WO2024003984A1 - Dispositif d'alimentation en composants - Google Patents

Dispositif d'alimentation en composants Download PDF

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Publication number
WO2024003984A1
WO2024003984A1 PCT/JP2022/025556 JP2022025556W WO2024003984A1 WO 2024003984 A1 WO2024003984 A1 WO 2024003984A1 JP 2022025556 W JP2022025556 W JP 2022025556W WO 2024003984 A1 WO2024003984 A1 WO 2024003984A1
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WIPO (PCT)
Prior art keywords
parts
component
stage
imaging
scattered
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PCT/JP2022/025556
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English (en)
Japanese (ja)
Inventor
昇 内山
章郎 杉原
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株式会社Fuji
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Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/025556 priority Critical patent/WO2024003984A1/fr
Publication of WO2024003984A1 publication Critical patent/WO2024003984A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • the present invention relates to a component supply device that includes a stage on which components are scattered.
  • Some component supply devices include a stage on which components are scattered, as described in the following patent documents.
  • An object of the present invention is to suitably supply parts to a stage where multiple types of parts are scattered.
  • the present specification provides a stage on which multiple types of parts are scattered, a scattering device that scatters parts on the stage, and a scattering device that scatters parts on the stage. and an imaging device that images parts scattered on the stage, and satisfaction for all types of parts among the plurality of types of parts scattered on the stage, based on imaging data obtained by the imaging device imaging the parts scattered on the stage.
  • a parts supply device including a determination device that determines whether or not a component is being supplied.
  • each time the scattering device scatters parts on the stage the parts scattered on the stage are imaged by the imaging device, and based on the imaging data captured by the imaging device, multiple types of parts scattered on the stage are detected. It is determined whether all types of parts are satisfied. This makes it possible to suitably supply parts to the stage.
  • FIG. 2 is a perspective view showing a component mounting device of a component mounting machine.
  • FIG. 1 is a perspective view showing a bulk parts supply system.
  • FIG. 2 is a perspective view showing a bulk parts supply device.
  • FIG. 3 is a transparent view showing the bulk parts supply device.
  • FIG. 2 is a plan view showing the main body of the bulk parts supply system.
  • FIG. 3 is a transparent view showing the bulk parts supply device.
  • It is a perspective view showing a component support device.
  • It is a perspective view showing a component holding head. It is a figure showing a component receiving member in a state where electronic circuit components are housed.
  • FIG. 1 is a perspective view showing a bulk parts supply system.
  • FIG. 2 is a perspective view showing a bulk parts supply device.
  • FIG. 3 is a transparent view showing the bulk parts supply device.
  • FIG. 2 is a plan view showing the main body of the bulk parts supply system.
  • FIG. 2 is a block diagram showing a control device of the component mounting machine.
  • FIG. 2 is a perspective view showing a bulk parts supply device including two parts supply devices.
  • FIG. 7 is a diagram showing holdable components at the time of N-th imaging.
  • FIG. 7 is a diagram showing the occupancy rate of parts, the number of holdable parts, the average value of the number of holdable parts, and supplied parts at the time of N-th imaging. It is a figure which shows the flowchart when a component supply operation
  • FIG. 1 shows a component mounting machine 10.
  • the component mounting machine 10 is a device for mounting components onto the circuit board 12.
  • the component mounting machine 10 includes an apparatus main body 20, a base material conveyance/holding device 22, a component mounting device 24, imaging devices 26, 28, an aligned component supply system 30, a bulk component supply system 32, and a control device (see FIG. 12) 34.
  • the circuit base material 12 include a circuit board, a base material with a three-dimensional structure, and the like
  • examples of the circuit board include a printed wiring board, a printed circuit board, and the like.
  • the device main body 20 is composed of a frame 40 and a beam 42 mounted on the frame 40.
  • the base material conveyance/holding device 22 is disposed at the center of the frame 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52.
  • the transport device 50 is a device that transports the circuit board 12
  • the clamp device 52 is a device that holds the circuit board 12.
  • the base material conveying and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position.
  • the direction in which the circuit board 12 is transported will be referred to as the X direction
  • the horizontal direction perpendicular to that direction will be referred to as the Y direction
  • the vertical direction will be referred to as the Z direction. That is, the width direction of the component mounter 10 is the X direction, and the front and back direction is the Y direction.
  • the component mounting device 24 is disposed on the beam 42 and has two working heads 60 and 62 and a working head moving device 64.
  • Each work head 60, 62 has a suction nozzle (see FIG. 2) 66, and the suction nozzle 66 holds the component.
  • the work head moving device 64 includes an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. Then, the two working heads 60 and 62 are integrally moved to any position on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70. Further, as shown in FIG.
  • each work head 60, 62 is detachably attached to a slider 74, 76, and the Z-direction moving device 72 moves the slider 74, 76 individually in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z direction moving device 72.
  • the imaging device 26 is attached to the slider 74 facing downward, and is moved together with the work head 60 in the X direction, Y direction, and Z direction. Thereby, the imaging device 26 images an arbitrary position on the frame 40. As shown in FIG. 1, the imaging device 28 is disposed facing upward between the substrate conveying and holding device 22 on the frame 40 and the aligned component supply system 30. Thereby, the imaging device 28 images the parts held by the suction nozzles 66 of the working heads 60 and 62.
  • the aligned component supply system 30 is disposed at one end of the frame 40 in the front-rear direction.
  • the aligned component supply system 30 includes a tray-type component supply device 78 and a feeder-type component supply device (not shown).
  • the tray type component supply device 78 is a device that supplies components placed on a tray.
  • the feeder type component supply device is a device that supplies components using a tape feeder (not shown) or a stick feeder (not shown).
  • the bulk parts supply system 32 is disposed at the other end of the frame 40 in the front-rear direction.
  • the bulk parts supply system 32 is a device that aligns a plurality of scattered parts and supplies the parts in an aligned state. In other words, it is an apparatus that aligns a plurality of parts in arbitrary orientations in a predetermined orientation and supplies the parts in a predetermined orientation.
