WO2023280270A1 - 一种提拉装置及硅片清洗系统 - Google Patents

一种提拉装置及硅片清洗系统 Download PDF

Info

Publication number
WO2023280270A1
WO2023280270A1 PCT/CN2022/104362 CN2022104362W WO2023280270A1 WO 2023280270 A1 WO2023280270 A1 WO 2023280270A1 CN 2022104362 W CN2022104362 W CN 2022104362W WO 2023280270 A1 WO2023280270 A1 WO 2023280270A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicon wafer
flower basket
lifting
lifting device
base
Prior art date
Application number
PCT/CN2022/104362
Other languages
English (en)
French (fr)
Inventor
孙前高
Original Assignee
禄丰隆基硅材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 禄丰隆基硅材料有限公司 filed Critical 禄丰隆基硅材料有限公司
Publication of WO2023280270A1 publication Critical patent/WO2023280270A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of photovoltaic technology, in particular to a lifting device and a silicon wafer cleaning system.
  • Silicon wafer production is an important link in the photovoltaic industry chain. Usually, silicon wafers are cut from silicon ingots or rods, and the cut silicon wafers need to be cleaned before entering the next section.
  • the silicon wafers are vertically placed in the insertion slots of the flower basket, and then the silicon wafers are cleaned by a cleaning machine. After the silicon wafer is cleaned by the washing machine, the lifting device lifts the flower basket carrying the silicon wafer to leave the washing machine.
  • the flower basket carrying the silicon wafers is pulled, the silicon wafers tend to stick together, resulting in a large amount of cleaning solution remaining on the surface of the silicon wafers after the silicon wafers are detached from the cleaning machine. Therefore, when the silicon wafer is dried after cleaning, it is not easy to dry, and problems such as wet wafers may also occur, which reduces the drying efficiency and affects the quality of the silicon wafer.
  • the purpose of this application is to provide a lifting device and a silicon wafer cleaning system to minimize the cleaning solution adhered to the surface of the silicon wafer after cleaning, thereby improving the drying effect and effectively increasing the yield.
  • the present application provides a lifting device.
  • the lifting device is used for lifting flower baskets submerged in the cleaning tank.
  • the lifting device provided in the present application includes a mechanically connected lifting mechanism and a bearing structure.
  • the bearing structure includes a base and a seesaw mechanism.
  • the base is mechanically connected to the lifting mechanism.
  • the rocker mechanism is installed on the base.
  • the seesaw mechanism is used to carry the flower basket, so that the lifting mechanism tilts and lifts the flower basket from the cleaning tank at a first preset angle.
  • the base is mechanically connected to the lifting mechanism, and the seesaw mechanism is installed on the base, and the seesaw mechanism is used to carry the flower basket. Therefore, when the lifting mechanism lifts the carrying structure, the seesaw mechanism can The flower basket is tilted and lifted at a first preset angle, so that each silicon chip carried by the flower basket can be tilted in one direction, thereby avoiding the problem of two adjacent silicon chips sticking together. Based on this, when the lifting mechanism lifts the carrying structure away from the liquid level of the cleaning solution, the cleaning solution attached to each silicon wafer carried by the flower basket can smoothly drip from the surface of the silicon wafer into the cleaning tank, thereby reducing the residue on the surface of the silicon wafer.
  • the cleaning solution is used to facilitate the drying of silicon wafers, and reduce the chance of wet wafers, dirt and other problems on silicon wafers, thereby ensuring the quality of silicon wafers.
  • the above-mentioned seesaw mechanism includes a bearing part and a rotating connection assembly.
  • the carrying part is arranged on the above-mentioned base through a rotating connection assembly.
  • the central axis of the rotating connection assembly deviates from the central axis of the bearing part.
  • the surface of the carrying portion away from the base and the surface of the base close to the carrying portion form the above-mentioned first preset angle.
  • the carrying part is arranged on the base through the rotating connection assembly, and the central axis of the rotating connecting assembly deviates from the central axis of the carrying part, so that the carrying part is always in a state of tilting to one side without external force Therefore, in the process of lifting the supporting structure by the lifting mechanism, the supporting part can ensure that the flower basket carried is also in an inclined state, and the silicon wafers in the flower basket are all inclined in the same direction, thereby avoiding the adhesion of adjacent silicon wafers At the same time, the silicon wafers take off the liquid more thoroughly.
  • the above-mentioned first preset angle is greater than 0° and less than or equal to 30°.
  • the inclination angle of the silicon wafer is appropriate, on the one hand, it can reduce the adhesion of adjacent silicon wafers, and on the other hand, it can avoid the negative consequences such as the tipping of the silicon wafer or even the collision caused by the excessive angle.
  • the above-mentioned first preset angle is greater than 0° and less than or equal to 20°.
  • At least one edge of the silicon wafer in the flower basket near the bottom of the cleaning tank has a second preset angle with the liquid surface.
  • the second preset angle is 0° ⁇ 90°.
  • the extension surface of the silicon wafer and the extension surface of the cleaning solution will intersect in a straight line, and the silicon wafer in the flower basket is close to at least one edge of the bottom of the cleaning tank The sides are parallel to the liquid surface of the cleaning solution.
  • the silicon chip in the flower basket keeps rising slowly in an inclined state, and the contact area between the silicon chip and the liquid surface of the cleaning solution gradually changes from a plane to a line contact, and finally The silicon wafer leaves the liquid surface.
  • the above-mentioned second preset angle is greater than 0° and less than or equal to 90°
  • at least one edge of the silicon wafer in the flower basket near the bottom of the cleaning tank is in point contact with the liquid surface of the cleaning solution, and two The intersection point is a vertex at the bottom of the silicon chip.
  • the silicon chip in the flower basket keeps tilting and slowly rises. The difference between the silicon chip and the liquid surface of the cleaning solution The contact area gradually changes from plane to point contact, and finally the silicon wafer leaves the liquid surface.
  • the above-mentioned rotating connection assembly includes a rotating shaft and at least one sleeve movably sleeved on the rotating shaft.
  • the rotating shaft is arranged on the base.
  • Each sleeve is arranged on the side of the bearing portion away from the bearing surface.
  • the radial dimension of the sleeve is larger than the radial dimension of the rotating shaft.
  • the bearing part has two opposite sides.
  • a flower basket positioning structure is arranged on the opposite side. Based on this, the flower basket can be fixed on the flower basket positioning mechanism on the bearing part, so that the flower basket remains stable when it is pulled up, avoiding the consequences of silicon wafer adhesion or incomplete removal of liquid caused by accidental sliding or vibration of the flower basket, which in turn affects the Wafer quality.
  • the side of the base close to the bearing part has multiple sets of installation parts. Multiple sets of mounting parts are distributed along a direction perpendicular to the rotating shaft.
  • the above-mentioned rotating connection assembly is arranged on the corresponding set of mounting parts. Since multiple sets of mounting parts are distributed along the direction perpendicular to the rotating shaft, when the carrying structure needs to be lifted at different inclination angles, the distance between the rotating shaft included in the rotating connection assembly and the different mounting parts can be adjusted, thereby changing the first preset angle.
  • each set of mounting parts includes at least one mounting groove or mounting frame provided on the base.
  • the heights of each group of mounting parts are the same or different.
  • the seesaw mechanism further includes multiple sets of detachable connecting pieces, and each set of detachable connecting pieces fixes the rotating shaft on a corresponding set of mounting parts.
  • the rotating shaft is detachably installed on the mounting bracket or the mounting groove on the corresponding group of mounting parts through the detachable connecting piece, thereby realizing the detachment of the whole seesaw mechanism for easy replacement.
  • the above bearing structure further includes two limiting parts.
  • the two stoppers are distributed on the side wall of the cleaning tank along the pulling direction of the pulling device.
  • the seesaw mechanism is located between the two limiting parts.
  • the two limit parts cooperate with the seesaw mechanism, so that the seesaw mechanism can maintain the level when it rises to the highest position and the lowest position, and the horizontal state of the highest position is consistent with the horizontal state of other slots, which is conducive to the transfer mechanism to realize pick-and-place
  • the function of the flower basket; the lowest position is in a horizontal state, so that the cleaning solution can clean the silicon wafer more thoroughly, thereby improving the quality of the silicon wafer.
  • the above-mentioned lifting mechanism includes a frame and a lifting driving mechanism provided on the frame.
  • the frame is connected to the base.
  • the above-mentioned pulling driving mechanism includes at least one linear lifting mechanism, and the linear lifting mechanism is a screw nut lifting mechanism, a slider guide rail lifting mechanism, and the like.
  • the driving methods of these linear lifting mechanisms can be electric, pneumatic or hydraulic, which will not be described in detail here.
  • the lifting device further includes at least one support portion provided on the carrying structure. At least one support part is in contact with the cleaning tank. Each supporting part is a rotating supporting part. The guiding direction of each supporting part is the same as the pulling direction of the pulling mechanism. Based on this, at least one supporting part can play a supporting role between the lifting mechanism and the cleaning tank.
  • at least one supporting part supports the lifting mechanism and acts as a booster, so that the lifting mechanism is not easily deformed .
  • rotating the supporting part can also play the role of reducing friction and guiding.
  • the guiding direction of the supporting part is the same as the pulling direction of the above-mentioned pulling mechanism.
  • the lifting mechanism pulls the flower basket the supporting part It can play a guiding role, making the lifting process of the lifting mechanism smoother.
  • the present application also provides a silicon wafer cleaning system, including the pulling device described in the first aspect or any possible implementation manner of the first aspect.
  • the beneficial effect of the silicon wafer cleaning system provided by the second aspect is the same as that of the lifting device described in the first aspect or any possible implementation manner of the first aspect, and will not be repeated here.
  • Fig. 1 is the structural representation of the silicon wafer cleaning system that the embodiment of the present application provides;
  • FIG. 2 is a schematic structural diagram of a lifting device provided in an embodiment of the present application.
  • Fig. 3A is a schematic diagram of the tilted state of the silicon chip in the flower basket in the related art
  • Fig. 3B is a schematic diagram of the tilted state of the silicon chip in the flower basket in the embodiment of the present application;
  • FIG. 4A is a schematic diagram of a second preset angle of 0° in the embodiment of the present application.
  • FIG. 4B is a schematic diagram of a second preset angle greater than 0° and less than or equal to 90° in the embodiment of the present application;
  • FIG. 5 is a schematic structural diagram of a bearing structure provided in an embodiment of the present application.
  • Fig. 6 is a schematic structural diagram of the seesaw mechanism provided by the embodiment of the present application.
  • FIG. 7 is a schematic structural view of the flower basket provided by the embodiment of the present application.
  • Fig. 8 is a front view of the lifting device provided by the embodiment of the present application.
  • Fig. 9 is a front view of the lifting mechanism provided by the embodiment of the present application.
  • Fig. 10 is a side view of the lifting device provided by the embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • plurality means two or more, unless otherwise specifically defined. "Several” means one or more than one, unless otherwise clearly and specifically defined.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection.
  • Connection, or integral connection it may be mechanical connection or electrical connection; it may be direct connection or indirect connection through an intermediary, and it may be the internal communication of two elements or the interaction relationship between two elements.
  • connection or integral connection; it may be mechanical connection or electrical connection; it may be direct connection or indirect connection through an intermediary, and it may be the internal communication of two elements or the interaction relationship between two elements.
