WO2024001595A1 - 一种用于晶圆切割后晶粒外观的检测方法 - Google Patents

一种用于晶圆切割后晶粒外观的检测方法 Download PDF

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Publication number
WO2024001595A1
WO2024001595A1 PCT/CN2023/094923 CN2023094923W WO2024001595A1 WO 2024001595 A1 WO2024001595 A1 WO 2024001595A1 CN 2023094923 W CN2023094923 W CN 2023094923W WO 2024001595 A1 WO2024001595 A1 WO 2024001595A1
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Prior art keywords
grains
station
detection
material tray
tray
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PCT/CN2023/094923
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English (en)
French (fr)
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肖治祥
朱涛
商秋锋
叶坤
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苏州精濑光电有限公司
武汉精测电子集团股份有限公司
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Publication of WO2024001595A1 publication Critical patent/WO2024001595A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Definitions

  • the invention belongs to the field of semiconductor detection technology, and in particular relates to a method for detecting the appearance of grains after wafer cutting in the semiconductor front-end process.
  • the quality of detection methods is directly related to production efficiency, quality, and product market competitiveness.
  • the inspection process of the grain appearance after wafer cutting is essential, which is related to the reliability and accuracy of subsequent use of the product.
  • the die is loaded into the slot of the Tray.
  • the Tray is usually picked up by a robot and then transported to the inspection station.
  • Optical inspection of grains requires inspection of multiple specific surfaces of the grains.
  • Existing detection methods generally detect the upward side of a single die first, then turn the single die over, change the orientation, and then detect another specific surface, and then determine the detection results as OK (qualified) or NG (not acceptable). Qualified) grain output.
  • the existing methods for detecting the appearance of wafer chips after wafer cutting have at least the following defects: 1. Inspection of a single wafer overturned, with low integration and long cycle time, which limits the improvement of efficiency; 2. From loading to Multiple inspection stations between blanking materials are arranged in parallel to cope with the inspection of different specific surfaces. The coordination of the circulation paths at different inspection stations is not high, and the inspection takes up a large space; 3. Sorting is rough and only qualified products are distinguished. The unqualified grains are only output from one cutting position. The unqualified grains are not sorted and output according to the unqualified items. Other work sections must continue to test the NG grains to complete the quality inspection requirements. Moreover, not grading and unloading materials directly after inspection increases the secondary sorting process, which is inefficient and increases the possibility of grain contamination.
  • the degree of integration of inspection is low. In addition, simply distinguishing OK and NG is obviously not in line with production reality. On the one hand, it is impossible to evaluate whether the NG grains can be reworked, repaired and reused, and the NG grains are directly discarded, which is a huge waste; on the other hand, the specific defects of the grains are not evaluated. For qualified projects, NG cannot be classified, and the test results cannot be used to guide quality and process improvements. Therefore, the existing detection methods for the appearance of wafer grains after cutting are not conducive to the further development of semiconductor inspection processes.
  • the present invention is to solve all or part of the problems of the above-mentioned prior art.
  • the present invention provides a method for detecting the appearance of grains after wafer cutting, which can efficiently complete the detection of multiple surfaces and integrate NG sorting. Graded output.
  • the present invention is a method for detecting the appearance of wafer grains after cutting, which is implemented using detection equipment;
  • the detection equipment includes a host computer, a circumferential conveyor line, and multiple stations arranged along the circumferential conveyor line; so The upper computer is used to control the work of the plurality of workstations;
  • the plurality of workstations include a loading station, several detection stations, a turning station and a sorting station;
  • the sorting station is provided with at least Two unloading ports;
  • the detection method includes: loading a plurality of crystal grains at the loading station, and transferring them to different stations by the circumferential conveying line, and sequentially: loading the plurality of crystal grains upward One side is subjected to optical inspection; after turning over to change the side of the plurality of grains facing upward, optical inspection is performed; according to the inspection results, the unqualified grains are classified and output; wherein the inspection results include inspection item information;
  • the inspection item information includes unqualified marks and defect characteristics;
  • the method for outputting after grading includes
  • Flow a number of grains along a circumferential direction detect different orientations to obtain detection results on multiple detection surfaces, and the detection space layout is more reasonable; at least two unloading ports are set up at the sorting station, and corresponding definitions are based on different defect characteristics. Multiple defect levels, and the corresponding relationship between the defect levels and the blanking port is defined, and the grains are output separately according to the defect levels.
  • While sorting qualified and unqualified grains the definition of actual inspection requirements can be based on
  • the defect characteristics detected at different positions (such as the position of the defect in the detection surface, the number of defects, etc.) can be classified into unqualified grains and then output to different feeding ports, which can not only improve the integration of the sorting process , reduces the number of sorting, reduces the risk of grain contamination loss, and can continuously complete various processes on the circular path.
  • the movement stroke is better coordinated, further optimizing the cycle time, and helping to improve production efficiency.
  • the circumferential conveying line is a circular turntable, and the circular turntable is provided with at least a first load-bearing jig and at least a second load-bearing jig; the front side of the die is noted as the first orientation, and the back side of the die is marked as the first orientation.
  • the above is marked as the second orientation;
  • the method of loading a plurality of wafers at the loading station and transferring them to different stations includes: carrying the plurality of wafers in the first orientation in a material tray, The material tray is recorded as the first material tray; the first material tray is placed on the first carrying fixture; the circular turntable rotates to transfer the first carrying fixture to the several detection stations.
  • the circular turntable rotates to transfer the first carrying fixture to the turning station; the turning station A material tray is provided, which is marked as the second material tray; at the turning station, the entire tray of crystal grains in the first material tray is turned over into the second material tray, and the crystal grains in the second material tray are The second orientation; place the second material tray on the second carrying fixture; rotate the circular turntable to transfer the second material tray to the several detection stations for detection; the detection is completed After all the grains of the second orientation are in the second material tray, the circular turntable rotates to transfer the second material tray to the sorting station.
  • the detection item information also includes: the position information of the crystal grain in the second material tray; the method of outputting the target crystal grain from the corresponding unloading port includes: the host computer obtains the target The position information of the crystal grain is output from the unloading port after the target crystal grain is taken out of the second material tray.