  • the configuration of the bulk parts supply system 32 will be explained in detail.
  • the components supplied by the aligned component supply system 30 and the bulk component supply system 32 include electronic circuit components, solar cell components, power module components, and the like.
  • electronic circuit components include components with leads, components without leads, and the like.
  • the bulk parts supply system 32 includes a main body 80, a bulk parts supply device 82, a two-dimensional imaging device 84, and a parts delivery device 86.
  • the bulk parts supply device 82 includes a parts supply device 88, a frame 89, a parts support device (see FIG. 4) 90, and a parts return device (see FIG. 4) 92. 90 and a parts return device 92 are integrally constructed.
  • the bulk parts supply device 82 is detachably assembled to the main body 80.
  • the parts supply device 88 has a generally rectangular parallelepiped box shape, and is arranged to extend in the Y direction, as shown in FIGS. 4 and 5. Note that the Y direction is described as the front-rear direction of the parts supply device 88, and the direction toward the side where the parts return device 92 is disposed in the bulk parts supply device 82 is described as the front direction, and the direction toward the side where the parts supply device 88 is disposed is described as the front direction. The direction toward the side where the device is installed is described as backward.
  • the parts replenishing device 88 is open at the top and the front, the opening at the top is a component input port 97, and the front opening is a component discharge port 98.
  • an inclined plate 104 is disposed below the input port 97 .
  • the inclined plate 104 is arranged so as to be inclined downward from the rear end surface of the parts supply device 88 toward the center.
  • a conveyor device 106 is provided on the front side of the inclined plate 104.
  • the conveyor device 106 is disposed so as to be inclined upward from the front end of the inclined plate 104 toward the front of the component supply device 88.
  • the conveyor belt 112 of the conveyor device 106 is rotated counterclockwise in FIG. 5 by driving of an electromagnetic motor (see FIG. 12) 116. That is, the conveyance direction by the conveyor device 106 is diagonally upward from the front end of the inclined plate 104 toward the front.
  • an inclined plate 126 is provided below the front end of the conveyor device 106.
  • the inclined plate 126 is disposed from the front end surface of the component replenishing device 88 toward the bottom of the conveyor device 106, and the rear end thereof is inclined diagonally downward.
  • an inclined plate 128 is provided below the inclined plate 126 as well. The inclined plate 128 is inclined from below the central portion of the conveyor device 106 toward the discharge port 98 of the component supply device 88 so that the front end thereof is located downward.
  • the frame 89 is composed of a pair of side frames 130 and a connecting frame 132.
  • the pair of side frames 130 are erected so as to face each other, parallel to each other, and extending in the Y direction.
  • a connecting frame 132 spans the lower ends of the pair of side frames 130, and the pair of side frames 130 are connected by the connecting frame 132.
  • the distance between the pair of side frames 130 is made slightly larger than the dimension in the width direction of the component supply device 88, and the component supply device 88 is positioned between the pair of side frames 130. can be attached and detached with one touch. Note that "one-touch attachment/detachment" means that the attachment/detachment can be reproducibly performed without the operator using any tools or the like.
  • each slot 140 is formed to extend in the Y direction, and the five slots 140 are arranged adjacent to each other in the X direction at the same pitch.
  • the five slots 140 have the same shape.
  • the dimension of each slot 140 in the X direction that is, the width dimension, is smaller than the dimension of the frame 89 of the bulk parts supply device 82 in the width direction.
  • the dimension in the Y direction of each slot 140 that is, the length dimension, is slightly larger than the length dimension of the frame 89 of the bulk parts supply device 82.
  • a frame 89 of the bulk parts supply device 82 is bolted to each slot 140.
  • the bulk parts supply device 82 can be attached and detached by an operator using a tool using each slot 140 of the main body 80 while being positioned in the mounting area 141 corresponding to each slot. ing.
  • the component support device 90 includes a component support member 150 and a component support member moving device 152, as shown in FIGS. 4 and 5.
  • the component support member 150 includes a stage 156 and a pair of side walls 158.
  • the stage 156 has a generally elongated plate shape and is arranged so as to extend forward from below the component supply device 88 mounted between the pair of side frames 130.
  • the width of the stage 156 is approximately the same as the width between the pair of side frames 130, that is, the width of the frame 89, and the rear end of the stage 156 is the same as the width between the pair of side frames 130. It is located in between.
  • the upper surface of the stage 156 is generally horizontal, and as shown in FIG.
  • the stage 156 is disposed with a slight clearance at its rear end from the front end of the inclined plate 128 of the component supply device 88. Further, as shown in FIG. 4, the pair of side walls 158 are fixed in an erected state on both sides of the stage 156 in the longitudinal direction, and the upper ends of each side wall 158 are lower than the top surface of the stage 156. It extends upward.
  • the component support member moving device 152 slides the component support member 150 in the Y direction by operating an air cylinder (see FIG. 12) 166. At this time, the component support member 150 moves between a stored state in which it is stored below the component supply device 88 (see FIG. 7) and an exposed state in which it is exposed from below the component supply device 88 (see FIG. 5). .
  • the parts return device 92 includes a parts storage container 180 and a container rocking device 181.
  • the component storage container 180 is generally box-shaped and has an arcuate bottom surface. Note that the width of the component storage container 180 is approximately the same as the width of the stage 156.
  • the component storage container 180 is swingably held at the front end of the stage 156, and swings by the operation of the container swinging device 181. At this time, the component storage container 180 swings between a storage position with the opening facing upward (see FIG. 8) and a returned position with the opening facing the top surface of the stage 156 of the component support member 150 (see FIG. 9). do.
  • the two-dimensional imaging device 84 includes a camera 290 and a camera moving device 292, as shown in FIG.
  • Camera moving device 292 includes a guide rail 296 and a slider 298.
