WO2024004074A1 - Machine de montage - Google Patents

Machine de montage Download PDF

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Publication number
WO2024004074A1
WO2024004074A1 PCT/JP2022/025931 JP2022025931W WO2024004074A1 WO 2024004074 A1 WO2024004074 A1 WO 2024004074A1 JP 2022025931 W JP2022025931 W JP 2022025931W WO 2024004074 A1 WO2024004074 A1 WO 2024004074A1
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WO
WIPO (PCT)
Prior art keywords
nozzle
mounting machine
component
attracted
inner diameter
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PCT/JP2022/025931
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English (en)
Japanese (ja)
Inventor
博充 岡
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株式会社Fuji
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Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/025931 priority Critical patent/WO2024004074A1/fr
Publication of WO2024004074A1 publication Critical patent/WO2024004074A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • This specification discloses a mounting machine.
  • Patent Document 1 describes a case in which the amount of positional deviation of the nozzle tip with respect to the rotation center position is measured in advance and the amount of positional deviation is taken into consideration when suctioning an object or mounting the object.
  • a mounting machine that corrects the nozzle position is disclosed.
  • the position of the hole in the cylindrical nozzle may be offset from the center relative to the outer shape. In this case, the mounting machine disclosed in Patent Document 1 may not be able to correctly determine the position of the hole, and the suction accuracy may deteriorate.
  • Patent Document 2 describes a method for solving such problems, in which a spherical detection chip is adsorbed by a nozzle, an image of the detection chip adsorbed to the nozzle is taken from below, and the center of the detection chip is identified in the captured image.
  • a mounting machine that determines the center of the nozzle is disclosed.
  • the main purpose of the present disclosure is to improve suction accuracy.
  • the mounting machine of the present disclosure includes: A mounting machine that can pick up and mount objects, a nozzle formed in a cylindrical shape and sucking the object at its lower end; a head that holds the nozzle; a head moving device that moves the head in a horizontal direction; a camera capable of capturing an image of the lower end of the nozzle or the lower surface side of the object attracted to the nozzle; controlling the camera so that an image of the lower end of the nozzle is captured, recognizing the inner diameter portion of the nozzle at the lower end based on the image, and deriving the center of the inner diameter of the nozzle in advance; controlling the head moving device to attract the object to the nozzle so that the center of the inner diameter of the nozzle coincides with the adsorption position of the object when performing the adsorption operation of the object; a device;
  • the main point is to have the following.
  • the camera is controlled so that an image of the lower end of the nozzle is captured, the inner diameter portion of the nozzle at the lower end is recognized based on the image, and the center of the inner diameter of the nozzle is derived in advance.
  • the head moving device is controlled so that the nozzle attracts the target object so that the center of the inner diameter of the nozzle coincides with the position of the target object. Even if the center of the cylindrical nozzle based on the inner diameter (inner diameter center) is offset from the center based on the outer diameter (outer diameter center), the center of the inner diameter can be aligned with the position of the object to be adsorbed.
  • the suction accuracy can be improved.
  • the center of the inner diameter is determined without using a detection chip, the problem that the detection accuracy of the center of the inner diameter is reduced due to scratches or dents on the detection chip is less likely to occur. Therefore, suction accuracy can be improved.
  • FIG. 1 is a perspective view of a component mounting machine 10.
  • FIG. It is a perspective view of part P. 3 is a schematic configuration diagram of a parts camera 40 and a lighting device 50.
  • FIG. FIG. 2 is a block diagram showing electrical connections of the component mounter 10.
  • FIG. 3 is a flowchart illustrating an example of an inner diameter center position derivation routine.
  • FIG. 3 is an explanatory diagram showing an example of a nozzle lower end image Im1.
  • FIG. 3 is an explanatory diagram showing an example of a nozzle lower end image Im1.
  • 3 is a flowchart showing an example of a component mounting routine.
  • FIG. 3 is an explanatory diagram showing how a part P is attracted.
  • FIG. 3 is an explanatory diagram showing how a part P is attracted.
  • FIG. 3 is an explanatory diagram showing how a part P is attracted.
  • FIG. 7 is an explanatory diagram showing a modified example of how the component P is sucked.
  • FIG. 7 is an explanatory diagram showing a modified example of how the component P is sucked.
  • FIG. 7 is an explanatory diagram showing a modified example of how the component P is sucked.