  • the ultimate goal of sorting NG and OK is often not to simply scrap the NG dies, but to repair the NG problem points in the later stage and reuse them into OK products. Therefore, sorting During the process, through the position information and corresponding defect characteristics in the second material tray, the NG grains can be taken out correspondingly as target grains and output from the corresponding unloading port, which is conducive to improving the automation of the entire production process. , which can not only save man-hours and costs, but also improve the actual effect of quality inspection.
  • the multiple workstations also include a blanking station and a replenishing station; the detection method also includes: outputting a full tray of qualified crystal grains from the blanking station; and obtaining the full tray of qualified crystal grains.
  • the second material tray By setting up the replenishing station, the second material tray passes through the sorting station and then goes to the replenishing station. At the replenishing station, the second material tray is moved due to unqualified crystals. After the grains are output and the vacant slots are filled, qualified grains are output from the whole tray, eliminating the subsequent process of transferring qualified grains to other trays. Qualified grains can be processed directly using the tray as a working unit. Improve overall production efficiency; the replenishing station automatically obtains qualified grains from the second material tray for subsequent replenishing. The entire replenishing process does not require manual intervention, and the degree of automation is higher.
  • the method of flipping the entire tray of dies in the first tray into the second tray at the turning station includes: covering the second tray on the first tray, and moving the entire tray together Flip; overall shaking after flipping.
  • the specific surfaces of the die that generally need to be inspected include the CG outer layer (the outer layer on the front side of the die, usually the outer surface of glass), the BGA side (the back side of the die, that is, the circuit surface), and the CG inner layer (including the bottom layer on the front side of the die, usually the outer surface of the glass).
  • the inner surface of the glass referring to the interface between the glass and the luminous body), etc., each surface needs to be inspected.
  • the process of rotating the circular turntable to transfer the first carrying fixture to the plurality of detection stations for inspection includes: rotating the circular turntable to transfer the first carrying fixture to the first detection station. Detect the front bottom layer of the die; after completing the detection of all the die in the first material tray, the circular turntable rotates to transfer the second load-bearing fixture to the second detection station to detect the front outer layer of the die ;
  • the rotation of the circular turntable to transfer the second material tray to the plurality of detection stations means that the second load-bearing fixture is transferred to the second detection station to detect the grain line surface.
  • the plurality of workstations also include reserved workstations for implementing supplementary processes; the supplementary processes include detecting newly added detection items, inspecting the first material tray and/or before arriving at the several detection stations.
  • the grains in the second tray are pre-inspected to determine whether there is a shortage of material and/or whether the grain orientation is correct.
  • the plurality of workstations are evenly spaced on a circle.
  • the multiple workstations are evenly distributed on a circle.
  • it is convenient to set the movement step length.
  • it is convenient to control the accurate flow of materials and simplify the design difficulty of the control system; on the other hand, it improves the utilization rate of the production space. Higher and more automated.
  • the angle of rotation of the circular turntable is greater than 360° and less than 720°.
  • the turning, inspection and sorting output are completed in less than two circles of circulation.
  • the entire process is automated and there is no redundant travel, which shortens the cycle time to the greatest extent and greatly improves the efficiency of the entire inspection process.
  • Another aspect of the present invention provides a detection device for integrated implementation of the method for detecting the appearance of wafer grains after wafer cutting. By implementing the entire tray turning over, the traditional method of turning over a single die for multiple inspections has been changed.
  • Multi-sided inspection is implemented on the tray as a unit, which reduces the frequency of pick-and-place operations, simplifies the configuration of mechanical parts, and increases the stability of the equipment. , which is conducive to later maintenance and greatly improves the detection efficiency; by setting up at least two unloading ports through the sorting mechanism, unqualified grains can be output according to the classification according to the detection requirements and actual production, which is conducive to the improvement of the entire production quality and crystal quality. Effective utilization of particles.
  • the present invention is a method for detecting the appearance of grains after wafer cutting. It defines multiple defect levels based on different defect characteristics, and defines the corresponding relationship between the defect levels and the blanking port, which can be combined with actual detection.
  • Requirements and actual quality work conditions Detect different positions on multiple specific surfaces of the grains and classify the unqualified grains before outputting them from different feeding ports, which can sort qualified and unqualified grains at the same time Unqualified grains are classified and output separately, and each process can be completed continuously on the circular stroke.
  • the movement stroke is better coordinated and the cycle time is further optimized, which is beneficial to improving production efficiency.
  • the testing process has a high degree of integration and direct output by classification, which is more in line with the needs of later quality assessment and repair and reuse of unqualified grains. It has a high degree of automation, reasonable work station layout, small equipment occupation space, and stable operation.
  • the present invention's method for detecting the appearance of grains after wafer cutting provides a positive solution for reasonably optimizing quality.
  • Figure 1 is a schematic diagram of the circulation process according to the embodiment of the present invention.
  • FIG. 2 is a schematic diagram of the detection equipment according to the embodiment of the present invention.
  • Figure 3 is a schematic process diagram of the detection method according to the embodiment of the present invention.
  • Figure 4 is a schematic diagram of the feeding and unloading process of the embodiment of the present invention.
  • Example testing equipment includes a host computer (not shown), a circumferential conveyor line, and eight stations set along the circumferential conveyor line.
  • the host computer is used to control the work of each workstation.
  • the example circumferential conveying line is implemented using a circular turntable T. As shown in Figure 1, along the outer circumference of the circular turntable T, there are respectively a loading station 1, a reserved station 2, a first detection station 3, a second detection station 4, a sorting station 5, and a feeding station. Station 6, blanking station 7 and turning station 8.
  • a first load-bearing jig T1 and a second load-carrying jig T2 are provided on the inner edge of the upper circumference of the circular turntable T corresponding to each work station.
  • a loading mechanism 10 is used to input a full tray of dies to be tested into the circular turntable T at the loading station 1 for circulation; the detection mechanism 30 and the detection mechanism 40 are respectively arranged at the first detection station 3 and the second detection station. 4. Used for optical inspection of different surfaces of the grains to be measured.
  • the turning mechanism 80 is provided at the turning station 8 for turning over the entire tray of dies to be tested.
  • the sorting mechanism 50 is used to sort unqualified die at the sorting station 5 and output them.