  • Photovoltaic power generation is a utilization method of "light-to-electricity" conversion of solar energy resources. It has the advantages of simple energy conversion process, no noise, no pollution emission, and high power generation efficiency, and has been vigorously developed.
  • silicon wafers As a basic material for photovoltaic power generation, the market demand for silicon wafers is very extensive. Silicon wafer production is an important link in the photovoltaic industry chain. Usually, silicon wafers are cut from silicon ingots or rods, and the cut silicon wafers need to be cleaned before entering the next section.
  • the silicon wafers are vertically placed in the insertion slots of the flower basket, and then the silicon wafers are cleaned by a washing machine. After the silicon wafer is cleaned by the washing machine, the lifting device lifts the flower basket carrying the silicon wafer to leave the washing machine.
  • the flower basket carrying the silicon wafers is pulled, the silicon wafers in the flower basket are prone to sticking problems, resulting in a large amount of cleaning solution remaining on the surface of the silicon wafers after the silicon wafers are detached from the cleaning machine. Therefore, when the silicon wafer is dried after cleaning, it is not easy to dry, and there will be problems such as wet wafer and dirt, which reduces the drying efficiency and affects the quality of the silicon wafer.
  • FIG. 1 illustrates a schematic structural diagram of a silicon wafer cleaning system provided in an embodiment of the present application.
  • the silicon wafer cleaning system provided in the embodiment of the present application includes a pulling device 1 and may also include a cleaning tank 2 .
  • the cleaning tank 2 can cooperate with the lifting device 1 to realize the cleaning of silicon wafers.
  • the cleaning tank 2 can hold a cleaning solution, and the cleaning solution can be water or other liquids that can clean dirt on the surface of the silicon wafer 120 .
  • a first limiting member 20 and a second limiting member 21 are provided on the side wall of the cleaning tank 2 close to the lifting device 1 , and the lifting device 1 is located between the two limiting members.
  • the first limiter 20 and the second limiter 21 can cooperate with the lifting device 1, on the one hand, it can limit the highest position and the lowest position that the lifting device 1 can reach, on the other hand, it can also make the lifting device 1 Levels can be maintained at the highest and lowest positions.
  • the process of using the lifting device 1 provided in the embodiment of the present application to cooperate with the cleaning tank 2 to clean the silicon wafer includes the following steps:
  • the lifting device 1 is put into the cleaning tank 2 filled with cleaning solution
  • the lifting device 1 is lowered until it contacts with the second stopper 21, and cooperates to make the flower basket reach a horizontal state;
  • the lifting device lifts the flower basket 12 upwards, and the flower basket is in a tilted state at this time;
  • the lifting device 1 is lifted upwards, and contacts with the first stopper 20, and cooperates to make the flower basket reach a horizontal state, which is convenient for the transmission mechanism to take and place the flower basket 12.
  • the silicon wafer cleaning system avoids the occurrence of adhesion of adjacent silicon wafers 120 during the cleaning process, and reduces the number of adjacent silicon wafers 120 during the lifting process.
  • a large amount of cleaning solution attached to the silicon wafer 120 makes the silicon wafer 120 easier to dry, reduces the production of poor quality silicon wafer 120, effectively improves the yield of the silicon wafer 120, and greatly shortens the drying time and improves Improve the drying efficiency, thereby improving the equipment capacity.
  • Fig. 2 illustrates a schematic structural diagram of a lifting device provided by an embodiment of the present application.
  • the lifting device 1 provided by the embodiment of the present application includes a lifting mechanism 10 and a bearing structure 11 .
  • the supporting structure 11 includes a base 110 and a seesaw mechanism 111 .
  • the base 110 is mechanically connected to the lifting mechanism 10
  • the seesaw mechanism 111 is installed on the base 110 .
  • the seesaw mechanism 111 is used to carry the flower basket 12 , so that the lifting mechanism 10 lifts the flower basket 12 obliquely at a first preset angle ⁇ from the cleaning tank 2 .
  • the lifting mechanism 10 drives the carrying structure 11 to rise, and lifts the flower basket 12 submerged in the cleaning tank 2 at a first preset angle ⁇ .
  • the flower basket 12 keeps tilting to one side on the seesaw mechanism 111 until the bottom of the flower basket 12 leaves the liquid surface, and the angle of inclination is the first preset angle ⁇ .
  • the silicon wafers 120 in the flower basket 12 also rise obliquely from the cleaning solution to leave the liquid surface at a first predetermined angle ⁇ .
  • Fig. 3A illustrates the schematic diagram of the inclined state of the silicon wafer in the flower basket in the related art.
  • the silicon wafer 120 may appear adjacent to each other as shown in Fig. 3A. Si wafers 120 sticking to each other.
  • Figure 3B illustrates the schematic diagram of the tilted state of the silicon wafers in the flower basket in the embodiment of the present application. Tilting in the same direction prevents adjacent silicon wafers 120 from sticking together.
  • the lifting mechanism 10 lifts the supporting structure 11 away from the liquid level of the cleaning solution
  • the cleaning solution attached to each silicon wafer 120 carried by the flower basket 12 can smoothly drip from the surface of the silicon wafer 120 into the cleaning tank 2, In this way, the remaining cleaning solution on the surface of the silicon wafer 120 is reduced to facilitate drying of the silicon wafer 120 , and the probability of problems such as wet wafers and dirt on the silicon wafer 120 is reduced, thereby ensuring the quality of the silicon wafer 120 .
  • the above-mentioned first preset angle ⁇ is greater than 0° and less than or equal to 30°.
  • the first preset angle ⁇ is greater than 0° and less than or equal to 20°.
  • the first preset angle ⁇ is 5°, 10°, 15° or 20°, but not limited thereto.
  • the inclination angle of the silicon wafer 120 within this angle range is appropriate, on the one hand, it can reduce the adhesion of adjacent silicon wafers 120, and on the other hand, it can avoid adverse consequences such as the silicon wafer 120 falling over or even colliding caused by the excessive angle.
  • FIG. 4A is a schematic diagram of the second preset angle ⁇ of 0° provided by the embodiment of the present application
  • FIG. 4B is a schematic diagram of the second preset angle ⁇ of the embodiment of the present application that is greater than 0° and less than or equal to 90°.
  • the extension surface of the silicon wafer 120 and the extension surface of the cleaning solution will intersect in a straight line, and the silicon wafer 120 in the flower basket 12 is close to the bottom of the cleaning tank 2. At least one edge is parallel to the liquid surface of the cleaning solution.
  • the silicon chip 120 in the flower basket 12 keeps rising slowly in an inclined state, and the contact area between the silicon chip 120 and the liquid surface of the cleaning solution gradually changes from a plane to a surface.
  • the silicon chip 120 finally leaves the liquid surface. Based on this, when at least one edge of the silicon wafer 120 in the flower basket 12 near the bottom of the cleaning tank 2 is in point contact with the liquid level of the cleaning solution, under the action of gravity and the surface tension of the cleaning solution, the residual cleaning residue on the silicon wafer 120 will The solution flows down along at least one edge of the silicon wafer 120 near the bottom of the cleaning tank 2 , and finally gathers at an apex of the bottom of the silicon wafer 120 to form droplets. Under the same situation of the volume of cleaning solution remaining on the surface of the silicon wafer 120, the size of the droplets that converge on the apex of the bottom of the silicon wafer 120 is larger than that of the droplets distributed along the edges.
  • the liquid droplets gathered at the top of the bottom of the silicon wafer 120 are more likely to fall into the cleaning tank 2, thereby reducing the residual cleaning solution on the surface of the silicon wafer 120, so as to facilitate the drying of the silicon wafer 120 and reduce the occurrence of wet chips on the silicon wafer 120. , dirt and other problems, thereby ensuring the quality of the silicon wafer 120.
  • the flower basket in the subsequent drying process, can be placed obliquely, and the inclination direction is opposite to the second preset angle ⁇ formed by at least one edge of the silicon wafer 120 in the flower basket 12 near the bottom of the cleaning tank 2 and the liquid surface,
  • the inclination angle of the silicon wafer 120 changes greatly during the process of leaving the cleaning solution liquid surface and drying, which can further reduce the residual cleaning solution on the surface of the silicon wafer 120, improve drying efficiency, and further improve product quality.
  • FIG. 5 illustrates a schematic structural diagram of a bearing structure provided by an embodiment of the present application
  • FIG. 6 illustrates a schematic structural diagram of a seesaw mechanism provided by an embodiment of the present application.
  • the above-mentioned seesaw mechanism 111 includes a bearing portion 1110 and a rotating connection assembly 1111 .
  • the bearing part 1110 is disposed on the base 110 through a rotating connection assembly 1111 .
  • the central axis of the rotating connection assembly 1111 deviates from the central axis 3 of the bearing part 1110 .
  • the surface of the bearing part 1110 away from the base 110 and the surface of the base 110 close to the bearing part 1110 form the above-mentioned first preset angle ⁇ .
  • the carrying part 1110 is arranged on the base 110 through the rotating connection assembly 1111, and the central axis of the rotating connecting assembly 1111 deviates from the central axis 3 of the carrying part 1110, so that the carrying part 1110 is always in a state of tilting to one side without external force,
  • the flower basket 12 carried by the carrying portion 1110 also maintains a tilted state accordingly. Therefore, when the lifting mechanism 10 lifts the carrying structure 11, the supporting part 1110 can ensure that the flower basket 12 carried is also in a tilted state, so that the silicon wafers 120 in the flower basket 12 are all tilted in the same direction, thereby avoiding the same. Adjacent silicon wafers 120 stick together, and the silicon wafers 120 take off the liquid more thoroughly.
  • the central axis of the rotating connection assembly 1111 is located on the left side of the central axis 3 of the bearing part 1110 , so that the bearing part 1110 presents a state of being higher on the left and lower on the right. Based on this, when the lifting mechanism 10 lifts the flower basket 12 , the flower basket 12 is in a state of being higher on the left and lower on the right, and the silicon wafer 120 in the flower basket is correspondingly inclined to the right.
  • both the above-mentioned bearing part 1110 and the base 110 may be structures that facilitate the draining of liquid.
  • the structure of the bearing part 1110 and the base 110 will be described below with reference to the accompanying drawings. It should be understood that the examples are only for explanation and not for limitation.
  • the above-mentioned carrying part 1110 and base 110 are frame-type structures, which can drain the liquid to the greatest extent, so that the liquid can be drained out quickly during the pulling process, shortening the time required for dehydration of the silicon wafer, so that Silicon wafers are more thoroughly dehydrated.
  • the bearing part 1110 has a beam 1110a, and the central axis of the rotating connection assembly 1111 and the central axis of the beam 1110a are the same straight line.
  • the bearing part 1110 has two opposite sides.
  • a flower basket positioning structure is arranged on the opposite side.
  • the above-mentioned carrying part 1110 has four sides.
  • the above-mentioned second predetermined angle ⁇ is 0°, and the contact area between the silicon chip 120 in the flower basket 12 and the liquid surface of the cleaning solution gradually changes from a plane to a line contact;
  • the above-mentioned second preset angle ⁇ is greater than 0° and less than or equal to 90°, and the silicon in the flower basket 12
  • the contact area between the sheet 120 and the liquid surface of the cleaning solution gradually changes from flat to point contact.
  • the two flower basket positioning mechanisms are defined as the first flower basket positioning mechanism 1112 and the second flower basket positioning mechanism 1113 respectively.
  • the flower basket 12 can be fixed on the first flower basket positioning mechanism 1112 and the second flower basket positioning mechanism 1113 on the bearing part 1110, so that the flower basket 12 remains stable when it is pulled, and the silicon chip 120 caused by accidental sliding or vibration of the flower basket 12 is avoided. Consequences such as adhesion or incomplete removal of liquid will further affect the quality of the silicon wafer 120 .
  • Fig. 7 illustrates a schematic structural view of the flower basket provided by the embodiment of the present application.
  • the flower basket 12 has a plurality of protruding pieces 121 on the bottom of two opposite sides, and the protruding pieces 121 on the two sides are symmetrical about the central axis of the flower basket 12 .