  • FIG. 7 is an explanatory diagram showing a modified example of how the component P is sucked.
  • FIG. 7 is an explanatory diagram showing a modified example of how the component P is sucked.
  • FIG. 1 is a perspective view of the component mounter 10.
  • FIG. 2 is a perspective view of the component P.
  • FIG. 3 is a schematic configuration diagram of the parts camera 40 and the lighting device 50.
  • FIG. 4 is a block diagram showing the electrical connections of the component mounter 10. In this embodiment, the left-right direction (X-axis), the front-back direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. 1 and 2.
  • the component mounting machine 10 receives components P from a plurality of tape feeders 70 and mounts them onto a board S.
  • the component mounter 10 includes a base 11 and a mounter main body 12 installed on the base 11.
  • the tape feeder 70 includes a reel 72 and a feeder section 74.
  • the tape feeder 70 is detachably attached to the front side of the mounting machine main body 12.
  • a tape T is wound around each reel 72.
  • a plurality of accommodation recesses are provided on the surface of the tape T along the longitudinal direction of the tape T.
  • a component P as shown in FIG. 2 is accommodated in each accommodation recess.
  • This component P may be, for example, an LED component in which a hemispherical dome portion A is formed of a transparent resin having light transmittance. These parts P are protected by a film covering the surface of the tape T.
  • the tape T is unwound backward from the reel 72, and the film is peeled off at the feeder section 74, leaving the component P exposed.
  • This exposed component P is attracted by the nozzle 23.
  • the operation of the reel 72 is controlled by a feeder controller 76 (see FIG. 4) included in each feeder section 74.
  • the mounting machine main body 12 is installed on the base 11 so as to be replaceable. As shown in FIG. 1, this mounting machine main body 12 includes a substrate transport device 13, a head moving device 17, a head 22, a nozzle 23, a parts camera 40, a mark camera 45, and an illumination device 50 (FIG. 3). ) and a control device 60.
  • the substrate transport device 13 is a device that transports and holds the substrate S.
  • This substrate transport device 13 includes support plates 14, 14 and conveyor belts 15, 15 (only one of which is shown in FIG. 1).
  • the pair of front and rear support plates 14, 14 are members extending in the left-right direction, and are provided with an interval equal to the length of the front and rear of the substrate S.
  • the conveyor belts 15, 15 span endless driving wheels and driven wheels provided on the left and right sides of the support plates 14, 14.
  • the substrate S is placed on the upper surface of a pair of conveyor belts 15, 15 and conveyed from left to right. When this board S is carried into the mounting machine main body 12, it is transported to a position where the component P is mounted, and then clamped by a clamp device (not shown).
  • the head moving device 17 is a device that moves the head 22 in the horizontal direction.
  • the head moving device 17 includes an X-axis slider 18 and a Y-axis slider 19.
  • the Y-axis slider 19 is slidably attached to a pair of left and right guide rails 20, 20 extending in the front-rear direction.
  • a pair of upper and lower guide rails 21, 21 extending in the left-right direction are provided on the front surface of the Y-axis slider 19.
  • the X-axis slider 18 is slidably attached to the guide rails 21, 21. Note that each slider 18, 19 is driven by a drive motor 18a, 19a (see FIG. 4), respectively.
  • the X-axis slider 18 has a position sensor 18b (see FIG.
  • the position sensor 18b outputs the position of the X-axis slider 18 to the control device 60 (see FIG. 4).
  • the Y-axis slider 19 has a position sensor 19b (see FIG. 4) that can detect the position of the Y-axis slider 19.
  • the position sensor 19b outputs the position of the Y-axis slider 19 to the control device 60.
  • the head 22 is for holding the nozzle 23.
  • the head 22 is attached to the front surface of the X-axis slider 18.
  • the X-axis slider 18 is attached to the front surface of the Y-axis slider 19.
  • the head 22 moves in the left-right direction as the X-axis slider 18 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 19 moves in the front-back direction.
  • the nozzle lifting device 24 (see FIG. 4) is a device that moves the nozzle 23 up and down with respect to the head 22.
  • the nozzle lifting device 24 includes a Z-axis motor 25 and a ball screw 26 extending along the Z-axis.
  • the nozzle 23 is attached to the ball screw 26 via a nozzle holder (not shown), and the height of the nozzle 23 is adjusted by the Z-axis motor 25.
  • the nozzle lifting device 24 includes a Q-axis motor 27 (see FIG. 4) that rotates the nozzle 23 around its axis.