  • the exemplary sorting mechanism 50 is provided with five unloading openings for outputting unqualified die to five storage locations 501 respectively.
  • unqualified grains are divided into five defect levels based on inspection requirements, and the corresponding defect characteristics for each defect level are predefined in the host computer.
  • the corresponding relationship between the five blanking ports and the defect levels is defined based on the actual situation on site. Marking the level codes on the five blanking ports can intuitively determine the defect level of the output die, which facilitates subsequent targeted repairs. and guide process optimization.
  • the exemplary testing equipment is also provided with a transfer feeding mechanism 60 and a feeding mechanism 70 corresponding to the feeding station 6 and the unloading station 7 .
  • the unloading mechanism 70 can also be provided with multiple unloading ports.
  • the grading standards of qualified crystal grains can also be predefined, and the grades of qualified crystal grains can be obtained from the unloading mechanism after matching according to the inspection item information.
  • the multiple unloading ports of 70 correspond to the output, and the qualified grains are also classified. The specific application is not limited here.
  • an example method for detecting the appearance of wafer chips after cutting includes: loading several dies at a loading station and transferring them to different workstations in sequence: Optical inspection is performed on the upward side; after turning over to change the upward side of several grains, optical inspection is performed; according to the inspection results, the unqualified grains are classified and output; among them, the inspection results include inspection item information; the inspection item information includes Unqualified marks and defect characteristics; the method of output after classification includes: defining multiple defect levels based on different defect characteristics in the host computer, and defining the corresponding relationship between the defect levels and the unloading port; the host computer obtains the inspection item information, and The grains with unqualified marks are used as target grains; based on the defect characteristics of the target grains, the defect level of the target grains is determined; the host computer controls the sorting station to sort the target grains based on the corresponding relationship and the defect level of the target grains. Output from the corresponding unloading port.
  • the front side of the crystal grain facing upward is recorded as the first orientation
  • the back side of the crystal grain facing upward is marked as the second orientation.
  • the method of loading several dies at the loading station and transferring them to different stations includes: carrying multiple dies in the first orientation in a material tray, and recording the material tray as the first material.
  • the first material tray is placed on the first load-bearing fixture T1 corresponding to the loading station 1; the circular turntable T rotates and the first load-bearing fixture T1 is sequentially transferred to the first detection station 3 and the second detection station.
  • Position 4 detects the front side of the die.
  • the circular turntable T rotates to transfer the first load-bearing fixture T1 to the turning station 8; the turning station is equipped with materials
  • the tray is marked as the second tray; at the turning station 8, the turning mechanism 80 is used to turn the entire tray of grains in the first tray 180° and place it in the second tray.
  • the second orientation place the second material tray on a second load-bearing fixture T2; rotate the circular turntable T and rotate the second material tray with the second load-bearing fixture T2 to the second detection station 4 to detect the reverse side of the die That is, the line surface; after the inspection is completed, the second tray will be transferred to the sorting station 5.
  • the host computer obtains the test results and determines whether there are unqualified grains in the second material tray according to the test item information. If there are, the unqualified grains will be unloaded at the sorting station 5 and the unqualified grains will be picked out. Then the second material tray continues to flow to the replenishing station 6; at the replenishing station 6, the vacant dies in the second material tray are filled, and the second material tray is transferred to the unloading station 7 to collect the entire tray of qualified dies. output. In the example case, it is advantageous to put multiple dies face up. When loading and unloading single dies, only the back side can be absorbed, so it is convenient to load the dies face up. The number of dies that can be carried by the first and second trays in the example ranges from 20 to 168.
  • the dies are transferred between each workstation in units of trays, and the efficiency is much higher than that of a single die being transferred between multiple workstations. , it also further optimizes the flow stroke, which helps reduce the setting of the transfer manipulator, simplifies the equipment structure design, and improves the utilization of production space.
  • the example detection item information also includes: position information of the crystal grains in the second material tray.
  • the position information of the example is represented in the form of coordinates, and the coordinates of the crystal grain can be used to locate which row and column of slots in the second material tray the crystal grain is located.
  • the method of outputting the target die from the corresponding unloading port includes: the host computer obtains the position information of the target die, controls the sorting mechanism 50 to take out the target die from the corresponding slot in the second tray, and then removes the target die from the lower slot. Material port output.
  • the industrial camera magnification for inspection is selected according to the requirements.
  • the industrial camera in the first inspection station 3 is a 2x lens, which is used to detect the front bottom layer of the die through flying photography.
  • the industrial camera in the second inspection station 4 is a large target camera used to detect the circuit surface and surface of the die.
  • Front outer layer There is a thin layer of glass on the grain.
  • the specific surfaces of the die that generally need to be inspected include the CG outer layer (the outer layer on the front side of the die, usually the outer surface of glass), the BGA side (the back side of the die, that is, the circuit surface), and the CG inner layer (including the bottom layer on the front side of the die, usually the outer surface of the glass).
  • the inner surface of the glass refers to the interface between the glass and the luminous body), etc.
  • the positions of the first detection station 3 and the second detection station 4 can be interchanged and are not limited.
  • the industrial camera obtains the coordinates and records the location information of the target grain in the tray. After the inspection is completed, the defect characteristics and the coordinates of the grain are stored together as part of the inspection project information.
  • the defect characteristics include detecting the specific locations of defects on the wafer, which are also recorded in the form of coordinates. This is not limited to the fact that the defect characteristics may also include the number of defects.
  • sorting it can be comprehensively analyzed to determine whether the grain is qualified and determine the defect level based on the position of the grain in the material tray, the unqualified mark, the number of defects, and the defect characteristics (such as the specific location of the defect on the grain, etc.), making the sorting more detailed.
  • the sorting results are more reliable; the hierarchical directional output maximizes the effectiveness of subsequent processes and the overall efficiency is high.
  • the second material tray passes through the sorting station and then goes to the replenishing station. At the replenishing station, the slots left vacant by the unqualified grains in the second material tray are filled up. The entire tray is then output with qualified wafers, eliminating the subsequent process of transferring qualified wafers to other trays. Qualified wafers can be processed directly using the tray as a working unit, improving overall production efficiency and achieving a high degree of automation.
  • the method of flipping the entire tray of dice in the first tray and placing it in the second tray includes: covering the empty second tray on the first tray, and flipping the whole tray together; after flipping, the whole tray is Jitter.