  • each flower basket positioning mechanism includes a positioning plate provided on a corresponding side, and each positioning plate has a plurality of positioning grooves.
  • Each positioning slot included in the two positioning mechanisms is distributed symmetrically, and each positioning slot is distributed along the extending direction of the corresponding side.
  • the angle between the surface of the positioning plate and the upper surface of the bearing part 1110 is an obtuse angle.
  • the positioning plate has a thickness of 3.0-2.5 mm and a width of 6-8 cm.
  • Each flower basket positioning mechanism includes a positioning plate that is distributed obliquely to the bearing part 1110, which guides the placement of the flower basket 12; each positioning plate has a plurality of symmetrically distributed positioning grooves, and each positioning groove is along the corresponding side.
  • the distribution of the extension direction is convenient for matching with the protruding parts 121 on both sides of the flower basket 12, so that the flower basket 12 can be firmly locked in the positioning groove, avoiding shaking caused by loose fixation.
  • each positioning plate has four positioning slots, and the positioning plate is a stainless steel plate with a thickness of 2.7 mm and a width of 7 cm.
  • the above-mentioned rotating connection assembly 1111 includes a rotating shaft 1111 a and at least one sleeve movably sleeved on the rotating shaft 1111 a.
  • the rotating shaft 1111a is disposed on the base 110 .
  • Each sleeve is disposed on a side of the bearing portion 1110 away from the bearing surface.
  • the radial dimension of the sleeve is larger than the radial dimension of the rotating shaft 1111a.
  • the above-mentioned bearing part 1110 realizes rotation through the rotating shaft 1111a and at least one sleeve arranged on the side of the bearing part 1110 away from the bearing surface, and the sleeve movably sleeved on the rotating shaft 1111a rotates in cooperation with the rotating shaft 1111a, reducing the In order to avoid the influence of friction, it is convenient for the lifting mechanism 10 to tilt the flower basket 12.
  • the sleeves are fixed on the side of the beam 1110 a away from the bearing surface.
  • the two sleeves are defined as the first sleeve 1111b and the second sleeve 1111c respectively, and the first sleeve 1111b and the second sleeve 1111c can be respectively sleeved on both ends of the rotating shaft 1111a , so that the bearing part 1110 is more stable when rotating, avoiding the vibration of the bearing part 1110 when rotating due to the excessive concentration of the sleeve position, thereby ensuring a more thorough removal of liquid from the silicon wafer 120 and improving the cleaning quality of the silicon wafer 120.
  • the side of the base 110 close to the bearing part 1110 has multiple sets of mounting parts.
  • the heights of the mounting parts of each group are the same or different.
  • Multiple sets of mounting portions are distributed along a direction perpendicular to the rotating shaft 1111a.
  • the above-mentioned rotating connection assembly 1111 is provided on the corresponding set of mounting parts. Since multiple sets of mounting parts are distributed along the direction perpendicular to the rotating shaft 1111a, when the carrying structure 11 needs to be lifted at different inclination angles, the distance between the rotating shaft 1111a contained in the rotating connection assembly 1111 and different mounting parts can be adjusted, thereby changing the first Preset angle ⁇ .
  • FIG. 6 there are two installation parts, which are defined as a first installation part 1114 and a second installation part 1115 .
  • the two installation parts are arranged at both ends of the base 110, and the two ends of the rotating connection assembly 1111 are respectively arranged on the corresponding installation parts. This makes the rotating connection assembly 1111 more stable and ensures the stability of the silicon wafer 120 during the pulling process.
  • the above-mentioned seesaw mechanism 111 may also include multiple sets of detachable connectors, and the detachable connectors may be clip assemblies or bolt assemblies, etc., which will not be described in detail here.
  • Each set of detachable connectors fixes the rotating shaft 1111a on the corresponding set of mounting parts.
  • the rotating shaft 1111a is detachably mounted on the mounting bracket or the mounting groove on the corresponding set of mounting parts through a detachable connecting piece, so that the entire seesaw mechanism 111 is detachable and easy to replace.
  • the positioning plate and the positioning grooves of the positioning plate need to be in frequent contact with the flower basket 12, and the positioning plate itself is relatively thin, it is easy to be deformed and damaged during the lifting process. Detachable, thereby realizing the replacement of the positioning plate.
  • each set of mounting parts includes at least one mounting groove or mounting frame disposed on the base 110 .
  • the installation part includes a plurality of installation grooves or mounting brackets
  • the rotating shaft 1111a can realize the change of the position or height between the rotating shaft 1111a and the base 110 through the structure of the slot and the detachable connection assembly or the slide rail and the detachable connection assembly, thereby changing
  • the tilting angle of the seesaw mechanism 111 is to change the magnitude of the first preset angle ⁇ .
  • each set of mounting parts includes a mounting slot, and the two ends of the rotating shaft 1111 a are respectively installed in the corresponding mounting slots.
  • the lifting device 1 further includes at least one support portion provided on the carrying structure 11 . At least one support portion is in contact with the washing tank 2 . Each supporting part is a rotating supporting part. The guiding direction of each supporting portion is the same as the pulling direction 4 of the pulling mechanism 10 .
  • the bearing structure 11 also includes a traction frame 112 on which at least one supporting part is arranged. The base 110 is connected to the pulling mechanism 10 through a traction frame 112 .
  • the traction frame 112 When the silicon wafer cleaning system cleaned the silicon wafer 120 in the flower basket 12, the traction frame 112 was positioned under the cleaning solution liquid level in the cleaning tank 2; when the silicon wafer cleaning system finished cleaning the silicon wafer 120 in the flower basket 12, the The pulling mechanism 10 pulls the traction frame 112 above the liquid level of the cleaning solution in the cleaning tank 2 .
  • the rotating surface of at least one rotating support part is in contact with the cleaning tank 2 , and the guiding direction of each rotating supporting part is the same as the pulling direction 4 of the pulling mechanism 10 .
  • the lifting mechanism 10 lifts the flower basket 12, based on this, at least one rotating support part can play a supporting role between the bearing structure 11 and the cleaning tank 2.
  • the rotating support part supports the bearing
  • the structure 11 also acts as a booster so that the bearing structure 11 is not easily deformed.
  • rotating the supporting part can also play the role of reducing friction and guiding. The pulling process is smoother.
  • Fig. 8 illustrates a front view of the lifting device provided by the embodiment of the present application.
  • the above-mentioned supporting parts are rollers, and the number of supporting parts is two.
  • the two rollers are defined as the first roller 1120 and the second roller 1121 respectively.
  • Above-mentioned traction frame 112 has two columns, and each roller is installed on the lower end of corresponding column, and first roller 1120 and second roller 1121 are symmetrically distributed about the central axis of traction frame 112.
  • the rolling surfaces of the first roller 1120 and the second roller 1121 are in contact with the cleaning tank 2, which not only play the role of support, assist and guide, but also balance the two ends of the traction frame 112, so that the flower basket 12
  • the lifting process is smoother and smoother.
  • the above-mentioned bearing structure 11 may also include two limiting members. Two stoppers are distributed on the side wall of the cleaning tank 2 along the pulling direction 4 of the pulling device 1 .
  • the seesaw mechanism 111 is located between the two limiting members.
  • the two limiters are the above-mentioned first limiter 20 and the second limiter 21 .
  • the first limiter 20 and the second limiter 21 cooperate with the seesaw mechanism 111, so that the seesaw mechanism 111 can maintain a level when it rises to the highest position and is in the lowest position, and the horizontal state of the highest position is consistent with the level of other grooves.
  • the state is consistent, which is conducive to the transfer mechanism to realize the function of picking and placing the flower basket 12; the horizontal state of the lowest position is consistent with the horizontal state of other tanks, which is conducive to the cleaning solution to clean the silicon wafer 120 more thoroughly, thereby improving the quality of the silicon wafer 120 .
  • the seesaw mechanism 111 further includes two limiting parts cooperating with the two limiting parts.
  • the above-mentioned rocker mechanism 111 has two tilting sides, and each limiting portion is provided on the corresponding tilting side.
  • one of the limiting parts is an L-shaped limiting frame 1116 hung on the traction frame 112
  • the other limiting part is a columnar limiting block 1117 protruding from the bearing part 1110 .
  • the columnar stopper 1117 cooperates with the second stopper 21 located below the seesaw mechanism 111 on the side wall of the cleaning tank 2, and the second stopper 21
  • the entire bearing part 1110 is supported under the columnar limiting block 1117 so that the seesaw mechanism 111 is in a horizontal state when it is at its lowest position.
  • the L-shaped stop frame 1116 cooperates with the first stopper 20 above the seesaw mechanism 111 on the side wall of the cleaning tank 2, and the first stopper 20 Press down on the carrying part 1110 above the L-shaped limit frame 1116, so that the seesaw mechanism 111 is in a horizontal state when it is at the highest position, which is convenient for the subsequent transfer mechanism to take and place the flower basket 12.
  • the L-shaped limit frame 1116 and the traction frame 112 can also guide the seesaw mechanism 111 .
  • Fig. 9 illustrates a front view of the lifting mechanism provided by the embodiment of the present application
  • Fig. 10 illustrates a side view of the lifting device provided by the embodiment of the present application.
  • the lifting mechanism 10 includes a frame 100 and a lifting driving mechanism 101 arranged on the frame 100 .
  • the frame 100 is connected to the base 110 .
  • the above-mentioned lifting drive mechanism 101 includes at least one linear lifting mechanism, and the linear lifting mechanism is a screw nut lifting mechanism, a slider guide rail lifting mechanism, and the like.
  • the driving methods of these linear lifting mechanisms can be electric, pneumatic or hydraulic, which will not be described in detail here.
  • the driving speed of the pulling drive mechanism 101 is very slow, ranging from 2 mm/s to 4 mm/s.
  • the silicon wafer 120 can be stained with cleaning solution as little as possible, thereby avoiding the silicon wafer 120 Generation of residual liquid traces on 120.
  • the above-mentioned pulling driving mechanism 101 includes two types of linear lifting mechanisms: a screw nut lifting mechanism and a slider guide rail lifting mechanism.
  • the screw nut lifting mechanism 1010 is located between the first slider guide rail lifting mechanism 1011 and the second slider guide rail lifting mechanism 1012 .
  • the screw nut elevating mechanism 1010, the first slider guide rail elevating mechanism 1011 and the second slider guide rail elevating mechanism 1012 are connected by brackets to ensure the synchronism and structural stability of the three.
  • the screw nut lifting mechanism 1010 includes a screw rod and a threaded member threaded on the screw rod.
  • the first slide rail lifting mechanism 1011 includes a first slide rail 1011a and a first slide block 1011b disposed on the first slide rail 1011a.
  • the second slide rail lifting mechanism 1012 includes a second slide rail 1012a and a second slide block 1012b disposed on the second slide rail 1012a.
  • the bracket includes a connecting frame 102 and two connecting arms arranged on the connecting frame 102 , and the two connecting arms are defined as a first connecting arm 13 and a second connecting arm 14 . Both the first connecting arm 13 and the second connecting arm 14 are connected to the traction frame 112 .
  • a motor 1013 is fixed below the screw nut lifting mechanism 1010 .
  • the motor 1013 first drives the screw nut lifting mechanism 1010, the first slider guide rail lifting mechanism 1011 and the second slider guide rail lifting mechanism 1012 synchronously rises slowly, and at the same time, the connecting frame 102 drives the traction frame 112 to rise through the first connecting arm 13 and the second connecting arm 14, thereby realizing the slow lifting of the flower basket 12, and the pulling speed is 2mm/s, so that the silicon wafer 120
  • the liquid on the silicon wafer 120 is removed to the greatest extent, leaving only a thin liquid film, which makes drying very easy, and no trace of liquid is left on the silicon wafer 120, which improves the quality of the silicon wafer 120.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