  • the guide rail 296 is fixed to the main body 80 above the parts supply device 88 so as to extend in the width direction (X direction) of the bulk parts supply system.
  • the slider 298 is slidably attached to the guide rail 296, and is slid to any position by the operation of an electromagnetic motor (see FIG. 12) 299. Further, the camera 290 is attached to the slider 298 in a state facing downward.
  • the component delivery device 86 includes a component holding head moving device 300, a component holding head 302, and two shuttle devices 304.
  • the component holding head moving device 300 includes an X-direction moving device 310, a Y-direction moving device 312, and a Z-direction moving device 314.
  • the Y direction moving device 312 has a Y slider 316 disposed above the bulk parts supply device 82 so as to extend in the X direction, and the Y slider 316 drives an electromagnetic motor (see FIG. 12) 319. to move to an arbitrary position in the Y direction.
  • the X-direction moving device 310 has an X-slider 320 disposed on the side surface of the Y-slider 316, and the X-slider 320 can be moved to any position in the X-direction by driving an electromagnetic motor (see FIG. 12) 321.
  • the Z direction moving device 314 has a Z slider 322 disposed on the side surface of the X slider 320, and the Z slider 322 can be moved to any position in the Z direction by driving an electromagnetic motor (see FIG. 12) 323. Moving.
  • the component holding head 302 includes a head main body 330, a suction nozzle 332, a nozzle rotation device 334, and a nozzle rotation device 335.
  • the head main body 330 is integrally formed with the Z slider 322.
  • the suction nozzle 332 holds the component and is detachably attached to the lower end of the holder 340.
  • the holder 340 is bendable at the support shaft 344, and the holder 340 is bent 90 degrees upward by the operation of the nozzle turning device 334. As a result, the suction nozzle 332 attached to the lower end of the holder 340 rotates 90 degrees and is located at the rotating position.
  • the suction nozzle 332 rotates between the non-swivel position and the swiveling position by the operation of the nozzle swiveling device 334.
  • the nozzle rotation device 335 rotates the suction nozzle 332 around its axis.
  • Each of the two shuttle devices 304 includes a component carrier 388 and a component carrier moving device 390, as shown in FIG. Fixed.
  • Five component receiving members 392 are attached to the component carrier 388 in a row in a horizontal direction, and a component is placed on each component receiving member 392.
  • the bulk parts supply system 32 can supply various parts, and various parts receiving members 392 are prepared depending on the shape of the parts.
  • a component receiving member 392 corresponding to a lead component 410 having a lead will be described.
  • the lead component 410 includes a block-shaped component body 412 and two leads 414 protruding from the bottom surface of the component body 412.
  • a component receiving recess 416 having a shape corresponding to the lead component 410 is formed in the component receiving member 392.
  • the component receiving recess 416 is a stepped recess, and is composed of a main body receiving recess 418 that opens on the top surface of the component receiving member 392, and a lead receiving recess 420 that opens on the bottom surface of the main body receiving recess 418.
  • the lead component 410 is inserted into the component receiving recess 416 with the lead 414 facing downward.
  • the lead component 410 is placed inside the component receiving recess 416 with the lead 414 inserted into the lead receiving recess 420 and the component body 412 being inserted into the main body receiving recess 418 .
  • the component carrier moving device 390 is a plate-shaped longitudinal member, and is disposed on the front side of the bulk component supply device 82 so as to extend in the front-rear direction.
  • a component carrier 388 is disposed on the upper surface of the component carrier moving device 390 so as to be slidable in the front-back direction, and is slid to any position in the front-back direction by driving an electromagnetic motor (see FIG. 12) 430. Note that when the component carrier 388 slides in the direction approaching the bulk component supply device 82, it slides to a component receiving position located within the movement range of the component holding head 302 by the component holding head moving device 300. On the other hand, when the component carrier 388 slides away from the bulk component supply device 82, it slides to a component supply position located within the range of movement of the work heads 60, 62 by the work head moving device 64.
  • the control device 34 includes a general control device 450, a plurality of individual control devices (only one is shown in the figure) 452, and an image processing device 454.
  • the overall control device 450 is mainly composed of a computer, and is connected to the substrate conveyance and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the aligned component supply system 30, and the bulk component supply system 32. has been done. Thereby, the overall control device 450 centrally controls the base material transport and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the aligned component supply system 30, and the bulk component supply system 32.
  • the plurality of individual control devices 452 are mainly configured with a computer, and include a base material conveyance and holding device 22, a component mounting device 24, an imaging device 26, an imaging device 28, an aligned component supply system 30, and a bulk component supply system 32. (In the figure, only the individual control device 452 corresponding to the bulk parts supply system 32 is shown).
  • the individual control device 452 of the bulk parts supply system 32 is connected to the component supply device 88, the component support device 90, the component return device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. ing.
  • the individual control devices 452 of the bulk parts supply system 32 include the component supply device 88, the component support device 90, the component return device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. control.
  • the image processing device 454 is connected to the two-dimensional imaging device 84 and processes imaged data captured by the two-dimensional imaging device 84.
  • the image processing device 454 is connected to the individual control device 452 of the bulk parts supply system 32. Thereby, the individual control device 452 of the bulk parts supply system 32 acquires the imaging data captured by the two-dimensional imaging device 84.
  • the component mounting machine 10 performs a work of mounting components onto the circuit substrate 12 held by the substrate conveying and holding device 22. Specifically, the circuit base material 12 is transported to a working position by the base material transport and holding device 22, and is fixedly held at that position by the clamp device 52. Next, the imaging device 26 moves above the fixedly held circuit board 12 and images the circuit board 12. Thereby, information regarding the error in the holding position of the circuit board 12 can be obtained. Further, the aligned parts supply system 30 or the bulk parts supply system 32 supplies parts at a predetermined supply position. Note that the supply of parts by the bulk parts supply system 32 will be explained in detail later.