  • the grains are generally smaller and lighter. After direct flipping, some of the grains may not fall into the slots of the second tray. The overall shaking after flipping further ensures that all the grains turn over and fall into the second tray during the flipping process. Two ingredients on the plate.
  • the multiple workstations also include a reserved workstation 2 for implementing supplementary processes.
  • supplementary processes include detecting newly added inspection items, and pre-inspecting the grains in the first and second material trays before arriving at the first inspection station 3 to determine whether there is a shortage of material and whether the grain orientation is correct.
  • an industrial camera can be added to the reserved station 2 to detect whether all the grains in the second material tray are turned up and lying neatly in each slot.
  • the number and specific applications of reserved workstations 2 are not limited here.
  • the reserved station 2 After the reserved station 2 is included in the example, there are 8 stations in the example, evenly spaced on a circle. In the example, an even number of stations can evenly divide the circumference. When flowing along the circumferential direction, it is convenient to set the movement step. On the one hand, it is convenient for the host computer to control the accurate flow of materials and simplify the design difficulty of the control system; on the other hand, it makes better use of production space. Higher efficiency and better automation.
  • the circular turntable T rotates through an angle greater than 360° and less than 720°. In the example, from loading station 1 to unloading station 7, the entire tray is unloaded. The circular turntable T rotates 630° in one cycle, and the turning and inspection are completed in less than two circles. And sorting output, the whole process is automated and there is no redundant travel, which shortens the cycle time to the greatest extent.
  • a first carrying fixture T1 and a second carrying fixture T2 are provided on the circular turntable T corresponding to each work station.
  • it is particularly beneficial to continuous large-volume inspection work. It can continuously load materials while conveying the first tray on the circumferential conveyor line, conduct uninterrupted inspection and grade unloading throughout the entire process, further improving the overall production efficiency and detection speed.