  • the nozzle 23 is a member that attracts and holds the component P at the tip of the nozzle, and releases the component P that is sucked from the tip of the nozzle.
  • the nozzle 23 is a cylindrical member having a flange.
  • the suction port of the nozzle 23 is configured to selectively communicate with either the vacuum pump 29 or the air pipe 30 via the solenoid valve 28.
  • the nozzle 23 can apply negative pressure to the suction port to adsorb the component P, and the suction port communicates with the air pipe 30.
  • positive pressure can be applied to the suction port to release the suction of the component P.
  • the nozzle 23 projects downward from the bottom surface of the main body of the head 22. Furthermore, the height of the component attracted to the nozzle 23 is adjusted by moving the nozzle 23 up and down along the Z-axis direction by the Z-axis motor 25. By rotating the nozzle 23 by the Q-axis motor 27, the orientation of the component attracted to the nozzle 23 is adjusted.
  • the parts camera 40 is a camera that has an imaging range above.
  • the parts camera 40 can generate an image by capturing an image of the lower end of the nozzle 23 from below, and can also generate an image by capturing an image of the component P attracted to the nozzle 23 from below.
  • the parts camera 40 is arranged in front of the support plate 14 on the front side of the substrate transport device 13.
  • the mark camera 45 has an imaging area at the bottom and can read reference marks attached to the board S indicating the reference position of the board S and the reference position where the component P is placed, etc., and is housed in the storage recess of the tape T. This is a camera that can take an image of the part P that is being used.
  • the mark camera 45 is attached to the lower surface of the X-axis slider 18 and can move together with the head 22.
  • the illumination device 50 is a device that irradiates light onto an imaging target (for example, the component P or the lower end of the nozzle 23).
  • the illumination device 50 includes a housing 52, a connecting portion 53, an incident light source 54, a half mirror 56, and a multistage light source 57.
  • the housing 52 is a bowl-shaped member with an octagonal opening at the upper and lower surfaces (bottom surface).
  • the housing 52 has a shape in which the opening on the top surface is larger than the opening on the bottom surface, and the internal space tends to increase from the bottom surface to the top surface.
  • the connecting portion 53 is a cylindrical member that connects the housing 52 and the parts camera 40.
  • the incident light source 54 has a plurality of LEDs 55.
  • the half mirror 56 reflects horizontal light from the LED 55 of the incident light source 54 upward. Further, the half mirror 56 transmits light from above toward the parts camera 40.
  • the multistage light source 57 includes an upper stage light source 57a, a middle stage light source 57b, and a lower stage light source 57c.
  • the upper light source 57a has a plurality of LEDs 58a
  • the middle light source 57b has a plurality of LEDs 58b
  • the lower light source 57c has a plurality of LEDs 58c.
  • the LEDs 58a to 58c all emit light in a direction inclined from the optical axis 59a.
  • the angle of inclination of the irradiation direction of the LEDs 58a to 58c from the optical axis 59a is the largest for the LED 58a, and the LED 58a irradiates light in a substantially horizontal direction. Moreover, this angle of inclination is the smallest for the LED 58c.
  • the control device 60 includes a CPU 61, a RAM 62, a ROM 63, and a storage (for example, HDD or SSD) 64.
  • This control device 60 includes the substrate transfer device 13, a drive motor 18a for the X-axis slider 18, a drive motor 19a for the Y-axis slider 19, a Z-axis motor 25, a Q-axis motor 27, a parts camera 40, a solenoid valve 28, and a lighting device.
  • a control signal is output to 50.
  • the control device 60 inputs captured images from the parts camera 40.
  • the control device 60 is communicatively connected to a feeder controller 76 of a tape feeder 70.
  • the control device 60 controls the drive motors 18a, 19a of each slider 18, 19 while inputting position information from the position sensors 18b, 19b.
  • FIG. 5 is a flowchart showing an example of the inner diameter center position derivation routine.
  • FIG. 6A is an explanatory diagram showing an example of the nozzle lower end image Im1. This position of the inner diameter center C0 is used in a component mounting routine to be described later.
  • the CPU 61 controls the drive motor 18a of the X-axis slider 18 and the drive motor 19a of the Y-axis slider 19 so that the lower end of the nozzle 23 moves above the parts camera 40 (S100).