  • one of the work heads 60 and 62 moves above the part supply position and holds the part by the suction nozzle 66. Subsequently, the work heads 60 and 62 holding the component move above the imaging device 28, and the component held by the suction nozzle 66 is imaged by the imaging device 28. This provides information regarding the error in the holding position of the component. Then, the work heads 60 and 62 holding the components move above the circuit board 12 and correct the errors in the holding position of the circuit board 12, the errors in the holding positions of the parts, etc. , mounted on the circuit board 12.
  • lead parts 410 are inputted by an operator through the input port 97 of the parts supply device 88, and the input lead parts 410 are processed by the operation of the bulk parts supply device 82 and the parts delivery device 86. It is supplied while being placed on the component receiving member 392 of the component carrier 388.
  • the operator inputs the lead component 410 from the input port 97 on the top surface of the component supply device 88.
  • the component support member 150 is moved below the component supply device 88 by the operation of the component support member moving device 152, and is in a so-called stored state (see FIG. 7).
  • the component storage container 180 disposed at the front end of the component support member 150 is located in front of the component supply device 88, and the component storage container 180 is located in front of the component supply device 88. This is a posture with the opening 180 facing upward (accommodating posture).
  • the lead component 410 input from the input port 97 of the component supply device 88 falls onto the inclined plate 104 of the component supply device 88 and rolls down to the lower end of the inclined plate 104 on the front side. At this time, the lead components 410 that have rolled down to the lower end of the front side of the inclined plate 104 are piled up between the lower end of the front side of the inclined plate 104 and the lower end of the rear side of the conveyor device 106. Then, when the conveyor device 106 is operated, the conveyor belt 112 of the conveyor device 106 rotates counterclockwise in FIG. 7 . At this time, the lead parts 410 piled up between the inclined plate 104 and the conveyor belt 112 are conveyed diagonally upward by the conveyor belt 112.
  • the lead component 410 conveyed by the conveyor belt 112 falls onto the inclined plate 126 from the upper end of the front side of the conveyor device 106.
  • the lead component 410 that has fallen onto the inclined plate 126 rolls backward on the inclined plate 126 and falls onto the inclined plate 128.
  • the lead component 410 that has fallen onto the inclined plate 128 rolls down toward the front and is discharged from the discharge port 98 on the front side of the component supply device 88.
  • the lead components 410 discharged from the discharge port 98 of the component supply device 88 are accommodated inside the component storage container 180. Then, when a predetermined amount of lead components 410 are discharged from the component supply device 88, that is, when the conveyor device 106 operates a certain amount, the conveyor device 106 stops. Next, the component support member 150 is moved forward from the stored state by the operation of the component support member moving device 152.
  • the container swing device 181 of the component return device 92 is activated, and the component storage container 180 swings.
  • the attitude of the component storage container 180 changes rapidly from an attitude with the opening facing upward (accommodating attitude) to an attitude with the opening facing the stage 156 (returning attitude).
  • the lead component 410 housed in the component storage container 180 is vigorously ejected toward the stage 156.
  • the lead components 410 are scattered from the component storage container 180 onto the stage 156.
  • the scattering of the lead components 410 is a concept that includes a state in which the lead components 410 are scattered in an overlapping state and a state in which the lead components 410 are scattered in a separate state without overlapping.
  • the camera 290 of the two-dimensional imaging device 84 moves the camera 290 onto the component support member by the operation of the camera moving device 292. 150 and image the lead component 410. Thereby, two-dimensional imaging data of each of the plurality of lead components 410 scattered on the upper surface of the component support member 150 is obtained. Then, information such as the position on the component support member 150 and the posture of the lead component 410 is calculated for the plurality of lead components 410 scattered on the upper surface of the component support member 150 based on the two-dimensional imaging data. .
  • holdable parts parts that can be held by the suction nozzle 332 (hereinafter referred to as “holdable parts”) are identified by pattern matching, and the position, orientation, etc. of the holdable parts on the component support member 150 are determined. Information is calculated. Note that since pattern matching is an existing technology, a detailed explanation of pattern matching will be omitted.
  • the component holding head 302 is moved above the lead component by the operation of the component holding head moving device 300, and the lead component is sucked and held by the suction nozzle 332. be done. Note that when the lead component is suctioned and held by the suction nozzle 332, the suction nozzle 332 is located at a non-rotating position.
  • the component holding head 302 moves above the component carrier 388.
  • the component carrier 388 is moved to the component receiving position by the operation of the component carrier moving device 390.
  • the suction nozzle 332 is rotated to the rotation position. Note that the suction nozzle 332 is rotated by the operation of the nozzle rotation device 335 so that the lead 414 of the lead component 410 held by the suction nozzle 332 in the rotating position is directed downward in the vertical direction.
  • the lead component 410 with the lead 414 facing vertically downward is inserted into the component receiving recess 416 of the component receiving member 392. Thereby, the lead component 410 is placed on the component receiving member 392 with the lead 414 facing downward in the vertical direction, as shown in FIG.
  • the component carrier 388 is moved to the component supply position by the operation of the component carrier moving device 390. Since the component carrier 388 that has moved to the component supply position is located within the movement range of the work heads 60 and 62, the lead component 410 is supplied to the component mounter 10 at this position in the bulk component supply system 32. In this way, in the bulk component supply system 32, the lead components 410 are supplied to the component receiving member 392 with the leads 414 facing downward and the top surface opposite the bottom surface to which the leads 414 are connected facing upward. Ru. Therefore, the suction nozzles 66 of the working heads 60 and 62 can appropriately hold the lead component 410.
  • the holdable parts when the holdable parts are scattered on the stage 156 of the component support member 150, holding of the scattered holdable parts is repeated, and the held holdable parts are It is placed on the component receiving member 392. Then, the component carrier 388 to which the component receiving member 392 is attached moves to the component supply position, whereby the lead component 410 is supplied.
