026614 WO2024009359A1 (ja) 2022-07-04 2022-07-04 レーザ加工ヘッド、及びレーザ加工システム
CN202280097571.4A CN119451772A (zh) 2022-07-04 2022-07-04 激光加工头以及激光加工系统
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04351285A (ja) * 1991-04-27 1992-12-07 Nippei Toyama Corp レーザ加工装置
JPH08267381A (ja) * 1995-03-30 1996-10-15 Nippon Steel Corp ロボット手動送り制御装置
JP2002538971A (ja) * 1998-09-09 2002-11-19 ジーエスアイ ルモニクス ロボット的に動作するレーザ・ヘッド
JP2009285753A (ja) * 2008-05-28 2009-12-10 Shibuya Kogyo Co Ltd ロボット制御システム
JP2017006955A (ja) * 2015-06-23 2017-01-12 株式会社総合車両製作所 レーザ溶接方法
JP2018153873A (ja) * 2017-03-15 2018-10-04 株式会社オカムラ マニピュレータの制御装置、制御方法およびプログラム、ならびに作業システム
JP2020028911A (ja) * 2018-08-24 2020-02-27 ファナック株式会社 レーザ加工システム、噴流観測装置、レーザ加工方法、及び噴流観測方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113194A (ja) * 1987-10-27 1989-05-01 Mitsubishi Electric Corp レーザ加工機制御装置
JP2000024787A (ja) 1998-07-14 2000-01-25 Amada Co Ltd ハンディレーザヘッド自動送り装置
JP2000052076A (ja) 1998-08-07 2000-02-22 Amada Co Ltd レーザー加工装置及び加工ヘッド駆動方法
AU2021241577A1 (en) * 2020-03-27 2022-11-03 Mako Surgical Corp. Systems and methods for controlling robotic movement of a tool based on a virtual boundary

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04351285A (ja) * 1991-04-27 1992-12-07 Nippei Toyama Corp レーザ加工装置
JPH08267381A (ja) * 1995-03-30 1996-10-15 Nippon Steel Corp ロボット手動送り制御装置
JP2002538971A (ja) * 1998-09-09 2002-11-19 ジーエスアイ ルモニクス ロボット的に動作するレーザ・ヘッド
JP2009285753A (ja) * 2008-05-28 2009-12-10 Shibuya Kogyo Co Ltd ロボット制御システム
JP2017006955A (ja) * 2015-06-23 2017-01-12 株式会社総合車両製作所 レーザ溶接方法
JP2018153873A (ja) * 2017-03-15 2018-10-04 株式会社オカムラ マニピュレータの制御装置、制御方法およびプログラム、ならびに作業システム
JP2020028911A (ja) * 2018-08-24 2020-02-27 ファナック株式会社 レーザ加工システム、噴流観測装置、レーザ加工方法、及び噴流観測方法

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