  • the CPU 61 turns on the lighting device 50 (S110). Specifically, the CPU 61 turns on the upper light source 57a, the middle light source 57b, the lower light source 57c, and the incident light source 54. Subsequently, the CPU 61 sets the exposure time T1 (S120).
  • the exposure time T1 is longer than the exposure time T2 when the lower surface of the component P is imaged by the parts camera 40 in a component mounting routine to be described later.
  • the exposure time T1 is, for example, about 250 [ms].
  • FIG. 6A is a nozzle lower end image Im1 in which the center based on the inner diameter (inner diameter center C0) of the nozzle 23 is not shifted from the center based on the outer diameter (outer diameter center C1).
  • the CPU 61 recognizes the inner diameter of the nozzle 23 based on the nozzle lower end image Im1 (S140). This process is executed as follows. That is, the CPU 61 acquires the brightness value of each pixel that constitutes the nozzle lower end image Im1. Next, the CPU 61 recognizes the outline of the inner diameter of the nozzle 23 based on the change in the brightness value. Then, the CPU 61 recognizes the portion surrounded by the outline as the inner diameter of the nozzle 23.
  • the CPU 61 derives the center position of the nozzle 23 (S150). This process is executed as follows. That is, first, the CPU 61 recognizes the outer diameter of the nozzle 23. This process is executed in the same manner as in recognizing the inner diameter of the nozzle 23 described above. Next, the CPU 61 derives the inner diameter center C0 based on the inner diameter outline of the nozzle 23 recognized in S140, and also derives the outer diameter center C1 of the nozzle 23 based on the outer diameter outline of the nozzle 23.
  • the CPU 61 determines the positional deviation amount of the inner diameter center C0 with respect to the outer diameter center C1 (when the XY coordinates are determined for the nozzle lower end image Im1, the XY coordinate values of the inner diameter center C0 with the outer diameter center C1 as the origin) Derive. Then, the CPU 61 stores the nozzle 23 (identification information) and the amount of positional deviation of the inner diameter center C0 with respect to the outer diameter center C1 in the storage 64 in association with each other. After the CPU 61 executes the processes from S110 to S150 for all nozzles used in the component mounter 10, it ends this routine.
  • FIG. 6B is an explanatory diagram showing an example of the nozzle lower end image Im1.
  • FIG. 7 is a flowchart showing an example of a component mounting cooking routine.
  • 8A to 8C are explanatory diagrams showing how the nozzle 23 sucks the component P.
  • This routine is executed by the CPU 61 after receiving a production job from a management computer (not shown).
  • the production job defines the mounting order (which type of component is to be mounted on the board S in what order in the component mounter 10), the target mounting position, and how many boards S to mount the component on. It is information.
  • the CPU 61 reads from the storage 64 the amount of positional deviation of the inner diameter center C0 with respect to the outer diameter center C1 of the nozzle 23 currently attached to the head 22 (S200). Subsequently, the CPU 61 controls the board transport device 13 so that the board S is transported into the component mounting machine 10 (S210).
  • the CPU 61 recognizes the component P to be mounted next on the board S in light of the mounting order in the production job (S220).
  • the CPU 61 drives the drive motor 18a of the X-axis slider 18 and the Y-axis slider 19 so that the inner diameter center C0 of the nozzle 23 coincides with the suction point of the component P to be mounted.
  • the motor 19a is controlled (S230). This process is executed, for example, as follows. That is, first, the CPU 61 controls the drive motor 18a of the X-axis slider 18 and the drive motor 19a of the Y-axis slider 19 so that the mark camera 45 moves above the component P to be mounted on the board S next. Next, the CPU 61 controls the mark camera 45 so that an image of the component P accommodated in the accommodation recess is captured.
  • the CPU 61 determines the suction point of the component P (for example, the center point of the component P) based on the position information from the position sensors 18b and 19b and the image of the component P. Then, the drive motor 18a of the X-axis slider 18 and the drive motor 19a of the Y-axis slider 19 are controlled so that the center position of the component P and the inner diameter center C0 of the nozzle 23 coincide.
  • the position of the inner diameter center C0 is the position where the position of the outer diameter center C1 is equal to the positional deviation amount of the position of the inner diameter center C0 with respect to the position of the outer diameter center C1.
  • the position of the outer diameter center C1 can be determined based on position information from the position sensors 18b and 19b. This is because the position of the head 22 can be derived based on the position information of the position sensors 18b and 19b, and the relative position of the nozzle 23 with respect to the head 22 is constant.