  • the lead component 410 cannot be held from the stage 156. In other words, all the lead components 410 that were determined to be able to be held by the suction nozzle 332 were retained, and the lead components 410 that were determined to be unable to be held by the suction nozzle 332 or those that were determined to be unrecognizable. If lead component 410 remains on stage 156, lead component 410 cannot be held from stage 156.
  • the bulk parts supply system 32 performs a part return operation. That is, the lead component 410 remaining on the stage 156 is collected into the component storage container 180. Then, the lead components 410 collected in the component storage container 180 are scattered on the stage 156 again, and the posture of the lead components 410 is changed, so that the holding of the lead components 410 from the stage 156 is resumed. Ru.
  • the component support member 150 is moved downward of the component supply device 88 by the operation of the component support member moving device 152. That is, the component support member 150 moves from the exposed state (see FIG. 5) toward the retracted state (see FIG. 6). At this time, the component storage container 180 disposed at the front end of the component support member 150 is in a posture with its opening facing upward (recovery posture).
  • the lead component 410 on the stage 156 of the component support member 150 is dammed by the front end of the inclined plate 128 of the component supply device 88. It can be stopped.
  • the lead component 410 on the stage 156 is scraped into the component storage container 180.
  • the lead component 410 on the stage 156 is collected into the component storage container 180.
  • the collected lead components 410 are scattered on the stage 156.
  • the component support member 150 is in the stored state, as shown in FIG. Therefore, the component support member 150 is moved forward from the stored state by the operation of the component support member moving device 152. Then, at the timing when the component support member 150 moves forward by a predetermined amount from the stored state, the container rocking device 181 of the component return device 92 is activated, and the component storage container 180 is rocked. As a result, the attitude of the component storage container 180 changes rapidly from an attitude with the opening facing upward (accommodating attitude) to an attitude with the opening facing the stage 156 (returning attitude).
  • the lead component 410 housed in the component storage container 180 is vigorously ejected toward the stage 156.
  • the lead components 410 are scattered from the component storage container 180 onto the stage 156. That is, the lead components 410 collected in the component storage container 180 are supplied to the stage 156.
  • the attitude of the lead component 410 on the stage is changed, and the lead component 410 is held from above the stage 156 again.
  • the number of lead components scattered on the stage 156 decreases due to the return operation.
  • the number of components that can be held by the suction nozzle 332 from above the stage 156 also decreases, so lead components are supplied from the component supply device 88. A supply operation is performed to do so.
  • the camera 290 of the two-dimensional imaging device 84 moves the stage of the component support member 150 in order to calculate the position, orientation, etc. of the holdable component. 156.
  • Lead components scattered on top of 156 are imaged.
  • the position, orientation, etc. of the holdable component on the stage are calculated, and at this time, the occupancy rate of the component on the stage is also calculated.
  • the occupancy rate of a component is the ratio of the area occupied by the component to the area of the top surface of the stage 156, and the area of the top surface of the stage 156 is stored in the individual control device 452.
  • the individual control device 452 calculates the area of the parts scattered on the stage 156 based on the two-dimensional image data captured by the camera. Then, the individual control device 452 calculates the occupancy rate of the component.
  • the calculated component occupancy rate exceeds 15%, it is determined that the number of lead components scattered on the stage 156 is not small, and the components on the stage 156 are retained. be done. On the other hand, when the calculated component occupancy rate is 15% or less, it is determined that the number of lead components scattered on the stage 156 is small, and the lead components are supplied from the component supply device 88 to the stage. Ru.
  • the lead component 410 on the stage 156 is collected into the component storage container 180, similarly to the return operation. That is, the component support member 150 moves below the component supply device 88, that is, toward the stored state, by the operation of the component support member moving device 152, so that the lead component 410 on the stage 156 is moved to the component supply device 88. It is blocked by the inclined plate 128 and collected into the parts storage container 180.
  • the conveyor device 106 is operated, so that the lead component 410 housed in the component supply device 88 is conveyed by the conveyor belt 112 and discharged from the component supply device 88 .
  • the lead components 410 discharged from the component supply device 88 are accommodated in the component storage container 180. That is, the parts storage container 180 stores the parts collected from above the stage 156 and the parts newly supplied from the parts supply device 88. Then, when a predetermined amount of lead components 410 are discharged from the component supply device 88, the conveyor device 106 stops and the component support member 150 moves forward from the stored state. Then, at the timing when the component support member 150 moves forward from the stored state to the exposed state by a predetermined amount, the container swing device 181 of the component return device 92 is activated, and the component storage container 180 swings. At this time, the lead component 410 accommodated in the component storage container 180 is vigorously ejected toward the stage 156.
  • the lead components 410 are scattered from the component storage container 180 onto the stage 156. That is, in the supply operation, parts collected from above the stage 156 and parts newly supplied from the parts supply device 88 are scattered on the stage 156. In this way, parts newly supplied from the parts supply device 88 are scattered on the stage 156, so that the bulk parts supply device 82 can continuously supply parts.
  • the bulk parts supply system 32 in the bulk parts supply system 32, as shown in FIG. Alternatively, it can also be installed in the slot 140 of the main body 80.
  • the bulk parts supply device 500 includes a frame 504, a component support device 506, and a component return device 508.
  • the bulk parts supplying apparatus 500 is approximately the same as the bulk parts supplying apparatus, except that it is wider than the bulk parts supplying apparatus and is equipped with two parts supplying apparatuses 88, so the description will be simplified. explain.
  • the width dimension of the frame 504 is twice that of the frame 89 of the bulk parts supply device 82, and like the frame 89, it is composed of a pair of side frames 520 and a connecting frame 522.
  • the pair of side frames 520 have approximately the same shape as the pair of side frames 130 of the bulk parts supply device 82, and the widthwise dimension of the connecting frame 522 is equal to the width direction of the connecting frame 132 of the bulk parts supplying device 82. It is twice the size.
  • the two component supply devices 88 are removably mounted between the pair of side frames 520 in a state where they are lined up in the width direction.
  • the frame 504 which is twice the widthwise dimension of the frame 89 of the bulk parts supply device 82, fits into two adjacent slots 140 of the five slots 140 formed in the main body 80 of the bulk parts supply system 32. , to be installed.
  • the component support device 506 also includes a component support member 530 and a component support member moving device 532. and a side wall portion 538.
  • the dimension of the stage 536 in the width direction is twice that of the stage 156 of the bulk parts supply device 82, and a pair of side walls 538 are provided upright on both edges of the stage 536 in the width direction. Then, the component support member 530 slides in the front-back direction by the operation of the component support member moving device 532.
  • the parts return device 508 also includes a component storage container 540 and a container rocking device 542.
  • the dimension in the width direction of the component storage container 540 is twice that of the component storage container 180 of the bulk component supply device 82, and is swingably disposed at the front end of the stage 536. Then, by the operation of the container rocking device 542, the component storage container 540 is moved between a posture with the opening of the component storage container 540 facing upward (accommodation posture) and a posture with the opening of the component storage container 540 facing the stage 536 (returning posture). ).
  • the bulk parts supply device 500 with such a structure installed in the bulk parts supply system 32 can supply two types of parts. That is, for example, if one of the two component supply devices 88a stores the A component and the other component supply device 88b stores the B component, the component supply device 88a Component A is discharged from the component replenishing device 88b, and component B is discharged from the component supply device 88b, so that the A component and the B component are scattered on the stage 536. Subsequently, the parts scattered on the stage 536 are imaged by the two-dimensional imaging device 84, and based on the imaged data, the holdable parts among the scattered parts A and B are identified.
  • the holdable parts among the A parts and B parts scattered from above the stage 536 are held by the suction nozzle 332. That is, the bulk parts supply device 500 supplies A parts and B parts. Further, when the suction nozzle 332 holds holdable parts from above the stage 536 and there are no holdable parts on the stage 536, the return operation of the scattered parts is performed in the same manner as the bulk parts supply device 82. be exposed. Further, when the number of parts scattered on the stage 536 decreases, the parts are supplied from the parts supply device 88. However, in the bulk parts supply device 500, parts A are supplied from the parts supply device 88a and parts B are supplied from the parts supply device 88b, so two types of parts A and B are scattered on the stage.
  • the parts supply device 88 It is determined whether or not the parts are satisfied. If it is determined that all types of parts are satisfied, the parts are not supplied from the parts supply device 88, and if it is determined that any of all types of parts is not satisfied, the parts are not supplied. , parts of the type determined to be unsatisfied are supplied from the parts supply device 88. Note that the types of parts that are determined to be sufficient include those in which the suction nozzle 332 that performs the part holding work has parts that can be held without idle time or standby time, or the work plan for assembly or installation. There are parts that do not cause any delays.
  • parts A and B are scattered on the stage 536.
  • a component supply operation is performed. That is, in the parts supply operation, the conveyor device 106 of the parts supply device 88a is operated to discharge parts A from the parts supply device 88a, and the conveyor device 106 of the parts supply device 88b is operated to supply parts B. By being ejected from the device 88b, the A parts and the B parts are scattered on the stage 536. At this time, the component supply operation is repeatedly performed until the component occupancy exceeds 15%.
  • the individual control device 452 calculates the occupancy rate of the component based on the imaging data of the two-dimensional imaging device 84. At this time, if the calculated occupancy rate of the parts is 15% or less, the operation of supplying parts A and B is performed again. Then, the operation of supplying parts A and B is repeated until the occupancy rate of the parts exceeds 15%.
  • the component holding head carries out the work of holding the component with the suction nozzle.
  • the individual control device 452 specifies the holdable parts A part and B part based on the image data taken by the two-dimensional imaging device 84 in order to calculate the occupancy rate of the parts.
  • the imaging when the occupancy rate of the component exceeds 15% in the imaging data captured by the two-dimensional imaging device 84 is handled as the first imaging. For example, assume that the occupancy rate of parts at the time of the first imaging is 50%.
  • the individual control device 452 specifies the holdable parts for each of the A part and the B part based on the imaging data obtained during the first imaging
  • the individual control device 452 calculates the number of the specified holdable parts for each type of part, in a scattered manner. It is stored together with the number of times the part was imaged. For example, as shown in FIG. 14, when the scattered parts are imaged for the first time, it is specified that the number of parts that can be held for part A is two, and that the number of parts that can be held for part B is three. .
  • the individual control device 452 then stores the identified numbers, as shown in FIG. Note that in FIG.
  • the individual control device 452 determines the holdable parts based on the number of holdable parts for each specified part type (hereinafter referred to as the number of holdable parts).
  • the average value of the number of parts is calculated for each type of part. Note that the average value of the number of parts that can be held is the average value of the number of parts that can be held that is specified based on the imaging data of the last five images of scattered parts. Therefore, at the time of the first imaging, the number of parts that can be held for each type of component specified at the time of the first imaging becomes the average value of the number of parts that can be held at the time of the first imaging.
  • the average value of the number of parts that can be held for parts A at the time of the first imaging is 2.0, and the average value of the number of parts that can be held for parts B is 3.0. Then, since the component occupancy rate at the time of the first imaging is 50%, which exceeds 15%, it is determined that the A and B components are sufficient, and the component supply operation is executed.
  • the retainable parts on the stage are held by the suction nozzle 332.
  • the holdable component identified during the first imaging is held by the suction nozzle 332, a return operation is executed. That is, the parts remaining on the stage 536 are collected into the parts storage container 540, and the collected parts are scattered on the stage 536 again.
  • the two-dimensional imaging device 84 performs a second imaging of the parts scattered on the stage 536 again.
  • the individual control device 452 calculates the occupancy rate of the parts based on the second imaging data, and specifies the holdable parts for each type of parts. At this time, for example, since the occupancy rate of the parts at the time of the second imaging was 50%, as shown in FIG. It is specified that there are two holdable parts.
  • the individual control device 452 then stores the identified numbers, as shown in FIG.