本申请公开一种提拉装置及硅片清洗系统，涉及光伏技术领域，以最大程度减少硅片清洗结束后表面黏附的清洗溶液，从而提高烘干效果，有效提高成品率。所述提拉装置包括机械连接的提拉机构和承载结构；其中，所述承载结构包括底座以及翘板机构，所述底座机械连接于所述提拉机构，所述翘板机构安装在所述底座；所述翘板机构用于承载所述花篮，使所述提拉机构从所述清洗槽内以第一预设角度倾斜提起所述花篮。所述硅片清洗系统包括上述技术方案所提的提拉装置。本申请提供的提拉装置用于提拉浸没在清洗槽内的花篮。

Description

一种提拉装置及硅片清洗系统
本申请要求在2021年7月7日提交中国专利局，申请号为202121535766.1，申请名称为“一种提拉装置及硅片清洗系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光伏技术领域，特别是涉及一种提拉装置及硅片清洗系统。
背景技术
硅片生产是光伏产业链中的一个重要环节。通常，硅片由硅锭或硅棒切割而成，切割好的硅片需要进行清洗，然后再进入下一工段。
目前，在清洗开始前，硅片被竖直放入花篮的插片槽内，然后利用清洗机清洗硅片。当清洗机清洗硅片后，提拉装置提拉承载硅片的花篮脱离清洗机。但是，在提拉承载硅片的花篮时，硅片之间容易出现粘连，导致硅片从清洗机脱离后，硅片表面残留有大量清洗溶液。因此，硅片清洗后进行烘干时，不易烘干，还会出现湿片等问题，降低了烘干效率，影响了硅片质量。
申请内容
本申请的目的在于提供一种提拉装置及硅片清洗系统，以最大程度减少硅片清洗结束后表面黏附的清洗溶液，从而提高烘干效果，有效提高成品率。
第一方面，本申请提供一种提拉装置。该提拉装置用于提拉浸没在清洗槽内的花篮。本申请提供的提拉装置包括机械连接的提拉机构和承载结构。承载结构包括底座以及翘板机构。底座机械连接于提拉机构。翘板机构安装在底座。翘板机构用于承载花篮，使提拉机构从清洗槽内以第一预设角度倾斜提起花篮。
采用上述技术方案的情况下，底座机械连接于提拉机构，翘板机构安装在底座，而翘板机构用于承载花篮，因此，在提拉机构提拉承载结构的过程中，翘板机构可以以第一预设角度倾斜提起花篮，使得花篮所承载的各个硅片可以沿着一个方向倾斜，进而避免出现相邻两个硅片粘连在一起的问题。基于此，当提拉机构提拉承载结构离开清洗溶液的液面时，花篮所承载的各 个硅片附着的清洗溶液可以顺利的从硅片表面滴落到清洗槽内，从而减少硅片表面残留的清洗溶液，以方便烘干硅片，并减少硅片出现湿片、脏污等问题的几率，进而保证硅片质量。
在一种可能的实现方式中，上述翘板机构包括承载部以及转动连接组件。承载部通过转动连接组件设在上述底座上。转动连接组件的中心轴偏离承载部的中心轴。承载部远离底座的表面与底座靠近承载部的表面形成上述第一预设角度。
采用上述技术方案的情况下，承载部通过转动连接组件设在底座上，而转动连接组件的中心轴偏离承载部的中心轴，使得承载部在无外力作用下总是处于向一侧倾斜的状态，因此，在提拉机构提拉承载结构的过程中，承载部可保证所承载的花篮也处在倾斜状态，花篮内的硅片均向同一方向倾斜，从而避免了相邻的硅片粘连在一起，硅片脱去液体更彻底。
在一种可能的实现方式中，上述第一预设角度大于0°且小于或等于30°。在这个角度范围内硅片的倾斜角度合适，一方面可以减少相邻硅片的粘连，另一方面避免了角度过大造成的硅片倾倒，甚至碰撞等不良后果。
在一种可能的实现方式中，上述第一预设角度大于0°且小于或等于20°。
在一种可能的实现方式中，当上述提拉机构提拉花篮时，花篮内的硅片靠近清洗槽的底部的至少一条棱边与液面具有第二预设角度。第二预设角度为0°～90°。
采用上述技术方案的情况下，当上述第二预设角度为0°时，硅片的延伸面与清洗溶液的延伸面会相交于一条直线，花篮内的硅片靠近清洗槽的底部的至少一条棱边与清洗溶液的液面平行。此时，在上述提拉机构提拉花篮至离开液面的过程中，花篮内的硅片保持倾斜的状态缓慢上升，硅片与清洗溶液液面的接触面积由平面逐渐变成线接触，最终硅片离开液面。而且，当花篮内的硅片靠近清洗槽的底部的至少一条棱边与清洗溶液的液面为线接触，在重力和清洗溶液表面张力的作用下，硅片表面残留的清洗溶液最后汇聚到硅片靠近清洗槽的底部的棱边，形成沿着棱边分布的液滴。
当上述第二预设角度为大于0°且小于等于90°时，在离开清洗溶液时，花篮内的硅片靠近清洗槽的底部的至少一条棱边与清洗溶液的液面为点接触，二者的交点为硅片底部的一个顶点，此时，在上述提拉机构提拉花篮至离开液面的过程中，花篮内的硅片保持倾斜的状态缓慢上升，硅片与清洗 溶液液面的接触面积由平面逐渐变成点接触，最终硅片离开液面。基于此，当花篮内的硅片靠近清洗槽的底部的至少一条棱边与清洗溶液的液面为点接触，在重力和清洗溶液表面张力的作用下，硅片上残留的清洗溶液沿着硅片靠近清洗槽的底部的至少一条棱边向下流，最终汇聚在硅片底部的一个顶点，形成液滴。在硅片表面残留的清洗溶液体积相同的情况下，相对于沿着棱边分布的液滴来说，汇聚在硅片底部顶点的液滴尺寸比较大，因此，在重力和表面张力的作用下，汇聚在硅片底部顶点的液滴比较容易掉落到清洗槽内。
由上可见，当第二预设角度为大于0°且小于等于90°时，硅片从清洗溶液中脱离后，最终所残留的清洗溶液相对较少，可以缩短后续烘干时间，降低烘干后硅片表面残留液体痕迹的可能性，有效提高了硅片成品率。
在一种可能的实现方式中，上述转动连接组件包括转轴以及活动套设在转轴上的至少一个套筒。转轴设在底座上。各个套筒设在承载部远离承载面的一侧。套筒的径向尺寸大于转轴的径向尺寸。基于此，上述承载部通过转轴与设在承载部远离承载面的一侧上的至少一个套筒来实现转动，活动套设在转轴上的套筒与转轴相配合旋转，降低了摩擦带来的影响，便于提拉机构倾斜花篮。
在一种可能的实现方式中，上述承载部具有相对的两个侧边。在相对的侧边设有花篮定位结构。基于此，花篮在承载部上可以被固定在花篮定位机构上，使得花篮在提拉时保持稳定，避免了花篮因意外滑动或颤动导致的硅片粘连或除去液体不彻底等后果，进而影响到硅片质量。
在一种可能的实现方式中，上述底座靠近承载部的一面具有多组安装部。多组安装部沿着垂直于转轴的方向分布。上述转动连接组件设在相应组安装部上。由于多组安装部沿着垂直于转轴的方向分布，使得在需要不同倾斜角度提拉承载结构时，可以调整转动连接组件所含有的转轴与不同安装部的距离，进而改变第一预设角度。
在一种可能的实现方式中，每组安装部包括至少一个设在底座上的安装槽或安装架。
在一种可能的实现方式中，各组安装部的高度相同或不同。
在一种可能的实现方式中，上述翘板机构还包括多组可拆卸连接件，每组可拆卸连接件将转轴固定在相应组安装部上。转轴通过可拆卸连接件可拆卸地安装于相应组安装部上上的安装架或安装槽上，从而实现了整个翘板机 构的可拆卸，便于更换。
在一种可能的实现方式中，上述承载结构还包括两个限位件。两个限位件沿着上述提拉装置的提拉方向分布在清洗槽侧壁。上述翘板机构位于两个限位件之间。两个限位件与翘板机构配合，使得翘板机构在上升到最高位和处在最低位时可以保持水平，最高位的水平状态与其他槽的水平状态一致，有利于传送机构实现取放花篮的功能；最低位处于水平状态，使得清洗溶液将硅片清洗得更彻底，进而使得硅片质量有所提升。
在一种可能的实现方式中，上述提拉机构包括框架以及设在框架上的提拉驱动机构。框架与底座连接。上述提拉驱动机构包括至少一种直线升降机构，该直线升降机构为丝杆螺母升降机构、滑块导轨升降机构等。这些直线升降机构的驱动方式可以为电动、气动或液压等方式，此处不做详述。
在一种可能的实现方式中，提拉装置还包括设在承载结构上的至少一个支撑部。至少一个支撑部与清洗槽接触。各个支撑部均为转动支撑部。各个支撑部的导向方向与提拉机构的提拉方向相同。基于此，至少一个支撑部可以在提拉机构与清洗槽之间起支撑作用，在提拉机构提拉花篮时，至少一个支撑部支撑提拉机构并起到助力作用，使得提拉机构不易变形。此外，在提拉机构提拉花篮时转动支撑部还可以起到减少摩擦和导向的作用，支撑部的导向方向与上述提拉机构的提拉方向相同，在提拉机构提拉花篮时支撑部可以起到导向作用，使得提拉机构的提拉过程更顺畅。
第二方面，本申请还提供一种硅片清洗系统，包括第一方面或第一方面任一可能的实现方式描述的提拉装置。
第二方面提供的硅片清洗系统的有益效果与第一方面或第一方面任一可能的实现方式描述的提拉装置的有益效果相同，此处不做赘述。
上述说明仅是本申请技术方案的概述，为了能够更清楚了解本申请的技术手段，而可依照说明书的内容予以实施，并且为了让本申请的上述和其它目的、特征和优点能够更明显易懂，以下特举本申请的具体实施方式。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的硅片清洗系统的结构示意图；
图2为本申请实施例提供的提拉装置的结构示意图；
图3A为相关技术中花篮内硅片的倾斜状态示意图；
图3B为本申请实施例中花篮内硅片的倾斜状态示意图；
图4A为本申请实施例中第二预设角度为0°的示意图；
图4B为本申请实施例中第二预设角度大于0°且小于等于90°的示意图；
图5为本申请实施例提供的承载结构的结构示意图；
图6为本申请实施例提供的翘板机构的结构示意图；
图7为本申请实施例提供的花篮的结构示意图；
图8为本申请实施例提供的提拉装置的主视图；
图9为本申请实施例提供的提拉机构的主视图；
图10为本申请实施例提供的提拉装置的侧视图。
其中：
1-提拉装置，       2-清洗槽，
20-第一限位件，    21-第二限位件，
12-花篮，          120-硅片，
10-提拉机构，      11-承载结构，
110-底座，         111-翘板机构，
α-第一预设角度，  β-第二预设角度，
1110-承载部，      1111-转动连接组件，
3-承载部的中心轴， 1110a-横梁，
1111a-转轴，       1111b-第一套筒，
1111c-第二套筒，   1112-第一花篮定位机构，
1113-第二花篮定位机构，     1114-第一安装部，
1115-第二安装部，   112-牵引架，
1116-L型限位架，    1117-柱状限位块，
1120-第一滚轮，     1121-第二滚轮，
100-框架，          101-提拉驱动机构，
1010-丝杆螺母升降机构，     1011-第一滑块导轨升降机构，
1012-第二滑块导轨升降机构，    1013-电机，