  • the method for detecting the appearance of the die after wafer cutting operates integrally in the circumferential direction, and the host computer controls the work of multiple stations to implement optical inspection of the die in different directions. Two optical inspections at multiple levels of the grain are completed within the two-circle stroke, and the inspection item information is obtained through the host computer. For the grain marked as unqualified, the user can define the defect level based on the actual situation and its defect characteristics. At the sorting station, the dies are sorted according to defect levels. It has changed the practice of using single grains to flow through multiple workstations, and not only directly distinguishes qualified and unqualified grains, but also combines unqualified grains with specific product quality requirements and testing needs for graded output, ensuring high integration.

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Abstract

本发明提供一种用于晶圆切割后晶粒外观的检测方法，包括：将若干晶粒在所述上料工位上料，并流转到不同的工位依次进行：对所述若干晶粒朝上一面进行光学检测；翻面改变所述若干晶粒朝上的一面后，进行光学检测；根据检测结果，将不合格的晶粒分级后输出。基于不同的缺陷特征对应定义多个缺陷级别，并定义所述缺陷级别与所述下料口的对应关系；上位机控制分拣工位基于所述对应关系与目标晶粒的缺陷级别将所述目标晶粒的从对应的所述下料口输出，流转行程合理、节拍时间短、一体化程度高且分级输出利于后期质量评估及不合格晶粒的修复以再利用，提高了整体生产效率。

Description

一种用于晶圆切割后晶粒外观的检测方法   技术领域
本发明属于半导体检测技术领域，尤其涉及一种半导体前段工艺中用于晶圆切割后晶粒外观的检测方法。
 背景技术
半导体、显示以及新能源等测试领域，检测方法的优劣直接关系到生产效率、质量和产品市场竞争力。以晶圆的生产过程为例，晶圆切割后晶粒外观的检测过程是必不可少的，其关系到产品后续使用的可靠性和准确性。晶圆切割成晶粒后，晶粒装载于Tray盘的槽格内，一般由机械手将Tray盘抓取再搬运到检测工位。对晶粒进行光学检测时需要对晶粒多个特定表面进行检测。现有的检测方法一般将单个晶粒朝上的一面先检测，然后对单个晶粒进行翻面，改变朝向后再检测另一个特定表面，然后分别将检测结果为OK（合格）或NG（不合格）的晶粒输出。
现有的用于晶圆切割后晶粒外观的检测方法至少存在以下缺陷：一、单个晶粒翻面检测，一体化程度低，节拍时间长，限制了效率的提高；二、从上料至下料之间的多个检测工位是平行排布以应对不同特定表面的检测，在不同的检测工位流转路径统筹协调性不高，检测占用空间大；三、分拣粗略，仅区分合格与不合格，并只从一个下料位输出，对于不合格的晶粒并不按不合格的项目分选输出，还必须要其他工段再对NG的晶粒继续检测才能完成质量检验的要求，而且检测后不直接分级下料增加了二次分拣的工序，效率低且增加了晶粒被污染的可能性，检测一体化程度低。此外，单单区分OK与NG显然不符合生产实际，一方面无法评估NG的晶粒能否返工修复再利用，对NG的晶粒直接弃用，浪费巨大；另一方面不评估晶粒的具体不合格项目，也就不能对NG进行分级，也就不能将检测结果用以指导质量及工艺的改进。因此，现有的用于晶圆切割后晶粒外观的检测方法不利于半导体检测工艺的进一步发展。
 发明内容
本发明是为解决上述现有技术的全部或部分问题，本发明提供了一种用于晶圆切割后晶粒外观的检测方法，能高效地完成多个表面的检测且一体化进行NG分拣分级输出。
本发明的一种用于晶圆切割后晶粒外观的检测方法，使用检测设备一体实施；所述检测设备包括上位机、圆周输送线、沿所述圆周输送线设置的多个工位；所述上位机用于控制所述多个工位工作；所述多个工位包括上料工位、若干检测工位、翻面工位和分拣工位；所述分拣工位设置有至少两个下料口；所述检测方法包括：将若干晶粒在所述上料工位上料，并由所述圆周输送线流转到不同的工位依次进行：对所述若干晶粒朝上一面进行光学检测；翻面改变所述若干晶粒朝上的一面后，进行光学检测；根据检测结果，将不合格的晶粒分级后输出；其中，所述检测结果包括检测项目信息；所述检测项目信息包括不合格标记、缺陷特征；所述分级后输出的方法包括：在所述上位机中基于不同的缺陷特征对应定义多个缺陷级别，并定义所述缺陷级别与所述下料口的对应关系；所述上位机获取所述检测项目信息，将有所述不合格标记的晶粒作为目标晶粒；基于所述目标晶粒的所述缺陷特征，确定所述目标晶粒的缺陷级别；所述上位机控制所述分拣工位基于所述对应关系与所述目标晶粒的缺陷级别将所述目标晶粒的从对应的所述下料口输出。
沿一个圆周方向流转若干晶粒，检测不同的朝向获取多个检测面的检测结果，检测空间布局更合理；在所述分拣工位设置至少两个下料口，基于不同的缺陷特征对应定义多个缺陷级别，并定义所述缺陷级别与所述下料口的对应关系，分别将晶粒按照缺陷级别分开输出，在分选合格与不合格晶粒的同时可以根据实际检测要求的定义基于不同位置检测得到的缺陷特征（例如缺陷在检测面中的位置、缺陷的数量等），将不合格晶粒分级后对应输出到不同的下料口，既能提高了分拣工序的一体化程度，减少了分拣次数，降低了晶粒污染损失的风险又能在圆周路径上连续完成各个工序，运动行程更好地统筹协调，进一步优化了节拍时间，利于提高生产效率。
所述圆周输送线是圆形转台，所述圆形转台上设置有至少第一承载治具和至少一个第二承载治具；将晶粒正面朝上记为第一朝向，将晶粒背面朝上记为第二朝向；将若干晶粒在所述上料工位上料，并流转到不同的工位的方法包括：将所述第一朝向的多个晶粒承载于料盘内，将所述料盘记为第一料盘；将所述第一料盘置于所述第一承载治具；所述圆形转台转动将所述第一承载治具流转至所述若干检测工位检测，完成所述第一料盘中全部所述第一朝向的晶粒检测后所述圆形转台转动将所述第一承载治具流转至所述翻面工位；所述翻面工位设置有料盘，记为第二料盘；在所述翻面工位将所述第一料盘中的整盘晶粒翻转入第二料盘内，所述第二料盘内的晶粒为所述第二朝向；将所述第二料盘置于所述第二承载治具；所述圆形转台转动将所述第二料盘流转至所述若干检测工位检测；检测完成所述第二料盘中全部所述第二朝向的晶粒后，所述圆形转台转动将所述第二料盘流转至所述分拣工位。