  • the parts remaining on the stage 536 are collected into the parts storage container 540 and placed on the stage 536 again.
  • a return operation of the scattered parts is performed.
  • the two-dimensional imaging device 84 performs a third imaging of the parts scattered on the stage 536 again.
  • the individual control device 452 calculates the occupancy rate of the parts based on the third imaging data, and specifies the holdable parts for each type of parts. At this time, for example, since the component occupancy rate at the time of the third imaging was 10%, as shown in FIG. 14, the retainable components of component A are not specified, and the retainable components of component B It is specified that there is one.
  • the component occupancy rate at the time of the third imaging is 10% and is less than 15%, it is determined that there are not enough components, and the component supply operation is executed.
  • the average value of the number of parts that can be held for parts A and B is less than 1, it is determined that there are not enough parts A and B.
  • the average value of the number of parts that can be held for parts A and B is the same, and there are no parts that can be held for parts A and B, it is determined that there are not enough parts A and B.
  • the part with the smaller average value of the number of parts that can be held among parts A and parts B is not sufficient.
  • the average value of the number of parts that can be held for parts A at the time of the third imaging is 1.7, and the average value of the number of parts that can be held for parts B is 2.0. Therefore, based on the imaging data obtained during the third imaging, it is determined that the A parts are not sufficient, and the supply operation of the A parts is executed.
  • the two-dimensional imaging device 84 performs a fourth imaging of the components scattered on the stage 536. Then, the individual control device 452 calculates the occupancy rate of the parts based on the fourth imaging data, and specifies the holdable parts for each type of parts. For example, the occupancy rate of parts at the time of the fourth imaging is 15%, and as shown in FIG. If not, the individual controller 452 stores those identified numbers, as shown in FIG. Further, the individual control device 452 calculates the average value of the number of parts that can be held at the time of the fourth imaging for each type of part.
  • the average value of the number of parts that can be held for parts A at the time of the fourth imaging is 1.8, and the average value of the number of parts that can be held for parts B is 1.5. Therefore, based on the imaging data obtained during the fourth imaging, it is determined that the B components are not sufficient, and the B component supply operation is executed.
  • the two-dimensional imaging device 84 performs a fifth imaging of the components scattered on the stage 536. Then, the individual control device 452 calculates the occupancy rate of the parts based on the fifth imaging data, and specifies the holdable parts for each type of parts. For example, the occupancy rate of the parts at the time of the fifth image capture is 35%, and as shown in FIG. If it is specified that the number is 1, the individual control device 452 stores the specified number, as shown in FIG. Further, the individual control device 452 calculates the average value of the number of parts that can be held at the time of the fifth imaging for each type of part.
  • the parts remaining on the stage 536 are collected into the parts storage container 540 and placed on the stage 536 again.
  • a return operation of the scattered parts is performed.
  • the two-dimensional imaging device 84 performs a sixth imaging of the parts scattered on the stage 536 again.
  • the individual control device 452 calculates the occupancy rate of the parts based on the fifth imaging data, and specifies the holdable parts for each type of parts. At this time, for example, since the component occupancy rate at the time of the sixth imaging was 5%, as shown in FIG. Not specified. The individual control device 452 then stores these information as shown in FIG.
  • the component occupancy rate at the time of the sixth imaging is 5%, which is less than 15%, it is determined that there are not enough components, and the component supply operation is executed.
  • the average value of the number of parts that can be held for parts A at the time of the sixth imaging is 1.2, and the average value of the number of parts that can be held for parts B is also 1.2. In other words, the average value of the number of parts that can be held for parts A and the average value of the number of parts that can be held for parts B are the same.
  • there is no part A that can be held and there is no part that can hold part B. Therefore, based on the imaging data obtained during the sixth imaging, it is determined that the A and B parts are not sufficient, and the operation for supplying the A and B parts is executed.
  • the two-dimensional imaging device 84 performs the seventh imaging of the parts scattered on the stage 536. Then, the individual control device 452 calculates the occupancy rate of the parts based on the seventh imaging data, and specifies the holdable parts for each type of parts. For example, the occupancy rate of the parts at the time of the seventh imaging is 15%, and as shown in FIG. If it is specified that the number is 1, the individual control device 452 stores the specified number, as shown in FIG. Further, the individual control device 452 calculates the average value of the number of parts that can be held at the time of the seventh imaging for each type of part.
  • the average value of the number of parts that can be held for parts A at the seventh time of imaging is 0.8, and the average value of the number of parts that can be held for parts B is also 1.0. In other words, the average value of the number of parts that can be held for parts A and B is all 1 or less. Therefore, based on the imaging data obtained during the seventh imaging, it is determined that the A and B parts are not sufficient, and the supply operation of the A and B parts is executed.
  • each time parts are scattered on the stage it is determined whether there are enough parts on the stage based on the imaging data obtained by imaging the scattered parts on the stage with the two-dimensional imaging device 84. By determining whether this is the case, it becomes possible to suitably supply the parts to the stage. Furthermore, based on the imaging data obtained by imaging with the two-dimensional imaging device 84, it is first determined whether the area occupation rate of the scattered parts with respect to the area of the stage is 15% or less. If it is determined that the occupancy rate of parts is 15% or less, the parts are sufficient for each type of parts based on the average number of parts that can be held for each type of parts scattered on the stage. It is possible to judge whether or not there is a sufficient number of parts, and to supply only the types of parts that are not satisfied to the stage. Thereby, parts can be more suitably supplied to the stage.
  • the operation of supplying the A component and the B component and the imaging of the stage after the components are supplied are repeated.
  • the occupancy rate of the component exceeds 15% (S16: NO)
  • the part that can be held is held by the suction nozzle 332 (S20). Then, when the suction nozzle holds all the parts that can be held on the stage, a return operation is executed (S22).
  • the suction nozzle does not hold the parts and collects the parts scattered on the stage.
  • a scattered return operation is performed again (S22).