1011a-第一滑轨，    1012a-第二滑轨，
1011b-第一滑块，    1012b-第二滑块，
102-连接架，        13-第一连接臂，
14-第二连接臂，     4-提拉方向，
121-凸出件。
具体实施例
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。“若干”的含义是一个或一个以上，除非另有明确具体的限定。
在本申请的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“左”、“右”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而 言，可以根据具体情况理解上述术语在本申请中的具体含义。
随着世界经济的不断发展，现代化建设对高效能源需求不断增长。作为绿色能源以及人类可持续发展的主要能源的一种，太阳能资源受到了世界各国的重视。光伏发电就是一种对太阳能资源进行“光-电”转换的利用方式，具有能量转换过程简单、无噪声、无污染排放、发电效率高等优点，得到了大力发展。作为光伏发电的一种基础材料，硅片的市场需求非常广泛。硅片生产是光伏产业链中的一个重要环节。通常，硅片由硅锭或硅棒切割而成，切割好的硅片需要进行清洗，然后再进入下一工段。目前，在清洗开始前，硅片被竖直放入花篮的插片槽内，然后利用清洗机清洗硅片。当清洗机清洗硅片后，提拉装置提拉承载硅片的花篮脱离清洗机。但是，在提拉承载硅片的花篮时，花篮内的硅片之间容易出现粘连问题，导致硅片从清洗机脱离后，硅片表面残留有大量清洗溶液。因此，硅片清洗后进行烘干时，不易烘干，还会出现湿片、脏污等问题，降低了烘干效率，影响了硅片质量。
图1示例出本申请实施例提供的硅片清洗系统的结构示意图。如图1所示，本申请实施例提供的硅片清洗系统包括提拉装置1，还可以包括清洗槽2。该清洗槽2可以与提拉装置1配合，实现硅片的清洗。清洗槽2可以盛放清洗溶液，清洗溶液可以为水或其它可以实现硅片120表面污渍清洗的液体。清洗槽2靠近提拉装置1的侧壁上设有第一限位件20和第二限位件21，提拉装置1位于两个限位件之间。第一限位件20和第二限位件21可以与提拉装置1配合，一方面可以限定提拉装置1所能抵达的最高位和最低位，另一方面，还可以使得提拉装置1在最高位和最低位时可以保持水平。
采用本申请实施例提供的提拉装置1与清洗槽2配合进行硅片清洗的过程包括如下步骤：
第一步，将硅片120放入花篮12内，将花篮12放至提拉装置1上；
第二步，将提拉装置1放入盛装有清洗溶液的清洗槽2内；
第三步，提拉装置1下降，至与第二限位件21相接触，配合使花篮达到水平状态；
第四步，提拉装置向上提拉花篮12，此时花篮处于倾斜状态；
第五步，提拉装置1向上提升，与第一限位件20接触，配合使花篮达 到水平状态，便于传送机构取放花篮12。
通过上述硅片清洗系统的组成和硅片清洗过程可知，本申请实施例提供的硅片清洗系统避免了在清洗过程中相邻的硅片120出现粘连的情况，减少了在提拉上升过程中附着在硅片120上的大量清洗溶液，使硅片120更容易烘干，减少了品质不良的硅片120的生产，有效提高了硅片120的成品率，同时大幅缩短了烘干时间，提高了烘干效率，进而提高了设备产能。
图2示例出了本申请实施例提供的提拉装置的结构示意图。如图1和图2所示，本申请实施例提供的提拉装置1包括提拉机构10和承载结构11。承载结构11包括底座110以及翘板机构111。底座110机械连接于提拉机构10，翘板机构111安装在底座110。
如图1和图2所示，翘板机构111用于承载花篮12，使提拉机构10从清洗槽2内以第一预设角度α倾斜提起花篮12。具体实施时，如图1所示，当花篮12内的硅片120清洗完成后，提拉机构10带动承载结构11上升，以第一预设角度α提起浸没在清洗槽2内的花篮12，花篮12在翘板机构111上保持向一侧倾斜的状态直至花篮12的底部离开液面，倾斜的角度为第一预设角度α。花篮12内的硅片120也以第一预设角度α倾斜着从清洗溶液中上升至离开液面。
图3A示例出了相关技术中花篮内硅片的倾斜状态示意图，如图3A所示，在现有的垂直提拉的提拉装置中，硅片120可能会出现如图3A所示的相邻的硅片120相互粘连的情况。图3B示例出了本申请实施例中花篮内硅片的倾斜状态示意图，如图3B所示，在本申请实施例提供的倾斜提拉的提拉装置1中，相邻的硅片120均向同一方向倾斜，避免了相邻的硅片120粘在一起。
通过对比图3A和图3B所示的两种花篮12内硅片120在垂直提拉的提拉装置和在倾斜提拉的提拉装置1内的倾斜状态示意图可知，在提拉机构10提拉承载结构11的过程中，翘板机构111以第一预设角度α倾斜提起花篮12，使得花篮12所承载的各个硅片120可以沿着一个方向倾斜，进而避免出现相邻的硅片120粘连在一起的问题。基于此，当提拉机构10提拉承载结构11离开清洗溶液的液面时，花篮12所承载的各个硅片120附着的清洗溶液可以顺利的从硅片120表面滴落到清洗槽2内，从而减少硅片120表 面残留的清洗溶液，以方便烘干硅片120，并减少硅片120出现湿片、脏污等问题的几率，进而保证硅片120的质量。
作为一种可能的实现方式，上述第一预设角度α大于0°且小于或等于30°。例如：第一预设角度α大于0°且小于或等于20°。又例如：第一预设角度α为5°、10°、15°或20°，但不仅限于此。在这个角度范围内硅片120的倾斜角度合适，一方面可以减少相邻硅片120的粘连，另一方面避免了角度过大造成的硅片120倾倒，甚至碰撞等不良后果。
作为一种可能的实现方式，当上述提拉机构10提拉花篮12时，花篮12内的硅片120靠近清洗槽2的底部的至少一条棱边与液面具有第二预设角度β。第二预设角度β为0°～90°。图4A为本申请实施例提供的第二预设角度β为0°的示意图，图4B为本申请实施例提供的第二预设角度β大于0°且小于等于90°的示意图。
如图4A所示，当上述第二预设角度β为0°时，硅片120的延伸面与清洗溶液的延伸面会相交于一条直线，花篮12内的硅片120靠近清洗槽2的底部的至少一条棱边与清洗溶液的液面平行。此时，在上述提拉机构10提拉花篮12至离开液面的过程中，花篮12内的硅片120保持倾斜的状态缓慢上升，硅片120与清洗溶液液面的接触面积由平面逐渐变成线接触，最终硅片120离开液面。而且，当花篮12内的硅片120靠近清洗槽2的底部的至少一条棱边与清洗溶液的液面为线接触，在重力和清洗溶液表面张力的作用下，硅片120表面残留的清洗溶液最后汇聚到硅片120靠近清洗槽2的底部的棱边，形成沿着棱边分布的液滴。
如图4B所示，当上述第二预设角度β大于0°且小于等于90°时，在离开清洗溶液时，花篮122内的硅片120靠近清洗槽2的底部的至少一条棱边与清洗溶液的液面为点接触，二者的交点为硅片120底部的一个顶点。此时，在上述提拉机构10提拉花篮12至离开液面的过程中，花篮12内的硅片120保持倾斜的状态缓慢上升，硅片120与清洗溶液液面的接触面积由平面逐渐变成点接触，最终硅片120离开液面。基于此，当花篮12内的硅片120靠近清洗槽2的底部的至少一条棱边与清洗溶液的液面为点接触，在重力和清洗溶液表面张力的作用下，硅片120上残留的清洗溶液沿着硅片120靠近清洗槽2的底部的至少一条棱边向下流，最终汇聚在硅片120底部的一 个顶点，形成液滴。在硅片120表面残留的清洗溶液体积相同的情况下，相对于沿着棱边分布的液滴来说，汇聚在硅片120底部顶点的液滴尺寸比较大，因此，在重力和表面张力的作用下，汇聚在硅片120底部顶点的液滴比较容易掉落到清洗槽2内，从而减少硅片120表面残留的清洗溶液，以方便烘干硅片120，并减少硅片120出现湿片、脏污等问题的几率，进而保证硅片120的质量。
由上可见，当第二预设角度β为大于0°且小于等于90°时，硅片120从清洗溶液中脱离后，最终所残留的清洗溶液相对较少，可以缩短后续烘干时间，降低烘干后硅片120表面残留液体痕迹的可能性，有效提高了硅片120成品率。此外，在后续的烘干过程中，可以将花篮倾斜放置，倾斜方向与花篮12内的硅片120靠近清洗槽2的底部的至少一条棱边与液面形成的第二预设角度β相反，使得硅片120在离开清洗溶液液面到烘干的过程中，倾斜角度变化幅度较大，可以进一步减少硅片120表面残留的清洗溶液，提高烘干效率，进而提高产品质量。
图5示例出了本申请实施例提供的承载结构的结构示意图，图6示例出了本申请实施例提供的翘板机构的结构示意图。
作为一种可能的实现方式，如图5和图6所示，上述翘板机构111包括承载部1110以及转动连接组件1111。承载部1110通过转动连接组件1111设在底座110上。转动连接组件1111的中心轴偏离承载部1110的中心轴3。承载部1110远离底座110的表面与底座110靠近承载部1110的表面形成上述第一预设角度α。承载部1110通过转动连接组件1111设在底座110上，而转动连接组件1111的中心轴偏离承载部1110的中心轴3，使得承载部1110在无外力作用下总是处于向一侧倾斜的状态，承载部1110承载的花篮12也相应保持倾斜状态。因此，在提拉机构10提拉承载结构11的过程中，承载部1110可保证所承载的花篮12也处在倾斜状态，使得花篮12内的硅片120均向同一方向倾斜，从而避免了相邻的硅片120粘连在一起，硅片120脱去液体更彻底。
示例性的，如图5所示，转动连接组件1111的中心轴位于承载部1110的中心轴3的左侧，使得承载部1110呈现左高右低的状态。基于此，提拉机构10提拉花篮12时，花篮12呈现左高右低的状态，花篮内的硅片120 也相应地倾向右侧。
为了实现沥出液体的功能，上述承载部1110及底座110均可以为方便沥出液体的结构。下面结合附图举例描述承载部1110和底座110的结构，应理解一下举例仅作为解释，不作为限定。如图4所示，上述承载部1110及底座110均为框架式结构，可以最大程度上沥出液体，使得提拉过程中沥出液体比较快速，缩短了硅片脱水所需的时间，从而使得硅片脱水更彻底。承载部1110具有横梁1110a，转动连接组件1111的中心轴与横梁1110a的中心轴为同一条直线。