通过将整盘晶粒作为工作单位沿圆周方向流转进行检测，并将整盘晶粒进行翻面，由若干检测工位以料盘为单位按检测要求分别检测，既能针对不同的检测指标更全面检测获取需要的检测项目结果，更好地符合特定应用需求，又能大幅减少单个晶粒的取放，简化控制程序和取放机构的设置，提高流转效率进而提高整体的检测效率。
所述检测项目信息还包括：晶粒在所述第二料盘中的位置信息；将所述目标晶粒的从对应的所述下料口输出的方法包括：所述上位机获取所述目标晶粒的所述位置信息，将所述目标晶粒从所述第二料盘中取出后从所述下料口输出。在检测中，分拣NG和OK的最终目的往往并不是简单的将NG的晶粒报废，而是通过后期的对应NG的问题点相应修复还可以再利用把它变成OK品，因此分拣过程中通过在所述第二料盘中的位置信息及对应的缺陷特征，能够将NG晶粒作为目标晶粒对应分级取出并从对应的下料口输出，有利于完善整个生产流程的自动化程度，既能节约工时、成本又能提高质量检验的实际效果。
所述多个工位还包括下料工位、补料工位；所述检测方法还包括：将满盘合格的晶粒从所述下料工位输出；获取所述满盘合格的晶粒的过程包括：将当前流转至所述补料工位的所述第二料盘记为Pi，i≥1，为自然数；初始化i=1，P1中存在合格的晶粒，将P1中合格的晶粒全部存放至所述补料工位；i=i+1；判断所述补料工位存有的合格晶粒是否能将所述Pi补满：若能，则将Pi补满后流转至所述下料工位；若不能，则将Pi中合格的晶粒存在所述补料工位。通过设置所述补料工位，将所述第二料盘经过所述分拣工位后先至补料工位，在所述补料工位将所述第二料盘因不合格的晶粒被输出而空缺的槽格补满后整盘输出合格的晶粒，省去了后续再次转存合格晶粒至其他料盘的工序，可直接以料盘为工作单位处理合格的晶粒，提高整体生产效率；所述补料工位自动从所述第二料盘中获取合格的晶粒用于后续的补料，补料全过程无须人工介入，自动化程度更高。
在所述翻面工位将所述第一料盘中的整盘晶粒翻转入第二料盘内的方法包括：将所述第二料盘覆盖在所述第一料盘上，整体一同翻转；翻转后整体抖动。
所述若干检测工位有两个，分别记为第一检测工位和第二检测工位；所述第一检测工位用于检测晶粒正面底层，所述第二检测工位用于检测晶粒线路面和正面外层。一般需要检测的晶粒特定面包括CG外层（晶粒正面外层，一般是玻璃外表面）、BGA面（晶粒背面，即线路面）及CG内层（包括晶粒正面底层，一般是玻璃内表面，指玻璃与发光体交界面）等，每个面都需要检测，通过设置两个检测工位分别配置不同类型的工业相机对晶粒多个特定表面进行准确检测。
所述圆形转台转动将所述第一承载治具流转至所述若干检测工位检测的过程包括：所述圆形转台转动将所述第一承载治具转至所述第一检测工位检测晶粒正面底层；完成所述第一料盘中全部晶粒的检测后，所述圆形转台转动将所述第二承载治具转至所述第二检测工位检测晶粒正面外层；所述圆形转台转动将所述第二料盘流转至所述若干检测工位检测是指将所述第二承载治具转至所述第二检测工位检测晶粒线路面。
所述多个工位还包括预留工位，用于实施补充工序；所述补充工序包括检测新增的检测项目、在到达所述若干检测工位之前对所述第一料盘和/或第二料盘中的晶粒进行预检确定是否存在缺料和/或晶粒朝向是否正确。通过在圆周上增加设置预留工位，能够进一步应对客户多样化的检测需求，对增加的检测项目实施补充工序。即使客户没有额外检测需求时，也能够进一步对流转到所述检测工位的晶粒进行预检测，可以评估是否存在缺料、朝向是否正确，可以根据检测工作实际情况进行补充工序提高检测质量和效果。
所述多个工位间隔均匀设置在一个圆周上。所述多个工位均匀分布在一个圆周上，在沿圆周方向流转时，便于设置运动步长，一方面便于控制物料的准确流转简化控制系统的设计难度；另一方面对生产空间的利用率更高、自动化程度更好。
将若干晶粒在所述上料工位上料，并流转到不同的工位的过程中，所述圆形转台转过的角度大于360°小于720°。在不到两个圆周的流转行程内完成翻面、检测及分拣输出，全程自动化且没有多余行程，最大程度缩短了节拍时间，整个检测过程的效率得到大幅提高。本发明另一方面提供的一种检测设备，用于一体化实施本发明一方面的用于晶圆切割后晶粒外观的检测方法。通过实施整盘翻面改变了传统的单颗晶粒翻面进行多次检测的做法，以料盘为单位实施多面检测，减少了取放动作频率简化了机械件的配置，设备稳定性更高、利于后期维护保养且检测效率大幅提高；通过所述分拣机构设置至少两个下料口，能够结合检测需求和生产实际将不合格的晶粒分级对应输出，利于整个生产质量的改进和晶粒的有效利用。
与现有技术相比，本发明的主要有益效果：
本发明的一种用于晶圆切割后晶粒外观的检测方法，基于不同的缺陷特征对应定义多个缺陷级别，并定义所述缺陷级别与所述下料口的对应关系，能够结合实际检测需求和质量工作实际情况对晶粒的多个特定表面的不同位置进行检测并对不合格的晶粒进行分级后对应从不同的下料口输出，既能分拣合格与不合格晶粒的同时将不合格的晶粒分级后分别输出，又能在圆周行程上连续完成各个工序，运动行程得到更好地统筹协调，进一步优化了节拍时间，利于提高生产效率。检测过程一体化程度高且分级直接输出，更符合后期质量评估及不合格晶粒的修复再利用的需求，自动化程度高，工位布局合理、设备占用空间少、运行稳定性。本发明的用于晶圆切割后晶粒外观的检测方法为合理优化质量提供了积极的方案。
 附图说明
图1为本发明实施例的流转过程示意图。
图2为本发明实施例的检测设备示意图。
图3为本发明实施例的检测方法过程示意图。
图4为本发明实施例的补料、下料过程示意图。
 实施方式
下面将对本发明具体实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在下述实施例中采用特定次序描绘了实施例的操作，这些次序的描述是为了更好的理解实施例中的细节以全面了解本发明，但这些次序的描述并不一定与本发明的方法一一对应，并不能以此限定本发明的范围。