  • the two-dimensional imaging device 84 images the parts scattered on the stage after the return operation has been performed (S24).
  • the occupancy rate of the component is 15% or less based on the image data captured by the two-dimensional imaging device 84 (S26). At this time, if the occupancy rate of the parts exceeds 15% (S26: NO), the holding work of the holdable parts is performed by the suction nozzle (S18, S19), and the processes from S22 onwards are performed. . On the other hand, if the occupancy rate of the parts is 15% or less (S26: YES), it is determined whether the average number of parts that can be held for each of A parts and B parts is all 1 or less. (S28).
  • step S34 an operation is performed to supply the component A or B, which has a smaller average number of parts that can be held (S34).
  • the two-dimensional imaging device 84 is an example of an imaging device.
  • the parts supply device 88 is an example of a supply machine.
  • the individual control device 452 is an example of a determination device.
  • the bulk parts supply device 500 is an example of a parts supply device.
  • the parts return device 508 is an example of a scattering device.
  • Stage 536 is an example of a stage.
  • the present invention is not limited to the above embodiments, but can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, it is determined whether or not there are enough parts for each type of parts based on the average number of parts that can be held for each type of parts. It may be determined whether or not there are enough parts for each type of parts based on the number of parts that can be held for each type. That is, it may be determined whether or not there are enough parts for each type of parts based on at least one of the number of parts that can be held for each type of parts and the average value of the number of parts that can be held. Furthermore, it may be determined whether or not there are sufficient parts for each type of parts based on the amount, ratio, etc. of parts that can be held for each type of parts.
  • a component supply device 88 is prepared for each type of component, and the same type of component is supplied from each of the plurality of component supply devices 88.
  • a single component supply device 88 may accommodate a plurality of types of components, and the single component supply device 88 may supply the plurality of types of components to the stage.
  • the parts return device 508 scatters the parts on the stage
  • the parts supply device 88 may scatter the parts on the stage. That is, in the embodiment described above, the parts supply device 88 supplies parts to the parts storage container 540 of the parts return device 508, and the parts storage container 540 containing the parts is scattered on the stage.
  • the parts supply device 88 may directly scatter the parts on the stage. That is, for example, the component supply device 88 may directly scatter the components on the stage by discharging the components while moving the stage from the stored state to the exposed state. In such a case, the parts supply device 88 functions as a scattering device.
  • the stage 536 is used as a member on which parts are scattered, but various members can be used as long as they have a shape that allows parts to be scattered.
  • a tray, a carrier, etc. can be used as a stage, or the upper surface of a conveyor belt can also function as a stage.
  • two parts supply devices 88 are arranged in one bulk parts supply device 500, but three or more parts supply devices 88 are arranged in one bulk parts supply device. You may. If different types of components are stored in each of the three or more component supply devices 88, three or more types of components can be supplied from one bulk component supply device 500.
  • the bulk parts supply device 500 that can supply three or more types of parts, if the occupancy rate of the parts scattered on the stage is 15% or less, the retainable parts among the three or more types of parts It is possible to supply the type of parts for which the average number of parts is the smallest, or to supply only the types of parts for which the average value of the number of holdable parts calculated for each of three or more types of parts is less than a predetermined threshold value. Good too.
  • the present invention is applied to the lead components 410, A component, and B component, but the present invention may be applied to various types of components. Specifically, the present invention can be applied to, for example, components of solar cells, components of power modules, electronic circuit components without leads, small chip-type electronic components, and the like.
  • Imaging device Two-dimensional imaging device (imaging device) 88: Parts supply device (supply machine) 452: Individual control device (judgment device) 500: Bulk parts supply device (components supply device) 508: Parts return device (scattering device) 536: stage

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Abstract

L'invention concerne un dispositif d'alimentation en composants comprenant : un étage sur lequel une pluralité de types de composants sont dispersés; un dispositif de diffusion pour diffuser les composants sur l'étage; un dispositif d'imagerie pour capturer une image des composants dispersés sur l'étage à chaque fois que les composants sont dispersés sur l'étage par le dispositif de diffusion; et un dispositif de détermination pour déterminer si tous les types de la pluralité de types de composants dispersés sur l'étage satisfont ou non à une exigence d'adéquation sur la base de données d'imagerie résultant du dispositif d'imagerie imageant les composants dispersés sur l'étage.
PCT/JP2022/025556 2022-06-27 2022-06-27 Dispositif d'alimentation en composants WO2024003984A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019116442A1 (fr) * 2017-12-12 2019-06-20 株式会社Ｆｕｊｉ Dispositif d'alimentation en composants et procédé d'alimentation en composants
WO2020245945A1 (fr) * 2019-06-05 2020-12-10 株式会社Ｆｕｊｉ Appareil d'apport de pièces
JP2021082842A (ja) * 2021-02-26 2021-05-27 株式会社Ｆｕｊｉ ピックアップ装置
WO2022009336A1 (fr) * 2020-07-08 2022-01-13 株式会社Fuji Procédé de distribution de composants et dispositif de distribution de composants
WO2022107188A1 (fr) * 2020-11-17 2022-05-27 株式会社Fuji Dispositif de traitement d'image et procédé pour l'identification de composants dispersés

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019116442A1 (fr) * 2017-12-12 2019-06-20 株式会社Ｆｕｊｉ Dispositif d'alimentation en composants et procédé d'alimentation en composants
WO2020245945A1 (fr) * 2019-06-05 2020-12-10 株式会社Ｆｕｊｉ Appareil d'apport de pièces
WO2022009336A1 (fr) * 2020-07-08 2022-01-13 株式会社Fuji Procédé de distribution de composants et dispositif de distribution de composants
WO2022107188A1 (fr) * 2020-11-17 2022-05-27 株式会社Fuji Dispositif de traitement d'image et procédé pour l'identification de composants dispersés
JP2021082842A (ja) * 2021-02-26 2021-05-27 株式会社Ｆｕｊｉ ピックアップ装置

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