在一种可选方式中，上述承载部1110具有相对的两个侧边。在相对的侧边设有花篮定位结构。如图6所示，上述承载部1110具有四个侧边，当上述两个花篮定位机构分别设在如图6中所示的两侧边位置时，在上述提拉机构10提拉花篮12的过程中，上述第二预设角度β为0°，花篮12内的硅片120与清洗溶液液面的接触面积逐渐由平面变成线接触；当上述两个花篮定位机构分别设在与图6中所示的侧边相接的另外两侧边时，在上述提拉机构10提拉花篮12的过程中，上述第二预设角度β大于0°且小于等于90°，花篮12内的硅片120与清洗溶液液面的接触面积逐渐由平面变成点接触。定义两个花篮定位机构分别为第一花篮定位机构1112和第二花篮定位机构1113。花篮12在承载部1110上可以被固定在第一花篮定位机构1112和第二花篮定位机构1113上，使得花篮12在提拉时保持稳定，避免了花篮12因意外滑动或颤动导致的硅片120粘连或除去液体不彻底等后果，进而影响到硅片120的质量。
图7示例出了本申请实施例提供的花篮的结构示意图。如图7所示，该花篮12的相对的两个侧面的底部具有多个凸出件121，两个侧面的凸出件121关于花篮12的中心轴对称。
在一种示例中，如图5和图6所示，每个花篮定位机构包括设在相应侧边的定位板，每个定位板具有多个定位槽。两个定位机构所包括的每个定位槽对称分布，每个定位槽沿相应侧边的延伸方向分布。定位板的板面与承载部1110的上表面的夹角为钝角。定位板的厚度为3.0～2.5mm，宽度为6～8cm。每个花篮定位机构包括与承载部1110呈对口倾斜分布的定位板，对花篮12的放置起到导向作用；每个定位板具有多个对称分布的定位槽， 每个定位槽沿相应侧边的延伸方向分布，便于与花篮12两侧的凸出件121相配合，使得花篮12可以被牢固地卡在定位槽里，避免了因固定不牢造成的晃动。
示例性的，如图6所示，上述每个定位板具有四个定位槽，定位板为厚度为2.7mm，宽度为7cm的不锈钢钢板。
在一种可选方式中，如图6所示，上述转动连接组件1111包括转轴1111a以及活动套设在转轴1111a上的至少一个套筒。转轴1111a设在底座110上。各个套筒设在承载部1110远离承载面的一侧。套筒的径向尺寸大于转轴1111a的径向尺寸。基于此，上述承载部1110通过转轴1111a与设在承载部1110远离承载面的一侧上的至少一个套筒来实现转动，活动套设在转轴1111a上的套筒与转轴1111a相配合旋转，降低了摩擦带来的影响，便于提拉机构10倾斜花篮12。
示例性的，如图5和图6所示，套筒均固定在横梁1110a远离承载面的一侧。当套筒的数量为两个时，定义这两个套筒分别为第一套筒1111b和第二套筒1111c，第一套筒1111b和第二套筒1111c可以分别套设在转轴1111a两端，使得承载部1110在转动时更加稳定，避免了因套筒位置过于集中造成的承载部1110在转动时的颤动，进而保证了硅片120除去液体更彻底，提高了硅片120的清洗质量。
示例性的，上述底座110靠近承载部1110的一面具有多组安装部。各组安装部的高度相同或不同。多组安装部沿着垂直于转轴1111a的方向分布。上述转动连接组件1111设在相应组安装部上。由于多组安装部沿着垂直于转轴1111a的方向分布，使得在需要不同倾斜角度提拉承载结构11时，可以调整转动连接组件1111所含有的转轴1111a与不同安装部的距离，进而改变第一预设角度α。
示例性的，如图6所示，上述安装部的数量为两个，定义为第一安装部1114和第二安装部1115。两个安装部分设在底座110两端，转动连接组件1111的两端分别设在相应安装部上。使得转动连接组件1111更稳定，保证了硅片120在提拉过程中的稳定性。
示例性的，上述翘板机构111还可以包括多组可拆卸连接件，可拆卸连接件可以为抱夹组件或螺栓组件等，此处不做详述。每组可拆卸连接件将 转轴1111a固定在相应组安装部上。转轴1111a通过可拆卸连接件可拆卸地安装于相应组安装部上的安装架或安装槽上，从而实现了整个翘板机构111的可拆卸，便于更换。此外，由于定位板以及定位板具有的定位槽需要频繁与花篮12接触，定位板本身也较薄，在提拉过程中容易出现变形及损坏，通过上述可拆卸连接件可以实现整个承载部1110的可拆卸，从而实现了定位板的更换。
举例来说，每组安装部包括至少一个设在底座110上的安装槽或安装架。当安装部包括多个安装槽或安装架时，转轴1111a可以通过卡槽与可拆卸连接组件或滑轨与可拆卸连接组件的结构实现转轴1111a与底座110之间位置或高度的改变，从而改变翘板机构111翘起的角度，也就是改变第一预设角度α的大小。例如：如图6所示，每组安装部包括一个安装槽，转轴1111a两端分别安装在相应安装槽内。
作为一种可能的实现方式，如图2所示，提拉装置1还包括设在承载结构11上的至少一个支撑部。至少一个支撑部与清洗槽2接触。各个支撑部均为转动支撑部。各个支撑部的导向方向与提拉机构10的提拉方向4相同。承载结构11还包括牵引架112，至少一个支撑部设在牵引架112上。底座110通过牵引架112与提拉机构10连接。当硅片清洗系统清洗花篮12内的硅片120的时候，牵引架112位于清洗槽2内的清洗溶液液面下；当硅片清洗系统结束对花篮12内硅片120的清洗的时候，提拉机构10将上述牵引架112提拉至清洗槽2内的清洗溶液液面上方。至少一个转动支撑部的转动面与清洗槽2接触，各个转动支撑部的导向方向与提拉机构10的提拉方向4相同。在提拉机构10提拉花篮12时，基于此，至少一个转动支撑部可以在承载结构11与清洗槽2之间起支撑作用，在提拉机构10提拉花篮12时，转动支撑部支撑承载结构11并起到助力作用，使得承载结构11不易变形。此外，在提拉机构10提拉花篮12时转动支撑部还可以起到减少摩擦和导向的作用，支撑部的导向方向与提拉机构10的提拉方向4相同，使得提拉机构10的提拉过程更顺畅。
图8示例出了本申请实施例提供的提拉装置的主视图。
示例性的，如图8所示，上述支撑部为滚轮，支撑部的数量为两个。定义两个滚轮分别为第一滚轮1120和第二滚轮1121。上述牵引架112具有两 个立柱，每个滚轮安装在相应立柱的下端，第一滚轮1120和第二滚轮1121关于牵引架112的中心轴对称分布。在提拉的过程中，第一滚轮1120和第二滚轮1121的滚动面与清洗槽2相接触，不仅起到了支撑、助力和导向的作用，还平衡了牵引架112的两端，使得花篮12的提拉过程更平稳流畅。
作为一种可能的实现方式，上述承载结构11还可以包括两个限位件。两个限位件沿着提拉装置1的提拉方向4分布在清洗槽2的侧壁。翘板机构111位于两个限位件之间。两个限位件即上述第一限位件20和第二限位件21。第一限位件20和第二限位件21与翘板机构111配合，使得翘板机构111在上升到最高位和处在最低位时可以保持水平，最高位的水平状态与其他槽的水平状态一致，有利于传送机构实现取放花篮12的功能；最低位的水平状态与其他槽的水平状态一致，有利于清洗溶液将硅片120清洗得更彻底，进而使得硅片120质量有所提升。
在一种示例中，如图5和图6所示，上述翘板机构111还包括与两个限位件进行配合的两个限位部。上述翘板机构111具有两个翘起侧，每个限位部设在相应翘起侧。
示例性的，如图5所示，其中一个限位部为挂设在所述牵引架112上的L型限位架1116，另一个限位部为伸出承载部1110的柱状限位块1117。在花篮12放置到提拉装置1上处于最低位时，柱状限位块1117与清洗槽2的侧壁上的位于翘板机构111下方的第二限位件21配合，第二限位件21在柱状限位块1117的下方支撑起整个承载部1110，使得翘板机构111在最低位时呈现水平状态。在花篮12被提升至花篮12的底部离开液面后，L型限位架1116与清洗槽2的侧壁上的位于翘板机构111上方的第一限位件20配合，第一限位件20在L型限位架1116的上方将承载部1110向下压，使得翘板机构111在最高位时呈现水平状态，便于后续的传送机构取放花篮12。此外，L型限位架1116还可以与牵引架112实现对翘板机构111的导向作用。
图9示例出了本申请实施例提供的提拉机构的主视图，图10示例出了本申请实施例提供的提拉装置的侧视图。
作为一种可能的实现方式，如图9所示，上述提拉机构10包括框架100以及设在框架100上的提拉驱动机构101。框架100与底座110连接。上述 提拉驱动机构101包括至少一种直线升降机构，该直线升降机构为丝杆螺母升降机构、滑块导轨升降机构等。这些直线升降机构的驱动方式可以为电动、气动或液压等方式，此处不做详述。此外，提拉驱动机构101的驱动速度很慢，为2mm/s～4mm/s，同时由于清洗溶液的表面张力作用，可以让硅片120上尽可能少得沾上清洗溶液，进而避免硅片120上残留液体痕迹的产生。
示例性的，如图9所示，上述提拉驱动机构101包括丝杆螺母升降机构和滑块导轨升降机构两种直线升降机构。滑块导轨升降机构的数量为两个，定义为第一滑块导轨升降机构1011和第二滑块导轨升降机构1012。丝杆螺母升降机构1010位于第一滑块导轨升降机构1011和第二滑块导轨升降机构1012之间。丝杆螺母升降机构1010、第一滑块导轨升降机构1011和第二滑块导轨升降机构1012通过支架连接，以保证三者的升降同步性和结构稳定性。
举例来说，如图2和图9所示，丝杆螺母升降机构1010包含丝杆以及螺纹连接在丝杆上的螺纹件。第一滑块导轨升降机构1011包括第一滑轨1011a以及设在第一滑轨1011a上的第一滑块1011b。第二滑块导轨升降机构1012包括第二滑轨1012a以及设在第二滑轨1012a上的第二滑块1012b。该支架包括连接架102以及设在连接架102上的两个连接臂，定义两个连接臂为第一连接臂13和第二连接臂14。第一连接臂13和第二连接臂14均连接在牵引架112上。
如图10所示，当升降机构的驱动方式为电动式驱动时，丝杆螺母升降机构1010下方固定有电机1013。如图2和图9所示，在提拉装置1提拉花篮12的过程中，首先由电机1013驱动丝杆螺母升降机构1010、第一滑块导轨升降机构1011和第二滑块导轨升降机构1012同步缓慢上升，同时，连接架102通过第一连接臂13和第二连接臂14带动牵引架112上升，进而实现了花篮12的缓慢提拉，提拉速度为2mm/s，使硅片120上的液体被最大程度去除，只留下一层薄薄的液体膜，让干燥变得非常容易，并且硅片120上不会留下液体的痕迹，提高了硅片120的质量。
在上述实施方式的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。
在此处所提供的说明书中，说明了大量具体细节。然而，能够理解，本申请的实施例可以在没有这些具体细节的情况下被实践。在一些实例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (10)