  • the CPU 61 executes a process of sucking the part P (S240). Specifically, the CPU 61 controls the Z-axis motor 25 so that the lower surface of the nozzle 23 abuts the component P, as shown in FIG. 8B. Next, the CPU 61 controls the solenoid valve 28 so that the suction port of the nozzle 23 communicates with the vacuum pump 29 . As a result, negative pressure acts on the suction port of the nozzle 23, and the component P is suctioned by the nozzle 23. Then, the CPU 61 controls the Z-axis motor 25 so that the nozzle 23 rises.
  • the part P having the dome part A is Since the top part of the part P is sucked into the suction hole of the nozzle 23, there is a risk that the part P will be sucked in an inclined state with respect to the nozzle 23. If the process of S290 of this routine, which will be described later, is executed in this state, there is a possibility that positional deviation or misrecognition of the part size will occur due to the tilt of the part P. Therefore, when mounting the component P on the board S, there is a possibility that a positional shift may occur, which may cause defects.
  • the part P having the dome part A is sucked while entering the suction hole of the nozzle 23, so if the position of the suction hole when picking up the part P deviates even slightly from the top of the dome part A, the part P will not be suctioned. Defects are more likely to occur.
  • the suction operation of the component P is performed in a state where the inner diameter center C0 coincides with the suction point of the component P.
  • the CPU 61 controls the drive motor 18a of the X-axis slider 18 and the drive motor 19a of the Y-axis slider 19 so that the part P attracted to the nozzle 23 moves above the parts camera 40 (S250). Subsequently, the CPU 61 turns on the lighting device 50 (S260). Specifically, the CPU 61 turns on the upper light source 57a and the epi-light source 54.
  • the exposure time T2 is shorter than the exposure time T1 when capturing the nozzle lower end image Im1 in the inner diameter center deriving routine.
  • the exposure time T2 is, for example, about 40 [ms].
  • the CPU 61 controls the parts camera 40 so that the bottom surface of the part P is imaged with the lighting device 50 turned on (S280). Subsequently, the CPU 61 derives the amount of deviation of the suction position of the component P with respect to the nozzle 23 based on the captured image (S290). The deviation amount of the suction position is the difference between the target suction position of the component P with respect to the nozzle 23 and the actual suction position with respect to the nozzle 23 . Then, the CPU 61 determines whether the amount of deviation of the suction position is within an allowable range (S300).
  • the CPU 61 controls various members so that the parts P picked up by the nozzle 23 are discarded to a discarding device (not shown) (S310). After S310, the CPU 61 returns to S220 again. Then, the CPU 61 recognizes a component P of the same type as the component P discarded in S310 as a component to be mounted (S220), and executes the processes from S230 onwards.
  • the CPU 61 corrects the target mounting position based on the amount of deviation of the suction position (S320).
  • This process is executed as follows. That is, the CPU 61 first sets the position correction amount.
  • the position correction amount is an amount that can eliminate the suction position deviation amount. Then, the CPU 61 adds the position correction amount to the target mounting position before correction to derive the target mounting position after correction.
  • the CPU 61 executes a process of mounting the component P on the board S (S330). Specifically, the drive motor 18a of the X-axis slider 18 and the drive motor 19a of the Y-axis slider 19 are controlled so that the mark camera 45 moves above the substrate S.
  • the CPU 61 controls the drive motor 18a of the X-axis slider 18 and the drive motor 19a of the Y-axis slider 19 so that the component P moves above the corrected target mounting position.
  • the CPU 61 controls the Z-axis motor 25 so that the component P descends and is pressed against the substrate S.
  • the CPU 61 controls the solenoid valve 28 so that the suction port of the nozzle 23 communicates with the air pipe 30. As a result, positive pressure acts on the suction port of the nozzle 23, and the suction of the component P is released. In this way, the component P is mounted on the board S.
  • the CPU 61 determines whether all the components to be mounted on the own machine have been mounted (S340). If a negative determination is made in S340, the CPU 61 returns to S220. Then, the next component to be mounted is recognized based on the production job (S220), and the processes from S230 onwards are repeatedly executed. On the other hand, if an affirmative determination is made in S340, the CPU 61 executes a process of transporting the substrate S downstream (S350). Specifically, the CPU 61 controls the substrate transport device 13 so that the substrate S is transported downstream in the transport direction.