本发明实施例中，结合参考图1和图2所示，示例的用于晶圆切割后晶粒外观的检测方法使用检测设备一体实施。示例的检测设备包括上位机（未图示）、圆周输送线、沿圆周输送线设置的八个工位。上位机用于控制每个工位进行工作。示例的圆周输送线采用圆形转台T实现。如图1所示，沿圆形转台T外侧的圆周分别设有上料工位1、预留位2、第一检测工位3、第二检测工位4、分拣工位5、补料工位6、下料工位7和翻面工位8。如图2所示，圆形转台T上沿圆周内沿分别对应每个工位设置有一个第一承载治具T1和一个第二承载治具T2。沿圆形转台T外沿在相应工位分别设置有上料机构10、检测机构30和检测机构40及分拣机构50、翻面机构80。上料机构10用于在上料工位1将满盘待测晶粒输入圆形转台T进行流转；检测机构30和检测机构40分别对应设置在第一检测工位3和第二检测工位4，用于对待测晶粒的不同表面进行光学检测。翻面机构80设置在翻面工位8用于将整盘待测晶粒翻面。分拣机构50用于在分拣工位5分选不合格的晶粒并输出。示例的分拣机构50设置有五个下料口，用于输出不合格的晶粒分别至五个存储位501。示例的情况中根据检测需求将不合格的晶粒分为五个缺陷级别，每个缺陷级别对的应缺陷特征在上位机中进行预定义。示例的情况中根据现场实际情况定义五个下料口与缺陷级别的对应关系，对五个下料口分别标记级别编码可以直观的确定输出晶粒的缺陷级别，便于后续有针对性地进行修复及指导工艺优化。示例的检测设备还对应补料工位6和下料工位7设置有中转补料机构60、下料机构70。有些实施情况中，下料机构70也可以设置有多个下料口，在检测过程中也可以预定义合格晶粒的分级标准，根据检测项目信息匹配获取合格晶粒的等级后从下料机构70的多个下料口对应输出，将合格晶粒也分级，在此不限定具体应用。
结合参考图1和图3，示例的用于晶圆切割后晶粒外观的检测方法包括：将若干晶粒在上料工位上料，并流转到不同的工位依次进行：对若干晶粒朝上一面进行光学检测；翻面改变若干晶粒朝上的一面后，进行光学检测；根据检测结果，将不合格的晶粒分级后输出；其中，检测结果包括检测项目信息；检测项目信息包括不合格标记、缺陷特征；分级后输出的方法包括：在上位机中基于不同的缺陷特征对应定义多个缺陷级别，并定义缺陷级别与下料口的对应关系；上位机获取检测项目信息，将有不合格标记的晶粒作为目标晶粒；基于目标晶粒的缺陷特征，确定目标晶粒的缺陷级别；上位机控制分拣工位基于对应关系与目标晶粒的缺陷级别将目标晶粒的从对应的下料口输出。
在本实施例中，将晶粒正面朝上记为第一朝向，将晶粒背面朝上记为第二朝向。示例的情况中将若干晶粒在上料工位上料，并流转到不同的工位的方法包括：将第一朝向的多个晶粒承载于料盘内，将料盘记为第一料盘；将第一料盘置于对应上料工位1的第一承载治具T1；圆形转台T转动将该第一承载治具T1依次转至第一检测工位3、第二检测工位4检测晶粒正面，，完成第一料盘中全部第一朝向的晶粒检测后，圆形转台T转动将第一承载治具T1转至翻面工位8；翻面工位设置有料盘，记为第二料盘；在翻面工位8用翻面机构80将第一料盘中的整盘晶粒翻转180°置于第二料盘内，第二料盘内的晶粒为第二朝向；将第二料盘置于一个第二承载治具T2；圆形转台T转动将第二料盘随该第二承载治具T2转至第二检测工位4检测晶粒反面即线路面；检测完成后将第二料盘流转至分拣工位5。上位机获取检测结果根据检测项目信息判断第二料盘中是否存在有不合格标记的晶粒，若存在则将不合格的晶粒在分拣工位5下料，挑出不合格的晶粒后第二料盘继续向补料工位6流转；在补料工位6将第二料盘空缺的晶粒补满，将第二料盘流转至下料位7将整盘的合格晶粒输出。示例情况中，将多个晶粒正面朝上是有利的，在单晶粒上下料时，只能吸附背面，因而正面向上上料方便。示例的第一料盘和第二料盘可以承载的晶粒数量从20至168颗不等，以料盘为单位在各个工位流转，效率远高于单颗晶粒在多工位间流转，也更加优化了流转的动作行程，利于减少转运机械手的设置，简化设备结构设计，提高了生产空间利用率。
在本实施例中，示例的检测项目信息还包括：晶粒在第二料盘中的位置信息。示例的位置信息以坐标形式表征，通过晶粒的坐标可以定位该晶粒所在第二料盘中哪一排哪一列的槽格中。将目标晶粒的从对应的下料口输出的方法包括：上位机获取目标晶粒的位置信息，控制分拣机构50将目标晶粒从第二料盘中对应的槽格中取出后从下料口输出。
示例的情况中依据要求而选择的用于检测的工业相机倍率。在本实施例中，第一检测工位3的工业相机是2倍镜，飞拍检测晶粒正面底层，第二检测工位4的工业相机是大靶面相机用于检测晶粒线路面和正面外层。晶粒上有一层薄薄的玻璃。一般需要检测的晶粒特定面包括CG外层（晶粒正面外层，一般是玻璃外表面）、BGA面（晶粒背面，即线路面）及CG内层（包括晶粒正面底层，一般是玻璃内表面，指玻璃与发光体交界面）等，第一检测工位3和第二检测工位4位置可以互换，并不限定。工业相机在进行自动光学检测时获取目标晶粒在料盘中的坐标记录位置信息，检测完成后将缺陷特征与该晶粒的坐标作为检测项目信息的一部分共同存储。有的实施情况中缺陷特征包括检测晶粒上出现缺陷的具体位置，也通过坐标形式记录，在此并不限定，缺陷特征还可以包括缺陷的数量。分选时能结合晶粒在料盘中的位置以及不合格标记、缺陷数量、缺陷特征（如缺陷出现在晶粒上的具体位置等）综合分析确定是否合格并确定缺陷级别，分选更细致全面，分选结果更可靠；分级定向输出对后段工序的效用最大化，整体效率高。
在本实施例中，获取满盘合格的晶粒的过程，如图4示例，包括：将当前流转至补料工位的第二料盘记为Pi，i≥1，为自然数；初始化i=1，P1中存在合格的晶粒，将P1中合格的晶粒全部存放至补料工位6；i=i+1；判断补料工位6存有的合格晶粒是否能将Pi补满：若能，则将Pi补满后流转至下料工位7；若不能，则将Pi中合格的晶粒存在补料工位6。通过设置补料工位，将第二料盘经过分拣工位后先至补料工位，在补料工位将第二料盘因不合格的晶粒被输出而空缺的槽格补满后整盘输出合格的晶粒，省去了后续再次转存合格晶粒至其他料盘的工序，可直接以料盘为工作单位处理合格的晶粒，提高整体生产效率，自动化程度高。
本实施例中，将第一料盘中的整盘晶粒翻转置于第二料盘内的做法包括：将空的第二料盘覆盖在第一料盘上，整体一同翻转；翻转后整体抖动。晶粒一般较小也较轻，直接翻转后可能还有部分晶粒没有落入第二料盘的槽格内，通过翻转后整体抖动进一步保障翻面过程中晶粒全部翻面并落在第二料盘中。
在本实施例中，多个工位还包括预留工位2，用于实施补充工序。示例的补充工序包括检测新增的检测项目、在到达第一检测工位3之前对第一料盘和第二料盘中的晶粒进行预检确定是否存在缺料及晶粒朝向是否正确。通过在圆周上增加设置预留工位，能够进一步应对客户多样化的检测需求，对增加的检测项目实施补充工序。例如可以在预留工位2增加工业相机，检测第二料盘中的晶粒是否是所有都被翻起来，很规整的平躺在每个槽格里。在此不限定预留工位2的数量和具体应用。