  1. 一种提拉装置，其中，用于提拉浸没在清洗槽内的花篮，所述提拉装置包括机械连接的提拉机构和承载结构；其中，
    所述承载结构包括底座以及翘板机构，所述底座机械连接于所述提拉机构，所述翘板机构安装在所述底座；所述翘板机构用于承载所述花篮，使所述提拉机构从所述清洗槽内以第一预设角度倾斜提起所述花篮。
  2. 根据权利要求1所述的提拉装置，其中，所述翘板机构包括承载部以及转动连接组件，所述承载部通过所述转动连接组件设在所述底座上，所述转动连接组件的中心轴偏离所述承载部的中心轴，所述承载部远离所述底座的表面与所述底座靠近所述承载部的表面形成所述第一预设角度。
  3. 根据权利要求1所述的提拉装置，其中，所述第一预设角度大于0°且小于或等于30°；或，
    所述第一预设角度大于0°且小于或等于20°。
  4. 根据权利要求1所述的提拉装置，其中，当所述提拉机构提拉所述花篮时，所述花篮内的硅片靠近所述清洗槽的底部的至少一条棱边与液面具有第二预设角度，所述第二预设角度为0°～90°。
  5. 根据权利要求2所述的提拉装置，其中，所述转动连接组件包括转轴以及活动套设在所述转轴上的至少一个套筒，所述转轴设在所述底座上，各个所述套筒设在所述承载部远离所述承载面的一侧，所述套筒的径向尺寸大于所述转轴的径向尺寸。
  6. 根据权利要求2所述的提拉装置，其中，所述承载部具有相对的两个侧边，在相对的所述侧边设有花篮定位结构。
  7. 根据权利要求2所述的提拉装置，其中，所述底座靠近所述承载部的一面具有多组安装部，多组所述安装部沿着垂直于所述转轴的方向分布，所述转动连接组件设在相应组所述安装部上；其中，
    每组所述安装部包括至少一个设在所述底座上的安装槽或安装架；和/或，
    各组所述安装部的高度相同或不同；和/或，
    所述翘板机构还包括多组可拆卸连接件，每组所述可拆卸连接件将所述转轴固定在相应组所述安装部上。
  8. 根据权利要求1所述的提拉装置，其中，所述承载结构还包括两个限位件；两个所述限位件沿着所述提拉装置的提拉方向分布在所述清洗槽侧 壁，所述翘板机构位于两个所述限位件之间。
  9. 根据权利要求1所述的提拉装置，其中，所述提拉机构包括框架以及设在所述框架上的提拉驱动机构，所述框架与所述底座连接；和/或，
    所述提拉装置还包括设在所述承载结构上的至少一个支撑部，至少一个所述支撑部与所述清洗槽接触，各个所述支撑部均为转动支撑部，各个所述支撑部的导向方向与所述提拉机构的提拉方向相同。
  10. 一种硅片清洗系统，其中，包括权利要求1～9任一项所述提拉装置。
PCT/CN2022/104362 2021-07-07 2022-07-07 一种提拉装置及硅片清洗系统 WO2023280270A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202121535766.1 2021-07-07
CN202121535766.1U CN215988665U (zh) 2021-07-07 2021-07-07 一种提拉装置及硅片清洗系统