  • the CPU 61 determines whether the planned number of substrates S has been produced (S360). If a negative determination is made in S360, the CPU 61 returns to S210 again. On the other hand, if an affirmative determination is made in S360, the CPU 61 ends this routine.
  • this routine may be executed for all components P to be mounted by the component mounter 10, or may be executed only for a specific component P that particularly requires precision during suction.
  • this routine only on a specific part P, set whether or not it is necessary in the production job in advance, and derive the amount of deviation of the center of the inner diameter only for the nozzle 23 that picks up the part P that is the target of this routine. You may also do so.
  • the component mounter 10 of this embodiment corresponds to the mounter of the present disclosure
  • the head 22 corresponds to a head
  • the head moving device 17 corresponds to a head moving device
  • the parts camera 40 corresponds to a camera.
  • the parts camera 40 is controlled so that the nozzle lower end image Im1 at the lower end of the nozzle 23 is captured, and the inner diameter portion of the nozzle 23 at the lower end is detected based on the nozzle lower end image Im1.
  • the head moving device is controlled so that the center of the inner diameter of the nozzle coincides with the point to be attracted on the object when performing the suction operation of the object.
  • the object is attracted to the nozzle.
  • the inner diameter center C0 of a cylindrical nozzle 23 deviates from the outer diameter center C1, the inner diameter center C0 can be aligned with the suction point of the part P to improve suction accuracy. Can be done.
  • the inner diameter center C0 is determined without using a detection chip, the problem of lowering the detection accuracy of the inner diameter center due to scratches or dents on the detection chip is less likely to occur. Therefore, suction accuracy can be improved.
  • the component P has a dome portion A on the upper surface as a suction surface. Since the dome portion A is sucked so as to fit into the suction hole, a suction failure is likely to occur if there is even a slight deviation. However, in the component mounter 10, by aligning the inner diameter center C0 of the nozzle 23 with the suction point of the component P, the occurrence of suction failure can be suppressed.
  • the control device 60 controls the lower end of the nozzle 23 and the lower surface of the component P sucked by the nozzle 23 to be imaged under different imaging conditions. Therefore, the imaging conditions can be determined in consideration of the ease of recognizing the inner diameter portion of the nozzle 23.
  • the illumination device 50 is provided which can irradiate light to the lower end of the nozzle 23 and the lower surface side of the component P attracted to the nozzle 23 under a plurality of different illumination conditions. These are the exposure time and light intensity when imaging the lower surface side of the component P attracted to the nozzle 23, and the control device 60 determines that it is better to image the lower end of the nozzle 23 than to capture the lower surface of the component P attracted to the nozzle 23.
  • the exposure time is controlled to be longer and the amount of light is controlled to be greater. Therefore, it becomes easier to recognize the inner diameter portion of the nozzle 23. This is because the contrast between the inner diameter portion of the nozzle 23 and other portions is increased.
  • the object of the present disclosure is a component P having a spherical dome portion A on the upper surface.
  • the object may be entirely spherical (for example, a solder ball).
  • the part P may have a protrusion shape formed on the upper surface.
  • FIG. 10A after horizontally moving the nozzle 23 so that the inner diameter center C0 of the nozzle 23 coincides with the center of the part P, as shown in FIG.
  • the nozzle 23 sucks the part P. It can also be used as a thing. In this way, as shown in FIG. 10C, it is possible to prevent the component P from being attracted to the nozzle 23 in a tilted state with respect to the nozzle 23.
  • the outer diameter of the nozzle 23 is cylindrical.
  • the nozzle 23 may have an elliptical cylindrical outer diameter.
  • An example of the nozzle lower end image Im1 in this case is shown in FIGS. 11A and 11B.
  • FIG. 11A is a nozzle lower end image Im1 in which the inner diameter center C0 of the nozzle 23 is not shifted from the outer diameter center C1.
  • FIG. 11B is a nozzle lower end image Im1 in which the inner diameter center C0 of the nozzle 23 is shifted from the outer diameter center C1.
  • the outer diameter of the nozzle 23 may be rectangular.
  • the inner shape of the nozzle 23 may be a rectangle or a shape in which a protrusion is provided inside.
  • the information of the nozzle 23 stored in advance in the control device 60 for example, the outer shape, the center of the outer shape, the inner shape, the center of the inner shape, etc.
  • the center of the outer diameter and the center of the inner diameter of the nozzle 23 may be derived by comparing the image of the lower end of the nozzle 23 .
  • the control device 60 controls the exposure time to be longer when capturing an image of the lower end of the nozzle 23 than when capturing an image of the lower surface of the component P attracted to the nozzle 23.
  • the amount of light emitted by the illumination device 50 was controlled to be large.
  • the control device 60 may control so that only one of the exposure time and the light amount is different.
  • the irradiation direction of the light irradiated by the illumination device 50 may be made different depending on when the lower end of the nozzle 23 is imaged and when the lower surface of the component P attracted to the nozzle 23 is imaged. In that case, different light sources may be used when irradiating light.
  • each of the light sources 57a to 57c of the lighting device 50 may include an LED that emits light of a plurality of different colors.
  • the control device 60 changes the LEDs used when emitting light, so that the lower end of the nozzle 23 is imaged and the lower surface of the component P attracted to the nozzle 23 is imaged.
  • the color of the light emitted by the illumination device 50 may be varied.
  • the present invention can be used in a mounting device that places components on a board.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Une machine de montage de la présente divulgation est apte à aspirer un objet cible et à le monter. La machine de montage comprend : une buse qui est formée sous une forme cylindrique et applique une aspiration à l'objet cible au niveau d'une section d'extrémité inférieure ; une tête qui retient la buse ; un dispositif de déplacement de tête qui déplace la tête horizontalement ; une caméra qui peut capturer une image de la section d'extrémité inférieure de la buse ou de l'objet cible aspiré vers la buse ; et un dispositif de commande qui commande la caméra de telle sorte qu'une image de la section d'extrémité inférieure de la buse est capturée, reconnaît une partie de diamètre interne de la buse dans la section d'extrémité inférieure sur la base de l'image pour dériver un centre de diamètre interne de la buse à l'avance, et, lorsqu'une action d'aspiration est effectuée sur l'objet cible, commande le dispositif de déplacement de tête pour aspirer l'objet cible vers la buse de telle sorte que le centre de diamètre interne de la buse correspond à la position d'aspiration de l'objet cible.
PCT/JP2022/025931 2022-06-29 2022-06-29 Machine de montage WO2024004074A1 (fr)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057496A (ja) * 2000-08-07 2002-02-22 Matsushita Electric Ind Co Ltd 電子部品の実装装置および実装方法
JP2014135482A (ja) * 2012-12-11 2014-07-24 Hitachi High-Tech Instruments Co Ltd 部品装着装置
WO2016125285A1 (fr) * 2015-02-05 2016-08-11 富士機械製造株式会社 Buse de fixation par aspiration, dispositif de montage, et procédé de démontage d'élément
JP2017191888A (ja) * 2016-04-14 2017-10-19 富士機械製造株式会社 部品実装機および部品実装ヘッド
WO2020031366A1 (fr) * 2018-08-10 2020-02-13 株式会社Ｆｕｊｉ Dispositif de gestion de machine de montage d'élément
WO2020070858A1 (fr) * 2018-10-04 2020-04-09 株式会社Ｆｕｊｉ Caméra destinée à capturer des images de composant, et machine de montage de composants
WO2021014636A1 (fr) * 2019-07-25 2021-01-28 株式会社Ｆｕｊｉ Dispositif et procédé d'inspection de buse d'adsorption

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057496A (ja) * 2000-08-07 2002-02-22 Matsushita Electric Ind Co Ltd 電子部品の実装装置および実装方法
JP2014135482A (ja) * 2012-12-11 2014-07-24 Hitachi High-Tech Instruments Co Ltd 部品装着装置
WO2016125285A1 (fr) * 2015-02-05 2016-08-11 富士機械製造株式会社 Buse de fixation par aspiration, dispositif de montage, et procédé de démontage d'élément
JP2017191888A (ja) * 2016-04-14 2017-10-19 富士機械製造株式会社 部品実装機および部品実装ヘッド
WO2020031366A1 (fr) * 2018-08-10 2020-02-13 株式会社Ｆｕｊｉ Dispositif de gestion de machine de montage d'élément
WO2020070858A1 (fr) * 2018-10-04 2020-04-09 株式会社Ｆｕｊｉ Caméra destinée à capturer des images de composant, et machine de montage de composants
WO2021014636A1 (fr) * 2019-07-25 2021-01-28 株式会社Ｆｕｊｉ Dispositif et procédé d'inspection de buse d'adsorption

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