示例的情况中包含预留工位2后，示例的工位有8个，间隔均匀设置在一个圆周上。示例的情况偶数个工位能均分圆周，在沿圆周方向流转时，便于设置运动步长，一方面便于上位机控制物料的准确流转简化控制系统的设计难度；另一方面对生产空间的利用率更高、自动化程度更好。在本实施例中，将若干晶粒在上料工位上料，并流转到不同的工位的过程中，圆形转台T转过的角度大于360°小于720°。示例的情况中，从上料工位1上料至下料工位7整盘下料，一次流转圆形转台T转过630°，在不到两个圆周的流转行程内完成翻面、检测及分拣输出，全程自动化且没有多余行程，最大程度缩短了节拍时间。
在本实施例中，圆形转台T上对应每个工位都设置有第一承载治具T1和第二承载治具T2。在实际生产应用中特别有利于连续的大批量检测工作，可以在圆周输送线输送上一个第一料盘的同时，连续上料，全程不间断进行检测并分级下料，进一步提高了整体的生产效率和检测速度。
由上述实施例可知，用于晶圆切割后晶粒外观的检测方法，在圆周方向上一体化运行，由上位机控制多个工位工作，实施对晶粒的不同朝向光学检测，在不到两个圆周的行程内完成两种朝向晶粒多个层面的光学检测，并通过上位机获取检测项目信息，对标记为不合格的晶粒用户可以根据实际情况并基于其缺陷特征定义缺陷级别，在分拣工位将晶粒按照缺陷级别进行分选。改变了以单颗晶粒在多个工位流转的做法，并且不仅仅直接区分合格与不合格，还将不合格的晶粒结合具体产品质量要求及检测需求进行分级输出，在保障一体化高效率的前提下充分利用检测得到的信息，灵活定义缺陷级别，检测、评估、分选作为一个整体完成。在生产实际中该用于晶圆切割后晶粒外观的检测方法对于多批大量晶粒的检测工作有特别明显的优势。
还需要说明的是，在本文中，诸如“第一”和“第二”等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。

Claims (10)

  1. 一种用于晶圆切割后晶粒外观的检测方法，其特征在于：使用检测设备一体实施；所述检测设备包括上位机、圆周输送线、沿所述圆周输送线设置的多个工位；所述上位机用于控制所述多个工位工作；所述多个工位包括上料工位、若干检测工位、翻面工位和分拣工位；所述分拣工位设置有至少两个下料口；
    所述检测方法包括：将若干晶粒在所述上料工位上料，并由所述圆周输送线流转到不同的工位依次进行：对所述若干晶粒朝上一面进行光学检测；翻面改变所述若干晶粒朝上的一面后，进行光学检测；根据检测结果，将不合格的晶粒分级后输出；
    其中，所述检测结果包括检测项目信息；所述检测项目信息包括不合格标记、缺陷特征；所述分级后输出的方法包括：
    在所述上位机中基于不同的缺陷特征对应定义多个缺陷级别，并定义所述缺陷级别与所述下料口的对应关系；所述上位机获取所述检测项目信息，将有所述不合格标记的晶粒作为目标晶粒；基于所述目标晶粒的所述缺陷特征，确定所述目标晶粒的缺陷级别；所述上位机控制所述分拣工位基于所述对应关系与所述目标晶粒的缺陷级别将所述目标晶粒的从对应的所述下料口输出。
  2. 根据权利要求1所述的用于晶圆切割后晶粒外观的检测方法，其特征在于：所述圆周输送线是圆形转台，所述圆形转台上设置有至少第一承载治具和至少一个第二承载治具；将晶粒正面朝上记为第一朝向，将晶粒背面朝上记为第二朝向；
    将若干晶粒在所述上料工位上料，并流转到不同的工位的方法包括：将所述第一朝向的多个晶粒承载于料盘内，将所述料盘记为第一料盘；将所述第一料盘置于所述第一承载治具；
    所述圆形转台转动将所述第一承载治具流转至所述若干检测工位检测，完成所述第一料盘中全部所述第一朝向的晶粒检测后所述圆形转台转动将所述第一承载治具流转至所述翻面工位；所述翻面工位设置有料盘，记为第二料盘；在所述翻面工位将所述第一料盘中的整盘晶粒翻转入第二料盘内，所述第二料盘内的晶粒为所述第二朝向；将所述第二料盘置于所述第二承载治具；
    所述圆形转台转动将所述第二料盘流转至所述若干检测工位检测；
    检测完成所述第二料盘中全部所述第二朝向的晶粒后，所述圆形转台转动将所述第二料盘流转至所述分拣工位。
  3. 根据权利要求2所述的用于晶圆切割后晶粒外观的检测方法，其特征在于：所述检测项目信息还包括：晶粒在所述第二料盘中的位置信息；将所述目标晶粒的从对应的所述下料口输出的方法包括：所述上位机获取所述目标晶粒的所述位置信息，将所述目标晶粒从所述第二料盘中取出后从所述下料口输出。
  4. 根据权利要求2所述的用于晶圆切割后晶粒外观的检测方法，其特征在于：所述多个工位还包括下料工位、补料工位；所述检测方法还包括：将满盘合格的晶粒从所述下料工位输出；
    获取所述满盘合格的晶粒的过程包括：将当前流转至所述补料工位的所述第二料盘记为Pi，i≥1，为自然数；
    初始化i=1，P1中存在合格的晶粒，将P1中合格的晶粒全部存放至所述补料工位；i=i+1；
    判断所述补料工位存有的合格晶粒是否能将所述Pi补满：若能，则将Pi补满后流转至所述下料工位；若不能，则将Pi中合格的晶粒存在所述补料工位。
  5. 根据权利要求2所述的用于晶圆切割后晶粒外观的检测方法，其特征在于：在所述翻面工位将所述第一料盘中的整盘晶粒翻转入第二料盘内的方法包括：将所述第二料盘覆盖在所述第一料盘上，整体一同翻转；翻转后整体抖动。
  6. 根据权利要求4所述的用于晶圆切割后晶粒外观的检测方法，其特征在于：所述若干检测工位有两个，分别记为第一检测工位和第二检测工位；所述第一检测工位用于检测晶粒正面底层，所述第二检测工位用于检测晶粒线路面和正面外层。
  7. 根据权利要求6所述的用于晶圆切割后晶粒外观的检测方法，其特征在于：所述圆形转台转动将所述第一承载治具流转至所述若干检测工位检测的过程包括：
    所述圆形转台转动将所述第一承载治具转至所述第一检测工位检测晶粒正面底层；完成所述第一料盘中全部晶粒的检测后，所述圆形转台转动将所述第二承载治具转至所述第二检测工位检测晶粒正面外层；
    所述圆形转台转动将所述第二料盘流转至所述若干检测工位检测是指将所述第二承载治具转至所述第二检测工位检测晶粒线路面。 
  8. 根据权利要求2-7任一项所述的用于晶圆切割后晶粒外观的检测方法 ，其特征在于：所述多个工位还包括预留工位，用于实施补充工序；所述补充工序包括检测新增的检测项目、在到达所述若干检测工位之前对所述第一料盘和/或第二料盘中的晶粒进行预检确定是否存在缺料和/或晶粒朝向是否正确。
  9. 根据权利要求2-7任一项所述的用于晶圆切割后晶粒外观的检测方法，其特征在于：所述多个工位间隔均匀设置在一个圆周上。
  10. 根据权利要求2-7任一项所述的用于晶圆切割后晶粒外观的检测方法，包括：将若干晶粒在所述上料工位上料，并流转到不同的工位的过程中，所述圆形转台转过的角度大于360°小于720°。
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