Publications (1)

Publication Number Publication Date
WO2023280270A1 true WO2023280270A1 (zh) 2023-01-12

Family

ID=80515985

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/104362 WO2023280270A1 (zh) 2021-07-07 2022-07-07 一种提拉装置及硅片清洗系统

Country Status (2)

Country Link
CN (1) CN215988665U (zh)
WO (1) WO2023280270A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117096075A (zh) * 2023-10-18 2023-11-21 长春市元尚欣信息科技有限公司 一种防止硅片粘连的硅片承载器
CN117293066A (zh) * 2023-11-24 2023-12-26 西安寰微电子科技有限公司 一种半导体硅片的清洗装置
CN117457804A (zh) * 2023-12-21 2024-01-26 阳光中科（福建）能源股份有限公司 一种太阳能电池片的硅片表面清洗装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN215988665U (zh) * 2021-07-07 2022-03-08 禄丰隆基硅材料有限公司 一种提拉装置及硅片清洗系统
CN115415230B (zh) * 2022-08-26 2023-07-04 曲靖阳光新能源股份有限公司 一种用于清洗机的倾斜式慢提拉结构
CN117012684B (zh) * 2023-09-18 2023-12-08 上海普达特半导体设备有限公司 调节式晶圆搬运机构
CN117960679A (zh) * 2024-04-01 2024-05-03 常州捷佳创精密机械有限公司 一种硅片清洗设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160089696A1 (en) * 2014-09-30 2016-03-31 SCREEN Holdings Co., Ltd. Substrate processing method
CN107473133A (zh) * 2017-09-22 2017-12-15 张家港市超声电气有限公司 硅片花篮慢提拉装置
CN107516694A (zh) * 2017-07-31 2017-12-26 常州市杰洋精密机械有限公司 一种湿法清洗物载具预脱水方法及所用提升机构
CN215988665U (zh) * 2021-07-07 2022-03-08 禄丰隆基硅材料有限公司 一种提拉装置及硅片清洗系统

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160089696A1 (en) * 2014-09-30 2016-03-31 SCREEN Holdings Co., Ltd. Substrate processing method
CN107516694A (zh) * 2017-07-31 2017-12-26 常州市杰洋精密机械有限公司 一种湿法清洗物载具预脱水方法及所用提升机构
CN107473133A (zh) * 2017-09-22 2017-12-15 张家港市超声电气有限公司 硅片花篮慢提拉装置
CN215988665U (zh) * 2021-07-07 2022-03-08 禄丰隆基硅材料有限公司 一种提拉装置及硅片清洗系统

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117096075A (zh) * 2023-10-18 2023-11-21 长春市元尚欣信息科技有限公司 一种防止硅片粘连的硅片承载器
CN117293066A (zh) * 2023-11-24 2023-12-26 西安寰微电子科技有限公司 一种半导体硅片的清洗装置
CN117293066B (zh) * 2023-11-24 2024-01-30 西安寰微电子科技有限公司 一种半导体硅片的清洗装置
CN117457804A (zh) * 2023-12-21 2024-01-26 阳光中科（福建）能源股份有限公司 一种太阳能电池片的硅片表面清洗装置
CN117457804B (zh) * 2023-12-21 2024-03-22 阳光中科（福建）能源股份有限公司 一种太阳能电池片的硅片表面清洗装置

Also Published As

Publication number Publication date
CN215988665U (zh) 2022-03-08

Similar Documents

Publication Publication Date Title
WO2023280270A1 (zh) 一种提拉装置及硅片清洗系统
US20190019916A1 (en) Wafer supporting apparatus
CN107681023B (zh) 慢提拉脱水设备
CN114597140A (zh) 一种可调慢提拉清洗系统及干燥方法
CN218513471U (zh) 一种斜拉式花篮提拉机构
CN213905317U (zh) 基于z字型伸缩式微动摇摆晶圆充分干燥装置
CN213716848U (zh) 一种片篮承载装置及设有该承载装置的满提拉清洗系统
CN217371659U (zh) 一种用于生产屏幕的抛光装置
CN209447775U (zh) 黑硅太阳能电池的制绒装置
CN218743553U (zh) 一种12寸抛动机构
CN219106184U (zh) 一种半片hjt电池片的抽片装置
CN221086559U (zh) 一种晶圆清洗槽的晃动机构
CN205564795U (zh) 一种石英舟结构
CN213716849U (zh) 一种可调慢提拉清洗系统
CN111799202A (zh) 一种硅片激光标识生产线
CN218555000U (zh) 一种垂直式单晶硅片清洗槽
CN216174811U (zh) 一种硅片放置料框、插片设备
CN217671672U (zh) 一种光伏玻璃丝网印刷机定位托盘升降结构
CN217451376U (zh) 一种用于面板的清洗机
CN111036635A (zh) 一种生物实验用培养皿清洗装置
CN216099754U (zh) 一种单晶硅棒切割后的水洗脱胶装置
CN109873054B (zh) 黑硅太阳能电池生产线
CN215266218U (zh) 一种悬空式硅片承载框及承载装置
CN213958914U (zh) 一种限位装置及设有该限位装置的满提拉清洗系统
CN111890585B (zh) 一种led用硅片切割清洗机构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22837015

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE